WO2021017198A1 - 柔性发光面板、柔性发光面板的制备方法及显示设备 - Google Patents

柔性发光面板、柔性发光面板的制备方法及显示设备 Download PDF

Info

Publication number
WO2021017198A1
WO2021017198A1 PCT/CN2019/112432 CN2019112432W WO2021017198A1 WO 2021017198 A1 WO2021017198 A1 WO 2021017198A1 CN 2019112432 W CN2019112432 W CN 2019112432W WO 2021017198 A1 WO2021017198 A1 WO 2021017198A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
flexible
sub
adhesive layer
emitting panel
Prior art date
Application number
PCT/CN2019/112432
Other languages
English (en)
French (fr)
Inventor
王芳
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/625,762 priority Critical patent/US11322716B2/en
Publication of WO2021017198A1 publication Critical patent/WO2021017198A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/868—Arrangements for polarized light emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Definitions

  • This application relates to the field of display technology, and in particular to a flexible light-emitting panel, a method for preparing the flexible light-emitting panel, and a display device.
  • the embodiments of the present application provide a flexible light-emitting panel, a method for preparing a flexible light-emitting panel, and a display device, which can avoid interlayer peeling between multiple functional layers of the flexible light-emitting panel and improve the product yield.
  • an embodiment of the present application provides a flexible light-emitting panel, including:
  • An adhesive layer includes a first sub-adhesive layer disposed on the back plate and a plurality of second sub-adhesive layers protruding from the first sub-adhesive layer in a direction away from the back plate;
  • a flexible layer the flexible layer is disposed on the first sub-adhesive layer, and the flexible layer includes a plurality of sub-flexible layers arranged at intervals, the second sub-adhesive layer is located in the interval, and the second The sub-glue layer corresponds to the interval one to one;
  • An array substrate, a light emitting device and an encapsulation layer are sequentially stacked on each of the sub-flexible layers;
  • a cover plate, the cover plate is arranged on the encapsulation layer and the second sub-adhesive layer.
  • the flexible light-emitting panel includes at least one bending area, and at least one sub-flexible layer of the plurality of sub-flexible layers is located in the bending area.
  • the width of the second sub-adhesive layer is the same as the width of the interval.
  • the thickness of the adhesive layer is the same as the distance from the back plate to the cover plate.
  • the width of the second sub-adhesive layer is 1 to 3 microns.
  • a polarizer and a touch panel are further provided between the encapsulation layer and the cover plate, the polarizer is provided on the encapsulation layer, and the touch panel Set on the polarizer.
  • an embodiment of the present application also provides a method for manufacturing a flexible light-emitting panel, including:
  • a backplane is attached to the second surface of the adhesive layer away from the packaging layer.
  • the peeling off the substrate includes:
  • the substrate is irradiated with a laser under vacuum to peel off the substrate from the flexible layer.
  • the adhesive glue is dripped and cured to the flexible layer away from the first surface of the encapsulation layer and the space between the adjacent flexible layers.
  • Glue layer including:
  • Drip adhesive glue to the flexible layer away from the first surface of the encapsulation layer and the space between adjacent flexible layers;
  • the adhesive glue is cured by ultraviolet to form the glue layer.
  • an embodiment of the present application further provides a display device, including: a flexible light-emitting panel and a housing, the flexible light-emitting panel is disposed on the housing, and the flexible light-emitting panel includes:
  • An adhesive layer includes a first sub-adhesive layer disposed on the back plate and a plurality of second sub-adhesive layers protruding from the first sub-adhesive layer in a direction away from the back plate;
  • a flexible layer the flexible layer is disposed on the first sub-adhesive layer, and the flexible layer includes a plurality of sub-flexible layers arranged at intervals, the second sub-adhesive layer is located in the interval, and the second The sub-glue layer corresponds to the interval one to one;
  • An array substrate, a light emitting device and an encapsulation layer are sequentially stacked on each of the sub-flexible layers;
  • the cover plate is arranged on the encapsulation layer and the second sub-adhesive layer, wherein the flexible light-emitting panel includes at least one bending area, and at least one sub-flexible layer of the plurality of sub-flexible layers is located In the bending area, a polarizer and a touch panel are further provided between the packaging layer and the cover plate, the polarizer is provided on the packaging layer, and the touch panel is provided on the polarizer.
  • the width of the second sub-adhesive layer is the same as the width of the interval.
  • the thickness of the adhesive layer is the same as the distance from the back plate to the cover plate.
  • the width of the second sub-adhesive layer is 1 to 3 microns.
  • the flexible light-emitting panel includes: a back plate; an adhesive layer, the adhesive layer includes a first sub-adhesive layer disposed on the back plate and a direction away from the back from the first sub-adhesive layer A plurality of second sub-adhesive layers protruding in the direction of the board; a flexible layer, the flexible layer is arranged on the first sub-adhesive layer, and the flexible layer includes a plurality of sub-flexible layers arranged at intervals, the second The sub-adhesive layer is located in the interval, and the second sub-adhesive layer corresponds to the interval one-to-one; an array substrate, a light emitting device, and an encapsulation layer are sequentially stacked on each of the sub-flexible layers; a cover plate, The cover plate is arranged on the packaging layer and the second sub-adhesive layer.
  • the present application can avoid interlayer peeling between the multiple functional layers of the flexible light-emit
  • FIG. 1 is a schematic structural diagram of a display device provided by an embodiment of the application.
  • FIG. 2 is a schematic flow chart of a method for manufacturing a flexible light-emitting panel provided by an embodiment of the application
  • FIG. 3 is a diagram of the first intermediate product when preparing a flexible light-emitting panel provided by an embodiment of the application.
  • FIG. 4 is a diagram of a second intermediate product when preparing a flexible light-emitting panel provided by an embodiment of the application.
  • FIG. 5 is a diagram of the third intermediate product when preparing a flexible light-emitting panel provided by an embodiment of the application.
  • FIG. 6 is a schematic diagram of the first structure of a flexible light emitting panel provided by an embodiment of the application.
  • FIG. 7 is a schematic diagram of a second structure of a flexible light emitting panel provided by an embodiment of the application.
  • the light emitting device in order to satisfy the bending characteristics of the flexible display device, the light emitting device needs to be prepared on the flexible substrate. Therefore, in the manufacturing process, PI is first coated on the glass substrate, and then the subsequent array and electroluminescence (EL) manufacturing processes are performed to complete the preparation and packaging of the flexible display device.
  • EL electroluminescence
  • the design of an external mechanism equipped with a flexible light-emitting panel usually includes a hinge to complete the bending of the entire display device. In an in-folding mobile device, the inner panel of the case will sink as the case is closed and the hinge moves, so as to reduce the stress between the panel and the mechanism and prevent the peeling of the adhesive. ).
  • each film layer of the Panel still appears to be squeezed and pulled to different degrees during the outward folding process.
  • the interlayer peeling caused by pulling or stress cannot be released during the bending of the laminate, causing the entire Panel to fail.
  • An embodiment of the present application provides a display device, including: a flexible light-emitting panel and a housing, the flexible light-emitting panel is disposed on the housing, and the flexible light-emitting panel includes:
  • An adhesive layer includes a first sub-adhesive layer disposed on the back plate and a plurality of second sub-adhesive layers protruding from the first sub-adhesive layer in a direction away from the back plate;
  • a flexible layer the flexible layer is disposed on the first sub-adhesive layer, and the flexible layer includes a plurality of sub-flexible layers arranged at intervals, the second sub-adhesive layer is located in the interval, and the second The sub-glue layer corresponds to the interval one to one;
  • An array substrate, a light emitting device and an encapsulation layer are sequentially stacked on each of the sub-flexible layers;
  • the cover plate is arranged on the encapsulation layer and the second sub-adhesive layer, wherein the flexible light-emitting panel includes at least one bending area, and at least one sub-flexible layer of the plurality of sub-flexible layers is located In the bending area, a polarizer and a touch panel are further provided between the packaging layer and the cover plate, the polarizer is provided on the packaging layer, and the touch panel is provided on the polarizer.
  • the width of the second sub-adhesive layer is the same as the width of the interval.
  • the thickness of the adhesive layer is the same as the distance from the back plate to the cover plate.
  • the width of the second sub-adhesive layer is 1 to 3 microns.
  • FIG. 1 is a schematic structural diagram of a display device 1000 according to an embodiment of the application.
  • the display device 100 may include a flexible light emitting panel 100, a control circuit 200, and a housing 300. It should be noted that the display device 1000 shown in FIG. 1 is not limited to the above content, and may also include other devices, such as a camera, an antenna structure, a pattern unlocking module, and the like.
  • the flexible light emitting panel 100 is disposed on the housing 200.
  • the housing may include a mounting mechanism and a hinge structure of the flexible light-emitting panel 100 (not shown in the figure).
  • the flexible light-emitting panel 100 may be fixed to the housing 300, and the flexible light-emitting panel 100 and the housing 300 form a closed space to accommodate the control circuit 200 and other devices.
  • the housing 300 may be made of a flexible material, such as a plastic housing or a silicone housing.
  • control circuit 200 is installed in the housing 300, the control circuit 200 may be the main board of the display device 1000, and the control circuit 200 may be integrated with a battery, an antenna structure, a microphone, a speaker, a headphone interface, a universal serial bus interface, One, two or more of functional components such as camera, distance sensor, ambient light sensor, receiver, and processor.
  • the flexible light-emitting panel 100 is installed in the housing 300, and at the same time, the flexible light-emitting panel 100 is electrically connected to the control circuit 200 to form the display surface of the display device 1000.
  • the flexible light emitting panel 100 may include a display area and a non-display area.
  • the display area can be used to display the screen of the display device 1000 or for the user to perform touch manipulation.
  • This non-display area can be used to set various functional components.
  • FIG. 2 is a schematic flowchart of a method for manufacturing a flexible light-emitting panel provided by an embodiment of the application, including:
  • the substrate 10 is usually a glass substrate.
  • FIG. 3 is a diagram of the first intermediate product when the flexible light-emitting panel 100 is prepared according to an embodiment of the application.
  • the flexible layer 20 on the substrate 10 will also be bent along the bending direction. If the bending stress cannot be fully released, the flexible layer 20 may break or peel off from the functional layer thereon. Therefore, in the present application, the flexible layer 20 is coated on the substrate 10 in sections, so that the flexible layer 20 can be separated by the interval between two adjacent sub-flexible layers 201 during bending to form a segmented flexible layer 20 .
  • FIG. 4 is a diagram of the second intermediate product when the flexible light-emitting panel 100 is prepared according to an embodiment of the application.
  • a certain interval is also reserved between the functional layers.
  • the interval corresponds to the interval between the adjacent sub-flexible layers 201, so that when the flexible light-emitting panel 100 is bent, the functional layer can also be separated by the interval to form a segmented functional layer, and the stress generated by the bending passes Release at the interval.
  • the light emitting device 40 may include a TFT, a pixel defining layer, and an anode, a hole transport layer, a light emitting layer, an electron transport layer, and a cathode (none of which are shown in the figure) which are sequentially formed on the area defined by the pixel defining layer. .
  • a TFT time division multiplexing
  • a pixel defining layer an anode
  • a hole transport layer a light emitting layer
  • an electron transport layer an electron transport layer
  • a cathode one of which are shown in the figure
  • white W which is not limited here.
  • the light-emitting device 40 is not limited to an OLED, but may also be an LCD or the like.
  • FIG. 5 is a diagram of the third intermediate product when the flexible light-emitting panel 100 is prepared according to an embodiment of the application.
  • the step of peeling off the substrate 10 may be performed by laser lift off (LLO) to peel off the substrate 10, therefore, this step may specifically include: irradiating the substrate 10 with a laser under vacuum to make the substrate 10 and the flexible layer 20 peeled off.
  • LLO laser lift off
  • the cured adhesive can be cured by ultraviolet light (UV). Therefore, to the flexible layer 20 away from the first surface 202 of the encapsulation layer 50 and the space between the adjacent flexible layer 201 is dripped with adhesive glue and cured to form the glue layer 70, including:
  • the adhesive glue is cured by ultraviolet to form the glue layer 70.
  • the purpose of forming the adhesive layer 70 at the interval between the first surface 202 and the adjacent flexible layer 201 is to facilitate the stress release of the functional layer and avoid the functional layer from sinking when the flexible light-emitting panel 100 is bent.
  • the adhesive is dropped, in order to prevent the adhesive from flowing out from the lower side along the interval, the flexible light-emitting panel of FIG. 4 needs to be turned upside down, and then the dropping process is performed.
  • FIG. 6 is a schematic diagram of the first structure of the flexible light emitting panel 100 provided by an embodiment of the application.
  • a backplane 80 is attached to the second surface 701 of the adhesive layer away from the encapsulation layer 50 to form a complete flexible light-emitting panel 100.
  • the flexible light emitting panel 100 includes:
  • the adhesive layer 70 includes a first sub-adhesive layer 702 disposed on the back plate 80 and a plurality of second sub-adhesive layers 702 projecting away from the back plate 80 from the first sub-adhesive layer 702 Sub glue layer 703;
  • the flexible layer 20 is disposed on the first sub-adhesive layer 702, and the flexible layer 20 includes a plurality of sub-flexible layers 201 arranged at intervals, and the second sub-adhesive layer 703 is located in the interval. , And the second sub-adhesive layer 703 corresponds to the interval one to one;
  • An array substrate 30, a light emitting device 40, and an encapsulation layer 50 are sequentially stacked on each of the sub-flexible layers 201;
  • a cover plate 60 is provided on the packaging layer 50 and the second sub-adhesive layer 703.
  • a polarizer and a touch panel may be provided between the packaging layer 50 and the cover plate 60, the polarizer is provided on the packaging layer, and the touch panel is provided on the polarizer.
  • a polarizer needs to be attached to the encapsulation layer 50.
  • the imaging of the liquid crystal display must rely on polarized light, and the polarizer is used to dissipate surface reflection and reverse the polarization of the polarized light.
  • the direction of propagation so as to achieve functions such as enhancing brightness and reducing color saturation.
  • Polarizers generally used in LCDs generally include liquid crystal glass and polarizers attached to two opposite surfaces of the liquid crystal glass. Therefore, the thickness of the polarizer is usually 1 mm.
  • the light-emitting device 40 is an OLED
  • a circular polarizer is also needed to weaken the cathode or other metals. Reflection.
  • the touch panel gives the flexible light-emitting panel 100 touch functions.
  • the width of the second sub-adhesive layer 703 arranged in the interval is the same as the width of the interval, and the width of the second sub-adhesive layer is 1 ⁇ 3 microns ;
  • the thickness of the adhesive layer 70 is the same as the distance from the back plate 80 to the cover plate 60.
  • the flexible light emitting panel 100 includes at least one bending area AA, and at least one sub-flexible layer 201 of the plurality of sub-flexible layers 201 is located in the bending area.
  • FIG. 7 is a schematic diagram of the second structure of the flexible light emitting panel 100 provided by an embodiment of the application.
  • the bending area AA is located in the middle of the flexible light-emitting panel 100, based on the central axis of the flexible light-emitting panel 100.
  • the bending area AA is from the central axis to the negative direction of the X axis. Cm and the area formed by 2 cm from the central axis to the positive X-axis.
  • the flexible light-emitting panel 100 may also have multiple bending areas AA, that is, the fixed bending area is not limited, and it can be bent at any position, which will not be repeated here.
  • the flexible light-emitting panel includes: a back plate; an adhesive layer, the adhesive layer includes a first sub-adhesive layer disposed on the back plate and a direction away from the back from the first sub-adhesive layer A plurality of second sub-adhesive layers protruding in the direction of the board; a flexible layer, the flexible layer is arranged on the first sub-adhesive layer, and the flexible layer includes a plurality of sub-flexible layers arranged at intervals, the second The sub-adhesive layer is located in the interval, and the second sub-adhesive layer corresponds to the interval one-to-one; an array substrate, a light emitting device, and an encapsulation layer are sequentially stacked on each of the sub-flexible layers; a cover plate, The cover plate is arranged on the packaging layer and the second sub-adhesive layer.
  • the present application can avoid interlayer peeling between the multiple functional layers of the flexible light-emit

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

柔性发光面板及其制备方法及显示设备，柔性发光面板包括：背板；胶层包括设置在背板上的第一子胶层及自第一子胶层向远离背板方向凸起的多个第二子胶层；柔性层设置在第一子胶层上，且柔性层包括多个间隔设置的子柔性层，第二子胶层位于间隔；在每一子柔性层上依次层叠设置有阵列基板、发光器件及封装层；盖板，盖设在封装层及第二子胶层上。

Description

柔性发光面板、柔性发光面板的制备方法及显示设备 技术领域
本申请涉及显示技术领域，具体涉及一种柔性发光面板、柔性发光面板的制备方法及显示设备。
 背景技术
近年来，随着显示技术的发展，显示设备例如手机、平板电脑等以其便携被用户所接受，而可弯折显示器相较于一般显示器具有可弯折、扭曲或卷起的优点，使得高分辨率、大尺寸的显示需求与设备的便携性不再成为矛盾。
目前，柔性发光面板由于需要保持其弯折特征，需要将发光器件、薄膜封装层（Thin-Film Encapsulation，TFE）等多个功能层制备于柔性基板上，而在弯折柔性发光面板时，由于弯折应力无法充分释放，因此会致使多个功能层之间产生层间剥离。
 技术问题
本申请实施例提供一种柔性发光面板、柔性发光面板的制备方法及显示设备，可以避免制备柔性发光面板的多个功能层之间产生层间剥离，提高产品良率。
 技术解决方案
第一方面，本申请实施例提供一种柔性发光面板，包括：
背板；
胶层，所述胶层包括设置在所述背板上的第一子胶层及自所述第一子胶层向远离所述背板方向凸起的多个第二子胶层；
柔性层，所述柔性层设置在所述第一子胶层上，且所述柔性层包括多个间隔设置的子柔性层，所述第二子胶层位于所述间隔，且所述第二子胶层与所述间隔一一对应；
在每一所述子柔性层上依次层叠设置有阵列基板、发光器件及封装层；
盖板，所述盖板盖设在所述封装层及所述第二子胶层上。
在本申请所述的柔性发光面板中，所述柔性发光面板包括至少一弯折区，所述多个子柔性层中至少一子柔性层位于所述弯折区。
在本申请所述的柔性发光面板中，所述第二子胶层的宽度与所述间隔的宽度相同。
在本申请所述的柔性发光面板中，所述胶层的厚度与所述背板至所述盖板的距离相同。
在本申请所述的柔性发光面板中，所述第二子胶层的宽度为1~3微米。
在本申请所述的柔性发光面板中，在所述封装层与所述盖板之间还设置有偏光片、触控板，所述偏光片设置在所述封装层上，所述触控板设置在所述偏光片上。
第二方面，本申请实施例还提供一种柔性发光面板的制备方法，包括：
提供一基板；
在所述基板上间隔涂布多个子柔性层，以在所述基板上形成柔性层；
在所述多个子柔性层中每一子柔性层上依次制备阵列基板、发光器件及封装层，并在所述封装层上盖设一盖板；
剥离所述基板，并向所述柔性层远离所述封装层的第一表面及相邻所述柔性层之间的间隔处滴加粘接胶，固化所述粘接胶形成胶层；
在所述胶层远离所述封装层的第二表面上贴附一背板。
在本申请所述的柔性发光面板的制备方法中，所述剥离所述基板，包括：
在真空下通过激光照射所述基板，以使所述基板与所述柔性层剥离。
在本申请所述的柔性发光面板的制备方法中，所述向所述柔性层远离所述封装层的第一表面及相邻所述柔性层之间的间隔处滴加粘接胶并固化形成胶层，包括：
向所述柔性层远离所述封装层的第一表面及相邻所述柔性层之间的间隔处滴加粘接胶；
紫外固化所述粘接胶，形成所述胶层。
第三方面，本申请实施例还提供一种显示设备，包括：柔性发光面板及壳体，所述柔性发光面板设置在所述壳体上，所述柔性发光面板包括：
背板；
胶层，所述胶层包括设置在所述背板上的第一子胶层及自所述第一子胶层向远离所述背板方向凸起的多个第二子胶层；
柔性层，所述柔性层设置在所述第一子胶层上，且所述柔性层包括多个间隔设置的子柔性层，所述第二子胶层位于所述间隔，且所述第二子胶层与所述间隔一一对应；
在每一所述子柔性层上依次层叠设置有阵列基板、发光器件及封装层；
盖板，所述盖板盖设在所述封装层及所述第二子胶层上，其中所述柔性发光面板包括至少一弯折区，所述多个子柔性层中至少一子柔性层位于所述弯折区，在所述封装层与所述盖板之间还设置有偏光片、触控板，所述偏光片设置在所述封装层上，所述触控板设置在所述偏光片上。
在本申请所述的显示设备中，所述第二子胶层的宽度与所述间隔的宽度相同。
在本申请所述的显示设备中，所述胶层的厚度与所述背板至所述盖板的距离相同。
在本申请所述的显示设备中，所述第二子胶层的宽度为1~3微米。
 有益效果
本申请实施例提供的柔性发光面板，包括：背板；胶层，所述胶层包括设置在所述背板上的第一子胶层及自所述第一子胶层向远离所述背板方向凸起的多个第二子胶层；柔性层，所述柔性层设置在所述第一子胶层上，且所述柔性层包括多个间隔设置的子柔性层，所述第二子胶层位于所述间隔，且所述第二子胶层与所述间隔一一对应；在每一所述子柔性层上依次层叠设置有阵列基板、发光器件及封装层；盖板，所述盖板盖设在所述封装层及所述第二子胶层上。本申请可以避免制备柔性发光面板的多个功能层之间产生层间剥离，提高产品良率。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的显示设备的结构示意图。
图2为本申请实施例提供的柔性发光面板的制备方法的流程示意图
图3为本申请实施例提供的制备柔性发光面板时的第一中间产物图。
图4为本申请实施例提供的制备柔性发光面板时的第二中间产物图。
图5为本申请实施例提供的制备柔性发光面板时的第三中间产物图。
图6为本申请实施例提供的柔性发光面板的第一种结构示意图。
图7为本申请实施例提供的柔性发光面板的第二种结构示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
相关技术中，柔性显示器件为满足弯折特性，需要将发光器件制备于柔性基板上。因此，制程上会先将PI涂布于玻璃基板上，再进行后续阵列段（Array）及电致发光段（EL）制程，完成柔性显示器件的制备及封装。但是，搭载柔性发光面板的外部机构设计中通常包含铰链，以完成整个显示器件的弯折。在折叠（in-folding）移动设备中，机壳内部面板（panel）会随着机壳的关闭，铰链的运动而出现屏幕下陷，从而减缓panel与机构间的应力，防止粘结处剥离（peeling）。但是，即使采用这类设计，Panel在外折过程中各个膜层仍出现不同程度的挤压和拉扯。而对于包含无机层的TFE、EL及Array部分，在叠层弯折中会受到拉扯或应力释放不了而导致的膜层间peeling，造成整个Panel失效。
本申请实施例提供一种显示设备，包括：柔性发光面板及壳体，所述柔性发光面板设置在所述壳体上，所述柔性发光面板包括：
背板；
胶层，所述胶层包括设置在所述背板上的第一子胶层及自所述第一子胶层向远离所述背板方向凸起的多个第二子胶层；
柔性层，所述柔性层设置在所述第一子胶层上，且所述柔性层包括多个间隔设置的子柔性层，所述第二子胶层位于所述间隔，且所述第二子胶层与所述间隔一一对应；
在每一所述子柔性层上依次层叠设置有阵列基板、发光器件及封装层；
盖板，所述盖板盖设在所述封装层及所述第二子胶层上，其中所述柔性发光面板包括至少一弯折区，所述多个子柔性层中至少一子柔性层位于所述弯折区，在所述封装层与所述盖板之间还设置有偏光片、触控板，所述偏光片设置在所述封装层上，所述触控板设置在所述偏光片上。
其中，所述第二子胶层的宽度与所述间隔的宽度相同。
其中，所述胶层的厚度与所述背板至所述盖板的距离相同。
其中，所述第二子胶层的宽度为1~3微米。
请参阅图1，图1为本申请实施例提供的显示设备1000的结构示意图。该显示设备100可以包括柔性发光面板100、控制电路200、以及壳体300。需要说明的是，图1所示的显示设备1000并不限于以上内容，其还可以包括其他器件，比如还可以包括摄像头、天线结构、纹解锁模块等。
其中，柔性发光面板100设置于壳体200上。壳体上可以包括有柔性发光面板100的搭载机构及铰链结构等（图中未示出）。
在一些实施例中，柔性发光面板100可以固定到壳体300上，柔性发光面板100和壳体300形成密闭空间，以容纳控制电路200等器件。
在一些实施例中，壳体300可以为由柔性材料制成，比如为塑胶壳体或者硅胶壳体等。
其中，该控制电路200安装在壳体300中，该控制电路200可以为显示设备1000的主板，控制电路200上可以集成有电池、天线结构、麦克风、扬声器、耳机接口、通用串行总线接口、摄像头、距离传感器、环境光传感器、受话器以及处理器等功能组件中的一个、两个或多个。
其中，该柔性发光面板100安装在壳体300中，同时，该柔性发光面板100电连接至控制电路200上，以形成显示设备1000的显示面。该柔性发光面板100可以包括显示区域和非显示区域。该显示区域可以用来显示显示设备1000的画面或者供用户进行触摸操控等。该非显示区域可用于设置各种功能组件。
请参阅图2，图2为本申请实施例提供的柔性发光面板的制备方法的流程示意图，包括：
110、提供一基板10。
具体的，基板10通常为玻璃材质的基板。
120、在基板10上间隔涂布多个子柔性层201，以在基板10上形成柔性层20。
具体的，请参阅图3，图3为本申请实施例提供的制备柔性发光面板100时的第一中间产物图。
由于在弯折柔性发光面板100时，在基板10上的柔性层20也会随弯折方向进行弯折，如果弯折应力无法充分释放，可能造成柔性层20断裂或与其上的功能层剥离，因此本申请将柔性层20分段式涂布在基板10上，这样在弯折时可通过相邻两子柔性层201之间的间隔将柔性层20隔开，形成分段式的柔性层20。
130、在多个子柔性层201中每一子柔性层201上依次制备阵列基板30、发光器件40及封装层50，并在所述封装层50上盖设一盖板60。
具体的，请参阅图4，图4为本申请实施例提供的制备柔性发光面板100时的第二中间产物图。为了避免柔性层20上的功能层例如：阵列基板30、发光器件40及封装层50在弯折时产生裂纹、断裂或层间剥离，因此也在功能层之间预留有一定的间隔，该间隔与相邻子柔性层201之间的间隔相对应，这样在弯折柔性发光面板100时功能层也可通过间隔将功能层隔开，形成分段式的功能层，弯折产生的应力通过间隔处释放。
发光器件40可以包括TFT、像素界定层，以及在被像素界定层所限定出的区域上依次形成的阳极、空穴传输层、发光层、电子传输层以及阴极（图中均未示出）等。当电力供应至适当电压时，正极空穴与阴极电荷就会在发光层中结合，产生光亮，从而产生红、绿和蓝 RGB 三原色。但不仅限于RGB三种颜色，还可以包括白色W，这里不做限定。当然，发光器件40不仅限于OLED，也可以是LCD等。
140、剥离基板10、并向柔性层20远离封装层50的第一表面202及相邻子柔性层201之间的间隔处滴加粘接胶，固化粘接胶形成胶层70。
具体的，请参阅图5，图5为本申请实施例提供的制备柔性发光面板100时的第三中间产物图。
其中，剥离基板10的步骤可以通过激光剥离（LLO）对基板10进行剥离，因此，此步骤具体可包括：在真空下通过激光照射所述基板10，以使所述基板10与所述柔性层20剥离。
固化粘接胶可通过紫外光固化（UV）固化粘接胶。因此，向所述柔性层20远离所述封装层50的第一表面202及相邻所述柔性层201之间的间隔处滴加粘接胶并固化形成胶层70，包括：
向所述柔性层20远离所述封装50层的第一表面202及相邻所述柔性层201之间的间隔处滴加粘接胶；
紫外固化所述粘接胶，形成所述胶层70。
在第一表面202及相邻柔性层201之间的间隔处形成胶层70的目的在于：在弯折柔性发光面板100时利于功能层的应力释放及避免功能层的下陷。在滴加粘接胶时，为了避免粘接胶顺着间隔从下侧流出，需将图4的柔性发光面板倒置，再进行滴加工艺。
150、在胶层70远离封装层50的第二表面701上贴附一背板80。
具体的，请参阅图6，图6为本申请实施例提供的柔性发光面板100的第一种结构示意图。在形成胶层70之后再在胶层远离封装层50的第二表面701上贴附一背板80，形成完整的柔性发光面板100。
因此，柔性发光面板100包括：
背板80；
胶层70，所述胶层70包括设置在所述背板80上的第一子胶层702及自所述第一子胶层702向远离所述背板80方向凸起的多个第二子胶层703；
柔性层20，所述柔性层20设置在所述第一子胶层702上，且所述柔性层20包括多个间隔设置的子柔性层201，所述第二子胶层703位于所述间隔，且所述第二子胶层703与所述间隔一一对应；
在每一所述子柔性层201上依次层叠设置有阵列基板30、发光器件40及封装层50；
盖板60，所述盖板60盖设在所述封装层50及所述第二子胶层703上。
在一些实施例中，在封装层50与所述盖板60之间还可以设置有偏光片、触控板，偏光片设置在所述封装层上，触控板设置在所述偏光片上。其中，若发光器件40为液晶盒（Liquid Crystal Display，LCD）则需在封装层50上贴附偏光片，液晶显示成像必须依靠偏振光，而偏光片用于消散表面反光，并且扭转偏振光的传播方向，从而实现增强亮度、减弱色彩饱和度等功能。一般用于LCD的偏光片一般包括液晶玻璃，以及贴合在液晶玻璃相对的两个表面上的偏光片，因此通常偏光片的厚度为1mm。
可以理解，当发光器件40为OLED时，为了避免外界光照射到柔性发光面板100上会被阴极等金属反射回来，影响对比度等问题，一般也需要圆形的偏光片，以减弱阴极或其他金属的反射。触控板即赋予柔性发光面板100触控功能。
为了保持相邻功能层及相邻子柔性层201之间的连续性，因此设置在间隔的第二子胶层703的宽度与间隔的宽度相同，第二子胶层的宽度为1~3微米；同理，避免背板80与盖板60从功能层及柔性层20上剥落，因此胶层70的厚度与所述背板80至所述盖板60的距离相同。
在一些实施例中，柔性发光面板100包括至少一弯折区AA，多个子柔性层201中至少一子柔性层201位于所述弯折区。
具体的，如图7所示，图7为本申请实施例提供的柔性发光面板100的第二种结构示意图。一般柔性发光面板100只存在一个弯折区AA，弯折区AA位于柔性发光面板100的中间位置，以柔性发光面板100的中轴线为准，弯折区AA为从中轴线向X轴负方向2厘米及从中轴线向X轴正方向2厘米所形成的区域。在弯折区AA内至少存在有一子柔性层201，以使在弯折区AA处也可发光。
此外，柔性发光面板100也可存在有多个弯折区AA，即不限定固定弯折区，任意位置皆可弯折，此处不做赘述。
本申请实施例提供的柔性发光面板，包括：背板；胶层，所述胶层包括设置在所述背板上的第一子胶层及自所述第一子胶层向远离所述背板方向凸起的多个第二子胶层；柔性层，所述柔性层设置在所述第一子胶层上，且所述柔性层包括多个间隔设置的子柔性层，所述第二子胶层位于所述间隔，且所述第二子胶层与所述间隔一一对应；在每一所述子柔性层上依次层叠设置有阵列基板、发光器件及封装层；盖板，所述盖板盖设在所述封装层及所述第二子胶层上。本申请可以避免制备柔性发光面板的多个功能层之间产生层间剥离，提高产品良率。
以上对本申请实施例所提供的一种柔性发光面板、柔性发光面板的制备方法及显示设备进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (13)

  1. 一种柔性发光面板，其包括：
    背板；
    胶层，所述胶层包括设置在所述背板上的第一子胶层及自所述第一子胶层向远离所述背板方向凸起的多个第二子胶层；
    柔性层，所述柔性层设置在所述第一子胶层上，且所述柔性层包括多个间隔设置的子柔性层，所述第二子胶层位于所述间隔，且所述第二子胶层与所述间隔一一对应；
    在每一所述子柔性层上依次层叠设置有阵列基板、发光器件及封装层；
    盖板，所述盖板盖设在所述封装层及所述第二子胶层上。
  2. 根据权利要求1所述的柔性发光面板，其中所述柔性发光面板包括至少一弯折区，所述多个子柔性层中至少一子柔性层位于所述弯折区。
  3. 根据权利要求2所述的柔性发光面板，其中所述第二子胶层的宽度与所述间隔的宽度相同。
  4. 根据权利要求3所述的柔性发光面板，其中所述胶层的厚度与所述背板至所述盖板的距离相同。
  5. 根据权利要求4所述的柔性发光面板，其中所述第二子胶层的宽度为1~3微米。
  6. 根据权利要求1所述的柔性发光面板，其中在所述封装层与所述盖板之间还设置有偏光片、触控板，所述偏光片设置在所述封装层上，所述触控板设置在所述偏光片上。
  7. 一种柔性发光面板的制备方法，其包括：
    提供一基板；
    在所述基板上间隔涂布多个子柔性层，以在所述基板上形成柔性层；
    在所述多个子柔性层中每一子柔性层上依次制备阵列基板、发光器件及封装层，并在所述封装层上盖设一盖板；
    剥离所述基板，并向所述柔性层远离所述封装层的第一表面及相邻所述柔性层之间的间隔处滴加粘接胶，固化所述粘接胶形成胶层；
    在所述胶层远离所述封装层的第二表面上贴附一背板。
  8. 根据权利要求7所述的柔性发光面板的制备方法，其中所述剥离所述基板，包括：
    在真空下通过激光照射所述基板，以使所述基板与所述柔性层剥离。
  9. 根据权利要求8所述的柔性发光面板的制备方法，其中所述向所述柔性层远离所述封装层的第一表面及相邻所述柔性层之间的间隔处滴加粘接胶并固化形成胶层，包括：
    向所述柔性层远离所述封装层的第一表面及相邻所述柔性层之间的间隔处滴加粘接胶；
    紫外固化所述粘接胶，形成所述胶层。
  10. 一种显示设备，其中所述显示设备包括柔性发光面板及壳体，所述柔性发光面板设置在所述壳体上，所述柔性发光面板包括：
    背板；
    胶层，所述胶层包括设置在所述背板上的第一子胶层及自所述第一子胶层向远离所述背板方向凸起的多个第二子胶层；
    柔性层，所述柔性层设置在所述第一子胶层上，且所述柔性层包括多个间隔设置的子柔性层，所述第二子胶层位于所述间隔，且所述第二子胶层与所述间隔一一对应；
    在每一所述子柔性层上依次层叠设置有阵列基板、发光器件及封装层；
    盖板，所述盖板盖设在所述封装层及所述第二子胶层上，其中所述柔性发光面板包括至少一弯折区，所述多个子柔性层中至少一子柔性层位于所述弯折区，在所述封装层与所述盖板之间还设置有偏光片、触控板，所述偏光片设置在所述封装层上，所述触控板设置在所述偏光片上。
  11. 根据权利要求10所述的显示设备，其中所述第二子胶层的宽度与所述间隔的宽度相同。
  12. 根据权利要求11所述的显示设备，其中所述胶层的厚度与所述背板至所述盖板的距离相同。
  13. 根据权利要求12所述的显示设备，其中所述第二子胶层的宽度为1~3微米。
PCT/CN2019/112432 2019-08-01 2019-10-22 柔性发光面板、柔性发光面板的制备方法及显示设备 WO2021017198A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/625,762 US11322716B2 (en) 2019-08-01 2019-10-22 Flexible light-emitting panel, method of manufacturing flexible light-emitting panel, and display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910706407.9 2019-08-01
CN201910706407.9A CN110491914A (zh) 2019-08-01 2019-08-01 柔性发光面板、柔性发光面板的制备方法及显示设备

Publications (1)

Publication Number Publication Date
WO2021017198A1 true WO2021017198A1 (zh) 2021-02-04

Family

ID=68548967

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/112432 WO2021017198A1 (zh) 2019-08-01 2019-10-22 柔性发光面板、柔性发光面板的制备方法及显示设备

Country Status (3)

Country Link
US (1) US11322716B2 (zh)
CN (1) CN110491914A (zh)
WO (1) WO2021017198A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111180600B (zh) * 2020-01-06 2021-09-03 武汉华星光电半导体显示技术有限公司 有机发光二极管器件结构及其制造方法
CN111402734A (zh) * 2020-03-26 2020-07-10 武汉华星光电半导体显示技术有限公司 柔性显示模组及其制备方法与柔性显示装置
CN111415589A (zh) * 2020-04-02 2020-07-14 武汉华星光电半导体显示技术有限公司 柔性模组
CN113066361A (zh) * 2021-03-01 2021-07-02 武汉华星光电半导体显示技术有限公司 柔性显示装置及其制备方法
CN113066365A (zh) * 2021-03-15 2021-07-02 京东方科技集团股份有限公司 显示装置以及制作方法
CN113079237A (zh) * 2021-04-19 2021-07-06 维沃移动通信有限公司 显示屏组件和电子设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100213819A1 (en) * 2009-02-25 2010-08-26 Cok Ronald S Flexible oled display with chiplets
CN105845701A (zh) * 2015-01-16 2016-08-10 昆山工研院新型平板显示技术中心有限公司 一种柔性显示装置及其制作方法
CN108183126A (zh) * 2017-12-31 2018-06-19 深圳市华星光电技术有限公司 一种弹性显示面板制作方法、弹性显示面板及其显示器
CN108615822A (zh) * 2018-04-28 2018-10-02 武汉华星光电半导体显示技术有限公司 柔性oled显示面板及其制备方法、显示装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102489110B1 (ko) * 2016-02-04 2023-01-16 삼성디스플레이 주식회사 표시 장치
KR102516055B1 (ko) * 2016-07-05 2023-03-31 삼성디스플레이 주식회사 플렉서블 디스플레이 장치
CN206076240U (zh) * 2016-10-14 2017-04-05 上海天马微电子有限公司 显示面板和显示装置
CN108550607B (zh) * 2018-05-04 2020-07-28 京东方科技集团股份有限公司 一种显示面板、显示装置及其封装检测方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100213819A1 (en) * 2009-02-25 2010-08-26 Cok Ronald S Flexible oled display with chiplets
CN105845701A (zh) * 2015-01-16 2016-08-10 昆山工研院新型平板显示技术中心有限公司 一种柔性显示装置及其制作方法
CN108183126A (zh) * 2017-12-31 2018-06-19 深圳市华星光电技术有限公司 一种弹性显示面板制作方法、弹性显示面板及其显示器
CN108615822A (zh) * 2018-04-28 2018-10-02 武汉华星光电半导体显示技术有限公司 柔性oled显示面板及其制备方法、显示装置

Also Published As

Publication number Publication date
CN110491914A (zh) 2019-11-22
US20210367193A1 (en) 2021-11-25
US11322716B2 (en) 2022-05-03

Similar Documents

Publication Publication Date Title
WO2021017198A1 (zh) 柔性发光面板、柔性发光面板的制备方法及显示设备
US10274776B2 (en) Color film substrate, display device, and manufacturing method of the color film substrate
US9933667B2 (en) Liquid crystal panel and manufacture method thereof
CN109461839B (zh) Oled显示基板及其制作方法、显示装置
WO2018059028A1 (zh) 双面显示面板及其制作方法、显示装置
CN107807468A (zh) 显示模组及显示装置
WO2020038200A1 (zh) 显示面板及制备方法以及电子设备
US10741796B2 (en) Light-emitting panel capable of emitting uniform light and method for manufacturing the same
WO2022077725A1 (zh) 一种微型发光二极管灯板、背光模组及其制备方法
WO2022032701A1 (zh) 显示盖板及其制备方法、显示装置
CN109786434B (zh) 阵列基板、其制备方法、显示面板、装置和像素驱动电路
US20110255034A1 (en) Display device
WO2015139421A1 (zh) 显示面板及显示装置
US20220255047A1 (en) Display panel and display device
WO2018214206A1 (zh) 柔性阵列基板的制作方法
US20220199959A1 (en) Display panel and formation method thereof, and display apparatus
CN111785760B (zh) 一种显示基板及其制备方法、显示装置
WO2020181591A1 (zh) 显示面板的制作方法、显示面板及电子设备
WO2020181569A1 (zh) 显示面板的制作方法、显示面板及电子设备
WO2021042573A1 (zh) 柔性发光面板、柔性发光面板的制备方法及显示设备
WO2020024765A1 (zh) 显示面板及其制造方法、显示装置
WO2022237017A1 (zh) 显示面板及其制作方法、显示装置
WO2020103349A1 (zh) Oled显示装置及其制作方法
WO2023088168A1 (zh) 阵列基板、显示面板及其制作方法
WO2020181587A1 (zh) 显示面板的制作方法、显示面板及电子设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19939511

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19939511

Country of ref document: EP

Kind code of ref document: A1