WO2018113022A1 - 基于柔性oled的显示面板、无缝拼接显示装置及其制作方法 - Google Patents

基于柔性oled的显示面板、无缝拼接显示装置及其制作方法 Download PDF

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WO2018113022A1
WO2018113022A1 PCT/CN2016/113107 CN2016113107W WO2018113022A1 WO 2018113022 A1 WO2018113022 A1 WO 2018113022A1 CN 2016113107 W CN2016113107 W CN 2016113107W WO 2018113022 A1 WO2018113022 A1 WO 2018113022A1
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splicing
flexible substrate
display panel
flexible
seamless
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PCT/CN2016/113107
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English (en)
French (fr)
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林碧芬
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深圳市华星光电技术有限公司
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Priority to US15/502,555 priority Critical patent/US20180182840A1/en
Publication of WO2018113022A1 publication Critical patent/WO2018113022A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/18—Tiled displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/128—Active-matrix OLED [AMOLED] displays comprising two independent displays, e.g. for emitting information from two major sides of the display
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H10K2102/3023—Direction of light emission
    • H10K2102/3026—Top emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a display panel based on a flexible OLED, a seamless splicing display device, and a method for fabricating the same.
  • the former hard splicing technology mainly includes: DLP (Digital Light Procession) (splicing less than 0.5mm), CRT (Cathode Ray Tube) splicing, PDP (Plasma Display Panel) Plasma display panel) plasma splicing, LCD (liquid crystal display) liquid crystal splicing, but the above splicing screen has gaps, affecting the display effect; the latter seamless splicing technology uses projector + edge fuse + splicer The way to achieve a true seamless stitching effect, but expensive, huge equipment.
  • the present invention provides a display panel and a seamless splicing display device based on a flexible OLED (Organic Light-Emitting Diode), which has a good seamless splicing effect and low cost. method.
  • OLED Organic Light-Emitting Diode
  • a flexible OLED-based display panel includes a flexible substrate, an organic light-emitting layer and a thin film encapsulation layer sequentially disposed on the flexible substrate, and a first side thinning process of the flexible substrate forms a first splice portion, the flexibility
  • the second side thinning process of the substrate forms a second splice portion, the first splice portion surface is provided with a driving circuit and a control chip, and the organic light emitting layer extends to cover the second splice portion.
  • the flexible substrate is a high molecular polymer, a metal sheet or a glass.
  • the organic light-emitting layer is of a top emission type.
  • the thin film encapsulation layer is one or more of an acrylic resin, a transparent silicon nitride, and SiO 2 .
  • the other sides of the flexible substrate are also thinned to form a second splice.
  • Another object of the present invention is to provide a seamless splicing display device comprising a plurality of spliced flexible OLED-based display panels, wherein the second splicing portion of the display panel overlaps the first of the adjacent display panels The joint portion abuts the adjacent display panel; the first joint portion is curved away from the light exiting direction.
  • the second splice portion is adhered to the surface of the first splice portion.
  • Still another object of the present invention is to provide a method for fabricating the seamless splicing display device, comprising:
  • a top-emitting OLED device Forming a top-emitting OLED device, a display circuit and a driving circuit on the flexible substrate, and extending the display circuit to the second splicing portion, the driving circuit is formed at the first splicing portion;
  • the flexible substrate is fabricated on a glass substrate by coating a flexible substrate material on the glass substrate.
  • the first splicing portion and the second splicing portion are thinned on the flexible substrate by fabricating the organic luminescent layer on the flexible substrate, and the first splicing portion and the second splicing portion are respectively formed with the display circuit and the driving circuit, and adopt
  • the thin film encapsulation can achieve seamless splicing of two adjacent display panels by overlapping the second splicing portions of the two adjacent flexible substrates with the first splicing portion, and the manufacturing cost is low and the display effect is good.
  • FIG. 1 is a schematic diagram of a manufacturing process of a display panel according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a flexible substrate according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of a mating structure of a flexible substrate of two adjacent display panels according to an embodiment of the present invention.
  • the flexible OLED-based display panel of the embodiment of the present invention includes a flexible substrate 11, an organic light-emitting layer 12 and a thin film encapsulation layer 13 sequentially disposed on the flexible substrate 11, and the first side of the flexible substrate 11 is thinned.
  • the first splicing portion 111 is formed, and the second splicing portion 112 of the flexible substrate 11 is formed to form a second splicing portion 112.
  • the surface of the first splicing portion 111 is provided with a driving circuit and a control chip 113, and the organic luminescent layer 12 extends to cover the second splicing. Part 112.
  • the second splicing portion 112 and the first splicing portion 111 are formed on the left and right sides of the flexible substrate 11, and specifically, the display circuit is formed on the display region formed by the main portion of the flexible substrate 11 and the second splicing portion 112.
  • the first splicing portion 111 produces a drive circuit.
  • the organic light-emitting layer 12 is of a top emission type, and the structure is not affected by the bottom driving circuit of the device, so that the aperture ratio can be effectively improved, and the integration of the device and the bottom driving circuit is facilitated.
  • the flexible substrate 11 may be a high molecular polymer, a metal foil, or an ultra-thin glass.
  • the thin film encapsulation layer 13 is a transparent thin film material formed of one or more of an acrylic resin, a transparent silicon nitride compound, and SiO 2 .
  • the flexible substrate 11 structure of this embodiment can be used for seamless splicing of two adjacent display panels.
  • the other sides of the flexible substrate 11 can also be thinned to form the second splicing portion 112, and each display panel can be spliced with the adjacent four display panels to form a combined display device.
  • the plurality of spliced display panels constitute a seamless splicing display device.
  • the curved shape of the first splicing portion 111 is U-shaped, and the control chip is controlled.
  • 113 is located on the back surface of the flexible substrate 11 with the first splicing portion 111.
  • the second splicing portion 112 of one of the display panels is overlapped on the first splicing portion 111 of the adjacent display panel, and the end portion abuts on the adjacent display panel, and the display device is spliced.
  • the upper second splicing portion 112 can display the picture, a true seamless splicing is realized, and since the first splicing portion 111 and the second splicing portion 112 are both thinned, the combined display device is substantially unobtained. influences.
  • the manufacturing method of the seamless splicing display device of the present invention comprises:
  • the driving circuit is formed in the first splicing portion 111;
  • the two adjacent display panels are spliced so that the second splicing portion 112 of one display panel overlaps the bent first splicing portion 111 of the other display panel;
  • the flexible substrate 11 is preferably formed on the glass substrate 1 by coating a flexible substrate material on the glass substrate 1. In other embodiments, the flexible substrate 11 may also be formed on the glass substrate 1 by attaching.
  • the second joint portion 112 is fixed to the surface of the first joint portion 111 by means of sticking or screw fastening or the like.
  • the two flexible substrates 11 are connected to an external controller through the control chip 113, and the signal input by the controller controls the spliced display device to selectively implement single-screen partition display or large-screen splicing display.
  • the first splicing portion and the second splicing portion are thinned on the flexible substrate by fabricating the organic luminescent layer on the flexible substrate, and the first splicing portion and the second splicing portion are respectively formed with the display circuit and the driving circuit, and adopt
  • the thin film encapsulation can achieve seamless splicing of two adjacent display panels by overlapping the second splicing portions of the two adjacent flexible substrates with the first splicing portion, and the manufacturing cost is low and the display effect is good.

Abstract

一种基于柔性OLED的显示面板、一种无缝拼接显示装置及其制作方法，显示面板包括柔性基板（11）、依次设于柔性基板（11）上的有机发光层（12）和薄膜封装层（13），柔性基板（11）的第一侧减薄处理形成第一拼接部（111），柔性基板（11）的第二侧减薄处理形成第二拼接部（112），第一拼接部（111）表面设有驱动电路和控制芯片（113），有机发光层（12）延伸至覆盖第二拼接部（112）。无缝拼接显示装置的制作方法包括如下步骤：在柔性基板（11）上制作减薄的第一拼接部（111）和第二拼接部（112），在柔性基板（11）上制作有机发光层（12），第一拼接部（111）和第二拼接部（112）分别制作有驱动电路和显示电路，并采用薄膜封装，将相邻两个柔性基板（11）的第二拼接部（112）与第一拼接部（111）搭接配合。可以实现相邻两个显示面板的无缝拼接，制作成本低且显示效果好。

Description

基于柔性OLED的显示面板、无缝拼接显示装置及其制作方法 技术领域
本发明涉及显示技术领域，尤其涉及一种基于柔性OLED的显示面板、无缝拼接显示装置及其制作方法。
背景技术
显示屏拼接方式主要有两种，一种是传统的大屏幕显示墙硬拼接技术，另一种是采用边缘融合技术的投影机实现的无缝拼接技术。其中，前者的硬拼接技术主要有：DLP(Digital Light Procession，即数字光处理)拼接(拼缝小于0.5mm)、CRT(Cathode Ray Tube，即阴极射线显像管)拼接、PDP(Plasma Display Panel，即等离子显示板)等离子拼接、LCD(liquid crystal Display，即液晶显示器)液晶拼接，但是以上拼接屏都有缝隙，影响显示效果；后者的无缝拼接技术采用投影机+边缘融合器+拼接器的方式能实现真正的无缝拼接效果，但成本昂贵，机器设备庞大。
发明内容
鉴于现有技术存在的不足，本发明提供了一种无缝拼接效果好、成本低的基于柔性OLED(Organic Light-Emitting Diode，即有机发光二极管)的显示面板、无缝拼接显示装置及其制作方法。
为了实现上述的目的，本发明采用了如下的技术方案：
一种基于柔性OLED的显示面板，包括柔性基板、依次设于所述柔性基板上的有机发光层和薄膜封装层，所述柔性基板的第一侧减薄处理形成第一拼接部，所述柔性基板的第二侧减薄处理形成第二拼接部，所述第一拼接部表面设有驱动电路和控制芯片，所述有机发光层延伸至覆盖所述第二拼接部。
作为其中一种实施方式，所述柔性基板为高分子聚合物、金属片或玻璃。
作为其中一种实施方式，所述有机发光层为顶发射型。
作为其中一种实施方式，所述薄膜封装层为丙烯酸类树脂、透明的硅氮化 合物、SiO2的一种或多种。
作为其中一种实施方式，所述柔性基板的另外两侧也减薄形成第二拼接部。
本发明的另一目的在于提供一种无缝拼接显示装置，包括多个拼接的所述的基于柔性OLED的显示面板，其中显示面板的第二拼接部搭接在相邻的显示面板的第一拼接部上，且端部抵接相邻的显示面板；所述第一拼接部背向出光方向弯曲。
作为其中一种实施方式，所述第二拼接部粘贴在所述第一拼接部表面。
本发明的又一目的在于提供一种所述的无缝拼接显示装置的制作方法，包括：
提供一玻璃基板；
在玻璃基板上制作柔性基板并形成第一拼接部和第二拼接部；
在柔性基板上制作顶发射OLED器件、显示电路和驱动电路，并使显示电路延伸至第二拼接部，驱动电路形成在第一拼接部；
封装并在第一拼接部进行控制芯片绑定制程；
剥离玻璃基板；
拼接相邻的两个显示面板，使一个显示面板的第二拼接部搭接在另一个显示面板的弯折后的第一拼接部上；
固定相邻的两个显示面板。
作为其中一种实施方式，在玻璃基板上制作柔性基板的方式为：在玻璃基板上涂覆柔性基板材料。
本发明通过在柔性基板上制作有机发光层，在柔性基板上制作减薄的第一拼接部和第二拼接部，第一拼接部和第二拼接部分别制作有显示电路和驱动电路，并采用薄膜封装，通过将相邻两个柔性基板的第二拼接部与第一拼接部搭接配合可以实现相邻两个显示面板的无缝拼接，制作成本低且显示效果好。
附图说明
图1为本发明实施例的显示面板的制作过程示意图。
图2为本发明实施例的柔性基板的结构示意图。
图3为本发明实施例的相邻两块显示面板的柔性基板的配合结构示意图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
参阅图1和图2，本发明实施例的基于柔性OLED的显示面板包括柔性基板11、依次设于柔性基板11上的有机发光层12和薄膜封装层13，柔性基板11的第一侧减薄处理形成第一拼接部111，柔性基板11的第二侧减薄处理形成第二拼接部112，第一拼接部111表面设有驱动电路和控制芯片113，有机发光层12延伸至覆盖第二拼接部112。
本实施例中，第二拼接部112与第一拼接部111形成在柔性基板11相对的左右两侧，具体是在柔性基板11主体部和第二拼接部112形成的显示区制作显示电路，在第一拼接部111制作驱动电路。有机发光层12为顶发射型，此种结构不受器件底部驱动电路的影响从而能有效地提高开口率，有利于器件与底部驱动电路的集成。
柔性基板11可以是高分子聚合物、金属薄片或超薄玻璃等。薄膜封装层13为丙烯酸类树脂、透明的硅氮化合物、SiO2的一种或多种形成的透明薄膜材料。
本实施例的柔性基板11结构可用于相邻两个显示面板的无缝拼接。当然，柔性基板11的另外两侧也可以减薄形成第二拼接部112，每个显示面板可以与邻近的4个显示面板拼接形成组合的显示装置。
多个拼接的该显示面板即组成无缝拼接显示装置，结合图3所示，通过将所有的第一拼接部111背向出光方向弯曲，第一拼接部111的弯曲形状呈U型，控制芯片113随第一拼接部111位于柔性基板11背面。将其中一个显示面板的第二拼接部112搭接在相邻的显示面板的第一拼接部111上，且端部抵接相邻的显示面板上，显示装置即拼接完成。由于上方的第二拼接部112能够显示画面，因此实现了真正的无缝拼接，而且，由于第一拼接部111、第二拼接部112均减薄处理，组合后的显示装置显示效果基本不受影响。
本发明的无缝拼接显示装置的制作方法包括：
提供一玻璃基板1；
在玻璃基板1上制作柔性基板11并形成第一拼接部111和第二拼接部112；
在柔性基板11上制作顶发射OLED器件、显示电路和驱动电路，并使显示电路延伸至第二拼接部112，驱动电路形成在第一拼接部111；
封装并在第一拼接部111进行控制芯片绑定制程；
剥离玻璃基板1，形成单个显示面板，至此，显示面板制作过程即完成；
随后，拼接相邻的两个显示面板，使一个显示面板的第二拼接部112搭接在另一个显示面板的弯折后的第一拼接部111上；
最后，固定相邻的两个显示面板。
其中，在玻璃基板1上制作柔性基板11的方式最好是在玻璃基板1上涂覆柔性基板材料。在其他实施方式中，柔性基板11也可以采用贴附的方式形成在玻璃基板1上。第二拼接部112通过粘贴或螺钉紧固等方式固定在第一拼接部111表面。
两柔性基板11通过控制芯片113与外部的控制器连接，由控制器输入的信号控制拼接后的显示装置选择性地实现单屏分区显示或大屏拼接显示。
本发明通过在柔性基板上制作有机发光层，在柔性基板上制作减薄的第一拼接部和第二拼接部，第一拼接部和第二拼接部分别制作有显示电路和驱动电路，并采用薄膜封装，通过将相邻两个柔性基板的第二拼接部与第一拼接部搭接配合可以实现相邻两个显示面板的无缝拼接，制作成本低且显示效果好。
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (20)

  1. 一种基于柔性OLED的显示面板，其中，包括柔性基板、依次设于所述柔性基板上的有机发光层和薄膜封装层，所述柔性基板的第一侧减薄处理形成第一拼接部，所述柔性基板的第二侧减薄处理形成第二拼接部，所述第一拼接部表面设有驱动电路和控制芯片，所述有机发光层延伸至覆盖所述第二拼接部。
  2. 根据权利要求1所述的基于柔性OLED的显示面板，其中，所述柔性基板的另外两侧也减薄形成第二拼接部。
  3. 根据权利要求1所述的基于柔性OLED的显示面板，其中，所述柔性基板为高分子聚合物、金属片或玻璃。
  4. 根据权利要求3所述的基于柔性OLED的显示面板，其中，所述柔性基板的另外两侧也减薄形成第二拼接部。
  5. 根据权利要求1所述的基于柔性OLED的显示面板，其中，所述有机发光层为顶发射型。
  6. 根据权利要求5所述的基于柔性OLED的显示面板，其中，所述柔性基板的另外两侧也减薄形成第二拼接部。
  7. 根据权利要求1所述的基于柔性OLED的显示面板，其中，所述薄膜封装层为丙烯酸类树脂、透明的硅氮化合物、SiO2的一种或多种。
  8. 根据权利要求7所述的基于柔性OLED的显示面板，其中，所述柔性基板的另外两侧也减薄形成第二拼接部。
  9. 一种无缝拼接显示装置，其中，包括多个拼接的基于柔性OLED的显示面板，其中，基于柔性OLED的显示面板包括柔性基板、依次设于所述柔性基板上的有机发光层和薄膜封装层，所述柔性基板的第一侧减薄处理形成第一拼接部，所述柔性基板的第二侧减薄处理形成第二拼接部，所述第一拼接部表面设有驱动电路和控制芯片，所述有机发光层延伸至覆盖所述第二拼接部；显示面板的第二拼接部搭接在相邻的显示面板的第一拼接部上，且端部抵接相邻的显示面板；所述第一拼接部背向出光方向弯曲。
  10. 根据权利要求9所述的无缝拼接显示装置，其中，所述第二拼接部粘贴在所述第一拼接部表面。
  11. 根据权利要求9所述的无缝拼接显示装置，其中，所述柔性基板为高分子聚合物、金属片或玻璃。
  12. 根据权利要求9所述的无缝拼接显示装置，其中，所述有机发光层为顶发射型。
  13. 根据权利要求9所述的无缝拼接显示装置，其中，所述薄膜封装层为丙烯酸类树脂、透明的硅氮化合物、SiO2的一种或多种。
  14. 根据权利要求9所述的无缝拼接显示装置，其中，所述柔性基板的另外两侧也减薄形成第二拼接部。
  15. 一种无缝拼接显示装置的制作方法，其中，包括：
    提供一玻璃基板；
    在玻璃基板上制作柔性基板并形成第一拼接部和第二拼接部；
    在柔性基板上制作顶发射OLED器件、显示电路和驱动电路，并使显示电路延伸至第二拼接部，驱动电路形成在第一拼接部；
    封装并在第一拼接部进行控制芯片绑定制程；
    剥离玻璃基板；
    拼接相邻的两个显示面板，使一个显示面板的第二拼接部搭接在另一个显示面板的弯折后的第一拼接部上；
    固定相邻的两个显示面板。
  16. 根据权利要求15所述的无缝拼接显示装置的制作方法，其中，在玻璃基板上制作柔性基板的方式为：在玻璃基板上涂覆柔性基板材料。
  17. 根据权利要求15所述的无缝拼接显示装置的制作方法，其中，所述第二拼接部粘贴在所述第一拼接部表面。
  18. 根据权利要求15所述的无缝拼接显示装置的制作方法，其中，所述柔性基板为高分子聚合物、金属片或玻璃。
  19. 根据权利要求15所述的无缝拼接显示装置的制作方法，其中，所述薄膜封装层为丙烯酸类树脂、透明的硅氮化合物、SiO2的一种或多种。
  20. 根据权利要求15所述的无缝拼接显示装置的制作方法，其中，所述柔 性基板的另外两侧也减薄形成第二拼接部。
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