WO2016136121A1 - マグネトロンスパッタリング装置用の回転式カソードユニット - Google Patents
マグネトロンスパッタリング装置用の回転式カソードユニット Download PDFInfo
- Publication number
- WO2016136121A1 WO2016136121A1 PCT/JP2016/000092 JP2016000092W WO2016136121A1 WO 2016136121 A1 WO2016136121 A1 WO 2016136121A1 JP 2016000092 W JP2016000092 W JP 2016000092W WO 2016136121 A1 WO2016136121 A1 WO 2016136121A1
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- target
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- magnetic field
- magnetron sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/354—Introduction of auxiliary energy into the plasma
- C23C14/355—Introduction of auxiliary energy into the plasma using electrons, e.g. triode sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/342—Hollow targets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3423—Shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3452—Magnet distribution
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3497—Temperature of target
Definitions
- the present invention relates to a rotary cathode unit used in a magnetron sputtering apparatus.
- This type of rotary cathode unit is known from Patent Document 1, for example.
- This conventional example includes a cylindrical target disposed opposite to a substrate in a vacuum chamber, a magnet unit disposed in an internal space of the target, a refrigerant circulation means for circulating a refrigerant in the internal space of the target, and a target Driving means for rotationally driving the motor.
- the magnet unit consists of a magnetic magnet with a length equivalent to the length of the target bus and a central magnet that is placed along the bus of the target, and a center that extends along the center magnet.
- a magnet provided with peripheral magnets arranged on both sides of the magnet and corner magnets that bridge between the peripheral magnets so as to surround both ends of the central magnet is used.
- a rotary cathode unit for a magnetron sputtering apparatus of the present invention has a cylindrical target and a line passing through a position where the vertical component of the magnetic field is zero in the internal space of the target.
- a magnet unit that generates a magnetic field that leaks from the target surface so as to close along the generatrix of the target and close in a racetrack shape, a refrigerant circulating means that circulates a refrigerant in the internal space of the target, and a driving means that rotationally drives the target
- the magnet unit includes a first portion that forms racetrack-shaped corner portions at both ends of the target in the busbar direction, and a second portion that is disposed adjacent to the first portion from the first portion inward in the busbar direction of the target. Divided into a part and a third part located between the second parts, the first part and the second part independently Characterized in that the moving means for moving so as to be closely spaced to Getto surface housed in the internal space of the target.
- the present invention when the electron density in the plasma generated in a racetrack shape is locally high at the corners and the amount of erosion increases at both ends of the target, By moving both the first portions in the separating direction with respect to the target by the accommodated moving means, the strength of the magnetic field leaking from the target surface can be weakened and local erosion at both ends of the target can be suppressed. Then, by weakening the magnetic field strength at the corner portion, when the amount of erosion changes in the portion of the target located on the inner side in the busbar direction from both ends of the target, both the second portions are moved in the proximity direction or The amount of erosion of the target can be adjusted by changing the magnetic field strength in the portion by moving in the separation direction. As a result, the target can be uniformly eroded over the entire length of the target in the busbar direction, and the use efficiency of the target can be improved.
- a moving means for independently moving the third portion of the magnet unit so as to be able to approach and separate from the target surface.
- FIG. 1A shows a state in which the magnet unit is close to the target
- FIG. 1B shows a state in which the magnet unit is separated from the target.
- RC is a rotary cathode unit of the present embodiment.
- the rotary cathode unit RC is provided in an unillustrated vacuum chamber via an insulator so as to face the substrate W as a film formation target in the vertical direction, and is clamped to the cylindrical target Tg and the right end of the target Tg.
- the driving block 1 is connected via Cp
- the support block 2 is connected to the left end of the target Tg via a clamp Cp.
- the support block 2 is provided with a driven shaft 21 supported by a bearing (not shown) so as to rotatably support one end of the target Tg.
- the drive block 1 includes a housing 11, and an inner cylinder body 12 having a circular cross section extending in the left-right direction is erected on the right inner wall of the housing 11.
- an outer cylinder 13 having a circular cross section is disposed concentrically with the inner cylinder 12.
- An annular recess 13a that is recessed in the radial direction is provided on the inner circumferential surface of the outer cylinder 13, and a brush 14 that conducts the inner cylinder 12 and the outer cylinder 13 through the recess 13a is provided.
- the outer cylinder 13 is rotatably supported by a support member 16 inserted into the housing 11 via a plurality of bearings 15a.
- 15b is an oil seal.
- a belt 3c is wound around an outer peripheral surface of the outer cylinder 13 between a pulley 3b provided on a drive shaft of the motor 3a.
- a conductive flange 17 is liquid-tightly attached to the left end of the outer cylinder 13, and is connected to the backing tube 41 of the target Tg by a clamp Cp via the flange 17.
- the inner cylinder 12 is electrically connected to the outer cylinder 13 via the brush 14, and the outer cylinder 13 is electrically connected to the backing tube 41 and eventually the target material 42 via the flange 17 (that is, the inner cylinder 12
- the cylinder 12 and the target material 42 have the same potential).
- the housing 11 is provided with a conductive pipe 18 in which an outward path 18 a and a return path 18 b are respectively provided.
- One end of the housing 11 extends through the housing 11 to the inner cylindrical body 12, and the forward path 18 a is connected to the inner cylindrical body 12.
- the return path 18 b communicates with a space 13 b between the inner cylinder body 12 and the outer cylinder body 13.
- the other end of the pipe 18 is connected to a chiller unit Ch as a refrigerant circulation means having a known structure.
- an output cable 19 from a sputtering power source (not shown) is connected to the pipe 18.
- predetermined power having a negative potential can be applied to the target Tg via the output cable 19 from the sputtering power source while the outer cylinder 13 is rotationally driven by the motor 3a and the target Tg is rotationally driven. it can.
- the target Tg includes a cylindrical backing tube 41 and a cylindrical target material 42 joined to the backing tube 41 via a bonding material (not shown) such as indium or tin.
- a bonding material such as indium or tin.
- As the target material 42 a material appropriately selected from metals and metal compounds according to the composition of the film to be deposited on the substrate W is used.
- a thin magnet case 43 is inserted so as to extend over substantially the entire length of the target material 42 in the generatrix direction. As shown in FIG. 3, in the magnet case 43, a line Ml passing through the position where the vertical component of the magnetic field is zero between the target Tg and the substrate W extends along the generatrix of the target Tg.
- a magnet unit Mu that generates a magnetic field leaking from the surface of the target Tg is incorporated so as to be closed in a shape.
- the magnet unit Mu is adjacent to the first portion 5a that forms the corner portions Mc at both ends of the target Tg in the generatrix direction and the first portion 5a from the first portion 5a inward in the generatrix direction of the target Tg.
- the first portion 5a, the second portion 5b, and the third portion 5c are made independent by being divided into a second portion 5b having a predetermined length and a third portion 5c located between the second portions 5b.
- the moving means 6 that moves so as to be able to approach and separate from the surface of the target Tg is housed in the magnet case 43 as an internal space of the target Tg.
- the internal structure of the magnet case 43 will be specifically described with further reference to FIGS. 4 and 5.
- an upper frame body 44 and a lower frame body 45 that are joined in the vertical direction via the O-ring S ⁇ b> 1 are inserted into the magnet case 43.
- the upper frame body 44 and the lower frame body 45 are separated by a partition plate 46, and a magnet unit Mu is provided in the internal space 44 a of the upper frame body 44 located above the partition plate 46.
- the first portion 5a, the second portion 5b, and the third portion 5c are independently moved in the inner space 45a of the lower frame body 45 located below the partition plate 46 so as to be able to approach and separate from the surface of the target Tg.
- Five moving means 6 are arranged.
- a forward path 47 for circulating the refrigerant between the magnet case 43 is opened so as to extend in the generatrix direction of the target Tg, and the right end of the forward path 47 is the inner side of the inner cylinder body. It communicates with the space 12a.
- the magnet case 43 is formed to have an elliptical cross section that is long in the vertical direction, and when the magnet case 43 is inserted into the backing tube 41, the magnet case 43 and the inner peripheral surface of the backing tube 41
- the return path 48 is formed so as to be positioned radially outward of the forward path 47, and the return path 48 communicates with the space 13 b between the inner cylinder body 12 and the outer cylinder body 13. Yes.
- the chiller unit Ch reaches the forward path 47 of the magnet case 43 from the forward path 18a of the pipe 18 through the internal space 12a of the inner cylinder 12, and returns to the return path 48 of the magnet case 43 at the end on the support block 2 side.
- a refrigerant circulation passage that reaches the space 13b from the return path 48 and returns from the return path 18b of the pipe 18 to the chiller unit Ch is formed, and the target material 42 can be cooled by heat exchange with the refrigerant during sputtering.
- Each moving means 6 has the same structure, and includes a motor 61 and a crank mechanism 63 connected to a drive shaft 62 of the motor 61 as shown in FIG.
- a crank arm 63b that extends upward through a through hole (not shown) formed at a predetermined position of the partition plate 46 is inserted into the crank pin 63a of the crank mechanism 63, and an upper end of the crank arm 63b is a yoke 51a, which will be described later. It is connected to the lower surfaces of 51b and 51c.
- a guide pin 64 is provided on the partition plate 46 so as to protrude in the vicinity of the crank arm 63b, and a guide hole is provided at a predetermined position of a later-described yoke 51a, 51b, 51c. Has been inserted.
- the first part 5a, the second part 5b, and the third part 5c of the magnet unit Mu are arranged in parallel in the upper frame body 44 along the generatrix of the target Tg.
- the first portion 5a, the second portion 5b, and the third portion 5c are provided with yokes 51a, 51b, 51c having the same cross-sectional shape with different lengths, and the yokes 51a, 51b, 51c are arranged without gaps along the generatrix of the target Tg. When arranged in parallel, it has a length equivalent to the bus length of the target Tg (see FIG. 3).
- Each of the yokes 51a, 51b, 51c is formed of a plate member made of a magnetic material in which a top surface 510 parallel to the substrate W and an inclined surface 511 inclined downward from the top surface 510 are formed.
- a central magnet 52a is disposed on the top surface 510 of the yoke 51a of the first portion 5a so as to extend from the inner end in the busbar direction, and peripheral magnets 53a having substantially the same length as the central magnet 52a are disposed on both inclined surfaces 511.
- a corner magnet 54 is disposed at the outer end of the top surface 510 of the yoke 51a in the direction of the generatrix so as to bridge between the peripheral magnets 53a so as to surround the end of the central magnet 52a.
- central magnets 52b and 52c are disposed over the entire length of the top surface 510 of each of the yokes 51b and 51c of the second portion 5b and the third portion 5c, and both the inclined surfaces 511 have the entire length.
- Peripheral magnets 53b and 53c are respectively arranged.
- the central magnets 52a, 52b, 52c the peripheral magnets 53a, 53b, 53c, and the corner magnets 54, neodymium magnets having the same magnetization are used.
- the rectangular magnet pieces can be arranged side by side.
- the inside of the magnet case 43 can be made into an atmospheric condition, it adheres to each yoke 51a, 51b, 51c using a well-known adhesive agent.
- strength of the magnetic field leaked on the surface of the target Tg may differ so that the thing of another part and a magnet type may be changed.
- the length D1 in the generatrix direction of the first portion 5a is made to correspond to the position that is the starting point of the corner portion Mc of the racetrack-like line Ml (that is, the position that changes from a straight line to a curve on the racetrack-like line).
- the length D2 of the second portion 5b is appropriately set according to the film thickness distribution in the substrate plane when the target Tg is sputtered under a predetermined condition.
- the length D3 of the third portion 5c is appropriately set in consideration of the bus length of the target Tg.
- the moving means 6 makes a difference with respect to the target Tg.
- the strength of the magnetic field leaking from the surface of the target Tg can be weakened to suppress local erosion at both ends of the target Tg.
- the amount of erosion changes in the portion of the target Tg located on the inner side in the generatrix direction from both ends of the target Tg.
- the target Tg can be uniformly eroded over the entire length of the target Tg in the generatrix direction, the target Tg can be used efficiently, and the target Tg of this embodiment is formed on the substrate by sputtering.
- the film thickness distribution in the substrate surface can be made uniform.
- the third portion 5c can also move forward and backward with respect to the surface of the target Tg by the moving means 6, the intensity of the magnetic field leaking from the surface of the target Tg changes in accordance with the target type and the target thickness.
- the intensity of the magnetic field leaking from the surface of the target Tg can be changed according to the progress of erosion of the target Tg, and as a result, a predetermined thin film is formed on the surface of the substrate W with good reproducibility. Can be formed.
- the third portion 5c is described as being movable forward and backward with respect to the target Tg.
- the moving means 6 includes a motor and a crank mechanism.
- other actuators such as a linear motion motor can also be used.
- the portions 5a, 5b, 5c of the magnet unit Mu can be positioned in an open loop.
- RC Rotary cathode unit for magnetron sputtering apparatus
- Tg Cylindrical target, Mu ... Magnet unit, 41 ... Backing tube, 42 ... Target material, 43 ... Magnet case, Ml ... Position where the vertical component of the magnetic field becomes zero , Mc ... race track corner, 5a ... first part of magnet unit, 5b ... second part of magnet unit, 5c ... third part of magnet unit, 6 ... moving means, Ch ... chiller unit (refrigerant) Circulating means), 47... Outward path of refrigerant circulation path (refrigerant circulation means), 48... Return path of refrigerant circulation path (refrigerant circulation means).
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Abstract
Description
Claims (2)
- 円筒状のターゲットと、このターゲットの内部空間に配置されて磁場の垂直成分がゼロとなる位置を通る線がターゲットの母線に沿ってのびてレーストラック状に閉じるようにターゲット表面から漏洩する磁場を発生させる磁石ユニットと、ターゲットの内部空間に冷媒を循環させる冷媒循環手段と、ターゲットを回転駆動する駆動手段とを備えるマグネトロンスパッタリング装置用の回転式カソードユニットにおいて、
磁石ユニットは、ターゲットの母線方向両端でレーストラックのコーナー部を夫々形成する第1部分と、第1部分からターゲットの母線方向内方で第1部分に夫々隣接配置される第2部分と、第2部分相互の間に位置する第3部分とに分けて構成され、第1部分及び第2部分を独立してターゲット表面に対し近接離間可能に進退させる移動手段をターゲットの内部空間に収納したことを特徴とするマグネトロンスパッタリング装置用の回転式カソードユニット。 - 前記磁石ユニットの第3部分を独立してターゲット表面に対し近接離間可能に進退させる移動手段を更に備えることを特徴とする請求項1記載のマグネトロンスパッタリング装置用の回転式カソードユニット。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/552,079 US10378102B2 (en) | 2015-02-24 | 2016-01-08 | Rotary cathode unit for magnetron sputtering apparatus |
KR1020207015642A KR102364799B1 (ko) | 2015-02-24 | 2016-01-08 | 마그네트론 스퍼터링 장치용 회전식 캐소드 유닛 |
CN201680012047.7A CN107250427A (zh) | 2015-02-24 | 2016-01-08 | 磁控管溅射装置用旋转式阴极单元 |
KR1020177025056A KR20170116077A (ko) | 2015-02-24 | 2016-01-08 | 마그네트론 스퍼터링 장치용 회전식 캐소드 유닛 |
JP2017501884A JP6205520B2 (ja) | 2015-02-24 | 2016-01-08 | マグネトロンスパッタリング装置用の回転式カソードユニット |
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JP2015-034206 | 2015-02-24 | ||
JP2015034206 | 2015-02-24 |
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WO2016136121A1 true WO2016136121A1 (ja) | 2016-09-01 |
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PCT/JP2016/000092 WO2016136121A1 (ja) | 2015-02-24 | 2016-01-08 | マグネトロンスパッタリング装置用の回転式カソードユニット |
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US (1) | US10378102B2 (ja) |
JP (1) | JP6205520B2 (ja) |
KR (2) | KR102364799B1 (ja) |
CN (2) | CN107250427A (ja) |
TW (1) | TWI617686B (ja) |
WO (1) | WO2016136121A1 (ja) |
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JP2020200520A (ja) * | 2019-06-12 | 2020-12-17 | 株式会社アルバック | 成膜装置、スパッタリングターゲット機構及び成膜方法 |
EP3669394A4 (en) * | 2017-08-16 | 2021-05-26 | Sputtering Components, Inc. | MAGNETIC FORCE RELEASE FOR SPUTTER SOURCES WITH MAGNETIC TARGET MATERIALS |
JPWO2022059278A1 (ja) * | 2020-09-16 | 2022-03-24 |
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BE1024754B9 (nl) * | 2016-11-29 | 2018-07-24 | Soleras Advanced Coatings Bvba | Een universeel monteerbaar eindblok |
CN107858653B (zh) * | 2017-10-31 | 2023-05-12 | 东莞市汇成真空科技有限公司 | 一种电弧靶升降抬头机构 |
CN108315704B (zh) * | 2018-02-26 | 2020-03-27 | 沈阳中北真空技术有限公司 | 一种磁控溅射光学镀膜设备及镀膜方法 |
JP7171270B2 (ja) * | 2018-07-02 | 2022-11-15 | キヤノン株式会社 | 成膜装置およびそれを用いた成膜方法 |
KR102353670B1 (ko) * | 2019-10-07 | 2022-01-21 | 주식회사 에이치앤이루자 | 스퍼터링 장치용 원통형 캐소드 |
WO2021183729A1 (en) * | 2020-03-11 | 2021-09-16 | Intellivation Llc | Movable magnet array for magnetron sputtering |
DE102021129521B3 (de) * | 2021-11-12 | 2023-03-30 | VON ARDENNE Asset GmbH & Co. KG | Magnetsystem, Sputtervorrichtung und Verfahren |
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- 2016-01-08 KR KR1020177025056A patent/KR20170116077A/ko active Application Filing
- 2016-01-08 CN CN201680012047.7A patent/CN107250427A/zh active Pending
- 2016-01-08 CN CN202010162332.5A patent/CN111500994A/zh active Pending
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EP3669394A4 (en) * | 2017-08-16 | 2021-05-26 | Sputtering Components, Inc. | MAGNETIC FORCE RELEASE FOR SPUTTER SOURCES WITH MAGNETIC TARGET MATERIALS |
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EP4092715A1 (en) * | 2017-08-16 | 2022-11-23 | Sputtering Components, Inc. | Magnet bar assembly for a rotary target cathode |
JP7233466B2 (ja) | 2017-08-16 | 2023-03-06 | スパッタリング・コンポーネンツ・インコーポレーテッド | 磁性ターゲット材料を用いたスパッタリング源の磁力解放 |
JP2020200520A (ja) * | 2019-06-12 | 2020-12-17 | 株式会社アルバック | 成膜装置、スパッタリングターゲット機構及び成膜方法 |
JPWO2022059278A1 (ja) * | 2020-09-16 | 2022-03-24 | ||
JP7303393B2 (ja) | 2020-09-16 | 2023-07-04 | 株式会社アルバック | 回転式カソードユニット用の駆動ブロック |
Also Published As
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KR20170116077A (ko) | 2017-10-18 |
US10378102B2 (en) | 2019-08-13 |
CN111500994A (zh) | 2020-08-07 |
TWI617686B (zh) | 2018-03-11 |
US20180030591A1 (en) | 2018-02-01 |
JP6205520B2 (ja) | 2017-09-27 |
KR20200066377A (ko) | 2020-06-09 |
TW201634721A (zh) | 2016-10-01 |
CN107250427A (zh) | 2017-10-13 |
KR102364799B1 (ko) | 2022-02-18 |
JPWO2016136121A1 (ja) | 2017-08-31 |
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