WO2017154800A1 - レーザ加工装置 - Google Patents

レーザ加工装置 Download PDF

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Publication number
WO2017154800A1
WO2017154800A1 PCT/JP2017/008647 JP2017008647W WO2017154800A1 WO 2017154800 A1 WO2017154800 A1 WO 2017154800A1 JP 2017008647 W JP2017008647 W JP 2017008647W WO 2017154800 A1 WO2017154800 A1 WO 2017154800A1
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WO
WIPO (PCT)
Prior art keywords
laser
laser pulse
pulse
path
light source
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Application number
PCT/JP2017/008647
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English (en)
French (fr)
Japanese (ja)
Inventor
奥平　恭之
Original Assignee
住友重機械工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 住友重機械工業株式会社 filed Critical 住友重機械工業株式会社
Priority to CN201780011198.5A priority Critical patent/CN108698165B/zh
Priority to KR1020187023175A priority patent/KR20180122605A/ko
Publication of WO2017154800A1 publication Critical patent/WO2017154800A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing

Definitions

  • the present invention relates to a laser processing apparatus that cuts out at least two laser pulses on a time axis from one laser pulse and performs laser processing on at least two axes.
  • Patent Document 1 discloses a laser processing apparatus that performs drilling with a laser beam.
  • This laser processing apparatus includes a laser light source and an acoustooptic element (acoustooptic deflector).
  • the acoustooptic device directs the pulse laser beam output from the laser light source to one of a path toward the beam damper, a first processing path toward the processing target, and a second processing path.
  • the pulsed laser beam directed to the first processing path or the second processing path is deflected by the galvano scanner and then enters the target position of the processing object.
  • the laser beam is directed to the first machining path during a certain period within the pulse width of one laser pulse, the other machining period is directed to the second machining path, and the remaining period is directed to the damper path.
  • two laser pulses can be cut out from one laser pulse, and laser processing can be performed in two axes.
  • the light intensity of a laser pulse output from a carbon dioxide laser or the like usually decreases with the passage of time from the rising point.
  • the light intensity of a laser pulse cut out relatively later in time is lower than the light intensity of a laser pulse cut out relatively earlier. Become. For this reason, it is difficult to make the processing quality uniform in each of the plurality of processing axes.
  • An object of the present invention is to provide a laser processing apparatus capable of aligning the processing quality on each processing axis when performing laser processing on a plurality of processing axes.
  • a laser light source for outputting a laser beam
  • An acousto-optic deflector disposed in a path of a laser beam output from the laser light source and directing the incident laser beam to any one of a damper path toward the beam damper, a first processing path, and a second processing path; , A stage for holding a workpiece at a position where the first laser pulse directed to the first machining path is incident and a position where the second laser pulse directed to the second machining path is incident; A first beam deflector and a second beam deflector which are arranged in the first processing path and the second processing path, respectively, and which change the incident position on the processing object held on the stage; A control device for controlling the laser light source, the acousto-optic deflector, the first beam deflector, and the second beam deflector; The controller is A step of operating the first beam deflector and the second beam deflector to move the incident positions of the first laser pulse and the second laser pulse to a target position
  • the pulse width of the first laser pulse changes, the elapsed time from the cutting out of the first laser pulse to the cutting out of the second laser pulse does not vary. For this reason, the ratio between the light intensity of the original laser pulse at the time of cutting out the first laser pulse and the light intensity of the original laser pulse at the time of cutting out the second laser pulse is substantially constant. Even if the pulse width of the first laser pulse changes, the light intensity of the first laser pulse is adjusted by adjusting the diffraction efficiency to the first processing path and the diffraction efficiency to the second processing path. And the light intensity of the second laser pulse can be made substantially equal. As a result, the quality of the processing by the first laser pulse and the processing by the second laser pulse can be made uniform.
  • FIG. 1 is a schematic diagram of a laser processing apparatus according to an embodiment of the present invention and a reference example.
  • FIG. 2A is a schematic plan view of a printed circuit board shown as an example of a workpiece
  • FIG. 2B is a partial cross-sectional view of the printed circuit board
  • FIG. It is sectional drawing which shows the shape of the hole in the formation process of.
  • FIG. 3 is a timing chart of a part of the first shot and the second shot of the operation state of the beam deflector, the oscillation command signal, the path selection signal, and the cutting signal.
  • FIG. 4A is a graph showing an oscillation command signal, a path selection signal, a cutting signal timing chart, and a laser pulse waveform at the time of cutting out the first-shot laser pulse when processing with the laser processing apparatus according to the reference example.
  • FIG. 4B is a graph showing an oscillation command signal, a path selection signal, a cutting signal timing chart, and a laser pulse waveform when the second and third shot laser pulses are cut out.
  • FIG. 5A is a graph showing an oscillation command signal, a path selection signal, a cutting signal timing chart, and a laser pulse waveform at the time of cutting out the first-shot laser pulse when processing is performed by the laser processing apparatus according to the embodiment.
  • FIG. 1 is a graph showing an oscillation command signal, a path selection signal, a cutting signal timing chart, and a laser pulse waveform at the time of cutting out the first-shot laser pulse when processing is performed by the laser processing apparatus according to the embodiment.
  • 5B is a graph showing an oscillation command signal, a path selection signal, a cutting signal timing chart, and a laser pulse waveform when the second and third shot laser pulses are cut out.
  • 6A to 6C are timing charts of an oscillation command signal, an operation state of a beam deflector, a path selection signal, and a cutting signal in a laser processing apparatus according to another embodiment.
  • FIG. 7 is a timing chart of an oscillation command signal, an operation state of a beam deflector, a path selection signal, and a cutting signal in a laser processing apparatus according to still another embodiment.
  • FIG. 1 shows a schematic diagram of a laser processing apparatus according to an embodiment of the present invention and a reference example.
  • the laser light source 10 receives the oscillation command signal S0 from the control device 55, oscillates, and outputs a pulsed laser beam PLB.
  • a carbon dioxide laser is used for the laser light source 10.
  • oscillation start is commanded by the rising edge of the oscillation command signal S0
  • oscillation stop is commanded by the falling edge of the oscillation command signal S0.
  • An acousto-optic deflector (AOD) 20 is disposed in the path of the pulse laser beam PLB output from the laser light source 10 and passing through the optical system 11.
  • the optical system 11 includes, for example, a beam expander and an aperture.
  • the AOD 20 directs the incident laser beam to any one of the damper path PD, the first machining path MP1, and the second machining path MP2 toward the beam damper 13.
  • the AOD 20 includes an acousto-optic crystal 21, a transducer 22, and a driver 23.
  • the transducer 22 is driven by the driver 23 to generate an elastic wave in the acousto-optic crystal 21.
  • the driver 23 is provided with a path switching terminal 24, a cutting terminal 25, a first diffraction efficiency adjustment knob 26, and a second diffraction efficiency adjustment knob 27.
  • a route selection signal S ⁇ b> 1 is input from the control device 55 to the route switching terminal 24.
  • One of the first machining path MP1 and the second machining path MP2 is selected by the path selection signal S1.
  • the cut signal S ⁇ b> 2 is input from the control device 55 to the cut terminal 25.
  • the AOD 20 directs the incident laser beam to the damper path PD.
  • the AOD 20 directs the laser beam to the path selected by the path selection signal S1 out of the first machining path MP1 and the second machining path MP2.
  • the first diffraction efficiency adjustment knob 26 can adjust the diffraction efficiency when the input laser beam is directed to the first machining path MP1.
  • the second diffraction efficiency adjustment knob 27 can adjust the diffraction efficiency when the input laser beam is directed to the second machining path MP2.
  • the AOD 20 has a function of independently adjusting the diffraction efficiency to the first machining path MP1 and the diffraction efficiency to the second machining path MP2.
  • the light intensity of the laser beam directed to the first machining path MP1 and the second machining path MP2 can be adjusted.
  • a command value of the diffraction efficiency may be input to the driver 23 from the control device 55.
  • the laser beam output to the first machining path MP1 is reflected by the mirror 30 and enters the beam deflector 31.
  • the beam deflector 31 changes the traveling direction of the laser beam in a two-dimensional direction.
  • a pair of galvano scanners can be used as the beam deflector 31, for example.
  • the laser beam deflected by the beam deflector 31 is converged by the f ⁇ lens 32 and then enters the workpiece 33.
  • the laser beam output to the second processing path MP2 enters the processing object 43 via the mirror 40, the beam deflector 41, and the f ⁇ lens 42.
  • the workpieces 33 and 43 are held on the stage 50.
  • the beam deflectors 31 and 41 receive control signals G1 and G2 from the control device 55, respectively, and operate so that the laser beam enters the commanded target position.
  • the controller 55 is notified of the completion of setting.
  • FIG. 2A shows a schematic plan view of a printed circuit board 60 as an example of the processing objects 33 and 43.
  • the surface of the printed circuit board 60 is divided into a plurality of blocks 61.
  • Each block 61 is set to such a size that the beam incident position can be moved by the operation of the beam deflectors 31 and 41 (FIG. 1).
  • a plurality of target positions 62 of holes to be formed are defined on the surface of the printed circuit board 60.
  • the coordinates of the plurality of target positions 62 and the processing order are stored in advance in the control device 55 (FIG. 1).
  • the control device 55 moves the stage 50, so that the unprocessed block 61 is scanned by the beam deflectors 31, 41 (FIG. 1). Place in the possible area. Thereafter, the unprocessed block 61 is processed in the same procedure.
  • FIG. 2B shows a partial cross-sectional view of the printed circuit board 60.
  • An inner layer conductor pattern 66 is disposed on the surface of the core substrate 65.
  • An insulating layer 67 is disposed on the core substrate 65 and the conductor pattern 66, and a conductor pattern 68 is disposed on the surface thereof.
  • a resin such as epoxy is used for the core substrate 65 and the insulating layer 67.
  • copper is used for the conductor patterns 66 and 68.
  • FIG. 2C shows the shape of the hole in the formation process when the drilling process is performed with the incident pulse laser beam.
  • FIG. 2C shows an example in which one drilling process is completed with three shot laser pulses.
  • a hole 68A is formed in the conductor pattern 68 on the surface by the first shot laser pulse.
  • the surface layer portion of the insulating layer 67 on the bottom surface of the hole 68A is also removed, thereby forming a recess 67A.
  • a recess 67B is formed by deepening the recess 67A formed in the insulating layer 67 by the second shot laser pulse. Due to the third shot laser pulse, the recess 67B becomes deeper and a hole 67C reaching the inner conductor pattern 66 is formed.
  • the suitable pulse width of the laser pulse varies depending on the material of the workpiece. For example, the pulse widths of the second and third shot laser pulses are shorter than the pulse width of the first shot laser pulse.
  • the procedure for processing in one block 61 (FIG. 2A) will be described.
  • the incident position of the laser beam is moved to the next target position 62, and the first shot laser pulse is incident on the new target position 62.
  • the second shot laser pulse is sequentially incident on all target positions 62.
  • the third shot laser pulse is incident on all target positions 62 in order.
  • the second shot laser pulse and the third shot laser pulse are continuously incident on a single target position 62 with a minute time interval without moving the incident position of the laser beam. Also good.
  • FIG. 3 shows a timing chart of a part of the first shot and the second shot of the operation state of the beam deflectors 31, 41 (FIG. 1), the oscillation command signal S0, the path selection signal S1, and the cutting signal S2.
  • the period during which the beam deflectors 31 and 41 are operating is represented by two lines divided up and down, and the settling period is represented by one line.
  • the controller 55 When one shot of the laser pulse is incident on one target position 62 (FIG. 2A), the controller 55 operates the beam deflectors 31 and 41 to process the incident position of the laser beam next. Move to the target position 62.
  • the control is performed.
  • the device 55 starts sending the oscillation command signal S0 to the laser light source 10 (time t2). Thereby, the output of the laser pulse of the pulse laser beam PLB output from the laser light source 10 is started.
  • the rising edge of the oscillation command signal S0 corresponds to an oscillation start command for the laser light source 10.
  • the first machining path MP1 is selected by the path selection signal S1.
  • the control device 55 sends out a cutting signal S2 having a predetermined pulse width PW1 (time t3). Thereby, one laser pulse is cut out in the first machining path MP1. Thereafter, the control device 55 sends a route selection signal S1 for selecting the second machining route MP2 (time t4). In a state where the second machining path MP2 is selected, the control device 55 sends out a cutting signal S2 having a predetermined pulse width PW1 (time t5). Thereby, one laser pulse is cut out in the second machining path MP2.
  • control device 55 stops sending the oscillation command signal S0 and returns the route selected by the route selection signal S1 to the first machining route MP1 (time t7).
  • the falling edge of the oscillation command signal S0 corresponds to an oscillation stop command for the laser light source 10.
  • control signals G1 and G2 are sent to the beam deflectors 31 and 41 to move the laser beam incident position to the next target position 62 (FIG. 2A).
  • FIG. 3 shows an example in which the pulse width of the cut signal S2 for cutting out the laser pulse for the second shot is shorter than the pulse width of the cut signal S2 for cutting out the laser pulse for the first shot.
  • FIG. 4A shows a timing chart of the oscillation command signal S0, the path selection signal S1, and the cutting signal S2 when cutting the laser pulse of the first shot, and the waveform of the laser pulse.
  • the pulse of the cutting signal S2 is sent out (time t3) in a state where the first machining path MP1 is selected by the path selection signal S1, the first machining path MP1 is first transferred from the original laser pulse LP0.
  • the laser pulse LP1 is cut out.
  • the pulse of the cutting signal S2 is sent out (time t5) while the second machining path MP2 is selected by the path selection signal S1, the second laser beam LP0 is transferred to the second machining path MP2 from the original laser pulse LP0.
  • the laser pulse LP2 is cut out.
  • the pulse width of the first laser pulse LP1 and the pulse width of the second laser pulse LP2 are the same.
  • the ratio of the light intensity of the first laser pulse LP1 to the original laser pulse LP0 is determined by the setting of the first diffraction efficiency adjustment knob 26.
  • the ratio of the light intensity of the second laser pulse LP2 to the original laser pulse LP0 is determined by the setting of the second diffraction efficiency adjustment knob 27.
  • the light intensity of the original laser pulse LP0 when the first machining path MP1 is selected by the path selection signal S1 is the light intensity of the original laser pulse LP0 when the second machining path MP2 is selected by the path selection signal S1. Stronger than light intensity.
  • the first diffraction efficiency adjustment knob 26 and the second diffraction efficiency are adjusted so that the diffraction efficiency into the first machining path MP1 is lower than the diffraction efficiency into the second machining path MP2.
  • the diffraction efficiency is adjusted by the diffraction efficiency adjustment knob 27.
  • the attenuation amount of the light intensity when the first laser pulse LP1 is cut out from the original laser pulse LP0 is larger than the attenuation amount of the light when the second laser pulse LP2 is cut out from the original laser pulse LP0.
  • the pulse energy of the first laser pulse LP1 and the pulse energy of the second laser pulse LP2 are substantially equal.
  • the diffraction efficiency to the first machining path MP1 and the second machining path MP2 are set so that the pulse energy of the first laser pulse LP1 and the pulse energy of the second laser pulse LP2 are substantially equal. The diffraction efficiency is adjusted.
  • FIG. 4B shows a timing chart of the oscillation command signal S0, the path selection signal S1, and the cutting signal S2 when cutting the laser pulse of the second shot, and the waveform of the laser pulse. Note that the timing for cutting out the laser pulse for the third shot is the same as the timing for cutting out the laser pulse for the second shot.
  • the pulse width PW2 of the cutout signal S2 is shorter than the pulse width PW1 of the cutout signal S2 when cutting out the first shot laser pulse.
  • the pulse width of the original laser pulse LP0 is also shorter than the pulse width of the original laser pulse LP0 of the first shot.
  • the pulse width of the original laser pulse LP0 is short, the waveform from the rising edge to the falling edge is almost the same as the waveform of the corresponding portion of the original laser pulse LP0 of the first shot.
  • the elapsed time from the time when the first laser pulse LP1 is cut out (time t3) to the time when the second laser pulse LP2 is cut out (time t5) is longer in the second shot than in the first shot. short. For this reason, the amount of decrease in the light intensity of the original laser pulse LP0 from when the first laser pulse LP1 is cut out until the second laser pulse LP2 is cut out is when the second shot is the first shot. Fewer.
  • the diffraction efficiency to the first machining path MP1 and the diffraction efficiency to the second machining path MP2 are the same for the second shot and the first shot.
  • the pulse energy of the first laser pulse LP1 of the second shot becomes smaller than the pulse energy of the second laser pulse LP2.
  • the pulse energy of the first laser pulse LP1 output to the first machining path MP1 and the first shot in all of the first shot, the second shot, and the third shot It is difficult to make the pulse energy of the second laser pulse LP2 output to the second machining path MP2 substantially the same.
  • FIG. 5A shows a timing chart of the oscillation command signal S0, the path selection signal S1, and the cutting signal S2 when cutting out the first-shot laser pulse, and the laser pulse waveform. This timing chart is the same as the timing chart of the reference example shown in FIG. 4A.
  • FIG. 5B shows a timing chart of the oscillation command signal S0, the path selection signal S1, and the cutting signal S2 when cutting the laser pulse of the second shot, and the laser pulse waveform.
  • the timing for cutting out the laser pulse for the third shot is the same as the timing for cutting out the laser pulse for the second shot. From the time when the control device 55 controls the laser light source 10 to start outputting the original laser pulse LP0 (time t2) to the time when the first laser pulse LP1 is output to the first machining path MP1 (time t3). The elapsed time is unchanged from the first shot to the third shot, as in the case of the reference example.
  • the pulse width PW2 of the first laser pulse LP1 output to the first processing path MP1 is set to the pulse width at the first shot. Change from PW1. Specifically, the pulse width PW2 is made shorter than the pulse width PW1. Even when the pulse width is shortened, the time point at which cutting out of the second laser pulse LP2 to the second machining path MP2 is instructed from the time point (time t3) at which cutting out of LP1 of the first laser pulse is instructed. The elapsed time until (time t5) is not changed between the first shot and the second shot.
  • the diffraction efficiency to the first machining path MP1 and the diffraction efficiency to the second machining path MP2 are the same as in the reference example, the pulse energy of the first laser pulse LP1 (FIG. 5A) of the first shot. And the pulse energy of the second laser pulse LP2 (FIG. 5A) are set to be substantially equal.
  • the portion where the second laser pulse LP2 is cut out in the second machining path MP2 in the pulse width of the original laser pulse LP0 is the same for the first shot and the second shot. It is. For this reason, in the second shot, the difference between the pulse energy of the first laser pulse LP1 and the pulse energy of the second laser pulse LP2 can be reduced as compared with the reference example.
  • the first machining is performed.
  • the machining quality of the path MP1 and the second machining path MP2 can be made uniform.
  • three shots of laser pulses are incident on one processing point, but the number of shots of the incident laser pulses is not limited to three.
  • the laser pulse incident on one processing point may be 2 shots or 4 shots or more.
  • the cut-out timing of the third and subsequent shots may be the same as the cut-out timing of the second shot.
  • the control device 55 receives the oscillation command signal immediately after the beam deflectors 31, 41 (FIG. 1) are set (time t1 in FIG. 3). Transmission of S0 is started (time t2). In the embodiment described below, the time at which the control device 55 starts sending the oscillation command signal S0 is limited within a certain range.
  • FIG. 6A shows a timing chart of the oscillation command signal S0, the operation states of the beam deflectors 31, 41, the path selection signal S1, and the cutting signal S2 in the laser processing apparatus according to the present embodiment.
  • the operation states of the two beam deflectors 31 and 41 are shown in an overlapping manner.
  • the lower limit value RPL and the upper limit value RPU of the repetition period of the laser pulse output from the laser light source 10 are stored in the control device 55.
  • the control device 55 sends the oscillation command signal S0 so that the repetition period of the laser pulse falls within the range between the lower limit value RPL and the upper limit value RPU.
  • the control device 55 starts sending the oscillation command signal S0 (time t12) immediately after the operation of the beam deflectors 31, 41 is completed (time t11).
  • the timing chart of the route selection signal S1 and the cutout signal S2 is common to the embodiment shown in FIGS. 5A and 5B.
  • the control device 55 Until the time corresponding to the lower limit value RPL has elapsed, the transmission of the oscillation command signal S0 to the laser light source 10 is awaited.
  • the control device 55 starts sending the oscillation command signal S0 when the time corresponding to the lower limit value RPL has elapsed (time t14) from the rising time (time t10) of the oscillation command signal S0 of the previous cycle.
  • the operations of the beam deflectors 31 and 41 are completed when the elapsed time from the rising point (time t10) of the oscillation command signal S0 in the previous cycle reaches the upper limit value RPU (time t15). If not, the control device 55 starts sending the oscillation command signal S0 to the laser light source 10 at that time. However, the control device 55 does not send out the pulse of the cutout signal S2. Therefore, the original laser pulse output from the laser light source 10 is directed to the damper path PD (FIG. 1) in all time zones within the pulse width.
  • the following is performed so that the elapsed time from the rising point (time t15) of the oscillation command signal S0 in the previous cycle is within the range between the lower limit value RPL and the upper limit value RPU.
  • the transmission timing of the oscillation command signal S0 is determined. For example, when the beam deflectors 31 and 41 are set at the time (time t17) when the time corresponding to the lower limit value RPL has elapsed from the rising time (time t15) of the oscillation command signal S0 in the previous cycle, the time At t17, the control device 55 starts sending the oscillation command signal S0.
  • the lower limit value RPL and the upper limit value RPU of the pulse repetition period of the embodiment shown in FIGS. 6A to 6C are set to the same value. Therefore, the laser light source 10 outputs the original laser pulse LP0 (FIGS. 5A and 5B) at a constant repetition frequency regardless of the operation of the beam deflectors 31 and 41.
  • the cut-out signal S2 for cutting out the first laser pulse LP1 and the second laser pulse LP2 is sent out (time t22, t23).
  • the laser pulse is transferred from the original laser pulse LP0 to the first machining path MP1 and the second machining path MP2.
  • the pulse of the cut-out signal S2 for cutting out is not sent out. For this reason, the original laser pulse LP0 is directed to the damper path PD (FIG. 1).
  • the pulse repetition frequency of the pulse laser beam output from the laser light source 10 is constant, so that the stability of the pulse energy of the original laser pulse LP0 can be further improved.
  • the pulse energy of the first laser pulse LP1 and the second laser pulse LP2 directed to the first machining path MP1 and the second machining path MP2 is also stabilized.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
PCT/JP2017/008647 2016-03-09 2017-03-06 レーザ加工装置 WO2017154800A1 (ja)

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CN201780011198.5A CN108698165B (zh) 2016-03-09 2017-03-06 激光加工装置
KR1020187023175A KR20180122605A (ko) 2016-03-09 2017-03-06 레이저가공장치

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JP2016045341A JP2017159317A (ja) 2016-03-09 2016-03-09 レーザ加工装置
JP2016-045341 2016-03-09

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JP7125254B2 (ja) * 2017-10-12 2022-08-24 ビアメカニクス株式会社 レーザ加工装置及びレーザ加工方法
JP7190808B2 (ja) * 2017-11-08 2022-12-16 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
JP7043128B2 (ja) * 2018-01-31 2022-03-29 住友重機械工業株式会社 レーザ制御装置及びレーザ加工方法
JP2020151736A (ja) * 2019-03-19 2020-09-24 住友重機械工業株式会社 レーザ制御装置及びパルスレーザ出力装置
JP7262410B2 (ja) * 2020-03-11 2023-04-21 住友重機械工業株式会社 加工順決定装置、レーザ加工装置、及びレーザ加工方法
JP2023007738A (ja) 2021-07-02 2023-01-19 住友重機械工業株式会社 レーザ制御装置及びレーザパルス切出し方法
CN115519243B (zh) * 2022-11-25 2023-03-21 武汉铱科赛科技有限公司 一种激光脉冲时空相关定位扫描方法、装置及系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010516476A (ja) * 2007-01-26 2010-05-20 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 材料加工のためのパルス列を生成する方法及びシステム
JP2012106266A (ja) * 2010-11-18 2012-06-07 Sumitomo Heavy Ind Ltd レーザ加工方法及びレーザ加工装置
JP2015186822A (ja) * 2014-03-27 2015-10-29 住友重機械工業株式会社 レーザ加工装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3213882B2 (ja) * 1997-03-21 2001-10-02 住友重機械工業株式会社 レーザ加工装置及び加工方法
US7521651B2 (en) * 2003-09-12 2009-04-21 Orbotech Ltd Multiple beam micro-machining system and method
JP5036276B2 (ja) * 2006-11-02 2012-09-26 株式会社ディスコ レーザー加工装置
JP4274251B2 (ja) * 2007-01-24 2009-06-03 ソニー株式会社 レーザ描画方法及びレーザ描画装置
JP2010158691A (ja) * 2009-01-07 2010-07-22 Disco Abrasive Syst Ltd レーザー加工装置
TWM417976U (en) * 2011-07-13 2011-12-11 Chun-Hao Li Laser machining table
JP6415357B2 (ja) * 2015-03-06 2018-10-31 住友重機械工業株式会社 レーザ加工装置
TWM510208U (zh) * 2015-06-02 2015-10-11 E&R Engineering Corp 雷射加工裝置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010516476A (ja) * 2007-01-26 2010-05-20 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 材料加工のためのパルス列を生成する方法及びシステム
JP2012106266A (ja) * 2010-11-18 2012-06-07 Sumitomo Heavy Ind Ltd レーザ加工方法及びレーザ加工装置
JP2015186822A (ja) * 2014-03-27 2015-10-29 住友重機械工業株式会社 レーザ加工装置

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