WO2017124682A1 - 用于制造柔性基板的方法、柔性基板和显示装置 - Google Patents

用于制造柔性基板的方法、柔性基板和显示装置 Download PDF

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WO2017124682A1
WO2017124682A1 PCT/CN2016/084935 CN2016084935W WO2017124682A1 WO 2017124682 A1 WO2017124682 A1 WO 2017124682A1 CN 2016084935 W CN2016084935 W CN 2016084935W WO 2017124682 A1 WO2017124682 A1 WO 2017124682A1
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film layer
flexible substrate
film
coating
layer
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PCT/CN2016/084935
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English (en)
French (fr)
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谢明哲
刘陆
谢春燕
王和金
郭远征
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京东方科技集团股份有限公司
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Priority to US15/503,994 priority Critical patent/US10319924B2/en
Publication of WO2017124682A1 publication Critical patent/WO2017124682A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/263—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer having non-uniform thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption
    • B32B2307/7242—Non-permeable
    • B32B2307/7244—Oxygen barrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/726—Permeability to liquids, absorption
    • B32B2307/7265—Non-permeable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to the field of flexible substrates, and more particularly to a method for manufacturing a flexible substrate, a flexible substrate produced by the method, and a display device including the flexible substrate.
  • the flexible flexible substrate is more and more widely used in the fields of thin film printed circuit boards, flexible display panels, and the like because of its light weight, thin thickness, and softness.
  • a material such as polyimide or polyetheretherketone is usually coated on a glass carrier a plurality of times to form a multilayer film layer, and the formed multilayer film layer is peeled off to form a final Flexible substrate.
  • FIG. 1 in the process of coating the film layer, due to the combination of the surface tension of the material, or the surface tension and the liquid flow, there is a film thickness unstable region around the coating film, and this film The thick unstable region becomes larger as the film thickness increases, and becomes higher as the film layer increases.
  • the present invention provides a novel method for fabricating a flexible substrate.
  • a method for manufacturing a flexible substrate comprising the steps of: coating a multilayer film layer on a glass carrier, wherein at least one pair of adjacent films of the multilayer film layer Each pair of adjacent film layers in the layer is formed in the following manner: step S1: coating the first film layer; step S2: coating a second film layer on the first film layer, the second film layer Covering the first film layer, wherein an area of the second film layer is larger than an area of the first film layer; and peeling off the formed multilayer film layer structure from the glass carrier to form a flexible substrate.
  • a thickness unstable portion is formed at an edge of the first film layer in the first coating
  • This increases the process area
  • the domain eliminates the problem that the available coating area due to double-layer coating is small and the film thickness is unstable.
  • the edge of the first film layer and the edge of the second film layer are separated by 5 mm or more.
  • a barrier layer is provided on the first film layer for blocking water and/or oxygen, and in step S2, the second film layer covers the barrier layer.
  • the first film layer and the second film layer are applied by nip extrusion coating.
  • the at least one pair of adjacent film layers includes a pair of adjacent film layers, and the first film layer is coated on the glass carrier.
  • the first film layer and the second film layer are polyimide film layers.
  • a flexible substrate produced by the above method is provided.
  • the thickness of the second film layer is greater than or equal to 10% of the thickness of the first film layer.
  • a display device including the above flexible substrate is provided.
  • Fig. 1 is a view schematically showing a schematic diagram in which a film thickness unstable region of a protrusion around a coating film becomes larger as the film thickness increases as a film layer is coated;
  • FIGS. 2A-2C schematically show schematic structural views corresponding to respective steps of one example of a method for fabricating a flexible substrate according to an embodiment of the present invention.
  • a method for fabricating a flexible substrate in accordance with an embodiment of the present invention includes the steps of: step S1: coating the first film layer 2 on the glass carrier 1; step S2: coating the second film layer 4 on the glass carrier 1 so that the second film layer 4 covers the first film layer 2, The area of the second film layer 4 is larger than the area of the first film layer 2. Then, the formed film layer structure is peeled off from the glass carrier 1 to form a flexible substrate.
  • the thickness unstable portion 2a is formed at the edge of the first film layer in the first coating, by coating the second film layer on the first film layer
  • the film layer is such that the second film layer covers the first film layer, that is, the area of the second film layer is larger than that of the first film layer, and the thickness unstable portion 2a can be covered by the subsequently coated second film layer to achieve planarization.
  • the thickness unstable portion 4a is formed only at the edge of the second film layer. This increases the process area and eliminates the problems associated with double layer coating.
  • a barrier layer 3 (for example formed of an inorganic material capable of blocking water and/or oxygen) is provided on the first film layer 2 prior to step S2 for blocking water and/or oxygen. And in step S2, the second film layer 4 covers the barrier layer 3.
  • the present invention is not limited to coating two film layers, and a plurality of film layers may be coated as long as at least one pair of adjacent film layers of the plurality of film layers are combined with the first film layer and the second film described above.
  • the formation of the layers may be performed in the same manner.
  • a barrier layer (for example formed of an inorganic material capable of blocking water and/or oxygen) may be disposed between the at least one pair of adjacent film layers for blocking water and/or oxygen.
  • the at least one pair of adjacent film layers includes a pair of adjacent film layers, wherein the first film layer is coated on the glass carrier.
  • the first film layer 2 and the second film layer 4 are polyimide film layers.
  • the present invention is not limited thereto, and any material suitable for forming a flexible substrate can be used.
  • the first film layer 2 and the second film layer 4 may be applied by a nip extrusion coating method.
  • a nip extrusion coating method In this way, a large-area, thick-thick film layer can be realized, and materials can be saved.
  • the method for producing a flexible substrate of the present invention is particularly suitable for such a coating method.
  • the barrier layer 3 can be formed using any suitable means and materials present.
  • the edge of the first film layer 2 and the edge of the second film layer 4 are 5 mm or more apart, that is, the edge of the first film layer 2 and the second film layer 4.
  • the distance d between the edges is greater than or equal to 5 mm. It should be noted that it is possible to easily utilize existing equipment by adjusting process parameters and the like, such as modifying process parameters in the input process software.
  • the step of coating the second film layer such that the edge of the first film layer is spaced from the edge of the second film layer by a distance, for example equal to or greater than 5 mm, is achieved without the need for additional equipment and processes.
  • the thickness of the second film layer 4 is greater than or equal to 10% of the thickness of the first film layer 2.
  • the reason for this arrangement is that the inventors have found that the thickness of the protruding portion of the thickness of the unstable region of the film layer is generally 10% of the thickness of the film layer. Therefore, setting the thickness of the second film layer to be greater than or equal to 10% of the thickness of the first film layer ensures that the second film layer necessarily covers the unstable region of the thickness of the first film layer, achieving planarization there.
  • the method for fabricating a flexible substrate in accordance with the present invention has been described above with reference to specific embodiments.
  • the present invention also provides a flexible substrate produced by the method as described above and a display device including the same.

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Abstract

一种用于制造柔性基板的方法、使用该方法制成的柔性基板和包括该柔性基板的显示装置。该方法包括步骤：在玻璃载体（1）上涂布多层膜层（2,3,4），其中多层膜层（2,3,4）中的至少一对相邻膜层中的每一对相邻膜层以如下方式形成：步骤S1：涂布第一膜层（2），和步骤S2：在第一膜层（2）上涂布第二膜层（4），使第二膜层（4）覆盖第一膜层（2），其中第二膜层（4）的面积大于第一膜层（2）的面积；和将所形成的膜层结构从玻璃载体（1）上剥离，形成柔性基板。

Description

用于制造柔性基板的方法、柔性基板和显示装置 技术领域
本发明涉及柔性基板领域，尤其涉及一种用于制造柔性基板的方法、通过该方法制成的柔性基板和包括该柔性基板的显示装置。
背景技术
与传统的硬质基板相比，能够弯曲的柔性基板以其重量轻、厚度薄、柔软等优点被越来越广泛地应用于薄膜印刷电路板、可弯曲显示面板等领域中。在柔性基板的制造技术中，通常是在玻璃载体上多次涂布聚酰亚胺或聚醚醚酮等材料而形成多层膜层，并且将所形成的多层膜层剥离，从而形成最终的柔性基板。然而，如图1所示，在涂布膜层的过程中，由于材料表面张力、或表面张力和液体流动的共同作用，在涂膜的周围会有突起的膜厚不稳定区，而且这个膜厚不稳定区随着膜厚的增高而变大，随着膜层的增多而变高。
发明内容
为了克服或者至少缓解上述缺点，本发明提供一种新颖的用于制造柔性基板的方法。具体地，根据本发明的一方面，提供一种用于制造柔性基板的方法，包括步骤：在玻璃载体上涂布多层膜层，其中所述多层膜层中的至少一对相邻膜层中的每一对相邻膜层以如下方式形成：步骤S1：涂布第一膜层；步骤S2：在所述第一膜层上涂布第二膜层，使所述第二膜层覆盖所述第一膜层，其中所述第二膜层的面积大于所述第一膜层的面积；和将所形成的多层膜层结构从所述玻璃载体上剥离，形成柔性基板。
在根据本发明的用于制造柔性基板的方法中，虽然在第一次涂布中在第一膜层的边缘处形成了厚度不稳定部分，但是通过在第一膜层上涂布第二膜层，使得第二膜层覆盖第一膜层，即第二膜层的面积大于第一膜层，可以使该厚度不稳定部分被随后涂布的第二膜层覆盖而实现平坦化，从而仅仅在第二膜层的边缘处形成厚度不稳定部分。这样，增大了工艺使用区 域，消除了双层涂布所带来的可用涂布面积小、膜厚不稳定区域大的问题。
优选地，在步骤S2中，所述第一膜层的边缘与所述第二膜层的边缘之间相距5mm或大于5mm。
优选地，在步骤S2之前，在所述第一膜层上设置阻隔层，用于阻隔水和/或氧，且在步骤S2中，所述第二膜层覆盖所述阻隔层。
在一实施例中，通过夹缝挤出式涂布方式涂布所述第一膜层和所述第二膜层。
在一实施例中，所述至少一对相邻膜层包括一对相邻膜层，并且第一膜层被涂布设置在所述玻璃载体上。
在一实施例中，所述第一膜层和所述第二膜层是聚酰亚胺膜层。
根据本发明的另一方面，提供一种通过上述方法制作的柔性基板。优选地，所述第二膜层的厚度大于或等于所述第一膜层的厚度的10％。
根据本发明的还一方面，提供一种包括上述柔性基板的显示装置。
附图说明
通过下面结合附图说明本发明的优选实施例，将使本发明的上述及其它目的、特征和优点更加清楚，其中：
图1示意性地示出涂布膜层时涂膜周围的突起的膜厚不稳定区随着膜厚的增高而变大的原理图；和
图2A-2C示意性地示出根据本发明实施例的用于制作柔性基板的方法的一个示例的各个步骤所对应的结构示意图。
在本发明的所有附图中，相同或相似的结构均以相同或相似的附图标记标识。另外，本发明的附图仅为示意目的，并非按比例绘制。
具体实施方式
下面参照附图对本发明的优选实施例进行详细说明，在描述过程中省略了对于本发明来说是不必要的细节和功能，以防止对本发明的理解造成混淆。此外，应该指出的是，本发明中所用的“第一”和“第二”仅仅是为了便于在描述过程中进行区别，而并没有任何限定作用。
如图2A-2C所示，根据本发明实施例的用于制造柔性基板的方法的一 个示例包括步骤：步骤S1：在玻璃载体1上涂布第一膜层2；步骤S2：在玻璃载体1上涂布第二膜层4，使第二膜层4覆盖第一膜层2，其中第二膜层4的面积大于第一膜层2的面积。然后，将所形成的膜层结构从玻璃载体1上剥离，形成柔性基板。
在根据本发明的用于制造柔性基板的方法中，虽然在第一次涂布中在第一膜层的边缘处形成了厚度不稳定部分2a，但是通过在第一膜层上涂布第二膜层，使得第二膜层覆盖第一膜层，即第二膜层的面积大于第一膜层，可以使该厚度不稳定部分2a被随后涂布的第二膜层覆盖而实现平坦化，从而仅仅在第二膜层的边缘处形成厚度不稳定部分4a。这样，增大了工艺使用区域，消除了双层涂布所带来的问题。
在一可选或优选实施例中，在步骤S2之前，在第一膜层2上设置阻隔层3(例如由能够阻隔水和/或氧的无机材料形成)，用于阻隔水和/或氧，且在步骤S2中，第二膜层4覆盖阻隔层3。
应该指出的是，本发明不局限于涂布两层膜层，可以涂布多个膜层，只要多个膜层中的至少一对相邻膜层以与上述第一膜层和第二膜层的形成方式相同的方式形成即可。可选地，所述至少一对相邻膜层之间可以设置阻隔层(例如由能够阻隔水和/或氧的无机材料形成)，用于阻隔水和/或氧。在上述实例中，所述至少一对相邻膜层包括一对相邻膜层，其中第一膜层被涂布设置在玻璃载体上。
在一实施例中，第一膜层2和第二膜层4是聚酰亚胺膜层。然而，本发明不局限于此，可以使用适于形成柔性基板的任何材料。
此外，在一实施例中，可以通过夹缝挤出式涂布方式涂布第一膜层2和第二膜层4。采用这种方式能够实现面积大、厚度厚的膜层，并且节省材料。而且，由于厚度不稳定区域的问题主要出现在夹缝挤出式涂布方式中，因此，本发明的用于制作柔性基板的方法尤其适用此种涂布方式。此外，阻隔层3可以使用现有的任何适当的方式和材料形成。
在一个优选实施例中，在步骤S2中，第一膜层2的边缘与第二膜层4的边缘之间相距5mm或大于5mm，即第一膜层2的边缘与第二膜层4的边缘之间的距离d为大于或等于5mm。应该指出的是，可以通过调整工艺参数等方法，例如修改输入工艺加工软件中的工艺参数，容易地利用现有设 备实现上述涂布第二膜层、使第一膜层的边缘与第二膜层的边缘相距一段距离，例如等于或大于5mm的步骤，而不需要额外的设备和工艺。
在一优选实施例中，第二膜层4的厚度大于或等于第一膜层2的厚度的10％。这样设置的原因在于，发明人发现：膜层的厚度不稳定区域的厚度突起部分的高度一般是膜层厚度的10％。因此，设置第二膜层的厚度大于或等于第一膜层的厚度的10％能够保证第二膜层必然覆盖第一膜层的厚度不稳定区域，实现该处的平坦化。
以上参考具体实施例描述了根据本发明的用于制作柔性基板的方法。本发明还提供一种通过如上所述方法制作的柔性基板和包括所述柔性基板的显示装置。
至此已经结合优选实施例对本发明进行了描述。应该理解，本领域技术人员在不脱离本发明的精神和范围的情况下，可以进行各种其它的改变、替换和添加。因此，本发明的范围不局限于上述特定实施例，而应由所附权利要求所限定。

Claims (11)

  1. 一种用于制造柔性基板的方法，包括步骤：
    在玻璃载体上涂布多层膜层，其中所述多层膜层中的至少一对相邻膜层中的每一对相邻膜层以如下方式形成：
    步骤S1：涂布第一膜层；
    步骤S2：在所述第一膜层上涂布第二膜层，使所述第二膜层覆盖所述第一膜层，其中所述第二膜层的面积大于所述第一膜层的面积；和
    将所形成的多层膜层结构从所述玻璃载体上剥离，形成柔性基板。
  2. 根据权利要求1所述的方法，其中在步骤S2中，所述第一膜层的边缘与所述第二膜层的边缘之间相距5mm或大于5mm。
  3. 根据权利要求1或2所述的方法，还包括：在步骤S2之前，在所述第一膜层上设置阻隔层，用于阻隔水和/或氧，且在步骤S2中，所述第二膜层覆盖所述阻隔层。
  4. 根据权利要求1或2所述的方法，其中通过夹缝挤出式涂布方式涂布所述第一膜层和所述第二膜层。
  5. 根据权利要求1或2所述的方法，其中所述至少一对相邻膜层包括一对相邻膜层，并且第一膜层被涂布设置在玻璃载体上。
  6. 根据权利要求5所述的方法，还包括步骤：在所述一对相邻膜层之间设置阻隔层，用于阻隔水和/或氧。
  7. 根据权利要求6所述的方法，其中通过夹缝挤出式涂布方式涂布所述第一膜层和所述第二膜层。
  8. 根据权利要求1或2所述的方法，其中所述第一膜层和所述第二膜层是聚酰亚胺膜层。
  9. 一种通过如权利要求1-8中任一项所述的方法制作的柔性基板。
  10. 根据权利要求9所述的柔性基板，其中所述第二膜层的厚度大于或等于所述第一膜层的厚度的10％。
  11. 一种显示装置，包括如权利要求9至10中任一项所述的柔性基板。
PCT/CN2016/084935 2016-01-20 2016-06-06 用于制造柔性基板的方法、柔性基板和显示装置 WO2017124682A1 (zh)

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