CN109411457A - Rgb led集成封装模块 - Google Patents
Rgb led集成封装模块 Download PDFInfo
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- CN109411457A CN109411457A CN201811259044.0A CN201811259044A CN109411457A CN 109411457 A CN109411457 A CN 109411457A CN 201811259044 A CN201811259044 A CN 201811259044A CN 109411457 A CN109411457 A CN 109411457A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 38
- 238000004020 luminiscence type Methods 0.000 claims abstract description 100
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 230000010354 integration Effects 0.000 claims abstract description 3
- 239000000084 colloidal system Substances 0.000 claims description 36
- 238000005253 cladding Methods 0.000 claims description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000004593 Epoxy Substances 0.000 claims description 7
- 239000011148 porous material Substances 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 241001062009 Indigofera Species 0.000 claims description 2
- 230000003760 hair shine Effects 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- 238000009826 distribution Methods 0.000 description 7
- 238000000465 moulding Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000693 micelle Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811259044.0A CN109411457A (zh) | 2018-10-26 | 2018-10-26 | Rgb led集成封装模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811259044.0A CN109411457A (zh) | 2018-10-26 | 2018-10-26 | Rgb led集成封装模块 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109411457A true CN109411457A (zh) | 2019-03-01 |
Family
ID=65469179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811259044.0A Pending CN109411457A (zh) | 2018-10-26 | 2018-10-26 | Rgb led集成封装模块 |
Country Status (1)
Country | Link |
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CN (1) | CN109411457A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021189618A1 (zh) * | 2020-03-26 | 2021-09-30 | 深圳利亚德光电有限公司 | 显示支架、显示组件以及显示支架的制作方法 |
WO2022266960A1 (zh) * | 2021-06-24 | 2022-12-29 | 京东方科技集团股份有限公司 | 背板及其制作方法、背光模组、显示装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201820787U (zh) * | 2010-08-26 | 2011-05-04 | 浙江英特来光电科技有限公司 | 共极式全彩贴片发光二极管 |
CN203351594U (zh) * | 2013-05-22 | 2013-12-18 | 深圳市安普光光电科技有限公司 | 发光二极管 |
CN106847801A (zh) * | 2017-03-28 | 2017-06-13 | 山东晶泰星光电科技有限公司 | 一种表面贴装式rgb‑led封装模组及其制造方法 |
CN106992169A (zh) * | 2017-04-27 | 2017-07-28 | 山东晶泰星光电科技有限公司 | 一种倒装rgb‑led封装模组及其显示屏 |
CN207425855U (zh) * | 2017-08-22 | 2018-05-29 | 山东晶泰星光电科技有限公司 | 一种四连体8引脚型rgb-led封装模组及其显示屏 |
CN207852672U (zh) * | 2018-02-26 | 2018-09-11 | 山东晶泰星光电科技有限公司 | 一种四连体rgb-led封装模组及其显示屏 |
CN108598071A (zh) * | 2018-06-28 | 2018-09-28 | 山西高科华兴电子科技有限公司 | 一种top结构的三基色led模组器件及其制作方法 |
-
2018
- 2018-10-26 CN CN201811259044.0A patent/CN109411457A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201820787U (zh) * | 2010-08-26 | 2011-05-04 | 浙江英特来光电科技有限公司 | 共极式全彩贴片发光二极管 |
CN203351594U (zh) * | 2013-05-22 | 2013-12-18 | 深圳市安普光光电科技有限公司 | 发光二极管 |
CN106847801A (zh) * | 2017-03-28 | 2017-06-13 | 山东晶泰星光电科技有限公司 | 一种表面贴装式rgb‑led封装模组及其制造方法 |
CN106992169A (zh) * | 2017-04-27 | 2017-07-28 | 山东晶泰星光电科技有限公司 | 一种倒装rgb‑led封装模组及其显示屏 |
CN207425855U (zh) * | 2017-08-22 | 2018-05-29 | 山东晶泰星光电科技有限公司 | 一种四连体8引脚型rgb-led封装模组及其显示屏 |
CN207852672U (zh) * | 2018-02-26 | 2018-09-11 | 山东晶泰星光电科技有限公司 | 一种四连体rgb-led封装模组及其显示屏 |
CN108598071A (zh) * | 2018-06-28 | 2018-09-28 | 山西高科华兴电子科技有限公司 | 一种top结构的三基色led模组器件及其制作方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021189618A1 (zh) * | 2020-03-26 | 2021-09-30 | 深圳利亚德光电有限公司 | 显示支架、显示组件以及显示支架的制作方法 |
WO2022266960A1 (zh) * | 2021-06-24 | 2022-12-29 | 京东方科技集团股份有限公司 | 背板及其制作方法、背光模组、显示装置 |
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Address after: 343000 Business Avenue of Jingkai District, Ji'an City, Jiangxi Province Applicant after: JIAN MULINSEN PHOTOELECTRICITY Co.,Ltd. Address before: 343000 East District of Jinggangshan Economic Development Zone, Ji'an City, Jiangxi Province - 288 Nantang Road, Mulinsen Industrial Park Applicant before: JIAN MULINSEN PHOTOELECTRICITY Co.,Ltd. |
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Address after: 343000 Ji'an city open area entrepreneurial Avenue Applicant after: Ji'an Mulinsen Industrial Co.,Ltd. Address before: 343000 Ji'an city open area entrepreneurial Avenue Applicant before: JIAN MULINSEN PHOTOELECTRICITY Co.,Ltd. |
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Effective date of registration: 20190812 Address after: 343000 No. 288 Nantang Road, Jinggangshan Economic and Technological Development Zone, Ji'an City, Jiangxi Province Applicant after: Ji'an Mulinsen Display Co.,Ltd. Address before: 343000 Ji'an city open area entrepreneurial Avenue Applicant before: Ji'an Mulinsen Industrial Co.,Ltd. |
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Country or region after: China Address after: 343000 No.288, Nantang Road, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province Applicant after: JIAN MULINSEN PHOTOELECTRICITY Co.,Ltd. Address before: 343000 No.288, Nantang Road, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province Applicant before: Ji'an Mulinsen Display Co.,Ltd. Country or region before: China |