WO2017038941A1 - 樹脂組成物、硬化物、封止用フィルム及び封止構造体 - Google Patents

樹脂組成物、硬化物、封止用フィルム及び封止構造体 Download PDF

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WO2017038941A1
WO2017038941A1 PCT/JP2016/075688 JP2016075688W WO2017038941A1 WO 2017038941 A1 WO2017038941 A1 WO 2017038941A1 JP 2016075688 W JP2016075688 W JP 2016075688W WO 2017038941 A1 WO2017038941 A1 WO 2017038941A1
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Prior art keywords
mass
resin composition
sealing
resin
inorganic filler
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PCT/JP2016/075688
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English (en)
French (fr)
Japanese (ja)
Inventor
裕介 渡瀬
藤本　大輔
野村　豊
弘邦 荻原
知世 金子
正也 鳥羽
鈴木　雅彦
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日立化成株式会社
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Priority to JP2017538107A priority Critical patent/JP6763391B2/ja
Priority to KR1020187006211A priority patent/KR102486893B1/ko
Priority to CN201680049953.4A priority patent/CN107924886A/zh
Publication of WO2017038941A1 publication Critical patent/WO2017038941A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Definitions

  • the present invention relates to a resin composition, a cured product, a sealing film, and a sealing structure.
  • the thermal conductivity of the sealing part (cured product of the sealing resin) that seals the object to be sealed is low, the heat dissipation is poor. For this reason, the low thermal conductivity causes deterioration of the apparatus, ignition of the apparatus, and the like.
  • a package form such as PoP (Package on Package) has the merit that the mounting area can be reduced by stacking the CPU and the memory that are normally mounted separately, while the thickness of the entire apparatus increases. Therefore, it is easy to worry about a decrease in heat dissipation. Therefore, there is a limit to improving heat dissipation by reducing the thickness of the sealing portion.
  • This invention is made
  • Another object of the present invention is to provide a sealing film and a sealing structure using the resin composition.
  • the thermal conductivity of a cured product of a conventional sealing resin composition is about 1.2 W / m ⁇ K.
  • the present inventors obtain a cured product having excellent thermal conductivity by using a resin composition containing a thermosetting component and a specific amount of an inorganic filler containing aluminum oxide. The present invention has been found to be possible.
  • the resin composition according to the present invention is a resin composition containing a thermosetting component and an inorganic filler, wherein the inorganic filler contains aluminum oxide, and the content of the inorganic filler is the total mass of the resin composition. 72% by mass or more based on (excluding the mass of the solvent).
  • the resin composition of the present invention it is possible to obtain a cured product having excellent thermal conductivity, for example, thermal conductivity exceeding 2.5 W / m ⁇ K (preferably 2.7 W / A cured product having a thermal conductivity of m ⁇ K or more can be obtained. If the thermal conductivity of the cured product of the sealing resin composition can be improved, the heat dissipation of an electronic component device (semiconductor device or the like) including a sealing part containing the cured product of the resin composition is improved. It is possible to suppress the progress of deterioration and ignition of the device.
  • an electronic component device semiconductor device or the like
  • the resin composition according to the present invention it is possible to improve heat dissipation, which is a problem in a package form (PoP or the like) having an increased thickness.
  • a cured product having excellent thermal conductivity can be obtained while ensuring the embedding property of the resin composition.
  • the thermosetting component may contain a thermosetting resin.
  • the thermosetting resin preferably contains an epoxy resin.
  • the thermosetting component may further contain a curing agent.
  • the curing agent preferably contains a phenol resin.
  • thermosetting component may further contain a curing accelerator.
  • the curing accelerator preferably contains an imidazole compound.
  • the content of the epoxy resin that is liquid at 25 ° C. is preferably 5% by mass or more and more preferably 7% by mass or more based on the total mass of the resin composition (excluding the mass of the solvent).
  • the content of the inorganic filler is preferably 93% by mass or less, and more preferably 85% by mass or less, based on the total mass of the resin composition (excluding the mass of the solvent).
  • the average particle size of the inorganic filler is preferably 0.01 to 25 ⁇ m, more preferably 0.01 to 10 ⁇ m.
  • the content of aluminum oxide in the inorganic filler is preferably 50% by mass or more.
  • the resin composition according to the present invention may further contain a solvent.
  • the cured product according to the present invention is a cured product of the resin composition according to the present invention.
  • sealing of electronic components such as semiconductor elements is often performed at the final stage when manufacturing an electronic component device such as a semiconductor device.
  • the sealing structure sealed molded product
  • a plurality of electronic component devices may be obtained by dicing a sealing structure obtained by sealing a plurality of electronic components (semiconductor elements, etc.).
  • the more electronic components that are rearranged the more electronic component devices that can be manufactured in a single process.
  • studies have been conducted to enlarge the sealing structure.
  • the sealing structure is formed into a wafer shape, and the diameter of the wafer shape tends to increase.
  • the use of a sealing structure as a panel is also being studied so that a printed wiring board manufacturing apparatus or the like that can be made larger and cheaper than a semiconductor manufacturing apparatus can be used.
  • a mold molding in which a solid or liquid resin sealing material is molded with a mold may be used.
  • transfer molding may be used in which a pellet-shaped resin sealing material is melted and sealed by pouring the resin into a mold.
  • transfer molding is performed by pouring molten resin, when filling a large area, an unfilled portion may occur. Therefore, in recent years, compression molding has started to be performed in which molding is performed after supplying a resin sealing material to a mold or a sealed body in advance. In compression molding, since the resin sealing material is directly supplied to the mold or the object to be sealed, there is an advantage that an unfilled portion is hardly generated even when sealing a large area.
  • a solid or liquid resin sealing material is used as in transfer molding.
  • a liquid resin encapsulant may cause a liquid flow or the like, and it may be difficult to uniformly supply the encapsulated body onto the encapsulated body.
  • a solid or resin sealing material is not a conventional pellet-shaped resin, but a granular or powder resin sealing material. There is a case.
  • the resin composition according to the present invention may be in the form of a film as a sealing film for sealing an object to be sealed.
  • the sealing film according to the present invention includes the resin composition according to the present invention. In this case, it is possible to uniformly supply the resin onto the object to be sealed and reduce dust generation. In addition, it is possible to obtain an embedding ability capable of sealing not only by molding but also by a molding method (laminate, press, etc.) that does not require a mold (such as a mold for high pressure).
  • the content of the solvent is preferably 0.2 to 1.5% by mass.
  • the minimum melt viscosity of a film-like resin composition important for embedding an object to be sealed decreases as the content of a solvent (such as an organic solvent) increases. This is considered because a solvent improves the fluidity
  • an appropriate amount of the solvent gives the film-like resin composition stickiness and easily prevents peeling from the film-like support, cracking of the film-like resin composition itself, and the like.
  • the thickness of the sealing film according to the present invention is preferably 20 to 250 ⁇ m.
  • the sealing structure which concerns on this invention is equipped with the to-be-sealed body and the sealing part which seals the said to-be-sealed body,
  • the said sealing part is the hardened
  • the sealed object may be an electronic component.
  • the present invention it is possible to provide a resin composition capable of obtaining a cured product having excellent thermal conductivity, and a cured product thereof. Moreover, according to this invention, the film for sealing and the sealing structure using the said resin composition can be provided.
  • a numerical range indicated by using “to” indicates a range including the numerical values described before and after “to” as the minimum value and the maximum value, respectively.
  • the upper limit value or lower limit value of a numerical range of a certain step may be replaced with the upper limit value or lower limit value of the numerical range of another step.
  • the upper limit value or the lower limit value of the numerical range may be replaced with the values shown in the examples.
  • “A or B” only needs to include either A or B, and may include both.
  • the materials exemplified in the present specification may be used alone or in combination of two or more.
  • the content of each component in the composition is the sum of the plurality of substances present in the composition unless there is a specific indication when there are a plurality of substances corresponding to each component in the composition. Means quantity.
  • Liquid epoxy resin is an epoxy resin that is liquid at 25 ° C. “Liquid at 25 ° C.” means that the viscosity at 25 ° C. measured with an E-type viscometer is 400 Pa ⁇ s or less.
  • the resin composition according to this embodiment is a resin composition containing a thermosetting component and an inorganic filler.
  • the thermosetting component include (A) thermosetting resins (excluding compounds corresponding to curing agents), (B) curing agents, and (C) curing accelerators.
  • the thermosetting component may contain a thermosetting resin without containing a curing agent and / or a curing accelerator.
  • the resin composition according to the present embodiment contains (D) an inorganic filler in addition to the thermosetting component, and (D) the inorganic filler contains aluminum oxide.
  • the resin composition according to the present embodiment may be in the form of a varnish or a film (a sealing film).
  • the cured product according to the present embodiment is a cured product of the resin composition according to the present embodiment.
  • thermosetting component [(A) component: thermosetting resin]
  • thermosetting resin include epoxy resin, phenoxy resin, cyanate resin, thermosetting polyimide, melamine resin, urea resin, unsaturated polyester, alkyd resin, polyurethane and the like.
  • an epoxy resin is preferable from the viewpoint of easily obtaining a cured product having excellent thermal conductivity.
  • the epoxy resin at least one selected from the group consisting of an epoxy resin that is liquid at 25 ° C. and an epoxy resin that is not liquid at 25 ° C. can be used.
  • the epoxy resin can be used without particular limitation as long as it is a resin having two or more glycidyl groups in one molecule.
  • the epoxy resin include bisphenol A type epoxy resin, bisphenol AP type epoxy resin, bisphenol AF type epoxy resin, bisphenol B type epoxy resin, bisphenol BP type epoxy resin, bisphenol C type epoxy resin, bisphenol E type epoxy resin, and bisphenol.
  • F type epoxy resin bisphenol G type epoxy resin, bisphenol M type epoxy resin, bisphenol S type epoxy resin (hexanediol bisphenol S diglycidyl ether, etc.), bisphenol P type epoxy resin, bisphenol PH type epoxy resin, bisphenol TMC type epoxy resin Bisphenol Z type epoxy resin, phenol novolak type epoxy resin (orthocresol novolak type epoxy resin, etc.), biff Nyl type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin, bixylenol type epoxy resin (bixylenol diglycidyl ether, etc.), hydrogenated bisphenol A type epoxy resin (hydrogenated bisphenol A glycidyl ether, etc.), these Examples of the resin include dibasic acid-modified diglycidyl ether type epoxy resins and aliphatic epoxy resins. An epoxy resin may be used individually by 1 type, and may use 2 or more types together.
  • liquid epoxy resins include bisphenol A type glycidyl ether, bisphenol AD type glycidyl ether, bisphenol S type glycidyl ether, bisphenol F type glycidyl ether, water-added bisphenol A type glycidyl ether, and ethylene oxide adduct bisphenol A type.
  • examples thereof include glycidyl ether, propylene oxide adduct bisphenol A-type glycidyl ether, naphthalene resin glycidyl ether, trifunctional or tetrafunctional glycidylamine, and the like.
  • epoxy resins include “EXA-4700” (tetrafunctional naphthalene type epoxy resin), “Epiclon HP-4032” and “EXA-4750” (polyfunctional solid epoxy resin containing naphthalene skeleton) manufactured by DIC Corporation, Japan.
  • Naphthalene type epoxy resins such as “NC-7000” (Naphthalene skeleton-containing polyfunctional solid epoxy resin) manufactured by Kayaku Co., Ltd .
  • phenols such as “EPPN-502H” (Trisphenol epoxy resin) manufactured by Nippon Kayaku Co., Ltd.
  • Dicyclopentadiene aralkyl epoxy resin Dicyclopentadiene aralkyl epoxy resin; Biphenyl aralkyl type epoxy resins such as “NC-3000H” (bifunctional skeleton-containing polyfunctional solid epoxy resin) manufactured by Kayaku Co., Ltd .; “Epicron N-660”, “Epicron N-690”, “Epicron” manufactured by DIC Corporation Novolak type epoxy resins such as “N-740” (phenol novolac type epoxy resin) and “N500P-1” (orthocresol novolak type epoxy resin), “EOCN-104S” manufactured by Nippon Kayaku Co., Ltd .; Nissan Chemical Industries, Ltd.
  • Tris (2,3-epoxypropyl) isocyanurate such as “TEPIC” manufactured by DIC Corporation; “Epicron 860”, “Epicron 900-IM”, “Epicron EXA-4816” and “Epicron EXA-4822” manufactured by DIC Corporation, “Araldite AER280” manufactured by Asahi Ciba Co., Ltd. "Epototo YD-134", “YD-8125” and “YDF8170” manufactured by Toto Kasei Co., Ltd. (Nippon Steel & Sumikin Chemical Co., Ltd.), “jER834" and “jER872” manufactured by Japan Epoxy Resin Co., Ltd.
  • the content of the thermosetting resin is preferably 1% by mass or more, more preferably 3% by mass or more based on the total mass of the resin composition (excluding the mass of the solvent) from the viewpoint of easily obtaining excellent fluidity.
  • 4% by mass or more is more preferable, 4% by mass or more is particularly preferable, 5% by mass or more is extremely preferable, 10% by mass or more is very preferable, and 15% by mass or more is even more preferable.
  • the content of the thermosetting resin is preferably 30% by mass or less, based on the total mass of the resin composition (excluding the mass of the solvent), from the viewpoint of easily suppressing the occurrence of cracks and cracks on the film surface, and 25% by mass. % Or less is more preferable, and 20% by mass or less is still more preferable.
  • the content of the epoxy resin is based on the total mass of the thermosetting resin from the viewpoint of easily obtaining a cured product having excellent thermal conductivity. 50 mass% or more is preferable, 80 mass% or more is more preferable, and 90 mass% or more is still more preferable.
  • the content of the epoxy resin may be 100% by mass based on the total mass of the thermosetting resin.
  • the content of the liquid epoxy resin is preferably 0.5% by mass or more based on the total mass of the resin composition (excluding the mass of the solvent) from the viewpoint of easily suppressing the occurrence of cracks and cracks on the film surface. More preferably 3% by weight or more, still more preferably 5% by weight or more, particularly preferably 7% by weight or more, and very preferably 9% by weight or more.
  • the content of the liquid epoxy resin is based on the total mass of the resin composition (excluding the mass of the solvent) from the viewpoint of easily suppressing the increase in the tackiness of the film and from the viewpoint of easily suppressing edge fusion. 20 mass% or less is preferable, 15 mass% or less is more preferable, and 13 mass% or less is still more preferable.
  • the content of the liquid epoxy resin is preferably 20% by mass or more, more preferably 30% by mass or more, based on the total mass of the thermosetting resin, from the viewpoint of easily suppressing the occurrence of cracks and cracks on the film surface. More preferably, it is more than mass%.
  • the content of the liquid epoxy resin is 95% by mass or less based on the total mass of the thermosetting resin, from the viewpoint of easily suppressing an excessive increase in the tackiness of the film and from the viewpoint of easily suppressing edge fusion.
  • 90 mass% or less is more preferable, and 80 mass% or less is still more preferable.
  • the content of the liquid epoxy resin may be 100% by mass based on the total mass of the thermosetting resin.
  • the content of the liquid epoxy resin causes cracks and cracks on the film surface.
  • it is preferably 0.5% by mass or more, more preferably 1% by mass or more, further preferably 3% by mass or more, and more preferably 5% by mass or more, based on the total mass of the components (A) to (D). Is particularly preferable, 7% by mass or more is very preferable and 9% by mass or more is very preferable.
  • the content of the liquid epoxy resin is 20 on the basis of the total mass of the components (A) to (D) from the viewpoint of easily suppressing an excessive increase in the tackiness of the film and from the viewpoint of easily suppressing the edge fusion. % By mass or less is preferred, 15% by mass or less is more preferred, and 13% by mass or less is still more preferred.
  • (B) component: curing agent Although it does not specifically limit as a hardening
  • the curing agent (B) can be used without particular limitation as long as it is a compound having two or more functional groups that react with a glycidyl group in one molecule. Examples of such curing agents include phenol resins and acid anhydrides.
  • the curing agent a phenol resin is preferable from the viewpoint of easily obtaining a cured product having excellent thermal conductivity.
  • curing agent may be used individually by 1 type, and may use 2 or more types together.
  • phenol resin is a resin having two or more phenolic hydroxyl groups in one molecule
  • a known phenol resin can be used without particular limitation.
  • phenol resins include resins obtained by condensation or cocondensation of phenols and / or naphthols and aldehydes in the presence of an acidic catalyst, biphenyl skeleton type phenol resins, paraxylylene-modified phenol resins, metaxylylene / paraxylylene-modified phenol resins, melamine Examples thereof include a modified phenol resin, a terpene modified phenol resin, a dicyclopentadiene modified phenol resin, a cyclopentadiene modified phenol resin, a polycyclic aromatic ring modified phenol resin, and a xylylene modified naphthol resin.
  • phenols include phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, and the like.
  • naphthols include ⁇ -naphthol, ⁇ -naphthol, dihydroxynaphthalene and the like.
  • aldehydes include formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, salicylaldehyde and the like.
  • phenol resins include “Phenolite LF2882”, “Phenolite LF2822”, “Phenolite TD-2090”, “Phenolite TD-2149”, “Phenolite VH-4150” and “Phenolite” manufactured by DIC Corporation. "Light VH4170”, “XLC-LL” and “XLC-4L” manufactured by Mitsui Chemicals, Inc. "SN-100”, “SN-300”, “SN-395" and “SN-” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.
  • the content of the curing agent is preferably 1 to 20% by mass, preferably 2 to 15% by mass based on the total mass of the resin composition (excluding the mass of the solvent) from the viewpoint of excellent curability of the thermosetting resin. More preferred is 3 to 10% by mass.
  • the equivalent of the glycidyl group (epoxy equivalent) of the epoxy resin and the equivalent of the functional group (such as phenolic hydroxyl group) that reacts with the glycidyl group in the curing agent (phenolic) is preferably 0.7 to 2.0, more preferably 0.8 to 1.8 0.9 to 1.7 is more preferable.
  • the ratio is 0.7 or more or 2.0 or less, unreacted epoxy resin and / or unreacted curing agent hardly remains, and desired cured product characteristics are easily obtained.
  • At least 1 sort (s) chosen from the group which consists of an amine type hardening accelerator and a phosphorus type hardening accelerator is preferable.
  • an amine-based curing accelerator is used as the curing accelerator.
  • at least one selected from the group consisting of imidazole compounds, aliphatic amines and alicyclic amines is more preferable, and imidazole compounds are more preferable.
  • imidazole compound examples include 2-phenyl-4-methylimidazole and 1-benzyl-2-methylimidazole.
  • a hardening accelerator may be used individually by 1 type, and may use 2 or more types together.
  • Examples of commercially available curing accelerators include “2P4MZ” and “1B2MZ” manufactured by Shikoku Kasei Kogyo Co., Ltd.
  • the content of the curing accelerator is preferably in the following range based on the total amount of the thermosetting resin (epoxy resin or the like) and the curing agent (phenol resin or the like).
  • the content of the curing accelerator is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, and still more preferably 0.3% by mass or more from the viewpoint that a sufficient curing acceleration effect can be easily obtained.
  • the content of the curing accelerator is such that curing does not easily proceed during the process (for example, coating and drying) at the time of producing the sealing film, or during the storage of the sealing film, And from a viewpoint of being easy to prevent the molding defect accompanying a raise of melt viscosity, 5 mass% or less is preferable, 3 mass% or less is more preferable, and 1.5 mass% or less is still more preferable. From these viewpoints, the content of the curing accelerator is preferably 0.01 to 5% by mass, more preferably 0.1 to 3% by mass, and still more preferably 0.3 to 1.5% by mass.
  • the inorganic filler contains aluminum oxide (such as aluminum oxide particles).
  • aluminum oxide such as aluminum oxide particles.
  • examples of commercially available inorganic fillers containing aluminum oxide include “AA-1.5” manufactured by Sumitomo Chemical Co., Ltd. and “DAW20” manufactured by Denka Co., Ltd.
  • the inorganic filler may contain a constituent material other than aluminum oxide (such as aluminum oxide particles). That is, the resin composition according to this embodiment may contain particles containing aluminum oxide and a constituent material other than aluminum oxide, and contains aluminum oxide particles and particles containing components other than aluminum oxide. You may do it.
  • a constituent material other than aluminum oxide such as aluminum oxide particles
  • the content of aluminum oxide in the inorganic filler is preferably 50% by mass or more, more preferably 70% by mass or more, more preferably 80% by mass, based on the total mass of the inorganic filler, from the viewpoint of further improving the thermal conductivity improvement effect. % Or more is more preferable, and 90 mass% or more is particularly preferable.
  • the content of aluminum oxide may be 100% by mass based on the total mass of the inorganic filler.
  • constituent materials contained in conventionally known inorganic fillers can be used, and are not limited to specific ones.
  • constituent materials other than aluminum oxide include barium sulfate, barium titanate, silica, talc, clay, magnesium carbonate, calcium carbonate, aluminum hydroxide, silicon nitride, and aluminum nitride.
  • the inorganic filler containing silica include amorphous silica, crystalline silica, fused silica, and spherical silica.
  • silica As a constituent material other than aluminum oxide, it has a relatively small thermal expansion coefficient as well as a viewpoint of easily obtaining a dispersibility improving effect in a resin and a sedimentation suppressing effect in a varnish by surface modification or the like. From the viewpoint of easily obtaining desired cured product characteristics, silica is preferable. Examples of commercially available inorganic fillers containing silica include “SC2500-SXJ”, “SC5500-SXE” and “SC2050-KC” manufactured by Admatechs Co., Ltd. As the constituent material other than aluminum oxide, one type may be used alone, or two or more types may be used in combination.
  • the surface of the inorganic filler may be modified.
  • the method of surface modification is not particularly limited. Surface modification using a silane coupling agent is preferable from the viewpoint of simple treatment, rich types of functional groups, and easy provision of desired characteristics.
  • silane coupling agent examples include alkyl silane, alkoxy silane, vinyl silane, epoxy silane, amino silane, acrylic silane, methacryl silane, mercapto silane, sulfide silane, isocyanate silane, sulfur silane, styryl silane, alkyl chlorosilane, and the like.
  • silane coupling agent examples include methyltrimethoxysilane, dimethyldimethoxysilane, trimethylmethoxysilane, methyltriethoxysilane, methyltriphenoxysilane, ethyltrimethoxysilane, n-propyltrimethoxysilane, diisopropyldimethoxysilane, isobutyl.
  • the average particle diameter of the inorganic filler is preferably 0.01 ⁇ m or more, more preferably 0.1 ⁇ m or more, and more preferably 0.3 ⁇ m or more from the viewpoint of easily suppressing the aggregation of the inorganic filler and easy dispersion of the inorganic filler. Is more preferable, and 0.5 ⁇ m or more is particularly preferable.
  • the average particle diameter of the inorganic filler is preferably 25 ⁇ m or less, more preferably 10 ⁇ m or less, and more preferably 5 ⁇ m or less from the viewpoint of easily suppressing the precipitation of the inorganic filler in the varnish and easy to produce a uniform sealing film. Is more preferable.
  • the average particle size of the inorganic filler is preferably 0.01 to 25 ⁇ m, more preferably 0.01 to 10 ⁇ m, still more preferably 0.1 to 10 ⁇ m, particularly preferably 0.3 to 5 ⁇ m, and 0 Very preferably 5 to 5 ⁇ m.
  • the average particle diameter of the inorganic filler may be 10 to 18 ⁇ m.
  • the largest average particle size is preferably 15 to 25 ⁇ m.
  • the “average particle size” is the particle size at a point corresponding to a volume of 50% when the cumulative frequency distribution curve by the particle size is obtained with the total volume of the particles being 100%, and the particle size distribution using the laser diffraction scattering method It can be measured with a measuring device or the like.
  • the average particle diameter of each combined inorganic filler can be confirmed from the average particle diameter of each inorganic filler at the time of mixing, and can be confirmed by measuring the particle size distribution.
  • the content of the inorganic filler (the total amount of the inorganic filler containing aluminum oxide and the inorganic filler not containing aluminum oxide) is a viewpoint of improving the thermal conductivity and the coefficient of thermal expansion with the object to be sealed. 72% by mass based on the total mass of the resin composition (excluding the mass of the solvent) from the viewpoint of easily suppressing an increase in warpage of the sealing structure (for example, an electronic component device such as a semiconductor device) due to the difference in That's it.
  • the content of the inorganic filler is the total mass of the resin composition (excluding the mass of the solvent) from the viewpoint of further improving the thermal conductivity and from the viewpoint of further suppressing the warpage of the sealing structure.
  • the content of the inorganic filler is such that the sealing film is easily cracked in the drying step when the sealing film is produced, and the fluidity is increased due to an increase in the melt viscosity of the sealing film.
  • 93% by mass or less is preferable based on the total mass of the resin composition (excluding the mass of the solvent), 90 mass% or less is more preferable, 85 mass% or less is further more preferable, 84.5 mass% or less is especially preferable, 81 mass% or less is very preferable, and 80 mass% or less is very preferable.
  • the content of the inorganic filler is preferably 72 to 93% by mass, more preferably 72 to 90% by mass, and more preferably 72 to 85% based on the total mass of the resin composition (excluding the mass of the solvent). More preferably, it is more preferably from 72 to 84.5% by weight, very particularly preferably from 72.5 to 81% by weight and very particularly preferably from 73 to 80% by weight.
  • the content of the inorganic filler containing aluminum oxide (such as aluminum oxide particles) is preferably in the following range based on the total mass of the resin composition (excluding the mass of the solvent). From the viewpoint of further improving the thermal conductivity, the content of the inorganic filler containing aluminum oxide is preferably 50% by mass or more, more preferably 60% by mass or more, and further preferably 70% by mass or more. The content of the inorganic filler containing aluminum oxide is preferably 85% by mass or less, more preferably 80% by mass or less, and still more preferably 75% by mass or less, from the viewpoint of ensuring sufficient embedding properties.
  • the resin composition according to the present embodiment may contain (E) a solvent or may not contain (E) a solvent.
  • a conventionally well-known organic solvent can be used as a solvent.
  • the organic solvent a solvent capable of dissolving components other than the inorganic filler is preferable, and examples thereof include aliphatic hydrocarbons, aromatic hydrocarbons, terpenes, halogens, esters, ketones, alcohols, aldehydes, and the like. It is done.
  • a solvent may be used individually by 1 type and may use 2 or more types together.
  • the solvent is selected from the group consisting of esters, ketones, and alcohols from the viewpoint of low environmental burden and the ability to easily dissolve thermosetting resins (such as epoxy resins) and curing agents (such as phenolic resins). At least one is preferred. Among these, ketones are preferable from the viewpoint of easily dissolving a thermosetting resin (such as an epoxy resin) and a curing agent (such as a phenol resin).
  • the solvent is preferably at least one selected from the group consisting of acetone, methyl ethyl ketone and methyl isobutyl ketone, from the viewpoint of low volatilization at room temperature (25 ° C.) and easy removal during drying.
  • the resin composition according to the present embodiment may contain (F) an elastomer (flexible agent) as necessary.
  • an elastomer selected from the group consisting of polybutadiene particles, styrene butadiene particles, acrylic elastomers, silicone powders, silicone oils, and silicone oligomers.
  • One type of elastomer may be used alone, or two or more types may be used in combination.
  • the average particle diameter of the elastomer When the elastomer is particulate, there is no particular limitation on the average particle diameter of the elastomer. In eWLB (Embedded Wafer-Level Ball Grid Array) applications, it is necessary to embed between semiconductor elements, so when using a sealing film for eWLB applications, the average particle size of the elastomer may be 50 ⁇ m or less. preferable. The average particle diameter of the elastomer is preferably 0.1 ⁇ m or more from the viewpoint of excellent dispersibility of the elastomer.
  • elastomers examples include “HTR280” manufactured by Nagase ChemteX Corporation. Also, some commercially available elastomer components are dispersed in advance in a liquid resin (for example, a liquid epoxy resin) instead of the elastomer alone, but can be used without any problem. Examples of such commercially available products include “MX-136” and “MX-965” manufactured by Kaneka Corporation.
  • the resin composition according to the present embodiment can further contain other additives.
  • additives include pigments, dyes, mold release agents, antioxidants, surface tension adjusting agents and the like.
  • the sealing film according to the present embodiment includes the resin composition according to the present embodiment.
  • the sealing film according to the present embodiment may be obtained by molding the resin composition according to the present embodiment into a film shape and may be formed of the resin composition according to the present embodiment.
  • the sealing film according to this embodiment can be used, for example, for sealing a semiconductor device, embedding an electronic component arranged on a printed wiring board, and the like.
  • the thickness (film thickness) of the sealing film is preferably 20 ⁇ m or more, more preferably 30 ⁇ m or more, further preferably 50 ⁇ m or more, and more preferably 100 ⁇ m or more, from the viewpoint of easily suppressing in-plane thickness variation during coating. Particularly preferred.
  • the thickness of the sealing film is preferably 250 ⁇ m or less, more preferably 200 ⁇ m or less, and even more preferably 150 ⁇ m or less, from the viewpoint that a certain drying property can be easily obtained in the depth direction during coating. From these viewpoints, the thickness of the sealing film is preferably 20 to 250 ⁇ m, more preferably 30 to 250 ⁇ m, still more preferably 50 to 200 ⁇ m, and particularly preferably 100 to 150 ⁇ m. Further, a plurality of sealing films can be laminated to produce a sealing film having a thickness exceeding 250 ⁇ m.
  • the content of the inorganic filler in the sealing film is the total mass of the sealing film (excluding the mass of the solvent) On the other hand, the following ranges are preferable.
  • the content of the inorganic filler is preferably 72% by mass or more, more preferably 72.5% by mass or more from the viewpoint of further improving the thermal conductivity and from the viewpoint of easily suppressing the warpage of the sealing structure. More preferably, 73 mass% or more is still more preferable.
  • the content of the inorganic filler is 93% by mass from the viewpoint that the fluidity is suppressed from lowering due to the increase in the melt viscosity of the sealing film, and the object to be sealed (electronic parts, etc.) is easily sealed.
  • the following is preferable, 90% by mass or less is more preferable, 85% by mass or less is further preferable, 84.5% by mass or less is particularly preferable, 81% by mass or less is extremely preferable, and 80% by mass or less is very preferable.
  • the content of the inorganic filler is preferably 72 to 93% by mass, more preferably 72 to 90% by mass, further preferably 72 to 85% by mass, particularly preferably 72 to 84.5% by mass, 72.5 to 81% by mass is very preferable, and 73 to 80% by mass is very preferable.
  • content of the solvent (organic solvent etc.) contained in the sealing film is in the following range with respect to the total mass (including the mass of the solvent) of the sealing film.
  • the content of the solvent is from the viewpoint of easily suppressing the sealing film from becoming brittle and causing problems such as cracking of the sealing film, and the minimum melt viscosity to be increased and the embedding property to be lowered. 2 mass% or more is preferable, 0.3 mass% or more is more preferable, 0.5 mass% or more is further preferable, 0.6 mass% or more is particularly preferable, and 0.7 mass% or more is extremely preferable.
  • the content of the solvent is a problem that the adhesiveness of the sealing film becomes too strong and the handleability is lowered, and a problem such as foaming due to the volatilization of the solvent (organic solvent, etc.) during thermal curing of the sealing film.
  • the content of the solvent is preferably 0.2 to 1.5% by mass, more preferably 0.3 to 1% by mass, further preferably 0.5 to 1% by mass, and 0.6 to 1%. % By weight is particularly preferred, and 0.7 to 1% by weight is very particularly preferred.
  • the sealing film according to the present embodiment can be produced as follows.
  • thermosetting resin (B) curing agent, (C) curing accelerator, (D) inorganic filler, (E) solvent, etc.) are mixed.
  • a varnish (varnish-like resin composition) is produced.
  • the mixing method is not particularly limited, and a mill, a mixer, and a stirring blade can be used.
  • a solvent (such as an organic solvent) can be used to dissolve and disperse the constituents of the resin composition, which is a material for the sealing film, to prepare a varnish, or to assist in preparing the varnish. . Most of the solvent can be removed in the drying step after coating.
  • the sealing varnish can be produced by applying the varnish thus produced to a support (film-like support etc.) and then drying by heating with hot air blowing or the like.
  • a coating (coating) method For example, coating apparatuses, such as a comma coater, a bar coater, a kiss coater, a roll coater, a gravure coater, a die coater, can be used.
  • a polymer film, a metal foil or the like can be used as the film-like support.
  • the polymer film include polyolefin films such as polyethylene films and polypropylene films; vinyl films such as polyvinyl chloride films; polyester films such as polyethylene terephthalate films; polycarbonate films; acetylcellulose films;
  • the metal foil include copper foil and aluminum foil.
  • the thickness of the support is not particularly limited, but is preferably 2 to 200 ⁇ m from the viewpoint of excellent workability and drying properties.
  • the thickness of the support is 2 ⁇ m or more, it is easy to suppress problems such as breakage of the support during coating, bending of the support due to the weight of the varnish, and the like.
  • the thickness of the support is 200 ⁇ m or less, it is easy to suppress problems that prevent solvent drying in the varnish when hot air is blown from both the coating surface and the back surface in the drying step.
  • a protective layer for the purpose of protecting the sealing film may be disposed on the sealing film formed on the support.
  • the handleability is improved, and the problem that the sealing film sticks to the back surface of the support can be avoided when the film is wound.
  • a polymer film, a metal foil or the like can be used as the protective layer.
  • the polymer film include polyolefin films such as polyethylene films and polypropylene films; vinyl films such as polyvinyl chloride films; polyester films such as polyethylene terephthalate films; polycarbonate films; acetylcellulose films; it can.
  • the metal foil include copper foil and aluminum foil.
  • the sealing film produced as described above includes a step of placing the object to be sealed (embedded object) facing the sealing film, and heating and melting the sealing film to obtain a pressure.
  • a sealing structure e.g., a semiconductor
  • a sealing structure by obtaining a cured body of the sealing film by applying the step of embedding the object to be sealed and the step of thermally curing the sealing film having an embedding ability by heating. It can be used to manufacture an electronic component device such as a device.
  • the sealing structure which concerns on this embodiment is provided with the to-be-sealed body and the sealing part which seals the said to-be-sealed body, and the sealing part is the hardened
  • An electronic component device etc. are mentioned as a sealing structure.
  • the electronic component device includes an electronic component and a sealing portion that seals the electronic component, and the sealing portion includes a cured product of the resin composition according to the present embodiment.
  • the electronic component include a semiconductor element; a semiconductor wafer; an integrated circuit; a semiconductor device; a filter such as a SAW filter; a passive component such as a sensor.
  • the electronic component device may be a semiconductor device including a semiconductor element or a semiconductor wafer as an electronic component; a printed wiring board or the like.
  • the sealing structure according to the present embodiment may include a plurality of objects to be sealed. The plurality of objects to be sealed may be of the same type or different types.
  • FIG. 1 is a schematic cross-sectional view for explaining an embodiment of a manufacturing method of a semiconductor device which is an electronic component device as an embodiment of a manufacturing method of a sealing structure.
  • the manufacturing method according to the present embodiment includes a step (FIG. 1A) of arranging a plurality of semiconductor elements 20 side by side on a substrate 30 having a temporary fixing material 40 as an object to be sealed (a target to be embedded), and a support.
  • the sealing film 2 with the support provided with the body 1 and the sealing film 2 provided on the support 1 is opposed to the semiconductor element 20, and then the sealing film 2 is heated on the semiconductor element 20.
  • the step of embedding the semiconductor element 20 in the sealing film 2 by pressing (laminating) (FIG. 1B) and the sealing film 2 embedded with the semiconductor element 20 are cured to obtain a cured product 2a.
  • a step of obtaining (FIG. 1C).
  • the sealing film 2 is thermally cured to provide the semiconductor element 20 embedded in the cured product 2a.
  • the structure electroactive component device
  • the sealing structure may be obtained by a compression mold.
  • the laminator used in the laminating method is not particularly limited, and examples thereof include roll type and balloon type laminators.
  • the laminator may be a balloon type capable of vacuum pressurization from the viewpoint of excellent embeddability.
  • Lamination is usually performed below the softening point of the support.
  • the laminating temperature is preferably around the minimum melt viscosity of the sealing film.
  • the pressure at the time of laminating varies depending on the size, density, etc. of an object to be sealed (for example, an electronic component such as a semiconductor element).
  • the pressure during lamination may be, for example, in the range of 0.2 to 1.5 MPa, or in the range of 0.3 to 1.0 MPa.
  • the lamination time is not particularly limited, but may be 20 to 600 seconds, 30 to 300 seconds, or 40 to 120 seconds.
  • the sealing film can be cured, for example, in the air or under an inert gas.
  • the curing temperature is not particularly limited, and may be 80 to 280 ° C., 100 to 240 ° C., or 120 to 200 ° C. When the curing temperature is 80 ° C. or higher, the curing of the sealing film proceeds sufficiently, and the occurrence of defects can be suppressed. When the curing temperature is 280 ° C. or lower, the occurrence of heat damage to other materials tends to be suppressed.
  • the curing time (heating time) is not particularly limited, and may be 30 to 600 minutes, 45 to 300 minutes, or 60 to 240 minutes. When the curing time is within these ranges, curing of the sealing film proceeds sufficiently, and better production efficiency can be obtained. Moreover, you may combine several conditions for hardening conditions.
  • varnish-like epoxy resin composition varnish-like epoxy resin composition
  • sealing film film-like epoxy resin composition
  • thermosetting resin (epoxy resin) A1: Bisphenol F type epoxy resin (manufactured by Mitsubishi Chemical Corporation, trade name: jER806, epoxy equivalent: 160 g / eq, epoxy resin which shows liquid at 25 ° C.)
  • A3 Polybutadiene elastomer particle-containing bisphenol F type epoxy resin (manufactured by Kaneka Corporation, trade name: MX-136, liquid epoxy resin content: 75 mass%, elastomer particle content: 25 mass%, epoxy equivalent: 226 g / eq, average particle diameter of elastomer particles: 0.1 ⁇ m, a component containing an epoxy resin that is liquid at 25 ° C.)
  • B1 Phenol novolac resin (manufactured by Asahi Organic Materials Co., Ltd., trade name: PAPS-PN2, phenolic hydroxyl group equivalent: 104 g / eq, phenol resin not showing liquid at 25 ° C.)
  • B2 Alkylphenol novolak resin (manufactured by Gunei Chemical Industry Co., Ltd., trade name: ELP40, phenolic hydroxyl group equivalent: 140 g / eq)
  • D1 Aluminum oxide particles (manufactured by Sumitomo Chemical Co., Ltd., trade name: AA-1.5, average particle size: 1.5 ⁇ m)
  • D2 Aluminum oxide particles (Denka Co., Ltd., trade name: DAW20, average particle size: 20 ⁇ m)
  • D3 Silica particles (manufactured by Admatechs Co., Ltd., trade name: SC2500-SXJ, phenylaminosilane treatment, average particle size: 0.5 ⁇ m)
  • D4 Silica particles (manufactured by Admatechs Co., Ltd., trade name: SC5500-SXE, phenylaminosilane treatment, average particle size: 1.6 ⁇ m)
  • D5 Silica slurry (manufactured by Admatechs Co., Ltd., trade name: SC2050-KC, silicone oligomer treatment, average particle size: 0.5 ⁇ m, methyl isobutyl ket
  • Elastomer F1 Polymer elastomer (manufactured by Nagase ChemteX Corporation, trade name: HTR280, epoxy-modified linear elastomer)
  • Example 1 172 g of organic solvent E1 was put in a 10 L polyethylene container. After adding 542 g of the inorganic filler D1 to the container, the inorganic filler D1 was dispersed with a stirring blade to obtain a dispersion. To this dispersion, 48 g of thermosetting resin A1, 12 g of thermosetting resin A2, and 38 g of curing agent B1 were added and stirred. After confirming that the curing agent B1 was dissolved, 0.8 g of the curing accelerator C1 was added and further stirred for 1 hour to obtain a mixed solution. This mixed solution was filtered through nylon # 200 mesh (opening 75 ⁇ m), and the filtrate was collected to prepare a varnish-like epoxy resin composition.
  • this varnish-like epoxy resin composition is coated on the following film-like support under the following conditions, and a sealing film (film-like epoxy resin composition) having a film thickness of 100 ⁇ m is supported.
  • ⁇ Coating head method Comma coater
  • ⁇ Coating and drying speed 1 m / min
  • Drying conditions temperature / furnace length: 110 ° C./3.3 m, 130 ° C./3.3 m, 140 ° C./3.3 m
  • -Film-like support polyethylene terephthalate film with a thickness of 38 ⁇ m
  • the surface of the sealing film was protected by disposing a protective layer (12 ⁇ m thick polyethylene terephthalate film) on the side opposite to the support in the sealing film.
  • a protective layer (12 ⁇ m thick polyethylene terephthalate film)
  • Example 2 141 g of organic solvent E1 was put in a 10 L polyethylene container. After adding 493 g of the inorganic filler D1 to the container, the inorganic filler D1 was dispersed with a stirring blade to obtain a dispersion. To this dispersion, 88 g of thermosetting resin A1, 22 g of thermosetting resin A2, and 70 g of curing agent B1 were added and stirred. After confirming that the curing agent B1 was dissolved, 1.4 g of the curing accelerator C1 was added and further stirred for 1 hour to obtain a mixed solution. This mixed solution was filtered through nylon # 200 mesh (opening 75 ⁇ m), and the filtrate was collected to prepare a varnish-like epoxy resin composition. Using a coating machine, this varnish-like epoxy resin composition was applied onto a film-like support in the same manner as in Example 1, and a film for sealing (film-like epoxy resin composition) having a film thickness of 100 ⁇ m was obtained. Produced.
  • Example 3 114 g of organic solvent E1 was put in a 10 L polyethylene container. After adding 401 g of the inorganic filler D1 to the container, the inorganic filler D1 was dispersed with a stirring blade to obtain a dispersion. To this dispersion, 48 g of thermosetting resin A1, 12 g of thermosetting resin A2, and 38 g of curing agent B1 were added and stirred. After confirming that the curing agent B1 was dissolved, 0.8 g of the curing accelerator C1 was added and further stirred for 1 hour to obtain a mixed solution. This mixed solution was filtered through nylon # 200 mesh (opening 75 ⁇ m), and the filtrate was collected to prepare a varnish-like epoxy resin composition. Using a coating machine, this varnish-like epoxy resin composition was applied onto a film-like support in the same manner as in Example 1, and a film for sealing (film-like epoxy resin composition) having a film thickness of 100 ⁇ m was obtained. Produced.
  • Example 4 149 g of organic solvent E1 was put in a 10 L polyethylene container. After adding 423 g of the inorganic filler D1 to the container, 104 g of the inorganic filler D3 was added, and the inorganic fillers D1 and D3 were dispersed with a stirring blade to obtain a dispersion. The average particle diameter of the inorganic fillers D1 and D3 was 1.0 ⁇ m. To this dispersion, 48 g of thermosetting resin A1, 12 g of thermosetting resin A2, and 38 g of curing agent B1 were added and stirred. After confirming that the curing agent B1 was dissolved, 0.8 g of the curing accelerator C1 was added and further stirred for 1 hour to obtain a mixed solution.
  • This mixed solution was filtered through nylon # 200 mesh (opening 75 ⁇ m), and the filtrate was collected to prepare a varnish-like epoxy resin composition.
  • this varnish-like epoxy resin composition was applied onto a film-like support in the same manner as in Example 1, and a film for sealing (film-like epoxy resin composition) having a film thickness of 100 ⁇ m was obtained. Produced.
  • thermosetting resin A1 4629 g of organic solvent E1 was placed in a 10 L polyethylene container. After adding 6622 g of inorganic filler D3 to the container, the inorganic filler D3 was dispersed with a stirring blade to obtain a dispersion. To this dispersion, 680 g of thermosetting resin A1, 240 g of thermosetting resin A2, 202 g of thermosetting resin A3, 78 g of thermosetting resin A4, and 711 g of curing agent B1 were added and stirred. After confirming that the curing agent B1 was dissolved, 15 g of the curing accelerator C1 was added, and the mixture was further stirred for 1 hour to obtain a mixed solution.
  • This mixed solution was filtered through nylon # 200 mesh (opening 75 ⁇ m), and the filtrate was collected to prepare a varnish-like epoxy resin composition.
  • this varnish-like epoxy resin composition was applied onto a film-like support in the same manner as in Example 1, and a film for sealing (film-like epoxy resin composition) having a film thickness of 100 ⁇ m was obtained. Produced.
  • Comparative Example 3 A sealing film (film epoxy resin composition) having a film thickness of 100 ⁇ m was prepared in the same manner as in Comparative Example 1 except that the coating and drying speed of Comparative Example 1 were changed from 1 m / min to 0.5 m / min. .
  • Example 5 83 g of organic solvent E1 was put in a 10 L polyethylene container. After adding 151 g of the inorganic filler D5 to the container, 660 g of the inorganic filler D2 and 53 g of the inorganic filler D4 are added, and the inorganic fillers D2, D4, and D5 are dispersed with a stirring blade to obtain a dispersion. It was. The average particle diameter of the inorganic fillers D2, D4 and D5 was 16 ⁇ m. To this dispersion, 34 g of thermosetting resin A5, 11 g of thermosetting resin A6, and 28 g of curing agent B2 were added and stirred.
  • Example 6 83 g of organic solvent E1 was put in a 10 L polyethylene container. After adding 98 g of inorganic filler D5 to the container, add 430 g of inorganic filler D2 and 34 g of inorganic filler D4, and disperse the inorganic fillers D2, D4 and D5 with a stirring blade to obtain a dispersion. It was. The average particle diameter of the inorganic fillers D2, D4 and D5 was 18 ⁇ m. To this dispersion, 21 g of thermosetting resin A5, 7 g of thermosetting resin A6, and 17 g of curing agent B2 were added and stirred.
  • Example 7 83 g of organic solvent E1 was put in a 10 L polyethylene container. After adding 68.6 g of inorganic filler D3 to the container, add 463 g of inorganic filler D2 and 34.3 g of inorganic filler D4, and disperse inorganic fillers D2, D3, and D4 with a stirring blade. A dispersion was obtained. The average particle diameter of the inorganic fillers D2, D3 and D4 was 18 ⁇ m. To this dispersion, 18.3 g of thermosetting resin A5, 4.6 g of thermosetting resin A6, and 14.4 g of curing agent B2 were added and stirred.
  • Example 8 83 g of organic solvent E1 was put in a 10 L polyethylene container. After adding 68.6 g of inorganic filler D3 to the container, add 463 g of inorganic filler D2 and 34.3 g of inorganic filler D4, and disperse inorganic fillers D2, D3, and D4 with a stirring blade. A dispersion was obtained. The average particle diameter of the inorganic fillers D2, D3 and D4 was 18 ⁇ m. To this dispersion, 17.9 g of thermosetting resin A5, 4.5 g of thermosetting resin A6, and 14 g of curing agent B2 were added and stirred.
  • the obtained film for sealing with double-sided copper foil was cured under the following conditions to produce a cured epoxy resin body with copper foil.
  • Oven Espec Co., Ltd., trade name "SAFETY OPEN SPH-201"
  • Oven temperature 140 °C ⁇ Heating time: 120 minutes
  • the copper foil of the produced epoxy resin cured body with copper foil was removed by etching to obtain an epoxy resin cured body (cured product of sealing film).
  • the obtained cured epoxy resin was cut into 1 cm square, and the thermal diffusivity was measured using the following apparatus.
  • ⁇ Thermal diffusivity measuring device Product name “LFA447” (Xenon Flash Analyzer) manufactured by NETZSCH
  • the specific heat of the obtained cured epoxy resin was determined by differential scanning calorimetry under the following conditions. ⁇ Differential scanning calorimeter: Trade name “Q-200” manufactured by TA Instruments Japan Test conditions: 25 ° C., 10 minutes (constant) ⁇ 25-60 ° C. (10 ° C./min) ⁇ 60° C., 10 minutes (constant)
  • thermal conductivity thermal diffusivity x specific gravity x specific heat
  • thermal conductivity was evaluated based on the following evaluation criteria.
  • the results of Examples 1 to 4 are shown in Table 1.
  • the thermal conductivity of Examples 5 to 8 is equivalent to that of Examples 1 to 4 (evaluation: A).
  • the thermal conductivity of Example 5 was 2.73 W / m ⁇ K.
  • A Thermal conductivity> 2.5 W / m ⁇ K
  • B Thermal conductivity ⁇ 2.5 W / m ⁇ K
  • the obtained laminated film having a thickness of 500 ⁇ m was cured under the following conditions to prepare an epoxy resin cured body (cured product of sealing film).
  • ⁇ Oven Product name “SAFETY OPEN SPH-201” manufactured by ESPEC Corporation ⁇ Oven temperature: 140 °C ⁇ Heating time: 90 minutes
  • the obtained cured epoxy resin was cut into 1 cm square, and the thermal conductivity of the cured epoxy resin was measured by a temperature gradient method using a thermal resistivity meter. And thermal conductivity was evaluated based on the following evaluation criteria. The results are shown in Table 2. “A”: Thermal conductivity> 2.5 W / m ⁇ K “B”: Thermal conductivity ⁇ 2.5 W / m ⁇ K
  • FIG. 2 shows a layout of silicon chips in this measurement. First, as shown in FIG. 2, silicon chips (7.3 mm square silicon chip 60 and 3 mm square silicon chip 70) having a thickness of 350 ⁇ m were arranged on the SUS plate 50. Next, the laminated film was cut into a circle having a diameter of 20 cm and placed on the silicon chip.
  • the silicon chip was sealed under the following conditions using a compression mold apparatus (manufactured by Apic Yamada Co., Ltd., trade name: WCM-300) to obtain a sealed body (sealed structure).
  • a compression mold apparatus manufactured by Apic Yamada Co., Ltd., trade name: WCM-300
  • ⁇ Compression molding temperature 140 °C
  • Compression mold pressure 2.5MPa
  • Compression mold time 10 minutes
  • the inorganic filler contains aluminum oxide, and the content of the inorganic filler is that of the resin composition. It can be seen that when the total mass (excluding the mass of the solvent) is 72% by mass or more, an excellent effect can be obtained with respect to the thermal conductivity of the cured product. From Example 4 shown in Table 1, it can be seen that even when the inorganic filler contains silica, an excellent effect can be obtained regarding the thermal conductivity of the cured product.
  • the inorganic filler contains aluminum oxide, and the content of the inorganic filler is the total mass of the resin composition (excluding the mass of the solvent). ) On the basis of 72% by mass or more, it was found that an excellent effect on the thermal conductivity of the cured product was obtained and the embedding property was excellent.
  • SYMBOLS 1 Support body, 2 ... Sealing film, 2a ... Hardened

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PCT/JP2016/075688 2015-09-02 2016-09-01 樹脂組成物、硬化物、封止用フィルム及び封止構造体 WO2017038941A1 (ja)

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JP2017538107A JP6763391B2 (ja) 2015-09-02 2016-09-01 樹脂組成物、硬化物、封止用フィルム及び封止構造体
KR1020187006211A KR102486893B1 (ko) 2015-09-02 2016-09-01 수지 조성물, 경화물, 봉지용 필름 및 봉지 구조체
CN201680049953.4A CN107924886A (zh) 2015-09-02 2016-09-01 树脂组合物、固化物、密封用膜及密封结构体

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019017283A1 (ja) * 2017-07-21 2019-01-24 株式会社村田製作所 電子部品
WO2020065872A1 (ja) * 2018-09-27 2020-04-02 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
WO2022149602A1 (ja) * 2021-01-08 2022-07-14 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物及び電子部品装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200094221A (ko) * 2017-12-28 2020-08-06 히타치가세이가부시끼가이샤 볼 그리드 어레이 패키지 밀봉용 에폭시 수지 조성물, 에폭시 수지 경화물 및 전자 부품 장치
CN114437511A (zh) * 2021-12-31 2022-05-06 江苏科化新材料科技有限公司 环氧树脂组合物及其应用、环氧树脂成型材料及其制备方法与应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012025907A (ja) * 2010-07-27 2012-02-09 Panasonic Electric Works Co Ltd 電子部品封止用シート状エポキシ樹脂組成物材料の製造方法と電子部品
JP2014029958A (ja) * 2012-07-31 2014-02-13 Ajinomoto Co Inc 半導体装置の製造方法
JP2015106698A (ja) * 2013-12-02 2015-06-08 味の素株式会社 半導体装置の製造方法
WO2015098838A1 (ja) * 2013-12-26 2015-07-02 日東電工株式会社 半導体装置の製造方法及び熱硬化性樹脂シート

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56166729A (en) 1980-05-06 1981-12-22 Mitsubishi Electric Corp Automatic speed aligning device
JP2001127095A (ja) 1999-10-29 2001-05-11 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
JP2001244372A (ja) 2000-03-01 2001-09-07 Seiko Epson Corp 半導体装置およびその製造方法
JP3995421B2 (ja) * 2001-01-19 2007-10-24 株式会社ルネサステクノロジ 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置
JP2005200533A (ja) * 2004-01-15 2005-07-28 Kyocera Chemical Corp 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置
JP2006028264A (ja) * 2004-07-13 2006-02-02 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2008274083A (ja) * 2007-04-27 2008-11-13 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び半導体装置
JP2010229269A (ja) * 2009-03-26 2010-10-14 Panasonic Electric Works Co Ltd 熱伝導性エポキシ樹脂シート材
JP5799532B2 (ja) 2011-03-10 2015-10-28 住友ベークライト株式会社 半導体封止用樹脂組成物、半導体装置および半導体装置の製造方法
JP2013006893A (ja) * 2011-06-22 2013-01-10 Hitachi Chemical Co Ltd 高熱伝導樹脂組成物、高熱伝導性硬化物、接着フィルム、封止用フィルム、及びこれらを用いた半導体装置
JP5983085B2 (ja) * 2012-06-25 2016-08-31 住友ベークライト株式会社 エポキシ樹脂組成物及び電子部品装置
JP2015126124A (ja) * 2013-12-26 2015-07-06 日東電工株式会社 半導体パッケージの製造方法
CN105849880A (zh) * 2013-12-26 2016-08-10 日东电工株式会社 半导体装置的制造方法
JP6584752B2 (ja) * 2014-06-12 2019-10-02 日東電工株式会社 封止用樹脂シート

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012025907A (ja) * 2010-07-27 2012-02-09 Panasonic Electric Works Co Ltd 電子部品封止用シート状エポキシ樹脂組成物材料の製造方法と電子部品
JP2014029958A (ja) * 2012-07-31 2014-02-13 Ajinomoto Co Inc 半導体装置の製造方法
JP2015106698A (ja) * 2013-12-02 2015-06-08 味の素株式会社 半導体装置の製造方法
WO2015098838A1 (ja) * 2013-12-26 2015-07-02 日東電工株式会社 半導体装置の製造方法及び熱硬化性樹脂シート

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019017283A1 (ja) * 2017-07-21 2019-01-24 株式会社村田製作所 電子部品
US11335617B2 (en) 2017-07-21 2022-05-17 Murata Manufacturing Co., Ltd. Electronic component
WO2020065872A1 (ja) * 2018-09-27 2020-04-02 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JPWO2020065872A1 (ja) * 2018-09-27 2021-08-30 昭和電工マテリアルズ株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7272368B2 (ja) 2018-09-27 2023-05-12 株式会社レゾナック 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
WO2022149602A1 (ja) * 2021-01-08 2022-07-14 昭和電工マテリアルズ株式会社 熱硬化性樹脂組成物及び電子部品装置

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