CN106648209B - 柔性触摸屏及其制作方法、触摸装置 - Google Patents

柔性触摸屏及其制作方法、触摸装置 Download PDF

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CN106648209B
CN106648209B CN201610910445.2A CN201610910445A CN106648209B CN 106648209 B CN106648209 B CN 106648209B CN 201610910445 A CN201610910445 A CN 201610910445A CN 106648209 B CN106648209 B CN 106648209B
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CN106648209A (zh
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崔磊
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Wuhan China Star Optoelectronics Technology Co Ltd
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    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
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    • H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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    • H05K2201/10151—Sensor
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor

Abstract

本发明揭露一种柔性触摸屏，包括：柔性基板，所述柔性基板上设有主外引脚接合区以及触控引脚接合区，所述主外引脚接合区以及所述触控引脚接合区均设有柔性线路板绑定焊垫；触控面板，所述触控面板与所述柔性基板通过粘胶层连接，所述触控面板上与所述柔性基板相对的一面设有触控柔性线路板，所述触控柔性线路板的位置与所述触控引脚接合区的位置相对应；在柔性线路板绑定时，所述触控面板的所述触控柔性线路板与所述柔性基板的所述触控引脚接合区上设置的柔性线路板绑定焊垫绑定连接，所述柔性基板通过所述主外引脚接合区上设置的柔性线路板绑定焊垫与主柔性线路板绑定连接。本发明简化了柔性触摸屏FPC绑定制程且，减少了FPC的数量。

Description

柔性触摸屏及其制作方法、触摸装置
技术领域
本发明涉及显示技术领域，尤其是涉及一种提高柔性基板和触摸屏OLB整合技术的柔性触摸屏及其制作方法、触摸装置。
背景技术
触摸技术作为目前一种最简单、方便、自然的人机交互方式已受到全球的普遍重视，并被广泛应用于各个行业中。随着科技发展以及人们对产品要求的提高，柔性触摸屏开始逐渐应用于手机和掌上电脑等的移动电子设备。柔性触摸屏是采用柔性材料制成的可以任意弯曲变形的触控显示面板，具有轻、薄、可折叠和便携等的突出优点。
参考图1-3，其中，图1为现有柔性触摸屏的叠成结构，图2为现有柔性触摸屏的柔性线路板绑定结构，图3为现有柔性触摸屏的柔性线路板绑定位置示意图。柔性触摸屏包括TFT阵列基板11、触控面板12；TFT阵列基板11与触控面板12通过粘胶层13连接；TFT阵列基板11上设有薄膜封装层(TFE)14。触控面板12的长度小于TFT阵列基板11的长度，以暴露出设于TFT阵列基板11上的第一外引脚接合区(OLB)111，触控面板12的上表面设有第二外引脚接合区121。TFT阵列基板11在第一外引脚接合区111设有第一绑定焊垫112，触控面板12在第二外引脚接合区121设有第二绑定焊垫122。TFT阵列基板11通过第一绑定焊垫112与主柔性线路板21绑定连接；触控面板12通过第二绑定焊垫122与触控柔性线路板22绑定连接。现有的柔性触摸屏在柔性线路板(Flexible Printed Circuit，简称FPC))绑定时，需要先将触控面板的触控FPC绑定后，再将触控面板的触控FPC和TFT阵列基板的主FPC绑定在一起(如图3中标号31所示位置)。FPC绑定制程工序较复杂，且需要的FPC的数量较多。
因此，现有柔性触摸屏的结构有待改进和发展，以提高柔性触摸屏的整合特性，简化柔性触摸屏FPC绑定制程的工序，以及减少FPC的数量。
发明内容
本发明的目的在于，提供一种柔性触摸屏及其制作方法、触摸装置，可以提高柔性触摸屏的整合特性，简化柔性触摸屏FPC绑定制程的工序，以及减少FPC的数量。
为实现上述目的，本发明提供了一种柔性触摸屏，包括：柔性基板，所述柔性基板上设有主外引脚接合区以及触控引脚接合区，所述主外引脚接合区以及所述触控引脚接合区均设有柔性线路板绑定焊垫；触控面板，所述触控面板与所述柔性基板通过粘胶层连接，所述触控面板上与所述柔性基板相对的一面设有触控柔性线路板，所述触控柔性线路板的位置与所述触控引脚接合区的位置相对应；在柔性线路板绑定时，所述触控面板的所述触控柔性线路板与所述柔性基板的所述触控引脚接合区上设置的柔性线路板绑定焊垫绑定连接，所述柔性基板通过所述主外引脚接合区上设置的柔性线路板绑定焊垫与主柔性线路板绑定连接。
为实现上述目的，本发明还提供了一种触摸装置，包括本发明所述的柔性触摸屏。
为实现上述目的，本发明还提供了一种柔性触摸屏的制作方法，包括：提供一柔性基板，并在所述柔性基板上沉积一层粘胶层，所述柔性基板上设有主外引脚接合区以及触控引脚接合区；提供一触控面板，所述触控面板与所述柔性基板通过所述粘胶层连接，所述触控面板上与所述柔性基板相对的一面设有触控柔性线路板，所述触控柔性线路板的位置与所述触控引脚接合区的位置相对应；在所述触控引脚接合区，将所述触控柔性线路板与所述触控引脚接合区上设置的柔性线路板绑定焊垫绑定连接，以及，在所述主外引脚接合区，将所述柔性基板通过所述主外引脚接合区上设置的柔性线路板绑定焊垫与主柔性线路板绑定连接。
本发明的优点在于，通过将柔性触摸屏中触控柔性线路板整合到触控面板上，将触控面板的OLB制作在柔性基板上，实现触控面板的触控柔性线路板和柔性基板上相应的OLB区域可以直接进行绑定，从而减少一道FPC绑定制程，简化了柔性触摸屏FPC绑定制程且，减少了FPC的数量。
附图说明
图1，现有柔性触摸屏的叠成结构；
图2，现有柔性触摸屏的柔性线路板绑定结构
图3，现有柔性触摸屏的柔性线路板绑定位置示意图；
图4，本发明所述的柔性触摸屏的叠成结构；
图5，本发明所述的柔性触摸屏的柔性线路板绑定结构
图6，本发明所述的柔性触摸屏的柔性线路板绑定位置示意图；
图7，本发明一实施例所述的柔性触摸屏的制作方法的流程图。
具体实施方式
下面结合附图以及实施例，对本发明提供的柔性触摸屏及其制作方法、触摸装置作详细说明。显然，所描述的实施例仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
参考图4-6，其中，图4为本发明所述的柔性触摸屏的叠成结构，图5为本发明所述的柔性触摸屏的柔性线路板绑定结构，图6为本发明所述的柔性触摸屏的柔性线路板绑定位置示意图。所述的柔性触摸屏包括：柔性基板41以及触控面板42。
所述柔性基板41上设有主外引脚接合区61以及触控引脚接合区62；所述主外引脚接合区61以及所述触控引脚接合区62均设有柔性线路板绑定焊垫(FPC Banding Pad)。如图6所示，所述主外引脚接合区61设有主柔性线路板绑定焊垫(Main FPC Banding Pad)611，所述触控引脚接合区62设有触控柔性线路板绑定焊垫(TP FPC Banding Pad)621。也即，本发明将触控柔性线路板的绑定焊垫嵌入到柔性基板上。
所述触控面板42与所述柔性基板41通过粘胶层43连接。所述触控面板42上与所述柔性基板41相对的一面设有触控柔性线路板421，所述触控柔性线路板421的位置与所述触控引脚接合区62的位置相对应。如图4所示，所述触控柔性线路板421设于所述触控面板42的下表面，且正对所述柔性基板41上的所述触控引脚接合区62。所述粘胶层43具体为光学透明胶层(Optical Clear Adhesive，简称OCA)。粘胶层43的长度小于柔性基板41的长度，以及触控面板42的长度，以暴露出触控面板42下表面的触控柔性线路板421以及柔性基板41上的主外引脚接合区61以及触控引脚接合区62；触控面板42与柔性基板41的长度可以相等。
在柔性线路板绑定时，所述触控面板42的所述触控柔性线路板421与所述柔性基板41的所述触控引脚接合区62上设置的触控柔性线路板绑定焊垫621绑定连接，所述柔性基板42通过所述主外引脚接合区61上设置的主柔性线路板绑定焊垫611与主柔性线路板51绑定连接。
本发明通过将柔性触摸屏中触控柔性线路板整合到触控面板上，将触控面板的OLB制作在柔性基板上，实现触控面板的触控柔性线路板和柔性基板上相应的OLB区域可以直接进行绑定，从而减少一道FPC绑定制程，简化了柔性触摸屏FPC绑定制程且，减少了FPC的数量。
可选的，所述柔性基板41为柔性的TFT(Thin Film Transistor，薄膜晶体管)阵列基板。
优选的，所述柔性基板41上设有薄膜封装层44。薄膜封装(Thin filmencapsulation，简称TFE)，采用薄膜封装技术的柔性面板，在具有良好伸缩性能的同时，更轻、更薄。
可选的，所述触控面板42包括玻璃盖板、触摸感应膜层以及触控柔性线路板；所述触控柔性线路板嵌入所述触摸感应膜层，所述触摸感应膜层通过所述粘胶层43与所述柔性基板41连接。所述触摸感应膜层的结构可以为单层膜结构或双层膜结构。单层膜结构或双层膜结构为导电材料在绝缘膜层载体或者玻璃载体上生成的导电图案。导电图案通过激光镭射、蚀刻或曝光显影来实现。
本发明还提供了一种触摸装置，所述的触摸装置包括本发明所述的柔性触摸屏。采用本发明所述的柔性触摸屏的触摸装置，通过将触控柔性线路板整合到触控面板上，将触控面板的OLB制作在柔性基板上，实现触控面板的触控柔性线路板和柔性基板上相应的OLB区域可以直接进行绑定，从而减少一道FPC绑定制程，简化了柔性触摸屏FPC绑定制程且，减少了FPC的数量。
参考图7，本发明一实施例所述的柔性触摸屏的制作方法的流程图；所述方法包括如下步骤：S71：提供一柔性基板，并在所述柔性基板上沉积一层粘胶层；其中，所述柔性基板上设有主外引脚接合区以及触控引脚接合区。S72：提供一触控面板，所述触控面板与所述柔性基板通过所述粘胶层连接；其中，所述触控面板上与所述柔性基板相对的一面设有触控柔性线路板，所述触控柔性线路板的位置与所述触控引脚接合区的位置相对应。S73：在所述触控引脚接合区，将所述触控柔性线路板与所述触控引脚接合区上设置的柔性线路板绑定焊垫绑定连接，以及，在所述主外引脚接合区，将所述柔性基板通过所述主外引脚接合区上设置的柔性线路板绑定焊垫与主柔性线路板绑定连接。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (6)

1.一种柔性触摸屏，其特征在于，包括：
柔性基板，所述柔性基板上设有主外引脚接合区以及触控引脚接合区，所述主外引脚接合区以及所述触控引脚接合区均设有柔性线路板绑定焊垫；
触控面板，所述触控面板上与所述柔性基板相对的一面设有触控柔性线路板，所述触控柔性线路板的位置与所述触控引脚接合区的位置相对应，所述触控面板还包括玻璃盖板、触摸感应膜层，所述触控柔性线路板嵌入所述触摸感应膜层，所述触摸感应膜层通过粘胶层与所述柔性基板连接；
在柔性线路板绑定时，所述触控面板的所述触控柔性线路板与所述柔性基板的所述触控引脚接合区上设置的柔性线路板绑定焊垫绑定连接，所述柔性基板通过所述主外引脚接合区上设置的柔性线路板绑定焊垫与主柔性线路板绑定连接。
2.如权利要求1所述的柔性触摸屏，其特征在于，所述柔性基板为柔性的TFT阵列基板。
3.如权利要求1所述的柔性触摸屏，其特征在于，所述柔性基板上设有薄膜封装层。
4.如权利要求1所述的柔性触摸屏，其特征在于，所述粘胶层为光学透明胶层。
5.一种触摸装置，其特征在于，包括权利要求1～4任意一项所述的柔性触摸屏。
6.一种柔性触摸屏的制作方法，其特征在于，包括：
提供一柔性基板，并在所述柔性基板上沉积一层粘胶层，所述柔性基板上设有主外引脚接合区以及触控引脚接合区；
提供一触控面板，所述触控面板上与所述柔性基板相对的一面设有触控柔性线路板，所述触控柔性线路板的位置与所述触控引脚接合区的位置相对应，所述触控面板还包括玻璃盖板、触摸感应膜层，所述触控柔性线路板嵌入所述触摸感应膜层，所述触摸感应膜层通过所述粘胶层与所述柔性基板连接；
在所述触控引脚接合区，将所述触控柔性线路板与所述触控引脚接合区上设置的柔性线路板绑定焊垫绑定连接，以及，
在所述主外引脚接合区，将所述柔性基板通过所述主外引脚接合区上设置的柔性线路板绑定焊垫与主柔性线路板绑定连接。
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