CN103107274B - 一种采用过渡电极实现的led集成封装模块 - Google Patents
一种采用过渡电极实现的led集成封装模块 Download PDFInfo
- Publication number
- CN103107274B CN103107274B CN201310053376.4A CN201310053376A CN103107274B CN 103107274 B CN103107274 B CN 103107274B CN 201310053376 A CN201310053376 A CN 201310053376A CN 103107274 B CN103107274 B CN 103107274B
- Authority
- CN
- China
- Prior art keywords
- electrode
- led
- transition electrode
- nation
- transition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310053376.4A CN103107274B (zh) | 2013-02-19 | 2013-02-19 | 一种采用过渡电极实现的led集成封装模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310053376.4A CN103107274B (zh) | 2013-02-19 | 2013-02-19 | 一种采用过渡电极实现的led集成封装模块 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103107274A CN103107274A (zh) | 2013-05-15 |
CN103107274B true CN103107274B (zh) | 2016-06-08 |
Family
ID=48314975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310053376.4A Active CN103107274B (zh) | 2013-02-19 | 2013-02-19 | 一种采用过渡电极实现的led集成封装模块 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103107274B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10159151B1 (en) | 2017-06-14 | 2018-12-18 | Unimicron Technology Corp. | Chip package circuit board module |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101794763A (zh) * | 2009-12-25 | 2010-08-04 | 山西乐百利特科技有限责任公司 | 多芯片集成led的电连接方法 |
CN102593337A (zh) * | 2012-03-09 | 2012-07-18 | 苏州玄照光电有限公司 | 高可靠性的集成封装led芯片 |
CN203071134U (zh) * | 2013-02-19 | 2013-07-17 | 河北神通光电科技有限公司 | 一种采用过渡电极实现的led集成封装模块 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE458276T1 (de) * | 2005-04-21 | 2010-03-15 | Fiat Ricerche | Durchsichtige led-anzeigevorrichtung |
-
2013
- 2013-02-19 CN CN201310053376.4A patent/CN103107274B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101794763A (zh) * | 2009-12-25 | 2010-08-04 | 山西乐百利特科技有限责任公司 | 多芯片集成led的电连接方法 |
CN102593337A (zh) * | 2012-03-09 | 2012-07-18 | 苏州玄照光电有限公司 | 高可靠性的集成封装led芯片 |
CN203071134U (zh) * | 2013-02-19 | 2013-07-17 | 河北神通光电科技有限公司 | 一种采用过渡电极实现的led集成封装模块 |
Also Published As
Publication number | Publication date |
---|---|
CN103107274A (zh) | 2013-05-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2020502780A (ja) | 表面実装型rgb−ledパッケージモジュール及びその製造方法 | |
TW523942B (en) | package socket and package legs structure for LED and manufacturing of the same | |
CN102185091A (zh) | 一种发光二极管器件及其制造方法 | |
CN102185086B (zh) | 一种led支架及具有该支架的led | |
KR20130009188A (ko) | 광 디바이스용 기판 | |
EP2641279B1 (en) | Islanded carrier for light emitting device | |
CN103107274B (zh) | 一种采用过渡电极实现的led集成封装模块 | |
CN111162157A (zh) | 一种led显示模组 | |
CN104157638A (zh) | 正装芯片倒装360度发光可任意环绕led灯丝及其制备方法 | |
CN202084577U (zh) | 一种高可靠性的发光二极管 | |
CN204088316U (zh) | 正装芯片倒装360度发光可任意环绕led灯丝 | |
CN202205814U (zh) | 一种发光二极管器件 | |
US9065030B2 (en) | Diode package having improved lead wire and manufacturing method thereof | |
JP6581886B2 (ja) | 半導体装置 | |
CN203071134U (zh) | 一种采用过渡电极实现的led集成封装模块 | |
US20020158261A1 (en) | Light emitting diode layout structure | |
KR101895359B1 (ko) | 씨오비 패키지를 이용한 조명 모듈 구현 방법 및 그 조명 모듈 | |
CN102856307A (zh) | 一种小型跳线式双列桥堆 | |
CN102762030A (zh) | 高密度pcb | |
CN202034413U (zh) | 一种led支架及具有该支架的led | |
CN102214779A (zh) | 一种高可靠性的发光二极管及其制造方法 | |
CN203071135U (zh) | 一种用于led集成封装模块的过渡电极 | |
CN202111086U (zh) | 一种小型跳线式双列桥堆 | |
CN215896381U (zh) | 一种多层叠的die焊线结构及芯片 | |
CN213877424U (zh) | 一种无连接器的柔性透明显示屏 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Light-emitting diode (LED) integrated packaging module achieved by adopting transition electrode Effective date of registration: 20191120 Granted publication date: 20160608 Pledgee: Hebei re Guarantee Co.,Ltd. Pledgor: SHENTONG PHOTOELECTRICITY SCIENCE AND TECHNOLOGY CO.,LTD. Registration number: Y2019130000010 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20201224 Granted publication date: 20160608 Pledgee: Hebei re Guarantee Co.,Ltd. Pledgor: SHENTONG PHOTOELECTRICITY SCIENCE AND TECHNOLOGY Co.,Ltd. Registration number: Y2019130000010 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A LED integrated packaging module implemented with transition electrodes Effective date of registration: 20230907 Granted publication date: 20160608 Pledgee: China CITIC Bank Co.,Ltd. Shijiazhuang Branch Pledgor: SHENTONG PHOTOELECTRICITY SCIENCE AND TECHNOLOGY CO.,LTD. Registration number: Y2023980055913 |