WO2018029915A1 - ロードポート及びウェーハ搬送方法 - Google Patents
ロードポート及びウェーハ搬送方法 Download PDFInfo
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- WO2018029915A1 WO2018029915A1 PCT/JP2017/016127 JP2017016127W WO2018029915A1 WO 2018029915 A1 WO2018029915 A1 WO 2018029915A1 JP 2017016127 W JP2017016127 W JP 2017016127W WO 2018029915 A1 WO2018029915 A1 WO 2018029915A1
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- wafer
- drive mechanism
- latch
- lid
- load port
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
Definitions
- the present invention relates to a load port and a wafer transfer method.
- Wafers such as silicon wafers are transported and stored in a wafer storage container called FOUP (Front-Opening Unified Pod) or FOSB (Front Open Shipping BOX).
- FOUP Front-Opening Unified Pod
- FOSB Front Open Shipping BOX
- E-FEM Equipment Front End Module
- the lid of the wafer storage container is sucked and held by a suction cup at the door portion of the E-FEM load port, and a latch bar built in the lid is operated by a latch to open and close.
- the conventional load port 101 will be described more specifically with reference to FIGS.
- the load port 101 is installed on the wall surface of a wafer transfer chamber 51 such as an E-FEM installed in the clean room 30.
- the load port includes a mounting table 104 on which a wafer storage container 61 having a container main body 63 and a lid 62 is mounted, a plate-like portion 102 having an opening that opens the wafer transfer chamber 51, and the like, and a door fitted in the opening.
- the part 105 can be driven so as to be detached from the opening, and thereby the opening can be opened and closed.
- the door portion 105 includes an adsorber 115 that can hold the lid 62 by adsorbing to the lid 62.
- the door portion 105 includes a latch 107.
- the latch 107 can be driven to release the fixation between the container main body 63 and the lid 62, and can be driven to fix the container main body 63 and the lid 62. Then, as shown in FIG. 8, with the lid 62 sucked and held by the suction tool 115, the fixing of the container body 63 and the lid 62 is released by the latch 107, and the door 105 is detached from the opening 103, thereby 62 can be detached from the wafer storage container 61.
- the wafer is transferred in and out by the wafer transfer robot 52.
- Patent Document 2 discloses a technology related to an opener ( ⁇ load port) that automatically opens and closes the FOUP lid and E-FEM, and the opening operation of the FOUP lid disrupts the airflow that causes dust generation. It is described that there is a possibility that the wafer accommodated in the FOUP may be soiled.
- the paragraph (0006) of Patent Document 2 states that “the door 101 opened by the opener 200 is lifted and lowered in the box B as described later, but depending on the drive source used for the lift, "It was the cause", and it is described that the dust generated from the drive source becomes a problem.
- the pressure inside the E-FEM is higher than that in the clean room in order to maintain the cleanliness inside the E-FEM.
- the air in the E-FEM passes through a space (latch drive mechanism housing portion 109) in which a drive system component (latch drive mechanism 108) for operating the load port latch 107 is housed as shown in FIG.
- the air is discharged from the gap between the latches into the clean room.
- the lid 62 of the wafer container 61 is opened and closed, dust is generated by the latch driving mechanism 108 of the latch 107 of the load port 101.
- the latch drive mechanism housing portion 109 for housing the latch drive mechanism 108 is located in the E-FEM, and the pressure in this space is higher than that in the clean room. This is because the inside of the latch drive mechanism housing portion 109 and the inside of the E-FEM are spatially connected by a gap such as a lid portion or a wiring hole of the latch drive mechanism housing portion 109. Therefore, the generated dust rides on the airflow flowing in the clean room direction from the gap of the latch, moves into the wafer storage container, and adheres to the wafer (see FIG. 9).
- An object of the present invention is to provide a load port and a wafer transfer method that can be prevented.
- the present invention is provided adjacent to a wafer transfer chamber installed in a clean room, and a wafer is taken in and out between the wafer transfer chamber and a wafer storage container having a container body and a lid.
- a plate-shaped portion that constitutes a part of the wall surface of the wafer transfer chamber and has an opening that opens the wafer transfer chamber, and a lid of the wafer storage container is opposed to the opening.
- a mounting table on which the wafer storage container is mounted a door portion that is fitted in the opening and can be driven so as to be detached from the opening, so that the opening can be opened and closed, and the door portion is installed.
- An adsorber that can hold the lid by adsorbing to the lid, and can be driven to release the fixation between the container body and the lid, installed on the door, and the container body and the lid.
- a latch that can be driven to be fixed, and a latch drive mechanism housing portion that is provided adjacent to the door portion in the wafer transfer chamber and houses the latch drive mechanism that drives the latch, In a state where the lid is sucked and held, the container body and the lid are released by the latch, and the container body is moved relative to the suction tool to open and close the lid.
- the air pressure inside the latch drive mechanism storage portion is configured to be the same as the air pressure in the clean room or lower than the air pressure in the clean room.
- a load port is provided.
- the load port is capable of setting the air pressure inside the latch drive mechanism housing to the same or a lower pressure than that of the clean room, airflow from the latch drive mechanism housing to the clean room is unlikely to occur. Since the dust generated in the load port and the movable part inside the lid of the wafer storage container is difficult to move to the wafer storage container, the amount of adhered particles on the wafer can be reduced.
- the latch drive mechanism storage portion is connected to an exhaust device, and the exhaust device can make the pressure of the latch drive mechanism storage portion lower than the pressure of the clean room. It is preferable.
- the exhaust device can make the air pressure in the latch drive mechanism housing portion lower than the air pressure in the clean room.
- the latch drive mechanism housing is hermetically sealed with a sealing material and hermetically sealed with respect to the wafer transfer chamber.
- air can be prevented from flowing in from the wafer transfer chamber by the sealing material, and the air pressure in the latch drive mechanism housing portion can be the same or lower than the air pressure in the clean room.
- the load port according to the present invention further includes an inner cap that houses the latch drive mechanism inside the latch drive mechanism housing portion, and the inner cap is connected to an exhaust device. Therefore, it is preferable that the pressure inside the inner cap can be made lower than the pressure in the clean room.
- the exhaust capacity can be reduced and the exhaust volume can be reduced. Further, when the inner cap is sealed, the sealing shape can be simplified and the sealing area can be reduced, so that the sealing performance can be further improved and the construction is simplified, so that the machine difference can be reduced. In addition, the reduction of the exhaust amount can reduce the size of the exhaust equipment, thereby reducing the equipment cost and the running cost.
- the load port of the present invention further includes a hollow shaft portion that supports the latch drive mechanism storage portion, and a space inside the shaft portion is connected to a space inside the latch drive mechanism storage portion,
- the inside of the shaft portion and the inside of the latch drive mechanism housing portion are hermetically sealed by a sealing material and hermetically sealed with respect to the wafer transfer chamber, and the shaft portion is provided by an exhaust device connected to the shaft portion. It is preferable that the air pressure inside the latch drive mechanism housing portion can be made lower than the air pressure in the clean room by reducing the pressure inside.
- the exhaust pipe can be made thicker by connecting the exhaust device to the shaft portion, the exhaust amount can be increased. Therefore, since dust is less likely to move into the wafer storage container, the amount of adhered particles on the wafer can be further reduced. Moreover, since the part which uses a lot of sealing materials is kept away from a wafer, the contamination from a sealing material can be suppressed.
- the present invention uses the load port provided adjacent to the wafer transfer chamber installed in the clean room, between the wafer transfer chamber and the wafer storage container.
- a wafer transfer method for loading and unloading a wafer wherein the air pressure inside the latch drive mechanism storage unit is the same as the air pressure in the clean room, or lower than the air pressure in the clean room, and the lid is attached with the suction tool.
- the latch releases the fixing of the container body and the lid, and moves the container body relative to the suction tool to open the lid and the door portion. Is opened from the opening to connect the internal space of the wafer transfer chamber and the internal space of the wafer storage container, and Provides a wafer transfer method which is characterized in that the wafers out between the wafer carrier.
- the amount of particles adhering during wafer transfer can be reduced.
- the air pressure inside the wafer transfer chamber can be higher than the air pressure in the clean room.
- the load port and the wafer transfer method of the present invention it is possible to prevent the dust generated at the movable portion inside the load port and the lid of the wafer storage container from adhering to the wafer when the wafer is taken in and out of the wafer storage container. .
- the load port 1 of the present invention is provided adjacent to a wafer transfer chamber 51 installed in the clean room 30, and allows the wafer W to be taken in and out between the wafer transfer chamber 51 and the wafer storage container 61. Used when doing.
- the wafer transfer chamber 51 can be, for example, an E-FEM.
- the E-FEM is a module including the load port 1, the wafer transfer robot 52, the FFU (Fan Filter Unit) 53 for keeping the wafer transfer chamber 51 clean. Further, FOUP can be used as the wafer storage container 61.
- FIG. 2 is a perspective view showing only the load port 1.
- the load port 1 constitutes a part of the wall surface of the wafer transfer chamber 51, the plate-like portion 2 having the opening 3 that opens the wafer transfer chamber 51, and the lid 62 of the wafer storage container 61.
- the load port 1 includes a door portion 5 fitted in the opening 3 as shown in FIGS.
- the door portion 5 can be driven so as to be detached from the opening 3, and thus the opening 3 can be opened and closed.
- the door 5 can be moved up and down by a door drive mechanism 6.
- the door drive mechanism 6 can move the door 5 up and down by driving a support part of the door 5 connected to the guide up and down using a motor or a cylinder. By such a door drive mechanism 6, the door 5 can be raised and fitted into the opening 3, and conversely, the door 5 can be lowered and detached from the opening 3.
- the load port 1 includes an adsorbing tool 15 installed on the door portion 5.
- the suction tool 15 can hold the lid 62 by being sucked by the lid 62.
- a suction cup that can be vacuum-sucked to the lid 62 may be used as the suction tool 15.
- the load port 1 includes a latch 7 installed on the door portion 5.
- the latch 7 can be driven to release the fixation between the container body 63 and the lid 62, and can also be driven to fix the container body 63 and the lid 62.
- the lid 62 of the wafer storage container 61 such as a FOUP is provided with a lock mechanism that can fix the container body 63 and the lid 62.
- the lock mechanism is provided with an engagement hole with which the latch 7 is engaged. When the latch 7 is engaged with the engagement hole, the latch 7 rotates to rotate the container body 63 and the lid 62. It is possible to switch between a fixed state and a fixed release state.
- the drive for releasing the fixation between the container main body 63 and the lid 62” and “the drive for fixing the container main body 63 and the lid 62” include, for example, the latch 7 provided on the lid 62. It means to drive to engage with the engagement hole of the lock mechanism, and then to rotate in a predetermined rotation direction.
- the load port 1 is provided adjacent to the door portion 5 in the wafer transfer chamber 51, and includes a latch drive mechanism housing portion 9 in which a latch drive mechanism 8 that drives the latch 7 is housed. To do. Note that the latch drive mechanism 8 can be driven by the latch 7 by being controlled by the latch drive control unit 10.
- the load port 1 releases the fixation between the container body 63 and the lid 62 by the latch 7 while the cover 62 is sucked and held by the suction tool 15, and moves the container body 63 relative to the suction tool 15. By doing so, the lid 62 can be opened and closed.
- “moving the container main body 63 relative to the suction tool 15” means that the suction tool 15 may be moved or the container main body 63 may be moved.
- the mounting table 4 can move in a direction away from the opening 3 while the container main body 63 of the wafer storage container 61 is mounted. After the lid 62 is sucked and held by the suction tool 15, the mounting table 4 is By moving away from the opening 3, the lid 62 can be detached from the container body 63.
- the load port 1 of the present invention is configured such that the air pressure inside the latch drive mechanism housing portion 9 can be the same as the air pressure in the clean room 30 or lower than the air pressure in the clean room 30. Is. If this is the case, airflow from the latch drive mechanism housing portion 9 toward the clean room 30 is unlikely to occur, so that dust generated by the latch drive mechanism 8 does not easily reach the wafer storage container 61. In particular, in the case of a low pressure, an air flow is generated in the direction from the clean room 30 to the latch drive mechanism storage unit 9, so that dust generated by the latch drive mechanism 8 is more difficult to reach the wafer storage container 61.
- the inside of the lid 62 can be set to the same pressure or a low pressure with respect to the atmospheric pressure of the clean room 30, and is generated at a movable part inside the lid 62. Dust is also difficult to reach inside the wafer storage container 61. As a result, the amount of adhered particles on the wafer W can be reduced during transfer.
- the configuration for making the pressure inside the latch drive mechanism housing 9 lower than the pressure in the clean room 30 will be described more specifically.
- the latch drive mechanism housing portion 9 is connected to an exhaust device 11 (for example, a pump or an ejector)
- the air pressure of the latch drive mechanism housing portion 9 is reduced by the exhaust device 11 in the clean room 30.
- the pressure can be lower than the atmospheric pressure.
- Dust generated by the latch drive mechanism 8 and the like can be sucked and removed by the exhaust device 11, and the amount of particles adhering to the wafer W can be further reduced.
- the exhaust device 11 may be connected to the inside of the latch drive mechanism housing portion 9 by the vacuum line 12 as shown in FIG.
- the latch drive mechanism housing portion 9 is hermetically sealed by the sealing material 13 and sealed with respect to the wafer transfer chamber 51. Since the latch drive mechanism storage unit 9 is closed with respect to the wafer transfer chamber 51, the inflow of air from the wafer transfer chamber 51 having a higher atmospheric pressure can be prevented, and the air pressure inside the latch drive mechanism storage unit 9 can be prevented. Can be maintained at a lower pressure. Thereby, the airflow in the direction of the wafer storage container 61 can be further suppressed, and the adhesion of particles to the wafer can be further reduced.
- the load port 1 further has an inner cap 16 for accommodating the latch driving mechanism 8 inside the latch driving mechanism accommodating portion 9, and the inner cap 16 is connected to the exhaust device 11. It is preferable that the exhaust device 11 can make the pressure inside the inner cap 16 lower than the pressure in the clean room 30.
- the clean room 30 is not shown, but this is basically the same configuration as in FIG. 1.
- the inner cap 16 may be sealed with the sealing material 13.
- the structure of the latch drive mechanism 8 differs depending on the device manufacturer. If the structure is simple and there is room in the interior of the latch drive mechanism housing 9, it is effective to attach the inner cap 16.
- the exhaust capacity can be reduced and the exhaust amount can be reduced.
- the construction can be simplified and the machine difference can be reduced. Further, the reduction of the exhaust amount can reduce the size of the exhaust equipment, thereby reducing the equipment cost and the running cost.
- the internal pressure of the latch drive mechanism housing 9 may be set lower than that of the clean room 30 by the configuration as shown in FIG. That is, as shown in FIG. 12, the load port 1 further includes a hollow shaft portion 17 that supports the latch drive mechanism housing portion 9, and the exhaust device 11 connected to the shaft portion 17 allows the interior of the shaft portion 17 to be It is good also as what can make the atmospheric
- the space inside the shaft portion 17 is connected to the space inside the latch drive mechanism housing portion 9, and the inside of the shaft portion 17 and the inside of the latch drive mechanism housing portion 9 are hermetically sealed by the sealing material 13, The wafer transfer chamber 51 is sealed.
- the shaft portion 17 can support the latch drive mechanism storage portion 9 from below, and is configured to be movable up and down and front and rear integrally with the door portion 5 holding the lid 62 of the wafer storage container 61 and the latch drive mechanism storage portion 9.
- the inside is a route for wiring, piping, and the like.
- the exhaust pipe (vacuum line 12) needs to be passed through the inlet of the latch drive mechanism housing portion 9, so that the inlet is narrow and difficult to pass a thick pipe depending on the apparatus. There is a case.
- the exhaust pipe if the exhaust pipe is passed to the inside of the shaft portion 17, the exhaust pipe can be thickened, so that the exhaust amount can be more sufficiently taken.
- the part (lower part of the shaft part 17) which uses the sealing material 13 in large quantities is kept away from the wafer W, the contamination from the sealing material 13 can be suppressed.
- load port 1 of the present invention may include both the inner cap 16 and the shaft portion 17 as described above.
- the air pressure inside the latch drive mechanism housing 9 can be made the same pressure as the atmospheric pressure of the clean room 30.
- the inside of the latch drive mechanism storage portion 9 can be sealed with respect to the wafer transfer chamber 51, air does not flow from the wafer transfer chamber 51, and the generation of airflow in the direction of the wafer storage container 61 can be prevented. Further, the adhesion of particles to the wafer can be further reduced.
- the wafer transfer method of the present invention uses the load port 1 of the present invention provided adjacent to the wafer transfer chamber 51 installed in the clean room 30 to provide a space between the wafer transfer chamber 51 and the wafer storage container 61.
- This is a wafer transfer method in which the wafer W is taken in and out.
- the pressure inside the latch drive mechanism housing portion 9 of the load port 1 of the present invention is made the same as the pressure in the clean room 30 or lower than the pressure in the clean room 30. More specifically, the wafer can be taken in and out as follows.
- the wafer storage container 61 in which the wafer W is stored is mounted on the mounting table 4 of the load port 1. At this time, the wafer storage container 61 is placed so that the lid 62 of the wafer storage container 61 faces the opening 3 of the load port 1.
- the container body 63 and the lid 62 are released from being fixed by the latch 7, and the container body 63 is moved relative to the suction tool 15.
- the lid 62 is opened, and the door 5 is detached from the opening 3 to open the opening 3.
- the internal space of the wafer transfer chamber 51 and the internal space of the wafer storage container 61 are connected.
- the lid 7 is released by the latch 7, and the door 5 is lowered while the lid 62 is sucked and held by the suction tool 15, thereby removing the door 5 from the opening 3 and simultaneously storing the wafer.
- the lid 62 of the container 61 can be opened.
- the mounting table 4 may be one that can move in the direction away from the opening 3 while the wafer storage container 61 is mounted.
- the lid is released from the container body 63 by moving the mounting table 4 away from the opening 3 after releasing the fixation of the cover by the latch 7 and holding the cover 62 by suction. Can do.
- the mounting table 4 is moved in a direction approaching the opening 3 to dock the container body 63 and the opening 3.
- the internal space of the wafer transfer chamber 51 and the internal space of the wafer storage container 61 can be connected.
- the wafer W is taken out from the wafer storage container 61 (container body 63) by the wafer transfer robot 52.
- the taken-out wafer W is, for example, transferred to a processing apparatus (not shown) or the like, or transferred to an unload-side wafer storage container installed separately from the load side.
- the load port of the present invention can also be installed and used on the unload side.
- the wafer W that has been subjected to the predetermined processing can be returned to the wafer storage container 61 (container body 63) by the wafer transfer robot 52 again.
- the lid 62 can be returned to the container body 63 by fitting the door portion 5 connected to the lid 62 into the opening 3.
- the door 5 can be returned to the opening 3 by raising the door 5.
- the connection between the latch 7 and the lid 62 is released. The wafer can be taken in and out as described above.
- the pressure inside the wafer transfer chamber 51 is higher than the pressure in the clean room 30. Therefore, the inflow of air from the clean room to the wafer transfer chamber can be suppressed, and the cleanliness of the wafer transfer chamber can be maintained.
- Example 1 Wafers were transferred using the load port of the present invention as shown in FIGS. 1 to 3 as the load port of the transfer machine as shown in FIG. 5 installed in the clean room.
- the load port of the present invention used here is one in which the pressure in the latch drive mechanism housing portion is made lower than the pressure in the clean room by the exhaust pump, and the latch drive mechanism housing portion is hermetically sealed by the sealing material.
- the wafer transfer chamber was sealed with respect to the inside of the transfer machine in which a wafer transfer robot or the like is installed in the case of FIG.
- Such a load port of the present invention is arranged at ports 1 to 4 (P1 to P4 in FIG. 5) of the transfer machine as shown in FIG.
- Example 2 The wafer was transferred in the same manner as in Example 1 except that the conventional load port as shown in FIGS.
- the conventional load port used here did not perform decompression by the exhaust pump and sealing of the latch drive mechanism housing portion by the sealing material.
- Example 1 In both Example 1 and Comparative Example, before the wafer was transferred, the differential pressure between the clean room and the latch drive mechanism storage unit and the amount of dust in the air around the latch were measured. .
- the air pressure in the latch drive mechanism housing portion was higher than that in the clean room at all load ports.
- the air pressure in the latch drive mechanism housing portion was -2.4 Pa on average with respect to the air pressure in the clean room, and +0.1 Pa in the comparative example.
- Example 1 the average amount of dust in the air measured was 0 / Cf (0 / cubic foot), and the comparative example was 31,032 / Cf. Note that conversion from cubic feet to metric units is easy and one cubic foot is about 28.3 liters.
- the pressure in the latch drive mechanism housing is lower than the pressure in the clean room, dust generated in the latch drive mechanism housing hardly flows to the clean room side through the periphery of the latch. The amount of dust in the air was very small.
- the comparative example since the air pressure in the latch drive mechanism housing portion is higher than the air pressure in the clean room, the amount of measured dust in the air significantly increased.
- the FOUP containing the wafer is set in the load port on the loader side (P1, P2 in FIG. 5), and the load port on the unloader side (P3, P4 in FIG. 5). Empty FOUPs were set, and wafers were reciprocated between these FOUPs. This was done for all 2 ports on the supply side.
- LLS measurement was performed on all the wafers that had been transported under the same conditions as described above, and the number of particles having a size of 28 nm or more was examined. Then, the LLS increase number (increase number of particles) was calculated for the wafers before and after the transfer, and the LLS increase number per transfer was calculated.
- FIG. 6 is a graph summarizing the number of LLS increases of one wafer in one transfer for each particle size.
- the air pressure in the latch drive mechanism housing portion is lower than the clean room air pressure as in the first embodiment, the number of particles of 28 nm or more is 0.09 (pieces / wafer), and the air pressure in the latch drive mechanism housing portion is The number of particles increased was much smaller than that of the comparative example (0.85 / wafer) having a high pressure relative to the clean room pressure.
- Example 2 The wafer was transported in the same manner as in Example 1 except that the load port of the present invention having the latch drive mechanism housing portion as shown in FIG.
- the load port of the present invention used here is one in which the latch drive mechanism housing is hermetically sealed with a sealing material, and the latch drive mechanism housing is sealed with respect to the wafer transfer chamber (inside the transfer machine). It was.
- Example 2 the measured amount of dust in the air was 0.8 / Cf on average.
- Example 2 where the air pressure in the latch drive mechanism housing is the same as the pressure in the clean room, dust generated in the latch drive mechanism housing hardly flows to the clean room side through the periphery of the latch. The amount of dust in the air was very small compared to the comparative example.
- the amount of particles adhering to the wafer during conveyance was measured by the same method as in Example 1 and Comparative Example. The result is shown in FIG.
- the measurement result of the particle amount of Example 2 is also shown.
- Example 3 As in the first embodiment, the load port of the present invention having an inner cap to which the exhaust device is connected as shown in FIG. Carried. That is, the load port of the present invention used here seals the inside of the inner cap with a sealing material and then exhausts the inside of the inner cap, so that the pressure inside the inner cap is lower than the pressure in the clean room. It was possible.
- Example 3 before carrying the wafer in the same manner as in Examples 1, 2 and Comparative Example, measurement of the differential pressure inside the clean room and the inner cap, and the amount of dust in the air around the latch was measured. Further, the amount of particles adhering to the wafer during conveyance was measured by the same method as in Examples 1 and 2 and the comparative example.
- Example 4 As shown in FIG. 12, a load port is provided in the transfer machine that can reduce the pressure inside the latch drive mechanism housing by lowering the pressure inside the shaft, which is lower than the pressure in the clean room. Except that, the wafer was transferred in the same manner as in Example 1.
- Example 4 in the same manner as in Examples 1 to 3 and the comparative example, before carrying the wafer, measurement of the differential pressure between the clean room and the latch drive mechanism storage unit, and atmospheric dust around the latch The amount of was measured. Further, the amount of particles adhering to the wafer during conveyance was measured by the same method as in Examples 1 to 3 and the comparative example.
- Table 3 summarizes the differential pressure measured in Examples 3 and 4 and the amount of dust in the air around the latch. For comparison, Table 3 also shows the measurement results of the above comparative examples. Furthermore, Table 4 shows the measurement results of the amount of particles adhering to the wafer during conveyance. For comparison, Table 4 also shows the measurement results of the particle amount of the comparative example.
- Example 3 the measured amount of dust in the air is 0 / Cf and 0.25 / Cf on average, respectively, and the measured amount of dust in the air is Very little compared to the comparative example. Further, in Example 3, the exhaust flow rate could be set smaller than in Example 1, and conversely in Example 4, the exhaust flow rate could be set larger.
- the present invention is not limited to the above embodiment.
- the above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.
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Abstract
Description
クリーンルームに設置された、図5に示すような移載機のロードポートとして、図1~3に示したような本発明のロードポートを用いてウェーハの搬送を行った。ここで用いられた本発明のロードポートは、排気ポンプによって、ラッチ駆動機構収納部の気圧をクリーンルームの気圧よりも低圧にしたものであり、かつ、ラッチ駆動機構収納部がシール材によって気密にされ、ウェーハ搬送室(図5の場合はウェーハ搬送ロボットなどが設置されている移載機内部)に対して密閉されたものとした。そして、このような本発明のロードポートを図5のような移載機のポート1~4(図5中のP1~P4)に配置した。
図7~9に示したような従来のロードポートを移載機に配設したこと以外、実施例1と同様にウェーハの搬送を行った。ここで用いられた従来のロードポートは、排気ポンプによる減圧、及び、シール材によるラッチ駆動機構収納部の密閉を行わなかった。
最少単位0.1Paの差圧計(オムロン株式会社製)を用いてクリーンルームの気圧を基準としたラッチ駆動機構収納部の気圧の測定を行った。まず、差圧計の低圧側チューブをクリーンルームの床上1mの位置に設置した。次に、2個あるうちの一方のラッチをキャップし(もう一方はキャップせず)、差圧計の高圧側チューブをキャップの中に挿入し、差圧を測定した。その結果、表1のように、実施例1においては、すべてのロードポートでラッチ駆動機構収納部の気圧はクリーンルームの気圧に対して低圧となっていた。一方、比較例では、すべてのロードポートでラッチ駆動機構収納部の気圧はクリーンルームの気圧に対して高圧となっていた。また、実施例1では、ラッチ駆動機構収納部の気圧はクリーンルームの気圧に対して平均で-2.4Pa、比較例は+0.1Paであった。
パーティクル測定器(株式会社日立デコ製)の吸引チューブをラッチ部(クリーンルーム側)近傍にセットした。続いて、マニュアル操作でラッチ部のみを連続駆動(ラッチの蓋開閉動作)させ、気中のパーティクル(塵)を測定した。このとき、サイズが0.07μm以上のパーティクルの個数を調べた。測定結果を表1に示す。
まず、直径300mmのポリッシュドウェーハ(PW)を3枚入れたFOUPを2個準備した。そして、全てのウェーハについてLLS(Localized Light Scatters;局所的な光散乱体)測定を行った。ここでは、サイズが28nm以上のパーティクルの個数を調べた。また、パーティクル測定器としてはKLAテンコール社製のSurfscan SP2、Surfscan SP3、及びSurfscan SP5を用いた。
図4に示したようなラッチ駆動機構収納部を有する本発明のロードポートを移載機に配設したこと以外、実施例1と同様にウェーハの搬送を行った。即ち、ここで用いられた本発明のロードポートは、シール材によりラッチ駆動機構収納部を気密にし、ウェーハ搬送室(移載機内部)に対してラッチ駆動機構収納部が密閉されたものであった。
図11に示したような、排気装置が接続されたインナーキャップをラッチ駆動機構収納部の内部に有する本発明のロードポートを移載機に配設したこと以外、実施例1と同様にウェーハの搬送を行った。即ち、ここで用いられた本発明のロードポートは、シール材によりインナーキャップ内部を気密にしたうえで、インナーキャップ内部を排気することで、インナーキャップの内部の気圧をクリーンルームの気圧よりも低圧にできるものであった。
図12に示したような、シャフト部の内部を減圧することで、ラッチ駆動機構収納部の内部の気圧を、クリーンルームの気圧よりも低圧にすることが可能なロードポートを移載機に配設したこと以外、実施例1と同様にウェーハの搬送を行った。
Claims (7)
- クリーンルーム内に設置されたウェーハ搬送室に隣接して設けられ、該ウェーハ搬送室と容器本体及び蓋を具備するウェーハ収納容器との間でウェーハの出し入れを行うためのロードポートであって、
前記ウェーハ搬送室の壁面の一部を構成し、該ウェーハ搬送室内を開放する開口を有する板状部と、
前記ウェーハ収納容器の蓋を前記開口に対向させるように前記ウェーハ収納容器が載置される載置台と、
前記開口に嵌められ、前記開口から離脱するように駆動可能であることで前記開口を開閉可能な扉部と、
前記扉部に設置され、前記蓋に吸着することで前記蓋を保持可能な吸着具と、
前記扉部に設置され、前記容器本体と前記蓋との固定を解除するよう駆動でき、また、前記容器本体と前記蓋とを固定するよう駆動できるラッチと、
前記ウェーハ搬送室内で前記扉部に隣接して設けられ、前記ラッチを駆動させるラッチ駆動機構が収納されたラッチ駆動機構収納部と、
を具備し、
前記吸着具で前記蓋を吸着保持した状態で、前記ラッチで前記容器本体と前記蓋との固定を解除し、前記吸着具に対して相対的に前記容器本体を移動させることで、前記蓋を開閉することが可能に構成されており、
前記ラッチ駆動機構収納部の内部の気圧を、前記クリーンルームの気圧と同圧、又は、前記クリーンルームの気圧よりも低圧にすることが可能なように構成されたものであることを特徴とするロードポート。 - 前記ラッチ駆動機構収納部が排気装置に接続されたものであり、該排気装置によって、前記ラッチ駆動機構収納部の気圧を前記クリーンルームの気圧よりも低圧にすることが可能なものであることを特徴とする請求項1に記載のロードポート。
- 前記ラッチ駆動機構収納部がシール材によって気密にされ、前記ウェーハ搬送室に対して密閉されたものであることを特徴とする請求項1又は請求項2に記載のロードポート。
- さらに、前記ラッチ駆動機構を収納するインナーキャップを前記ラッチ駆動機構収納部の内部に有し、該インナーキャップが排気装置に接続されたものであり、該排気装置によって、該インナーキャップの内部の気圧を前記クリーンルームの気圧よりも低圧にすることが可能なものであることを特徴とする請求項1から請求項3のいずれか1項に記載のロードポート。
- さらに、前記ラッチ駆動機構収納部を支持する中空のシャフト部を具備し、該シャフト部の内部の空間が前記ラッチ駆動機構収納部の内部の空間と接続され、前記シャフト部の内部及び前記ラッチ駆動機構収納部の内部がシール材によって気密にされ、前記ウェーハ搬送室に対して密閉されたものであり、
前記シャフト部に接続された排気装置によって、該シャフト部の内部を減圧することで、前記ラッチ駆動機構収納部の内部の気圧を、前記クリーンルームの気圧よりも低圧にすることが可能なものであることを特徴とする請求項1から請求項4のいずれか1項に記載のロードポート。 - クリーンルーム内に設置されたウェーハ搬送室に隣接して設けられた請求項1から請求項5のいずれか1項に記載のロードポートを用いて、前記ウェーハ搬送室とウェーハ収納容器との間でウェーハの出し入れを行うウェーハ搬送方法であって、
前記ラッチ駆動機構収納部の内部の気圧を、前記クリーンルームの気圧と同圧、又は、前記クリーンルームの気圧よりも低圧とし、
前記吸着具で前記蓋を吸着保持した状態で、前記ラッチで前記容器本体と前記蓋との固定を解除し、前記吸着具に対して相対的に前記容器本体を移動させることで、前記蓋を開け、かつ、前記扉部を前記開口から離脱させて前記開口を開くことで、前記ウェーハ搬送室の内部空間と前記ウェーハ収納容器の内部空間を連結してから、前記ウェーハ搬送室と前記ウェーハ収納容器との間でウェーハの出し入れを行うことを特徴とするウェーハ搬送方法。 - 前記ウェーハ搬送室の内部の気圧を前記クリーンルームの気圧よりも高圧とすることを特徴とする請求項6に記載のウェーハ搬送方法。
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JP2017557230A JP6274379B1 (ja) | 2016-08-08 | 2017-04-24 | ロードポート及びウェーハ搬送方法 |
CN201780047185.3A CN109564887B (zh) | 2016-08-08 | 2017-04-24 | 装载埠以及晶圆搬送方法 |
US16/321,669 US10872799B2 (en) | 2016-08-08 | 2017-04-24 | Load port and method for carrying wafers |
SG11201900801XA SG11201900801XA (en) | 2016-08-08 | 2017-04-24 | Load port and method for carrying wafers |
EP17838991.2A EP3499555B1 (en) | 2016-08-08 | 2017-04-24 | Load port and wafer transfer method |
KR1020197003031A KR102374274B1 (ko) | 2016-08-08 | 2017-04-24 | 로드포트 및 웨이퍼 반송방법 |
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