WO2018163888A1 - 非可逆回路素子およびその製造方法 - Google Patents
非可逆回路素子およびその製造方法 Download PDFInfo
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- WO2018163888A1 WO2018163888A1 PCT/JP2018/006994 JP2018006994W WO2018163888A1 WO 2018163888 A1 WO2018163888 A1 WO 2018163888A1 JP 2018006994 W JP2018006994 W JP 2018006994W WO 2018163888 A1 WO2018163888 A1 WO 2018163888A1
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- main surface
- magnetic plate
- magnet
- cavity
- dielectric component
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
- H01F7/02—Permanent magnets [PM]
- H01F7/0205—Magnetic circuits with PM in general
- H01F7/021—Construction of PM
- H01F7/0215—Flexible forms, sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/32—Non-reciprocal transmission devices
- H01P1/38—Circulators
- H01P1/383—Junction circulators, e.g. Y-circulators
- H01P1/387—Strip line circulators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0253—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing permanent magnets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
- H01F7/02—Permanent magnets [PM]
- H01F7/0231—Magnetic circuits with PM for power or force generation
- H01F7/0242—Magnetic drives, magnetic coupling devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K1/00—Details of the magnetic circuit
- H02K1/02—Details of the magnetic circuit characterised by the magnetic material
Definitions
- the present invention relates to a nonreciprocal circuit device and a method for manufacturing the same.
- nonreciprocal circuit elements such as isolators or circulators are mounted on circuit boards of microwave devices such as microwave amplifiers and microwave oscillators.
- the element body of this type of non-reciprocal circuit element needs to have a simpler structure, better assembly, and higher reliability than ever before as the circuit board of a microwave device becomes smaller and lighter. It is said that.
- Patent Document 1 An existing nonreciprocal circuit device having excellent assemblability has been disclosed in, for example, Japanese Patent Application Laid-Open No. 2007-306634 (Patent Document 1).
- a dielectric plate and a permanent magnet stacked on a magnetic plate are pressed by a holder from above.
- a dielectric component has a through hole penetrating in a direction intersecting the main surface, and a magnetic plate is stored in the through hole.
- a permanent magnet is stored on the bottom surface of a punched holder. As described above, in the same publication, by storing each component, it is possible to suppress a shift in the position where each component is arranged.
- the non-reciprocal circuit device disclosed in Japanese Patent Application Laid-Open No. 2007-306634 has a structure in which high positional accuracy can be obtained if each component can be mounted at a desired position.
- the components may repel each other due to the influence of magnetic force during the process of mounting each component, and this is suppressed. Therefore, it is necessary to perform the mounting process using a jig and equipment having a mechanism for holding each component. That is, in Japanese Patent Application Laid-Open No.
- the holder (lid) serves as a magnetic yoke for controlling the path of the magnetic lines of force of the permanent magnet, and is made of a ferromagnetic material.
- a holding mechanism having a holding force capable of overcoming the magnetic force acting between them is required. For this reason, when assembling the nonreciprocal circuit device disclosed in Japanese Patent Laid-Open No. 2007-306634 with an automatic machine, there is a problem that the process becomes complicated and the equipment configuration becomes complicated.
- the present invention has been made in view of the above-described problems, and its object is to assemble a non-reciprocal circuit element with improved quality of an adhesion site for fixing each component, and an automatic machine having no complicated configuration. It is an object of the present invention to provide a method for manufacturing a non-reciprocal circuit device capable of achieving the above.
- the nonreciprocal circuit device of the present invention includes a magnetic plate, a dielectric component, a permanent magnet, a magnetic yoke, and a circuit board.
- the magnetic plate has one and other main surfaces and has a plurality of input / output terminals.
- the dielectric component is connected on one main surface of the magnetic plate.
- the permanent magnet is connected to the side opposite to the magnetic plate of the dielectric part.
- the magnetic yoke is connected to the side opposite to the magnetic plate of the permanent magnet.
- the circuit board is connected to the other main surface side of the magnetic plate and has a plurality of signal conductors.
- the permanent magnet can control transmission of an electric signal from each of the plurality of signal conductors to each of the plurality of input / output terminals.
- a cavity having a bottom surface extending in the direction along one main surface and a side surface extending in the thickness direction intersecting the bottom surface is formed on the surface of the dielectric component on the permanent magnet side. At least a portion of the permanent magnet is disposed in the cavity. The surface of at least a part of the permanent magnet disposed in the cavity is fixed to both the bottom surface and the side surface via an adhesive.
- a magnetic plate having one and the other main surfaces and having a plurality of input / output terminals is formed.
- a dielectric component is connected on one main surface of the magnetic plate.
- a permanent magnet is connected to the opposite side of the dielectric plate from the magnetic plate.
- a magnetic yoke is connected to the side of the permanent magnet opposite to the magnetic plate.
- a circuit board having a plurality of signal conductors is connected to the other main surface side of the magnetic plate.
- a cavity having a bottom surface extending in the direction along one main surface and a side surface extending in the thickness direction intersecting the bottom surface is formed on the surface of the dielectric component on the side to which the permanent magnet is connected.
- the step of connecting the permanent magnets at least part of the permanent magnets are disposed in the cavity, and at least a part of the surface of the permanent magnets disposed in the cavity is bonded to both the bottom surface and the side surface. Fixed through.
- a simple configuration and a simple low-cost process can suppress displacement due to a repulsive force when a magnetic yoke is mounted on a permanent magnet, and a highly reliable non-reciprocal circuit having a simple configuration.
- An element can be provided.
- FIG. 1 is a schematic perspective view showing a configuration of a non-reciprocal circuit device according to a first embodiment. It is the schematic plan view which looked at the nonreciprocal circuit device of Embodiment 1 of FIG. 1 from the upper side.
- 2 is a schematic cross-sectional view showing a configuration of a nonreciprocal circuit device according to Embodiment 1.
- FIG. FIG. 4 is a schematic plan view showing a state in which one main surface side of the magnetic plate in FIG. 3 is viewed in plan.
- FIG. 4 is a schematic plan view showing a state in which the other main surface side of the magnetic plate in FIG. 3 is viewed in plan.
- 6 is a schematic cross-sectional view showing a first step of the method for manufacturing the non-reciprocal circuit device of Embodiment 1.
- FIG. 6 is a schematic cross-sectional view showing a second step of the method for manufacturing the non-reciprocal circuit device of Embodiment 1.
- FIG. 6 is a schematic cross-sectional view showing a third step of the method for manufacturing the non-reciprocal circuit device of Embodiment 1.
- FIG. 6 is a schematic cross-sectional view showing a fourth step of the method for manufacturing the non-reciprocal circuit device of Embodiment 1.
- FIG. 7 is a schematic cross-sectional view showing a fifth step of the method for manufacturing the non-reciprocal circuit device of Embodiment 1.
- FIG. 7 is a schematic cross-sectional view showing a sixth step of the method for manufacturing the non-reciprocal circuit device of Embodiment 1.
- FIG. 6 is a schematic cross-sectional view showing a second step of the method for manufacturing the non-reciprocal circuit device of Embodiment 1.
- FIG. 6 is a schematic cross-sectional view showing a third step of the method for manufacturing the non-reci
- FIG. 12 is a schematic cross-sectional view showing a seventh step of the method for manufacturing the nonreciprocal circuit device of Embodiment 1.
- FIG. 12 is a schematic cross-sectional view showing an eighth step of the method for manufacturing the non-reciprocal circuit device of Embodiment 1.
- FIG. It is a schematic sectional drawing which shows the 9th process of the manufacturing method of the nonreciprocal circuit device of Embodiment 1.
- FIG. 5 is a schematic cross-sectional view showing a configuration of a nonreciprocal circuit device according to a second embodiment.
- FIG. It is a schematic perspective view for comparing the external appearance of the dielectric component (A) of the first embodiment and the dielectric component (B) of the second embodiment.
- 6 is a schematic cross-sectional view showing a configuration of a nonreciprocal circuit device according to a third embodiment.
- FIG. FIG. 3 is a schematic cross-sectional view showing an aspect of a problem that can occur in the nonreciprocal circuit device of the first embodiment.
- FIG. 1 is a perspective view of the non-reciprocal circuit device according to the present embodiment.
- 2 is a schematic plan view of the non-reciprocal circuit device of FIG. 1 viewed from above in FIG.
- FIG. 3 is a schematic cross-sectional view of a portion along the line III-III indicated by a broken line in FIG. 4 is a schematic plan view showing a configuration of only the magnetic plate of FIG. 3 as viewed from above in FIGS. 1 and 3.
- FIG. 5 is a schematic plan view showing the configuration of only the magnetic plate of FIG.
- nonreciprocal circuit device 100 of the present embodiment includes an element main body 100A and a mounting substrate 100B.
- the element main body 100A mainly includes a magnetic plate 1, a dielectric component 3, a magnet 5, a magnetic yoke 7, and a solder bump 9.
- the element main body 100A has a configuration including these and each member described later. ing.
- As the mounting board 100B a circuit board 11 is provided, and each member described later is provided on the circuit board 11.
- the magnetic plate 1 has one main surface 1A and the other main surface 1B.
- One main surface 1A is the upper main surface in FIG. 3, and the other main surface 1B is the opposite main surface 1A, that is, the lower main surface in FIG.
- the magnetic plate 1 is made of, for example, a metal material mainly composed of iron, ferrite, or a composite magnetic material obtained by mixing magnetic powder and a resin material.
- the magnetic plate 1 is preferably made of a ferrite material.
- rare earth garnet type ferrite known as a material having a small magnetic loss in a high frequency region is used.
- the magnetic plate 1 is preferably, for example, a flat plate shape having a rectangular shape or a square shape in a plan view, that is, a rectangular parallelepiped shape.
- the magnetic plate 1 of the present embodiment has a square shape of 5.0 mm in length and 5.0 mm in width in plan view, and the thickness, that is, the distance between one main surface 1A and the other main surface 1B is 0.5 mm. is there.
- a central electrode 21 is formed on one main surface 1A of the magnetic plate 1.
- the center electrode 21 is formed to have a circular shape in plan view, for example, and a wiring 23 is formed so as to extend outward from the circumference of the center electrode 21.
- a total of three wirings 23 are provided at positions that are 120 ° apart from the center of the central electrode 21 in plan view in the circumferential direction of the circular shape of the central electrode 21.
- the three wires 23 are arranged so that the center angle formed by the straight lines in the radial direction of the three center electrodes 21 connecting the center electrode 21 and each of the three wires 23 is 120 °. Yes.
- a plurality of input / output terminals 31 and a grounding electrode 33 are formed on the other main surface 1B of the magnetic plate 1.
- three input / output terminals 31 are formed, for example, at positions overlapping the wiring 23 in a plan view. Thereby, each of the plurality of wirings 23 is connected to the plurality of input / output terminals 31.
- the grounding electrode 33 is formed, for example, at a position overlapping the center electrode 21 in a plan view.
- the ground electrode 33 may be formed so as to cover the entire surface of the other main surface 1B, for example, but in FIG. 3 and each of the subsequent cross-sectional views, the ground electrode 33 is only part of it from the viewpoint of making the drawing easier to see. Are shown as being arranged.
- solder resist 35 is formed on the other main surface 1B so as to cover the surfaces of the input / output terminal 31 and the grounding electrode 33.
- the solder resist 35 is formed of a metal material such as chromium or an epoxy resin material. However, in this embodiment, an epoxy resin solder resist 35 is used.
- the region where the input / output terminal 31 and the grounding electrode 33 are exposed from the solder resist 35, that is, the input / output terminal 31 and the grounding electrode 33 exposed through the opening formed in the solder resist 35 are formed as pad electrodes.
- the center electrode 21, the wiring 23, the input / output terminal 31, and the grounding electrode 33 formed on the magnetic plate 1 are preferably formed of a copper foil having a thickness of 40 ⁇ m or more and 70 ⁇ m or less, for example.
- the magnetic plate 1 is formed with a plurality of through holes 25 extending from one main surface 1A to the other main surface 1b.
- the through hole 25 extends, for example, from a region overlapping with a part of the wiring 23 on one main surface 1A (see FIG. 4) so as to reach the input / output terminal 31 on the other main surface 1B.
- a conductive film 27 is formed on the inner wall surface of the through hole 25.
- the conductive film 27 may also be formed of the same copper foil as the wiring 23. For this reason, the plurality of through holes 25 connect one main surface 1 ⁇ / b> A and the other main surface 1 ⁇ / b> B of the magnetic plate 1.
- connection means electrical connection, but it can also be said that one main surface 1A and the other main surface 1B are mechanically connected via the conductive film 27. Thereby, the center electrode 21 and the wiring 23 on one main surface 1A can be electrically connected to the input / output terminal 31 and the grounding electrode 33 on the other main surface 1B.
- the magnetic plate 1 having the above configuration is a member for magnetically resonating microwaves inside.
- Dielectric component 3 is connected via sheet adhesive 13 on one main surface 1A of magnetic plate 1, that is, above the center electrode 21 and wiring 23 in FIG.
- a material constituting the dielectric component 3 it is preferable to use a material having a small dielectric loss. That is, the dielectric component 3 is made of, for example, a resin material such as polyimide or polytetrafluoroethylene (PTFE), or a ceramic material such as alumina. In the present embodiment, dielectric component 3 is formed of alumina.
- the dielectric component 3 is formed to have a circular shape in a plan view, for example, and has an outermost diameter of 3.0 mm or more, and is 3.8 mm in the present embodiment.
- Dielectric component 3 has one main surface 3A and the other main surface 3B.
- One main surface 3A is the upper main surface in FIG. 3, and the other main surface 3B is the opposite main surface 3A, that is, the lower main surface in FIG. Since the dielectric component 3 is basically columnar, the outermost diameter has a substantially constant value from one main surface 3A to the other main surface 3B.
- a cavity 3C that is recessed toward the other main surface 3B is formed in one main surface 3A, that is, a part of the surface on the magnet 5 side, which will be described later, particularly in a central portion in plan view.
- the cavity 3C has a bottom surface 3C1 as an inner wall surface extending in the left-right direction in FIG. 3 along one main surface 3A, and a side surface 3C2 as an inner wall surface extending in the thickness direction intersecting the bottom surface 3C1, that is, in the vertical direction in FIG. is doing.
- the bottom surface 3C1 of the cavity 3C also has a circular shape in plan view, and the entire cavity 3C composed of the bottom surface 3C1 and the side surface 3C2 has a cylindrical shape. Yes.
- the circular diameter of the cavity 3C in plan view is larger than 3.0 mm, for example, and is 3.2 mm in the present embodiment.
- the thickness of the bottom surface portion from the bottom surface 3C1 of the cavity 3C to the other main surface 3B is preferably 0.2 mm or more and 0.5 mm or less, for example, 0.3 mm in the present embodiment. The thickness of this portion determines the distance between the magnetic plate 1 and the magnet 5 above the cavity 3C, and the distance between the magnetic plate 1 and the magnet 5 affects the electrical characteristics of the nonreciprocal circuit element 100. In this sense, the thickness of the bottom portion of the cavity 3C is important.
- the height of the side portion is preferably 0.1 mm or more. In this way, the magnet 5 can be stably stored in the cavity 3C.
- the height of the side surface portion of the cavity 3C affects the stability of the posture in which the magnet 5 is housed in the cavity 3C. In this sense, the height of the side surface portion of the cavity 3C is important.
- the height dimension of the side surface portion is not more than twice the thickness of the side surface portion from the side surface 3C2 of the cavity 3C to the outermost side surface (surface) of the dielectric component 3.
- the thickness of the side surface portion means the dimension in the left-right direction in FIG. 3, that is, half of the difference between the outermost diameter of the dielectric component 3 and the diameter of the cavity 3C. In this way, the mechanical strength of the dielectric component 3 can be ensured.
- the surface area of the side surface 3C2, which is the inner wall surface of the cavity 3C is preferably at least 1/20 of the area when the magnet 5 described later housed in the cavity 3C is viewed in plane, that is, the bottom area. In this way, it is possible to ensure sufficient adhesion strength of the sheet adhesive 13 to the side surface 3C2 of the magnet 5.
- the height of the side surface portion of the cavity 3C is set to 0.3 mm.
- the magnet 5 is formed to have a circular shape in a plan view, for example.
- the diameter of the magnet 5 is, for example, 3.0 mm, which is smaller than the circular diameter in plan view of the cavity 3C from the viewpoint of enabling insertion of the magnet 5 into the cavity 3C, and the thickness (the dimension in the height direction) is 1. 0.0 mm.
- the magnet 5 has one main surface 5A (upper side in FIG. 3) and the other main surface 5B (lower side in FIG. 3) on the opposite side. A region between one main surface 5A and the other main surface 5B of the magnet 5 is formed as a magnet side surface 5C.
- the magnet 5 is a member as a permanent magnet that is arranged to use a DC magnetic field in the element main body 100A.
- the magnet 5 is made of, for example, any one of a ferrite material, a samarium-cobalt material, or a neodymium-iron-boron material.
- the magnet 5 is formed of a samarium-cobalt material having a high Curie temperature and high corrosion resistance.
- the magnet 5 is connected to the side opposite to the magnetic plate 1 of the dielectric component 3, that is, the upper side in FIG. More specifically, the magnet 5 is disposed so that at least a part thereof is accommodated in the cavity 3 ⁇ / b> C of the dielectric component 3. That is, at least a part of the magnet 5 is disposed in the cavity 3C.
- the other main surface 5B of the magnet 5 is connected to the bottom surface 3C1 in the cavity 3C via the sheet adhesive 13. At least a part of the side surface of the magnet 5 is connected to the side surface 3C2 in the cavity 3C via the sheet adhesive 13.
- the magnet 5 is in a state of being fitted into the cavity 3 ⁇ / b> C via the sheet adhesive 13.
- the height of the side surface portion of the cavity 3C is preferably 0.1 mm or more, and the dimension of the magnet 5 in the height direction is, for example, 1.0 mm.
- the height dimension of the side surface portion of the cavity 3C is preferably 10% or more of the dimension in the height direction of the magnet 5, and the height dimension of the side surface portion of the cavity 3C is set to the dimension in the height direction of the magnet 5. May be equal. That is, the height dimension of the side surface portion of the cavity 3 ⁇ / b> C is preferably 10% or more and 100% or less of the height dimension of the magnet 5.
- the magnet 5 is electrically applied to each of the three input / output terminals 31 of the magnetic plate 1 from each of a plurality of signal conductors formed on the circuit board 11 described below by applying a bias magnetic field. It is a member that enables control of signal transmission. Specifically, for example, a signal input from the first signal conductor of the three signal conductors to the first input / output terminal 31 of the three input / output terminals 31 hardly attenuates, The signal is transmitted to the second input / output terminal 31, which is one of the input / output terminals 31, and output from there to the second signal conductor.
- a greatly attenuated signal is transmitted to the third input / output terminal 31 which is one of the other input / output terminals 31 different from the above, and the greatly attenuated signal is output to the third signal conductor.
- the magnet 5 applies a magnetic field in only one direction to the inside of the magnetic plate 1 or passes a transmission path of the microwave input from the input / output terminal to the input / output terminal 31 in a specific direction. It has a function to change the rotation.
- the dielectric component 3 is connected to the magnetic plate 1 by, for example, a sheet adhesive 13 inside the plurality of through holes 25 in a plan view.
- a circle passing through the three through holes 25, which is a curve smoothly connecting a plurality of (three in FIG. 2) through holes 25 in plan view is considered.
- the dielectric component 3 is disposed at a position that fits inside a circle passing through the three through holes 25.
- the magnet 5 is also arranged inside the plurality of through holes 25 in plan view. In this way, a bias magnetic field can be uniformly applied to the entire center electrode 21.
- the circular center of the magnet 5 and the circular center of the center electrode 21 in plan view are arranged at substantially the same position.
- the present invention is not limited to this, and the position of the circular center of the magnet 5 and the circular center of the center electrode 21 in plan view may be shifted depending on the performance of the nonreciprocal circuit device 100.
- the magnetic yoke 7 is connected to the opposite side of the magnet 5 from the magnetic plate 1, that is, the upper side in FIG.
- the magnetic yoke 7 has a role of controlling the path of the lines of magnetic force, and is a member for exerting an effect of suppressing the influence of magnetism when being surface-mounted using a chip mounter or the like in addition to the electromagnetic shielding effect. is there.
- the magnetic yoke 7 also has one main surface 7A (upper side in FIG. 3) and the other main surface 7B (lower side in FIG. 3) on the opposite side.
- the magnetic yoke 7 is preferably basically composed of a ferromagnetic material, and for example, a disk-shaped member made of SUS430 is used.
- the magnetic yoke 7 of the present embodiment has a diameter of, for example, 4.0 mm and a thickness of 0.2 mm.
- the shape of the magnetic yoke 7 is not limited to the above-described disk shape, and may be a polygonal shape in plan view, for example. Further, the magnetic yoke 7 is not limited to the one connected to the magnet 5, and may be a cap shape that covers one main surface 5 ⁇ / b> A of the magnet 5, for example.
- the sheet adhesive 13 as an adhesive that bonds the magnetic plate 1, the dielectric component 3, the magnet 5, and the magnetic yoke 7 together so as to be integrated with each other is a flat plate member.
- the sheet adhesive 13 bonds the members to each other by bonding to one or the other main surface of the magnetic plate 1, the dielectric component 3, the magnet 5, and the magnetic yoke 7. That is, the sheet adhesive 13 adheres to one main surface 1A (center electrode 21) of the magnetic plate 1 and the other main surface 3B of the dielectric component 3 immediately above it, so that the magnetic plate 1 and the dielectric component 3 are bonded. And are bonded.
- one main surface 13A of the sheet adhesive 13 is bonded to the other main surface 3B of the dielectric component 3, and the other main surface 13B of the sheet adhesive 13 is one main surface 1A (center electrode) of the magnetic plate 1. 21).
- the sheet adhesive 13 is adhered to one main surface 3A (the bottom surface 3C1 of the cavity 3C) of the dielectric component 3 and the other main surface 5B of the magnet 5 immediately above it, so that the dielectric component 3 and the magnet 5 are bonded. And are bonded.
- one main surface 13A of the sheet adhesive 13 is bonded to the other main surface 5B of the magnet 5, and the other main surface 13B of the sheet adhesive 13 is connected to one main surface 3A (of the cavity 3C) of the dielectric component 3. It is bonded to the bottom surface 3C1 and the side surface 3C2).
- the sheet adhesive 13 adheres the magnet 5 and the magnetic yoke 7 by adhering to the one main surface 5A of the magnet 5 and the other main surface 7B of the magnetic yoke 7 immediately above it.
- one main surface 13 A of the sheet adhesive 13 is bonded to the other main surface 7 B of the magnetic yoke 7, and the other main surface 13 B of the sheet adhesive 13 is bonded to one main surface 5 A of the magnet 5. .
- thermosetting adhesive or a thermoplastic adhesive is preferably used as the sheet adhesive 13.
- different product numbers may be used as the plurality of sheet adhesives 13 described above.
- all the sheet adhesives 13 are epoxy resin adhesives having the same thermosetting property.
- the sheet adhesive 13 is preferably formed of a thermoplastic resin whose main component is an adhesive.
- the thermoplastic resin has a problem that heat resistance is insufficient when used for surface mounting. Therefore, in the present embodiment, from the viewpoint of ensuring both good adhesiveness and heat resistance, the sheet adhesive 13 made of a material in which both a thermoplastic resin and a thermosetting resin are blended is used. preferable.
- the inner wall surface of the cavity 3 ⁇ / b> C is interposed via the sheet adhesive 13 when arranging and bonding at least a part of the magnet 5 in the cavity 3 ⁇ / b> C of the dielectric component 3. It is required that the bottom surface 3C1 and the side surface 3C2 and the magnet 5 can be bonded and fixed. From this point of view, in the present embodiment, for example, the sheet adhesive 13 of each part described above has the same shape, that is, a circular planar shape, and the dimension in plan view is 3.6 mm in diameter and thickness. Can be used with a thickness of 0.1 mm.
- the above thickness is set in consideration of the thickness of the dielectric component 3.
- any insulating material capable of adhering and fixing the respective members and ensuring electrical insulation between the adhesively fixed members can be used.
- a one-component adhesive or a two-component adhesive may be used.
- the magnetic plate 1, the dielectric component 3, the magnet 5 and the magnetic yoke 7 are integrated, but a plurality of solders are formed on the lowermost part in FIG. 3, that is, on the other main surface 1 B of the magnetic plate 1.
- Bumps 9 are connected.
- the solder bumps 9 are used to electrically connect the element main body 100A and the mounting substrate 100B.
- the solder bump 9 is a pad electrode in which the input / output terminal 31 and the grounding electrode 33 are exposed from the solder resist 35 on the other main surface 1B side (on the other main surface 1B) of the magnetic plate 1. It is joined to the part. Thereby, the terminals and electrodes of the magnetic plate 1 and the solder bumps 9 are electrically connected.
- the solder bumps 9 are preferably formed of, for example, a solder made of an alloy of tin, silver, and copper.
- the solder bump 9 is preferably formed of Sn3.0Ag0.5Cu, but is not limited thereto.
- the solder bumps 9 are, for example, spherical, and their dimensions are an important item for determining the gap between the magnetic plate 1 and the circuit board 11. Therefore, the dimensions of the solder bumps 9 are, for example, the diameters in consideration of the electrical characteristics between the magnetic plate 1 and the circuit board 11, the connection reliability, the efficiency of the work of mounting the solder bumps 9 on the circuit board 11, etc. Although it is preferable to set it as 0.65 mm, it is not restricted to this.
- the circuit board 11 as the mounting board 100B is, for example, a flat plate member having a rectangular shape in a plan view, and similarly to the other members, one main surface 11A (upper side in FIG. 3) and the other opposite side. Main surface 11B (lower side in FIG. 3).
- the circuit board 11 is preferably made of a ceramic material or a resin material.
- a printed circuit board made of a resin having a dielectric loss lower than that of a ceramic material is used as the circuit board 11. Thereby, the improvement of the high frequency characteristic of the circuit board 11 and the reduction of manufacturing cost can be made compatible.
- the external dimensions of the circuit board 11 are, for example, a square shape having a length of 50 mm and a width of 50 mm in plan view, and the thickness, that is, the distance between one main surface 11A and the other main surface 11B is 1.7 mm.
- the circuit board 11 is formed with a pad electrode 41 as a plurality of signal conductors and a circuit board center electrode 43. That is, on one main surface 11A of the circuit board 11, a pad electrode 41 as a plurality of signal conductors and a circuit board center electrode 43 are formed. Of these, the pad electrode 41 is not shown, but in a plan view of the one main surface 11A, a position separated by 120 ° with respect to the circumferential direction of a virtual circle drawn on the one main surface 11A with the center at the center. There are a total of three locations. In other words, three pad electrodes 41 are arranged in a direction overlapping the wiring 23 of the magnetic plate 1 in a plane. A plurality of circuit board center electrodes 43 are provided at a part of a position overlapping the grounding electrode 33 of the magnetic plate 1 in a planar manner with a space therebetween.
- solder resist 35 is formed so as to cover the surfaces of the pad electrode 41 and the circuit board central electrode 43, as on the other main surface 1B of the magnetic plate 1. However, since the solder resist 35 has an opening at a portion where the pad electrode 41 and the circuit board central electrode 43 overlap, the pad electrode 41 and the circuit board central electrode 43 are exposed from the solder resist 35.
- the exposed pad electrode 41 and the circuit board center electrode 43 are joined to the solder bump 9. Thereby, the magnetic plate 1 and the circuit board 11 are electrically connected. Specifically, the pad electrode 41 of the circuit board 11 and the plurality of input / output terminals 31 and the grounding electrode 33 of the magnetic plate 1 are electrically connected.
- the pad electrode 41 is electrically connected to the plurality of input / output terminals 31 and the grounding electrode 33 by the solder bump 9 or the sheet adhesive 13, but other connection means may be used.
- BGA All Grid Array
- a nickel plating film having a thickness of 3 ⁇ m or more and 5 ⁇ m or less and a gold film having a thickness of 0.02 ⁇ m or more and 0.05 ⁇ m or less are formed on the surface of the pad electrode 41 and the circuit board central electrode 43 which are the openings of the solder resist 35. Are formed by laminating these plating films.
- This plating film is for preventing oxidation of the pad electrode 41 and the like and improving the wettability of the solder bump 9 thereon.
- Such nickel and gold plating films may also be formed on the surfaces of the input / output terminals 31 and the grounding electrode 33 of the magnetic plate 1.
- a back electrode 51 is formed so as to cover the entire surface.
- a through hole 53 is formed in the circuit board 11 from the circuit board central electrode 43 on one main surface 5 A to the back electrode 51 on the other main surface 5 B, and the conductive film 55 is filled so as to fill the through hole 53. Is formed.
- the pad electrode 41, the circuit board center electrode 43, and the back electrode 51 formed on the circuit board 11 are preferably formed of a copper foil having a thickness of 40 ⁇ m or more and 70 ⁇ m or less, for example.
- the conductive film 55 may also be formed of the same copper foil as the circuit board center electrode 43.
- the element main body 100A is mounted on the one main surface 5A of the circuit board 11 as the mounting board 100B by the solder bumps 9, and the nonreciprocal circuit element 100 is formed.
- the circuit board 11 is connected to the other main surface 1B (the other main surface 1B side) of the magnetic plate 1 via the solder bumps 9.
- a magnetic plate 1 having one main surface 1A and the other main surface 1B opposite to the main surface 1A is prepared.
- a through hole 25 is formed in the magnetic plate 1 from one main surface 1A to the other main surface 1B.
- sand blasting or laser processing is used. In the present embodiment, it is preferable to use sandblasting from the viewpoint of reducing processing costs.
- a central electrode 21 and wiring 23 are formed on one main surface 1A, and a plurality of input / output terminals 31 and grounding electrodes 33 are formed on the other main surface 1B. These are preferably formed by any method selected from generally known screen printing methods, sputtering methods, vapor deposition methods and plating methods.
- a copper thin film of 3 ⁇ m or more and 5 ⁇ m or less is first formed on one main surface 1A and the other main surface 1B of the base material of the magnetic plate 1 by electrolytic plating. Is formed by laminating a nickel plating film having a thickness of 1 ⁇ m to 2 ⁇ m and a gold plating film having a thickness of 0.02 ⁇ m to 0.05 ⁇ m. Nickel and gold plating films are formed to prevent oxidation of copper thin films and improve solder wettability.
- the conductive film 27 may be formed on the inner wall surface of the through hole 25 by forming these films.
- the formed film is patterned by a technique such as a generally known photolithography technique. Thereafter, a solder resist 35 is formed on the other main surface 1B so as to cover the input / output terminal 31 and the grounding electrode 33. However, the solder resist 35 in a region where the input / output terminal 31 and the grounding electrode 33 are to be exposed is formed so that an opening is formed.
- the solder resist 35 may be formed by a sputtering method or a vapor deposition method when forming a metal material such as chromium that is difficult to wet with solder, and may be formed by a screen printing method when forming an epoxy resin-based material. preferable. In this embodiment, an epoxy resin solder resist 35 is formed by a screen printing method.
- the magnetic plate 1 formed in this way is placed on one main surface of the hot plate 101.
- the magnetic plate 1 is placed on the hot plate 101 so that the solder resist 35 on the other main surface 1B side contacts the hot plate 101.
- the sheet adhesive 13 is, for example, the center of the magnetic plate 1. Affixed on the electrode 21.
- the sheet adhesive 13 a sheet adhesive previously supplied in a roll shape from a material maker and separated into pieces by a mold or the like is used.
- the general sheet adhesive 13 has a tack property which is an initial adhesive property of the adhesive depending on its temperature. Thereby, the sheet adhesive 13 has both excellent handling properties and adhesiveness. Specifically, the sheet adhesive 13 of the present embodiment has a low tackiness at room temperature and an excellent handling property. However, the sheet adhesive 13 at room temperature is insufficient in flexibility to adhere to the magnetic plate 1 so as not to cause wrinkles. Therefore, when the sheet adhesive 13 is stuck on the magnetic plate 1, it is preferable that the sheet adhesive 13 is softened by being heated to 40 ° C. or higher and 80 ° C. or lower. If it does in this way, the wettability with respect to the adherend of the sheet adhesive 13 will improve, and high adhesive strength can be obtained.
- a silicone roller 103 having a hardness of 60 is used and a pressure of 0.3 MPa or more and 1.0 MPa or less is applied while a pressure of 0.3 MPa or more and 1.0 MPa or less is applied along the horizontal direction of the figure from 10 mm / s to 100 mm. It is preferable to rotate this at a speed of less than / s.
- the release film 112 is attached to the sheet adhesive 13. That is, the sheet adhesive 13 is attached so as to be in close contact with the center electrode 21, and the release film 112 integral with the sheet adhesive 13 is disposed on the upper side of the sheet adhesive 13 in FIG. Since the roller 113 rolls on the sheet adhesive 13 so as to come into contact with the release film 112 and pressurizes it, the roller 113 does not adhere to the sheet adhesive 13 due to the pressurization.
- roller 113 with the heater attached, because the temperature difference between the upper side and the lower side of the sheet adhesive 13 in FIG. 7 can be reduced.
- the release film 112 is peeled off to expose the sheet adhesive 13 and the magnetic plate 1 is hot. It is removed from the top of the plate 101 and stored.
- the magnet 5 is placed on the hot plate 101.
- the magnet 5 is placed on the hot plate 101 so that one main surface 5A arranged on the upper side is arranged on the lower side and contacts the hot plate 101. Is done.
- the sheet adhesive 13 is stuck on the other main surface 5 ⁇ / b> B and is pressed by the roller 113 from the attached release film 112.
- the above processing may be performed in a state where the magnet 5 is fixed to a support plate such as a ferromagnetic body so that the magnet 5 does not move due to the influence of magnetic force.
- the release film 112 is peeled off after the pressurizing step, and the magnet 5 is removed from the hot plate 101 and stored.
- the magnetic yoke 7 is placed on the hot plate 101.
- one main surface 7 ⁇ / b> A is disposed on the lower side and placed so as to contact the hot plate 101.
- seat adhesive agent 13 is affixed on the other main surface 7B by the procedure using the roller 113 similar to FIG.
- FIGS. 10 to 13 shows a process of installing a member on the dedicated tray 114
- FIGS. 10 to 13 shows a process of actually assembling the member on the assembly stage 116.
- the magnetic plate 1, the dielectric component 3, the magnet 5 and the magnetic yoke 7 are assembled using a chip mounter having a dedicated tray 114, a suction nozzle 115, and an assembly stage 116. That is, the magnetic plate 1 is accommodated in the dedicated tray 114 as shown in FIG.
- the dielectric component 3 as shown in FIG. 11 (A), the magnet 5 as shown in FIG. 12 (A), and the magnetic yoke 7 as shown in FIG. 13 (A), respectively. It is stored in a dedicated tray 114.
- the dedicated tray 114 is provided with a digging structure for escaping at a position where it comes into contact with the sheet adhesive 13, or a process for suppressing adhesion to the sheet adhesive 13 by surface treatment. It is preferable that it is made.
- a treatment for physically roughing the surface such as sandblasting, may be performed.
- a material having a releasing action such as polytetrafluoroethylene (PTFE) may be used on the surface.
- the magnet 5 in FIG. 12A it is possible to provide a sufficient pitch between components from the viewpoint of suppressing a plurality of magnets 5 housed in the dedicated tray 114 from exerting a magnetic force due to the influence of the magnetic force. It is preferable that a special tray 114 is used.
- the magnetic plate 1 is sucked up from the dedicated tray 114 by the suction nozzle 115 constituting the chip mounter, and on the assembly stage 116 as shown in FIG. 10 (B).
- the assembly stage 116 has a flat plate shape, and has a through-hole-shaped vacuum suction portion 116 ⁇ / b> C that reaches from one (upper) main surface to the other (lower) main surface. That is, the assembly stage 116 has a configuration capable of adsorbing an object placed immediately above the assembly stage 116 by a suction force from below the vacuum suction portion 116C. Therefore, the magnetic plate 1 placed on the assembly stage 116 is fixed by being attracted to the assembly stage 116 by the vacuum suction portion 116C immediately below it.
- the dielectric component 3 is sucked up from the dedicated tray 114 by the suction nozzle 115 and fixed to the assembly stage 116 as shown in FIG. 11B. It is mounted on the center of the sheet adhesive 13. Thereby, the dielectric component 3 is connected on one main surface 1A of the magnetic plate 1.
- the dielectric component 3 has a cavity 3C having a bottom surface 3C1 and a side surface 3C2 formed on a part of one main surface 3A that is a surface (upper side) to which a magnet 5 described later is connected. ing.
- the dielectric component 3 is mounted and connected to the magnetic plate 1 so that the other main surface 3B on the lower side of the dielectric component 3 is in contact with the sheet adhesive 13 of the magnetic plate 1.
- the lowering height of the suction nozzle 115 is set to an appropriate value so that, for example, the dielectric component 3 adheres to the sheet adhesive 13. It is preferable that the downward pressing force is controlled to be 0.3 MPa or more and 1.0 MPa or less. Further, in FIG. 11B, when the suction nozzle 115 reaches the lowermost lower part, that is, when the dielectric component 3 reaches the lowermost part, that is, on the sheet adhesive 13 of the magnetic plate 1, it is 1 second or more and 10 seconds or less. Preferably, a stop time is provided. This stop time is a standby time sufficient for the sheet adhesive 13 and the dielectric component 3 to be temporarily fixed.
- the magnet 5 and the sheet adhesive 13 are sucked up from the dedicated tray 114 shown in FIG. 12A, and the dielectric connected to the magnetic plate 1 on the assembly stage 116 as shown in FIG. 12B.
- the components 3 are arranged so as to be housed in the cavities 3C.
- the sheet adhesive 13 adhered to the other main surface 5B of the magnet 5 adheres to the bottom surface 3C1 of the cavity 3C, whereby the dielectric component 3 is connected to the bottom surface 3C1.
- the magnet 5 is connected to the side opposite to the magnetic plate 1 of the dielectric component 3, that is, the upper side in FIG.
- the magnet 5 is sucked up from the dedicated tray 114 by the same suction nozzle 115 as in FIGS. 10 and 11 and is stored in the cavity 3 ⁇ / b> C of the dielectric component 3.
- At least a part of the surface of the magnet 5 disposed in the cavity 3C is a bottom surface in a state where at least a part of the magnet 5 is disposed in the cavity 3C. It is fixed to both 3C1 and the side surface 3C2 via the sheet adhesive 13.
- at least a part of the magnet 5 means, for example, a region relatively close to the other main surface 5B in the magnet 5 of FIG. That is, the sheet adhesive 13 is adhered to both the bottom surface 3C1 and the side surface 3C2 which are the inner wall surfaces of the cavity 3C, and is adhered to the other main surface 5B of the magnet 5 and a region relatively lower than the magnet side surface 5C. It is considered as an embodiment.
- the sheet adhesive 13 connects the magnet 5 and the dielectric component 3 (cavity 3C).
- the sheet adhesive 13 attached to the other main surface 5B of the magnet 5 is caught on the inner wall surface of the cavity 3C of the dielectric component 3 so that the sheet adhesive 13 is not damaged. It is preferable. From this point of view, it is necessary to sufficiently lower the lowering speed of the suction nozzle 115 (not shown) for transporting the magnet 5 to the dielectric component 3 side in order to store the magnet 5 in the cavity 3C, particularly 0.1 mm / s. It is preferable to set it as 1 mm / s or more.
- the magnetic yoke 7 and the sheet adhesive 13 are sucked up from the dedicated tray shown in FIG. 13A, and these are placed on the assembly stage 116 as shown in FIG. 13B. Is placed on one main surface 5 ⁇ / b> A of the magnet 5. That is, the magnetic yoke 7 is connected to the opposite side of the magnet 5 from the magnetic plate 1, that is, the upper side in FIG.
- the detailed procedure of this process is basically the same as that of FIG.
- the connecting step of the magnetic yoke 7 at least a part of the surface of the magnet 5 is kept fixed to both the bottom surface 3C1 and the side surface 3C2 of the cavity 3C via the sheet adhesive 13.
- the magnetic yoke 7 is magnetized. 5 on one main surface 5A.
- the order of assembling the above parts is not limited to the above. For example, after assembling the magnet 5 and the dielectric part 3 for the first time, connecting them on the magnetic plate 1 and then connecting the magnetic yoke 7 on one main surface 5A of the magnet 5 Good.
- the magnetic plate 1, the dielectric component 3, the magnet 5, the magnetic yoke 7, and the sheet adhesive 13 are shown upside down.
- solder bump 9 is connected onto the other main surface 1 ⁇ / b> B of magnetic plate 1.
- the magnetic plate 1 is turned upside down so as to be exposed from the solder resist 35 on the other main surface 1B of the magnetic plate 1, particularly at the opening of the solder resist 35.
- a flux 118 is supplied onto the surfaces of the output terminal 31 and the ground electrode 33 (pad electrode).
- the flux 118 is preferably supplied by a generally known screen printing method using a printing mask on which a metal thin film is formed.
- a printing mask on which a metal thin film is formed.
- the flux 118 it is preferable to use an inactive rosin-based non-cleaning type flux. While printing the flux 118 supplied to the mask for printing with a urethane squeegee or the like, the flux 118 is supplied onto the surfaces of the input / output terminal 31 and the grounding electrode 33 (pad electrode).
- solder bumps 9 are placed on the flux 118 supplied onto the pad electrodes in the step of FIG.
- a method for mounting the solder bumps 9 for example, a method in which the solder bumps 9 are adsorbed by a mounter and transported to the flux 118 is used.
- the part of the solder bump 9 protruding from the mask by being set on the mask on which the metal thin film is formed is scraped off by a urethane squeegee or the like, so that the other main surface 1B of the magnetic plate 1 is obtained.
- a method of supplying the solder bump 9 to the opening of the solder resist 35 may be used. In the latter case, the work can be easily performed using a simple jig.
- solder bump 9 is connected to the input / output terminal 31 and the grounding electrode 33 in the opening of the solder resist 35 on the other main surface 1B by heating and soldering in a reflow furnace.
- the element main body 100A is formed.
- a circuit board 11 is prepared as a mounting board 100B for mounting the element main body 100A.
- a pad electrode 41 and a circuit board center electrode 43 are formed on one main surface 11A
- a back electrode 51 is formed on the other main surface 11B
- a through hole 53 and a conductive film 55 are formed in the substrate, respectively.
- a pattern of the solder resist 35 is formed on one main surface 11A of the circuit board 11 by a generally known screen printing method.
- the solder resist 35 has an opening at a portion to which the solder bump 9 is connected, and is formed so that the pad electrode 41 and the circuit board center electrode 43 are exposed.
- a solder paste thin film is printed on the exposed surfaces of the pad electrode 41 and the circuit board center electrode 43.
- the entire upper and lower sides of the element main body 100A formed in FIG. 16 are reversed again, and the solder bumps 9 connected to the magnetic plate 1 are opened in the solder resist 35 and the pad electrodes 41 and the circuit board central electrode 43 are exposed. Placed in contact with the area. In this state, the solder bumps 9 are connected to the pad electrode 41 and the circuit board center electrode 43 of the circuit board 11 by heating and soldering in a reflow furnace. Thus, the element main body 100A is connected, that is, mounted on the mounting substrate 100B.
- the circuit board 11 having the pad electrodes 41 as a plurality of signal conductors is connected to the other main surface 1B side of the magnetic plate 1 through the solder bumps 9.
- the height dimension h1 of the side surface portion of the cavity 3C is preferably 10% or more of the height H of the magnet 5 in the height direction.
- the height dimension h1 may be equal to the dimension H of the magnet 5 in the height direction. That is, the height dimension h1 of the side surface portion of the cavity 3C is preferably 10% to 100% of the dimension H in the height direction of the magnet 5.
- the h1 is 0.3 mm and the H is 1.0 mm.
- the height dimension h1 of the side surface portion is preferably not more than twice the thickness r of the side surface portion from the side surface 3C2 of the cavity 3C to the outermost side surface (surface) of the dielectric component 3.
- the r is 0.3 mm.
- the thickness h2 of the bottom surface portion from the bottom surface 3C1 of the cavity 3C to the other main surface 3B is preferably, for example, not less than 0.2 mm and not more than 0.5 mm. In this embodiment, h2 is set to 0.3 mm. Yes.
- the nonreciprocal circuit device 100 having the mode shown in FIG. 3 can be formed by the above steps. Next, the effect of this Embodiment is demonstrated.
- the nonreciprocal circuit device 100 In the method for manufacturing the nonreciprocal circuit device 100 according to the present embodiment, at least a part of the magnet 5 is disposed in the cavity 3C formed on the upper surface of the dielectric component 3, and the other of the magnets 5 is disposed. Part of main surface 5B and magnet side surface 5C is fixed to cavity 3C via sheet adhesive 13. Therefore, in the subsequent connecting process of the magnetic yoke 7, the other main surface 5B of the magnet 5 to which the magnetic yoke 7 is connected is the bottom surface 3C1 of the cavity 3C, and a part of the magnet side surface 5C is the cavity 3C. The state fixed to the side surface 3C2 via the sheet adhesive 13 is maintained. As a result, in the nonreciprocal circuit device 100 of the present embodiment, the cavity 3C is formed, and at least a part of the magnet 5 is disposed and connected in the cavity 3C.
- the holding posture of the magnet 5 with respect to the dielectric component 3 is stabilized by the step of connecting the magnet 5 into the cavity 3C.
- the magnetic yoke 7 is connected to the magnet 5 in a state where the holding posture is stable. Therefore, during the operation of mounting the magnetic yoke 7 on the magnet 5, which is shifted from FIG. 13A to FIG. 13B, it is possible to prevent the magnet 5 from being displaced so as to repel due to the magnetic force. As a result, assembly workability can be improved.
- the element body 100A of the non-reciprocal circuit element 100 can be easily and stably used by an automatic machine with a simple equipment configuration in which the cavity 3C is provided in the dielectric part 3 without adopting a complicated equipment configuration. Can be assembled.
- the magnet 5 can be fixed from both the up and down direction where the bottom surface 3C1 of the cavity 3C faces and the left and right direction where the side surface 3C2 faces. it can. For this reason, the reliability of the fixed state of the magnet 5 can be improved more. Since the magnet 5 can be bonded and fixed on the side surface 3C2 of the cavity 3C in a plan view, the possibility of stress concentration on the bonding surface can be reduced, and interface peeling from the bonding surface can be reduced. Progress can be suppressed. Also from this, the reliability of the connection portion can be improved.
- nonreciprocal circuit element 200 of the present embodiment basically has the same configuration as nonreciprocal circuit element 100 of the first embodiment. For this reason, regarding the nonreciprocal circuit element 200, the same reference numerals are given to the same components as those of the nonreciprocal circuit element 100, and the description thereof will not be repeated.
- the side surface 3C2 of the cavity 3C formed in the dielectric component 3 includes a defective portion in a part of the periphery of the magnet 5 in plan view.
- dielectric component 3 constituting nonreciprocal circuit device 100 of Embodiment 1 has a side surface 3C2 of cavity 3C around the magnet 5 housed therein in plan view. Is provided to surround the entire circumference (one round).
- dielectric part 3 constituting nonreciprocal circuit element 200 of the present embodiment has side surface 3C2 of cavity 3C as a flat surface of magnet 5 accommodated therein. Instead of enclosing the entire perimeter of the view, only a part of the periphery is surrounded, and in the other part, the magnet side surface 5C is exposed to the outside as a defect portion 3D. In this respect, the present embodiment is different from the first embodiment.
- air bubbles may remain in the sheet adhesive 13 attached to connect the magnet 5 in the cavity 3C. If the dielectric component 3 and the magnet 5 are connected using the sheet adhesive 13 in which bubbles remain in this way, the bubbles are caught in the region between the dielectric component 3 and the magnet 5, thereby There is a possibility that the magnet 5 is connected in a state where it is inclined with respect to the vertical direction in which the magnet side surface 5C should originally extend, for example. Since the inclination of the magnet side surface 5C affects the electrical characteristics of the non-reciprocal circuit element, it is preferable that the magnet side surface 5C is mounted so as to extend in the vertical direction as much as possible.
- the side surface 3C2 of the cavity 3C partially include the defect 3D as in the present embodiment, the bubbles in the sheet adhesive 13 can be discharged from the defect 3D to the outside during bonding. .
- the electrical characteristics of the nonreciprocal circuit element 200 can be stabilized and the quality can be improved.
- the dimension L with respect to the dimension of the circular circumferential direction (for one circumference) of the cavity 3C in the plan view is 10% or more and 70% or less of the entire circumference.
- nonreciprocal circuit element 300 of the present embodiment has basically the same configuration as nonreciprocal circuit element 100 of the first embodiment.
- the same components as those in the non-reciprocal circuit element 100 are denoted by the same reference numerals, and description thereof will not be repeated.
- the dielectric component 3 has a magnetic plate larger than the dimension D1 in the left-right direction along one main surface 1A of the magnetic plate 1 on the magnet 5 side, that is, the upper side in the figure.
- the dimension D2 in the left-right direction along one main surface 1A on the one side, that is, the lower side of the figure is larger.
- the other main surface 3B side of the dielectric component 3 that is, the outermost width D1 of the dielectric component 3, rather than the one main surface 3A side of the dielectric component 3, that is, the uppermost horizontal width D1.
- the lower horizontal width D2 is larger.
- the dielectric component 3 constituting the non-reciprocal circuit device 100 of the first embodiment has a cylindrical shape whose horizontal width hardly changes from one main surface 3A to the other main surface 3B.
- the dielectric component 3 constituting the non-reciprocal circuit device 300 of the present embodiment has a conical shape in which the horizontal width gradually increases from one main surface 3A side to the other main surface 3B side. Have. In this respect, the present embodiment is different from the first embodiment.
- the nonreciprocal circuit device 100 of the first embodiment when dielectric component 3 has a cylindrical shape as in nonreciprocal circuit device 100 of the first embodiment, magnetic yoke 7 is mounted on one main surface 5 ⁇ / b> A of magnet 5. In the process (see FIG. 13B), the cavity 3C has the effect of suppressing the falling of the magnet 5 from the dielectric component 3 as described above.
- the nonreciprocal circuit device 100 of the first embodiment there is a possibility that the dielectric part 3 to which the magnet 5 shown in FIG. 21 is fixed falls off from one main surface 1A of the magnetic plate 1. In this respect, it can be said that the nonreciprocal circuit device 100 according to the first embodiment has room for further increasing the adhesive force of the dielectric component 3 to the magnetic plate 1.
- the adhesive force of the dielectric component 3 to the magnetic plate 1 can be further increased as compared with the nonreciprocal circuit element 100.
- the dimension D2 of FIG. 20 is larger than the dimension D1, so that the area of the bonding portion between the dielectric component 3 and the magnetic plate 1 becomes larger than that of the non-reciprocal circuit element 100.
- the lowermost dimension D2 of the dielectric part 3 in FIG. 20 is preferably 2 to 5 times the uppermost dimension D1 of the dielectric part 3.
- the numerical range of the above dimensions is derived.
- the dimensional relationship between the magnet 5 and the magnetic plate 1 is determined by electrical factors rather than mechanical factors. Therefore, if the design is performed in consideration of electrical characteristics, the dimension D2 is set to be not less than 2 times and not more than 5 times the dimension D1 as described above.
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Abstract
Description
実施の形態1.
まず本実施の形態の非可逆回路素子の構成について図1~図5を用いて説明する。図1は、本実施の形態の非可逆回路素子の斜視図である。図2は図1の非可逆回路素子を図1の上方から見た概略平面図である。図3は図2中に折れ線で示すIII-III線に沿う部分の概略断面図である。図4は図3の磁性板のみを図1および図3の上方から見た構成を示す概略平面図である。図5は図3の磁性板のみを図1および図3の下方から見た構成を示す概略平面図である。図1~図5を参照して、本実施の形態の非可逆回路素子100は、素子本体部100Aと、実装基板100Bとを有している。素子本体部100Aは、磁性板1と、誘電体部品3と、マグネット5と、磁気ヨーク7と、はんだバンプ9とを主に有しており、これらと後述の各部材とを有する構成となっている。実装基板100Bとしては、回路基板11が設けられており、この回路基板11に後述の各部材が設けられている。
次に、本実施の形態の作用効果について説明する。
図18を参照して、本実施の形態の非可逆回路素子200は、基本的に実施の形態1の非可逆回路素子100と同様の構成を有している。このため非可逆回路素子200について、非可逆回路素子100と同様の構成要素には同一の参照符号を付し、その説明を繰り返さない。ただし本実施の形態の非可逆回路素子200においては、誘電体部品3に形成されるキャビティ3Cの側面3C2は、平面視におけるマグネット5の周囲の一部において欠損部を含んでいる。
図20を参照して、本実施の形態の非可逆回路素子300は、基本的に実施の形態1の非可逆回路素子100と同様の構成を有している。このため非可逆回路素子300について、非可逆回路素子100と同様の構成要素には同一の参照符号を付し、その説明を繰り返さない。ただし本実施の形態の非可逆回路素子300においては、誘電体部品3が、マグネット5側すなわち図の上側の、磁性板1の一方の主表面1Aに沿う左右方向に関する寸法D1よりも、磁性板1側すなわち図の下側の、一方の主表面1Aに沿う左右方向に関する寸法D2の方が大きくなっている。つまり本実施の形態の非可逆回路素子300においては、誘電体部品3の一方の主表面3A側すなわち最上部の水平方向の幅D1よりも、誘電体部品3の他方の主表面3B側すなわち最下部の水平方向の幅D2の方が大きくなっている。
Claims (8)
- 一方の主表面、および前記一方の主表面と反対側の他方の主表面を有し、複数の入出力端子を有する磁性板と、
前記磁性板の前記一方の主表面上に接続された誘電体部品と、
前記誘電体部品の前記磁性板と反対側に接続された永久磁石と、
前記永久磁石の前記磁性板と反対側に接続された磁気ヨークと、
前記磁性板の前記他方の主表面側に接続され、複数の信号導体を有する回路基板とを備え、
前記誘電体部品の前記永久磁石側の表面には、前記一方の主表面に沿う方向に延びる底面および前記底面に交差する厚み方向に延びる側面を有するキャビティが形成されており、
前記永久磁石の少なくとも一部は前記キャビティ内に配置され、
前記キャビティ内に配置される前記永久磁石の少なくとも一部の表面は、前記底面および前記側面の双方と、接着剤を介して固定されている、非可逆回路素子。 - 前記キャビティの前記側面は、平面視における前記永久磁石の周囲の一部において欠損部を含む、請求項1に記載の非可逆回路素子。
- 前記誘電体部品は、前記マグネット側の前記一方の主表面に沿う方向の寸法よりも、前記磁性板側の前記一方の主表面に沿う方向の寸法の方が大きい、請求項1に記載の非可逆回路素子。
- 前記磁性板は、前記一方の主表面および前記他方の主表面を接続する複数のスルーホールを含む、請求項1~3のいずれか1項に記載の非可逆回路素子。
- 前記誘電体部品は、平面視において前記複数のスルーホールより内側において前記磁性板に接続される、請求項4に記載の非可逆回路素子。
- 前記回路基板はパッド電極を有し、
前記磁性板は接地用電極を有し、
前記パッド電極と、前記複数の入出力端子および前記接地用電極とは電気的に接続される、請求項1~5のいずれか1項に記載の非可逆回路素子。 - 一方の主表面、および前記一方の主表面と反対側の他方の主表面を有し、複数の入出力端子を有する磁性板を形成する工程と、
前記磁性板の前記一方の主表面上に誘電体部品を接続する工程と、
前記誘電体部品の前記磁性板と反対側に永久磁石を接続する工程と、
前記永久磁石の前記磁性板と反対側に磁気ヨークを接続する工程と、
前記磁性板の前記他方の主表面側に、複数の信号導体を有する回路基板を接続する工程とを備え、
前記誘電体部品の前記永久磁石が接続される側の表面には、前記一方の主表面に沿う方向に延びる底面および前記底面に交差する厚み方向に延びる側面を有するキャビティが形成され、
前記永久磁石を接続する工程においては、前記永久磁石の少なくとも一部が前記キャビティ内に配置された状態で、前記キャビティ内に配置される前記永久磁石の少なくとも一部の表面が、前記底面および前記側面の双方と、接着剤を介して固定される、非可逆回路素子の製造方法。 - 前記磁気ヨークを接続する工程は、前記永久磁石の少なくとも一部の表面が前記底面および前記側面の双方と前記接着剤を介して固定された状態が保たれながらなされる、請求項7に記載の非可逆回路素子の製造方法。
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JPH09121104A (ja) * | 1995-10-24 | 1997-05-06 | Tokin Corp | 非可逆回路素子及びその非可逆回路素子によるアイソレーション特性調整方法 |
JP2015080056A (ja) * | 2013-10-16 | 2015-04-23 | 三菱電機株式会社 | 非可逆回路素子およびその製造方法 |
WO2016151847A1 (ja) * | 2015-03-26 | 2016-09-29 | 三菱電機株式会社 | 非可逆回路 |
WO2017188131A1 (ja) * | 2016-04-27 | 2017-11-02 | 三菱電機株式会社 | 非可逆回路素子およびその製造方法 |
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JP2007306634A (ja) | 2007-08-27 | 2007-11-22 | Tdk Corp | 磁気回転子、及び、これを用いた非可逆回路素子 |
US9761922B2 (en) * | 2013-10-11 | 2017-09-12 | Mitsubishi Electric Corporation | Non-reciprocal circuit |
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JPH09121104A (ja) * | 1995-10-24 | 1997-05-06 | Tokin Corp | 非可逆回路素子及びその非可逆回路素子によるアイソレーション特性調整方法 |
JP2015080056A (ja) * | 2013-10-16 | 2015-04-23 | 三菱電機株式会社 | 非可逆回路素子およびその製造方法 |
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