WO2016113821A1 - Capteur de température et procédé de fabrication associé - Google Patents

Capteur de température et procédé de fabrication associé Download PDF

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Publication number
WO2016113821A1
WO2016113821A1 PCT/JP2015/006416 JP2015006416W WO2016113821A1 WO 2016113821 A1 WO2016113821 A1 WO 2016113821A1 JP 2015006416 W JP2015006416 W JP 2015006416W WO 2016113821 A1 WO2016113821 A1 WO 2016113821A1
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WIPO (PCT)
Prior art keywords
metal lead
lead wire
reference direction
linear expansion
expansion coefficient
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PCT/JP2015/006416
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English (en)
Japanese (ja)
Inventor
秀和 福島
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株式会社デンソー
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Application filed by 株式会社デンソー filed Critical 株式会社デンソー
Priority to CN201580073331.0A priority Critical patent/CN107209067B/zh
Publication of WO2016113821A1 publication Critical patent/WO2016113821A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor

Definitions

  • the present disclosure relates to a temperature sensor and a manufacturing method thereof.
  • a temperature sensor in which a metal lead wire electrically connected to a temperature sensing element that senses temperature is inserted into a resin casing by insert molding has been conventionally known.
  • Patent Document 1 discloses a technique in which a primary mold resin is interposed between a resin casing as a secondary mold resin and a metal lead wire in a sensor device used as a temperature sensor or the like.
  • the primary expansion resin and the secondary mold resin have different linear expansion coefficients in the flow direction and the flow direction perpendicular to the molten resin material at the time of molding.
  • the thermal expansion amount of the primary mold resin is larger than the thermal expansion amount of the metal lead wire in the extending direction of the metal lead wire. Therefore, if the linear expansion coefficient is not properly set, the metal lead wire that is pulled in the extending direction by the primary mold resin that has undergone large thermal expansion may cause a disconnection due to the occurrence of stress, thereby reducing the yield.
  • An object of the present disclosure is to provide a temperature sensor with a high yield and a manufacturing method thereof.
  • the temperature sensor includes a temperature-sensitive element that senses temperature and an extending portion that is formed of a metal material and extends along the reference direction, and is electrically connected to the temperature-sensitive element.
  • a metal lead wire formed from a resin material, and a resin casing in which the metal lead wire is inserted by molding, and a specific material that gives a linear expansion coefficient larger than the metal lead wire and smaller than the resin casing in the reference direction,
  • An intermediate cover that is formed and interposed between the resin casing and the metal lead wire, and the difference in the linear expansion coefficient between the metal lead wire and the intermediate cover in the reference direction depends on the difference in the linear expansion coefficient. It is set within a specific range that limits the generated stress to be smaller than the tensile strength of the metal lead wire.
  • an intermediate cover is interposed between the metal lead wire inserted into the resin casing by molding and the resin casing.
  • the linear expansion coefficient of the intermediate cover is given larger than the metal lead wire and smaller than the resin casing by the specific material forming the intermediate cover. Therefore, even under use in a high temperature environment, in the reference direction, the thermal expansion amount of the intermediate cover can be as close as possible to the thermal expansion amount of the metal lead wire rather than the thermal expansion amount of the resin casing.
  • the generated stress generated in the metal lead wire according to the set value is smaller than the tensile strength of the metal lead wire. Limited. Thereby, in the metal lead wire, it is possible to suppress a situation in which the generated stress exceeds the tensile strength and causes disconnection, and thus it is possible to achieve a high yield.
  • the resin casing is formed by molding from a resin material containing a fibrous filler, and the linear expansion coefficient of the intermediate cover in the reference direction is greater than the minimum linear expansion coefficient of the resin casing. small.
  • the linear expansion coefficient in each part of the resin casing may vary depending on the gate formation position in the molding die. is there. Therefore, in the reference direction, as long as the difference between the linear expansion coefficients of the intermediate cover formed of a specific material and the metal lead wire having a smaller linear expansion coefficient is within a specific range, It is given smaller than the linear expansion coefficient. According to this, since the thermal expansion amount of the intermediate cover surely approaches the thermal expansion amount of the metal lead wire rather than the thermal expansion amount at an arbitrary location of the resin casing, the generated stress is higher than the tensile strength in the metal lead wire. The wire breakage can be suppressed by being limited to a small size. Therefore, it is possible to contribute to achieving a high yield.
  • the third aspect is a method of manufacturing the temperature sensor according to the second aspect, wherein the pair of metal leads are covered with an intermediate cover, and the pair of metal leads covered with the intermediate cover in the covering step.
  • Lines are arranged in a direction orthogonal to the reference direction and set together with the temperature sensing element in the molding cavity of the molding die, and a pair of metal lead wires set by the setting step in the molding die are orthogonal
  • An injection process for injecting molten resin material into the molding cavity from one of the two sides sandwiched in the direction toward one side and the other side of the both sides, and a molding cavity in the injection process A solidifying step of forming a resin casing by solidifying the resin material injected therein.
  • the pair of metal lead wires covered with the intermediate cover are arranged in a direction orthogonal to the reference direction and set together with the temperature sensitive element into the molding cavity of the molding die.
  • a molten resin material is formed from a gate provided on one side of both sides sandwiching a pair of set metal lead wires in an orthogonal direction toward one side and the other side of the both sides. Will be injected into the molding cavity.
  • the linear expansion coefficient of the intermediate cover is as long as the linear expansion coefficient difference with the smaller linear expansion coefficient of each metal lead wire is within a specific range. Thus, it is given smaller than the minimum linear expansion coefficient of the resin casing. According to this, since the thermal expansion amount of the intermediate cover surely approaches the thermal expansion amount of each metal lead wire rather than the thermal expansion amount at an arbitrary position of the resin casing, the generated stress is tensile in each of the metal lead wires. The disconnection can be suppressed by being limited to be smaller than the strength. Therefore, it is possible to contribute to achieving a high yield.
  • FIG. 1 is a diagram illustrating a structure of a temperature sensor according to an embodiment, and is a cross-sectional view taken along the line II of FIG.
  • FIG. 2 is a view showing a structure of a temperature sensor according to an embodiment, and is a cross-sectional view taken along the line II-II of FIG.
  • FIG. 3 is a physical property table for explaining physical properties of the temperature sensor according to an embodiment.
  • FIG. 4 is a top view (a), a side view (b), and a perspective view (c) showing a temperature sensing element, a metal lead wire, and a metal terminal as components of a temperature sensor according to an embodiment
  • FIG. 5 is a top view (a), a side view (b), and a perspective view (c) showing a metal terminal and an intermediate cover as components of a temperature sensor according to an embodiment
  • FIG. 6 is a top view (a), a side view (b), and a perspective view (c) showing an appearance of a temperature sensor according to an embodiment
  • FIG. 7 is a flowchart illustrating a method for manufacturing a temperature sensor according to an embodiment.
  • FIG. 8 is a cross-sectional view illustrating S101 in FIG. FIG.
  • FIG. 9 is a cross-sectional view showing S102 of FIG.
  • FIG. 10 is a cross-sectional view illustrating S103 of FIG.
  • FIG. 11 is a cross-sectional view illustrating S104 in FIG.
  • FIG. 12 is a cross-sectional view showing a modification of FIG.
  • the temperature sensor 1 shown in FIGS. 1 and 2 is mounted inside the front grill in the engine room of the vehicle.
  • the temperature sensor 1 senses the temperature of the outside air of the vehicle.
  • the temperature sensor 1 has a difference between the lowest temperature reached by the vehicle outside air in a cold environment and the highest temperature reached by radiant heat from the engine in a vehicle that is stopped or traveling at a low speed,
  • An operating temperature range ⁇ T is defined.
  • a wide-range operating temperature range ⁇ T of 110 ° C. is assumed in advance as the difference between the lowest temperature of ⁇ 30 ° C. and the highest temperature of 80 ° C.
  • the temperature sensor 1 includes a temperature sensitive element 10, a metal lead wire 20, a metal terminal 30, a resin casing 40, and an intermediate cover 50.
  • the temperature sensing element 10 shown in FIGS. 1, 2, and 4 is a thermistor that generates a sensing signal having a voltage corresponding to the sensed temperature in order to sense the temperature of the outside air of the vehicle.
  • the temperature sensitive element 10 is formed by sealing the entire element body 11 with a sealing material 12.
  • the sealing material 12 is formed from a material that exhibits heat resistance in the operating temperature range ⁇ T, such as an epoxy resin, glass, or the like. In the present embodiment, the sealing material 12 is oblate, but may be, for example, a rectangular or circular flat plate.
  • the element body 11 has a rectangular chip shape in the present embodiment, but may be, for example, a circular chip shape.
  • a pair of metal lead wires 20 shown in FIGS. 1, 2 and 4 are provided to output a sensing signal generated by the temperature sensing element 10.
  • Each metal lead wire 20 has an extending portion 21 extending linearly along a predetermined reference direction Db.
  • the metal lead wires 20 are arranged at intervals in an orthogonal direction Do orthogonal to the reference direction Db, thereby extending the extending portions 21 substantially parallel to each other along the reference direction Db.
  • each metal lead wire 20 is integrally provided with an inclined portion 22 that is inclined toward each other with respect to the reference direction Db by extending from the extending portion 21 toward the common temperature-sensitive element 10. Yes.
  • each metal lead wire 20 is electrically connected to the common temperature sensing element 10 by being joined to the common temperature sensing element 10 by, for example, welding.
  • Each metal lead wire 20 having such a configuration is formed of a conductive metal material such as copper, iron, stainless steel, or the like.
  • Each metal lead wire 20 has an elongated round bar shape as a whole in the present embodiment, but may be, for example, an elongated flat plate shape.
  • the metal lead wires 20 are given substantially the same linear expansion coefficient ⁇ l and substantially the same Young's modulus Yl with respect to the reference direction Db.
  • ⁇ l linear expansion coefficient defined in the reference direction Db of the metal lead wire 20 formed of annealed copper wire.
  • 152.0 GPa (kN / mm 2 ) is given as the Young's modulus Yl defined in the reference direction Db of the metal lead wire 20 formed from an annealed copper wire.
  • a pair of metal terminals 30 shown in FIGS. 1, 2, 4, and 5 are provided corresponding to the metal lead wires 20 individually in order to transmit a sensing signal output through each metal lead wire 20 to an external circuit. Yes.
  • Each metal terminal 30 is electrically connected to the corresponding metal lead wire 20 by being joined to the extending portion 21 of the corresponding metal lead wire 20 by welding or the like, for example.
  • the metal terminals 30 are linearly extended along the reference direction Db from the joints with the corresponding metal lead wires 20, and are arranged in the orthogonal direction Do orthogonal to the reference direction Db.
  • Each metal terminal 30 is formed of a conductive metal material, such as copper, iron, or dumet wire (a material in which an iron-nickel alloy is coated with copper).
  • Each metal terminal 30 has an elongated rectangular flat plate shape in the present embodiment, but may have an elongated round bar shape, for example.
  • Each of the metal terminals 30 is given a tensile strength of, for example, about 390 to 500 N / mm 2 so that the tensile strength in the reference direction Db is higher than that of the corresponding metal lead wire 20.
  • the resin casing 40 is formed by inserting the entire temperature sensing element 10, the entire metal lead wires 20, and a part of each metal terminal 30 by molding.
  • the resin casing 40 exposes the remainder of the metal terminals 30 to the outside so that the metal terminals 30 can be electrically connected to an external circuit.
  • the resin casing 40 is formed from a resin material exhibiting heat resistance in the use temperature range ⁇ T, such as polybutylene terephthalate (PBT) resin, polyphenylene sulfide (PPS) resin, or the like.
  • the resin casing 40 of the present embodiment is formed of a resin material containing a fibrous filler such as a glass filler, for example, in order to increase the impact strength in the vehicle.
  • a one-side gate type is adopted as mold forming in this embodiment.
  • the resin casing 40 is given a linear expansion coefficient ⁇ c larger than that of the metal lead wire 20 and a Young's modulus Yc smaller than that of the metal lead wire 20 with respect to the reference direction Db.
  • ⁇ c linear expansion coefficient
  • Yc Young's modulus
  • the other-side metal lead wire 20b (see FIG. 1) is provided around the one-side metal lead wire 20a (see FIG. 1).
  • a linear expansion coefficient ⁇ c smaller than the periphery of (see FIG. 1) is given in the reference direction Db.
  • the linear expansion coefficient ⁇ c shows a minimum value around the metal lead wire 20a on one side. Therefore, in the numerical example of FIG. 3, 2.0 ⁇ 10 ⁇ 5 / ° C. is presented as the minimum linear expansion coefficient ⁇ c around the metal lead wire 20a on one side.
  • the Young's modulus is larger around the metal lead wire 20a on the one side than around the metal lead wire 20b on the other side.
  • Yc is given in the reference direction Db.
  • the Young's modulus Yc shows the maximum value around the metal lead wire 20a on one side. Therefore, in the numerical example of FIG. 3, 9.0 GPa is presented as the maximum Young's modulus Yc around the metal lead wire 20a on one side.
  • the intermediate cover 50 is formed by coating the entire temperature sensing element 10, the entire metal lead wires 20, and a part of each metal terminal 30 by a coating process.
  • the intermediate cover 50 is inserted into the resin casing 40 by molding so that the intermediate cover 50 is interposed between the inner elements 10, 20, 30 and the outer resin casing 40 in a thin film shape.
  • the intermediate cover 50 is formed from a specific material exhibiting heat resistance in the use temperature range ⁇ T, for example, PPS resin, epoxy resin, silicone resin, or the like.
  • the intermediate cover 50 of the present embodiment is formed from a specific material containing a fibrous filler such as a glass filler, for example, in order to increase the impact strength in the vehicle.
  • the coating process for forming the intermediate cover 50 from such a specific material for example, a coating process or a spraying process of the liquid specific material, an immersion process in the liquid specific material, or the like can be employed.
  • a film thickness of about 0.2 to 2 mm is employed as the formation thickness of the intermediate cover 50 by the coating process.
  • the intermediate cover 50 has a linear expansion coefficient ⁇ m larger than the metal lead wire 20 and smaller than the resin casing 40, and a Young's modulus Ym smaller than the metal lead wire 20 and larger than the resin casing 40.
  • ⁇ m the linear expansion coefficient defined in the reference direction Db of the intermediate cover 50 formed from the glass filler-containing PPS resin by the coating process
  • ⁇ c the minimum linear expansion coefficient ⁇ c of the resin casing 40
  • the Young's modulus Ym defined in the reference direction Db of the intermediate cover 50 formed from the glass filler-containing PPS resin by the coating process is larger than the maximum Young's modulus Yc of the resin casing 40. 2 kN / mm 2 GPa is given.
  • the linear expansion coefficient difference ⁇ is expressed by the following formula 1. That is, the linear expansion coefficient difference ⁇ is obtained by a subtraction value obtained by subtracting the linear expansion coefficient ⁇ l of the metal lead wire 20 in the reference direction Db from the linear expansion coefficient ⁇ m of the intermediate cover 50 in the reference direction Db. Specifically, the linear expansion coefficient difference ⁇ obtained by substituting the numerical example of FIG. 3 into Equation 1 is 0.4 ⁇ 10 ⁇ 5 / ° C.
  • the generated stress ⁇ is expressed by the following formula 2. That is, the generated stress ⁇ is estimated by a multiplication value obtained by multiplying the linear expansion coefficient difference ⁇ in the reference direction Db, the Young's modulus Yl of the metal lead wire 20 in the reference direction Db, and the operating temperature range ⁇ T. Specifically, the generated stress ⁇ estimated by substituting the numerical example of FIG. 3 into Equation 2 is 66.88 N / mm 2 .
  • the temperature sensor 1 satisfies the relationship of the following formula 3 between the generated stress ⁇ and the tensile strength Sl in the metal lead wire 20. That is, in the metal lead wire 20, the generated stress ⁇ in the metal lead wire 20 is limited to be smaller than the tensile strength S1. Specifically, in the numerical example of FIG. 3, since the tensile strength S1 of the metal lead wire 20 formed of annealed copper wire is 120 N / mm 2 , the generated stress ⁇ in the metal lead wire 20 is 66.88 N as described above. / Mm 2 .
  • the tensile strength S1 can be measured by a method such as JIS Z2241 (metal material tensile test method).
  • ⁇ ⁇ Sl (Formula 3) From the above, when formulas 2 and 3 are arranged, the following formula 4 is obtained. Therefore, in the temperature sensor 1, when the minimum linear expansion coefficient ⁇ m of the intermediate cover 50 is given smaller than the linear expansion coefficient ⁇ l of the metal lead wire 20, a line obtained by substituting these coefficients ⁇ l and ⁇ m into Equation 1 is obtained.
  • the expansion coefficient difference ⁇ is set in advance in a specific range that satisfies the relationship of Equation 4.
  • the common temperature sensing element 10 joined to each metal lead wire 20 and a part of the individual metal terminal 30 are also covered by the intermediate cover 50. Therefore, in the covering step, for example, the liquid specific material is applied to the whole of the metal lead wires 20, the temperature sensing element 10, and a part of each of the metal terminals 30. A coating process such as a dipping process is performed.
  • the pair of metal lead wires 20 covered with the intermediate cover 50 in the previous covering step is formed of the mold 100 that has been opened. Set in molding cavity 101.
  • the temperature sensitive element 10 and the pair of metal terminals 30 covered by the intermediate cover 50 in the previous covering process are also set in the molding cavity 101 of the mold 100 that has been opened. To do.
  • the pair of metal lead wires 20 and the pair of metal terminals 30 are set together with the temperature sensing element 10 in a direction Do perpendicular to the reference direction Db.
  • the mold 100 having the pair of metal lead wires 20 and the like set in the molding cavity 101 by the previous setting step is closed and In a state where the mold is clamped, the molten resin material is injected into the molding cavity 101.
  • the setting step of the present embodiment only the gate 102 provided on the metal lead wire 20a side as one side among the both sides sandwiching the pair of metal lead wires 20 in the orthogonal direction Do in the molding die 100, Molten resin material is injected.
  • the injected molten resin material is obtained from the metal lead wire 20a as one side of the both sides sandwiching the pair of metal lead wires 20 in the orthogonal direction Do, and the metal lead as the other side. It flows toward the line 20b side.
  • a fibrous filler is included in the molten resin material.
  • the fiber orientation of the fibrous filler is easily along the reference direction Db around the metal lead wire 20 a on one side close to the gate 102.
  • the fiber orientation of the fibrous filler does not follow along the reference direction Db around the metal lead wire 20b on the other side far from the gate 102, for example, easily along the orthogonal direction Do.
  • the molten resin material is solidified by cooling the molten resin material injected into the molding cavity 101 in the previous injection step, and the resin casing. 40 is formed.
  • the circumference of the metal lead wire 20a on one side is smaller than the circumference of the metal lead wire 20b on the other side due to the difference in fiber orientation with respect to the fibrous filler in the injection process described above.
  • a linear expansion coefficient ⁇ c is given in the reference direction Db. As a result, the temperature sensor 1 is completed.
  • the intermediate cover 50 is interposed between the metal lead wire 20 inserted into the resin casing 40 by molding and the resin casing 40.
  • the linear expansion coefficient ⁇ m of the intermediate cover 50 is larger than that of the metal lead wire 20 and from the resin casing 40 due to the specific material forming the intermediate cover 50. Is also given small. Therefore, even under use in a high temperature environment, the thermal expansion amount of the intermediate cover 50 can be as close as possible to the thermal expansion amount of the metal lead wire 20 rather than the thermal expansion amount of the resin casing 40 in the reference direction Db. .
  • the generated stress ⁇ generated in the metal lead wire 20 according to the set value is the metal lead wire.
  • the tensile strength S1 is limited to be smaller than 20. As a result, in the metal lead wire 20, it is possible to suppress a situation in which the generated stress ⁇ exceeds the tensile strength S 1 and causes disconnection, so that a high yield can be achieved.
  • the generated stress ⁇ generated according to the linear expansion coefficient difference ⁇ in the reference direction Db with respect to the intermediate cover 50 is the linear expansion coefficient difference ⁇ and the Young's modulus Yl in the reference direction Db. It can be estimated by a multiplication value ( ⁇ ⁇ Yl ⁇ ⁇ T) with the operating temperature range ⁇ T. Therefore, by setting the linear expansion coefficient difference ⁇ within a specific range that satisfies the relationship ⁇ ⁇ Sl / (Yl ⁇ ⁇ T) in Equation 4, the generated stress ⁇ is more reliably set than the tensile strength S1 in the metal lead wire 20. The wire breakage can be suppressed by limiting to a small value. Therefore, the reliability for achieving a high yield can be improved.
  • the Young's modulus Ym of the intermediate cover 50 in the reference direction Db in which the extending portion 21 of the metal lead wire 20 extends is smaller than that of the metal lead wire 20 due to the specific material forming the intermediate cover 50 and It is given larger than the resin casing 40. Therefore, even under use in a high temperature environment, the tensile action in the reference direction Db by the resin casing 40 having a large thermal expansion amount is absorbed by the intermediate cover 50, and the metal lead wire 20 is caused to be in the same reference direction Db by the tensile action. Can be reduced. According to this, since the generated stress ⁇ generated in the metal lead wire 20 can be reduced and the disconnection can be suppressed, it is possible to contribute to the achievement of a high yield.
  • the linear expansion coefficient at each location of the resin casing 40 according to the formation position of the gate 102 in the molding die 100. ⁇ c may vary. Therefore, in the reference direction Db, as long as the linear expansion coefficient difference ⁇ with the metal lead wire 20 having a smaller linear expansion coefficient ⁇ l is within a specific range with respect to the linear expansion coefficient ⁇ m of the intermediate cover 50 formed of the specific material, the resin It is smaller than the minimum linear expansion coefficient ⁇ c of the casing 40.
  • the amount of thermal expansion of the intermediate cover 50 surely approaches the amount of thermal expansion of the metal lead wire 20 rather than the amount of thermal expansion at an arbitrary location of the resin casing 40, the generated stress ⁇ is generated in the metal lead wire 20. Is limited to be smaller than the tensile strength S1 and disconnection can be suppressed. Therefore, it is possible to contribute to achieving a high yield.
  • the pair of metal lead wires 20 covered with the intermediate cover 50 are arranged in the direction Do perpendicular to the reference direction Db, and together with the temperature sensing element 10, the molding cavity 101 of the molding die 100.
  • the molding cavity 101 Set in.
  • the gate 102 provided on one side of both sides sandwiching the set pair of metal lead wires 20 in the orthogonal direction Do, toward one side and the other side of the both sides,
  • the molten resin material is injected into the molding cavity 101.
  • the resin casing 40 formed by solidification of the molten resin material injected into the molding cavity 101 the metal on the other side far from the gate 102 around the metal lead wire 20 a on one side near the gate 102.
  • a linear expansion coefficient ⁇ c higher than that around the lead wire 20b is given in the reference direction Db. This is because the molten resin material flows along the reference direction Db around the metal lead wire 20a on one side, but does not follow the reference direction Db around the metal lead wire 20b on the other side. For example, when the molten resin material flows along the orthogonal direction Do, a difference occurs in the fiber orientation of the fibrous filler.
  • the linear expansion coefficient ⁇ m of the intermediate cover 50 is linearly expanded with the linear expansion coefficient ⁇ l of each metal lead wire 20 (20a, 20b) smaller than that.
  • the coefficient difference ⁇ is within the specific range, the coefficient is given smaller than the minimum linear expansion coefficient ⁇ c of the resin casing 40.
  • the generated stress ⁇ is limited to be smaller than the tensile strength Sl, and disconnection can be suppressed. Therefore, it can contribute to the achievement of a high yield.
  • the temperature sensor 1 may be used in vehicles other than a vehicle such as an outside air temperature sensing around a bridge (for displaying an outside air temperature in order to alert a freezing winter).
  • the Young's modulus Ym of the intermediate cover 50 may be set smaller than the Young's modulus Yc of the resin casing 40.
  • the specific material which forms the resin casing 40 does not need to contain a fibrous filler.
  • the specific material forming the intermediate cover 50 may not contain a fibrous filler.
  • the metal lead wire 20 may be configured only from the substantially extending portion 21 without providing the inclined portion 22. Further, as a sixth modified example, the metal lead wire 20 may be electrically connected to an external circuit without providing the metal terminal 30.
  • a molten resin material is injected into a molding cavity 101 from gates 102 provided on both sides sandwiching a pair of metal lead wires 20 in the orthogonal direction Do, thereby forming a resin casing.
  • 40 may be molded.
  • the resin casing 40 may be molded by the molding die 100 provided with the gate 102 in a positional relationship different from that of the above-described embodiment and the seventh modification.
  • the temperature sensitive element 10 may not be covered with the intermediate cover 50 in the covering step S101 and may be exposed in the molding cavity 101 in the setting step S102.
  • the metal terminal 30 may not be covered with the intermediate cover 50 in the covering step S101 and may be exposed in the molding cavity 101 in the setting step S102.
  • the intermediate cover 50 and the resin casing 40 may be sequentially formed by double molding of a resin material.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

L'invention concerne un capteur de température (1) comprenant: un élément sensible à la température (10) permettant de détecter une température; des fils de connexion métalliques (20, 20a, 20b) formés à partir d'un matériau métallique et comprenant une partie d'extension (21) s'étendant le long d'une direction de référence (Db), les fils de connexion métalliques (20, 20a, 20b) étant électriquement connectés à l'élément sensible à la température; un boîtier de résine (40) formé à partir d'un matériau de résine, les fils de connexion métalliques étant insérés dans le boîtier de résine (40) par moulage dans un moule; et un couvercle intermédiaire (50) formé à partir d'un matériau spécifique présentant un coefficient de dilatation linéaire dans la direction de référence supérieur à celui des fils de connexion métalliques et inférieur à celui du boîtier de résine, le couvercle intermédiaire (50) étant placé entre le boîtier de résine et les fils de connexion métalliques. La différence de coefficient de dilatation linéaire entre les fils de connexion métalliques et le couvercle intermédiaire dans la direction de référence est définie dans une plage spécifique, moyennant quoi la contrainte qui se produit dans les fils de connexion métalliques en réponse à la différence de coefficient de dilatation linéaire est limitée de manière à être inférieure à la résistance à la traction des fils de connexion métalliques.
PCT/JP2015/006416 2015-01-15 2015-12-23 Capteur de température et procédé de fabrication associé WO2016113821A1 (fr)

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JP2015006180A JP6384337B2 (ja) 2015-01-15 2015-01-15 温度センサ及びその製造方法
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JP7276061B2 (ja) 2019-10-09 2023-05-18 株式会社デンソー 温度センサ
CN111615622B (zh) * 2019-11-15 2021-04-20 株式会社芝浦电子 温度传感器、温度传感器元件及温度传感器的制造方法

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