KR101789654B1 - Temperature sensor and method for manufacturing the temperature sensor - Google Patents

Temperature sensor and method for manufacturing the temperature sensor Download PDF

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Publication number
KR101789654B1
KR101789654B1 KR1020160022592A KR20160022592A KR101789654B1 KR 101789654 B1 KR101789654 B1 KR 101789654B1 KR 1020160022592 A KR1020160022592 A KR 1020160022592A KR 20160022592 A KR20160022592 A KR 20160022592A KR 101789654 B1 KR101789654 B1 KR 101789654B1
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South Korea
Prior art keywords
sensor
case
substrate
wiring
tip
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KR1020160022592A
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Korean (ko)
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KR20170100258A (en
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방서연
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(주)에스엠지
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/16—Elements for restraining, or preventing the movement of, parts, e.g. for zeroising
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K2007/163—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements provided with specially adapted connectors

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

A temperature sensor and a manufacturing method thereof are disclosed. The temperature sensor according to the present invention includes a sensor tip for temperature sensing and a wiring protection tube for protecting the wiring extending from the sensor tip. The sensor tip and the wiring protection tube can be separated. According to another aspect of the present invention, there is provided a method of manufacturing a temperature sensor, comprising: inserting a sensor assembly into a case of a sensor tip; Filling the case with a filling material; And bonding the wiring protection tube to the case. According to the present invention, since the sensor substrate including the sensor element is inserted into the case of the relatively short length sensor tip separately manufactured, the positional alignment of the sensor element is facilitated, and the same response can be maintained in all directions. In addition, since the filler is filled in the sensor tip having a relatively short length, it is advantageous in reducing the amount of filling material and reducing the filling time, and it is unnecessary to provide a separate vibration device, thereby minimizing the initial facility construction cost.

Description

TECHNICAL FIELD [0001] The present invention relates to a temperature sensor and a manufacturing method thereof,

The present invention relates to a temperature sensor. More particularly, the present invention relates to a temperature sensor that improves alignment accuracy of a sensor element and facilitates the filling of a filler, and a method of manufacturing the same.

Temperature sensors are used in a variety of applications in the industrial field. Thermocouple, thermistor (NTC), resistance temperature detector (Resistance Temperature Detector) and so on are typical examples of the temperature sensor, and infrared pyrometer sensor, acoustic temperature sensor, and optical fiber temperature sensor.

The sensor element, which is an important element of the temperature sensor, is usually manufactured by sintering a transition metal oxide at a high temperature. For example, a transition metal oxide such as Fe 2 O 3 -NiO-Cr 2 O 3 -MnO 2 is mixed, And a lead wire such as Ni, Pt, Au, or Cu is bonded to the surface of the test piece by printing or plating an electrode on the surface of the test piece.

The sensor element thus manufactured senses that the electrical resistance of the metal conductor changes according to the temperature, and the temperature is measured. In the case of high purity platinum, it is linear compared with other metals and the temperature coefficient is high, so that it is possible to measure the temperature with high accuracy. According to the shape of the tip of the sensor element, it can be classified into two types of connection method of 2-wire, 3-wire and 4-wire type according to the accuracy of temperature measurement.

Such a sensor element is connected to a wiring connected to a microcomputer or the like, and the sensor element and the wiring are protected by being inserted into a hollow tube whose one side is closed. At this time, the hollow tube is filled with the filler, and the sensor element and the wire are fixed by the filler.

However, since the hollow tube is formed long in the longitudinal direction, it is difficult to precisely locate the sensor element at the center of the end near the closed end of the hollow tube. In addition, the alignment (including the direction) may be changed by the filler filling the hollow tube. In addition, when the filler is filled in the hollow tube, the hollow tube is vibrated so as to prevent microbubbles from being generated. In this case, dust is generated, which is not good for the health of the worker, .

Therefore, there is a need for a method of accurately positioning the sensor element in the center and solving the filling problem.

Korea Patent Office Registration No. 10-0998000, "Injection-type temperature sensor structure and manufacturing method thereof"

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a sensor tip for housing a sensor substrate including a sensor element and a wiring protection tube for protecting the wiring, The present invention also provides a temperature sensor for accurately aligning a sensor element by filling a filler and inserting a sensor substrate into a sensor tip of a sensor chip, and to easily perform filling.

According to an aspect of the present invention, there is provided a temperature sensor, comprising: a sensor tip for temperature sensing; And a wiring protection tube for protecting the wiring extending from the sensor tip, wherein the sensor tip and the wiring protection tube are separable.

At this time, a tube for wiring and protection can be coupled to the end of the wiring protection tube. The tube may be a heat-shrinkable tube.

Meanwhile, the sensor tip includes a case forming an outer shape and having a hollow formed therein; And a sensor assembly mounted in the hollow interior of the case.

The sensor assembly includes: a substrate; A sensor element formed at one end of the substrate; And a pattern electrode having one end connected to the sensor element and the other end connected to the wiring. At this time, a tuck may be formed on the case inlet side, a stopper of the substrate may be seated on the jaw, or a seating portion may be formed on the substrate to maintain the sensor element at a predetermined height from the case bottom surface . A guide groove for guiding the substrate may be formed on an inner wall of the case.

Meanwhile, a filler filled in the case may be used, and the filler may be at least one of epoxy and magnesium oxide.

Meanwhile, the method of manufacturing a temperature sensor of the present invention preferably includes: inserting a sensor assembly into a case of a sensor tip; Filling the case with a filling material; And bonding the wiring protection tube to the case.

The method may further include the step of joining a tube for wiring and protection to the end of the wiring protection tube.

The manufacturing of the sensor assembly includes: forming a sensor element and a pattern electrode on a substrate; Connecting the sensor element and one end of the pattern electrode with a lead wire; And connecting the wiring to the other end of the pattern electrode.

The filler may be at least one of epoxy and magnesium oxide.

The connection between the sensor tip and the wiring protection tube may be performed by any of an adhesive method, a screw method, and a fitting method.

As described above, according to the temperature sensor and the method of manufacturing the same according to the present invention, since the sensor substrate including the sensor element is inserted into the case of the sensor tip having a relatively short length, which is manufactured separately and separately, It is possible to maintain the same speed of response between the products.

In addition, since the position of the sensor element can be accurately aligned through adjustment of the case inner diameter of the sensor tip and the width of the sensor substrate, or a structure for aligning the case of the sensor tip and the sensor substrate selectively, It is possible to prevent the difference in the speed of the response due to the misalignment.

In addition, since the filler is filled in the sensor tip having a relatively short length, it is advantageous in reducing the amount of filling material and reducing the filling time. In addition, since it is not necessary to provide a separate vibration device, It is possible to minimize the facility construction cost.

1 is a configuration diagram of a temperature sensor according to an embodiment of the present invention.
2 is an exploded view of a temperature sensor according to an embodiment of the present invention.
3 is a configuration diagram of a sensor tip according to an embodiment of the present invention.
4 is a configuration diagram of a sensor tip according to another embodiment of the present invention.
5 is a modification of the case of the present invention.
6 is a configuration diagram of a sensor tip according to another embodiment of the present invention.
7 is a configuration diagram of a sensor assembly according to an embodiment of the present invention.
8 is a flowchart illustrating a method of manufacturing a temperature sensor according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Hereinafter, the present invention will be described in detail with reference to preferred embodiments of the present invention and the accompanying drawings, wherein like reference numerals refer to like elements.

It is to be understood that when an element is referred to as being "comprising" another element in the description of the invention or in the claims, it is not to be construed as being limited to only that element, And the like.

Also, in the description of the invention or the claims, the components named as "means", "parts", "modules", "blocks" refer to units that process at least one function or operation, Each of which may be implemented by software or hardware, or a combination thereof.

Hereinafter, an embodiment in which the temperature sensor of the present invention and its manufacturing method are implemented will be described with reference to specific embodiments.

1 is a configuration diagram of a temperature sensor according to an embodiment of the present invention.

1, a temperature sensor according to the present invention includes a sensor tip 1 to which temperature sensing is performed, a wiring protection tube 2 coupled to the sensor tip 1, 2 through the wiring 3.

At this time, the sensor tip 1 and the wiring protection tube 2 exist as independent bodies, and the sensor tip 1 and the wiring protection tube 2 are combined to constitute a temperature sensor.

On the other hand, at the end of the wiring protection tube 2, a tube 4 for arranging and protecting the wiring 3 can be coupled.

The sensor tip 1 may be made of various materials, preferably made of a metal material. Specifically, it is preferable to use a metal material having a good thermal conductivity such as stainless steel or brass.

The wiring protection tube 2 may be made of a metal material, a plastic material, or the like. When the wiring protection tube 2 is made of a metal material, it is preferably the same as the material of the sensor tip 1.

The tube 4 can be a heat-shrinkable tube which is contracted by heat.

The temperature sensor thus constructed is constituted by the sensor tip 1 and the wiring protection tube 2 being combined. That is, the sensor tip 1 and the wiring protection tube 2 are separated and separately manufactured for improving the alignment accuracy and ease of filling process, and then they are combined. In the conventional method, the sensor element 1 and the wiring protection tube 2 are combined in the length of the integral hollow tube and the filling process is filled in the integral hollow tube. However, in the present invention, Since the wiring protection tube 2 is separately separated, not only the sensor element is aligned with the sensor tip 1 having a relatively short length but also the filler is filled only in the sensor tip 1, the alignment accuracy is improved and the filling process is facilitated It will be done.

2 is an exploded view of a temperature sensor according to an embodiment of the present invention.

Referring to FIG. 2, in the temperature sensor of the present invention, the sensor tip 1, the wiring protection tube 2, and the tube 4 are separately manufactured and combined to complete the temperature sensor.

The connection between the sensor tip 1 and the wiring protection tube 2 can be performed by various methods such as an adhesion method, a screw method, and a fitting method.

By using the heat shrinkable tube as the tube 4, one end of the wiring protection tube 2 and the wiring 3 can be joined through contraction of the heat shrinkable tube.

Since the sensor tip 1 and the wiring protection tube 2 are separately manufactured and then combined, the temperature sensor can be completed by simple coupling when the process in the sensor tip 1 is completed. Thus, the process is simplified do. Also, the process of the sensor tip 1 may be a simple process of simply placing the sensor assembly in the hollow of the sensor tip 1 and filling the filler. This simplifies the process and reduces the process time.

In the temperature sensor thus configured, the sensor tip 1 has a built-in sensor assembly to perform a temperature sensing function, and the wiring protection tube 2 is extended by penetrating the wiring 3 connected thereto in the sensor assembly And functions to protect the wiring 3. The tube 4 functions to prevent alignment and disconnection of the wiring 3 by using a heat-shrinkable tube.

FIG. 3 is a configuration diagram of a sensor tip according to an embodiment of the present invention, and FIG. 4 is a configuration diagram of a sensor tip according to another embodiment of the present invention.

3 and 4, the sensor tip 1 of the present invention includes a case 11 having an outer shape and a hollow formed therein, a sensor assembly (not shown) installed in the hollow interior of the case 11 12).

The case 11 has a cylindrical shape with one side closed, and is preferably made of a metal material. When the case 11 is made of a metal material, the response speed can be improved.

It is preferable that the width of the sensor assembly 12 is set to be slightly smaller than the inner diameter of the case 11 so that the sensor element 122 of the sensor assembly 12 is positioned at the center of the bottom of the case 11 Do.

Since the sensor assembly 12 is held at a position passing through the center of the case 11, only the filling material can be filled without a separate alignment process.

In addition, since only the height of the end portion of the case 11 can be filled, the amount of filling material can be reduced, and the filling time can be reduced. In addition, there is no need to apply vibration to the case 11 as well.

Here, the filling material may be filled with an insulating material such as epoxy or magnesium oxide. As the magnesium oxide, it is preferable to use fused magnesia. The molten magnesia is obtained by melting CCM or DBM in an electric arc furnace at 2800 to 3000 ° C. The molten magnesia is used as an insulator by using high-purity magnesia of 99% or more of MgO.

3, the end portion of the substrate 121 of the sensor assembly 12 is tapered, and the center portion of the end portion is cut into the inside 121a, and the sensor element 122 is formed therebetween.

4, a stopper 121b is formed on the other side of the substrate 121 of the sensor assembly 12, and a tongue 11a is formed on the end of the case 11 so that the sensor element 122 is located on the bottom surface of the case 11 And has a predetermined interval.

5 is a modification of the case of the present invention.

Referring to FIG. 5, the case 11 of the present invention may have a guide groove H formed on its inner wall to fix the substrate 121 of the sensor assembly 12.

The sensor assembly 12 shown in FIGS. 3 and 4 can be rotated inside the case 11, while in the present embodiment, the sensor assembly 12 can be prevented from moving by fixing the sensor assembly 12 to the guide groove H. So that the sensor element 122 can have more accurate directionality.

6 is a configuration diagram of a sensor tip according to another embodiment of the present invention.

Referring to Fig. 6, this embodiment forms a screw thread or protrusion 11b at the end of the case 11 of Fig. That is, a screw thread or protrusion 11b is formed for coupling with the wiring protection tube 2, and a thread can be formed on one end of the wiring protection tube 2 so as to be coupled.

Of course, as described above, it is possible to combine the case 11 and the wiring protection pipe 2 by using various methods such as an adhesion method, a fitting method, and the like.

On the other hand, it is a matter of course that the formation of the thread or the projection 11b is also applicable to the case 11 in Fig.

The case 11 and the sensor assembly 12 shown in Figs. 3 to 6 can be deformed to the hollow shape of the case 11, and correspondingly, the substrate 121 of the sensor assembly 12 can be deformed, The shape can also be deformed. The length of the case 11 and the length of the sensor assembly 12 may be adjusted so that the height of the end of the case 11 and the height of the sensor assembly 12 may be kept the same.

The sensor tip 1 configured in this way ensures that the alignment in the sensor assembly 12 is precisely centered so that the responses in all directions can remain the same. That is, it is possible to prevent the difference in the sensing speed due to the misalignment of the center position of the sensor element 122.

The sensor assembly 12 may be manufactured in a cylindrical shape to be inserted into the inner diameter of the case 11, and the sensor assembly 12 may be installed inside the cylinder, and the main component of the cylinder may be an insulating material (epoxy, magnesium oxide) The process can be performed in a manner of combining the filling process.

7 is a configuration diagram of a sensor assembly according to an embodiment of the present invention.

7, the sensor assembly 12 of the present invention includes a substrate 121, a sensor element 122 formed at one end of the substrate 121, and a first end connected to the sensor element 122, 3).

An insulating material may cover the sensor element 122 and the pattern electrode 123 in order to prevent a short between the sensor element 122 and the pattern electrode 123 in correspondence with the material of the filler.

On the other hand, the sensor element 122 may include a platinum thin film and a protective film layer for protecting the platinum thin film. Platinum thin films are like other metals, and the resistance increases with increasing temperature. Using this resistive value and the proportional relationship of temperature, the temperature can be measured by changing the resistance value. High-purity platinum exhibits a linear resistance change with temperature, has excellent chemical and physical properties, and can be used at high temperatures. Of course, a positive temperature coefficient (PTC) or a negative temperature coefficient (NTC) thermistor may be used as the sensor element 122.

The sensor element 122 (platinum thin film) and the pattern electrode 123 are connected by a lead wire 124. The lead wire 124 is preferably made of platinum and may be covered with an insulating material to prevent a short circuit .

Hereinafter, a method of manufacturing the temperature sensor constructed as described above will be described.

8 is a flowchart illustrating a method of manufacturing a temperature sensor according to an embodiment of the present invention.

Referring to FIG. 8, a sensor element 122 and a pattern electrode 123 are formed on a substrate 121. One end of the sensor element 122 and one end of the pattern electrode 123 are connected to the lead wire 124 and the other end of the pattern electrode 123 is connected to the wiring 3. The step of forming the sensor element 122 includes a step of forming a platinum thin film and a protective film formed on the platinum thin film.

Then, the sensor element 122, the pattern electrode 123, and the lead wire 124 are covered with an insulating material.

Such a process may be performed through a separate semiconductor process for manufacturing the sensor assembly 12 (S1).

When the sensor assembly 12 is completed, the sensor assembly 12 is inserted into the case 11 of the sensor tip 1. At this time, the sensor assembly 12 is accurately aligned in the center of the case 11 by making the inner diameter of the case 11 and the substrate 121 of the sensor assembly 12 equal or similar. On the other hand, the guide groove H is accurately aligned with the center of the case 11 through the guide groove H formed on the inner wall of the case 11, the end 121a formed on the substrate 121 of the sensor assembly 12 and the stopper 121b ).

Then, the inside of the case 11 is filled with the filling material. As the filler, epoxy, magnesium oxide, or the like can be used (S3).

On the other hand, when the sensor tip 1 is completed, the separately formed wiring protection tube 2 is coupled with the sensor tip 1. At this time, the sensor tip 1 and the wiring protection tube 2 can be joined by various methods such as an adhesive method, a screw method, and a fitting method (S4).

When the sensor tip 1 and the wiring protection tube 2 are coupled as described above, the ends of the wiring protection tube 2 are finished using a heat shrinkable tube or the like. On the other hand, when the sensor tip 1 and the wiring protection tube 2 are bonded by a metal bond or the like, a heat-shrinkable tube may be applied to the junction of the sensor tip 1 and the wiring protection tube 2 in order to strengthen the bonding strength ).

The technical idea of the present invention has been described through several embodiments.

It will be apparent to those skilled in the art that various changes and modifications may be made to the embodiments described above from the description of the present invention. Further, although not explicitly shown or described, those skilled in the art can make various modifications including the technical idea of the present invention from the description of the present invention Which is still within the scope of the present invention. The above-described embodiments described with reference to the accompanying drawings are for the purpose of illustrating the present invention, and the scope of the present invention is not limited to these embodiments.

1: Sensor tip
2: Wiring shield
3: Wiring
4: tube

Claims (8)

Sensor tip with temperature sensing; And
And a wiring protection tube for protecting the wiring extending from the sensor tip,
Wherein the sensor tip and the wiring protection tube are separable,

The sensor tip includes:
A case which forms an outer shape and in which a hollow is formed; And
And a sensor assembly mounted in the hollow interior of the case,

The case has a cylindrical shape with one side closed,
The sensor assembly is formed on a substrate,
The width of the substrate is smaller than the inner diameter of the case to be within a predetermined range, and the substrate is automatically aligned at the center of the case,
Wherein a sensor element is held at a predetermined distance from a bottom surface of the case by a protrusion formed on the case and a stopper formed on the substrate.
delete The method according to claim 1,
The sensor assembly includes:
The substrate;
A sensor element formed at one end of the substrate; And
And a pattern electrode having one end connected to the sensor element and the other end connected to the wiring.
Inserting the sensor assembly into the case of the sensor tip;
Filling the case with a filling material; And
And bonding the wiring protection tube to the case,

The case has a cylindrical shape with one side closed,
The sensor assembly is formed on a substrate,
Wherein when the sensor assembly is inserted into the case, the width of the substrate is smaller than the inner diameter of the case so that the substrate is automatically aligned at the center of the case,
Wherein when the sensor assembly is inserted into the case, a sensor element is held at a predetermined distance from a bottom surface of the case by a protrusion formed on the case and a stopper formed on the substrate.
5. The method of claim 4,
And joining a tube for wiring arrangement and protection to the end of the wiring protection tube.
5. The method of claim 4,
The manufacture of the sensor assembly comprises:
Forming a sensor element and a pattern electrode on a substrate;
Connecting the sensor element and one end of the pattern electrode with a lead wire; And
And connecting a wiring to the other end of the pattern electrode.
5. The method of claim 4,
Wherein the filler is at least one selected from the group consisting of epoxy and magnesium oxide.
5. The method of claim 4,
The method of manufacturing a temperature sensor according to any one of the bonding method, the screw method and the fitting method is used for the connection between the sensor tip and the wiring protection pipe.
KR1020160022592A 2016-02-25 2016-02-25 Temperature sensor and method for manufacturing the temperature sensor KR101789654B1 (en)

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KR102348697B1 (en) * 2020-12-01 2022-01-07 고려대학교 세종산학협력단 Heavy metal detection electrode and manufacturing method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011043480A (en) * 2009-08-24 2011-03-03 Saginomiya Seisakusho Inc Temperature measurement sensor and temperature measuring device using the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011043480A (en) * 2009-08-24 2011-03-03 Saginomiya Seisakusho Inc Temperature measurement sensor and temperature measuring device using the same

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