WO2018105348A1 - Procédé de fabrication de module - Google Patents

Procédé de fabrication de module Download PDF

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Publication number
WO2018105348A1
WO2018105348A1 PCT/JP2017/041229 JP2017041229W WO2018105348A1 WO 2018105348 A1 WO2018105348 A1 WO 2018105348A1 JP 2017041229 W JP2017041229 W JP 2017041229W WO 2018105348 A1 WO2018105348 A1 WO 2018105348A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
adhesive layer
module
magnetic
coil pattern
Prior art date
Application number
PCT/JP2017/041229
Other languages
English (en)
Japanese (ja)
Inventor
佳宏 古川
圭佑 奥村
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2017213828A external-priority patent/JP6967428B2/ja
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to CN201780075984.1A priority Critical patent/CN110050315B/zh
Priority to KR1020197014688A priority patent/KR20190092389A/ko
Priority to EP17878408.8A priority patent/EP3553801A4/fr
Priority to US16/466,720 priority patent/US20200066441A1/en
Publication of WO2018105348A1 publication Critical patent/WO2018105348A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/0066—Printed inductances with a magnetic layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F2017/048—Fixed inductances of the signal type  with magnetic core with encapsulating core, e.g. made of resin and magnetic powder

Definitions

  • the present invention relates to a method for manufacturing a module.
  • a module in which a coil and a magnetic material are combined is known to be used for wireless power transmission (wireless power feeding), wireless communication, passive components, and the like.
  • planar conductor coil or a planar inductor in which both surfaces of a laminated body are sandwiched between ferromagnetic layers via an insulating layer is known.
  • a Cu foil is stretched on both sides of a first insulating layer made of a polyimide film, and then the Cu foil on both sides is etched to be processed into a spiral conductor coil ( Subtractive method).
  • two second insulating layers made of polyimide film are arranged, and subsequently a ferromagnetic layer is arranged.
  • the ferromagnetic layer is opposed to the spiral conductor coil via the second insulating layer. There is a problem that it is difficult to ensure high inductance.
  • the spiral conductor coil 46 is formed on the upper surface of the release layer 45 by the subtractive method, and the ferromagnetic layer 41 is disposed on the lower surface of the release layer 40.
  • the peeling layer 45 is pressed against the ferromagnetic layer 41, and the spiral conductor coil 46 is embedded in the ferromagnetic layer 41.
  • the peeling layer 45 is peeled from the ferromagnetic layer 41 and the spiral conductor coil 46.
  • An object of the present invention is to provide a module manufacturing method capable of reliably and smoothly manufacturing a module capable of ensuring a high inductance while reducing the thickness.
  • a module that does not include the first insulating layer as in Patent Document 1 can be manufactured. Therefore, a thin module can be manufactured.
  • the conductor pattern is pushed into the first adhesive layer containing the first magnetic particles, so that a high inductance can be secured while further reducing the thickness of the module. .
  • the conductor pattern formed on one surface in the thickness direction of the seed layer is pushed into the first adhesive layer, and at this time, even if one surface in the thickness direction of the seed layer is Even if pressure-sensitive bonding is performed on one adhesive layer, the conductive pattern and the other surface in the thickness direction of the first adhesive layer can be reliably and smoothly removed by peeling the first release layer from the seed layer and etching the seed layer in the fourth step. Can be exposed to.
  • the seed layer is pressure-bonded to the first adhesive layer, and the conductor pattern is pushed into the first adhesive layer, and the fourth step includes the first step.
  • the manufacturing method of the module as described in (1) provided with the 5th process of peeling a peeling layer from the said seed layer, and the 6th process of removing the said seed layer.
  • the first step is performed in the fifth step. Since the peeling layer is peeled from the seed layer and the seed layer is removed in the sixth step, the conductor pattern and the other surface in the thickness direction of the first adhesive layer can be more reliably and smoothly exposed.
  • the present invention (3) includes the module manufacturing method according to (2), wherein the seed layer is etched in the sixth step.
  • the conductor pattern formed on one surface in the thickness direction of the seed layer is pushed into the first adhesive layer, and at this time, even if one surface in the thickness direction of the seed layer is Since the seed layer is etched in the sixth step even if it is in close contact with one adhesive layer, the seed layer is reliably and smoothly removed, and the conductor pattern and the other surface in the thickness direction of the first adhesive layer are more reliably and smoothly Can be exposed to.
  • the present invention (4) is any one of (1) to (3), wherein the content ratio of the first magnetic particles in the first adhesive layer is 15% by volume or more and 80% by volume or less. Including a method of manufacturing the module.
  • the inductance can be improved.
  • the content rate of the 1st magnetic particle in a 1st contact bonding layer is 80 volume% or less, the pressing with respect to the 1st contact bonding layer of a conductor pattern can be implemented reliably. Therefore, it is possible to achieve both improvement in inductance and improvement in pushability of the conductor pattern with respect to the first adhesive layer.
  • the present invention (5) includes the method for producing a module according to any one of (1) to (4), wherein the first resin component is an epoxy resin, a phenol resin, and an acrylic resin.
  • the 1st resin component is an epoxy resin, a phenol resin, and an acrylic resin, in the 3rd process, while being able to push a conductor pattern into the 1st adhesion layer reliably, it is excellent.
  • a module having excellent flexibility and excellent heat resistance can be manufactured.
  • the present invention (6) further comprises a seventh step of disposing a magnetic layer containing second magnetic particles and a second resin component on the other surface in the thickness direction of the first adhesive layer.
  • the manufacturing method of the module as described in any one of (5) is included.
  • the magnetic layer is disposed on the other surface in the thickness direction of the first adhesive layer, so that the inductance of the module can be further improved.
  • This invention (7) implements the said 3rd process so that the said thickness one surface of the said conductor pattern may be exposed from the said 1st contact bonding layer, and the said 2nd contact bonding layer containing a said 1st magnetic particle WHEREIN: (1) to (1), further comprising an eighth step of forming the adhesive layer for embedding the conductor pattern by covering the one surface of the conductor pattern with the first adhesive layer and the second adhesive layer.
  • the manufacturing method of the module as described in any one of 5) is included.
  • the adhesive layer for burying the conductor pattern is formed in the eighth step, the inductance of the module can be further improved.
  • the present invention (8) includes the method for producing a module according to (7), wherein a content ratio of the first magnetic particles in the adhesive layer is 15% by volume or more and 80% by volume or less.
  • the inductance can be improved.
  • the content rate of the 1st magnetic particle in an contact bonding layer is 80 volume% or less, embedding with respect to the contact bonding layer of a conductor pattern can be implemented reliably. Therefore, it is possible to achieve both improvement in inductance and embedding property of the adhesive layer in the conductor pattern.
  • the module according to any one of (1) to (8), wherein the first magnetic particles are particles composed of at least one selected from iron and an iron alloy. Including methods.
  • the first magnetic particles are particles composed of at least one selected from iron and iron alloys, the inductance can be reliably improved.
  • the present invention (10) further comprises a tenth step of disposing the magnetic layer containing the second magnetic particles and the second resin component on one and the other surfaces in the thickness direction of the adhesive layer, (7) or The manufacturing method of the module as described in (8) is included.
  • the magnetic layer is disposed on one surface and the other surface in the thickness direction of the adhesive layer, so that the inductance of the module can be further improved.
  • the present invention (11) includes the module manufacturing method according to (6) or (10), wherein the content ratio of the second magnetic particles in the magnetic layer is 40% by volume or more.
  • the magnetic layer can further improve the inductance.
  • the second magnetic particles are particles made of at least one selected from iron and iron alloys, the inductance can be reliably improved.
  • the present invention (13) provides the method for producing a module according to any one of (6) and (10) to (12), wherein the second resin component is an epoxy resin, a phenol resin, and an acrylic resin. Including.
  • a module having excellent flexibility and excellent heat resistance can be manufactured.
  • the method for manufacturing a module of the present invention it is possible to ensure high inductance while thinning the module, and to reliably and smoothly expose the other side in the thickness direction of the conductor pattern and the first adhesive layer.
  • FIG. 1 shows a bottom view of a first module obtained by the first embodiment of the module manufacturing method of the present invention.
  • 2A to 2H are manufacturing process diagrams of a first module manufacturing method according to the first embodiment of the module manufacturing method of the present invention.
  • FIG. 2A shows a seed layer arranged in the first release layer.
  • 2B is a step of arranging a plating resist
  • FIG. 2C is a second step of forming a conductor pattern by plating
  • FIG. 2D is a step of removing the plating resist
  • FIG. FIG. 2F shows the third step of pressing the coil pattern into the first adhesive layer
  • FIG. 2G shows the fifth step of peeling the first release layer from the seed layer
  • FIG. 2H shows the seed.
  • FIG. 6 shows a sixth step of etching the layer (cross-sectional view taken along the line AA in FIG. 1).
  • FIG. 3 is a bottom view of the second module obtained by the second embodiment of the module manufacturing method of the present invention.
  • 4A to 4D are manufacturing process diagrams of the second module manufacturing method according to the second embodiment of the module manufacturing method of the present invention.
  • FIG. 4A shows the second adhesion arranged on the third release layer.
  • 4B is a step of preparing a layer
  • FIG. 4B is an eighth step of covering the coil pattern with the second adhesive layer, and embedding the coil pattern with the adhesive layer
  • FIG. 4C is a step of preparing two magnetic layers
  • FIG. 9 shows a ninth step of disposing the magnetic layer on the adhesive layer.
  • FIGS. 5A to 5D are manufacturing process diagrams of a third module that is the third embodiment of the method for manufacturing a module of the present invention and a manufacturing method of the fourth module that is the fourth embodiment.
  • the step of placing the support layer on the lower surface of the first module to manufacture the third module FIG. 5B is the eighth step of covering the support layer with the second adhesive layer, and FIG. 5C is the two magnetic layers.
  • the step of preparing, FIG. 5D shows the ninth step of disposing the magnetic layer on the adhesive layer.
  • 6A and 6B are manufacturing process diagrams of the manufacturing method of the module of Comparative Example 2, in which FIG. 6A is a process of preparing a coil pattern arranged in a release layer by a subtractive method, and FIG. 6B is a coil pattern. The process pressed into a 1st contact bonding layer is shown.
  • the vertical direction of the paper surface is the vertical direction (an example of the thickness direction, the first direction)
  • the upper side of the paper surface is the upper side (one side in the thickness direction, the first direction side)
  • the lower side of the paper surface is the lower side ( The other side in the thickness direction and the other side in the first direction).
  • the horizontal direction of the paper is the horizontal direction (second direction orthogonal to the first direction, the width direction), and the right side of the paper is the right side (one side in the width direction, one side in the second direction).
  • the left side of the drawing is the left side (the other side in the width direction and the other side in the second direction).
  • the vertical direction of the paper surface is the front-back direction (a third direction orthogonal to the first direction and the second direction), the lower side of the paper surface is the front side (one side in the third direction), and the upper side of the paper surface is the rear side (the first side). 3 direction other side).
  • First Module Manufacturing Method A first module 1 manufacturing method according to a first embodiment of the module manufacturing method of the present invention will be described with reference to FIGS. 1 and 2A to 2H.
  • the first module 1 is manufactured by a first step (see FIG. 2A) for preparing a seed layer 19 disposed on the upper surface (one example of the thickness direction one surface) of the first release layer 2, feeding from the seed layer 19.
  • 2nd process (refer FIG. 2D) which forms the coil pattern 5 as an example of a conductor pattern in the upper surface (an example of one surface of a thickness direction) of the seed layer 19 by plating to perform, the coil pattern 5 is made of the first magnetic particles.
  • 3rd process (refer FIG. 2F) pushed into the 1st contact bonding layer 11 to contain, and the 4th process (refer FIG. 2H) which exposes the coil pattern 5 and the lower surface (an example of the other surface of thickness direction) of the 1st contact bonding layer 11 ).
  • the first to fourth steps are sequentially performed in this order. Hereinafter, each process is demonstrated in order.
  • a seed layer 19 disposed on the upper surface (an example of one surface in the thickness direction) of the first release layer 2 is prepared.
  • the first release layer 2 has a substantially flat plate (sheet) shape extending in a plane direction (front-rear direction and left-right direction in FIG. 1) perpendicular to the thickness direction.
  • the first release layer 2 is a support layer that supports the coil pattern 5 together with the seed layer 19 until the coil pattern 5 is formed and then the coil pattern 5 is pushed into the first adhesive layer 11.
  • the first release layer 2 is also a transfer substrate (release layer) for transferring the coil pattern 5 to the first adhesive layer 11 (see FIG. 2D).
  • Examples of the material for forming the first release layer 2 include metals and resins. From the viewpoint of obtaining excellent strength, metals can be used. Examples of the metal include iron, copper, chromium, nickel, and alloys thereof, preferably alloys, and more preferably stainless steel.
  • the thickness of the first release layer 2 is, for example, 1 ⁇ m or more, preferably 10 ⁇ m or more. If the thickness of the 1st peeling layer 2 is more than the above-mentioned minimum, the coil pattern 5 and the seed layer 19 can be supported reliably.
  • the thickness of the first release layer 2 is, for example, 1000 ⁇ m or less, preferably 100 ⁇ m or less. If the thickness of the 1st peeling layer 2 is below an upper limit mentioned above, it will be excellent in the handleability of the 1st peeling layer 2. FIG.
  • the seed layer 19 is disposed on the entire upper surface of the first release layer 2.
  • the seed layer 19 has a substantially flat plate (sheet) shape extending in the surface direction.
  • the seed layer 19 is a power feeding layer when the coil pattern 5 is formed by electrolytic plating.
  • the seed layer 19 is a support layer that supports the coil pattern 5 together with the first release layer 2 until the coil pattern 5 is pushed into the first adhesive layer 11.
  • the first release layer 2 is also a transfer substrate (release layer) for transferring the coil pattern 5 to the first adhesive layer 11 (see FIG. 2D).
  • the seed layer 19 is in contact with the upper surface of the first release layer 2.
  • the seed layer 19 is in close contact (adhesion) with the upper surface of the first release layer 2 with a small release strength (pressure-sensitive adhesive force) PS1 with respect to the upper surface of the first release layer 2.
  • the pressure-sensitive adhesive force PS1 of the seed layer 19 with respect to the upper surface of the first release layer 2 is relatively low. Therefore, the first release layer 2 can be easily peeled from the seed layer 19 in the fourth step (see FIG. 2G).
  • Examples of the material for forming the seed layer 19 include metals such as copper, chromium, gold, silver, platinum, nickel, and alloys thereof, for example, nonmetals such as silicon, oxides thereof, and conductive polymers. .
  • a metal, more preferably copper is used from the viewpoint of obtaining high conductivity.
  • the seed layer 19 may be either a single layer or a multilayer.
  • the thickness of the seed layer 19 is, for example, 0.01 ⁇ m or more, preferably 0.1 ⁇ m or more, more preferably 0.5 ⁇ m or more. If the thickness of the seed layer 19 is equal to or greater than the above lower limit, the coil pattern 5 can be reliably and rapidly formed by electrolytic plating in the second step (see FIG. 2C).
  • the thickness of the seed layer 19 is, for example, 10 ⁇ m or less, preferably 5 ⁇ m or less, more preferably 2 ⁇ m or less. If the thickness of the seed layer 19 is equal to or less than the above upper limit, the seed layer 19 can be quickly removed in the fourth step (see FIG. 2G).
  • the ratio of the thickness of the seed layer 19 to the thickness of the first release layer 2 is, for example, 0.001 or more, preferably 0.005 or more, more preferably. Is 0.01 or more. If the above ratio is equal to or higher than the above lower limit, the coil pattern 5 can be reliably and quickly formed by electrolytic plating, and the handleability of the first release layer 2 is excellent.
  • the ratio of the thickness of the seed layer 19 to the thickness of the first release layer 2 is, for example, 0.5 or less, preferably 0.1 or less, more preferably. Is 0.05 or less. If the above ratio is equal to or less than the above upper limit, the first peeling layer 2 can reliably support the coil pattern 5 and the seed layer 19 while the seed layer 19 can be removed quickly.
  • the first release layer 2 is prepared.
  • the seed layer 19 is formed on the upper surface of the first release layer 2 by sputtering, for example, plating such as electrolytic plating or electroless plating.
  • the seed layer 19 is preferably formed on the upper surface of the first release layer 2 by plating, more preferably by electrolytic plating.
  • a laminate including the first release layer 2 and the seed layer 19 can be prepared.
  • the coil pattern 5 is formed on the upper surface of the seed layer 19 (an example of one surface in the thickness direction) by plating from the seed layer 19. Specifically, the coil pattern 5 is formed by an additive method.
  • the plating resist 29 is disposed on the upper surface of the seed layer 19.
  • a photoresist such as a dry film resist having a sheet shape is disposed on the entire upper surface of the seed layer 19, and then a coil pattern 5 (see FIG. 1) and a plating resist 29 having a reverse pattern are formed by photolithography. To do.
  • the coil pattern 5 is then formed on the upper surface of the seed layer 19 exposed from the plating resist 29 by plating with power supplied from the seed layer 19.
  • the first release layer 2, the seed layer 19, and the plating resist 29 are immersed in a plating bath, for example, and power is supplied from the seed layer 19. Then, the coil pattern 5 is laminated (formed) on the upper surface of the seed layer 19 exposed from the plating resist 29.
  • the plating conditions are not particularly limited, and are appropriately adjusted depending on the type of plating bath.
  • the coil pattern 5 is formed by the reverse pattern of the plating resist 29.
  • the plating resist 29 is removed.
  • the plating resist 29 is stripped with a stripping solution.
  • the seed layer 19 is not removed by the removal of the plating resist 29 described above, and remains on the entire upper surface of the first release layer 2.
  • the coil pattern 5 has a coil portion 6 and a terminal portion 7 continuously.
  • the coil portion 6 has a substantially annular shape in plan view with a rear end portion notched or a substantially rectangular frame shape in plan view.
  • the coil portion 6 has a substantially C shape in plan view with the rear side open.
  • the terminal portion 7 has a substantially linear shape in plan view extending rearward from each of the two rear end portions of the coil pattern 5.
  • the dimensions of the coil pattern 5 are not particularly limited.
  • the width W1 of the coil part 6 is, for example, 20 ⁇ m or more, preferably 50 ⁇ m or more, and for example, 100 mm or less, preferably 1000 ⁇ m or less.
  • the inner dimension (inner diameter) L1 of the coil portion 6 is, for example, 20 ⁇ m or more, preferably 50 ⁇ m or more, and for example, 500 mm or less, preferably 5 mm or less.
  • the outer dimension (outer diameter) L2 of the coil unit 6 is, for example, 60 ⁇ m or more, preferably 150 ⁇ m or more, and for example, 500 mm or less, preferably 5 mm or less.
  • the distance L3 between the two rear end portions in the left-right direction of the coil unit 6 is, for example, 20 ⁇ m or more, preferably 50 ⁇ m or more, and, for example, 300 mm or less, preferably 2 mm or less.
  • the cross-sectional area S of the coil pattern 5 is, for example, 20 ⁇ m 2 or more, preferably 2500 ⁇ m 2 or more, and for example, 20 mm 2 or less, preferably 0.1 mm 2 or less.
  • the length (width) W2 of the terminal portion 7 in the left-right direction is, for example, 20 ⁇ m or more, preferably 50 ⁇ m or more, and for example, 20 mm or less, preferably 10 mm or less.
  • the front-rear direction length L4 of the terminal portion 7 is, for example, 20 ⁇ m or more, preferably 50 ⁇ m or more, and for example, 20 mm or less, preferably 10 mm or less.
  • the interval between the adjacent terminal portions 7 is the same as the distance L3 between the rear end portions of the coil portion 6 described above.
  • the seed layer 19 is pressed against the first adhesive layer 11, and the coil pattern 5 is pressed into the first adhesive layer 11.
  • the first adhesive layer 11 is prepared.
  • the first adhesive layer 11 has a substantially flat plate shape extending in the surface direction.
  • the first adhesive layer 11 contains first magnetic particles and a first resin component. Specifically, the first adhesive layer 11 is prepared from a first adhesive resin composition containing first magnetic particles and a first resin component.
  • Examples of the first magnetic particles include soft magnetic particles and ferromagnetic particles, and preferably include soft magnetic particles.
  • the soft magnetic particles include particles composed of at least one selected from iron and iron alloys. Examples of such soft magnetic particles include magnetic stainless steel (Fe—Cr—Al—Si alloy) particles, sendust (Fe—Si—A1 alloy) particles, permalloy (Fe—Ni alloy) particles, silicon copper (Fe—).
  • Cu-Si alloy) particles Fe-Si alloy particles, Fe-Si-B (-Cu-Nb) alloy particles, Fe-Si-Cr alloy particles, Fe-Si-Cr-Ni alloy particles, Fe-Si-Cr Examples include alloy particles, Fe—Si—Al—Ni—Cr alloy particles, ferrite particles (specifically, Ni—Zn ferrite particles), carbonyl iron particles, and the like. Among these, from the viewpoint of magnetic properties, Fe—Si—Cr alloy particles and Ni—Zn ferrite particles are preferable.
  • the soft magnetic particles include those described in publicly known documents such as Japanese Patent Application Laid-Open Nos. 2016-108561, 2016-006853, 2016-6852, and 2016-006163. Examples include magnetic particles.
  • the volume ratio of the first magnetic particles in the first adhesive layer 11 is, for example, 15% by volume or more, preferably 20% by volume or more, more preferably 30% by volume or more, and further preferably 40% by volume or more. . If the capacity ratio of the first magnetic particles is equal to or higher than the lower limit, the inductance of the first module 1 can be improved.
  • the volume ratio of the first magnetic particles in the first adhesive layer 11 is, for example, 80% by volume or less, preferably 70% by volume or less, 65% by volume or less, preferably 60% by volume or less. If the volume ratio of the first magnetic particles is equal to or less than the above upper limit, the coil pattern 5 can be reliably pushed into the first adhesive layer 11 and the film forming property of the first adhesive resin composition is excellent. .
  • the mass ratio of the first magnetic particles in the first adhesive layer 11 is, for example, 44% by mass or more, preferably 53% by mass or more, more preferably 66% by mass or more, and further preferably 75% by mass or more. It is. If the mass ratio of the first magnetic particles is greater than or equal to the above lower limit, the inductance of the first module 1 can be improved.
  • the mass ratio of the first magnetic particles in the first adhesive layer 11 is, for example, 96% by mass or less, and preferably 94% by mass or less. If the mass ratio of the first magnetic particles is equal to or less than the above upper limit, the pressure-sensitive adhesiveness of the first adhesive layer 11 can be improved and the film forming property of the first adhesive resin composition is excellent.
  • the first resin component examples include the resin components described in the above-mentioned publicly known literature.
  • the resin component can be used alone or in combination.
  • an epoxy resin, a phenol resin and an acrylic resin are used in combination. If an epoxy resin, a phenol resin, and an acrylic resin are used in combination as the first resin component, the coil pattern 5 can be surely pushed into the first adhesive layer 11, and excellent flexibility and excellent heat resistance can be obtained. It can be applied to the adhesive layer 11.
  • the first adhesive resin composition is prepared by blending the first particles and the first resin component.
  • the first adhesive resin composition can also be blended with the additives (thermosetting catalyst, dispersant, rheology control agent, etc.) described in the above-mentioned known literature.
  • the 1st adhesive resin composition can also be prepared as a 1st adhesive resin composition solution containing a solvent further.
  • the first adhesive resin composition solution is applied to the surface of the release layer 10 (the lower surface in FIG. 2D). Thereafter, the first adhesive resin composition solution is dried by heating to remove the solvent.
  • the first adhesive layer 11 is disposed on the lower surface of the release layer 10.
  • the first adhesive layer 11 of the B stage is disposed on the lower surface of the release layer 10.
  • the first adhesive resin composition of the A stage becomes the B stage by drying the first adhesive resin composition solution.
  • the release layer 10 is a flexible separator having a substantially flat plate shape extending in a plane direction from a polymer material such as polyethylene terephthalate (PET). Moreover, the surface (lower surface) of the peeling layer 10 is subjected to an appropriate peeling treatment, for example.
  • the thickness of the release layer 10 is, for example, 15 ⁇ m or more, preferably 30 ⁇ m or more, and for example, 100 ⁇ m or less, preferably 75 ⁇ m or less.
  • the first adhesive layer 11 preferably has pressure-sensitive adhesiveness (tackiness).
  • the seed layer 19 is not yet in contact with the first adhesive layer 11 (described later), but the pressure-sensitive adhesive force PS3 (see FIG. 2F in the next step) of the seed layer 19 with respect to the first adhesive layer 11 is relatively high. high. Therefore, the first release layer 2 can be reliably peeled from the seed layer 19.
  • the following pressure-sensitive adhesive force PS satisfies, for example, the following formula.
  • PS1 ⁇ PS2 ⁇ PS3 PS1: Pressure sensitive adhesive force of the seed layer 19 to the first release layer 2
  • PS2 Pressure sensitive adhesive force of the first adhesive layer 11 to the coil pattern 5
  • PS3 Pressure sensitive adhesive force of the seed layer 19 to the first adhesive layer 11
  • the first adhesive layer 11 disposed on the lower surface of the release layer 10 is formed.
  • the release layer 10 and the first adhesive layer 11 are disposed to face the upper side of the coil pattern 5 so that the first adhesive layer 11 faces the coil pattern 5, and then, as shown in FIG. 2E, the first adhesive layer The lower surface of 11 is brought into contact with the upper surface of the coil pattern 5.
  • the first adhesive layer 11 is placed on the coil pattern 5 so that the lower surface of the first adhesive layer 11 and the upper surface of the seed layer 19 are separated by the thickness of the coil pattern 5. That is, the seed layer 19 is not in contact with the first adhesive layer 11.
  • the seed layer 19 is pressed against the first adhesive layer 11, and the coil pattern 5 is pushed into the first adhesive layer 11.
  • the seed layer 19 is pressed against the first adhesive layer 11 using a press such as a vacuum press.
  • the release layer 10 and the first adhesive layer 11, the coil pattern 5, the seed layer 19 and the first release layer 2 are installed in a press machine (not shown) including an upper plate and a lower plate.
  • a press machine including an upper plate and a lower plate.
  • the release layer 10 and the first adhesive layer 11 are installed on the upper plate, and the first release layer 2, the seed layer 19 and the coil pattern 5 are installed on the lower plate.
  • the press machine is driven to press the seed layer 19 against the first adhesive layer 11 and press the coil pattern 5 into the first adhesive layer 11 as shown by the arrow in FIG. 2D and FIG. 2F.
  • the third step is performed.
  • the coil pattern 5 digs into the first adhesive layer 11, and a portion of the first adhesive layer 11 that faces the coil pattern 5 in the thickness direction wraps around the side of the coil pattern 5.
  • the side surface of the coil pattern 5 is covered with the first adhesive layer 11.
  • the upper surface of the seed layer 19 and the lower surface of the first adhesive layer 11 are in contact with each other at portions other than the coil pattern 5.
  • the lower surface of the coil pattern 5 and the lower surface of the first adhesive layer 11 are flush with each other and are continuous in the surface direction.
  • the release layer 10 is peeled from the first adhesive layer 11 as indicated by the phantom lines and arrows in FIG. 2F.
  • the first laminate 23 including the first release layer 2, the seed layer 19, the coil pattern 5, and the first adhesive layer 11 is obtained.
  • the fourth step includes a fifth step (see FIG. 2G) for peeling the first release layer 2 from the seed layer 19 and a sixth step (see FIG. 2H) for removing the seed layer 19.
  • the fifth step and the sixth step are sequentially performed in this order.
  • each of the 5th process and the 6th process is explained in order.
  • the first peeling layer 2 is peeled from the seed layer 19 at the interface between the first peeling layer 2 and the seed layer 19 (interfacial peeling). Since the pressure-sensitive adhesive force PS1 of the first release layer 2 to the seed layer 19 is relatively low as described above, the upper surface of the first release layer 2 is easily separated from the lower surface of the seed layer 19.
  • the seed layer 19 is etched.
  • Etching includes, for example, wet etching and dry etching. From the viewpoint of productivity, wet etching is preferable. In the wet etching, the above-described second stacked body 24 is immersed in an etching solution.
  • the etching solution is not particularly limited as long as it is a solution that can etch (corrode) the seed layer 19, and examples thereof include a ferric chloride solution, a mixed solution of sulfuric acid and hydrogen peroxide, and the like. From the viewpoint of suppressing etching of the lower surface of the coil pattern 5 while etching, a mixed solution of sulfuric acid and hydrogen peroxide is used.
  • the etching time is, for example, 1 minute or more, preferably 2 minutes or more from the viewpoint of reliably removing the seed layer 19, and, for example, 10 minutes or less, preferably suppressing etching of the lower surface of the coil pattern 5. Is 5 minutes or less.
  • the lower surface of the coil pattern 5 is not substantially removed by etching. Note that slight etching of the coil pattern 5 is allowed. For example, etching of the lower end edge of the coil pattern 5 of 1 ⁇ m or less, further 0.1 ⁇ m or less is allowed.
  • the bottom surface of the coil pattern 5 and the first adhesive layer 11 is exposed by removing the seed layer 19 from the second stacked body 24.
  • the lower surface of the coil pattern 5 and the lower surface of the first adhesive layer 11 form an exposed surface exposed to the lower side. Further, the lower surface of the coil pattern 5 is exposed downward from the first adhesive layer 11.
  • the first module 1 including the first adhesive layer 11 and the coil pattern 5 is manufactured.
  • the lower surface of the first module 1, that is, the lower surfaces of the first adhesive layer 11 and the coil pattern 5 are exposed to the lower side.
  • the upper surface of the first module 1, that is, the upper surface of the first adhesive layer 11 is exposed to the upper side.
  • the first module 1 preferably includes only the first adhesive layer 11 and the coil pattern 5.
  • the first module 1 of the first embodiment is an intermediate member of the second module 31 (described later) in the second embodiment, and does not include the second adhesive layer 12 (described later, see FIG. 4B).
  • the first module 1 is a member that can be used industrially.
  • the first module 1 is heated to make the first adhesive layer 11 a C stage.
  • the thickness of the first module 1 is, for example, 750 ⁇ m or less, preferably 500 ⁇ m or less, more preferably 300 ⁇ m or less, and for example, 10 ⁇ m or more.
  • the thickness of the first module 1 is the distance between the lower surface of the coil pattern 5 and the upper surface of the first adhesive layer 11. If the thickness of the first module 1 is equal to or less than the upper limit described above, the first module 1 can be thinned.
  • the inductance of the first module 1 is, for example, 0.1 nH or more, preferably 0.5 nH or more, more preferably 1 nH or more.
  • the inductance is measured by an impedance analyzer (E4991B, 1 GHz, manufactured by KEYSIGHT). Subsequent inductance is measured by the same method as described above.
  • the first module 1 obtained by the manufacturing method of the first module 1 is used for, for example, wireless power transmission (wireless power feeding), wireless communication, a sensor, and the like. Since the lower surface of the coil pattern 5 is exposed, the first module 1 is preferably used for wireless power transmission and wireless communication.
  • the coil pattern 5 is pushed into the first adhesive layer 11 containing the first magnetic particles. It is possible to ensure high inductance while further reducing the thickness of 1.
  • the coil pattern 5 formed on the upper surface of the seed layer 19 is pushed into the first adhesive layer 11 in the third step, Even if the upper surface of the seed layer 19 is pressure-sensitively bonded to the first adhesive layer 11, as shown in FIGS. 2G and 2H, in the fourth step, the first release layer 2 is released from the seed layer 19, If 19 is etched, the lower surface of the coil pattern 5 and the 1st contact bonding layer 11 can be exposed reliably and smoothly.
  • the seed layer 19 is pressed against the first adhesive layer 11 so that the seed layer 19 Even if pressure-sensitive bonding is performed on the adhesive layer 11, the first release layer 2 is peeled off from the seed layer 19 in the fifth step as shown in FIG. 2G, and the seed layer is removed in the sixth step as shown in FIG. 2H. Since 19 is removed, the lower surfaces of the coil pattern 5 and the first adhesive layer 11 can be more reliably and smoothly exposed.
  • the coil pattern 5 formed on the upper surface of the seed layer 19 is pushed into the first adhesive layer 11, At this time, even if the upper surface of the seed layer 19 is in close contact with the first adhesive layer 11, as shown in FIG. 2H, the seed layer 19 is etched in the sixth step, so that the seed layer 19 is reliably and smoothly removed. Thus, the lower surfaces of the coil pattern 5 and the first adhesive layer 11 can be more reliably and smoothly exposed.
  • the inductance can be improved when the content ratio of the first magnetic particles in the first adhesive layer 11 is 15% by volume or more. Moreover, if the content rate of the 1st magnetic particle in the 1st contact bonding layer 11 is 80 volume% or less, the coil pattern 5 can be pushed in with respect to the 1st contact bonding layer 11 reliably. Therefore, it is possible to achieve both improvement in inductance and improvement in pushability of the coil pattern 5 with respect to the first adhesive layer 11.
  • the 1st resin component will be an epoxy resin, a phenol resin, and an acrylic resin, in the 3rd process, as shown in Drawing 2F, coil pattern 5 Can be reliably pushed into the first adhesive layer 11, and the first module 1 having excellent flexibility and excellent heat resistance can be manufactured.
  • the number of coil patterns 5 is 1, but the number is not particularly limited, and may be, for example, a plurality.
  • the first module 1 is manufactured by arranging the magnetic layer 18 on the upper surface of the first adhesive layer 11 (an example of the other surface in the thickness direction). Seven steps can be further provided.
  • the magnetic layer 18 is prepared.
  • the magnetic layer 18 is a core material for converging the magnetic field generated in the coil pattern 5 and amplifying the magnetic flux, and prevents magnetic flux leakage to the outside of the coil pattern 5 (or noise from the outside of the coil pattern 5). This is a shielding material for shielding the coil pattern 5.
  • the magnetic layer 18 has a substantially flat plate (sheet) shape extending in the plane direction.
  • the magnetic layer 18 contains second magnetic particles and a second resin component. Specifically, the magnetic layer 18 is formed from a magnetic resin composition containing second magnetic particles and a second resin component.
  • Examples of the second magnetic particles include the same magnetic particles as the first magnetic particles, and preferably, Sendust (Fe—Si—A1 alloy) particles are used from the viewpoint of magnetic properties.
  • Sendust (Fe—Si—A1 alloy) particles are used from the viewpoint of magnetic properties.
  • the physical properties such as the shape, holding power, average particle diameter, and average thickness of the second magnetic particles, the physical properties described in the above-mentioned known literatures are employed.
  • the volume ratio of the second magnetic particles in the magnetic layer 18 is, for example, 40% by volume or more, preferably 45% by volume or more, more preferably 48% by volume or more, and still more preferably 60% by volume or more. 90 volume% or less, preferably 85 volume% or less, and more preferably 80 volume% or less. If the capacity ratio of the second magnetic particles is equal to or higher than the above lower limit, the inductance of the first module 1 can be further improved. When the volume ratio of the second magnetic particles is equal to or less than the above upper limit, the film forming property of the magnetic resin composition is excellent.
  • the mass ratio of the second magnetic particles in the magnetic layer 18 is, for example, 80% by mass or more, preferably 83% by mass or more, more preferably 85% by mass or more, and for example, 98% by mass. % Or less, preferably 95% by mass or less, and more preferably 90% by mass or less.
  • the mass ratio of the second magnetic particles is equal to or greater than the lower limit described above, the magnetic characteristics of the first module 1 are excellent. If the mass ratio of the second magnetic particles is not more than the above upper limit, the magnetic resin composition is excellent.
  • the same resin component as the first resin component can be mentioned, and preferably, an epoxy resin, a phenol resin and an acrylic resin are used in combination. If an epoxy resin, a phenol resin, and an acrylic resin are used in combination as the second resin component, excellent flexibility and excellent heat resistance can be imparted to the magnetic layer 18.
  • a magnetic resin composition is prepared by blending the second magnetic particles and the second resin component.
  • the additive a thermosetting catalyst, a dispersing agent, a rheology control agent etc.
  • the magnetic resin composition can also be prepared as a magnetic resin composition solution further containing a solvent. And a magnetic resin composition solution is apply
  • a B-stage magnetic layer 18 is prepared.
  • the magnetic layer 18 is a B-stage, a plurality of magnetic layers 18 are stacked in the thickness direction, and they are hot-pressed in the thickness direction to form the C-stage magnetic layer 18.
  • the number of laminated magnetic layers 18 is not particularly limited, and is, for example, 2 or more, preferably 5 or more, and for example, 20 or less, preferably 10 or less.
  • the conditions described in the above-mentioned publicly known documents are appropriately adopted as the hot press conditions.
  • the average thickness of the magnetic layer 18 is, for example, 5 ⁇ m or more, preferably 10 ⁇ m or more, and, for example, 500 ⁇ m or less, preferably 250 ⁇ m or less.
  • the magnetic layer 18 is brought into contact with the upper surface of the first adhesive layer 11.
  • the magnetic layer 18 is pressure-bonded to the first adhesive layer 11.
  • the magnetic layer 18 is attached to the first adhesive layer 11 using a press such as a vacuum press.
  • the magnetic layer 18 is pressure-sensitively bonded to the upper surface of the first adhesive layer 11. Thereafter, if necessary, the first adhesive layer 11 is made to be a C stage, and the magnetic layer 18 is bonded to the first adhesive layer 11.
  • the first module 1 of this modification includes a first adhesive layer 11, a coil pattern 5, and a magnetic layer 18.
  • the first module 1 includes only the first adhesive layer 11, the coil pattern 5, and the magnetic layer 18.
  • the seventh step can be arranged with respect to the first adhesive layer 11 of the second stacked body 24 shown in FIG. 2G, or can be arranged with respect to the first adhesive layer 11 shown in FIG. 2H. .
  • This modification can also provide the same operational effects as the first embodiment.
  • the magnetic layer 18 is formed on the first adhesive layer 11 in the seventh step. Since it arrange
  • the release layer 10 and the first adhesive layer 11 are installed on the upper plate, and the first release layer 2, the seed layer 19 and the coil pattern 5 are installed on the lower plate.
  • the release layer 10 all of the release layer 10, the first adhesive layer 11, the first release layer 2, the seed layer 19 and the coil pattern 5 can be installed only on the upper plate.
  • all of the release layer 10, the first adhesive layer 11, the first release layer 2, the seed layer 19, and the coil pattern 5 can be installed only on the lower plate.
  • the first module 1 in which the lower surface of the coil pattern 5 is exposed is manufactured.
  • the manufacturing method of the second module 31 of the second embodiment covers the first adhesive layer 11 and the second adhesive by covering the lower surface of the coil pattern 5 with the second adhesive layer 12.
  • the adhesive layer 13 including the layer 12 further includes an eighth step of embedding the coil pattern 5.
  • the method of manufacturing the second module 31 of the second embodiment further includes a ninth step of disposing each of the two magnetic layers 18 on the upper surface and the lower surface of the adhesive layer 13, respectively. Prepare.
  • the second adhesive layer 12 has a substantially flat plate shape extending in the surface direction.
  • the second adhesive layer 12 contains the same first magnetic particles and the first resin component as the first adhesive layer 11.
  • the second adhesive layer 12 is formed from a second adhesive resin composition containing first magnetic particles and a first resin component.
  • the types and ratios of the first magnetic particles, the first resin component, and the additive in the second adhesive layer 12 are the same as those of the first magnetic particles and the first resin component in the first adhesive layer 11. .
  • the thickness of the second adhesive layer 12 is, for example, 1 ⁇ m or more, preferably 3 ⁇ m or more, and for example, 100 ⁇ m or less, preferably 50 ⁇ m or less.
  • a second adhesive resin composition is prepared.
  • the second adhesive resin composition can also be prepared as a second adhesive resin composition solution further containing a solvent.
  • the second adhesive resin composition solution is applied to the surface of the second release layer 15 (the upper surface in FIG. 4A).
  • the second adhesive resin composition solution is dried by heating to remove the solvent.
  • the second adhesive layer 12 is disposed on the upper surface of the second release layer 15.
  • the B-stage second adhesive layer 12 is disposed on the upper surface of the second release layer 15.
  • the second release layer 15 has the same shape, type, and physical properties as the release layer 10 described above.
  • the second release layer 15 and the second adhesive layer 12 are connected to the first adhesive layer 11 and the coil so that the second adhesive layer 12 faces the lower surface (exposed surface) of the coil pattern 5 and the lower surface of the first adhesive layer 11.
  • the pattern 5 is arranged to face the lower side.
  • the upper surface of the second adhesive layer 12 is brought into contact with the lower surface (exposed surface) of the coil pattern 5 and the lower surface of the first adhesive layer 11.
  • the second adhesive layer 12 is a B stage, the second adhesive layer 12 is pressure-sensitively bonded to the lower surface (exposed surface) of the coil pattern 5 and the lower surface of the first adhesive layer 11.
  • the adhesive layer 13 including the first adhesive layer 11 and the second adhesive layer 12 is obtained.
  • the content ratio of the first magnetic particles in the adhesive layer 13 is the same as the capacity ratio of the first magnetic particles in the first adhesive layer 11.
  • the adhesive layer 13 embeds the coil pattern 5 (specifically, the coil portion 6 indicated by the phantom line in FIG. 3).
  • the adhesive layer 13 covers the lower surface of the coil portion 6, while exposing the lower surface of the terminal portion 7. That is, the second adhesive layer 12 covers only the coil portion 6 in the coil pattern 5. On the other hand, the terminal portion 7 is exposed downward from the second adhesive layer 12 and is still pushed into the first adhesive layer 11.
  • the boundary between the first adhesive layer 11 and the second adhesive layer 12 can be observed visually (visually) or with a microscope or the like as drawn with a broken line. Alternatively, the boundary described above may not be visually recognized or observed.
  • the second release layer 15 is peeled from the second adhesive layer 12 (the lower surface of the adhesive layer 13).
  • the release layer 10 is released from the second adhesive layer 12 (the upper surface of the first adhesive layer 11).
  • Examples of the magnetic layer 18 include the magnetic layer 18 shown in the seventh step (see the phantom line in FIG. 2H) of the modification of the first embodiment.
  • the volume ratio of the second magnetic particles in the magnetic layer 18 is higher than the volume ratio of the first magnetic particles in the adhesive layer 13. Even in this case, the coil pattern 5 can be reliably pushed into the adhesive layer 13 as shown in FIG. 2F, while the magnetic layer 18 is formed into a sheet shape (preferably a C-stage, as shown in FIG. 4C). 4D, the magnetic layer 18 can be attached to the upper surface and the lower surface of the adhesive layer 13 (preferably, the adhesive layer 13 of the B stage).
  • each of the two magnetic layers 18 is pressure-sensitively bonded to the upper surface and the lower surface of the adhesive layer 13 as indicated by arrows in FIG. 4C.
  • the second module 31 is heated to make the adhesive layer 13 a C stage.
  • the adhesive layer 13, the coil pattern 5 having the coil portion 6 embedded in the adhesive layer 13, and the magnetic layer 18 disposed on the upper surface and the lower surface of the adhesive layer 13 are provided.
  • 2 module 31 is manufactured.
  • the thickness of the second module 31 is, for example, 1000 ⁇ m or less, preferably 700 ⁇ m or less, more preferably 500 ⁇ m or less, and, for example, 50 ⁇ m or more.
  • the thickness of the second module 31 is the distance between the upper surface and the lower surface of the adhesive layer 13.
  • the thickness of the second module 31 is the sum of the thickness of the first module 1 of the first embodiment, the thickness of the second adhesive layer 12, and the sum.
  • the thickness of the second module 31 includes the thickness of the coil pattern 5, the distance between the upper surface of the coil pattern 5 and the upper surface of the first adhesive layer 11 (adhesive layer 13), the lower surface of the coil pattern 5, and the second adhesive. It is the sum total with the distance between the lower surfaces of the layer 12 (adhesive layer 13).
  • the inductance of the second module 31 is, for example, 0.1 nH or more, preferably 0.5 nH or more, more preferably 1 nH or more.
  • the second module 31 of the second embodiment is preferably used for a sensor because the coil pattern 5 is embedded in the adhesive layer 13.
  • the adhesive layer 13 for embedding the coil pattern 5 is formed in the eighth step, so that the inductance of the second module 31 is reduced. This can be further improved.
  • the magnetic layer 18 is disposed on the upper surface and the lower surface of the adhesive layer 13 in the ninth step.
  • the inductance can be further improved.
  • the magnetic layer 18 According to the method for manufacturing the second module 31, if the content ratio of the second magnetic particles in the magnetic layer 18 is as high as 40% by volume or more, the magnetic layer 18 further improves the inductance. be able to.
  • the second module 31 is composed of the coil pattern 5 and the adhesive layer 13 in which the coil pattern 5 is embedded without including the magnetic layer 18. You can also. In that case, the manufacturing method of the second module 31 does not include the ninth step shown in FIG. 4D.
  • the number of coil patterns 5 is 1, but the number is not particularly limited, and may be, for example, a plurality. If the number of the coil patterns 5 is plural, the second module 31 can be suitably used as a sensor.
  • the third module 33 includes a support layer 14 in addition to the coil pattern 5 and the first adhesive layer 11.
  • the support layer 14 is a base sheet (thin film) that supports the coil pattern 5 from below.
  • the support layer 14 has a substantially rectangular sheet shape in plan view.
  • the support layer 14 forms the lower surface of the third module 33.
  • the support layer 14 is in contact with the lower surface of the coil pattern 5 and the lower surface of the first adhesive layer 11.
  • the material of the support layer 14 is a material having toughness, and examples thereof include resins such as polyimide, polyester, polyolefin, and fluororesin, and preferably polyimide.
  • the thickness of the support layer 14 is, for example, 20 ⁇ m or less, preferably 10 ⁇ m or less, and for example, 0.1 ⁇ m or more, preferably 0.5 ⁇ m or more.
  • the support layer 14 is disposed (attached) on the lower surface of the first module 1 of the first embodiment shown in FIG. 2H.
  • the third module 33 is heated or heated while being pressed, so that the first adhesive layer 11 is changed to a C stage.
  • the third module 33 of the third embodiment is an intermediate member of the fourth module 34 (described later) in the fourth embodiment, and does not include the second adhesive layer 12 (described later, see FIG. 5B).
  • the third module 33 is an industrially usable member.
  • the manufacturing method of the third module 33 since the coil pattern 5 is supported by the support layer 14, the displacement of the coil pattern 5 during the above-described C-staging process can be suppressed. The positional accuracy can be improved. Therefore, it is possible to manufacture the third module 33 having the designed inductance while preventing the above-described inductance deviation.
  • the third module 33 in which the lower surface of the support layer 14 is exposed is manufactured.
  • the fourth module 34 of the fourth embodiment is manufactured by covering the lower surface of the support layer 14 with the second adhesive layer 12, so that the first adhesive layer 11 and the second adhesive layer are bonded.
  • An eleventh step of sandwiching the coil pattern 5 and the support layer 14 in the thickness direction by the adhesive layer 13 including the layer 12 is further provided.
  • the fourth module 34 manufacturing method of the fourth embodiment further includes a twelfth step of disposing each of the two magnetic layers 18 on the upper surface and the lower surface of the adhesive layer 13, respectively. Prepare.
  • the lower surface of the support layer 14 is covered with the second adhesive layer 12.
  • An adhesive layer 13 including the first adhesive layer 11 and the second adhesive layer 12 is obtained.
  • the coil pattern 5 and the support layer 14 are sandwiched in the vertical direction by the adhesive layer 13.
  • the third release layer 15 is peeled from the second adhesive layer 12 (the lower surface of the adhesive layer 13).
  • the release layer 10 is released from the first adhesive layer 11 (the upper surface of the adhesive layer 13).
  • the two magnetic layers 18 are respectively disposed on the upper surface and the lower surface of the adhesive layer 13.
  • each of the two magnetic layers 18 is pressure-sensitively bonded to the upper surface and the lower surface of the adhesive layer 13 as indicated by arrows in FIG. 5C.
  • the fourth module 34 is heated or heated while being pressed to make the adhesive layer 13 a C stage.
  • the adhesive layer 13, the coil pattern 5 and the support layer 14 sandwiched between the adhesive layers 13 in the thickness direction, and the magnetic layer 18 disposed on the upper surface and the lower surface of the adhesive layer 13 are provided.
  • a fourth module 34 is manufactured.
  • the adhesive layer 13 sandwiching the coil pattern 5 and the support layer 14 is formed in the eleventh step, so that the positional accuracy of the coil pattern 5 is improved.
  • the inductance of the fourth module 34 can be further improved.
  • Example 1 (Example corresponding to the second embodiment) (First step) As shown in FIG. 2A, a seed layer 19 having a thickness of 1.5 ⁇ m made of copper was formed on the upper surface of the first release layer 2 made of stainless steel (SUS304) having a thickness of 50 ⁇ m by electrolytic plating.
  • SUS304 stainless steel
  • the first step of preparing the seed layer 19 on the upper surface of the first release layer 2 was performed.
  • the coil pattern 5 was formed by plating that supplies power from the seed layer 19.
  • the coil pattern 5 was formed by the additive method. That is, first, as shown in FIG. 2B, a photoresist is disposed on the entire upper surface of the seed layer 19, and then the photoresist is photo-processed to form a coil on the upper surface of the seed layer 19 as shown in FIG. 1A. A plating resist 29 having an inverted pattern of pattern 5 was disposed. Subsequently, as shown in FIG. 2C, the coil pattern 5 was formed on the upper surface of the seed layer 19 exposed from the plating resist 29 by plating with power supplied from the seed layer 19. Subsequently, as shown in FIG. 2D, the plating resist 29 was peeled off.
  • the coil pattern 5 has an inner dimension L1: 1900 ⁇ m, an outer dimension L2: 3100 ⁇ m, a width W1: 600 ⁇ m, a distance L3 between two rear end portions L3: 600 ⁇ m, and a width W2. : Two terminal portions 7 of 200 ⁇ m are continuously provided.
  • a first adhesive layer 11 was prepared.
  • first adhesive layer 11 To prepare the first adhesive layer 11, first, according to Table 1, each component is blended to prepare an adhesive resin composition (first adhesive resin composition), and then the adhesive resin composition is dissolved in methyl ethyl ketone. Thus, an adhesive resin composition solution having a solid content concentration of 35% by mass was prepared. Next, the adhesive resin composition solution was applied to the surface of a 50 ⁇ m thick release layer 10 (model number “MRA50”, manufactured by Mitsubishi Plastics) made of PET, and then dried at 110 ° C. for 2 minutes. Thereby, as shown to FIG. 2D, the 1st contact bonding layer 11 of B stage with an average thickness of 45 micrometers was formed.
  • first adhesive resin composition an adhesive resin composition
  • an adhesive resin composition solution having a solid content concentration of 35% by mass was prepared.
  • the adhesive resin composition solution was applied to the surface of a 50 ⁇ m thick release layer 10 (model number “MRA50”, manufactured by Mitsubishi Plastics) made of PET, and then dried at 110 ° C. for 2 minutes. Thereby, as shown
  • the release layer 10 and the first adhesive layer 11 were disposed on the upper side of the coil pattern 5 so that the first adhesive layer 11 faced downward.
  • the release layer 10 and the first adhesive layer 11 were disposed on the upper plate of the vacuum press, and the first release layer 2, the seed layer 19 and the coil pattern 5 were disposed on the lower plate of the vacuum press.
  • the vacuum press was driven to press the seed layer 19 against the first adhesive layer 11 and press the coil pattern 5 into the first adhesive layer 11 as shown in FIG. 2F.
  • the upper surface of the coil pattern 5 once contacts the lower surface of the first adhesive layer 11 and continuously as shown in FIG. 2F. And pressed into the first adhesive layer 11.
  • the seed layer 19 and the first adhesive layer 11 were in contact with each other at portions other than the coil pattern 5.
  • a fifth step for peeling the first release layer 2 from the seed layer 19 and a sixth step for removing the seed layer 19 (see FIG. 2H).
  • a fifth step for peeling the first release layer 2 from the seed layer 19
  • a sixth step for removing the seed layer 19 (see FIG. 2H).
  • the first release layer 2 was peeled off from the lower surface of the seed layer 19 so that the interface release occurred in the first release layer 2 and the seed layer 19.
  • the seed layer 19 was removed by etching.
  • a mixed solution of sulfuric acid and hydrogen peroxide was used as an etching solution, and the etching time was 3 minutes.
  • the first module 1 was obtained as an intermediate member for obtaining a second module 31 described later.
  • the first module 1 includes a first adhesive layer 11 and a coil pattern 5 pushed into the first adhesive layer 11, and is supported (protected) by the release layer 10.
  • a second adhesive layer 12 was prepared on the upper surface of the second release layer 15 according to the same method as the first adhesive layer 11 of the B stage having an average thickness of 40 ⁇ m.
  • the upper surface of the second adhesive layer 12 was pressure-sensitive bonded to the lower surface of the coil portion 6 and the lower surface of the first adhesive layer 11.
  • the eighth step of forming the adhesive layer 13 including the first adhesive layer 11 and the second adhesive layer 12 and embedding the coil portion 6 was performed.
  • the release layer 10 was peeled from the first adhesive layer 11 as indicated by the arrow on the lower side of FIG. 4B. 4B, the second release layer 15 was peeled from the second adhesive layer 12. As shown by the upper arrow in FIG.
  • each component is blended to prepare a magnetic resin composition, and then the magnetic resin composition is dissolved in methyl ethyl ketone, whereby a magnetic resin composition having a solid content concentration of 45% by mass is prepared.
  • a product solution was prepared.
  • the magnetic resin composition solution was applied to a release substrate (not shown), and then dried at 110 ° C. for 2 minutes.
  • a B-stage magnetic layer 18 (average thickness 45 ⁇ m) was prepared.
  • the magnetic layer 18 was peeled from the peeling substrate, and 8 layers of the magnetic layer 18 were laminated and heat-cured with a hot press under the conditions of 175 ° C., 30 minutes and 10 MPa.
  • a C-stage magnetic layer 18 (average thickness 200 ⁇ m) was produced.
  • each of the two magnetic layers 18 was pressure-sensitive bonded (adhered) to the upper surface of the adhesive layer 13 (the upper surface of the first adhesive layer 11) and the lower surface (the lower surface of the second adhesive layer 12). .
  • the ninth step was performed.
  • the second module 31 including the adhesive layer 13, the coil pattern 5 having the coil portion 6 embedded in the adhesive layer 13, and the magnetic layer 18 disposed on the upper surface and the lower surface of the adhesive layer 13 was manufactured.
  • Examples 2 to 6 and Comparative Example 1 Except having changed the adhesive resin composition according to Table 1, it processed similarly to Example 1, the 1st module 1 was manufactured, and the 2nd module 31 was manufactured subsequently.
  • Example 2 As shown in FIG. 6A, the second module 31 was manufactured in the same manner as in Example 1 except that the coil pattern 5 was formed on the upper surface of the release layer 45 by the subtractive method.
  • a pressure-sensitive adhesive release layer 45 is prepared, and then a conductor layer made of copper having a thickness of 50 ⁇ m is disposed on the upper surface of the release layer 45, and then etched.
  • the coil pattern 5 was formed.
  • the coil pattern 5 was then pushed into the first adhesive layer 11.
  • the release layer 45 was pressure-sensitively bonded to the first adhesive layer 11.
  • Ni-Zn ferrite particles Soft magnetic particles manufactured by JFE Ferrite Co., model number KNI-109, average particle size 1.5 ⁇ m Fe-Si-Cr alloy particles Soft magnetic particles, manufactured by Nippon Atomizing Co., Ltd., average particle size 8 ⁇ m, product name (iron alloy powder SFR-FeSiCr) Fe-Si-Al alloy particles Soft magnetic particles, flat, coercive force in the direction of easy magnetization: 3.9 (Oe), average particle diameter 40 ⁇ m, average thickness 1 ⁇ m Cresol novolac type epoxy resin Epoxy equivalent 199 g / eq.
  • acrylic resin Carboxyl group and hydroxy group modified ethyl acrylate-butyl acrylate-acrylonitrile copolymer Combined, weight average molecular weight 900,000, specific gravity 1.00, trade name “Taisan Resin SG-70L” (resin content 12.5 mass%), thermosetting catalyst 2-phenyl-1H-imidazole 4 manufactured by Nagase ChemteX Corporation , 5-dimethanol, specific gravity 1.33, trade name “Cureazole 2PHZ-PW”, Shikoku Kasei Co., Ltd. Dispersant polyether phosphate ester, acid value 17, specific gravity 1.03, trade name “HIPLAAD ED152”, Enomoto Kasei An adhesive resin composition was prepared according to the description in Table 1 of the company.
  • Indentability of the coil pattern to the first adhesive layer The indentability of the coil pattern 5 to the first adhesive layer 11 in the third step shown in FIG. 2H was evaluated according to the following criteria. ⁇ : The coil pattern 5 was reliably pushed into the first adhesive layer 11. ⁇ : The coil pattern 5 was pressed into the first adhesive layer 11, but the yield was 50%.
  • Magnetic permeability and inductance Magnetic permeability was measured by a one-turn method (frequency: 10 MHz) using an impedance analyzer (manufactured by KEYSIGN, "E4991B” 1 GHz model).
  • the inductance was measured with an impedance analyzer (manufactured by KEYLIGHT, “E4991B” 1 GHz model).
  • modules used for wireless power transmission (wireless power feeding), wireless communication, sensors, and the like are manufactured.

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  • Manufacturing Cores, Coils, And Magnets (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'un module qui consiste : en une première étape de préparation d'une couche de germe qui est disposée sur une surface d'une première couche d'écaillage, ladite surface étant dans la direction de l'épaisseur ; en une deuxième étape de formation, par placage au moyen d'une puissance provenant de la couche de germe, d'un motif conducteur sur une surface de la couche de germe, ladite surface étant dans la direction de l'épaisseur ; en une troisième étape de pression du motif conducteur dans une première couche adhésive contenant de premières particules magnétiques ; et en une quatrième étape d'exposition du motif conducteur, et de l'autre surface de la première couche adhésive, ladite autre surface étant dans la direction de l'épaisseur.
PCT/JP2017/041229 2016-12-07 2017-11-16 Procédé de fabrication de module WO2018105348A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201780075984.1A CN110050315B (zh) 2016-12-07 2017-11-16 模块的制造方法
KR1020197014688A KR20190092389A (ko) 2016-12-07 2017-11-16 모듈의 제조 방법
EP17878408.8A EP3553801A4 (fr) 2016-12-07 2017-11-16 Procédé de fabrication de module
US16/466,720 US20200066441A1 (en) 2016-12-07 2017-11-16 Producing method of module

Applications Claiming Priority (4)

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JP2016237740 2016-12-07
JP2016-237740 2016-12-07
JP2017213828A JP6967428B2 (ja) 2016-12-07 2017-11-06 モジュールの製造方法
JP2017-213828 2017-11-06

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WO2018105348A1 true WO2018105348A1 (fr) 2018-06-14

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023157833A1 (fr) * 2022-02-16 2023-08-24 日東電工株式会社 Inducteur et son procédé de fabrication

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JPH08162352A (ja) * 1994-10-04 1996-06-21 Matsushita Electric Ind Co Ltd 転写導体の製造方法およびグリーンシート積層体の製造方法
JP2004241538A (ja) * 2003-02-05 2004-08-26 Matsushita Electric Ind Co Ltd 積層部品およびその製造方法
JP2004327612A (ja) * 2003-04-23 2004-11-18 Tdk Corp 導体線路を有する基板及びその製造方法、並びに電子部品
JP2008166407A (ja) * 2006-12-27 2008-07-17 Tdk Corp 電子素子及び電子素子の製造方法
JP2016006853A (ja) 2014-05-29 2016-01-14 日東電工株式会社 軟磁性熱硬化性フィルムおよび軟磁性フィルム
JP2016006852A (ja) 2014-05-29 2016-01-14 日東電工株式会社 軟磁性樹脂組成物および軟磁性フィルム
JP2016006163A (ja) 2014-05-29 2016-01-14 日東電工株式会社 軟磁性フィルム
JP2016108561A (ja) 2014-12-04 2016-06-20 日東電工株式会社 軟磁性樹脂組成物および軟磁性フィルム

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JPH08162352A (ja) * 1994-10-04 1996-06-21 Matsushita Electric Ind Co Ltd 転写導体の製造方法およびグリーンシート積層体の製造方法
JP2004241538A (ja) * 2003-02-05 2004-08-26 Matsushita Electric Ind Co Ltd 積層部品およびその製造方法
JP2004327612A (ja) * 2003-04-23 2004-11-18 Tdk Corp 導体線路を有する基板及びその製造方法、並びに電子部品
JP2008166407A (ja) * 2006-12-27 2008-07-17 Tdk Corp 電子素子及び電子素子の製造方法
JP2016006853A (ja) 2014-05-29 2016-01-14 日東電工株式会社 軟磁性熱硬化性フィルムおよび軟磁性フィルム
JP2016006852A (ja) 2014-05-29 2016-01-14 日東電工株式会社 軟磁性樹脂組成物および軟磁性フィルム
JP2016006163A (ja) 2014-05-29 2016-01-14 日東電工株式会社 軟磁性フィルム
JP2016108561A (ja) 2014-12-04 2016-06-20 日東電工株式会社 軟磁性樹脂組成物および軟磁性フィルム

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023157833A1 (fr) * 2022-02-16 2023-08-24 日東電工株式会社 Inducteur et son procédé de fabrication

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