WO2016113821A1 - Temperature sensor and method for manufacturing same - Google Patents

Temperature sensor and method for manufacturing same Download PDF

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Publication number
WO2016113821A1
WO2016113821A1 PCT/JP2015/006416 JP2015006416W WO2016113821A1 WO 2016113821 A1 WO2016113821 A1 WO 2016113821A1 JP 2015006416 W JP2015006416 W JP 2015006416W WO 2016113821 A1 WO2016113821 A1 WO 2016113821A1
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WO
WIPO (PCT)
Prior art keywords
metal lead
lead wire
reference direction
linear expansion
expansion coefficient
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PCT/JP2015/006416
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French (fr)
Japanese (ja)
Inventor
秀和 福島
Original Assignee
株式会社デンソー
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Application filed by 株式会社デンソー filed Critical 株式会社デンソー
Priority to CN201580073331.0A priority Critical patent/CN107209067B/en
Publication of WO2016113821A1 publication Critical patent/WO2016113821A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor

Definitions

  • the present disclosure relates to a temperature sensor and a manufacturing method thereof.
  • a temperature sensor in which a metal lead wire electrically connected to a temperature sensing element that senses temperature is inserted into a resin casing by insert molding has been conventionally known.
  • Patent Document 1 discloses a technique in which a primary mold resin is interposed between a resin casing as a secondary mold resin and a metal lead wire in a sensor device used as a temperature sensor or the like.
  • the primary expansion resin and the secondary mold resin have different linear expansion coefficients in the flow direction and the flow direction perpendicular to the molten resin material at the time of molding.
  • the thermal expansion amount of the primary mold resin is larger than the thermal expansion amount of the metal lead wire in the extending direction of the metal lead wire. Therefore, if the linear expansion coefficient is not properly set, the metal lead wire that is pulled in the extending direction by the primary mold resin that has undergone large thermal expansion may cause a disconnection due to the occurrence of stress, thereby reducing the yield.
  • An object of the present disclosure is to provide a temperature sensor with a high yield and a manufacturing method thereof.
  • the temperature sensor includes a temperature-sensitive element that senses temperature and an extending portion that is formed of a metal material and extends along the reference direction, and is electrically connected to the temperature-sensitive element.
  • a metal lead wire formed from a resin material, and a resin casing in which the metal lead wire is inserted by molding, and a specific material that gives a linear expansion coefficient larger than the metal lead wire and smaller than the resin casing in the reference direction,
  • An intermediate cover that is formed and interposed between the resin casing and the metal lead wire, and the difference in the linear expansion coefficient between the metal lead wire and the intermediate cover in the reference direction depends on the difference in the linear expansion coefficient. It is set within a specific range that limits the generated stress to be smaller than the tensile strength of the metal lead wire.
  • an intermediate cover is interposed between the metal lead wire inserted into the resin casing by molding and the resin casing.
  • the linear expansion coefficient of the intermediate cover is given larger than the metal lead wire and smaller than the resin casing by the specific material forming the intermediate cover. Therefore, even under use in a high temperature environment, in the reference direction, the thermal expansion amount of the intermediate cover can be as close as possible to the thermal expansion amount of the metal lead wire rather than the thermal expansion amount of the resin casing.
  • the generated stress generated in the metal lead wire according to the set value is smaller than the tensile strength of the metal lead wire. Limited. Thereby, in the metal lead wire, it is possible to suppress a situation in which the generated stress exceeds the tensile strength and causes disconnection, and thus it is possible to achieve a high yield.
  • the resin casing is formed by molding from a resin material containing a fibrous filler, and the linear expansion coefficient of the intermediate cover in the reference direction is greater than the minimum linear expansion coefficient of the resin casing. small.
  • the linear expansion coefficient in each part of the resin casing may vary depending on the gate formation position in the molding die. is there. Therefore, in the reference direction, as long as the difference between the linear expansion coefficients of the intermediate cover formed of a specific material and the metal lead wire having a smaller linear expansion coefficient is within a specific range, It is given smaller than the linear expansion coefficient. According to this, since the thermal expansion amount of the intermediate cover surely approaches the thermal expansion amount of the metal lead wire rather than the thermal expansion amount at an arbitrary location of the resin casing, the generated stress is higher than the tensile strength in the metal lead wire. The wire breakage can be suppressed by being limited to a small size. Therefore, it is possible to contribute to achieving a high yield.
  • the third aspect is a method of manufacturing the temperature sensor according to the second aspect, wherein the pair of metal leads are covered with an intermediate cover, and the pair of metal leads covered with the intermediate cover in the covering step.
  • Lines are arranged in a direction orthogonal to the reference direction and set together with the temperature sensing element in the molding cavity of the molding die, and a pair of metal lead wires set by the setting step in the molding die are orthogonal
  • An injection process for injecting molten resin material into the molding cavity from one of the two sides sandwiched in the direction toward one side and the other side of the both sides, and a molding cavity in the injection process A solidifying step of forming a resin casing by solidifying the resin material injected therein.
  • the pair of metal lead wires covered with the intermediate cover are arranged in a direction orthogonal to the reference direction and set together with the temperature sensitive element into the molding cavity of the molding die.
  • a molten resin material is formed from a gate provided on one side of both sides sandwiching a pair of set metal lead wires in an orthogonal direction toward one side and the other side of the both sides. Will be injected into the molding cavity.
  • the linear expansion coefficient of the intermediate cover is as long as the linear expansion coefficient difference with the smaller linear expansion coefficient of each metal lead wire is within a specific range. Thus, it is given smaller than the minimum linear expansion coefficient of the resin casing. According to this, since the thermal expansion amount of the intermediate cover surely approaches the thermal expansion amount of each metal lead wire rather than the thermal expansion amount at an arbitrary position of the resin casing, the generated stress is tensile in each of the metal lead wires. The disconnection can be suppressed by being limited to be smaller than the strength. Therefore, it is possible to contribute to achieving a high yield.
  • FIG. 1 is a diagram illustrating a structure of a temperature sensor according to an embodiment, and is a cross-sectional view taken along the line II of FIG.
  • FIG. 2 is a view showing a structure of a temperature sensor according to an embodiment, and is a cross-sectional view taken along the line II-II of FIG.
  • FIG. 3 is a physical property table for explaining physical properties of the temperature sensor according to an embodiment.
  • FIG. 4 is a top view (a), a side view (b), and a perspective view (c) showing a temperature sensing element, a metal lead wire, and a metal terminal as components of a temperature sensor according to an embodiment
  • FIG. 5 is a top view (a), a side view (b), and a perspective view (c) showing a metal terminal and an intermediate cover as components of a temperature sensor according to an embodiment
  • FIG. 6 is a top view (a), a side view (b), and a perspective view (c) showing an appearance of a temperature sensor according to an embodiment
  • FIG. 7 is a flowchart illustrating a method for manufacturing a temperature sensor according to an embodiment.
  • FIG. 8 is a cross-sectional view illustrating S101 in FIG. FIG.
  • FIG. 9 is a cross-sectional view showing S102 of FIG.
  • FIG. 10 is a cross-sectional view illustrating S103 of FIG.
  • FIG. 11 is a cross-sectional view illustrating S104 in FIG.
  • FIG. 12 is a cross-sectional view showing a modification of FIG.
  • the temperature sensor 1 shown in FIGS. 1 and 2 is mounted inside the front grill in the engine room of the vehicle.
  • the temperature sensor 1 senses the temperature of the outside air of the vehicle.
  • the temperature sensor 1 has a difference between the lowest temperature reached by the vehicle outside air in a cold environment and the highest temperature reached by radiant heat from the engine in a vehicle that is stopped or traveling at a low speed,
  • An operating temperature range ⁇ T is defined.
  • a wide-range operating temperature range ⁇ T of 110 ° C. is assumed in advance as the difference between the lowest temperature of ⁇ 30 ° C. and the highest temperature of 80 ° C.
  • the temperature sensor 1 includes a temperature sensitive element 10, a metal lead wire 20, a metal terminal 30, a resin casing 40, and an intermediate cover 50.
  • the temperature sensing element 10 shown in FIGS. 1, 2, and 4 is a thermistor that generates a sensing signal having a voltage corresponding to the sensed temperature in order to sense the temperature of the outside air of the vehicle.
  • the temperature sensitive element 10 is formed by sealing the entire element body 11 with a sealing material 12.
  • the sealing material 12 is formed from a material that exhibits heat resistance in the operating temperature range ⁇ T, such as an epoxy resin, glass, or the like. In the present embodiment, the sealing material 12 is oblate, but may be, for example, a rectangular or circular flat plate.
  • the element body 11 has a rectangular chip shape in the present embodiment, but may be, for example, a circular chip shape.
  • a pair of metal lead wires 20 shown in FIGS. 1, 2 and 4 are provided to output a sensing signal generated by the temperature sensing element 10.
  • Each metal lead wire 20 has an extending portion 21 extending linearly along a predetermined reference direction Db.
  • the metal lead wires 20 are arranged at intervals in an orthogonal direction Do orthogonal to the reference direction Db, thereby extending the extending portions 21 substantially parallel to each other along the reference direction Db.
  • each metal lead wire 20 is integrally provided with an inclined portion 22 that is inclined toward each other with respect to the reference direction Db by extending from the extending portion 21 toward the common temperature-sensitive element 10. Yes.
  • each metal lead wire 20 is electrically connected to the common temperature sensing element 10 by being joined to the common temperature sensing element 10 by, for example, welding.
  • Each metal lead wire 20 having such a configuration is formed of a conductive metal material such as copper, iron, stainless steel, or the like.
  • Each metal lead wire 20 has an elongated round bar shape as a whole in the present embodiment, but may be, for example, an elongated flat plate shape.
  • the metal lead wires 20 are given substantially the same linear expansion coefficient ⁇ l and substantially the same Young's modulus Yl with respect to the reference direction Db.
  • ⁇ l linear expansion coefficient defined in the reference direction Db of the metal lead wire 20 formed of annealed copper wire.
  • 152.0 GPa (kN / mm 2 ) is given as the Young's modulus Yl defined in the reference direction Db of the metal lead wire 20 formed from an annealed copper wire.
  • a pair of metal terminals 30 shown in FIGS. 1, 2, 4, and 5 are provided corresponding to the metal lead wires 20 individually in order to transmit a sensing signal output through each metal lead wire 20 to an external circuit. Yes.
  • Each metal terminal 30 is electrically connected to the corresponding metal lead wire 20 by being joined to the extending portion 21 of the corresponding metal lead wire 20 by welding or the like, for example.
  • the metal terminals 30 are linearly extended along the reference direction Db from the joints with the corresponding metal lead wires 20, and are arranged in the orthogonal direction Do orthogonal to the reference direction Db.
  • Each metal terminal 30 is formed of a conductive metal material, such as copper, iron, or dumet wire (a material in which an iron-nickel alloy is coated with copper).
  • Each metal terminal 30 has an elongated rectangular flat plate shape in the present embodiment, but may have an elongated round bar shape, for example.
  • Each of the metal terminals 30 is given a tensile strength of, for example, about 390 to 500 N / mm 2 so that the tensile strength in the reference direction Db is higher than that of the corresponding metal lead wire 20.
  • the resin casing 40 is formed by inserting the entire temperature sensing element 10, the entire metal lead wires 20, and a part of each metal terminal 30 by molding.
  • the resin casing 40 exposes the remainder of the metal terminals 30 to the outside so that the metal terminals 30 can be electrically connected to an external circuit.
  • the resin casing 40 is formed from a resin material exhibiting heat resistance in the use temperature range ⁇ T, such as polybutylene terephthalate (PBT) resin, polyphenylene sulfide (PPS) resin, or the like.
  • the resin casing 40 of the present embodiment is formed of a resin material containing a fibrous filler such as a glass filler, for example, in order to increase the impact strength in the vehicle.
  • a one-side gate type is adopted as mold forming in this embodiment.
  • the resin casing 40 is given a linear expansion coefficient ⁇ c larger than that of the metal lead wire 20 and a Young's modulus Yc smaller than that of the metal lead wire 20 with respect to the reference direction Db.
  • ⁇ c linear expansion coefficient
  • Yc Young's modulus
  • the other-side metal lead wire 20b (see FIG. 1) is provided around the one-side metal lead wire 20a (see FIG. 1).
  • a linear expansion coefficient ⁇ c smaller than the periphery of (see FIG. 1) is given in the reference direction Db.
  • the linear expansion coefficient ⁇ c shows a minimum value around the metal lead wire 20a on one side. Therefore, in the numerical example of FIG. 3, 2.0 ⁇ 10 ⁇ 5 / ° C. is presented as the minimum linear expansion coefficient ⁇ c around the metal lead wire 20a on one side.
  • the Young's modulus is larger around the metal lead wire 20a on the one side than around the metal lead wire 20b on the other side.
  • Yc is given in the reference direction Db.
  • the Young's modulus Yc shows the maximum value around the metal lead wire 20a on one side. Therefore, in the numerical example of FIG. 3, 9.0 GPa is presented as the maximum Young's modulus Yc around the metal lead wire 20a on one side.
  • the intermediate cover 50 is formed by coating the entire temperature sensing element 10, the entire metal lead wires 20, and a part of each metal terminal 30 by a coating process.
  • the intermediate cover 50 is inserted into the resin casing 40 by molding so that the intermediate cover 50 is interposed between the inner elements 10, 20, 30 and the outer resin casing 40 in a thin film shape.
  • the intermediate cover 50 is formed from a specific material exhibiting heat resistance in the use temperature range ⁇ T, for example, PPS resin, epoxy resin, silicone resin, or the like.
  • the intermediate cover 50 of the present embodiment is formed from a specific material containing a fibrous filler such as a glass filler, for example, in order to increase the impact strength in the vehicle.
  • the coating process for forming the intermediate cover 50 from such a specific material for example, a coating process or a spraying process of the liquid specific material, an immersion process in the liquid specific material, or the like can be employed.
  • a film thickness of about 0.2 to 2 mm is employed as the formation thickness of the intermediate cover 50 by the coating process.
  • the intermediate cover 50 has a linear expansion coefficient ⁇ m larger than the metal lead wire 20 and smaller than the resin casing 40, and a Young's modulus Ym smaller than the metal lead wire 20 and larger than the resin casing 40.
  • ⁇ m the linear expansion coefficient defined in the reference direction Db of the intermediate cover 50 formed from the glass filler-containing PPS resin by the coating process
  • ⁇ c the minimum linear expansion coefficient ⁇ c of the resin casing 40
  • the Young's modulus Ym defined in the reference direction Db of the intermediate cover 50 formed from the glass filler-containing PPS resin by the coating process is larger than the maximum Young's modulus Yc of the resin casing 40. 2 kN / mm 2 GPa is given.
  • the linear expansion coefficient difference ⁇ is expressed by the following formula 1. That is, the linear expansion coefficient difference ⁇ is obtained by a subtraction value obtained by subtracting the linear expansion coefficient ⁇ l of the metal lead wire 20 in the reference direction Db from the linear expansion coefficient ⁇ m of the intermediate cover 50 in the reference direction Db. Specifically, the linear expansion coefficient difference ⁇ obtained by substituting the numerical example of FIG. 3 into Equation 1 is 0.4 ⁇ 10 ⁇ 5 / ° C.
  • the generated stress ⁇ is expressed by the following formula 2. That is, the generated stress ⁇ is estimated by a multiplication value obtained by multiplying the linear expansion coefficient difference ⁇ in the reference direction Db, the Young's modulus Yl of the metal lead wire 20 in the reference direction Db, and the operating temperature range ⁇ T. Specifically, the generated stress ⁇ estimated by substituting the numerical example of FIG. 3 into Equation 2 is 66.88 N / mm 2 .
  • the temperature sensor 1 satisfies the relationship of the following formula 3 between the generated stress ⁇ and the tensile strength Sl in the metal lead wire 20. That is, in the metal lead wire 20, the generated stress ⁇ in the metal lead wire 20 is limited to be smaller than the tensile strength S1. Specifically, in the numerical example of FIG. 3, since the tensile strength S1 of the metal lead wire 20 formed of annealed copper wire is 120 N / mm 2 , the generated stress ⁇ in the metal lead wire 20 is 66.88 N as described above. / Mm 2 .
  • the tensile strength S1 can be measured by a method such as JIS Z2241 (metal material tensile test method).
  • ⁇ ⁇ Sl (Formula 3) From the above, when formulas 2 and 3 are arranged, the following formula 4 is obtained. Therefore, in the temperature sensor 1, when the minimum linear expansion coefficient ⁇ m of the intermediate cover 50 is given smaller than the linear expansion coefficient ⁇ l of the metal lead wire 20, a line obtained by substituting these coefficients ⁇ l and ⁇ m into Equation 1 is obtained.
  • the expansion coefficient difference ⁇ is set in advance in a specific range that satisfies the relationship of Equation 4.
  • the common temperature sensing element 10 joined to each metal lead wire 20 and a part of the individual metal terminal 30 are also covered by the intermediate cover 50. Therefore, in the covering step, for example, the liquid specific material is applied to the whole of the metal lead wires 20, the temperature sensing element 10, and a part of each of the metal terminals 30. A coating process such as a dipping process is performed.
  • the pair of metal lead wires 20 covered with the intermediate cover 50 in the previous covering step is formed of the mold 100 that has been opened. Set in molding cavity 101.
  • the temperature sensitive element 10 and the pair of metal terminals 30 covered by the intermediate cover 50 in the previous covering process are also set in the molding cavity 101 of the mold 100 that has been opened. To do.
  • the pair of metal lead wires 20 and the pair of metal terminals 30 are set together with the temperature sensing element 10 in a direction Do perpendicular to the reference direction Db.
  • the mold 100 having the pair of metal lead wires 20 and the like set in the molding cavity 101 by the previous setting step is closed and In a state where the mold is clamped, the molten resin material is injected into the molding cavity 101.
  • the setting step of the present embodiment only the gate 102 provided on the metal lead wire 20a side as one side among the both sides sandwiching the pair of metal lead wires 20 in the orthogonal direction Do in the molding die 100, Molten resin material is injected.
  • the injected molten resin material is obtained from the metal lead wire 20a as one side of the both sides sandwiching the pair of metal lead wires 20 in the orthogonal direction Do, and the metal lead as the other side. It flows toward the line 20b side.
  • a fibrous filler is included in the molten resin material.
  • the fiber orientation of the fibrous filler is easily along the reference direction Db around the metal lead wire 20 a on one side close to the gate 102.
  • the fiber orientation of the fibrous filler does not follow along the reference direction Db around the metal lead wire 20b on the other side far from the gate 102, for example, easily along the orthogonal direction Do.
  • the molten resin material is solidified by cooling the molten resin material injected into the molding cavity 101 in the previous injection step, and the resin casing. 40 is formed.
  • the circumference of the metal lead wire 20a on one side is smaller than the circumference of the metal lead wire 20b on the other side due to the difference in fiber orientation with respect to the fibrous filler in the injection process described above.
  • a linear expansion coefficient ⁇ c is given in the reference direction Db. As a result, the temperature sensor 1 is completed.
  • the intermediate cover 50 is interposed between the metal lead wire 20 inserted into the resin casing 40 by molding and the resin casing 40.
  • the linear expansion coefficient ⁇ m of the intermediate cover 50 is larger than that of the metal lead wire 20 and from the resin casing 40 due to the specific material forming the intermediate cover 50. Is also given small. Therefore, even under use in a high temperature environment, the thermal expansion amount of the intermediate cover 50 can be as close as possible to the thermal expansion amount of the metal lead wire 20 rather than the thermal expansion amount of the resin casing 40 in the reference direction Db. .
  • the generated stress ⁇ generated in the metal lead wire 20 according to the set value is the metal lead wire.
  • the tensile strength S1 is limited to be smaller than 20. As a result, in the metal lead wire 20, it is possible to suppress a situation in which the generated stress ⁇ exceeds the tensile strength S 1 and causes disconnection, so that a high yield can be achieved.
  • the generated stress ⁇ generated according to the linear expansion coefficient difference ⁇ in the reference direction Db with respect to the intermediate cover 50 is the linear expansion coefficient difference ⁇ and the Young's modulus Yl in the reference direction Db. It can be estimated by a multiplication value ( ⁇ ⁇ Yl ⁇ ⁇ T) with the operating temperature range ⁇ T. Therefore, by setting the linear expansion coefficient difference ⁇ within a specific range that satisfies the relationship ⁇ ⁇ Sl / (Yl ⁇ ⁇ T) in Equation 4, the generated stress ⁇ is more reliably set than the tensile strength S1 in the metal lead wire 20. The wire breakage can be suppressed by limiting to a small value. Therefore, the reliability for achieving a high yield can be improved.
  • the Young's modulus Ym of the intermediate cover 50 in the reference direction Db in which the extending portion 21 of the metal lead wire 20 extends is smaller than that of the metal lead wire 20 due to the specific material forming the intermediate cover 50 and It is given larger than the resin casing 40. Therefore, even under use in a high temperature environment, the tensile action in the reference direction Db by the resin casing 40 having a large thermal expansion amount is absorbed by the intermediate cover 50, and the metal lead wire 20 is caused to be in the same reference direction Db by the tensile action. Can be reduced. According to this, since the generated stress ⁇ generated in the metal lead wire 20 can be reduced and the disconnection can be suppressed, it is possible to contribute to the achievement of a high yield.
  • the linear expansion coefficient at each location of the resin casing 40 according to the formation position of the gate 102 in the molding die 100. ⁇ c may vary. Therefore, in the reference direction Db, as long as the linear expansion coefficient difference ⁇ with the metal lead wire 20 having a smaller linear expansion coefficient ⁇ l is within a specific range with respect to the linear expansion coefficient ⁇ m of the intermediate cover 50 formed of the specific material, the resin It is smaller than the minimum linear expansion coefficient ⁇ c of the casing 40.
  • the amount of thermal expansion of the intermediate cover 50 surely approaches the amount of thermal expansion of the metal lead wire 20 rather than the amount of thermal expansion at an arbitrary location of the resin casing 40, the generated stress ⁇ is generated in the metal lead wire 20. Is limited to be smaller than the tensile strength S1 and disconnection can be suppressed. Therefore, it is possible to contribute to achieving a high yield.
  • the pair of metal lead wires 20 covered with the intermediate cover 50 are arranged in the direction Do perpendicular to the reference direction Db, and together with the temperature sensing element 10, the molding cavity 101 of the molding die 100.
  • the molding cavity 101 Set in.
  • the gate 102 provided on one side of both sides sandwiching the set pair of metal lead wires 20 in the orthogonal direction Do, toward one side and the other side of the both sides,
  • the molten resin material is injected into the molding cavity 101.
  • the resin casing 40 formed by solidification of the molten resin material injected into the molding cavity 101 the metal on the other side far from the gate 102 around the metal lead wire 20 a on one side near the gate 102.
  • a linear expansion coefficient ⁇ c higher than that around the lead wire 20b is given in the reference direction Db. This is because the molten resin material flows along the reference direction Db around the metal lead wire 20a on one side, but does not follow the reference direction Db around the metal lead wire 20b on the other side. For example, when the molten resin material flows along the orthogonal direction Do, a difference occurs in the fiber orientation of the fibrous filler.
  • the linear expansion coefficient ⁇ m of the intermediate cover 50 is linearly expanded with the linear expansion coefficient ⁇ l of each metal lead wire 20 (20a, 20b) smaller than that.
  • the coefficient difference ⁇ is within the specific range, the coefficient is given smaller than the minimum linear expansion coefficient ⁇ c of the resin casing 40.
  • the generated stress ⁇ is limited to be smaller than the tensile strength Sl, and disconnection can be suppressed. Therefore, it can contribute to the achievement of a high yield.
  • the temperature sensor 1 may be used in vehicles other than a vehicle such as an outside air temperature sensing around a bridge (for displaying an outside air temperature in order to alert a freezing winter).
  • the Young's modulus Ym of the intermediate cover 50 may be set smaller than the Young's modulus Yc of the resin casing 40.
  • the specific material which forms the resin casing 40 does not need to contain a fibrous filler.
  • the specific material forming the intermediate cover 50 may not contain a fibrous filler.
  • the metal lead wire 20 may be configured only from the substantially extending portion 21 without providing the inclined portion 22. Further, as a sixth modified example, the metal lead wire 20 may be electrically connected to an external circuit without providing the metal terminal 30.
  • a molten resin material is injected into a molding cavity 101 from gates 102 provided on both sides sandwiching a pair of metal lead wires 20 in the orthogonal direction Do, thereby forming a resin casing.
  • 40 may be molded.
  • the resin casing 40 may be molded by the molding die 100 provided with the gate 102 in a positional relationship different from that of the above-described embodiment and the seventh modification.
  • the temperature sensitive element 10 may not be covered with the intermediate cover 50 in the covering step S101 and may be exposed in the molding cavity 101 in the setting step S102.
  • the metal terminal 30 may not be covered with the intermediate cover 50 in the covering step S101 and may be exposed in the molding cavity 101 in the setting step S102.
  • the intermediate cover 50 and the resin casing 40 may be sequentially formed by double molding of a resin material.

Abstract

A temperature sensor (1) is provided with: a temperature-sensitive element (10) for sensing a temperature; metal lead wires (20, 20a, 20b) formed from a metal material and having an extension part (21) extending along a reference direction (Db), the metal lead wires (20, 20a, 20b) being electrically connected to the temperature-sensitive element; a resin casing (40) formed from a resin material, the metal lead wires being inserted into the resin casing (40) by molding in a mold; and a middle cover (50) formed from a specific material having a coefficient of linear expansion in the reference direction greater than that of the metal lead wires and less than that of the resin casing, the middle cover (50) being interposed between the resin casing and the metal lead wires. The difference in coefficient of linear expansion between the metal lead wires and the middle cover in the reference direction is set in a specific range whereby stress that occurs in the metal lead wires in response to the difference in coefficient of linear expansion is limited so as to be less than the tensile strength of the metal lead wires.

Description

温度センサ及びその製造方法Temperature sensor and manufacturing method thereof 関連出願の相互参照Cross-reference of related applications
　本出願は、２０１５年１月１５日に出願された日本特許出願番号２０１５－６１８０号に基づくもので、ここにその記載内容を援用する。 This application is based on Japanese Patent Application No. 2015-6180 filed on January 15, 2015, the contents of which are incorporated herein by reference.
　本開示は、温度センサ及びその製造方法に関するものである。 The present disclosure relates to a temperature sensor and a manufacturing method thereof.
　温度を感知する感温素子に対して電気的に接続される金属リード線を、インサート成形により樹脂ケーシングにインサートしてなる温度センサは、従来より知られている。 A temperature sensor in which a metal lead wire electrically connected to a temperature sensing element that senses temperature is inserted into a resin casing by insert molding has been conventionally known.
　例えば特許文献１には、温度センサ等として利用されるセンサ装置において、二次モールド樹脂としての樹脂ケーシングと金属リード線との間に、一次モールド樹脂を介在させる技術が開示されている。かかる技術では、一次モールド樹脂と二次モールド樹脂とについて、モールド成形時の溶融樹脂材料の流れ方向と流れ直角方向とで、線膨張係数の大小関係が異ならされている。 For example, Patent Document 1 discloses a technique in which a primary mold resin is interposed between a resin casing as a secondary mold resin and a metal lead wire in a sensor device used as a temperature sensor or the like. In such a technique, the primary expansion resin and the secondary mold resin have different linear expansion coefficients in the flow direction and the flow direction perpendicular to the molten resin material at the time of molding.
特開２００４－１９８２４０号公報Japanese Patent Laid-Open No. 2004-198240
　さて、特許文献１に開示される技術のように金属リード線が直線状に延伸する構成下、モールド成形金型において成形キャビティ内の金属リード線がゲートに近い箇所では、溶融樹脂材料の流れ方向が当該延伸方向に沿い易くなる。しかし、モールド成形金型において成形キャビティ内の金属リード線がゲートから遠い箇所では、溶融樹脂材料の流れ方向が金属リード線の延伸方向には沿い難くなる。そのため、特許文献１に開示される技術では、一次モールド樹脂の線膨張係数と金属リード線の線膨張係数との大小関係を、金属リード線の延伸方向において適切に設定することは難しい。ここで特に、高温環境での使用も想定される温度センサとしてのセンサ装置では、金属リード線の延伸方向において金属リード線の熱膨張量よりも一次モールド樹脂の熱膨張量が大きくなる。故に、線膨張係数の設定が適切でないと、大きく熱膨張した一次モールド樹脂により延伸方向に引っ張られる金属リード線では、応力の発生により断線を招くことで、歩留まりを低下させるおそれがあった。 Now, under the configuration in which the metal lead wire is linearly stretched as in the technique disclosed in Patent Document 1, the flow direction of the molten resin material at a location where the metal lead wire in the molding cavity is close to the gate in the molding die. Becomes easy to follow along the said extending | stretching direction. However, in the molding die, at the location where the metal lead wire in the molding cavity is far from the gate, the flow direction of the molten resin material becomes difficult to follow the extending direction of the metal lead wire. Therefore, with the technique disclosed in Patent Document 1, it is difficult to appropriately set the magnitude relationship between the linear expansion coefficient of the primary mold resin and the linear expansion coefficient of the metal lead wire in the extending direction of the metal lead wire. In particular, in a sensor device as a temperature sensor assumed to be used in a high-temperature environment, the thermal expansion amount of the primary mold resin is larger than the thermal expansion amount of the metal lead wire in the extending direction of the metal lead wire. Therefore, if the linear expansion coefficient is not properly set, the metal lead wire that is pulled in the extending direction by the primary mold resin that has undergone large thermal expansion may cause a disconnection due to the occurrence of stress, thereby reducing the yield.
　本開示の目的は、歩留まりの高い温度センサ及びその製造方法を提供することにある。 An object of the present disclosure is to provide a temperature sensor with a high yield and a manufacturing method thereof.
　本開示の一態様において、温度センサは、温度を感知する感温素子と、金属材料から形成され、基準方向に沿って延伸する延伸部を有し、感温素子に対して電気的に接続される金属リード線と、樹脂材料から形成され、モールド成形により金属リード線がインサートされた樹脂ケーシングと、基準方向において線膨張係数を金属リード線よりも大きく且つ樹脂ケーシングよりも小さく与える特定材料から、形成され、樹脂ケーシングと金属リード線との間に介在する中間カバーとを、備え、金属リード線と中間カバーとの基準方向の線膨張係数差は、線膨張係数差に応じて金属リード線に発生する発生応力を金属リード線の引張強度よりも小さく制限する特定範囲に、設定される。 In one embodiment of the present disclosure, the temperature sensor includes a temperature-sensitive element that senses temperature and an extending portion that is formed of a metal material and extends along the reference direction, and is electrically connected to the temperature-sensitive element. A metal lead wire formed from a resin material, and a resin casing in which the metal lead wire is inserted by molding, and a specific material that gives a linear expansion coefficient larger than the metal lead wire and smaller than the resin casing in the reference direction, An intermediate cover that is formed and interposed between the resin casing and the metal lead wire, and the difference in the linear expansion coefficient between the metal lead wire and the intermediate cover in the reference direction depends on the difference in the linear expansion coefficient. It is set within a specific range that limits the generated stress to be smaller than the tensile strength of the metal lead wire.
　第一の態様では、モールド成形により樹脂ケーシングにインサートされる金属リード線と、樹脂ケーシングとの間には、中間カバーが介在した状態となる。ここで、金属リード線の延伸部が延伸する基準方向において中間カバーの線膨張係数は、中間カバーを形成する特定材料により、金属リード線よりも大きく且つ樹脂ケーシングよりも小さく与えられる。故に、高温環境での使用下にあっても、基準方向では中間カバーの熱膨張量を、樹脂ケーシングの熱膨張量よりも金属リード線の熱膨張量に可及的に近づけ得る。しかも、金属リード線と中間カバーとの基準方向の線膨張係数差が特定範囲に設定されるので、設定値に応じて金属リード線に発生する発生応力は、金属リード線の引張強度よりも小さく制限される。これにより金属リード線では、発生応力が引張強度を超えて断線を招く事態を抑制できるので、高い歩留まりを達成することが可能となる。 In the first aspect, an intermediate cover is interposed between the metal lead wire inserted into the resin casing by molding and the resin casing. Here, in the reference direction in which the extending portion of the metal lead wire extends, the linear expansion coefficient of the intermediate cover is given larger than the metal lead wire and smaller than the resin casing by the specific material forming the intermediate cover. Therefore, even under use in a high temperature environment, in the reference direction, the thermal expansion amount of the intermediate cover can be as close as possible to the thermal expansion amount of the metal lead wire rather than the thermal expansion amount of the resin casing. Moreover, since the difference in linear expansion coefficient between the metal lead wire and the intermediate cover in the reference direction is set within a specific range, the generated stress generated in the metal lead wire according to the set value is smaller than the tensile strength of the metal lead wire. Limited. Thereby, in the metal lead wire, it is possible to suppress a situation in which the generated stress exceeds the tensile strength and causes disconnection, and thus it is possible to achieve a high yield.
　また、第二の態様によると、樹脂ケーシングは、繊維状フィラーを含有する樹脂材料から、モールド成形により形成され、基準方向において中間カバーの線膨張係数は、樹脂ケーシングの最小の線膨張係数よりも小さい。 According to the second aspect, the resin casing is formed by molding from a resin material containing a fibrous filler, and the linear expansion coefficient of the intermediate cover in the reference direction is greater than the minimum linear expansion coefficient of the resin casing. small.
　第二の態様のように、繊維状フィラー含有の樹脂材料から樹脂ケーシングをモールド成形すると、モールド成形金型におけるゲートの形成位置に応じて、樹脂ケーシングの各箇所における線膨張係数は変動する場合がある。そこで基準方向では、特定材料により形成される中間カバーの線膨張係数につき、それよりも小さな線膨張係数の金属リード線との線膨張係数差が特定範囲に収まる限りにて、樹脂ケーシングの最小の線膨張係数よりも小さく与えられる。これによれば、樹脂ケーシングの任意箇所での熱膨張量よりも中間カバーの熱膨張量が金属リード線の熱膨張量に確実に近づくことで、金属リード線では、発生応力が引張強度よりも小さく制限されて断線が抑制され得る。故に、高い歩留まりの達成に貢献可能となる。 When the resin casing is molded from a resin material containing a fibrous filler as in the second aspect, the linear expansion coefficient in each part of the resin casing may vary depending on the gate formation position in the molding die. is there. Therefore, in the reference direction, as long as the difference between the linear expansion coefficients of the intermediate cover formed of a specific material and the metal lead wire having a smaller linear expansion coefficient is within a specific range, It is given smaller than the linear expansion coefficient. According to this, since the thermal expansion amount of the intermediate cover surely approaches the thermal expansion amount of the metal lead wire rather than the thermal expansion amount at an arbitrary location of the resin casing, the generated stress is higher than the tensile strength in the metal lead wire. The wire breakage can be suppressed by being limited to a small size. Therefore, it is possible to contribute to achieving a high yield.
　さらに第三の態様は、第二の態様の温度センサの製造方法であって、一対の金属リード線を中間カバーにより被覆する被覆工程と、被覆工程にて中間カバーにより被覆された一対の金属リード線を、基準方向に対する直交方向に並べて、感温素子と共に、モールド成形金型の成形キャビティ内にセットするセット工程と、モールド成形金型において、セット工程によりセットされた一対の金属リード線を直交方向に挟む両側のうち一方側に設けられたゲートから、当該両側のうち一方側と他方側とへ向かって、溶融した樹脂材料を成形キャビティ内に注入する注入工程と、注入工程にて成形キャビティ内に注入された樹脂材料を固化させることにより、樹脂ケーシングを形成する固化工程とを、含む。 The third aspect is a method of manufacturing the temperature sensor according to the second aspect, wherein the pair of metal leads are covered with an intermediate cover, and the pair of metal leads covered with the intermediate cover in the covering step. Lines are arranged in a direction orthogonal to the reference direction and set together with the temperature sensing element in the molding cavity of the molding die, and a pair of metal lead wires set by the setting step in the molding die are orthogonal An injection process for injecting molten resin material into the molding cavity from one of the two sides sandwiched in the direction toward one side and the other side of the both sides, and a molding cavity in the injection process A solidifying step of forming a resin casing by solidifying the resin material injected therein.
　第三の態様では、中間カバーにより被覆された一対の金属リード線を、基準方向に対する直交方向に並べて、感温素子と共に、モールド成形金型の成形キャビティ内へとセットする。こうしたモールド成形金型においては、セットされた一対の金属リード線を直交方向に挟む両側のうち一方側に設けられたゲートから、当該両側のうち一方側と他方側とへ向かって、溶融樹脂材料を成形キャビティ内へと注入することになる。その結果、成形キャビティ内に注入された溶融樹脂材料の固化により形成される樹脂ケーシングでは、ゲートに近い一方側の金属リード線の周囲にて、同ゲートから遠い他方側の金属リード線の周囲よりも高い線膨張係数が、基準方向に与えられる。これは、一方側の金属リード線の周囲では、基準方向に沿って溶融樹脂材料が流動するのに対して、他方側の金属リード線の周囲では、同基準方向には沿わずに溶融樹脂材料が流動することで、繊維状フィラーの繊維配向に違いが生じることによる。 In the third aspect, the pair of metal lead wires covered with the intermediate cover are arranged in a direction orthogonal to the reference direction and set together with the temperature sensitive element into the molding cavity of the molding die. In such a molding die, a molten resin material is formed from a gate provided on one side of both sides sandwiching a pair of set metal lead wires in an orthogonal direction toward one side and the other side of the both sides. Will be injected into the molding cavity. As a result, in the resin casing formed by solidification of the molten resin material injected into the molding cavity, around the metal lead wire on one side close to the gate, than around the metal lead wire on the other side far from the gate A higher coefficient of linear expansion is given in the reference direction. This is because the molten resin material flows along the reference direction around the metal lead wire on one side, whereas the molten resin material does not follow the reference direction around the metal lead wire on the other side. This is because a difference occurs in the fiber orientation of the fibrous filler.
　しかし、第三の態様により製造される温度センサの基準方向では、中間カバーの線膨張係数は、それよりも小さな各金属リード線の線膨張係数との線膨張係数差が特定範囲に収まる限りにて、樹脂ケーシングの最小の線膨張係数よりも小さく与えられる。これによれば、樹脂ケーシングの任意箇所での熱膨張量よりも中間カバーの熱膨張量が各金属リード線の熱膨張量に確実に近づくことで、それら各金属リード線では、発生応力が引張強度よりも小さく制限されて断線が抑制され得る。故に、高い歩留まりの達成に貢献可能となる。 However, in the reference direction of the temperature sensor manufactured according to the third aspect, the linear expansion coefficient of the intermediate cover is as long as the linear expansion coefficient difference with the smaller linear expansion coefficient of each metal lead wire is within a specific range. Thus, it is given smaller than the minimum linear expansion coefficient of the resin casing. According to this, since the thermal expansion amount of the intermediate cover surely approaches the thermal expansion amount of each metal lead wire rather than the thermal expansion amount at an arbitrary position of the resin casing, the generated stress is tensile in each of the metal lead wires. The disconnection can be suppressed by being limited to be smaller than the strength. Therefore, it is possible to contribute to achieving a high yield.
　本開示についての上記目的およびその他の目的、特徴や利点は、添付の図面を参照しながら下記の詳細な記述により、より明確になる。その図面は、
図１は、一実施形態による温度センサの構造を示す図であって、図２のＩ－Ｉ線断面図であり、 図２は、一実施形態による温度センサの構造を示す図であって、図１のＩＩ－ＩＩ線断面図であり、 図３は、一実施形態による温度センサの物性について説明するための物性表であり、 図４は、一実施形態による温度センサの構成要素として、感温素子と金属リード線と金属ターミナルとを示す上面図（ａ）、側面図（ｂ）及び斜視図（ｃ）であり、 図５は、一実施形態による温度センサの構成要素として、金属ターミナルと中間カバーとを示す上面図（ａ）、側面図（ｂ）及び斜視図（ｃ）であり、 図６は、一実施形態による温度センサの外観を示す上面図（ａ）、側面図（ｂ）及び斜視図（ｃ）であり、 図７は、一実施形態による温度センサの製造方法を示すフローチャートであり、 図８は、図７のＳ１０１について示す断面図であり、 図９は、図７のＳ１０２について示す断面図であり、 図１０は、図７のＳ１０３について示す断面図であり、 図１１は、図７のＳ１０４について示す断面図であり、 図１２は、図１０の変形例を示す断面図である。 The above and other objects, features, and advantages of the present disclosure will become more apparent from the following detailed description with reference to the accompanying drawings. The drawing
FIG. 1 is a diagram illustrating a structure of a temperature sensor according to an embodiment, and is a cross-sectional view taken along the line II of FIG. FIG. 2 is a view showing a structure of a temperature sensor according to an embodiment, and is a cross-sectional view taken along the line II-II of FIG. FIG. 3 is a physical property table for explaining physical properties of the temperature sensor according to an embodiment. FIG. 4 is a top view (a), a side view (b), and a perspective view (c) showing a temperature sensing element, a metal lead wire, and a metal terminal as components of a temperature sensor according to an embodiment, FIG. 5 is a top view (a), a side view (b), and a perspective view (c) showing a metal terminal and an intermediate cover as components of a temperature sensor according to an embodiment, FIG. 6 is a top view (a), a side view (b), and a perspective view (c) showing an appearance of a temperature sensor according to an embodiment, FIG. 7 is a flowchart illustrating a method for manufacturing a temperature sensor according to an embodiment. FIG. 8 is a cross-sectional view illustrating S101 in FIG. FIG. 9 is a cross-sectional view showing S102 of FIG. FIG. 10 is a cross-sectional view illustrating S103 of FIG. FIG. 11 is a cross-sectional view illustrating S104 in FIG. FIG. 12 is a cross-sectional view showing a modification of FIG.
　以下、本開示の一実施形態を図面に基づいて説明する。 Hereinafter, an embodiment of the present disclosure will be described based on the drawings.
　本開示の一実施形態として図１，２に示す温度センサ１は、車両のエンジンルームのうちフロントグリルの内側に搭載される。温度センサ１は、車両外気の温度を感知する。こうした温度センサ１には、図３に示すように、寒冷環境下において車両外気が到達する最低温度と、停止中又は低速走行中の車両においてエンジンからの輻射熱により到達する最高温度との差として、使用温度範囲ΔＴが定義されている。ここで、図３の数値例では、－３０℃である最低温度と、８０℃である最高温度との差として、１１０℃となるワイドレンジの使用温度範囲ΔＴが予め想定されている。 As an embodiment of the present disclosure, the temperature sensor 1 shown in FIGS. 1 and 2 is mounted inside the front grill in the engine room of the vehicle. The temperature sensor 1 senses the temperature of the outside air of the vehicle. As shown in FIG. 3, the temperature sensor 1 has a difference between the lowest temperature reached by the vehicle outside air in a cold environment and the highest temperature reached by radiant heat from the engine in a vehicle that is stopped or traveling at a low speed, An operating temperature range ΔT is defined. Here, in the numerical example shown in FIG. 3, a wide-range operating temperature range ΔT of 110 ° C. is assumed in advance as the difference between the lowest temperature of −30 ° C. and the highest temperature of 80 ° C.
　まず、温度センサ１の構成につき、詳細に説明する。図１，２に示すように温度センサ１は、感温素子１０、金属リード線２０、金属ターミナル３０、樹脂ケーシング４０及び中間カバー５０を備えている。 First, the configuration of the temperature sensor 1 will be described in detail. As shown in FIGS. 1 and 2, the temperature sensor 1 includes a temperature sensitive element 10, a metal lead wire 20, a metal terminal 30, a resin casing 40, and an intermediate cover 50.
　図１，２，４に示す感温素子１０は、車両外気の温度を感知するために、当該感知温度に応じた電圧の感知信号を生成するサーミスタである。感温素子１０は、封止材１２により素子本体１１の全体を封止してなる。封止材１２は、使用温度範囲ΔＴにおいて耐熱性を示す材料、例えばエポキシ樹脂、ガラス等から、形成されている。封止材１２は、本実施形態では扁球状であるが、例えば矩形又は円形の平板状等であってもよい。図１，２に示す素子本体１１は、温度の変化に従って電気抵抗の変化する材料、例えばセラミックス材料、金属酸化物材料、導電性粒子含有の樹脂材料等から、形成されている。素子本体１１は、本実施形態では矩形のチップ状であるが、例えば円形のチップ状であってもよい。 The temperature sensing element 10 shown in FIGS. 1, 2, and 4 is a thermistor that generates a sensing signal having a voltage corresponding to the sensed temperature in order to sense the temperature of the outside air of the vehicle. The temperature sensitive element 10 is formed by sealing the entire element body 11 with a sealing material 12. The sealing material 12 is formed from a material that exhibits heat resistance in the operating temperature range ΔT, such as an epoxy resin, glass, or the like. In the present embodiment, the sealing material 12 is oblate, but may be, for example, a rectangular or circular flat plate. The element body 11 shown in FIGS. 1 and 2 is formed of a material whose electrical resistance changes according to a change in temperature, such as a ceramic material, a metal oxide material, or a resin material containing conductive particles. The element body 11 has a rectangular chip shape in the present embodiment, but may be, for example, a circular chip shape.
　図１，２，４に示す金属リード線２０は、感温素子１０の生成する感知信号を出力するために、一対設けられている。各金属リード線２０は、所定の基準方向Ｄｂに沿って直線状に延伸する延伸部２１を、それぞれ有している。各金属リード線２０は、基準方向Ｄｂとは直交する直交方向Ｄｏに間隔をあけて並ぶことで、延伸部２１同士を基準方向Ｄｂに沿って実質平行に延伸させている。さらに各金属リード線２０は、それぞれ延伸部２１から共通の感温素子１０へと向かって延伸することで、基準方向Ｄｂに対して互いの側へ傾斜する傾斜部２２も、一体に有している。各金属リード線２０の傾斜部２２は、共通の感温素子１０に対して例えば溶着等により接合されることで、共通の感温素子１０と電気的に接続されている。このような構成の各金属リード線２０は、導電性の金属材料、例えば銅、鉄、ステンレス鋼等から、形成されている。各金属リード線２０は、本実施形態では全体として細長の丸棒状であるが、例えば細長の平板状等であってもよい。 A pair of metal lead wires 20 shown in FIGS. 1, 2 and 4 are provided to output a sensing signal generated by the temperature sensing element 10. Each metal lead wire 20 has an extending portion 21 extending linearly along a predetermined reference direction Db. The metal lead wires 20 are arranged at intervals in an orthogonal direction Do orthogonal to the reference direction Db, thereby extending the extending portions 21 substantially parallel to each other along the reference direction Db. Furthermore, each metal lead wire 20 is integrally provided with an inclined portion 22 that is inclined toward each other with respect to the reference direction Db by extending from the extending portion 21 toward the common temperature-sensitive element 10. Yes. The inclined portion 22 of each metal lead wire 20 is electrically connected to the common temperature sensing element 10 by being joined to the common temperature sensing element 10 by, for example, welding. Each metal lead wire 20 having such a configuration is formed of a conductive metal material such as copper, iron, stainless steel, or the like. Each metal lead wire 20 has an elongated round bar shape as a whole in the present embodiment, but may be, for example, an elongated flat plate shape.
　図３に示すように各金属リード線２０には、互いに実質同一の線膨張係数αｌと、互いに実質同一のヤング率Ｙｌとが、基準方向Ｄｂに関して与えられている。具体的に図３の数値例では、軟銅線から形成される金属リード線２０の基準方向Ｄｂに定義される線膨張係数αｌとして、１．２×１０－５／℃が与えられている。また、図３の数値例では、軟銅線から形成される金属リード線２０の基準方向Ｄｂに定義されるヤング率Ｙｌとして、１５２．０ＧＰａ（ｋＮ／ｍｍ２）が与えられている。 As shown in FIG. 3, the metal lead wires 20 are given substantially the same linear expansion coefficient αl and substantially the same Young's modulus Yl with respect to the reference direction Db. Specifically, in the numerical example of FIG. 3, 1.2 × 10 −5 / ° C. is given as the linear expansion coefficient αl defined in the reference direction Db of the metal lead wire 20 formed of annealed copper wire. In the numerical example of FIG. 3, 152.0 GPa (kN / mm 2 ) is given as the Young's modulus Yl defined in the reference direction Db of the metal lead wire 20 formed from an annealed copper wire.
　図１，２，４，５に示す金属ターミナル３０は、各金属リード線２０を通して出力される感知信号を外部回路へ送信するために、それら金属リード線２０に個別に対応して一対設けられている。各金属ターミナル３０は、それぞれ対応する金属リード線２０の延伸部２１に対して例えば溶着等により接合されることで、対応する金属リード線２０と電気的に接続されている。各金属ターミナル３０は、それぞれ対応する金属リード線２０との接合箇所から基準方向Ｄｂに沿って直線状に延伸することで、同基準方向Ｄｂとは直交する直交方向Ｄｏに並んでいる。各金属ターミナル３０は、導電性の金属材料、例えば銅、鉄、ジュメット線（鉄－ニッケル合金のまわりを銅でコーティングした材料）等から、形成されている。各金属ターミナル３０は、本実施形態では細長の矩形平板状であるが、例えば細長の丸棒状等であってもよい。このような各金属ターミナル３０については、それぞれ対応する金属リード線２０よりも基準方向Ｄｂの引張強度が高くなるように、引張強度として例えば３９０～５００Ｎ／ｍｍ２程度の強度が与えられている。 A pair of metal terminals 30 shown in FIGS. 1, 2, 4, and 5 are provided corresponding to the metal lead wires 20 individually in order to transmit a sensing signal output through each metal lead wire 20 to an external circuit. Yes. Each metal terminal 30 is electrically connected to the corresponding metal lead wire 20 by being joined to the extending portion 21 of the corresponding metal lead wire 20 by welding or the like, for example. The metal terminals 30 are linearly extended along the reference direction Db from the joints with the corresponding metal lead wires 20, and are arranged in the orthogonal direction Do orthogonal to the reference direction Db. Each metal terminal 30 is formed of a conductive metal material, such as copper, iron, or dumet wire (a material in which an iron-nickel alloy is coated with copper). Each metal terminal 30 has an elongated rectangular flat plate shape in the present embodiment, but may have an elongated round bar shape, for example. Each of the metal terminals 30 is given a tensile strength of, for example, about 390 to 500 N / mm 2 so that the tensile strength in the reference direction Db is higher than that of the corresponding metal lead wire 20.
　図１，２，６に示すように樹脂ケーシング４０は、感温素子１０の全体と、各金属リード線２０の全体と、各金属ターミナル３０の一部とを、モールド成形によりインサートしてなる。樹脂ケーシング４０は、各金属ターミナル３０を外部回路に対して電気的に接続可能とするために、それら金属ターミナル３０の残部を外部に対して露出させている。樹脂ケーシング４０は、使用温度範囲ΔＴにおいて耐熱性を示す樹脂材料、例えばポリブチレンテレフタレート（ＰＢＴ）樹脂、ポリフェニレンサルファイド（ＰＰＳ）樹脂等から、形成されている。ここで、本実施形態の樹脂ケーシング４０は、車両における衝撃強度を高めるために、例えばガラスフィラー等の繊維状フィラーを含有した樹脂材料から、形成されている。こうした樹脂材料からの樹脂ケーシング４０を形成するために、モールド成形として本実施形態では、片側ゲート式が採用される。 As shown in FIGS. 1, 2, and 6, the resin casing 40 is formed by inserting the entire temperature sensing element 10, the entire metal lead wires 20, and a part of each metal terminal 30 by molding. The resin casing 40 exposes the remainder of the metal terminals 30 to the outside so that the metal terminals 30 can be electrically connected to an external circuit. The resin casing 40 is formed from a resin material exhibiting heat resistance in the use temperature range ΔT, such as polybutylene terephthalate (PBT) resin, polyphenylene sulfide (PPS) resin, or the like. Here, the resin casing 40 of the present embodiment is formed of a resin material containing a fibrous filler such as a glass filler, for example, in order to increase the impact strength in the vehicle. In order to form the resin casing 40 made of such a resin material, a one-side gate type is adopted as mold forming in this embodiment.
　図３に示すように樹脂ケーシング４０には、金属リード線２０よりも大きな線膨張係数αｃと、金属リード線２０よりも小さなヤング率Ｙｃとが、基準方向Ｄｂに関して与えられている。具体的に図３の数値例では、ガラスフィラー含有ＰＢＴ樹脂から形成される樹脂ケーシング４０の基準方向Ｄｂに定義される線膨張係数αｃとして、２．０×１０－５／℃が与えられている。また、ガラスフィラー含有ＰＢＴ樹脂から形成される樹脂ケーシング４０の基準方向Ｄｂに定義されるヤング率Ｙｃとして、９．０ＧＰａが与えられている。 As shown in FIG. 3, the resin casing 40 is given a linear expansion coefficient αc larger than that of the metal lead wire 20 and a Young's modulus Yc smaller than that of the metal lead wire 20 with respect to the reference direction Db. Specifically, in the numerical example of FIG. 3, 2.0 × 10 −5 / ° C. is given as the linear expansion coefficient αc defined in the reference direction Db of the resin casing 40 formed from the glass filler-containing PBT resin. . Moreover, 9.0 GPa is given as the Young's modulus Yc defined in the reference direction Db of the resin casing 40 formed from the glass filler-containing PBT resin.
　ここで、片側ゲート式のモールド成形によりガラスフィラー含有の特定材料から形成される樹脂ケーシング４０では、一方側の金属リード線２０ａ（図１参照）の周囲にて、他方側の金属リード線２０ｂ（図１参照）の周囲よりも小さな線膨張係数αｃが基準方向Ｄｂに与えられる。その結果、一方側の金属リード線２０ａの周囲では、線膨張係数αｃが最小値を示す。そこで図３の数値例では、一方側の金属リード線２０ａの周囲における最小の線膨張係数αｃとして、２．０×１０－５／℃が提示されている。 Here, in the resin casing 40 formed from a glass filler-containing specific material by one-side gate type molding, the other-side metal lead wire 20b (see FIG. 1) is provided around the one-side metal lead wire 20a (see FIG. 1). A linear expansion coefficient αc smaller than the periphery of (see FIG. 1) is given in the reference direction Db. As a result, the linear expansion coefficient αc shows a minimum value around the metal lead wire 20a on one side. Therefore, in the numerical example of FIG. 3, 2.0 × 10 −5 / ° C. is presented as the minimum linear expansion coefficient αc around the metal lead wire 20a on one side.
　また、片側ゲート式のモールド成形によりガラスフィラー含有の特定材料から形成される樹脂ケーシング４０では、一方側の金属リード線２０ａの周囲にて、他方側の金属リード線２０ｂの周囲よりも大きなヤング率Ｙｃが基準方向Ｄｂに与えられる。その結果、一方側の金属リード線２０ａの周囲では、ヤング率Ｙｃが最大値を示す。そこで図３の数値例では、一方側の金属リード線２０ａの周囲における最大のヤング率Ｙｃとして、９．０ＧＰａが提示されている。 Further, in the resin casing 40 formed from a glass filler-containing specific material by one-side gate type molding, the Young's modulus is larger around the metal lead wire 20a on the one side than around the metal lead wire 20b on the other side. Yc is given in the reference direction Db. As a result, the Young's modulus Yc shows the maximum value around the metal lead wire 20a on one side. Therefore, in the numerical example of FIG. 3, 9.0 GPa is presented as the maximum Young's modulus Yc around the metal lead wire 20a on one side.
　図１，２，５に示すように中間カバー５０は、感温素子１０の全体と、各金属リード線２０の全体と、各金属ターミナル３０の一部とを、コーティング処理により被覆してなる。中間カバー５０は、モールド成形により樹脂ケーシング４０にインサートされることで、内側の要素１０，２０，３０と外側の樹脂ケーシング４０との間に薄膜状に介在させられている。中間カバー５０は、使用温度範囲ΔＴにおいて耐熱性を示す特定材料、例えばＰＰＳ樹脂、エポキシ樹脂、シリコーン樹脂等から、形成されている。ここで、本実施形態の中間カバー５０は、車両における衝撃強度を高めるために、例えばガラスフィラー等の繊維状フィラーを含有した特定材料から、形成されている。こうした特定材料から中間カバー５０を形成するコーティング処理としては、例えば液状特定材料の塗布処理や吹付け処理、液状特定材料への浸漬処理等を採用可能である。また、コーティング処理による中間カバー５０の形成厚さとしては、例えば０．２～２ｍｍ程度の膜厚が採用される。 As shown in FIGS. 1, 2, and 5, the intermediate cover 50 is formed by coating the entire temperature sensing element 10, the entire metal lead wires 20, and a part of each metal terminal 30 by a coating process. The intermediate cover 50 is inserted into the resin casing 40 by molding so that the intermediate cover 50 is interposed between the inner elements 10, 20, 30 and the outer resin casing 40 in a thin film shape. The intermediate cover 50 is formed from a specific material exhibiting heat resistance in the use temperature range ΔT, for example, PPS resin, epoxy resin, silicone resin, or the like. Here, the intermediate cover 50 of the present embodiment is formed from a specific material containing a fibrous filler such as a glass filler, for example, in order to increase the impact strength in the vehicle. As the coating process for forming the intermediate cover 50 from such a specific material, for example, a coating process or a spraying process of the liquid specific material, an immersion process in the liquid specific material, or the like can be employed. In addition, as the formation thickness of the intermediate cover 50 by the coating process, for example, a film thickness of about 0.2 to 2 mm is employed.
　図３に示すように中間カバー５０には、金属リード線２０よりも大きく且つ樹脂ケーシング４０よりも小さな線膨張係数αｍと、金属リード線２０よりも小さく且つ樹脂ケーシング４０よりも大きなヤング率Ｙｍとが、基準方向Ｄｂに関して与えられている。具体的に図３の数値例では、ガラスフィラー含有ＰＰＳ樹脂からコーティング処理により形成される中間カバー５０の基準方向Ｄｂに定義される線膨張係数αｍとして、樹脂ケーシング４０の最小の線膨張係数αｃより小さな１．６×１０－５／℃が与えられている。また、図３の数値例では、ガラスフィラー含有ＰＰＳ樹脂からコーティング処理により形成される中間カバー５０の基準方向Ｄｂに定義されるヤング率Ｙｍとして、樹脂ケーシング４０の最大のヤング率Ｙｃより大きな１９．２ｋＮ／ｍｍ２ＧＰａが与えられている。 As shown in FIG. 3, the intermediate cover 50 has a linear expansion coefficient αm larger than the metal lead wire 20 and smaller than the resin casing 40, and a Young's modulus Ym smaller than the metal lead wire 20 and larger than the resin casing 40. Is given for the reference direction Db. Specifically, in the numerical example of FIG. 3, as the linear expansion coefficient αm defined in the reference direction Db of the intermediate cover 50 formed from the glass filler-containing PPS resin by the coating process, from the minimum linear expansion coefficient αc of the resin casing 40 A small 1.6 × 10 −5 / ° C. is given. Further, in the numerical example of FIG. 3, the Young's modulus Ym defined in the reference direction Db of the intermediate cover 50 formed from the glass filler-containing PPS resin by the coating process is larger than the maximum Young's modulus Yc of the resin casing 40. 2 kN / mm 2 GPa is given.
　このような温度センサ１の構成下、金属リード線２０と中間カバー５０との基準方向Ｄｂの線膨張係数差をΔαと定義すると、線膨張係数差Δαは、下記式１により表される。即ち、線膨張係数差Δαは、中間カバー５０の基準方向Ｄｂの線膨張係数αｍから、金属リード線２０の同基準方向Ｄｂの線膨張係数αｌを差し引いた減算値により、求められる。具体的に、図３の数値例を式１に代入することで求められる線膨張係数差Δαは、０．４×１０－５／℃となる。
Δα＝αｍ－αｌ　…（式１）
　また、中間カバー５０との線膨張係数差Δαに応じて金属リード線２０に発生する発生応力をσと定義すると、発生応力σは、下記式２により表される。即ち、発生応力σは、基準方向Ｄｂの線膨張係数差Δαと、金属リード線２０の同基準方向Ｄｂのヤング率Ｙｌと、使用温度範囲ΔＴとを掛け合わせた乗算値により、推定される。具体的に、図３の数値例を式２に代入することで推定される発生応力σは、６６．８８Ｎ／ｍｍ２となる。
σ＝Δα×Ｙｌ×ΔＴ　…（式２）
　さらに、基準方向Ｄｂにおける金属リード線２０の引張強度をＳｌと定義すると、金属リード線２０での発生応力σと引張強度Ｓｌとの間において温度センサ１は、下記式３の関係を満たす。即ち、金属リード線２０では、金属リード線２０での発生応力σが引張強度Ｓｌよりも小さく制限される。具体的に図３の数値例では、軟銅線から形成される金属リード線２０の引張強度Ｓｌが１２０Ｎ／ｍｍ２であることから、金属リード線２０での発生応力σが上述の如き６６．８８Ｎ／ｍｍ２に制限されている。尚、引張強度Ｓｌについては、例えばＪＩＳ　Ｚ２２４１（金属材料引張試験方法）等といった方法により、測定可能である。
σ＜Ｓｌ　…（式３）
　以上より、式２，３を整理すると、下記式４が得られる。そこで、温度センサ１では、金属リード線２０の線膨張係数αｌよりも中間カバー５０の最小の線膨張係数αｍが小さく与えられることで、それら係数αｌ，αｍを式１に代入して求められる線膨張係数差Δαは、式４の関係を満たす特定範囲に予め設定されている。このような温度センサ１では、線膨張係数αｍの中間カバー５０を形成する特定材料の選定により、式４の関係を成立させておけば、金属リード線２０や樹脂ケーシング４０を形成する樹脂材料の選定自由度を、高めることが可能となる。
Δα＜Ｓｌ／（Ｙｌ×ΔＴ）　…（式４）
　次に、温度センサ１を製造するために図７のフローチャートに従って実行される製造方法につき、詳細に説明する。製造方法の第一段階としてＳ１０１の被覆工程では、図８に示すように一対の金属リード線２０を、中間カバー５０により被覆する。このとき本実施形態の被覆工程では、各金属リード線２０に接合された共通の感温素子１０及び個別の金属ターミナル３０の一部も、中間カバー５０により被覆する。そこで被覆工程では、各金属リード線２０の全体と、感温素子１０の全体と、各金属ターミナル３０の一部とに対して、例えば液状特定材料の塗布処理や吹付け処理、液状特定材料への浸漬処理等のコーティング処理を施すことになる。 Under such a configuration of the temperature sensor 1, if the linear expansion coefficient difference in the reference direction Db between the metal lead wire 20 and the intermediate cover 50 is defined as Δα, the linear expansion coefficient difference Δα is expressed by the following formula 1. That is, the linear expansion coefficient difference Δα is obtained by a subtraction value obtained by subtracting the linear expansion coefficient αl of the metal lead wire 20 in the reference direction Db from the linear expansion coefficient αm of the intermediate cover 50 in the reference direction Db. Specifically, the linear expansion coefficient difference Δα obtained by substituting the numerical example of FIG. 3 into Equation 1 is 0.4 × 10 −5 / ° C.
Δα = αm−αl (Formula 1)
Further, when the generated stress generated in the metal lead wire 20 in accordance with the linear expansion coefficient difference Δα with the intermediate cover 50 is defined as σ, the generated stress σ is expressed by the following formula 2. That is, the generated stress σ is estimated by a multiplication value obtained by multiplying the linear expansion coefficient difference Δα in the reference direction Db, the Young's modulus Yl of the metal lead wire 20 in the reference direction Db, and the operating temperature range ΔT. Specifically, the generated stress σ estimated by substituting the numerical example of FIG. 3 into Equation 2 is 66.88 N / mm 2 .
σ = Δα × Yl × ΔT (Expression 2)
Furthermore, if the tensile strength of the metal lead wire 20 in the reference direction Db is defined as Sl, the temperature sensor 1 satisfies the relationship of the following formula 3 between the generated stress σ and the tensile strength Sl in the metal lead wire 20. That is, in the metal lead wire 20, the generated stress σ in the metal lead wire 20 is limited to be smaller than the tensile strength S1. Specifically, in the numerical example of FIG. 3, since the tensile strength S1 of the metal lead wire 20 formed of annealed copper wire is 120 N / mm 2 , the generated stress σ in the metal lead wire 20 is 66.88 N as described above. / Mm 2 . The tensile strength S1 can be measured by a method such as JIS Z2241 (metal material tensile test method).
σ <Sl (Formula 3)
From the above, when formulas 2 and 3 are arranged, the following formula 4 is obtained. Therefore, in the temperature sensor 1, when the minimum linear expansion coefficient αm of the intermediate cover 50 is given smaller than the linear expansion coefficient αl of the metal lead wire 20, a line obtained by substituting these coefficients αl and αm into Equation 1 is obtained. The expansion coefficient difference Δα is set in advance in a specific range that satisfies the relationship of Equation 4. In such a temperature sensor 1, if the relationship of Formula 4 is established by selecting a specific material for forming the intermediate cover 50 having a linear expansion coefficient αm, the resin material for forming the metal lead wire 20 and the resin casing 40 can be obtained. It becomes possible to increase the degree of freedom of selection.
Δα <Sl / (Yl × ΔT) (Formula 4)
Next, a manufacturing method executed in accordance with the flowchart of FIG. 7 in order to manufacture the temperature sensor 1 will be described in detail. As a first step of the manufacturing method, in the covering step of S101, a pair of metal lead wires 20 are covered with an intermediate cover 50 as shown in FIG. At this time, in the covering step of this embodiment, the common temperature sensing element 10 joined to each metal lead wire 20 and a part of the individual metal terminal 30 are also covered by the intermediate cover 50. Therefore, in the covering step, for example, the liquid specific material is applied to the whole of the metal lead wires 20, the temperature sensing element 10, and a part of each of the metal terminals 30. A coating process such as a dipping process is performed.
　製造方法の第二段階としてＳ１０２のセット工程では、図９に示すように、先の被覆工程にて中間カバー５０により被覆された一対の金属リード線２０を、型開したモールド成形金型１００の成形キャビティ１０１内にセットする。このとき本実施形態のセット工程では、先の被覆工程にて中間カバー５０により被覆された感温素子１０及び一対の金属ターミナル３０も、型開したモールド成形金型１００の成形キャビティ１０１内にセットする。このようなセット工程では、一対の金属リード線２０及び一対の金属ターミナル３０は、基準方向Ｄｂに対する直交方向Ｄｏに並んで、感温素子１０と共にセットされる。 In the setting step of S102 as the second stage of the manufacturing method, as shown in FIG. 9, the pair of metal lead wires 20 covered with the intermediate cover 50 in the previous covering step is formed of the mold 100 that has been opened. Set in molding cavity 101. At this time, in the setting process of the present embodiment, the temperature sensitive element 10 and the pair of metal terminals 30 covered by the intermediate cover 50 in the previous covering process are also set in the molding cavity 101 of the mold 100 that has been opened. To do. In such a setting process, the pair of metal lead wires 20 and the pair of metal terminals 30 are set together with the temperature sensing element 10 in a direction Do perpendicular to the reference direction Db.
　製造方法の第三段階としてＳ１０３の注入工程では、図１０に示すように、先のセット工程により一対の金属リード線２０等が成形キャビティ１０１内にセットされたモールド成形金型１００を型閉且つ型締した状態下、溶融させた樹脂材料を成形キャビティ１０１内に注入する。このとき本実施形態のセット工程では、モールド成形金型１００において一対の金属リード線２０を直交方向Ｄｏに挟む両側のうち、一方側としての金属リード線２０ａ側に設けられたゲート１０２のみから、溶融樹脂材料が注入される。こうした片側ゲート式でのモールド成形では、注入された溶融樹脂材料は、一対の金属リード線２０を直交方向Ｄｏに挟む両側のうち一方側としての金属リード線２０ａ側から、他方側としての金属リード線２０ｂ側へ向かって流動する。 In the injection step of S103 as the third step of the manufacturing method, as shown in FIG. 10, the mold 100 having the pair of metal lead wires 20 and the like set in the molding cavity 101 by the previous setting step is closed and In a state where the mold is clamped, the molten resin material is injected into the molding cavity 101. At this time, in the setting step of the present embodiment, only the gate 102 provided on the metal lead wire 20a side as one side among the both sides sandwiching the pair of metal lead wires 20 in the orthogonal direction Do in the molding die 100, Molten resin material is injected. In such a one-sided gate type molding, the injected molten resin material is obtained from the metal lead wire 20a as one side of the both sides sandwiching the pair of metal lead wires 20 in the orthogonal direction Do, and the metal lead as the other side. It flows toward the line 20b side.
　ここで本実施形態の注入工程では、モールド成形後の樹脂ケーシング４０を強化するために、繊維状フィラーを溶融樹脂材料に含有させている。その結果、樹脂ケーシング４０の外形を補完する成形キャビティ１０１内では、ゲート１０２に近い一方側の金属リード線２０ａの周囲にて、繊維状フィラーの繊維配向が基準方向Ｄｂに沿い易くなる。一方、そうした成形キャビティ１０１内では、ゲート１０２から遠い他方側の金属リード線２０ｂの周囲にて、繊維状フィラーの繊維配向が基準方向Ｄｂには沿わずに、例えば直交方向Ｄｏに沿い易くなる。 Here, in the injection step of this embodiment, in order to reinforce the resin casing 40 after molding, a fibrous filler is included in the molten resin material. As a result, in the molding cavity 101 that complements the outer shape of the resin casing 40, the fiber orientation of the fibrous filler is easily along the reference direction Db around the metal lead wire 20 a on one side close to the gate 102. On the other hand, in such a molding cavity 101, the fiber orientation of the fibrous filler does not follow along the reference direction Db around the metal lead wire 20b on the other side far from the gate 102, for example, easily along the orthogonal direction Do.
　製造方法の第四段階としてＳ１０４の固化工程では、図１１に示すように、先の注入工程にて成形キャビティ１０１内に注入された溶融樹脂材料の冷却により、溶融樹脂材料を固化させて樹脂ケーシング４０を形成する。このとき本実施形態の固化工程では、上述した注入工程での繊維状フィラーに関する繊維配向の違いにより、一方側の金属リード線２０ａの周囲にて、他方側の金属リード線２０ｂの周囲よりも小さな線膨張係数αｃが基準方向Ｄｂに与えられる。以上の結果、温度センサ１が完成することになる。 In the solidification step of S104 as the fourth stage of the manufacturing method, as shown in FIG. 11, the molten resin material is solidified by cooling the molten resin material injected into the molding cavity 101 in the previous injection step, and the resin casing. 40 is formed. At this time, in the solidification process of the present embodiment, the circumference of the metal lead wire 20a on one side is smaller than the circumference of the metal lead wire 20b on the other side due to the difference in fiber orientation with respect to the fibrous filler in the injection process described above. A linear expansion coefficient αc is given in the reference direction Db. As a result, the temperature sensor 1 is completed.
　ここまで説明した温度センサ１の作用効果を、以下に説明する。 The operation and effect of the temperature sensor 1 described so far will be described below.
　温度センサ１では、モールド成形により樹脂ケーシング４０にインサートされる金属リード線２０と、樹脂ケーシング４０との間には、中間カバー５０が介在した状態となる。ここで、金属リード線２０の延伸部２１が延伸する基準方向Ｄｂにおいて中間カバー５０の線膨張係数αｍは、中間カバー５０を形成する特定材料により、金属リード線２０よりも大きく且つ樹脂ケーシング４０よりも小さく与えられる。故に、高温環境での使用下にあっても、基準方向Ｄｂでは中間カバー５０の熱膨張量を、樹脂ケーシング４０の熱膨張量よりも金属リード線２０の熱膨張量に可及的に近づけ得る。しかも、金属リード線２０と中間カバー５０との基準方向Ｄｂの線膨張係数差Δαが特定範囲に設定されるので、設定値に応じて金属リード線２０に発生する発生応力σは、金属リード線２０の引張強度Ｓｌより小さく制限される。これにより金属リード線２０では、発生応力σが引張強度Ｓｌを超えて断線を招く事態を抑制できるので、高い歩留まりを達成することが可能となる。 In the temperature sensor 1, the intermediate cover 50 is interposed between the metal lead wire 20 inserted into the resin casing 40 by molding and the resin casing 40. Here, in the reference direction Db in which the extending portion 21 of the metal lead wire 20 extends, the linear expansion coefficient αm of the intermediate cover 50 is larger than that of the metal lead wire 20 and from the resin casing 40 due to the specific material forming the intermediate cover 50. Is also given small. Therefore, even under use in a high temperature environment, the thermal expansion amount of the intermediate cover 50 can be as close as possible to the thermal expansion amount of the metal lead wire 20 rather than the thermal expansion amount of the resin casing 40 in the reference direction Db. . Moreover, since the linear expansion coefficient difference Δα in the reference direction Db between the metal lead wire 20 and the intermediate cover 50 is set in a specific range, the generated stress σ generated in the metal lead wire 20 according to the set value is the metal lead wire. The tensile strength S1 is limited to be smaller than 20. As a result, in the metal lead wire 20, it is possible to suppress a situation in which the generated stress σ exceeds the tensile strength S 1 and causes disconnection, so that a high yield can be achieved.
　また、温度センサ１の金属リード線２０において、中間カバー５０との基準方向Ｄｂの線膨張係数差Δαに応じて発生する発生応力σは、線膨張係数差Δαと基準方向Ｄｂのヤング率Ｙｌと使用温度範囲ΔＴとの乗算値（Δα×Ｙｌ×ΔＴ）により、推定し得る。そこで、式４の関係Δα＜Ｓｌ／（Ｙｌ×ΔＴ）を満たす特定範囲に線膨張係数差Δαを設定することによれば、金属リード線２０では、発生応力σを引張強度Ｓｌよりも確実に小さく制限して断線を抑制できる。故に、高い歩留まりの達成に対する信頼度を、向上させることが可能となる。 Further, in the metal lead wire 20 of the temperature sensor 1, the generated stress σ generated according to the linear expansion coefficient difference Δα in the reference direction Db with respect to the intermediate cover 50 is the linear expansion coefficient difference Δα and the Young's modulus Yl in the reference direction Db. It can be estimated by a multiplication value (Δα × Yl × ΔT) with the operating temperature range ΔT. Therefore, by setting the linear expansion coefficient difference Δα within a specific range that satisfies the relationship Δα <Sl / (Yl × ΔT) in Equation 4, the generated stress σ is more reliably set than the tensile strength S1 in the metal lead wire 20. The wire breakage can be suppressed by limiting to a small value. Therefore, the reliability for achieving a high yield can be improved.
　さらに、温度センサ１によると、金属リード線２０の延伸部２１が延伸する基準方向Ｄｂにおいて中間カバー５０のヤング率Ｙｍは、中間カバー５０を形成する特定材料により、金属リード線２０よりも小さく且つ樹脂ケーシング４０よりも大きく与えられる。故に、高温環境での使用下にあっても、熱膨張量の大きな樹脂ケーシング４０による基準方向Ｄｂへの引張作用を中間カバー５０により吸収して、引張作用により金属リード線２０が同基準方向Ｄｂへ引張られるのを軽減し得る。これによれば、金属リード線２０に発生する発生応力σを低減させて断線を抑制できるので、高い歩留まりの達成に貢献可能となる。 Furthermore, according to the temperature sensor 1, the Young's modulus Ym of the intermediate cover 50 in the reference direction Db in which the extending portion 21 of the metal lead wire 20 extends is smaller than that of the metal lead wire 20 due to the specific material forming the intermediate cover 50 and It is given larger than the resin casing 40. Therefore, even under use in a high temperature environment, the tensile action in the reference direction Db by the resin casing 40 having a large thermal expansion amount is absorbed by the intermediate cover 50, and the metal lead wire 20 is caused to be in the same reference direction Db by the tensile action. Can be reduced. According to this, since the generated stress σ generated in the metal lead wire 20 can be reduced and the disconnection can be suppressed, it is possible to contribute to the achievement of a high yield.
　さらに、温度センサ１のように、繊維状フィラー含有の樹脂材料から樹脂ケーシング４０をモールド成形すると、モールド成形金型１００におけるゲート１０２の形成位置に応じて、樹脂ケーシング４０の各箇所における線膨張係数αｃは変動する場合がある。そこで基準方向Ｄｂでは、特定材料により形成される中間カバー５０の線膨張係数αｍにつき、それより小さな線膨張係数αｌの金属リード線２０との線膨張係数差Δαが特定範囲に収まる限りで、樹脂ケーシング４０の最小の線膨張係数αｃより小さく与えられる。これによれば、樹脂ケーシング４０の任意箇所での熱膨張量よりも中間カバー５０の熱膨張量が金属リード線２０の熱膨張量に確実に近づくことで、金属リード線２０では、発生応力σが引張強度Ｓｌよりも小さく制限されて断線が抑制され得る。故に、高い歩留まりの達成に貢献可能となる。 Further, when the resin casing 40 is molded from a resin material containing a fibrous filler as in the temperature sensor 1, the linear expansion coefficient at each location of the resin casing 40 according to the formation position of the gate 102 in the molding die 100. αc may vary. Therefore, in the reference direction Db, as long as the linear expansion coefficient difference Δα with the metal lead wire 20 having a smaller linear expansion coefficient αl is within a specific range with respect to the linear expansion coefficient αm of the intermediate cover 50 formed of the specific material, the resin It is smaller than the minimum linear expansion coefficient αc of the casing 40. According to this, since the amount of thermal expansion of the intermediate cover 50 surely approaches the amount of thermal expansion of the metal lead wire 20 rather than the amount of thermal expansion at an arbitrary location of the resin casing 40, the generated stress σ is generated in the metal lead wire 20. Is limited to be smaller than the tensile strength S1 and disconnection can be suppressed. Therefore, it is possible to contribute to achieving a high yield.
　さらに、温度センサ１の製造方法では、中間カバー５０により被覆された一対の金属リード線２０を、基準方向Ｄｂに対する直交方向Ｄｏに並べて、感温素子１０と共に、モールド成形金型１００の成形キャビティ１０１内へとセットする。こうしたモールド成形金型１００では、セットされた一対の金属リード線２０を直交方向Ｄｏに挟む両側のうち一方側に設けられたゲート１０２から、当該両側のうち一方側と他方側とへ向かって、溶融樹脂材料を成形キャビティ１０１内へと注入することになる。その結果、成形キャビティ１０１内に注入された溶融樹脂材料の固化により形成される樹脂ケーシング４０では、ゲート１０２に近い一方側の金属リード線２０ａの周囲にて、同ゲート１０２から遠い他方側の金属リード線２０ｂの周囲よりも高い線膨張係数αｃが、基準方向Ｄｂに与えられる。これは、一方側の金属リード線２０ａの周囲では、基準方向Ｄｂに沿って溶融樹脂材料が流動するのに対して、他方側の金属リード線２０ｂの周囲では、同基準方向Ｄｂには沿わずに例えば直交方向Ｄｏに沿って溶融樹脂材料が流動することで、繊維状フィラーの繊維配向に違いが生じることによる。 Further, in the manufacturing method of the temperature sensor 1, the pair of metal lead wires 20 covered with the intermediate cover 50 are arranged in the direction Do perpendicular to the reference direction Db, and together with the temperature sensing element 10, the molding cavity 101 of the molding die 100. Set in. In such a molding die 100, from the gate 102 provided on one side of both sides sandwiching the set pair of metal lead wires 20 in the orthogonal direction Do, toward one side and the other side of the both sides, The molten resin material is injected into the molding cavity 101. As a result, in the resin casing 40 formed by solidification of the molten resin material injected into the molding cavity 101, the metal on the other side far from the gate 102 around the metal lead wire 20 a on one side near the gate 102. A linear expansion coefficient αc higher than that around the lead wire 20b is given in the reference direction Db. This is because the molten resin material flows along the reference direction Db around the metal lead wire 20a on one side, but does not follow the reference direction Db around the metal lead wire 20b on the other side. For example, when the molten resin material flows along the orthogonal direction Do, a difference occurs in the fiber orientation of the fibrous filler.
　しかし、本実施形態により製造される温度センサ１の基準方向Ｄｂでは、中間カバー５０の線膨張係数αｍは、それより小さな各金属リード線２０（２０ａ，２０ｂ）の線膨張係数αｌとの線膨張係数差Δαが特定範囲に収まる限りで、樹脂ケーシング４０の最小の線膨張係数αｃより小さく与えられる。これによれば、樹脂ケーシング４０の任意箇所での熱膨張量よりも中間カバー５０の熱膨張量が各金属リード線２０の熱膨張量に確実に近づくことで、それら各金属リード線２０では、発生応力σが引張強度Ｓｌよりも小さく制限されて断線が抑制され得る。故に、高い歩留まりの達成に貢献可能となるのである。 However, in the reference direction Db of the temperature sensor 1 manufactured according to the present embodiment, the linear expansion coefficient αm of the intermediate cover 50 is linearly expanded with the linear expansion coefficient αl of each metal lead wire 20 (20a, 20b) smaller than that. As long as the coefficient difference Δα is within the specific range, the coefficient is given smaller than the minimum linear expansion coefficient αc of the resin casing 40. According to this, since the amount of thermal expansion of the intermediate cover 50 surely approaches the amount of thermal expansion of each metal lead wire 20 rather than the amount of thermal expansion at an arbitrary location of the resin casing 40, The generated stress σ is limited to be smaller than the tensile strength Sl, and disconnection can be suppressed. Therefore, it can contribute to the achievement of a high yield.
　（他の実施形態）
　以上、本開示の一実施形態について説明したが、本開示は、当該実施形態に限定して解釈されるものではなく、本開示の要旨を逸脱しない範囲内において種々の実施形態に適用することができる。 (Other embodiments)
Although one embodiment of the present disclosure has been described above, the present disclosure is not construed as being limited to the embodiment, and can be applied to various embodiments without departing from the gist of the present disclosure. it can.
　具体的に変形例１としては、例えば橋梁周辺の外気温度センシング（冬凍結注意喚起の外気温度表示用）等の車両以外において、温度センサ１を使用してもよい。 Specifically, as a first modification, for example, the temperature sensor 1 may be used in vehicles other than a vehicle such as an outside air temperature sensing around a bridge (for displaying an outside air temperature in order to alert a freezing winter).
　変形例２としては中間カバー５０のヤング率Ｙｍを、樹脂ケーシング４０のヤング率Ｙｃよりも小さく設定してもよい。また、変形例３としては、樹脂ケーシング４０を形成する特定材料に、繊維状フィラーを含有させなくてもよい。さらに、変形例４としては、中間カバー５０を形成する特定材料に、繊維状フィラーを含有させなくてもよい。 As a second modification, the Young's modulus Ym of the intermediate cover 50 may be set smaller than the Young's modulus Yc of the resin casing 40. Moreover, as the modification 3, the specific material which forms the resin casing 40 does not need to contain a fibrous filler. Furthermore, as a fourth modification, the specific material forming the intermediate cover 50 may not contain a fibrous filler.
　変形例５としては傾斜部２２を設けないで、実質延伸部２１のみから金属リード線２０を構成してもよい。また、変形例６としては金属ターミナル３０を設けないで、金属リード線２０を外部回路に対して電気的に接続可能としてもよい。 As a fifth modified example, the metal lead wire 20 may be configured only from the substantially extending portion 21 without providing the inclined portion 22. Further, as a sixth modified example, the metal lead wire 20 may be electrically connected to an external circuit without providing the metal terminal 30.
　変形例７としては図１２に示すように、一対の金属リード線２０を直交方向Ｄｏに挟む両側にそれぞれ設けられたゲート１０２から、溶融樹脂材料を成形キャビティ１０１内に注入することで、樹脂ケーシング４０をモールド成形してもよい。また、変形例８としては、上述の実施形態及び変形例７とは異なる位置関係にてゲート１０２を設けたモールド成形金型１００により、樹脂ケーシング４０をモールド成形してもよい。 As a modified example 7, as shown in FIG. 12, a molten resin material is injected into a molding cavity 101 from gates 102 provided on both sides sandwiching a pair of metal lead wires 20 in the orthogonal direction Do, thereby forming a resin casing. 40 may be molded. Further, as the eighth modification, the resin casing 40 may be molded by the molding die 100 provided with the gate 102 in a positional relationship different from that of the above-described embodiment and the seventh modification.
　変形例９としては感温素子１０を、被覆工程Ｓ１０１では中間カバー５０により被覆しないで、セット工程Ｓ１０２では成形キャビティ１０１内に露出させてもよい。また、変形例１０としては金属ターミナル３０を、被覆工程Ｓ１０１では中間カバー５０により被覆しないで、セット工程Ｓ１０２では成形キャビティ１０１内に露出させてもよい。さらに、変形例１１としては樹脂材料のダブルモールド成形により、中間カバー５０及び樹脂ケーシング４０を順次形成してもよい。 As a ninth modification, the temperature sensitive element 10 may not be covered with the intermediate cover 50 in the covering step S101 and may be exposed in the molding cavity 101 in the setting step S102. Further, as a tenth modification, the metal terminal 30 may not be covered with the intermediate cover 50 in the covering step S101 and may be exposed in the molding cavity 101 in the setting step S102. Furthermore, as a modified example 11, the intermediate cover 50 and the resin casing 40 may be sequentially formed by double molding of a resin material.
　本開示は、実施例に準拠して記述されたが、本開示は当該実施例や構造に限定されるものではないと理解される。本開示は、様々な変形例や均等範囲内の変形をも包含する。加えて、様々な組み合わせや形態、さらには、それらに一要素のみ、それ以上、あるいはそれ以下、を含む他の組み合わせや形態をも、本開示の範疇や思想範囲に入るものである。

  Although the present disclosure has been described with reference to the embodiments, it is understood that the present disclosure is not limited to the embodiments and structures. The present disclosure includes various modifications and modifications within the equivalent range. In addition, various combinations and forms, as well as other combinations and forms including only one element, more or less, are within the scope and spirit of the present disclosure.

Claims (5)

  1. 　温度を感知する感温素子（１０）と、
    　金属材料から形成され、基準方向（Ｄｂ）に沿って延伸する延伸部（２１）を有し、前記感温素子に対して電気的に接続される金属リード線（２０，２０ａ，２０ｂ）と、
    　樹脂材料から形成され、モールド成形により前記金属リード線がインサートされた樹脂ケーシング（４０）と、
    　前記基準方向において線膨張係数を前記金属リード線よりも大きく且つ前記樹脂ケーシングよりも小さく与える特定材料から、形成され、前記樹脂ケーシングと前記金属リード線との間に介在する中間カバー（５０）とを、備え、
    　前記金属リード線と前記中間カバーとの前記基準方向の線膨張係数差は、前記線膨張係数差に応じて前記金属リード線に発生する発生応力を前記金属リード線の引張強度よりも小さく制限する特定範囲に、設定される温度センサ。     A temperature sensing element (10) for sensing temperature;
    A metal lead wire (20, 20a, 20b) that is formed of a metal material, has an extending portion (21) extending along the reference direction (Db), and is electrically connected to the temperature sensitive element;
    A resin casing (40) formed of a resin material and inserted with the metal lead wire by molding;
    An intermediate cover (50) formed from a specific material that gives a linear expansion coefficient larger than the metal lead wire and smaller than the resin casing in the reference direction and interposed between the resin casing and the metal lead wire; With
    The difference in linear expansion coefficient between the metal lead wire and the intermediate cover in the reference direction limits the generated stress generated in the metal lead wire in accordance with the difference in linear expansion coefficient to be smaller than the tensile strength of the metal lead wire. Temperature sensor set to a specific range.
  2. 　前記基準方向の前記線膨張係数差をΔαと定義し、
    　前記金属リード線の前記引張強度をＳｌと定義し、
    　前記金属リード線の前記基準方向のヤング率をＹｌと定義し、
    　想定される使用温度範囲をΔＴと定義すると、
    　前記線膨張係数差は、Δα＜Ｓｌ／（Ｙｌ×ΔＴ）の関係を満たす前記特定範囲に、設定される請求項１に記載の温度センサ。     Define the linear expansion coefficient difference in the reference direction as Δα,
    The tensile strength of the metal lead wire is defined as Sl,
    The Young's modulus in the reference direction of the metal lead wire is defined as Yl,
    If the assumed operating temperature range is defined as ΔT,
    The temperature sensor according to claim 1, wherein the difference in linear expansion coefficient is set in the specific range that satisfies a relationship of Δα <Sl / (Yl × ΔT).
  3. 　前記中間カバーは、前記基準方向においてヤング率を前記金属リード線よりも小さく且つ前記樹脂ケーシングよりも大きく与える前記特定材料から、形成される請求項１又は２に記載の温度センサ。 3. The temperature sensor according to claim 1, wherein the intermediate cover is formed from the specific material that gives Young's modulus smaller than the metal lead wire and larger than the resin casing in the reference direction.
  4. 　前記樹脂ケーシングは、繊維状フィラーを含有する前記樹脂材料から、前記モールド成形により形成され、
    　前記基準方向において前記中間カバーの線膨張係数は、前記樹脂ケーシングの最小の線膨張係数よりも小さい請求項１～３のいずれか一項に記載の温度センサ。     The resin casing is formed from the resin material containing a fibrous filler by the molding,
    The temperature sensor according to any one of claims 1 to 3, wherein a linear expansion coefficient of the intermediate cover in the reference direction is smaller than a minimum linear expansion coefficient of the resin casing.
  5. 　請求項４に記載の温度センサの製造方法であって、
    　一対の前記金属リード線を前記中間カバーにより被覆する被覆工程（Ｓ１０１）と、
    　前記被覆工程にて前記中間カバーにより被覆された一対の前記金属リード線を、前記基準方向に対する直交方向（Ｄｏ）に並べて、前記感温素子と共に、モールド成形金型（１００）の成形キャビティ（１０１）内にセットするセット工程（Ｓ１０２）と、
    　前記モールド成形金型において、前記セット工程によりセットされた一対の前記金属リード線を前記直交方向に挟む両側のうち一方側に設けられたゲート（１０２）から、当該両側のうち前記一方側と他方側とへ向かって、溶融した前記樹脂材料を前記成形キャビティ内に注入する注入工程（Ｓ１０３）と、
    　前記注入工程にて前記成形キャビティ内に注入された前記樹脂材料を固化させることにより、前記樹脂ケーシングを形成する固化工程（Ｓ１０４）とを、含む温度センサの製造方法。

          It is a manufacturing method of the temperature sensor according to claim 4,
    A covering step (S101) for covering the pair of metal lead wires with the intermediate cover;
    A pair of the metal lead wires covered with the intermediate cover in the covering step are arranged in a direction orthogonal to the reference direction (Do), and together with the temperature sensitive element, a molding cavity (101) of the molding die (100). ) In the setting step (S102),
    In the molding die, from the gate (102) provided on one side of both sides sandwiching the pair of metal lead wires set in the setting step in the orthogonal direction, the one side and the other of the both sides An injection step (S103) for injecting the molten resin material into the molding cavity toward the side;
    A method of manufacturing a temperature sensor, comprising: a solidifying step (S104) of forming the resin casing by solidifying the resin material injected into the molding cavity in the injection step.

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