WO2018127173A1 - 柔性显示器 - Google Patents

柔性显示器 Download PDF

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Publication number
WO2018127173A1
WO2018127173A1 PCT/CN2018/071754 CN2018071754W WO2018127173A1 WO 2018127173 A1 WO2018127173 A1 WO 2018127173A1 CN 2018071754 W CN2018071754 W CN 2018071754W WO 2018127173 A1 WO2018127173 A1 WO 2018127173A1
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WO
WIPO (PCT)
Prior art keywords
support film
flexible display
flexible
bonding
area
Prior art date
Application number
PCT/CN2018/071754
Other languages
English (en)
French (fr)
Inventor
党鹏乐
程骥
张秀玉
高美玲
Original Assignee
昆山工研院新型平板显示技术中心有限公司
昆山国显光电有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 昆山工研院新型平板显示技术中心有限公司, 昆山国显光电有限公司 filed Critical 昆山工研院新型平板显示技术中心有限公司
Priority to EP18736181.1A priority Critical patent/EP3537479B1/en
Priority to US16/315,426 priority patent/US10608194B2/en
Priority to JP2019501591A priority patent/JP6991195B2/ja
Priority to KR1020197017876A priority patent/KR102265074B1/ko
Publication of WO2018127173A1 publication Critical patent/WO2018127173A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present application relates to the field of display technologies, and in particular, to a flexible display.
  • OLED display Organic Light Emitting Display
  • flexible substrates eg, plastics
  • the flexible display mainly includes a flexible display screen and a driving chip, wherein the flexible display screen includes a flexible substrate, the flexible substrate includes a display area and a bonding area, and the driving chip is bonded to the bonding area.
  • the thickness of the flexible display screen is very thin, usually about 0.02 mm, so that when the driving chip is bonded to the bonding area, the flexible display screen is easily warped and the quality of the flexible display screen is lowered, or the vacuum suction cup is not easily adsorbed. Living on a flexible display makes bonding operations more difficult.
  • the purpose of the present application is to provide a flexible display to solve the problems in the manufacturing process of the prior art flexible display, which may cause the flexible display screen to warp or the bonding operation to be difficult.
  • the present application provides a flexible display, the flexible display comprising: a flexible display screen and a driving chip, wherein the flexible display screen comprises a flexible substrate, the flexible substrate comprises a display area and a bonding area, A support film is adhered to the back surface of the flexible substrate, and the driving chip is bonded to the bonding region.
  • the display area and the bonding area have a supporting film, wherein the supporting film of the display area is a supporting film having a viscosity, and the bonding of the bonding area
  • the membrane is a tearable support membrane.
  • the display area is pasted with a support film, and the bonding area has no support film.
  • the display area and the bonding area are respectively pasted with a supporting film, wherein the supporting film of the bonding area has a hole, and the supporting film of the display area has no hole .
  • the display area and the bonding area are respectively pasted with a supporting film, wherein the bonding film of the bonding area and the display area each have a hole, and the state The porosity of the support film of the fixed region is higher than the porosity of the support film of the display region.
  • the flexibility of the support film of the bonding zone is higher than the flexibility of the support film of the display zone.
  • the support film has a thickness of 0.1 ⁇ m to 0.3 ⁇ m.
  • the material of the support film is the same as the material of the flexible substrate.
  • the material of the support film is a resin.
  • the flexible display screen further includes a driving circuit unit located on the front surface of the flexible substrate; an organic light emitting element located on the front surface of the flexible substrate and connected to the driving circuit unit; a film encapsulant covering the organic light emitting element; and a water oxygen barrier layer covering the film encapsulant.
  • the back surface of the flexible substrate is adhered with a supporting film, which improves the rigidity of the flexible display screen to a certain extent, so that the flexible display does not cause flexibility during the manufacturing process.
  • the display is warped and the vacuum chuck is easily attached to the flexible display for easy bonding.
  • the bonding region has no supporting film, or the supporting film of the bonding region has higher flexibility than the supporting film of the display region, that is, not only drives during the manufacturing process of the flexible display.
  • the chip timing does not cause the flexible display to warp, and the vacuum chuck is easy to adhere to the flexible display screen for easy bonding, and also makes the bonding area easy to bend, ensuring the bending requirements of the entire flexible display.
  • FIG. 1 is a schematic structural view of a flexible display according to Embodiment 1 of the present application.
  • FIG. 2 is a schematic view showing a partially bent state of a flexible display according to Embodiment 1 of the present application;
  • FIG. 3 is a schematic structural view of an original support film used in the first embodiment of the present application.
  • FIG. 4 and FIG. 5 are schematic diagrams showing the process of attaching a flexible substrate and a support film and driving the chip to a flexible substrate in the first embodiment of the present application;
  • FIG. 6 is a schematic structural view of a support film used in the second embodiment of the present application.
  • the core idea of the present application is to provide a flexible display in which a support film is adhered to the back surface of the flexible substrate, which improves the rigidity of the flexible display screen to some extent, so that the flexible display is in the manufacturing process.
  • Driving the chip timing does not cause the flexible display to warp, and the vacuum chuck is easy to adhere to the flexible display and is easy to bond.
  • the bonding region has no supporting film, or the supporting film of the bonding region has higher flexibility than the supporting film of the display region, that is, not only drives during the manufacturing process of the flexible display.
  • the chip timing does not cause the flexible display to warp, and the vacuum chuck is easy to adhere to the flexible display screen for easy bonding, and also makes the bonding area easy to bend, ensuring the bending requirements of the entire flexible display.
  • FIG. 1 is a schematic structural diagram of a flexible display according to Embodiment 1 of the present application.
  • the flexible display 1 comprises: a flexible display screen 10 and a driving chip 20, wherein the flexible display screen 10 comprises a flexible substrate 11, the flexible substrate 11 comprising a display area and a bonding area, A support film 12 is adhered to the back surface of the flexible substrate 11, and the driving chip 20 is bonded to the bonding region.
  • the rigidity of the flexible display screen 10 is improved to some extent, so that the flexible display does not cause the flexible display screen 10 to warp during the manufacturing process. And making the vacuum chuck easily adsorb the flexible display screen 10 for easy bonding.
  • the display area is pasted with a supporting film, and the bonding area has no supporting film.
  • the bonding zone requires a higher degree of curvature. Therefore, in the embodiment of the present application, the display area is affixed with a supporting film, and the bonding area has no supporting film, thereby enabling the flexible display to be driven during the manufacturing process without causing flexibility.
  • the display screen 10 is warped, and the vacuum chuck is easily attracted to the flexible display screen 10 for easy bonding, and the bonding zone has excellent bending properties to meet the high bending requirements for the bonding zone. Among them, the bending state of the bonding zone can be referred to FIG. 2.
  • the material of the support film 12 is a resin, and the resin material has excellent flexibility, so that the flexible substrate 11 to which the support film 12 is attached maintains good flexibility. More preferably, the material of the support film 12 is the same as the material of the flexible substrate 11, whereby the connection between the support film 12 and the flexible substrate 11 can be made stronger and stable.
  • the thickness of the support film 12 is 0.1 ⁇ m to 0.3 ⁇ m.
  • the thickness of the support film 12 may be 0.1 ⁇ m, 0.125 ⁇ m, 0.15 ⁇ m, 0.175 ⁇ m, 0.2 ⁇ m, 0.215 ⁇ m, 0.25 ⁇ m, 0.275. Mm or 0.3 ⁇ m, etc.
  • the thickness of the support film 12 is selected to be 0.1 ⁇ m to 0.3 ⁇ m, which can realize that the flexible display does not cause the flexible display screen 10 to warn during the manufacturing process.
  • the vacuum chuck is easily attracted to the flexible display screen 10 to be easily bonded, and can meet the bending requirements of the display area.
  • the flexible display 1 further includes: a driving circuit unit 13 located on the front surface of the flexible substrate 11; and an organic light emitting on the front surface of the flexible substrate 11 and connected to the driving circuit unit 13 An element 14; a film encapsulation 15 covering the organic light-emitting element 14; and a water-oxygen barrier layer 16 covering the film encapsulation 15.
  • the water-oxygen barrier layer includes a water-oxygen barrier glue 160 covering the film sealant 15 and a water-oxygen barrier film 161 covering the water-oxygen barrier glue 160.
  • the support film 12 is pasted with the flexible substrate 11 in the following manner.
  • an original support film 12' is provided, which has a separation line 120 on the original support film 12', which divides the original support film 12' into a first portion 121 and a second portion. 122.
  • the front surface of the first portion 121 has a viscosity
  • the front surface of the second portion 122 has no tackiness.
  • the front surface of the original support film 12' is attached to the back surface of the flexible substrate 11.
  • the driving chip 20 is bonded to the bonding region, as shown in FIG.
  • the second portion 122 of the original support film is peeled off along the separation line 120.
  • only the first portion 121 of the original support film is pasted on the back surface of the flexible substrate 11. That is, only the display area is pasted with the support film 12.
  • the original support film 12' may be adhered to the flexible substrate 11, and the second portion 122 may not be torn off.
  • both the display area and the bonding area have a supporting film, wherein the supporting film of the display area is a viscous supporting film (ie, the first part), the bonding area
  • the support film is a tear-off support film (ie, the second portion).
  • the support film of the bonding zone can be retained in subsequent use or can be torn off in subsequent use, increasing flexibility.
  • the bonding film has no supporting film or the supporting film of the bonding region is tearable, and can be selected or retained according to the needs of use.
  • the display area and the bonding area are respectively pasted with a supporting film, wherein the supporting film of the bonding area has a hole and the supporting film of the display area has no hole, or
  • the support film of the bonding zone and the display zone each have a hole, but the porosity of the support film of the bonding zone is higher than the porosity of the support film of the display zone.
  • the support film of the bonding zone and the display zone each have a hole as an example.
  • FIG. 6 is a schematic structural diagram of a support film used in Embodiment 2 of the present application.
  • the support film 32 has a separation line 320 that divides the support film 32 into a first portion 321 and a second portion 322. Wherein, the front faces of the first portion 321 and the second portion 322 are all sticky.
  • first portion 321 and the second portion 322 each have a hole. Further, each of the first portion 321 and the second portion 322 has a plurality of holes, and a plurality of holes on the first portion 321 are evenly distributed on the first portion 321 , and the second portion 322 is A plurality of holes are evenly distributed on the second portion 322.
  • the hole ratio on the first portion 321 is smaller than the hole ratio on the second portion 322.
  • the hole ratio refers to the ratio of the area of the hole to the area of the non-hole.
  • the area of the holes 324 in the second portion 322 is larger, and the interval between the adjacent holes 324 is smaller; and the area of the holes 323 in the first portion 321 is smaller, and between the adjacent holes 323 The interval is also small. That is, in the embodiment of the present application, the flexibility of the second portion 322 is higher than the flexibility of the first portion 321 .
  • the support film 32 can be pasted to the back surface of the flexible substrate, wherein the first portion 321 corresponds to the display area, and the second portion 322 corresponds to the bonding area. Then, the driver chip can be bonded to the bonding area, so that a flexible display can be obtained.
  • the support film of the bonding zone is no longer removed. That is, the bonding area is pasted with a supporting film, the supporting film adhered to the bonding area has a hole; the supporting film pasted by the display area has a hole, and the hole ratio of the supporting film pasted in the display area is smaller than the The porosity of the support film pasted in the bonding zone.
  • the flexibility of the support film adhered to the display area is less than the flexibility of the support film adhered to the bonding area. Therefore, the flexible display can not cause the flexible display screen to warp during the manufacturing process, and the vacuum chuck can easily adhere to the flexible display screen, thereby facilitating bonding and enabling the bonding zone to have a pole. Excellent bending performance to meet the high bending requirements for bonding areas.

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Abstract

一种柔性显示器（1），柔性显示器（1）中的柔性基底（11）的背面粘贴有支撑膜（12），一定程度上提高了柔性显示屏（10）的刚性。特别的，邦定区没有支撑膜（12），或者邦定区的支撑膜（12）的柔韧性高于显示区的支撑膜（12）的柔韧性，即不仅使得在柔性显示器（1）的制造过程中，进行驱动芯片（20）邦定时不会导致柔性显示屏（10）翘曲，以及使得真空吸盘容易吸附住柔性显示屏（10）从而易于邦定，还使得邦定区易于弯折，保证了整个柔性显示器（1）对于弯折的要求。

Description

柔性显示器 技术领域
本申请涉及显示器技术领域，特别涉及一种柔性显示器。
背景技术
OLED显示器(Organic Light Emitting Display，有机发光二极管显示器)作为用于移动电子器件的下一代显示设备而备受关注。然而，如果OLED显示器使用玻璃基底，则因为其易碎性及柔韧性差，而不便于携带，从而一定程度上限制了OLED显示器的发展。因此使用柔性基底(例如，塑料)开发出了柔性OLED显示器，柔性OLED显示器具有较佳的柔韧性，并且可以折叠或卷绕，从而便于携带，弥补了普通OLED显示器的缺陷。
柔性显示器主要包括柔性显示屏和驱动芯片，其中，所述柔性显示屏包括柔性基底，所述柔性基底包括显示区和邦定区，所述驱动芯片邦定于所述邦定区。目前柔性显示屏的厚度非常薄，通常在0.02mm左右，由此在将驱动芯片邦定于邦定区时，容易导致柔性显示屏翘曲而降低了柔性显示屏的质量，或者真空吸盘不易吸附住柔性显示屏而导致邦定操作比较困难。
发明内容
本申请的目的在于提供一种柔性显示器，以解决现有技术的柔性显示器制造过程中，在进行驱动芯片邦定时容易导致柔性显示屏翘曲或者邦定操作困难等问题。
为解决上述技术问题，本申请提供一种柔性显示器，所述柔性显示器包括：柔性显示屏和驱动芯片，其中，所述柔性显示屏包括柔性基底，所述柔性基底包括显示区和邦定区，所述柔性基底的背面粘贴有支撑膜，所述驱动 芯片邦定于所述邦定区。
可选的，在所述的柔性显示器中，所述显示区和所述邦定区均有支撑膜，其中，所述显示区的支撑膜为具有粘性的支撑膜，所述邦定区的支撑膜为可撕除的支撑膜。
可选的，在所述的柔性显示器中，所述显示区粘贴有支撑膜，所述邦定区没有支撑膜。
可选的，在所述的柔性显示器中，所述显示区和所述邦定区均粘贴有支撑膜，其中，所述邦定区的支撑膜具有孔洞，所述显示区的支撑膜无孔洞。
可选的，在所述的柔性显示器中，所述显示区和所述邦定区均粘贴有支撑膜，其中，所述邦定区和所述显示区的支撑膜均具有孔洞，所述邦定区的支撑膜的孔洞率高于所述显示区的支撑膜的孔洞率。
可选的，在所述的柔性显示器中，所述邦定区的支撑膜的柔韧性高于所述显示区的支撑膜的柔韧性。
可选的，在所述的柔性显示器中，所述支撑膜的厚度为0.1μm～0.3μm。
可选的，在所述的柔性显示器中，所述支撑膜的材料与所述柔性基底的材料相同。
可选的，在所述的柔性显示器中，所述支撑膜的材料为树脂。
可选的，在所述的柔性显示器中，所述柔性显示屏还包括位于所述柔性基底正面的驱动电路单元；位于所述柔性基底正面、且与所述驱动电路单元连接的有机发光元件；覆盖所述有机发光元件的薄膜封胶；及覆盖所述薄膜封胶的水氧阻隔层。
在本申请提供的柔性显示器中，其中，柔性基底的背面粘贴有支撑膜，一定程度上提高了柔性显示屏的刚性，从而使得柔性显示器在制造过程中，在进行驱动芯片邦定时不会导致柔性显示屏翘曲，以及使得真空吸盘容易吸 附住柔性显示屏从而易于邦定。特别的，所述邦定区没有支撑膜，或者所述邦定区的支撑膜的柔韧性高于所述显示区的支撑膜的柔韧性，即不仅使得在柔性显示器的制造过程中，进行驱动芯片邦定时不会导致柔性显示屏翘曲，以及使得真空吸盘容易吸附住柔性显示屏从而易于邦定，还使得所述邦定区易于弯折，保证了整个柔性显示器对于弯折的要求。
附图说明
图1是本申请实施例一的柔性显示器的结构示意图；
图2是本申请实施例一的柔性显示器的部分弯曲状态示意图；
图3是本申请实施例一中所使用的原始支撑膜的结构示意图；
图4和图5是本申请实施例一中柔性基底与支撑膜粘贴以及驱动芯片邦定于柔性基底上的过程示意图；
图6是本申请实施例二中所使用的支撑膜的结构示意图。
具体实施方式
以下结合附图和具体实施例对本申请提出的柔性显示器作进一步详细说明。根据下面说明和权利要求书，本申请的优点和特征将更清楚。需说明的是，附图均采用非常简化的形式且均使用非精准的比例，仅用以方便、明晰地辅助说明本申请实施例的目的。
本申请的核心思想在于，提供一种柔性显示器，所述柔性显示器中的柔性基底的背面粘贴有支撑膜，一定程度上提高了柔性显示屏的刚性，从而使得柔性显示器在制造过程中，在进行驱动芯片邦定时不会导致柔性显示屏翘曲，以及使得真空吸盘容易吸附住柔性显示屏从而易于邦定。特别的，所述邦定区没有支撑膜，或者所述邦定区的支撑膜的柔韧性高于所述显示区的支 撑膜的柔韧性，即不仅使得在柔性显示器的制造过程中，进行驱动芯片邦定时不会导致柔性显示屏翘曲，以及使得真空吸盘容易吸附住柔性显示屏从而易于邦定，还使得所述邦定区易于弯折，保证了整个柔性显示器对于弯折的要求。
【实施例一】
请参考图1，其为本申请实施例一的柔性显示器的结构示意图。如图1所示，所述柔性显示器1包括：柔性显示屏10和驱动芯片20，其中，所述柔性显示屏10包括柔性基底11，所述柔性基底11包括显示区和邦定区，所述柔性基底11的背面粘贴有支撑膜12，所述驱动芯片20邦定于所述邦定区。通过所述柔性基底11的背面粘贴有支撑膜12，一定程度上提高了柔性显示屏10的刚性，从而使得柔性显示器在制造过程中，在进行驱动芯片邦定时不会导致柔性显示屏10翘曲，以及使得真空吸盘容易吸附住柔性显示屏10从而易于邦定。
请继续参考图1，在本申请实施例中，所述显示区粘贴有支撑膜，所述邦定区没有支撑膜。通常的，柔性显示器对于邦定区的弯曲要求要高于对于显示区的弯曲要求，即邦定区需要更高的弯曲度。因此，在本申请实施例中，所述显示区粘贴有支撑膜，而所述邦定区没有支撑膜，由此既能够使得柔性显示器在制造过程中，在进行驱动芯片邦定时不会导致柔性显示屏10翘曲，以及使得真空吸盘容易吸附住柔性显示屏10从而易于邦定，又能够使得邦定区具有极佳的弯曲性能，满足对于邦定区较高的弯曲要求。其中，邦定区的弯曲状态可参考图2。
优选的，所述支撑膜12的材料为树脂，树脂材料具有极佳的柔韧性，从而使得粘贴有支撑膜12的柔性基底11保持较好的柔韧性。更优的，所述支撑膜12的材料与所述柔性基底11的材料相同，由此可以使得所述支撑膜12 与所述柔性基底11之间的连接更加牢固与稳定。
进一步的，所述支撑膜12的厚度为0.1μm～0.3μm，例如，所述支撑膜12的厚度可以为0.1μm、0.125μm、0.15μm、0.175μm、0.2μm、0.215μm、0.25μm、0.275μm或者0.3μm等。在本申请实施例中，通过所述支撑膜12的厚度选择为0.1μm～0.3μm，既可以实现柔性显示器在制造过程中，在进行驱动芯片邦定时不会导致柔性显示屏10翘曲，以及使得真空吸盘容易吸附住柔性显示屏10从而易于邦定，又能够满足显示区的弯曲要求。
请继续参考图1，进一步的，所述柔性显示器1还包括：位于所述柔性基底11正面的驱动电路单元13；位于所述柔性基底11正面、且与所述驱动电路单元13连接的有机发光元件14；覆盖所述有机发光元件14的薄膜封胶15；及覆盖所述薄膜封胶15的水氧阻隔层16。在本申请实施例中，所述水氧阻隔层包括覆盖所述薄膜封胶15的水氧阻隔胶160及覆盖所述水氧阻隔胶160的水氧阻隔膜161。
在本申请实施例中，所述支撑膜12通过如下方式与所述柔性基底11粘贴。
首先，如图3所示，提供原始支撑膜12’，所述原始支撑膜12’上具有分隔线120，所述分隔线120将所述原始支撑膜12’分为第一部分121和第二部分122。其中，所述第一部分121的正面具有粘性，所述第二部分122的正面无粘性。
接着，如图4所示，将所述原始支撑膜12’的正面粘贴于所述柔性基底11的背面。
在本申请实施例中，所述柔性基底11粘贴有原始支撑膜12’后，再将驱动芯片20邦定于所述邦定区，如图5所示。
最后，沿着所述分隔线120将所述原始支撑膜的第二部分122撕下，此 时，所述柔性基底11背面仅粘贴有所述原始支撑膜的第一部分121，可相应参考图1，也即仅有所述显示区粘贴有支撑膜12。
在本申请的其他实施例中，柔性显示器的制造过程中，也可以在将所述原始支撑膜12’粘贴于所述柔性基底11后即可，并不将所述第二部分122撕下。此时得到的柔性显示器中，所述显示区和所述邦定区均有支撑膜，其中，所述显示区的支撑膜为具有粘性的支撑膜(即第一部分)，所述邦定区的支撑膜为可撕除支撑膜(即第二部分)。在该柔性显示器中，邦定区的支撑膜既可以在后续使用中保留，也可以在后续使用中撕除，增加了灵活性。
【实施例二】
本实施例二与实施例一的差别在于，在实施例一中，所述邦定区没有支撑膜或者所述邦定区的支撑膜是可撕除的，可以根据使用需要而选择保留或者撕除；而在本实施例二中，所述显示区和所述邦定区均粘贴有支撑膜，其中，所述邦定区的支撑膜具有孔洞而所述显示区的支撑膜无孔洞，或者所述邦定区和所述显示区的支撑膜均具有孔洞，但是所述邦定区的支撑膜的孔洞率高于所述显示区的支撑膜的孔洞率。
以所述邦定区和所述显示区的支撑膜均具有孔洞为例。具体的，请参考图6，其为本申请实施例二中所使用的支撑膜的结构示意图。如图2所示，所述支撑膜32上具有分隔线320，所述分隔线320将所述支撑膜32分为第一部分321和第二部分322。其中，所述第一部分321和所述第二部分322的正面均具有粘性。
进一步的，所述第一部分321和所述第二部分322上均具有孔洞。更进一步的，所述第一部分321和所述第二部分322上均具有多个孔洞，所述第一部分321上的多个孔洞均匀分布于所述第一部分321上，所述第二部分322上的多个孔洞均匀分布于所述第二部分322上。其中，所述第一部分321上 的孔洞率小于所述第二部分322上的孔洞率。在此，孔洞率指孔洞面积与非孔洞面积之比。具体的，所述第二部分322上的孔洞324的面积更大，相邻孔洞324之间的间隔更小；而所述第一部分321上的孔洞323的面积较小，相邻孔洞323之间的间隔也较小。即，在本申请实施例中，所述第二部分322的柔韧性较所述第一部分321的柔韧性高。
接着，便可将所述支撑膜32粘贴至柔性基底背面，其中，第一部分321与显示区对应，第二部分322与邦定区对应。紧接着，即可将驱动芯片邦定于邦定区，从而便可得到柔性显示器。在本申请实施例中，不再将邦定区的支撑膜去除。即，所述邦定区粘贴有支撑膜，所述邦定区粘贴的支撑膜具有孔洞；所述显示区粘贴的支撑膜具有孔洞，并且所述显示区粘贴的支撑膜的孔洞率小于所述邦定区粘贴的支撑膜的孔洞率。也就是说，所述显示区粘贴的支撑膜的柔韧性小于所述邦定区粘贴的支撑膜的柔韧性。由此既能够使得柔性显示器在制造过程中，在进行驱动芯片邦定时不会导致柔性显示屏翘曲，以及使得真空吸盘容易吸附住柔性显示屏从而易于邦定，又能够使得邦定区具有极佳的弯曲性能，满足对于邦定区较高的弯曲要求。
上述描述仅是对本申请较佳实施例的描述，并非对本申请范围的任何限定，本申请领域的普通技术人员根据上述揭示内容做的任何变更、修饰，均属于权利要求书的保护范围。

Claims (10)

  1. 一种柔性显示器，其特征在于，所述柔性显示器包括：柔性显示屏和驱动芯片，其中，所述柔性显示屏包括柔性基底，所述柔性基底包括显示区和邦定区，所述柔性基底的背面粘贴有支撑膜，所述驱动芯片邦定于所述邦定区。
  2. 如权利要求1所述的柔性显示器，其特征在于，所述显示区和所述邦定区均有支撑膜，其中，所述显示区的支撑膜为具有粘性的支撑膜，所述邦定区的支撑膜为可撕除的支撑膜。
  3. 如权利要求1所述的柔性显示器，其特征在于，所述显示区粘贴有支撑膜，所述邦定区没有支撑膜。
  4. 如权利要求1所述的柔性显示器，其特征在于，所述显示区和所述邦定区均粘贴有支撑膜，其中，所述邦定区的支撑膜具有孔洞，所述显示区的支撑膜无孔洞。
  5. 如权利要求1所述的柔性显示器，其特征在于，所述显示区和所述邦定区均粘贴有支撑膜，其中，所述邦定区和所述显示区的支撑膜均具有孔洞，所述邦定区的支撑膜的孔洞率高于所述显示区的支撑膜的孔洞率。
  6. 如权利要求4或5所述的柔性显示器，其特征在于，所述邦定区的支撑膜的柔韧性高于所述显示区的支撑膜的柔韧性。
  7. 如权利要求1～5中任一项所述的柔性显示器，其特征在于，所述支撑膜的厚度为0.1μm～0.3μm。
  8. 如权利要求1～5中任一项所述的柔性显示器，其特征在于，所述支撑膜的材料与所述柔性基底的材料相同。
  9. 如权利要求1～5中任一项所述的柔性显示器，其特征在于，所述支撑 膜的材料为树脂。
  10. 如权利要求1～5中任一项所述的柔性显示器，其特征在于，所述柔性显示屏还包括位于所述柔性基底正面的驱动电路单元；位于所述柔性基底正面、且与所述驱动电路单元连接的有机发光元件；覆盖所述有机发光元件的薄膜封胶；及覆盖所述薄膜封胶的水氧阻隔层。
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US20190319202A1 (en) 2019-10-17
TWM564755U (zh) 2018-08-01
KR102265074B1 (ko) 2021-06-14
EP3537479A1 (en) 2019-09-11
EP3537479A4 (en) 2019-12-18
CN206322700U (zh) 2017-07-11
KR20190085097A (ko) 2019-07-17
US10608194B2 (en) 2020-03-31

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