WO2018029934A1 - Dispositif d'alimentation de résine, unité de presse, et dispositif de moulage de résine - Google Patents

Dispositif d'alimentation de résine, unité de presse, et dispositif de moulage de résine Download PDF

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Publication number
WO2018029934A1
WO2018029934A1 PCT/JP2017/018496 JP2017018496W WO2018029934A1 WO 2018029934 A1 WO2018029934 A1 WO 2018029934A1 JP 2017018496 W JP2017018496 W JP 2017018496W WO 2018029934 A1 WO2018029934 A1 WO 2018029934A1
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WO
WIPO (PCT)
Prior art keywords
resin
unit
workpiece
work
press
Prior art date
Application number
PCT/JP2017/018496
Other languages
English (en)
Japanese (ja)
Inventor
吉和 村松
秀作 田上
雅彦 藤沢
健司 木田
Original Assignee
アピックヤマダ株式会社
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Publication of WO2018029934A1 publication Critical patent/WO2018029934A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
    • B29C31/06—Feeding of the material to be moulded, e.g. into a mould cavity in measured doses, e.g. by weighting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Definitions

  • the present invention includes, for example, a resin supply device that mounts a liquid resin on a film and supplies the resin to a press unit, a press unit including a plurality of press units and a transfer unit that clamps and molds a workpiece and resin, and a resin using these units
  • the present invention relates to a molding apparatus.
  • ⁇ 8 inch is used for molding WLP (Wafer Level Package) using a wafer as a workpiece or PLP (Panel Level Package) using a substrate as a large panel.
  • resin molding is performed using a semiconductor wafer of ⁇ 12 inch size, or resin molding is performed using a rectangular panel (substrate, carrier, etc.) of ⁇ 300 mm to ⁇ 600 mm size (each side is 300 mm to 600 mm size). It has been broken.
  • a module type compression molding apparatus When molding a workpiece such as WLP or PLP, for example, a module type compression molding apparatus is used.
  • a conventional compression molding apparatus for example, WO2013 / 069496
  • a workpiece supply unit, a molded product storage unit, and a resin supply unit are arranged in the arrangement direction.
  • the object of the present invention is to solve the above-mentioned problems of the prior art, reduce the installation area, reduce the work area, improve the operability, and improve the operability.
  • An object of the present invention is to provide a press unit that realizes improvement in molding quality by making it uniform and a resin mold apparatus that is compact, multifunctional, and highly expandable.
  • the present invention comprises the following arrangement. Filled with a liquid film, a roll film container that accommodates a roll film wound in a long shape, a film cut-out part that cuts the roll film drawn out from the roll film container into a strip, and a liquid resin A syringe supply unit that holds a plurality of syringes, and a resin mounting unit that mounts the liquid resin on a single-wafer film prepared by being cut by the film cutting unit, and the roll film storage unit and the syringe supply And the resin mounting part is arranged adjacent to the syringe supply part.
  • a work area and an installation area can be reduced by arrange
  • the resin supply apparatus a press unit in which the liquid resin and the sheet film and a press unit for clamping the workpiece and resin molding are arranged, and the sheet film on which the liquid resin is mounted It is preferable to include a transport unit that transports the to the press unit. Thereby, the apparatus area of the resin mold apparatus can be reduced.
  • a press unit in which a press part for clamping a work and resin and resin molding is disposed; a housing part for housing the work and a molded product after resin mold molding;
  • a workpiece processing unit having a processing unit for performing post-processing on a molded product, a horizontal articulated robot for transporting the workpiece or the molded product between the container and the processing unit, and advancing / retreating with respect to the press unit
  • a workpiece loader for delivering the workpiece or the molded product, a conveyance region for the workpiece loader to convey the workpiece or the molded product, and a conveyance region for the horizontal articulated robot to convey the workpiece or the molded product.
  • a plurality of the pressing units provided adjacent to each other and a region adjacent to any of the plurality of pressing units are provided, and the work loader is conveyed in a direction perpendicular to the advancing / retreating direction of the work loader. It is preferable that the said processing part is connected to the said one end side in the said conveyance part while providing the said delivery part in the one end side in the said conveyance part.
  • a press unit in which a press part for clamping a work and resin and resin molding is disposed; a resin supply part for preparing the resin to be supplied to the press unit; and supplying the work to the press unit, and the work
  • a workpiece processing unit for accommodating a molded product molded with the resin, wherein the workpiece processing unit is configured such that an arm is rotatable with respect to a vertical axis, and is provided at a tip of the arm.
  • a horizontal articulated robot that changes the posture of the workpiece or the molded product by rotating the hand body in the roll direction of the arm while holding the workpiece or the molded product on the hand body of the robot hand. It is characterized by that.
  • the state of the workpiece or the molded product facing upward can be reversed downward and resin molding can be performed at the press portion.
  • the robot hand is provided on the opposite side of the fixed claw portion with the plurality of fixed claw portions provided at the tip of the hand body and the workpiece or the molded product, and can be moved forward and backward to the fixed claw portion. It is preferable to include a movable claw portion configured. Thereby, the said workpiece
  • the robot hand includes a suction hole that sucks the work or the molded product to the hand body, and a suction circuit that sucks the hand body from the suction hole.
  • work or the said molded product can be hold
  • a press unit that is provided in a resin molding apparatus that clamps a workpiece and resin and molds the resin, and the first press unit and the second press unit are arranged to face each other so as to intersect the transport direction of the transport unit, the transport unit Is a work loader for supplying a work to either the first press part or the second press part and taking out a molded product formed from either the first press part or the second press part,
  • the work loader includes a movable rail.
  • the press unit has a configuration in which the first press unit and the second press unit are arranged to face each other so as to intersect the transport direction of the transport unit. It does not become long in the direction and can be arranged compactly. Moreover, since the distance by which a work loader moves on a rail is the same in a 1st press part and a 2nd press part, the conveyance distance of a workpiece
  • the work loader includes a work loader body that reciprocates on the rail, a work hand that holds either the work or the molded product, and the hand that rotates the hand relative to the work loader body. It is preferable to have a hand drive unit that moves forward and backward. As a result, the work loader body reciprocates on the rail, and the hand drive unit rotates the work hand to a position facing each press unit and moves it back and forth, thereby moving the workpiece to the mold mold or supplying the molded product. Removal can be performed.
  • the transport unit includes a resin loader that supplies resin to either the first press unit or the second press unit, and the resin loader is configured to be movable while sharing the rail. It is preferable to include a main body, a resin hand for holding the resin, and a hand drive unit that rotates the resin hand relative to the resin loader main body and moves the resin hand forward and backward with respect to the press portions.
  • the resin loader body reciprocates in common with the work loader body and the rail, and the hand drive unit rotates the resin hand to a position facing each press unit, and moves forward and backward to move against the mold.
  • the resin can be supplied. At this time, the distance moved by holding the resin by the resin loader is the same in the first press portion and the second press portion.
  • any one of the press units described above a resin supply unit that supplies the resin to the press unit, a work processing unit that supplies the work to the press unit and accommodates the molded product,
  • the work processing unit is arranged on one end side in the longitudinal direction of the rail of the press unit, and the resin supply unit is arranged on the other end side.
  • the first press unit and the second press unit are arranged to face each other so as to intersect with the rail of the conveyance unit, and the workpiece processing unit and the resin supply unit are arranged to be connected to both sides of the rail of the conveyance unit. Therefore, the rail can be shared by the first press part and the second press part for work conveyance and resin conveyance. Therefore, the work loader conveyance distance required for the workpiece supply operation and the molded product storage operation from the workpiece processing unit to the first and second press units can be processed in the same short time, and the resin from the resin supply unit to the first and second press units Similarly, the transport distance of the resin loader required for the supply operation can be processed in a short time.
  • the expandability of the pre-processing function or the post-processing function in the work processing unit is high, and the versatility is improved because the resin type and the supply method of the resin supply unit can be arbitrarily selected.
  • the resin supply unit includes a film cut-out unit that cuts a film drawn from a roll film into a strip shape, and a film cut into the film cut-out unit, which is granular, powdery, liquid, gel-like, or sheet-like
  • a resin mounting portion for mounting the resin wherein the resin loader receives the film on which the resin is mounted from the resin mounting portion and shares the rail with the first press portion and the first It is preferable to supply to one of the two press sections.
  • any one of the first press part and the second press part can be performed by the resin loader while the resin in the form of granules, powder, liquid, gel, or sheet is mounted on the film cut into strips.
  • the amount of resin flow is small and uniform and can be supplied without excess or deficiency.
  • the transport distance of the resin from the resin mounting portion to the first press portion and the second press portion by the resin loader is the same, it can be transported while suppressing variation due to the thixotropy change of the resin.
  • a first resin supply unit and a second resin supply unit are disposed to face the resin supply unit with the transport unit interposed therebetween, and the resin loader includes the first resin supply unit and the second resin supply unit.
  • the film on which the resin is mounted may be received from any of the sections and supplied to either the first press section or the second press section. Thereby, the cycle time of the resin supply supplied from the resin supply unit can be shortened and the productivity can be improved. Moreover, the resin of a different aspect according to a workpiece
  • the workpiece processing unit takes out a workpiece before molding from a workpiece storage unit that holds a plurality of molded products before molding, a molded product storage unit that stores a plurality of molded products after molding, and the workpiece storage unit. And a second transport unit that transfers the molded product from the work loader and stores the molded product in the molded product storage unit. As a result, the second transport unit delivers the work from the work storage unit to the work loader and stores the molded product from the work loader to the molded product storage unit.
  • the storage can be automated.
  • the work processing unit performs pre-processing for performing at least one of thickness measurement of the work, arrangement of the work, or reversing of the work as a pre-process for the work before forming taken out from the work storage unit.
  • pre-processing for the molded product taken from the unit and the work loader among the reverse of the molded product, the inspection of the molded product, the post-cure of the molded product or the cooling of the molded product, and the storage of the film after use And a post-processing unit that performs at least one process.
  • the installation area can be reduced, the work area can be reduced, the operability can be improved, and the work quality and the resin transport distance can be made uniform to improve the molding quality.
  • the above-described resin supply device and press unit it is possible to provide a compact and multifunctional resin mold device having high expandability.
  • FIG. 5 is an explanatory plan view illustrating a workpiece transfer operation subsequent to FIG. 4.
  • FIG. 6 is an explanatory plan view showing a workpiece transfer operation to the first press section following FIG. 5.
  • FIG. 7 is an explanatory plan view showing a resin transport operation to the first press section following FIG. 6.
  • FIG. 8 is an explanatory plan view showing a workpiece transfer operation of the next workpiece following FIG. 7.
  • FIG. 9 is an explanatory plan view showing a workpiece transfer operation to the second press unit following FIG. 8.
  • a resin supply apparatus such as a large semiconductor wafer or metal carrier such as 8 inches or 12 inches, a large rectangular panel having a side exceeding 300 mm, or a resin substrate, for example, is used.
  • the film will be described using a resin mold apparatus that compresses and forms a single-wafer film having a larger size.
  • the single wafer film includes a film formed by cutting a long or large size film into a predetermined size in addition to an individual film previously formed into a predetermined size.
  • the resin mold apparatus will be described with the lower mold as a movable mold and the upper mold as a fixed mold.
  • the resin mold apparatus includes a mold opening / closing mechanism, but the illustration is omitted, and the configuration of the mold will be mainly described.
  • a control unit controls various parts to be described later to perform various operations, and receives an operation from an operator by an operation unit (not shown), and a display unit (not shown). ) To display and notify.
  • a work processing unit Uw work processing unit
  • a press unit Up press unit
  • a resin supply unit Ud resin supply unit
  • the configuration of the press unit Up will be described.
  • the first press part P1 and the second press part P2 that clamp the workpiece W and the resin R and mold the resin are opposed to each other so as to intersect (orthogonal) the transport direction of the transport unit C.
  • the transport unit C is formed in a rectangular shape in plan view
  • the first press unit P1 is connected to the first side surface (upper side surface in FIG. 1) of the transport unit C
  • the second press unit P2 Are connected to the first side surface and the second side surface (lower side surface in FIG. 1) facing the rail short direction of the transport unit C.
  • the conveyance unit C is provided with a work loader 1, a resin loader 6, and a rail 2 on which the work loader 1 and the resin loader 6 can move.
  • the work loader 1 supplies the work W to one of the first press part P1 and the second press part P2, and takes out the molded product M formed from either the first press part P1 or the second press part P2.
  • the transport unit C includes other units (work processing unit Uw, resin supply unit Ud), which will be described later, on a third side surface in the longitudinal direction (left and right side surfaces in FIG. 1) sandwiched between the first side surface and the second side surface. Connected.
  • the first press part P1 and the second press part P2 in the press unit Up include a molding die 21 for compression molding that opens and closes to a known mold opening / closing mechanism that raises and lowers the platen relative to the guide posts 20 provided at the four corners.
  • FIG. 11 shows a mold 21 that assumes a round workpiece W such as a semiconductor wafer or a carrier.
  • the upper mold fixing platen 22 is provided with an upper mold 23.
  • the workpiece W is conveyed by a workpiece loader 1 described later, and is transferred from the workpiece hand 4 (see FIG. 2) to the clamp surface of the upper mold 23, and the workpiece W is sucked and held.
  • the lower mold base 24 is mounted on the lower mold movable platen 24.
  • a lower mold cavity piece 26 is supported at the center of the lower mold base 25.
  • the upper surface of the lower mold cavity piece 26 constitutes the bottom of the lower mold cavity.
  • An annular lower mold movable clamper 27 is floatingly supported by a coil spring 28 around the lower mold cavity piece 26.
  • the sliding surface (inner peripheral surface) with the lower mold cavity piece 26 of the lower mold movable clamper 27 forms a lower mold cavity side portion.
  • the lower mold 29 is constituted by the lower mold cavity piece 26 and the lower mold movable clamper 27 disposed so as to surround the lower mold cavity piece 26. With such a configuration, the configuration shown in the figure can be said to be a “lower cavity type” mold configuration having a cavity in the lower mold.
  • the lower mold 29 is delivered by the resin loader 6 described later while the resin R is mounted on the sheet film F.
  • the sheet F is transferred to the lower mold 29 with the resin mounting surface positioned so as to be the bottom of the lower mold cavity (the upper surface of the lower mold cavity piece 26), and the sheet F is transferred to the lower mold clamping surface and the lower mold. Adsorbed and held at the bottom of the cavity.
  • a known ball that links the lower mold movable platen 24 to the upper mold fixed platen 22 and closes the mold 21 to the clamping force is provided on the back side of the lower mold movable platen 24 (downward in the drawing).
  • a screw mechanism is provided.
  • a plurality of (for example, four) ball screw mechanisms are provided on the inner side of the guide post 20, and are expanded and contracted as indicated by arrows in FIG. 11, for example. Accordingly, the lower mold movable platen 24 can be moved up and down in a predetermined inclination state, and when a plurality of workpieces W are molded, the mold is clamped by adjusting the inclination of the lower mold movable platen 24 according to the variation in the thickness of each workpiece.
  • the operation of the first press part P1 and the second press part P2 shown in FIG. 1 may be performed individually by providing an operation part (not shown), respectively, but to reduce the burden on the operator.
  • the operation on the other side can be made possible by the operation on one side, or the inside of the press parts P1, P2 on the side of the operation part on the other side can be monitored by the operation part on the one side.
  • FIG. 12 shows a configuration example of a mold 21 for simultaneously compression-molding a plurality of substrates as the work W.
  • the workpiece W is assumed to be an interposer substrate having a size of about 300 mm ⁇ 100 mm, and a plurality (two sets) of substrates are adsorbed and held on the clamp surface of the upper mold 23.
  • the workpiece W is conveyed by a workpiece loader 1 described later, transferred from the workpiece hand 4 (see FIG. 2) to the clamp surface of the upper mold 23, and the workpiece W is sucked and held, and a plurality of substrates are compression-molded at a time. It will be.
  • the lower mold 29 is delivered by the resin loader 6 described later while the resin R is mounted on the sheet film F.
  • the resin loader 6 conveys the single-wafer film F loaded with two sets of the resin R.
  • Each sheet F is transferred to the lower mold 29 with the resin mounting surface positioned so as to be the bottom of the lower mold cavity (the upper surface of the lower mold cavity piece 26), and the sheet F is transferred to the lower mold clamp surface and the lower mold Each is held by suction at the bottom of the mold cavity.
  • the press capable of clamping by adjusting the inclination of the lower mold movable platen 24 is used, depending on the thickness variation of each workpiece when molding a plurality of workpieces W that are sequentially supplied. Not only can molding be performed, but even when the thickness of a plurality of (for example, two or three) workpieces W formed simultaneously in one compression molding is different, the inclination of the lower mold movable platen 24 is adjusted to provide an appropriate clamping force. The mold can be clamped with.
  • the work loader 1 includes a work loader main body 3 that reciprocates on the rail 2, a work hand 4 that holds either the work W or the molded product M, and the work hand 4 that is the work loader main body 3. , And a hand drive unit 5 that moves forward and backward with respect to each press unit.
  • the hand drive unit 5 is supported so as to be rotatable about the rotation shaft 3a with respect to the work loader body 3.
  • the hand drive unit 5 is rotatable about the rotary shaft 3a and is provided with a vertical movement mechanism (for example, cylinder drive, solenoid drive, etc.) for delivering the workpiece W to the mold.
  • the hand drive 5 can be moved up and down.
  • the work hand 4 is linked to a linear motion rail 5a provided on the upper surface side of the hand drive unit 5 so as to reciprocate via the linear motion guide 4a. Further, on the upper surface of the work hand 4, a work holding portion 4b that holds the work W with the molding surface (semiconductor element mounting surface) facing downward is provided. Further, on the lower surface side of the work hand 4, a suction pad 4c for film collection described later is provided. The suction pad 4c can be omitted when another film collecting means is provided.
  • the conveyance part C is equipped with the resin loader 6 which supplies resin R to either the 1st press part P1 and the 2nd press part P2.
  • the resin loader 6 includes a resin loader body 7 configured to be movable while sharing the rail 2, a resin hand 8 that holds the resin R, and the resin hand 8 to the resin loader body 7.
  • a hand drive unit 9 that is rotated and moved forward and backward with respect to each press unit.
  • the hand drive unit 9 is supported by the resin loader main body 7 so as to be rotatable about the rotation shaft 7a.
  • the hand drive unit 9 is rotatable about the rotation shaft 7a and is provided with a vertical movement mechanism (for example, cylinder drive, solenoid drive, etc.) for delivering the resin R to the mold.
  • the hand drive unit 9 can be moved up and down.
  • the resin hand 8 is linked to a linear motion rail 9a provided on the upper surface side of the hand drive unit 9 so as to reciprocate via the linear motion guide 8a. Further, on the lower surface of the resin hand 8, there is provided a jig holding portion 8b for holding a conveying jig 12 on which a resin R is mounted on a film F described later.
  • the jig holding part 8b grips and conveys the opposing part of the conveying jig 12 formed in a rectangular ring shape.
  • the press unit Up the resin supply unit Ud for supplying the resin R to the press unit Up, and the work processing unit Uw for supplying the workpiece W to the press unit Up and accommodating the molded product M are provided. Further, the resin molding apparatus is arranged so that the workpiece processing unit Uw is connected to one end side in the longitudinal direction of the rail 2 of the press unit Up, and the resin supply unit Ud is connected to the other end side in the longitudinal direction.
  • the resin transport unit Ud is connected to one side surface (the right side surface in FIG. 1) in the longitudinal direction of the transport unit C so that the rail 2 extends from the transport unit C.
  • the first resin supply unit 10 and the second resin supply unit 11 are disposed opposite to each other with the extended rail 2 interposed therebetween.
  • a resin mounting portion 10c for mounting the resin R is provided.
  • the resin loader 6 receives the film F on which the resin R is mounted from the resin mounting portion 10c, and supplies the film F to one of the first press portion P1 and the second press portion P2 using the rail 2 in common.
  • the film cut-out portion 10b is provided with a roll film 10a in which a long film F is wound in a roll shape.
  • a roll film 10a in which a long film F is wound in a roll shape.
  • the resin R is supplied in a state where a necessary tension (tension) is applied to and supported by the sheet film F using the conveying jig 12.
  • a conveying jig 12 having a predetermined shape (for example, an outer shape rectangular frame) corresponding to the lower mold clamping surface surrounding the lower mold cavity recess is superposed on the sheet film F.
  • the outer peripheral edge of the rectangular sheet F is sandwiched and held on each side by a plurality of film chucks provided at the outer peripheral position of the sheet F, and the rotation angles of the pair of rotary levers supporting the film chuck are held.
  • the sheet F is held in a state in which tension is applied from the opposite side.
  • the resin R stored in the hopper 10d (either granular, powder, liquid, gel, or sheet) is formed into a predetermined hole (for example, a circular hole) provided in the conveying jig 12.
  • the resin R (for example, granular resin) required for one resin mold is supplied onto the single wafer film F.
  • the resin R may be supplied by the trough 10e that can be scanned in the XY directions, or may be supplied while rotating the conveying jig 12 holding the sheet film F.
  • the sheet film F has heat resistance and is easily peeled off from the mold surface, and has flexibility and extensibility, for example, PTFE, ETFE, PET, FEP film, fluorine-impregnated glass cloth.
  • a monolayer film or a multi-layer film mainly composed of polypropylene film, polyvinylidine chloride, or the like is preferably used.
  • the second resin supply unit 11 may also have the same configuration as the first resin supply unit 10 described above. However, it is possible to provide units having different configurations.
  • a dispensing unit 11a that supplies liquid resin may be provided.
  • the dispensing unit 11a is supplied from a revolver type (revolver structure) syringe supply unit 11c that rotatably holds a plurality of syringes 11b.
  • the dispensing unit 11a is cut (cut) into a rectangular shape of an arbitrary size in a state where the end of the film is drawn from the roll film 10a, and is prepared on the resin mounting portion 10c as a single wafer film F.
  • the resin R is supplied in a state in which the sheet film F is supported and supported by the conveying jig 12 with a required tension (tension).
  • the dispensing unit 11a supplies a resin R (for example, a liquid resin) necessary for a single resin mold onto the sheet film F while scanning in the XY direction.
  • the dispense unit 11a may be moved to the front-back direction, and resin R required in a spiral form may be supplied.
  • the resin loader 6 receives the sheet film F loaded with the resin R from either the first resin supply unit 10 or the second resin supply unit 11 together with the conveying jig 12, and uses the rail 2 to share the first press. Supplied to either the part P1 or the second press part P2.
  • the resin loader 6 grips and conveys the opposite side of the transport jig 12 by the resin hand 8 (jig holding portion 8b). At this time, the work loader 1 sharing the rail 2 is retracted on the rail 2 to a position where it does not interfere with the conveying operation of the resin loader 6.
  • the first resin supply unit 10 and the second resin supply unit 11 are not necessarily provided so as to coexist, and only two sets of the first resin supply unit 10 may be provided via the rail 2 (see FIG. 10). Moreover, you may provide the jig
  • the transport jig 12 may be transported to each resin mounting portion 10 c by the resin loader 6. In this case, the conveying jig 12 may be conveyed to the resin mounting portion 10 c by the jig holding portion 8 b of the resin hand 8.
  • the work processing unit Uw is connected to the other side surface (left side surface in FIG. 1) of the transport unit C in the longitudinal direction.
  • the workpiece processing unit Uw includes a workpiece accommodating portion 13 that accommodates and holds a plurality of unmolded workpieces W (semiconductor wafers, carriers, substrates, etc.), and a molded product accommodating portion 14 that accommodates a plurality of molded products M after molding.
  • a robot conveying device 15 (second conveying unit) for taking out the workpiece W before molding from the workpiece accommodating unit 13 and delivering it to the workpiece loader 1 and taking the molded product M from the workpiece loader 1 and accommodating it in the molded item accommodating unit 14. ing.
  • the work accommodating portion 13 for example, as a work W, a semiconductor wafer, a rectangular panel (substrate, carrier, substrate substrate, etc.) or the like is placed in a magazine such as a hoop magazine, a stack magazine, or a slit magazine, and the semiconductor chip mounting surface faces upward. It is stored in a state.
  • the molded product container 14 the molded product M resin-molded in each press is stored in the magazine.
  • work accommodating part 13 and the molded article accommodating part 14 do not show what has another structure, but when accommodating the workpiece
  • work W or the molded article M may be provided separately, respectively, and you may provide multiple accommodating parts which can accommodate all. Further, the magazine may be installed and removed from the work storage unit 13 or the like from the front of the apparatus or from above the apparatus.
  • the robot transport device 15 is used in combination with, for example, a horizontal articulated robot and an elevating mechanism, and transports the workpiece W or the molded product M to the robot hand 15a using both gripping or mechanical holding and suction.
  • FIG. 1 shows an example of holding a circular (round) semiconductor wafer as a workpiece.
  • the workpiece W is gripped by pressing at least one holding claw while in contact with the holding claws 15b provided at three places on the robot hand 15a.
  • the robot hand 15a is rotatably connected to the arm because the direction in which the workpiece W is set in the mold differs from the direction in which the workpiece W is accommodated in each accommodating portion.
  • the workpiece processing unit Uw performs workpiece W thickness measurement (die count, semiconductor chip height measurement, etc.), workpiece W array (plurality) as pre-processing for the workpiece W before being formed and taken out from the workpiece storage unit 13.
  • the pre-processing unit 16 that performs at least one of the work W and the reverse of the front and back of the work W may be provided.
  • the amount of resin supplied by the resin supply unit Ud may be determined by measuring the thickness of the workpiece W, or an identification mark (such as a square type two-dimensional code or barcode) previously given to the workpiece W may be used.
  • the amount of the resin supplied may be determined by reading the height of the semiconductor chip measured in advance by reading.
  • the robot transfer device 15 delivers the workpiece W from the workpiece storage unit 13 to the preprocessing unit 16 and delivers the workpiece W preprocessed by the preprocessing unit 16 to the work loader 1.
  • the work processing unit Uw performs post-processing on the molded product M taken from the work loader 1 by turning the molded product M upside down, inspecting the molded product M, post-curing the molded product, cooling the molded product M, and post-use film.
  • a curing furnace is provided as the post-processing unit 17, and the molded product M resin-molded in each press part is separately stored in a multi-stage shelf provided in the furnace, and after-curing is performed, and the resin package part is heated and cured.
  • the post-processing unit 17 a cooling unit that cools the molded product M, an inspection unit that performs an appearance inspection of the molded product M, and the like may be arranged.
  • the robot transfer device 15 receives the molded product M from the work loader 1 and delivers it to the post-processing unit 17, and stores the molded product M post-processed by the post-processing unit 17 in the molded product storage unit 14.
  • the configuration of the work processing unit Uw is not limited to the above-described mode, and may be configured to be divided into a first processing unit 18 and a second processing unit 19, for example, as shown in FIG.
  • the 1st process part 18 is good also as a structure provided with the workpiece
  • FIG. For example, the work storage unit 13, the preprocessing unit 16, and the post-processing unit 17 (cooling unit) are arranged in the first processing unit 18, and the molded product storage unit 14 and the post-processing unit 17 (curing unit) are arranged in the second processing unit 19.
  • a furnace may be arranged.
  • the first processing unit 18 is connected to the press unit Up, and the second processing unit 19 is connected to the first processing unit 18.
  • it is desirable that the robot transport device 15 has a configuration in which the base portion 15c can reciprocate on the rail 15d.
  • the work loader 1 can also remove the used single-wafer film F and the suction pad 4c when the work hand 4 takes out the molded product M from the mold 21.
  • the single-wafer film F taken out by being held by suction may be collected by a film collection unit (not shown).
  • a film recovery mechanism may be provided in the vicinity of the mold die 21 of each press unit, and the operation of recovering the single wafer film F by the work loader 1 may be omitted. .
  • FIG. 4 shows an operation of transporting the workpiece W before molding to the workpiece storage unit 13 to the pretreatment unit 16 by the robot transport device 15.
  • the workpiece W is gripped from the magazine by the robot hand 15a and transferred to the preprocessing unit 16.
  • the pre-processing unit 16 since the workpiece W is stored in an arbitrary direction in the magazine, uniform orientation is achieved by aligning the orientation by aligning the orientation of the workpiece W by rotating the workpiece W. Is possible. Further, die count of the workpiece W, thickness measurement of the workpiece W, and the like are performed. At this time, the work W is in a state in which the semiconductor chip mounting surface faces upward as in the case where the work W is accommodated in the magazine.
  • the robot transport device 15 receives the workpiece W from the preprocessing unit 16 and delivers the workpiece W to the workpiece loader 1 waiting at the end of the rail 2 on the workpiece processing unit side.
  • the hand drive unit 5 rotates 90 degrees counterclockwise with respect to the longitudinal direction of the work loader body 3 around the rotation shaft 3a, and waits in a direction in which the work hand 4 follows the rail 2. Yes.
  • the robot transfer device 15 the robot hand 15 a holding the workpiece W is rotated 180 degrees, and the posture of the semiconductor chip mounting surface is changed from upward to downward, and then the outer periphery of the workpiece W is placed on the workpiece holder 4 b of the workpiece hand 4. Deliver by holding.
  • the preprocessing operation of the work processing unit Uw shown in FIG. 5 and the resin supply operation in the resin supply unit Ud are performed in parallel.
  • the resin supply operation is performed in a superimposed manner in the resin supply unit Ud.
  • the film cutout portion 10b is cut (cut) into a rectangular shape of an arbitrary size in a state where the film end is drawn out from the roll film 10a, and cut out on the resin mounting portion 10c as a single wafer film F. .
  • a resin R (granular resin) stored in the hopper 10d in a state where a rectangular conveyance jig 12 is superimposed on the sheet film F and a necessary tension is applied to the sheet film F and supported. ) Is uniformly supplied onto the single wafer film F through the trough 10e that can be scanned in the XY directions.
  • the uniform resin R can be supplied by moving the trough 10e into a shape such as a shape in which parallel lines are arranged within a circular range, a concentric circle shape, or a spiral shape.
  • the resin loader 6 stands by at the end of the rail 2 extending toward the resin supply unit Ud.
  • the work loader 1 that has received the workpiece W moves along the rail 2 to a position (intermediate position) facing the first press portion P1 and the second press portion P2.
  • the hand drive unit 5 rotates 90 degrees in the clockwise direction around the rotation shaft 3 a and the posture of the work hand 4 is changed to a position where it overlaps the work loader body 3.
  • the work hand 4 is caused to enter the linear motion rail 5a provided in the hand drive unit 5 toward the mold die 21 of the first press part P1 which is opened.
  • the workpiece W held by the workpiece holding portion 4b of the workpiece hand 4 is delivered after being aligned with the clamp surface of the upper mold 23. Specifically, the workpiece hand 4 is lifted with respect to the upper clamp surface, and the surface of the workpiece W on which the semiconductor element is not mounted is pressed against and held by the upper clamp surface provided with the suction holes. (See FIG. 2).
  • the resin hand 8 provided on the hand drive unit 9 of the resin loader 6 moves on the linear motion rail 9a and enters the resin mounting unit 10c. Then, the resin R is delivered to the resin loader 6 by gripping the opposite sides of the conveying jig 12 with the sheet film F to which the resin R has been supplied by, for example, a claw-shaped jig holding portion 8b. The resin hand 8 holding the resin R and the sheet film F via the conveying jig 12 is retracted from the resin mounting portion 10 c onto the hand driving portion 9.
  • the work hand 4 that has entered the mold 21 that has been opened in the first press part P ⁇ b> 1 is retracted onto the hand driving unit 5, and the work loader 1 is moved along the rail 2 to the work processing unit. Move to Uw side and wait.
  • the resin supply operation by the resin loader 6 is started.
  • the resin loader body 7 is moved along the rail 2 to a position (intermediate position) opposite to the first press part P1 and the second press part P2.
  • the resin loader 6 moves the resin hand 8 provided on the hand drive unit 9 along the linear motion rail 9a to enter the first press part P1 that is opened.
  • the jig holding portion 8b aligns the conveying jig 12 and the lower mold 29 and lowers the resin hand 8 to release the chuck of the sheet film F by the conveying jig 12, and the lower mold clamping surface and lower By adsorbing and holding in the mold cavity, the resin R together with the sheet film F is delivered to the lower mold 29.
  • the resin loader 6 that has handed over the sheet film F and the resin R is retracted from the first press part P1 onto the hand driving part 9 while the resin hand 8 holds the conveying jig 12.
  • the resin loader main body 7 moves again along the rail 2 to the resin supply unit Ud side.
  • the robot conveyance device 15 holds the next workpiece W from the workpiece container 13 and conveys it to the pretreatment unit 16 to perform the pretreatment.
  • the conveyance jig 12 held by the resin hand 8 of the resin loader 6 may be used for the next resin conveyance, or the jig storage unit 30 of the conveyance jig 12 (see FIG. 10). In addition, they may be stocked or cooled in preparation for the next resin supply operation.
  • the mold 21 is closed and compression molding is performed. Specifically, the lower mold movable platen 24 is raised with respect to the upper mold fixed platen 22, the upper mold 23 and the lower mold 29 are closed, and the resin R is heated and cured while the workpiece W is clamped.
  • the work supply operation to the second press part P2 is performed.
  • the robot transport device 15 receives the next workpiece W that has been pre-processed from the pre-processing unit 16, and waits for the workpiece loader 1 ( Deliver the workpiece W to the workpiece hand 4).
  • the resin supply unit Ud the resin R is supplied to the film F held by the transport jig 12 set in the resin mounting portion 10c.
  • the work loader 1 that has received the workpiece W moves along the rail 2 to a position (intermediate position) facing the first press part P1 and the second press part P2 as shown in FIG.
  • the posture of the hand drive unit 5 is changed so that the work hand 4 overlaps the work loader body 3 by rotating 90 degrees counterclockwise about the rotation shaft 3a.
  • the work hand 4 is moved on the linear motion rail 5a provided in the hand drive unit 5 toward the mold die 21 of the second press part P2 which is opened.
  • the workpiece W held by the workpiece holding portion 4b of the workpiece hand 4 is delivered after being aligned with the clamp surface of the upper mold 23.
  • the resin hand 8 provided on the hand drive unit 9 of the resin loader 6 moves on the linear motion rail 9a and enters the resin mounting unit 10c. Then, the jig holding portion 8b retracts the sheet film F supplied with the resin R to a position where the resin hand 8 overlaps the hand driving portion 9 while holding the opposite sides of the conveying jig 12, and the resin R Is delivered to the resin loader 6.
  • the conveying jig 12 and the lower mold 29 are aligned, the resin hand 8 is lowered, the chuck of the sheet film F by the conveying jig 12 is released, and the sheet film F is moved to the lower mold clamping surface and the lower mold cavity.
  • the resin R is delivered to the lower mold 29 together with the sheet film F by being sucked and held inside.
  • the mold 21 is closed and compression molding is performed. Specifically, the lower mold movable platen 24 is raised with respect to the upper mold fixed platen 22, the upper mold 23 and the lower mold 29 are closed, and the resin R is heated and cured while the workpiece W is clamped.
  • the work loader 1 in the first press part P1, the molded product M after compression molding is received by the work loader 1 waiting at a position (intermediate position) opposite to the first press part P1 and the second press part P2, as shown in FIG. Then, the work hand 4 enters the mold mold 21 that has been opened, the molded product M is delivered from the upper mold 23 to the work holding portion 4b, and the sheet film F is sucked from the lower mold 29 by the suction pad 4c. to recover. Then, as shown in FIG. 5, the work loader 1 is moved along the rail 2 to the work processing unit Uw side, and the hand driving unit 5 is rotated 90 degrees counterclockwise to stand by.
  • the robot transport device 15 receives the molded product M from the work hand 4 by the robot hand 15a, reverses it 180 degrees, and transports it to the post-processing unit 17 with the mold surface facing upward.
  • the used single-wafer film F adsorbed by the adsorption pad 4c is desirably collected in a separate collection box.
  • the molded product M is subjected to appearance inspection (post-cure is performed if necessary) and cooled, and the post-processed molded product M is held by the robot transport device 15 and is stored in the molded product storage unit. 14 in a magazine.
  • the molded product M compression-molded by the second press part P2 is taken out by the work loader 1 and accommodated in the molded product accommodating part 14 via the post-processing unit 17 by the robot transport device 15 provided in the work processing unit Uw. .
  • the workpiece conveyance operation and the resin supply operation for the first press part P1 are performed in parallel, and the same resin molding operation is repeatedly performed.
  • the press unit Up has a configuration in which the first press part P1 and the second press part P2 are arranged to face each other so as to intersect (orthogonal) the transport direction of the transport part C, so that the installation area is long. It can be prevented from becoming long in the direction and can be arranged compactly. Further, since the distance that the work loader 1 moves on the rail 2 is the same between the first breath part P1 and the second press part P2, the transport distance of the work W and the molded product M is shortened.
  • the first press part P1 and the second press part P2 are arranged to face each other so as to intersect (orthogonal) the rail 2 of the transport part C, and the work processing unit Uw and the resin supply unit Ud are arranged in the press unit Up. Since the rails 2 are arranged so as to be connected to both sides of the rail 2, the rails 2 can be shared by the first press part P1 and the second press part P2 for work conveyance and resin conveyance. Therefore, the conveyance distance of the work loader 1 required for the workpiece supply operation and the molded product storage operation from the workpiece processing unit Uw to the first and second press portions P1 and P2 can be similarly processed in a short time.
  • the transport distance of the resin loader 6 required for the resin supply operation to the second press parts P1 and P2 can be processed in a short time. Further, the expandability of the pre-processing function or the post-processing function in the work processing unit Uw is high, and the type and supply method of the resin R of the resin supply unit Ud can be arbitrarily selected, so that versatility is improved.
  • the installation area can be reduced, the work area can be reduced, the operability can be improved, and the conveying distance of the workpiece W and the resin R can be made uniform, thereby improving the molding quality.
  • the resin mold apparatus with high expandability which is compact and has many functions can be provided.
  • the conveyance jig 12 described above can be used for resin-molding a workpiece W having an arbitrary shape such as an outer circular shape or an outer rectangular shape as appropriate.
  • the resin R is supplied in a rectangular shape by accommodating each part configured in a circular or annular shape in the above-described configuration and accommodated in a rectangular cavity.
  • the formed rectangular workpiece W can be molded.
  • the workpiece W may be resin-molded on both surfaces of the workpiece W.
  • the workpiece W is returned to the workpiece processing unit Uw, and the molded product M is reversed by the robot hand 15a of the robot transport device 15, and then the other side of the workpiece W (molded product M).
  • a resin mold may be formed on the surface.
  • This resin molding apparatus also has a part common to the first embodiment for the purpose of preventing an increase in the length of the entire apparatus, but a press unit for improving workability and operability.
  • the layout of Up and the second resin supply unit 11 is significantly different from that of the first embodiment.
  • a first press part P1 and a second press part P2 for clamping the work W and the resin R and resin molding are arranged adjacent to each other in parallel with the transport direction of the transport part C.
  • the conveyance unit C is provided with a work loader 1, a resin loader 6, and rails 2 a and 2 b to which the work loader 1 and the resin loader 6 can move.
  • the movement range of the work loader 1 and the movement range of the resin loader 6 overlap each other by providing the rail 2a to which the work loader 1 can move and the rail 2b to which the resin loader 6 can move. It is provided to do.
  • the work loader 1 supplies the work W to either the first press part P1 or the second press part P2, and is a molded product that is a work formed by either the first press part P1 or the second press part P2. Take out M.
  • the resin loader 6 supplies the resin R to either the first press part P1 or the second press part P2.
  • description here is abbreviate
  • the work loader 1 in this embodiment includes a work loader body 3 that reciprocates on a rail 2 a, a work hand 4 that holds either the work W or the molded product M, and the work hand 4.
  • a hand drive unit 5 that moves forward and backward in the direction of each press unit P1, P2 is provided. Further, the work hand 4 can be moved up and down with respect to the hand drive unit 5.
  • the resin loader 6 includes a resin loader main body 7 that reciprocates on the rail 2 b, a resin hand 8 that holds the resin R and the single-wafer film F via the conveying jig 12, and the resin hand 8 that corresponds to the press portions P 1 and P 2.
  • the hand drive part 9 which moves forward / backward with respect to the direction is provided.
  • the hand drive unit 9 is provided with a vertical movement mechanism (for example, cylinder drive, solenoid drive, etc.) for transferring the resin R to the mold, and the resin hand 8 is moved up and down relative to the hand drive unit 9. It can be made to.
  • a vertical movement mechanism for example, cylinder drive, solenoid drive, etc.
  • the press unit Up described above, the resin supply unit Ud that supplies the resin R to the press unit Up, and the work processing unit Uw that supplies the workpiece W to the press unit Up and accommodates the molded product M are the same.
  • the work processing unit Uw is not necessarily provided as a configuration of a semi-automatic resin molding apparatus that automates only the supply of the resin R.
  • the resin transport unit Ud is connected to one side surface (the right side surface in FIG. 1) in the longitudinal direction of the transport unit C so that the rail 2b extends from the transport unit C.
  • the first resin supply unit 10 and the second resin supply unit 11 are arranged so as to be adjacent to the extended rail 2b in the same direction.
  • the configuration of the first resin supply unit 10 is the same as that of the first embodiment with respect to functions other than the layout differing with respect to the conveyance unit C, and thus description thereof is omitted here.
  • the 2nd resin supply part 11 in this embodiment is provided with the function equivalent to the 2nd resin supply part 11 in 1st Embodiment in the point which can supply resin R on the sheet
  • the roll film 10a and the syringe 11b can be exchanged from the front of the apparatus (the front of the apparatus), and the apparatus area can be reduced.
  • a resin mounting portion 10c for mounting (supplying) liquid resin R on F is provided.
  • the film cut-out portion 10b is guided upward from a roll film 10a provided below the resin mounting portion 10c via a plurality of guide rollers 10f, and is directed to the resin mounting portion 10c.
  • a remaining amount sensor 10g for detecting the remaining amount of the roll film 10a is provided in the vicinity of the installation position of the roll film 10a.
  • the remaining amount sensor 10g can be configured to provide an arbitrary position in the radial direction of the roll film 10a so as to sandwich the light emitting element and the light receiving element. In this case, the remaining amount sensor 10g generates a detection signal when the remaining amount (outer peripheral position) of the roll film 10a falls below a predetermined position, and prompts replacement of the roll film 10a.
  • the syringe supply unit 11c is configured to be able to hold the plurality of syringes 11b at an arbitrary height by moving up and down the revolver structure that holds the plurality of syringes 11b rotatably.
  • the 2nd resin supply part 11 is provided with the syringe raising / lowering part 11d which raises / lowers the syringe supply part 11c.
  • the syringe elevating part 11d is configured by vertically arranging a linear motion mechanism including a linear guide, a ball screw, and a motor, for example. Thereby, it becomes possible to raise / lower the frame 11e which hold
  • the frame 11e is configured to open on the front surface side of the second resin supply unit 11 and on the inner side of the apparatus so that the syringe 11b can be transferred in the front surface direction (left side of the paper surface) and in the inner direction (right side of the paper surface). be able to.
  • the second resin supply unit 11 includes a dispenser 11f that holds the syringe 11b and discharges the resin R, and a dispenser that moves the dispenser 11f in the XYZ directions (front and rear, left and right, up and down directions). And a drive mechanism 11g.
  • the dispenser 11f receives and holds the syringe 11b held in the syringe supply unit 11c by a syringe holding part provided in the columnar dispenser main body, and advances the piston in the syringe 11b so that the tip (lower end) of the syringe 11b is moved. Resin R is discharged from the nozzle.
  • an elastic tube may be provided in the nozzle at the tip of the syringe 11b, and a pinch valve that sandwiches the tube and restricts the discharge of the resin R may be provided.
  • a shutter (not shown) for closing the lower part of the nozzle may be provided so as not to contaminate the inside of the apparatus due to the resin dripping from the nozzle tip.
  • the dispenser drive mechanism 11g is provided so as to be connected to the upper part of the dispenser main body of the dispenser 11f, and includes a plurality of linear motion mechanisms so that the dispenser 11f can be moved to an arbitrary position in the XYZ coordinates. Further, the dispenser drive mechanism 11g may have a structure including a parallel link mechanism instead of the linear motion mechanism. According to this, the dispenser 11f can be configured to be movable to an arbitrary position on the XYZ coordinates at a low cost.
  • the resin loader 6 receives the sheet film F loaded with the resin R from either the first resin supply unit 10 or the second resin supply unit 11 together with the conveying jig 12, moves on the rail 2b, and moves to the first. It supplies to either the press part P1 and the 2nd press part P2 (refer FIG. 13).
  • the resin loader 6 grips and conveys the opposite side of the transport jig 12 by the resin hand 8 (jig holding portion 8b).
  • the work loader 1 whose movement range overlaps with the resin loader 6 is positioned so as not to interfere with the conveying operation of the resin loader 6 on the rail 2a (first press portion P1 and Treatment to a position avoiding the front of the second press part P2.
  • the first resin supply unit 10 and the second resin supply unit 11 are not necessarily provided so as to coexist, and only one second resin supply unit 11 may be provided via the rail 2b. Only the second resin supply unit 11 may be provided side by side via the rail 2b.
  • FIG. 13 a configuration example of the work processing unit Uw will be described.
  • the work processing unit Uw is connected to the other side surface (left side surface in FIG. 1) of the transport unit C in the longitudinal direction.
  • the workpiece processing unit Uw is similar to the first embodiment in that the workpiece storage unit 13, the molded product storage unit 14, the robot transfer device 15, the preprocessing unit 16, and the postprocessing unit 17 are used.
  • the difference is that a film recovery unit 17a for recovering the sheet F is provided independently.
  • the film collection unit 17a in the present embodiment is provided between the robot transport device 15 and the press unit P1.
  • the film collection unit 17a is provided with a rail 2a that is connected to the rail 2a of the press unit P1 so that the work loader 1 can move.
  • recovery part 17a also comprises a part of conveyance part C.
  • work W or the molded article M temporarily is provided in the area
  • the delivery unit 2c passes the workpiece W and the molded product M held by the workpiece hand 4. In the position.
  • the delivery unit 2 c is configured to be able to hold and lift the workpiece W and the molded product M, and relays the delivery of the workpiece W and the molded product M between the robot hand 15 a and the workpiece hand 4. That is, the delivery unit 2 c receives the work W for which preprocessing has been completed from the robot hand 15 a and delivers it to the work hand 4 of the work loader 1. Moreover, the delivery part 2c receives the molded product M resin-molded in the mold 21 from the work hand 4 of the work loader 1 and delivers it to the robot hand 15a.
  • the robot hand 15a and the work hand 4 are not directly delivered between the robot hand 15a of the robot transport device 15 and the work hand 4 of the work loader 1. It is not necessary to move to the position where the hand is delivered at the same time. Therefore, the plurality of workpieces W and the molded product M can be efficiently conveyed without causing these waiting times.
  • the robot transport device 15 has a configuration for more reliably preventing the workpiece W and the molded product M from falling off when the front and back are reversed.
  • the robot hand 15a includes a hand main body 151, a fixed claw portion (holding claw) 152, a movable claw portion (holding claw) 153, a claw driving mechanism 154, a suction circuit 155, and a suction hole. 156 and a pad portion 157.
  • FIG. 15A shows a configuration of the robot hand 15a in a plan view
  • FIG. 15B shows a configuration of the robot hand 15a in a side view.
  • the hand main body 151 is provided, for example, by branching into a plurality of (for example, two) claws, and supports the workpiece W and the molded product M as a whole.
  • the hand main body 151 is configured to be rotatable in the circumferential (roll) direction Dr of the arm 15e at the tip of the arm 15e rotating with respect to the vertical axis in the horizontal articulated robot transport device 15.
  • a plurality of the fixed claw portions 152 are provided by being erected on the branched tip portion of the hand main body 151. Further, the fixed claw portion 152 functions as a holding claw that presses and holds the main surface (front surface) of the outer edge of the workpiece W or the molded product M by expanding the diameter of the tip.
  • the movable claw part 153 has the same shape as the fixed claw part 152, and a plurality of movable claw parts 153 are provided on the base side of the hand main body 151.
  • the shapes of the fixed claw portion 152 and the movable claw portion 153 may have a configuration (hook shape) other than the illustrated shape as long as the main surface (surface) at the outer edge of the workpiece W or the molded product M can be pressed and held. Further, the movable claw portion 153 moves back and forth with respect to the fixed claw portion 152 (in other words, the workpiece W and the molded product M to be held), thereby making the interval between the movable claw portion 153 and the fixed claw portion 152 variable.
  • the claw drive mechanism 154 includes a drive source such as an air cylinder (not shown), and drives the movable claw portion 153 in the advancing and retracting direction with respect to the workpiece W and the molded product M.
  • the claw driving mechanism 154 advances and retracts the movable claw portion 153, so that the workpiece W and the molded product M can be switched between holding and releasing.
  • the suction circuit 155 is provided in the hand main body 151 and is connected to a decompression device (not shown).
  • the suction holes 156 are opened at a plurality of locations on the holding surface of the work W and the molded product M of the hand main body 151, and suck the air through the suction circuit 155 to suck the workpiece W and the molded product M.
  • the pad portion 157 is made of an elastic body such as an O-ring or a rubber sheet, and is provided so as to surround the suction hole 156. Thereby, the pad portion 157 elastically closes the gap between the workpiece W or the molding surface M to be held and the suction hole 156, and maintains these suction states.
  • a hand main body 151 As a modified example of the robot hand 15a, a hand main body 151, a fixed claw portion 152, a movable claw portion 153, and a claw driving mechanism. It is good also as a mechanical holding structure provided only with 154.
  • a suction holding structure including only the hand main body 151, the suction circuit 155, and the suction hole 156 may be used. In these cases, the workpiece W and the molded product M can be held with a thin configuration.
  • the work processing unit Uw has the same configuration as that of the first embodiment with respect to the preprocessing unit 16 and the postprocessing unit 17. Also in the work processing unit Uw shown in the present embodiment, for example, as shown in FIG. 10, the first processing unit 18 and the second processing unit 19 may be arranged separately.
  • the workpiece W is assumed to be a round workpiece (semiconductor wafer, carrier) having a chip mounted on the surface, and the operation in the workpiece processing unit Uw is basically the same. Therefore, it demonstrates, referring each figure in 1st Embodiment.
  • the robot conveyance device 15 conveys the workpiece W before molding to the workpiece storage unit 13 to the pretreatment unit 16 (see FIG. 4). In this operation, first, the hand main body 151 is inserted into the work accommodating portion 13 to hold the work W.
  • the hand main body 151 is inserted so as to overlap the work W accommodated in the slit magazine in the work accommodating portion 13 shown in FIG. Specifically, the hand main body 151 is inserted to a position where the diameter-enlarged portion of the fixed claw portion 152 is slightly advanced so as not to contact the workpiece W when the workpiece W to be described later is attracted. Next, the hand main body 151 is raised to approach the back surface (chip non-mounting surface) of the work W, and the hand main body 151 is moved to a height at which the enlarged diameter portion of the fixed claw portion 152 exceeds the surface of the work W.
  • the work W is sandwiched between the fixed claw part 152 and the movable claw part 153 by pressing the movable claw part 153 so as to approach the work W (fixed claw part 152) by the claw driving mechanism 154.
  • the fixed claw portion 152 and the enlarged claw portion of the movable claw portion 153 are arranged at positions where the workpiece W is overlapped with the workpiece W in plan view, so that the workpiece W is mechanically formed by the fixed claw portion 152 and the movable claw portion 153.
  • the workpiece W is securely held (see FIGS. 15A and 15B).
  • the back surface of the work W is sucked from the suction hole 156 through the suction circuit 155 by a decompression device (not shown) connected to the robot transport device 15, thereby being sucked at a plurality of positions of the work W. Is retained.
  • a decompression device (not shown) connected to the robot transport device 15, thereby being sucked at a plurality of positions of the work W. Is retained.
  • the pad portion 157 made of an elastic body, it is possible to prevent the suction failure of the workpiece W.
  • the workpiece W held in this way is conveyed to the preprocessing unit 16 while being held by the robot hand 15a.
  • predetermined processing is performed, but the workpiece W is in a state in which the semiconductor chip mounting surface faces upward as in the case where the workpiece W is accommodated in the magazine.
  • the robot transport device 15 receives the workpiece W from the preprocessing unit 16, and delivers the inverted workpiece W to the delivery unit 2c (see FIG. 13). Thereby, the delivery operation
  • the robot transport device 15 rotates the robot hand 15a holding the workpiece W 180 degrees in the circumferential direction Dr of the arm 15e, and changes the posture so that the semiconductor chip mounting surface is directed from the top to the bottom.
  • the workpiece W is mechanically held by the fixed claw portion 152 and the movable claw portion 153, even if the workpiece W is not sufficiently held due to insufficient adsorption, the workpiece W is surely dropped. Can be prevented.
  • the distance between these four fulcrums is smaller than the diameter of the workpiece W due to the two fixed claw portions 152 and the movable claw portions 153 provided, and even if the robot hand 15a is tilted, the workpiece is viewed from the side.
  • the work loader 1 moves to a position where the work hand 4 overlaps the delivery unit 2c.
  • the work hand 4 relatively approaches the delivery unit 2c in the ascending / descending direction to hold and receive the work W.
  • the pre-processing operation of the workpiece processing unit Uw and the resin supply operation in the resin supply unit Ud are performed in parallel. That is, the resin supply operation is performed in a superimposed manner in the resin supply unit Ud while the pre-processing operation and the like are performed in the work processing unit Uw.
  • the roll film 10a provided below the apparatus of the second resin supply unit 11 is guided upward via the guide roller 10f, and the film is supplied to the resin mounting unit 10c.
  • the film cutout portion 10b the film edge is drawn out from the roll film 10a, and is cut (cut) into a rectangular shape of an arbitrary size, and cut out on the resin mounting portion 10c as a sheet film F.
  • the remaining amount sensor 10g detects the remaining amount of the roll film 10a provided below the apparatus, and displays a notification according to the remaining amount (replacement time, unusable) on the display unit. For this reason, the operator does not need to visually confirm the lower part of the apparatus in order to confirm the film remaining amount of the roll film 10a.
  • the roll film 10a provided below the apparatus of the second resin supply unit 11 is replaced at an arbitrary timing after the notification in the display unit is given.
  • the front cover (not shown) of the second resin supply unit 11 is opened, the roll film 10a (film roll) having no remaining amount is removed, and the unused roll film 10a is set.
  • the end of the roll film 10a is pulled out and set while passing through the guide roller 10f, and reaches the resin mounting portion 10c.
  • the roll film 10a can be replaced
  • the syringe supply part 11c is a structure which can be raised / lowered, when replacing
  • the dispenser 11f that discharges the resin R from the syringe 11b is moved in the XYZ directions by the dispenser drive mechanism 11g, so that the single-sheet film F cut out on the resin mounting unit 10c Then, the resin R is mounted (applied) in an arbitrary shape.
  • the dispenser drive mechanism 11g controls the position of the dispenser 11f in the XY direction (front-rear direction in the horizontal direction) to move the dispenser 11f from the inside to the outside (or from the outside to the inside) along the spiral trajectory.
  • the piston inserted into the syringe 11b is lowered by a predetermined amount, and the resin R is discharged from the nozzle of the dispenser 11f by a predetermined amount.
  • the spirally-shaped resin R is applied to the sheet film F.
  • the tube of the nozzle When stopping the discharge of the resin R from the nozzle (liquid draining), the tube of the nozzle is sandwiched between pinch valves and the discharge path of the resin R is closed to stop the discharge.
  • An operation of rotating the syringe 11b can also be performed so as to follow the outer periphery of the supply region.
  • the resin R hanging from the nozzle may be forcibly drained by a configuration such as a shutter that closes the lower part of the nozzle.
  • exchange of the syringe 11b with respect to the syringe supply part 11c are demonstrated. Since the syringe 11b is filled with a predetermined amount of the liquid resin R, it is necessary to receive the dispenser 11f from the unused syringe 11b held in the syringe supply unit 11c every time the molding is performed a predetermined number of times. In this case, first, the syringe supply unit 11c moves up and down to a height position where the syringe 11b can be delivered to the dispenser 11f.
  • the dispenser 11f approaches the syringe supply unit 11c by the dispenser driving mechanism 11g, and delivers the used syringe 11b with no resin R remaining to the syringe supply unit 11c. Subsequently, the syringe supply unit 11c rotates the unused syringe 11b to a position facing the dispenser 11f by the revolver structure.
  • the dispenser 11f approaches the syringe supply unit 11c by the dispenser drive mechanism 11g, and receives an unused syringe 11b from the syringe supply unit.
  • the operation of exchanging the syringe 11b with respect to the dispenser 11f is completed.
  • the resin R can be supplied without waste by supplying the shortage with respect to the total amount to which the resin R is to be applied from the new syringe 11b.
  • a plurality of (for example, eight) syringes 11b can be held in the syringe supply unit, but when all of the syringes 11b held in the syringe supply unit 11c are used by repeating the above operation, The operation
  • the syringe supply unit 11c is lowered to a position below the position of FIG. 14B, for example, so that the operator moves the syringe supply unit 11c up and down to a height at which the syringe 11b can be easily set.
  • the operator opens the front cover (not shown) of the second resin supply unit 11 to expose the syringe supply unit 11c. Subsequently, the used syringe 11b is replaced with an unused syringe 11b while rotating the revolver structure. When the replacement of the syringe 11b is completed, the front cover of the second resin supply unit 11 is closed, and the replacement of the syringe 11b with respect to the syringe supply unit 11c is completed.
  • the syringe supply unit 11c can be moved up and down to an arbitrary position, so that it can be moved to a position corresponding to each exchange operation. Further, as described above, when replacing the roll film 10a, the syringe supply unit 11c can be raised as shown in FIG. 14A so as not to hinder the work. In addition to these replacement operations, when performing a steady operation of discharging the resin R from the syringe 11b, the syringe supply unit 11c is raised to the position of FIG. 14A, and the syringe supply unit 11c is moved to the resin mounting unit 10c. By moving it from the front, it is possible to ensure the worker's field of view and to visually recognize the application shape of the resin R by the dispenser 11f from the outside of the second resin supply unit 11 (for example, a front cover having a transparent portion). Good.
  • the work loader 1 that has received the workpiece W moves along the rail 2a to a position facing the first press portion P1.
  • the hand drive unit 5 does not rotate as in the first embodiment, and the mold die in which the first press part P1 is opened on the linear motion rail 5a provided with the work hand 4 on the hand drive unit 5. Enter toward 21.
  • the workpiece W held by the workpiece holding portion 4b of the workpiece hand 4 is delivered after being aligned with the clamp surface of the upper mold 23. Specifically, the workpiece hand 4 is lifted with respect to the upper clamp surface, and the surface of the workpiece W on which the semiconductor element is not mounted is pressed against and held by the upper clamp surface provided with the suction holes. (See FIG. 2).
  • the work hand 4 that has entered the mold 21 is retracted onto the hand drive unit 5, and the work loader 1 is moved to the work processing unit Uw side along the rail 2a to stand by.
  • the resin loader 6 waiting on the rail 2b provided in the second resin supply unit 11 moves on the linear motion rail 9a and enters the resin mounting unit 10c.
  • the resin R is delivered to the resin loader 6 by gripping the opposite sides of the conveying jig 12 with the jig holding portion 8b such as a claw of the sheet film F supplied with the resin R.
  • the resin hand 8 holding the resin R and the sheet film F via the conveying jig 12 is retracted from the resin mounting portion 10 c onto the hand driving portion 9.
  • the resin supply operation by the resin loader 6 is started.
  • the resin loader 6 is moved along the rail 2b to a position facing the first press portion P1.
  • the resin loader 6 moves the resin hand 8 provided on the hand drive unit 9 along the linear motion rail 9a to enter the first press part P1 that is opened.
  • the jig holding portion 8b aligns the conveying jig 12 and the lower mold 29 and lowers the resin hand 8 to release the chuck of the sheet film F by the conveying jig 12, and the lower mold clamping surface and lower
  • the resin R together with the sheet film F is delivered to the lower mold 29.
  • work W in this 1st press part P1 and the 2nd press part P2 since it is the same as that of 1st Embodiment, description is abbreviate
  • the resin loader 6 that has handed over the sheet film F and the resin R is retracted from the first press part P1 onto the hand driving part 9 while the resin hand 8 holds the conveying jig 12. With the resin hand 8 returned to the hand drive unit 9, the resin loader 6 moves the resin loader body 7 again to the second resin supply unit 11 side along the rail 2b. While the resin molding operation is being performed in the first press portion P1, the operation of supplying the workpiece W, the single wafer film F, and the resin R to the second press portion P2 is performed. Since this is the same as the supply operation, the description is omitted here.
  • the mold 21 is opened, and the molded product M after compression molding is received by the work loader 1 waiting at a position facing the first press part P1, and used.
  • the sheet film F is collected.
  • the work loader 1 is moved to the work processing unit side end (the back position of the film collection unit 17a).
  • the work loader 1 moves to a position where the work hand 4 overlaps the delivery unit 2c.
  • the work hand 4 approaches relatively to the delivery part 2c and delivers the molded product M.
  • the work loader 1 puts the used single-wafer film F sucked on the suction pad 4c into a collection box provided in the film collection unit 17a.
  • the upside down robot hand 15a approaches the delivery unit 2c and receives the molded product M.
  • the robot hand 15a can receive the molded product M without waiting for the work loader 1 (work hand 4), other workpieces W and the molded product M can be transported smoothly.
  • the robot hand 15a holding the molded product M is rotated 180 degrees in the circumferential direction Dr of the arm 15e so that the semiconductor chip mounting surface is directed upward from below. Change posture. Since the robot hand 15a has the above-described configuration, it is possible to reliably prevent the molded product M from dropping off at this time as in the case of rotating the workpiece W. Further, since the molded product M is heavier than the workpiece W, for example, if the molded product M is held and reversed with a hand having only an adsorption function, the molded product M is likely to drop off.
  • the suction pad 4c securely holds the back surface of the molded product M while pressing and holding the molded product M on the surface with the diameter-enlarged portions of the fixed claw portion 152 and the movable claw portion 153.
  • the suction state at the suction hole 156 is secured to prevent the molded product M from falling off (see FIGS. 15A and 15B).
  • the molded product M is delivered to the post-processing unit 17 by the robot hand 15a, and post-processing is performed. Subsequently, the molded product M is transferred from the post-processing unit 17 to the molded product storage unit 14 by the robot hand 15a, and the molded product M is stored, and the molding process for one workpiece W is completed.
  • work W using the 2nd press part P2 is also performed sequentially, since the operation
  • the area of the entire apparatus is reduced in each part of the apparatus, and the installation area can be prevented from becoming longer in the longitudinal direction, and can be arranged compactly while ensuring workability and operability. it can. That is, the robot transport device 15 has a configuration in which the posture is changed by rotating the robot hand 15a holding the workpiece W or the molded product M, so that a separate configuration for changing the posture of the workpiece W or the molded product M is unnecessary. An installation area for the function can be eliminated. Further, the roll resin container 10A and the syringe supply part 11c are provided in the second resin supply part 11 so as to overlap each other so that the roll film 10a and the syringe 11b can be exchanged from the front of the apparatus. The area can be reduced.
  • the resin mold apparatus in the present embodiment includes a press unit Up in which press parts P1 and P2 for clamping the work W and the resin R and resin molding are arranged, a work accommodating part 13 for accommodating the work W, and a resin mold A molded product housing portion 14 for housing a molded product M, which is a workpiece W after molding, processing units 16 and 17 for performing pre-processing for the workpiece W or post-processing for the molded product W before and after resin molding, and a housing portion.
  • a workpiece processing unit Uw having a robot transfer device 15 which is a horizontal multi-indirect robot for transferring the workpiece W or the molded product M to and from the processing unit.
  • the resin molding apparatus includes a work loader 1 that moves forward and backward with respect to the press unit Up to deliver the workpiece W and the molded product M, a conveyance area in which the work loader 1 conveys the workpiece W or the molded product M, and robot conveyance.
  • the apparatus 15 is also provided with a delivery unit 2c that temporarily holds the workpiece W or the molded product M in a region that overlaps with the conveyance region in which the workpiece W or the molded product M is transported.
  • the plurality of workpieces W and the molded product M can be efficiently transferred without causing the robot transfer device 15 and the work loader 1 to wait.
  • the resin mold apparatus in the present embodiment is provided in a press unit Up in which a plurality of press portions P1 and P2 are provided adjacent to each other and in a region adjacent to any of the plurality of press units Up.
  • a transport unit C that transports the work loader 1 in a direction orthogonal to the advancing / retreating direction, a delivery unit 2c on one end side of the transport unit C, and a work processing unit Uw connected to the one end side of the transport unit C. It is the composition which is.
  • the installation number of press part P1, P2 can be increased arbitrarily, using the delivery part 2c together.
  • the effect similar to the effect in embodiment mentioned above can also be show
  • the resin mold apparatus as a modification shown in the figure has a simple structure by rearranging each unit structure in the resin mold apparatus in the second embodiment and adding a function in the unit.
  • the resin molding apparatus in the present modification includes a resin supply unit Ud in a press unit Up in which a function is added / converted to the press unit Up in the second embodiment, and a work processing unit Uw in the second embodiment. Is provided with a work processing unit Uw that integrates a part of the functions. For this reason, the apparatus part of the resin supply unit Ud is reduced and the installation area is made compact.
  • the press unit Up in the present modification is provided with a feeding shaft 201 and a winding shaft 202 of the roll film 10 a facing each other with the mold die 21 interposed therebetween, and a film F Is provided with a film handler 204 that performs resin molding in a state where the outer diameter circular cavity 203 (mold surface) is covered with the film F by passing the mold surface from the shaft 201 to the winding shaft 202 while passing the mold surface.
  • the mold according to this modification can be said to be an “upper cavity type” mold configuration in which the configuration of the mold mold 21 shown in FIG. For this reason, in this modified example, as shown in FIG. 17, the resin R is supplied to the lower mold 29 while being supplied onto the workpiece W.
  • the work processing unit Uw in the present modification has a configuration in which a liquid resin R supply device is provided in the work processing unit Uw as shown in FIG. In other words, the work processing unit Uw and the resin supply unit Ud are integrated.
  • the workpiece processing unit Uw includes a resin supply unit 16a that supplies the resin R onto the workpiece W as a pre-processing of the workpiece W.
  • the resin supply unit 16a has the same function as that of the second resin supply unit 11 in the second embodiment in that the resin R can be supplied to the object to be coated, although the target is different between the single wafer film F and the workpiece W. For this reason, the resin supply unit 16a can be configured to omit the mechanism related to the roll film 10a.
  • the resin supply unit 16a includes a revolver-type syringe supply unit 11c that holds a plurality of syringes 11b rotatably at a position close to the side surface of the apparatus, a dispenser 11f that holds the syringe 11b and discharges the resin R, and a dispenser 11f.
  • the robot hand 15a receives the workpiece W whose orientation is uniformly aligned by, for example, the aligner as the preprocessing unit 16 in the molding operation described in the second embodiment, and the resin R It is conveyed to a resin supply unit (resin supply device) that performs supply.
  • a resin supply unit resin supply device
  • the dispenser 11f discharges the liquid resin R onto the work W while moving the syringe 11b so that the locus of the nozzle follows a predetermined shape.
  • the resin R can be supplied to a substantially circular region by discharging and applying the resin R along the spiral trajectory on the workpiece W. In this case, when the width of the application path of the resin R applied is smaller than the resin R, the resin R can be supplied without exposing the surface of the workpiece W in the resin R supply region.
  • the resin R may be supplied to a substantially circular region by starting application from the center of the workpiece W and moving the dispenser 11f so as to move the nozzle of the syringe 11b outward along the spiral trajectory. .
  • the application (supply) method for applying the resin R in this way, the operation of discharging the resin R from the syringe 11 may be continued until the supply of a predetermined amount of resin is completed, and the resin R can be easily supplied. Can do.
  • a method may be adopted in which the dispenser 11f is moved so as to start application from the outer periphery of the workpiece W and move the nozzle of the syringe 11b inward along the spiral trajectory. Therefore, it is necessary to precisely control set values such as the viscosity of the resin R, the total supply amount of the resin R, the area of the region where the resin R is supplied, or the operation amount of the piston with respect to the syringe 11b. It is likely to be difficult to control the uniform supply to the entire surface. For this reason, for example, if the set value is not appropriate, the resin R is insufficient in the center of the area of the region where the resin R is supplied, which may cause a problem of unfilling.
  • an application method is preferred in which application starts from the center of the workpiece W and moves the dispenser 11f so as to move the nozzle of the syringe 11b outward along the spiral trajectory.
  • the dispenser 11f may discharge and supply the liquid resin R to the center position of the workpiece W without moving the syringe 11b.
  • the robot hand 15a receives the workpiece W supplied with the resin R and delivers it to the work loader 1 via the delivery unit 2c.
  • the work loader 1 delivers the work W to the upper surface of the lower mold 29 of the mold 21 as shown in FIG. In this modification, since the resin R is supplied onto the workpiece W, the workpiece W is not reversed.
  • the lower die 29 is provided with a seal ring 205 that faces the upper die clamper 208 and surrounds the work W mounting area. .
  • a sealed space is formed inside the seal ring 205.
  • a decompression device 207 is provided for decompressing the sealed space through a suction hole 206 opened in an area surrounded by the seal ring 205 outside the work W mounting area.
  • the molded product M is transported by the work loader 1 and the robot transport device 15, is post-processed by the post-processing unit 17, and then accommodated in the molded product housing unit 14. Since the operation is performed, the description here is omitted.
  • the resin supply unit 16a in the work processing unit Uw instead of the resin supply unit Ud, the effects and advantages of the configuration and method shown as the present modification can be achieved. Not only can this be done, but the resin supply unit Ud is unnecessary, and the installation area can be made compact.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

La problème décrit par la présente invention est de fournir un dispositif d'alimentation de résine qui rend compacte la taille d'une zone d'installation et réduit une zone de travail en vue d'améliorer l'opérabilité. En tant que solution, une unité d'alimentation de résine (Ud) dispose d'une section d'accueil de film en rouleau (10A) et une section d'alimentation par seringue (11c) agencées en vue de se chevaucher verticalement l'une l'autre au niveau de l'extrémité avant d'un dispositif, et dispose d'une section de montage de résine (10c) agencée près de la section d'alimentation par seringue (11c).
PCT/JP2017/018496 2016-08-09 2017-05-17 Dispositif d'alimentation de résine, unité de presse, et dispositif de moulage de résine WO2018029934A1 (fr)

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JP2016156490A JP6744780B2 (ja) 2016-08-09 2016-08-09 樹脂モールド装置

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JP7068094B2 (ja) * 2018-08-10 2022-05-16 アピックヤマダ株式会社 ワーク搬送装置、樹脂搬送装置及び樹脂モールド方法
JP7335647B2 (ja) * 2018-08-10 2023-08-30 アピックヤマダ株式会社 ワーク搬送装置及び樹脂モールド装置
JP7167358B2 (ja) * 2019-09-17 2022-11-08 大和製罐株式会社 成形装置
JP7394732B2 (ja) * 2020-10-19 2023-12-08 Ｔｏｗａ株式会社 樹脂供給方法、樹脂成形品の製造方法及び樹脂成形装置
JP7445974B2 (ja) * 2020-10-20 2024-03-08 アピックヤマダ株式会社 樹脂封止装置
KR102528159B1 (ko) * 2021-06-15 2023-05-08 (주)대성하이텍 웨이퍼의 반전이송모듈
JP2023003677A (ja) * 2021-06-24 2023-01-17 アピックヤマダ株式会社 圧縮成形装置及び圧縮成形方法
CN117153725A (zh) * 2023-08-31 2023-12-01 芯笙半导体科技(上海)有限公司 一种晶圆级封装装置

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