WO2018152941A1 - 有机电致发光显示装置及其制作方法 - Google Patents

有机电致发光显示装置及其制作方法 Download PDF

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Publication number
WO2018152941A1
WO2018152941A1 PCT/CN2017/080181 CN2017080181W WO2018152941A1 WO 2018152941 A1 WO2018152941 A1 WO 2018152941A1 CN 2017080181 W CN2017080181 W CN 2017080181W WO 2018152941 A1 WO2018152941 A1 WO 2018152941A1
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substrate
flexible substrate
support substrate
layer
manufacturing
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PCT/CN2017/080181
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English (en)
French (fr)
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徐超
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武汉华星光电技术有限公司
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Priority to US15/532,398 priority Critical patent/US10468600B2/en
Publication of WO2018152941A1 publication Critical patent/WO2018152941A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment

Definitions

  • the present invention belongs to the field of display technologies, and in particular, to an organic electroluminescence display device and a method of fabricating the same.
  • OLED Organic Light-Emitting Diode
  • the method for fabricating a flexible OLED display device is mainly to bond a flexible substrate to a rigid substrate, and after the OLED device is fabricated, the rigid substrate is separated from the flexible substrate.
  • the rigid substrate and the flexible substrate are relatively tightly bonded, it is difficult to separate the OLED device after the OLED device is fabricated.
  • the production of a flexible OLED display device usually requires a thin film package, which cannot be realized by a conventional glass package, and the film package requires an additional purchase of an expensive thin film packaging device, thereby causing an increase in the manufacturing cost of the flexible OLED display device.
  • an object of the present invention is to provide an organic electroluminescence display device and a method of fabricating the same.
  • a method for fabricating an organic electroluminescence display device includes: providing a lower support substrate and an upper support substrate; and sequentially forming a lower flexible substrate and an organic electroluminescent device layer on the lower support substrate, And sequentially forming an upper flexible substrate and an adhesive layer on the upper support substrate; the lower support substrate and the upper support substrate to bond the adhesive layer to the organic electroluminescent device layer; The support substrate and the upper support substrate.
  • the method for fabricating the lower flexible substrate on the lower support substrate comprises: coating a flexible material on the lower support substrate by a coating process, and curing the flexible material, or adhering the finished lower flexible substrate through adhesion
  • the agent is attached to the lower support substrate
  • the method for fabricating the upper flexible substrate on the upper support substrate comprises: coating a flexible material on the upper support substrate by a coating process, and curing the flexible material, or the finished material is completed
  • the upper flexible substrate is attached to the upper support substrate by an adhesive.
  • the method for peeling off the lower supporting substrate comprises: providing a release film layer between the lower flexible substrate and the lower supporting substrate to automatically separate the lower supporting substrate and the lower flexible substrate, or using the excimer laser to make the lower supporting substrate and the lower The flexible substrate is separated;
  • the method of peeling off the upper supporting substrate comprises: providing a release film layer between the upper flexible substrate and the upper supporting substrate to automatically separate the upper supporting substrate and the upper flexible substrate, or using the excimer laser to make the upper supporting substrate and The upper flexible substrate is separated.
  • the manufacturing method further includes: forming a passivation layer on the upper flexible substrate, wherein the passivation layer is used to improve water and oxygen barrier capability of the upper flexible substrate .
  • the manufacturing method further includes: forming a light extraction layer on the lower flexible substrate, wherein the light extraction layer is used to improve the water and oxygen barrier capability of the lower flexible substrate and Increase light transmission.
  • the manufacturing method further includes: forming a light extraction layer on the release film layer, wherein the light extraction layer is used to increase water oxygen of the lower flexible substrate Barrier ability and ability to increase light transmission.
  • the release film layer is made of photosensitive photoresist or silicone.
  • the light extraction layer is made of titanium dioxide.
  • the bonding layer is made of a UV curable adhesive.
  • an organic electroluminescence display device produced by the above-described fabrication method is also provided.
  • the invention has the beneficial effects that when the organic electroluminescence display device is manufactured by the manufacturing method of the invention, the problem that the rigid substrate (ie, the support substrate) and the flexible substrate are difficult to be separated can be effectively solved, and The organic electroluminescent device is directly packaged in the manufacturing process, and the package is not required to be additionally packaged, thereby greatly reducing the production cost.
  • FIGS. 1A to 1D are process diagrams of an organic electroluminescence display device according to an embodiment of the present invention.
  • FIGS. 2A through 2D are process diagrams of an organic electroluminescence display device in accordance with another embodiment of the present invention.
  • FIG. 1A through 1D are process diagrams of an organic electroluminescence display device in accordance with an embodiment of the present invention.
  • Step 1 Referring to FIG. 1A, a lower support substrate 110 and an upper support substrate 210 are provided.
  • the lower support substrate 110 and the upper support substrate 210 may be made of glass, ceramic or metal.
  • the lower support substrate 110 and the upper support substrate 210 have a thickness of between 0.5 mm and 1 mm.
  • the lower support substrate 110 and the upper support substrate 210 are preferably made of glass, and the lower support substrate The thickness of the 110 and upper support substrate 210 is preferably 0.7 mm.
  • Step 2 Referring to FIG. 1B, the lower flexible substrate 120 and the organic electroluminescent device layer 130 are sequentially formed on the lower supporting substrate 110, and the upper flexible substrate 220 and the adhesive layer 230 are sequentially formed on the upper supporting substrate 210.
  • the organic electroluminescent device layer 130 includes a plurality of thin film transistors (not shown) arranged in an array and a plurality of organic electroluminescent devices (not shown) arranged in an array, wherein each of the organic electroluminescent devices is A corresponding thin film transistor controls the illumination.
  • the adhesive layer 230 is made of a UV curable adhesive, but the invention is not limited thereto.
  • the arrangement of the flexible substrate (the lower flexible substrate 120 or the upper flexible substrate 220) can be divided into the following two ways:
  • Method 1 coating a flexible material (ie, a material for forming the flexible substrate) by a coating process such as spin coating, slit coating, inkjet coating, or the like on a support substrate (the lower support substrate 110 or the upper support substrate 210) ) and curing the coated flexible material.
  • a coating process such as spin coating, slit coating, inkjet coating, or the like
  • Method 2 A flexible substrate that has been made of a flexible material is attached to the support substrate by an adhesive.
  • the flexible substrate may include more than one organic layer, and may also include two or more organic layers, and the organic layer may further include one, two or more inorganic layers, wherein The inorganic layer may be made of SiN x and/or SiO x or the like.
  • a passivation layer 240 is formed on the upper flexible substrate 220, and the passivation layer 240 is used to improve the water and oxygen barrier capability of the upper flexible substrate 220. . It should be understood that as other embodiments of the present invention, the passivation layer 240 may not be provided.
  • a light extraction layer 140 is formed on the lower support substrate 110, and the light extraction layer 140 is used to improve the water and oxygen barrier capability of the lower flexible substrate 120 and improve light transmission. Over rate.
  • the light extraction layer 140 may not be provided.
  • the light extraction layer 140 may be made of an inorganic transparent material such as titanium dioxide.
  • Step 3 Referring to FIG. 1C, the lower support substrate 110 and the upper support substrate 210 are aligned to make the adhesive layer 230 is bonded to the organic electroluminescent device layer 130.
  • Step 4 referring to FIG. 1D, the lower support substrate 110 or the upper support substrate 210 is peeled off.
  • the method of peeling off the lower support substrate 110 or the upper support substrate 210 is specifically: the lower support substrate 110 is directly peeled off by using excimer laser, and the upper support substrate 210 is directly peeled off by using excimer laser.
  • FIGS. 2A through 2D are process diagrams of an organic electroluminescence display device in accordance with another embodiment of the present invention.
  • Step 1 Referring to FIG. 2A, a lower support substrate 110 and an upper support substrate 210 are provided.
  • the lower support substrate 110 and the upper support substrate 210 may be made of glass, ceramic or metal.
  • the lower support substrate 110 and the upper support substrate 210 have a thickness of between 0.5 mm and 1 mm.
  • the lower support substrate 110 and the upper support substrate 210 are preferably made of glass, and the thickness of the lower support substrate 110 and the upper support substrate 210 is preferably 0.7 mm.
  • Step 2 Referring to FIG. 2B, a lower release film layer 150, a lower flexible substrate 120, and an organic electroluminescent device layer 130 are sequentially formed on the lower support substrate 110, and an upper release film layer 250 is sequentially formed on the upper support substrate 210.
  • the flexible substrate 220 and the adhesive layer 230 are upper.
  • the organic electroluminescent device layer 130 includes a plurality of thin film transistors (not shown) arranged in an array and a plurality of organic electroluminescent devices (not shown) arranged in an array, wherein each of the organic electroluminescent devices is A corresponding thin film transistor controls the illumination.
  • the adhesive layer 230 is made of a UV curable adhesive, but the invention is not limited thereto.
  • the release film layer (the lower release film layer 150 and the upper release film layer 250) is made of a photosensitive photoresist or a silicone, but the invention is not limited thereto.
  • the arrangement of the flexible substrate (the lower flexible substrate 120 or the upper flexible substrate 220) can be divided into the following two ways:
  • Method 1 coating the flexible material on the release film layer (the lower release film layer 150 and the upper release film layer 250) by a coating process such as spin coating, slit coating, inkjet coating, etc. The material of the flexible substrate And curing the coated flexible material.
  • Method 2 A flexible substrate that has been made of a flexible material is attached to the release film layer by an adhesive.
  • the flexible substrate may include more than one organic layer, and may also include two or more organic layers, and the organic layer may further include one, two or more inorganic layers, wherein The inorganic layer may be made of SiN x and/or SiO x or the like.
  • a passivation layer 240 is formed on the upper flexible substrate 220, and the passivation layer 240 is used to improve the water and oxygen barrier capability of the upper flexible substrate 220. . It should be understood that as other embodiments of the present invention, the passivation layer 240 may not be provided.
  • a light extraction layer 140 is formed on the lower release film layer 150, and the light extraction layer 140 is used to improve the water and oxygen barrier capability of the lower flexible substrate 120 and Increase light transmission.
  • the light extraction layer 140 may not be provided.
  • the light extraction layer 140 may be made of an inorganic transparent material such as titanium dioxide.
  • Step 3 Referring to FIG. 1C, the lower support substrate 110 and the upper support substrate 210 are aligned to bond the adhesive layer 230 to the organic electroluminescent device layer 130.
  • Step 4 referring to FIG. 1D, the lower support substrate 110 or the upper support substrate 210 is peeled off.
  • the method of peeling off the lower support substrate 110 or the upper support substrate 210 is specifically: since the lower release film layer 150 is disposed on the lower support substrate 110, the lower release film layer 150 is processed to peel off the lower support substrate 110. Similarly, since the upper release film layer 250 is provided on the upper support substrate 210, the upper release film layer 250 is processed to peel the upper support substrate 210.
  • the manufacturing method of each embodiment effectively solves the problem that the rigid substrate (ie, the supporting substrate) and the flexible substrate are difficult to be separated, and in the manufacturing method, directly
  • the organic electroluminescent device is packaged, and the organic electroluminescent device is packaged without using an additional thin film encapsulation device, thereby greatly reducing the production cost.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种有机电致发光显示装置的制作方法以及显示装置，制作方法包括：提供下支撑基板（110）和上支撑基板（210）；在下支撑基板上依次制作下柔性基板（120）和有机电致发光器件层（130），且在上支撑基板上依次制作上柔性基板（220）和粘合层（230）；对位下支撑基板和上支撑基板，以使粘合层与有机电致发光器件层粘合；剥离下支撑基板和上支撑基板。该方法能够有效地解决支撑基板和柔性基板难以分离的问题，并且在制作过程中直接对有机电致发光器件进行了封装，无需额外使用薄膜封装装置进行封装，从而降低了生产成本。

Description

有机电致发光显示装置及其制作方法 技术领域
本发明属于显示技术领域，具体地讲，涉及一种有机电致发光显示装置及其制作方法。
背景技术
近年来，有机发光二极管(Organic Light-Emitting Diode，OLED)成为国内外非常热门的新兴平面显示装置产品，这是因为OLED显示装置具有自发光、广视角、短反应时间、高发光效率、广色域、低工作电压、薄厚度、可制作大尺寸与可挠曲的面板及制程简单等特性，而且它还具有低成本的潜力。
在可挠曲(或称柔性)OLED显示装置的制程中，由于柔性基板易变形，因此在生产过程中难以操作，从而大大制约了柔性OLED显示装置的发展。
目前，制作柔性OLED显示装置的方法主要是将柔性基板粘合在刚性基板上，制作好OLED器件后，再将刚性基板与柔性基板分离开来。但是，由于刚性基板和柔性基板粘合的比较紧，制作好OLED器件后，二者很难分离开。
此外，制作柔性OLED显示装置通常需要采用薄膜封装，传统的玻璃封装无法实现，而薄膜封装需要额外购买昂贵的薄膜封装设备，从而造成柔性OLED显示装置的制作成本增加。
发明内容
为了解决上述的技术问题，本发明的目的在于提供一种有机电致发光显示装置及其制作方法。
根据本发明的一方面，提供了一种有机电致发光显示装置的制作方法，其包括：提供下支撑基板和上支撑基板；在下支撑基板上依次制作下柔性基板和有机电致发光器件层，且在上支撑基板上依次制作上柔性基板和粘合层；对位下支撑基板和上支撑基板，以使粘合层与有机电致发光器件层粘合；剥离下支 撑基板和上支撑基板。
可选地，在下支撑基板上制作下柔性基板的方法包括：利用涂布工艺在下支撑基板上涂覆柔性材料，并对所述柔性材料进行固化，或者将已制作完成的下柔性基板通过粘附剂贴附在下支撑基板上；在上支撑基板上制作上柔性基板的方法包括：利用涂布工艺在上支撑基板上涂覆柔性材料，并对所述柔性材料进行固化，或者将已制作完成的上柔性基板通过粘附剂贴附在上支撑基板上。
可选地，剥离下支撑基板的方法包括：在下柔性基板与下支撑基板之间设置离型膜层，以使下支撑基板和下柔性基板自动分离，或者利用准分子镭射使下支撑基板和下柔性基板分离；剥离上支撑基板的方法包括：在上柔性基板与上支撑基板之间设置离型膜层，以使上支撑基板和上柔性基板自动分离，或者利用准分子镭射使上支撑基板和上柔性基板分离。
可选地，在上柔性基板上制作粘合层之前，所述制作方法还包括：在上柔性基板上制作钝化层，所述钝化层用于提高所述上柔性基板的水氧阻隔能力。
可选地，在下支撑基板上制作下柔性基板之前，所述制作方法还包括：在下柔性基板上制作光提取层，所述光提取层用于提高所述下柔性基板的水氧阻隔能力且能够提高光透过率。
可选地，在离型膜层上设置下柔性基板之前，所述制作方法还包括：在离型膜层上制作光提取层，所述光提取层用于提高所述下柔性基板的水氧阻隔能力且能够提高光透过率。
可选地，所述离型膜层的制作材料为感光光阻或有机硅。
可选地，所述光提取层的制作材料为二氧化钛。
可选地，所述粘结层的制作材料为紫外光固化胶。
根据本发明的另一方面，还提供了一种由上述的制作方法制作的有机电致发光显示装置。
本发明的有益效果：利用本发明的制作方法制作有机电致发光显示装置时，能够有效地解决刚性基板(即支撑基板)和柔性基板难以分离的问题，并 且在制作过程中直接对有机电致发光器件进行了封装，无需额外使用薄膜封装装置进行封装，从而使生产成本大大降低。
附图说明
通过结合附图进行的以下描述，本发明的实施例的上述和其它方面、特点和优点将变得更加清楚，附图中：
图1A至图1D是根据本发明的实施例的有机电致发光显示装置的制程图；
图2A至图2D是根据本发明的另一实施例的有机电致发光显示装置的制程图。
具体实施方式
以下，将参照附图来详细描述本发明的实施例。然而，可以以许多不同的形式来实施本发明，并且本发明不应该被解释为限制于这里阐述的具体实施例。相反，提供这些实施例是为了解释本发明的原理及其实际应用，从而使本领域的其他技术人员能够理解本发明的各种实施例和适合于特定预期应用的各种修改。
在附图中，为了清楚器件，夸大了层和区域的厚度。相同的标号在整个说明书和附图中表示相同的元器件。
将理解的是，当诸如层、膜、区域或基底的元件被称作“在”另一元件“上”时，该元件可以直接在所述另一元件上，或者也可以存在中间元件。可选择地，当元件被称作“直接在”另一元件“上”时，不存在中间元件。
图1A至图1D是根据本发明的实施例的有机电致发光显示装置的制程图。
根据本发明的实施例的有机电致发光显示装置的制作方法包括：
步骤一：参照图1A，提供下支撑基板110和上支撑基板210。
这里，下支撑基板110和上支撑基板210可以采用玻璃、陶瓷或金属制成。下支撑基板110和上支撑基板210厚度介于0.5mm至1mm之间。在本实施例中，下支撑基板110和上支撑基板210优选地采用玻璃制成，并且下支撑基板 110和上支撑基板210的厚度优选为0.7mm。
步骤二：参照图1B，在下支撑基板110上依次制作下柔性基板120和有机电致发光器件层130，且在上支撑基板210上依次制作上柔性基板220和粘合层230。
这里，有机电致发光器件层130包括阵列排布的多个薄膜晶体管(未示出)和阵列排布的多个有机电致发光器件(未示出)，其中每个有机电致发光器件被对应的一个薄膜晶体管控制发光。在本实施例中，优选地，粘合层230的制作材料为紫外线固化胶，但本发明并不限制于此。
进一步地，柔性基板(下柔性基板120或上柔性基板220)的设置可以分为以下两种方式：
方式一：在支撑基板(下支撑基板110或上支撑基板210)上通过诸如旋涂、狭缝涂覆、喷墨涂覆等涂布工艺涂覆柔性材料(即制成所述柔性基板的材料)，并对涂覆的柔性材料进行固化。
方式二：将已由柔性材料制成的柔性基板通过粘附剂贴附于支撑基板上。在一些实施方式中，柔性基板中可以不止包括一层有机物层，还可以包括两层或者更多层有机物层，同时有机物层中还可以包括一层、两层或更多层无机物层，其中无机物层可以由SiNx和/或SiOx等制成。
进一步地，在上柔性基板220上制作粘合层230之前，先在上柔性基板220上制作钝化层(Passivation layer)240，该钝化层240用于提高上柔性基板220的水氧阻隔能力。应当理解的是，作为本发明的其他实施方式，该钝化层240不设置也可以。
更进一步地，在下支撑基板110上制作下柔性基板120之前，先在下支撑基板110上制作光提取层140，该光提取层140用于提高下柔性基板120的水氧阻隔能力且能够提高光透过率。需要说明的是，作为本发明的其他实施方式，该光提取层140不设置也可以。在本实施例中，优选地，该光提取层140的制作材料可以为二氧化钛等无机透明材料。
步骤三：参照图1C，对位下支撑基板110和上支撑基板210，以使粘合层 230与有机电致发光器件层130粘合。
步骤四，参照图1D，剥离下支撑基板110或上支撑基板210。
进一步地，剥离下支撑基板110或上支撑基板210的方法具体为：直接利用准分子镭射使下支撑基板110被剥离，且直接利用准分子镭射使上支撑基板210被剥离。
图2A至图2D是根据本发明的另一实施例的有机电致发光显示装置的制程图。
根据本发明的另一实施例的有机电致发光显示装置的制作方法包括：
步骤一：参照图2A，提供下支撑基板110和上支撑基板210。
这里，下支撑基板110和上支撑基板210可以采用玻璃、陶瓷或金属制成。下支撑基板110和上支撑基板210厚度介于0.5mm至1mm之间。在本实施例中，下支撑基板110和上支撑基板210优选地采用玻璃制成，并且下支撑基板110和上支撑基板210的厚度优选为0.7mm。
步骤二：参照图2B，在下支撑基板110上依次制作下离型膜层150、下柔性基板120和有机电致发光器件层130，且在上支撑基板210上依次制作上离型膜层250、上柔性基板220和粘合层230。
这里，有机电致发光器件层130包括阵列排布的多个薄膜晶体管(未示出)和阵列排布的多个有机电致发光器件(未示出)，其中每个有机电致发光器件被对应的一个薄膜晶体管控制发光。在本实施例中，优选地，粘合层230的制作材料为紫外线固化胶，但本发明并不限制于此。在本实施例中，优选地，离型膜层(下离型膜层150和上离型膜层250)的制作材料为感光光阻或有机硅，但本发明并不限制于此。
进一步地，柔性基板(下柔性基板120或上柔性基板220)的设置可以分为以下两种方式：
方式一：在离型膜层(下离型膜层150和上离型膜层250)上通过诸如旋涂、狭缝涂覆、喷墨涂覆等涂布工艺涂覆柔性材料(即制成所述柔性基板的材 料)，并对涂覆的柔性材料进行固化。
方式二：将已由柔性材料制成的柔性基板通过粘附剂贴附于离型膜层上。在一些实施方式中，柔性基板中可以不止包括一层有机物层，还可以包括两层或者更多层有机物层，同时有机物层中还可以包括一层、两层或更多层无机物层，其中无机物层可以由SiNx和/或SiOx等制成。
进一步地，在上柔性基板220上制作粘合层230之前，先在上柔性基板220上制作钝化层(Passivation layer)240，该钝化层240用于提高上柔性基板220的水氧阻隔能力。应当理解的是，作为本发明的其他实施方式，该钝化层240不设置也可以。
进一步地，在下离型膜层150上制作下柔性基板120之前，先在下离型膜层150上制作光提取层140，该光提取层140用于提高下柔性基板120的水氧阻隔能力且能够提高光透过率。需要说明的是，作为本发明的其他实施方式，该光提取层140不设置也可以。在本实施例中，优选地，该光提取层140的制作材料可以为二氧化钛等无机透明材料。
步骤三：参照图1C，对位下支撑基板110和上支撑基板210，以使粘合层230与有机电致发光器件层130粘合。
步骤四，参照图1D，剥离下支撑基板110或上支撑基板210。
进一步地，剥离下支撑基板110或上支撑基板210的方法具体为：由于在下支撑基板110上设置了下离型膜层150，通过处理下离型膜层150，以使下支撑基板110被剥离；同样地，由于在上支撑基板210上设置了上离型膜层250，通过处理上离型膜层250，以使上支撑基板210被剥离。
综上所述，在制作有机电致发光显示装置的过程中，各实施例的制作方法有效地解决了刚性基板(即支撑基板)和柔性基板难以分离的问题，并且在该制作方法中，直接对有机电致发光器件进行了封装，无需额外使用薄膜封装装置对有机电致发光器件进行了封装，从而使生产成本大大降低。
虽然已经参照特定实施例示出并描述了本发明，但是本领域的技术人员将理解：在不脱离由权利要求及其等同物限定的本发明的精神和范围的情况下， 可在此进行形式和细节上的各种变化。

Claims (15)

  1. 一种有机电致发光显示装置的制作方法，其中，包括：
    提供下支撑基板和上支撑基板；
    在下支撑基板上依次制作下柔性基板和有机电致发光器件层，且在上支撑基板上依次制作上柔性基板和粘合层；
    对位下支撑基板和上支撑基板，以使粘合层与有机电致发光器件层粘合；
    剥离下支撑基板和上支撑基板。
  2. 根据权利要求1所述的制作方法，其中，在下支撑基板上制作下柔性基板的方法包括：利用涂布工艺在下支撑基板上涂覆柔性材料，并对所述柔性材料进行固化，或者将已制作完成的下柔性基板通过粘附剂贴附在下支撑基板上；
    在上支撑基板上制作上柔性基板的方法包括：利用涂布工艺在上支撑基板上涂覆柔性材料，并对所述柔性材料进行固化，或者将已制作完成的上柔性基板通过粘附剂贴附在上支撑基板上。
  3. 根据权利要求1所述的制作方法，其中，剥离下支撑基板的方法包括：在下柔性基板与下支撑基板之间设置离型膜层，以使下支撑基板和下柔性基板自动分离，或者利用准分子镭射使下支撑基板和下柔性基板分离；
    剥离上支撑基板的方法包括：在上柔性基板与上支撑基板之间设置离型膜层，以使上支撑基板和上柔性基板自动分离，或者利用准分子镭射使上支撑基板和上柔性基板分离。
  4. 根据权利要求2所述的制作方法，其中，剥离下支撑基板的方法包括：在下柔性基板与下支撑基板之间设置离型膜层，以使下支撑基板和下柔性基板自动分离，或者利用准分子镭射使下支撑基板和下柔性基板分离；
    剥离上支撑基板的方法包括：在上柔性基板与上支撑基板之间设置离型膜 层，以使上支撑基板和上柔性基板自动分离，或者利用准分子镭射使上支撑基板和上柔性基板分离。
  5. 根据权利要求1所述的制作方法，其中，在上柔性基板上制作粘合层之前，所述制作方法还包括：在上柔性基板上制作钝化层，所述钝化层用于提高所述上柔性基板的水氧阻隔能力。
  6. 根据权利要求1所述的制作方法，其中，在下支撑基板上制作下柔性基板之前，所述制作方法还包括：在下柔性基板上制作光提取层，所述光提取层用于提高所述下柔性基板的水氧阻隔能力且能够提高光透过率。
  7. 根据权利要求3所述的制作方法，其中，在离型膜层上设置下柔性基板之前，所述制作方法还包括：在离型膜层上制作光提取层，所述光提取层用于提高所述下柔性基板的水氧阻隔能力且能够提高光透过率。
  8. 根据权利要求4所述的制作方法，其中，在离型膜层上设置下柔性基板之前，所述制作方法还包括：在离型膜层上制作光提取层，所述光提取层用于提高所述下柔性基板的水氧阻隔能力且能够提高光透过率。
  9. 根据权利要求3所述的制作方法，其中，所述离型膜层的制作材料为感光光阻或有机硅。
  10. 根据权利要求4所述的制作方法，其中，所述离型膜层的制作材料为感光光阻或有机硅。
  11. 根据权利要求6所述的制作方法，其中，所述光提取层的制作材料为二氧化钛。
  12. 根据权利要求7所述的制作方法，其中，所述光提取层的制作材料为二氧化钛。
  13. 根据权利要求8所述的制作方法，其中，所述光提取层的制作材料为二氧化钛。
  14. 根据权利要求1所述的制作方法，其中，所述粘结层的制作材料为紫外光固化胶。
  15. 一种利用权利要求1所述的制作方法制作的有机电致发光显示装置。
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