WO2016180149A1 - 触控显示装置 - Google Patents

触控显示装置 Download PDF

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Publication number
WO2016180149A1
WO2016180149A1 PCT/CN2016/079262 CN2016079262W WO2016180149A1 WO 2016180149 A1 WO2016180149 A1 WO 2016180149A1 CN 2016079262 W CN2016079262 W CN 2016079262W WO 2016180149 A1 WO2016180149 A1 WO 2016180149A1
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Prior art keywords
circuit board
flexible circuit
touch
display device
touch display
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PCT/CN2016/079262
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English (en)
French (fr)
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王大鹏
崔洪伟
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京东方科技集团股份有限公司
京东方（河北）移动显示技术有限公司
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Publication of WO2016180149A1 publication Critical patent/WO2016180149A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a touch display device.
  • the existing touch technologies mainly include two modes: ON CELL and IN CELL.
  • the structure of the existing external touch display device is as shown in FIG. 1 .
  • the top cover includes a package cover 101 , an optical adhesive 102 , an upper polarizer 103 , a color filter substrate 104 , an array substrate 105 , and a lower polarizer 106 . , as well as backlights, etc.
  • the driving chip 107 and the display flexible circuit board 108 are bound to the terminals of the array substrate 105, and the touch flexible circuit board 109 is bound to the terminal of the color film substrate 104.
  • the bonding of the optical adhesive 102 is to apply the liquid glue on the upper polarizer 103 by coating, and then the package cover 101 is attached to the lower display panel, and then irradiated with the ultraviolet light source 110 to make the optical adhesive. 102 reached full cure.
  • the terminal side has both the driving chip 107 and the display flexible circuit board 108, and the touch flexible circuit board 109 is sandwiched between the display panel and the package cover 101, the light is solidified.
  • the gap that can be passed is very narrow, and it is easy to cause incomplete curing problems, which leads to hidden problems and defects in the progress of the overflow. This kind of failure cannot be eliminated and monitored, and becomes a problem that is difficult to solve in the bonding process.
  • An object of the present invention is to provide a touch display device for improving the binding yield of a touch flexible circuit board and the curing yield of the optical adhesive.
  • the touch display device includes a color film substrate and an array substrate disposed on the box, a touch circuit, and a display flexible circuit board and a touch flexible circuit board, wherein the display flexible circuit board and the touch flexible circuit board are respectively bound
  • the touch control circuit is formed on an upper surface of the color filter substrate, and the display flexible circuit board is bound on an edge of the array substrate beyond a portion of the color filter substrate, and the touch flexibility is A circuit board is bonded to an edge of the color film substrate opposite to the side on which the flexible circuit board is displayed.
  • the color film substrate is provided with a black matrix, and the black matrix covered area does not overlap with the binding area of the touch flexible circuit board.
  • an outer polarizer is disposed on the outer side of the color filter substrate, a first notch is disposed on the upper polarizer, the binding region is located in the first notch, and a lower polarizer is disposed outside the array substrate.
  • a second notch is disposed on the lower polarizer, and a position of the second notch corresponds to a position of the first notch.
  • the array substrate is provided with a pixel circuit, and the area where the pixel circuit is located does not overlap with the binding area of the touch flexible circuit board.
  • the touch display device further includes a package cover plate, and the package cover plate and the color filter substrate are bonded by optical glue.
  • the optical glue is a water gel.
  • the touch flexible circuit board and the color filter substrate are bound by an anisotropic conductive adhesive; and/or,
  • the display flexible circuit board and the array substrate are bonded by an anisotropic conductive adhesive.
  • the touch display device further includes a backlight
  • the backlight includes a light shielding glue
  • a binding area of the touch flexible circuit board is located in a region covered by the light shielding glue.
  • the invention discloses that the flexible circuit board and the touch flexible circuit board are respectively disposed on different sides, which can effectively increase the gap between the package cover and the display panel, so that the ultraviolet light is more easily irradiated onto the optical glue, thereby improving The curing yield of the optical glue avoids the subsequent poor glue overflow.
  • the present invention designs a black matrix, a polarizer, and the like in the binding area of the touch flexible circuit board, so that the touch flexible circuit board can be displayed after the binding is completed. The binding state is monitored under the micromirror, thereby improving the binding yield.
  • FIG. 1 is a schematic structural view of a conventional touch display device
  • FIG. 2 is a schematic structural diagram of a touch display device according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural view of the touch display device in the embodiment of the present invention when the flexible circuit board is not bound;
  • FIG. 4 is a schematic view of the end of FIG. 3 for binding a touch flexible circuit board
  • 5a and 5b are schematic views showing the binding state of the prior art and the present invention under a microscope
  • FIG. 6 is a schematic diagram showing an improved design of a backlight in an embodiment of the present invention.
  • 101-package cover 102-optical glue; 103, 203-upper polarizer; 104, 204-color film substrate; 105, 205-array substrate; 106, 206-lower polarizer; 107-drive Chip; 108-display flexible circuit board; 109-touch flexible circuit board; 110-UV light source; 211-black matrix; 212-shading glue; A-display flexible circuit board bonding area; B-touch flexible circuit board Binding area.
  • the present invention provides a touch display device.
  • the touch display device includes a display flexible circuit board 108 and a touch flexible circuit board 109 , wherein the flexible circuit board 108 and the touch flexible circuit board are displayed. 109 are respectively bound to different sides of the touch display device.
  • the package cover 101 and the display panel are The spacing is very narrow, about 0.05 mm.
  • the ultraviolet light emitted by the ultraviolet light source 110 is difficult to completely illuminate the area where the optical adhesive 102 is located, which tends to cause incomplete curing, and subsequently generates an overflow phenomenon.
  • the display flexible circuit board 108 and the touch flexible circuit board 109 are respectively disposed on different sides of the touch display device, and by practice, the gap between the package cover 101 and the display panel can be increased to About 0.15mm, the ultraviolet light is more easily irradiated onto the optical adhesive 102, thereby improving the curing yield of the optical adhesive and avoiding defects such as subsequent overflow.
  • the lower side of the touch flexible circuit board 109 corresponds to the black matrix, and it is difficult to observe the binding state of the touch flexible circuit board 109 under the microscope.
  • the black matrix avoidance design can be conveniently performed under the touch flexible circuit board 109, thereby facilitating the binding state under the microscope after the binding is completed. Monitor and increase the bond yield.
  • the display flexible circuit board 108 and the touch flexible circuit board 109 are respectively bound to opposite sides of the touch display device.
  • A indicates a binding area of the flexible circuit board 108
  • B indicates a binding area of the touch flexible circuit board 109.
  • the two binding areas are respectively disposed on opposite sides of the touch display device, which is beneficial to realize The narrow bezel design of the display unit.
  • the touch display device includes a color filter substrate 204 and an array substrate 205 disposed on the cartridge, and a touch circuit formed on an upper surface of the color filter substrate 204.
  • the display flexible circuit board 108 is bonded to the edge of the portion of the array substrate 205 that is beyond the color filter substrate 204 (the area shown by A in FIG. 3), and the touch flexible circuit board 109 is bonded to the color filter substrate 204.
  • the edge of the side opposite to the display flexible circuit board 108 (the area shown by B in Fig. 3).
  • a black matrix 211 is disposed on the color filter substrate 204. As described above, the black matrix 211 needs to avoid the binding area B of the touch flexible circuit board 109, that is, the binding area of the area covered by the black matrix 211 and the touch flexible circuit board 109. B does not overlap so as to monitor the binding state of the touch flexible circuit board 109 under the microscope.
  • FIG. 4 is a schematic diagram of the end of FIG. 3 for binding the touch flexible circuit board 109.
  • the transparent area of the touch flexible circuit board 109 is transparent glass. The glass can clearly see the binding state of the touch flexible circuit board 109 under the microscope, which is beneficial to real-time monitoring of the production process and improve the binding yield.
  • FIG. 5a and FIG. 5b are schematic diagrams showing the binding state of the prior art and the present invention under the microscope, and the touch flexible circuit board 109 and the color filter substrate 204 are bound by an anisotropic conductive adhesive, and the main under the microscope The deformation state of the conductive balls in the anisotropic conductive paste is observed to determine whether the touch flexible circuit board 109 is reliably bonded to the color filter substrate 204. Comparing FIG. 5a and FIG. 5b, the invention improves the binding process of the touch flexible circuit board 109 from the previous uncontrollable production process to the controllable production process, which greatly improves the production yield and improves the production yield. The production capacity.
  • the display flexible circuit board 108 and the array substrate 205 are also bound by an anisotropic conductive adhesive, and the binding state can also be observed in the above manner, and details are not described herein again.
  • an upper polarizer 203 is disposed outside the color film substrate 204, and a first notch is disposed on the upper polarizer 203, and a binding region of the touch flexible circuit board 109 is located in the first notch.
  • a lower polarizer 206 is disposed outside the array substrate 205, and a second notch is disposed on the lower polarizer 206, and the position of the second notch corresponds to the position of the first notch.
  • the present invention also avoids the binding region of the touch flexible circuit board 109 on the upper polarizer 203 and the lower polarizer 206, so that after the touch flexible circuit board 109 is bound, it can be tied under the microscope. The status is monitored.
  • a pixel circuit is disposed on the array substrate 205, and the pixel circuit includes a gate line, a data line, a common electrode line, and the like.
  • the area where the pixel circuit is located does not overlap with the binding area of the touch flexible circuit board 109. That is, the pixel circuit also avoids the binding area of the touch flexible circuit board 109 during design to ensure that the binding state of the touch flexible circuit board 109 can be monitored.
  • the touch display device further includes a package cover 101, and the package cover 101 and the color filter substrate 204 are bonded by the optical adhesive 102.
  • the upper polarizer 203 is attached to the color filter substrate 204, and the package cover 101 and the upper polarizer 203 are bonded together by the optical adhesive 102.
  • the optical glue 102 here is preferably made of water glue, which has the advantages of less bubbles, stable curing, and environmental protection, and can effectively improve the production yield.
  • the touch display device further includes a backlight.
  • the backlight includes a light shielding adhesive 212.
  • the binding area of the touch flexible circuit board 109 is located in a region covered by the light shielding adhesive 212.
  • FIG. 6 is a schematic diagram of an improved design of a backlight in an embodiment of the present invention. Since the black matrix is designed to avoid the binding area of the touch flexible circuit board 109, in order to avoid the occurrence of light leakage, the backlight in FIG. 6 is appropriate. Increase the width of the circle to match the black matrix to ensure product yield.
  • the present invention can effectively increase the gap between the package cover 101 and the display panel by providing the display flexible circuit board 108 and the touch flexible circuit board 109 on different sides of the touch display device. Therefore, the curing yield of the optical adhesive is improved, and the subsequent overflow failure is avoided.
  • the present invention designs a black matrix, a polarizer, and the like in the binding area of the touch flexible circuit board 109, so that the touch flexible circuit board 109 can be bound to monitor the binding state under the microscope, thereby improving the binding state. Bind yield.

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Abstract

一种触控显示装置。所述触控显示装置包括显示柔性电路板（108）和触控柔性电路板（109），所述显示柔性电路板（108）和所述触控柔性电路板（109）分别绑定在所述触控显示装置的不同侧。由此能够有效增大封装盖板（101）贴合时与显示面板之间的间隙，使得紫外光更容易照射到光学胶上，从而提高了光学胶的固化良率，避免了后续溢胶不良。此外，触控柔性电路板（109）的绑定区域与黑矩阵（211）、偏光片（106，206）等结构避让开，即使得其彼此不重叠，从而在触控柔性电路板绑定结束后能够在显微镜下监控其绑定状态，从而提高了绑定良率。

Description

触控显示装置 技术领域
本发明涉及显示技术领域，尤其涉及一种触控显示装置。
背景技术
随着显示技术的发展，现有的触控技术主要包括外挂式(ON CELL)和内嵌式(IN CELL)两种模式。现有外挂式触控显示装置的结构如图1所示，从上往下依次包括：封装盖板101、光学胶102、上偏光片103、彩膜基板104、阵列基板105、下偏光片106、以及背光源等。其中，驱动芯片107和显示柔性电路板108绑定于阵列基板105端子处，触控柔性电路板109绑定于彩膜基板104端子处。
光学胶102的贴合是通过涂布方式将液态胶涂布在上偏光片103上，然后将封装盖板101与下方的显示面板贴合在一起，再采用紫外光源110进行照射，使光学胶102达到完全固化。
现有技术在工艺中主要存在以下问题：
首先，触控柔性电路板109绑定时，由于底部为显示面板的黑矩阵区，因此无法检测绑定对位状态及导电粒子状态。
其次，封装盖板101进行贴合时，由于端子边既有驱动芯片107和显示柔性电路板108，又有触控柔性电路板109夹在显示面板和封装盖板101之间，使得固化时光线能通过的夹缝非常窄，容易产生固化不完全问题，从而导致进行性溢胶隐患及不良，这种不良无法杜绝与监控，成为贴合工艺中难以解决的问题。
发明内容
本发明的目的在于提供一种触控显示装置，以提升触控柔性电路板的绑定良率和光学胶的固化良率。
为解决上述技术问题，本发明提供了一种触控显示装置，所述 触控显示装置包括对盒设置的彩膜基板和阵列基板、触控电路、以及显示柔性电路板和触控柔性电路板，所述显示柔性电路板和所述触控柔性电路板分别绑定在
所述触控显示装置的相对的两侧。
优选地，所述触控电路形成在所述彩膜基板的上表面上，所述显示柔性电路板绑定在所述阵列基板上超出所述彩膜基板的部分的边缘，所述触控柔性电路板绑定在所述彩膜基板上与所述显示柔性电路板相对的一侧的边缘。
优选地，所述彩膜基板上设置有黑矩阵，所述黑矩阵覆盖的区域与所述触控柔性电路板的绑定区不重叠。
优选地，所述彩膜基板外侧设置有上偏光片，所述上偏光片上设置有第一缺口，所述绑定区位于所述第一缺口中，所述阵列基板外侧设置有下偏光片，所述下偏光片上设置有第二缺口，所述第二缺口的位置与所述第一缺口的位置相对应。
优选地，所述阵列基板上设置有像素电路，所述像素电路所在的区域与所述触控柔性电路板的绑定区不重叠。
优选地，所述触控显示装置还包括封装盖板，所述封装盖板与所述彩膜基板之间通过光学胶进行贴合。
优选地，所述光学胶为水胶。
优选地，所述触控柔性电路板与所述彩膜基板之间通过各向异性导电胶进行绑定；和/或，
所述显示柔性电路板与所述阵列基板之间通过各向异性导电胶进行绑定。
优选地，所述触控显示装置还包括背光源，所述背光源包括遮光胶，所述触控柔性电路板的绑定区位于所述遮光胶覆盖的区域中。
本发明将显示柔性电路板和触控柔性电路板分别设置在不同侧，能够有效增大封装盖板贴合时与显示面板之间的间隙，使得紫外光更容易照射到光学胶上，从而提高了光学胶的固化良率，避免了后续溢胶不良。此外，本发明在触控柔性电路板的绑定区域设计了黑矩阵、偏光片等结构的避让，使得触控柔性电路板绑定结束后能够在显 微镜下监控其绑定状态，从而提高了绑定良率。
附图说明
附图是用来提供对本发明的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本发明，但并不构成对本发明的限制。
图1是现有触控显示装置的结构示意图；
图2是本发明实施例中的触控显示装置的结构示意图；
图3是本发明实施例中的触控显示装置未绑定柔性电路板时的结构示意图；
图4是图3中用于绑定触控柔性电路板的一端的示意图；
图5a和图5b分别是现有技术与本发明在显微镜下观察绑定状态的示意图；
图6是本发明实施例中背光源的改进设计示意图。
在附图中，101-封装盖板；102-光学胶；103、203-上偏光片；104、204-彩膜基板；105、205-阵列基板；106、206-下偏光片；107-驱动芯片；108-显示柔性电路板；109-触控柔性电路板；110-紫外光源；211-黑矩阵；212-遮光胶；A-显示柔性电路板的绑定区；B-触控柔性电路板的绑定区。
具体实施方式
以下结合附图对本发明的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本发明，并不用于限制本发明。
本发明提供了一种触控显示装置，如图2所示，所述触控显示装置包括显示柔性电路板108和触控柔性电路板109，其中，显示柔性电路板108和触控柔性电路板109分别绑定在所述触控显示装置的不同侧。
在现有技术中，由于显示柔性电路板108和触控柔性电路板109均绑定在触控显示装置的同侧，导致封装盖板101与显示面板之间的 间距非常窄，大约为0.05mm，在对光学胶102进行固化时，紫外光源110发出的紫外光难以完全照射到光学胶102所在的区域，容易导致固化不完全，后续产生溢胶现象。
在本发明中，显示柔性电路板108和触控柔性电路板109分别设置在触控显示装置的不同侧，经实践，能够将封装盖板101贴合后与显示面板之间的间隙增大至0.15mm左右，使得紫外光更容易照射到光学胶102上，从而提高了光学胶的固化良率，避免了后续溢胶等不良。
此外，现有技术中触控柔性电路板109的下方对应于黑矩阵，难以在显微镜下观察触控柔性电路板109的绑定状态。本发明中由于触控柔性电路板109设置在另一侧，能够很方便地在触控柔性电路板109的下方进行黑矩阵避让设计，从而有利于在绑定结束后在显微镜下对绑定状态进行监控，提高绑定良率。
优选地，显示柔性电路板108和触控柔性电路板109分别绑定在所述触控显示装置的相对的两侧。如图3所示，A表示显示柔性电路板108的绑定区，B表示触控柔性电路板109的绑定区，两个绑定区分别设置在触控显示装置的对侧，有利于实现显示装置的窄边框设计。
通常，所述触控显示装置包括对盒设置的彩膜基板204和阵列基板205、以及触控电路，所述触控电路形成在彩膜基板204的上表面上。在本发明中，显示柔性电路板108绑定在阵列基板205上超出彩膜基板204的部分的边缘(图3中A所示区域)，触控柔性电路板109绑定在彩膜基板204上与显示柔性电路板108相对的一侧的边缘(图3中B所示区域)。
彩膜基板204上设置有黑矩阵211，如上所述，黑矩阵211需要避让触控柔性电路板109的绑定区B，即黑矩阵211覆盖的区域与触控柔性电路板109的绑定区B不重叠，以便于在显微镜下监控触控柔性电路板109的绑定状态。
图4是图3中用于绑定触控柔性电路板109的一端的示意图，从图4中可以看出，触控柔性电路板109的绑定区B下方为透明玻 璃，因此在显微镜下能够清楚地观看到触控柔性电路板109的绑定状态，有利于对生产过程进行实时监控，提高绑定良率。
图5a和图5b分别是现有技术与本发明在显微镜下观察绑定状态的示意图，触控柔性电路板109与彩膜基板204之间通过各向异性导电胶进行绑定，在显微镜下主要观察各向异性导电胶中的导电球的变形状态来确定触控柔性电路板109是否可靠地绑定在彩膜基板204上。对比图5a和图5b可以看出，本发明将触控柔性电路板109的绑定过程从之前的不可控生产过程改进为可控的生产过程，在很大程度上改善了生产良率，提高了产能。
此外，显示柔性电路板108与阵列基板205之间也通过各向异性导电胶进行绑定，并且也可以采用上述方式观察绑定状态，此处不再赘述。
进一步地，如图3所示，彩膜基板204外侧设置有上偏光片203，上偏光片203上设置有第一缺口，触控柔性电路板109的绑定区位于所述第一缺口中。此外，阵列基板205外侧设置有下偏光片206，下偏光片206上设置有第二缺口，所述第二缺口的位置与所述第一缺口的位置相对应。
本发明在上偏光片203和下偏光片206上也针对触控柔性电路板109的绑定区做了避让设计，以使得绑定完触控柔性电路板109后，能够在显微镜下对其绑定状态进行监控。
通常，阵列基板205上设置有像素电路，所述像素电路包括栅线、数据线、公共电极线等。同样地，为了便于观察触控柔性电路板109的绑定状态，所述像素电路所在的区域与触控柔性电路板109的绑定区不重叠。即所述像素电路在设计时也避让触控柔性电路板109的绑定区，以确保触控柔性电路板109的绑定状态可监控。
进一步地，所述触控显示装置还包括封装盖板101，封装盖板101与彩膜基板204之间通过光学胶102进行贴合。具体地，彩膜基板204上贴附有上偏光片203，封装盖板101与上偏光片203之间通过光学胶102进行贴合。此处的光学胶102优选采用水胶，水胶具有气泡少、固化稳定、环保的优点，能够有效提高生产良率。
进一步地，所述触控显示装置还包括背光源，如图6所示，所述背光源包括遮光胶212，触控柔性电路板109的绑定区位于遮光胶212覆盖的区域中。
图6是本发明实施例中背光源的改进设计示意图，由于黑矩阵在设计上对触控柔性电路板109的绑定区做了避让，为了避免漏光现象的产生，图6中的背光源适当增加画圈部位的宽度，以与黑矩阵进行配合，确保产品的良率。
综上所述，本发明通过将显示柔性电路板108和触控柔性电路板109分别设置在触控显示装置的不同侧，能够有效增大封装盖板101贴合时与显示面板之间的间隙，从而提高了光学胶的固化良率，避免了后续溢胶不良。此外，本发明在触控柔性电路板109的绑定区域设计了黑矩阵、偏光片等结构的避让，使得触控柔性电路板109绑定后能够在显微镜下监控其绑定状态，从而提高了绑定良率。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (10)

  1. 一种触控显示装置，包括对盒设置的彩膜基板和阵列基板、触控电路、以及显示柔性电路板和触控柔性电路板，所述触控电路形成在所述彩膜基板的上表面上，其特征在于，所述显示柔性电路板和所述触控柔性电路板
    分别绑定在所述触控显示装置的相对的两侧。
  2. 根据权利要求1所述的触控显示装置，其特征在于，所述显示柔性电路板绑定在所述阵列基板上超出所述彩膜基板的部分的边缘，所述触控柔性电路板绑定在所述彩膜基板上与所述显示柔性电路板相对的一侧的边缘。
  3. 根据权利要求2所述的触控显示装置，其特征在于，所述彩膜基板上设置有黑矩阵，所述黑矩阵覆盖的区域与所述触控柔性电路板的绑定区不重叠。
  4. 根据权利要求2所述的触控显示装置，其特征在于，所述彩膜基板外侧设置有上偏光片，所述上偏光片上设置有第一缺口，所述绑定区位于所述第一缺口中，所述阵列基板外侧设置有下偏光片，所述下偏光片上设置有第二缺口，所述第二缺口的位置与所述第一缺口的位置相对应。
  5. 根据权利要求2所述的触控显示装置，其特征在于，所述阵列基板上设置有像素电路，所述像素电路所在的区域与所述触控柔性电路板的绑定区不重叠。
  6. 根据权利要求2至5中任意一项所述的触控显示装置，其特征在于，所述触控显示装置还包括封装盖板，所述封装盖板与所述彩膜基板之间通过光学胶进行贴合。
  7. 根据权利要求6所述的触控显示装置，其特征在于，所述光学胶为水胶。
  8. 根据权利要求2至5中任意一项所述的触控显示装置，其特征在于，所述触控柔性电路板与所述彩膜基板之间通过各向异性导电胶进行绑定；和/或，
    所述显示柔性电路板与所述阵列基板之间通过各向异性导电胶进行绑定。
  9. 根据权利要求2至5中任意一项所述的触控显示装置，其特征在于，所述触控显示装置还包括背光源，所述背光源包括遮光胶，所述触控柔性电路板的绑定区位于所述遮光胶覆盖的区域中。
  10. 根据权利要求2至5中任意一项所述的触控显示装置，其特征在于，所述封装盖板与所述彩膜基板之间的间隙不小于0.15mm。
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