JP6357328B2 - Infrared temperature sensor manufacturing method - Google Patents

Description

The present invention relates to a method for manufacturing an infrared temperature sensor that detects infrared rays from a detection object and measures the temperature of the detection object.

  Conventionally, for example, as a temperature sensor for measuring the temperature of an object to be detected such as a heat fixing roller used in a fixing device of a copying machine, infrared temperature from the object to be detected is detected in a non-contact manner, and the temperature of the object to be detected is measured. An infrared temperature sensor is used.

  Such an infrared temperature sensor is provided with a temperature-compensating thermal element in addition to the infrared detecting thermal element in order to improve the followability associated with the ambient temperature change and compensate for the ambient temperature change.

  Also, in order to make the temperature environment in which the infrared detecting thermal element and the temperature compensating thermal element are installed equal to improve the followability accompanying changes in the ambient temperature, it has an opening and corresponds to the infrared detecting thermal element. A light guide unit that guides infrared light and a shielding unit corresponding to the temperature-compensating thermosensitive element have been developed (see Patent Document 1 and Patent Document 2).

  By the way, when forming a light guide part, the area of an opening part may change by dispersion | variation in a process, a mold size, etc. In addition, variations may occur in the characteristics of the thermal element and the dimensions of the film on which the thermal element is disposed. Variation in each member constituting the infrared temperature sensor causes a change in output characteristics of each infrared temperature sensor.

  In order to correct such fluctuations in output characteristics, a variable protrusion is applied to the light guide part of the infrared temperature sensor to adjust the amount of incident infrared light by varying the protrusion distance into the light guide part. A device that corrects the variation in the temperature detected by the temperature sensor has been proposed (see Patent Document 3).

International Publication No. 2013/014707 JP 2003-194630 A JP 2002-156284 A

  However, in the thing shown in the said patent document 3, in order to provide a variable protrusion part, a structure becomes complicated and a number of parts increases, and after variable adjustment, a variable protrusion part can be fixed with an adhesive agent. Since this is necessary, it takes time to correct the variation, resulting in a problem that productivity is lowered.

The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an infrared temperature sensor manufacturing method that can easily perform a correction operation for fluctuations in output characteristics with a simple configuration.

The method of manufacturing an infrared temperature sensor according to claim 1, wherein a case having an opening having a light guide that guides infrared light and a shield having a shielding wall that shields infrared light, the light guide, A film that is disposed opposite to the shielding part and absorbs infrared rays that reach through the light guide part and an infrared detection film that is disposed on the film and disposed at a position corresponding to the light guide part. An infrared temperature sensor comprising a thermal element and a temperature-compensating thermal element disposed on the film and disposed at a position corresponding to the shielding part, wherein a part of the opening of the light guide part is removed A removing step for forming the viewing area to be enlarged, or a bonding step for forming the viewing area to be reduced by adhering an adhesive or an additional member to a part of the opening of the light guide section. It is characterized by that.

A thin film thermistor and a chip thermistor are suitably used as the infrared detecting thermal element and the temperature compensating thermal element, but are not limited thereto, and for example, a thermocouple or a resistance temperature detector can be used.
The configuration of removal and adhesion is not particularly limited as long as the amount of infrared light incident on the light guide unit can be adjusted in the field region expansion unit or the field region reduction unit.
According to such an invention, it is possible to easily perform a correction operation for fluctuations in output characteristics with a simple configuration.

Method for manufacturing an infrared temperature sensor according to claim 2, in the manufacturing method of the infrared temperature sensor according to claim 1, wherein the casing is made of a material having thermal conductivity, the light guiding portion and the blocking portion The part to be formed is made of a resin material.

The method for manufacturing an infrared temperature sensor according to claim 3 is the method for manufacturing the infrared temperature sensor according to claim 1 or 2, wherein the infrared temperature sensor protrudes to an inner peripheral side at least at one position in the opening of the light guide. The projection area is provided, and the projection area is removed to enlarge the visual field area, or the visual field area is reduced by adhering an adhesive or an additional member to the projection area. And a field-of-view reduced portion formed in the above.

Method for manufacturing an infrared temperature sensor according to claim 4 is the method for manufacturing an infrared temperature sensor according to any one of claims 1 to 3, a shielding unit and the light guide section, separating them It is characterized by being formed in a substantially symmetrical form with the partition wall as an axis.

Method for manufacturing an infrared temperature sensor according to claim 5, in the manufacturing method of the infrared temperature sensor according to any one of claims 1 to 4, the film is heat sensitive element and the temperature compensating infrared detection A wiring pattern to which the thermosensitive element is connected is formed, and the external lead terminal and the external lead wire connected to the wiring pattern are connected via a relay terminal.

Method for manufacturing an infrared temperature sensor according to claim 6 is a manufacturing method of the infrared temperature sensor according to claim 5, wherein the relay terminal, the light guide portion and formed resin material and integrally forming the shielding portion It is characterized by.

  The infrared temperature sensor can be used for various devices such as a fixing device of a copying machine, a battery unit, and an IH cooking heater. The applied device is not particularly limited.

ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the infrared temperature sensor which can perform the correction | amendment operation | work of the fluctuation | variation of an output characteristic easily with a simple structure can be provided.

It is a perspective view which shows the infrared temperature sensor which concerns on the 1st Embodiment of this invention. The infrared temperature sensor is shown, (a) is a plan view, (b) is a sectional view taken along line XX in (a), (c) is a sectional view taken along line YY in (a). FIG. In the infrared temperature sensor, (a) shows a state where a part of the light guide is removed, and (b) is a cross-sectional view showing a state where an adhesive is adhered to a part of the light guide. The infrared temperature sensor which concerns on the 2nd Embodiment of this invention is shown, (a) is a top view, (b) is sectional drawing along XX in (a). In the infrared temperature sensor, (a) is a cross-sectional view showing a state where a part of the light guide is removed, and (b) is a plan view showing a state where an adhesive is adhered to a part of the light guide. The infrared temperature sensor which concerns on the 3rd Embodiment of this invention is shown, (a) is a top view, (b) is sectional drawing along XX in (a). In the infrared temperature sensor, it is sectional drawing which shows the state which removed a part of light guide part. The infrared temperature sensor which concerns on the 4th Embodiment of this invention is shown, (a) is a top view, (b) is sectional drawing along XX in (a). In the infrared temperature sensor, it is sectional drawing which shows the state which removed a part of light guide part. The infrared temperature sensor which concerns on the 5th Embodiment of this invention is shown, (a) is a top view, (b) is sectional drawing which followed the XX line in (a). In the infrared temperature sensor, it is a top view which shows the state which adhere | attached the adhesive agent to a part of light guide part. The infrared temperature sensor which concerns on the 6th Embodiment of this invention is shown, (a) is a top view, (b) is sectional drawing along XX line in (a), (c) is sectional drawing, (c) is The top view for demonstrating wiring connection relation, (d) is sectional drawing which shows the state before connecting a lead wire. The infrared temperature sensor which concerns on the 7th Embodiment of this invention is shown, (a) is a top view, (b) is sectional drawing along the XX line in (a), (c) is sectional drawing, (c) is The top view for demonstrating wiring connection relation, (d) is sectional drawing which shows the state before connecting a lead wire.

  Hereinafter, an infrared temperature sensor according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 3. FIG. 1 is a perspective view of an infrared temperature sensor, FIG. 2 (a) is a plan view, and (b) and (c) are cross-sectional views. 3A shows a state where a part of the light guide is removed, and FIG. 3B shows a state where an adhesive is adhered to a part of the light guide.

  As shown in FIGS. 1 and 2, the infrared temperature sensor 1 includes a case 2, a film 3, an infrared detection thermal element 4 and a temperature compensation thermal element 5 disposed on the film 3. Yes.

  Case 2 includes a first case 21 and a second case 22. Specifically, the first case 21 is a holding body, and the second case 22 is a lid member. The case 2 is made of a resin material such as nylon, PBT, PPS, or ABS.

  The material forming the case 2 is not particularly limited, and a material obtained by adding a filler such as carbon, metal, or ceramic to a resin, a metal material such as aluminum, copper, iron, or nickel, or a black metal material. A body-coated material or the like can be used.

  The first case 21 includes a substantially rectangular parallelepiped main body portion 21a protruding to the front side (upper side in FIG. 2B) and a substantially rectangular flange portion 21b formed around the main body portion 21a. ing. The main body portion 21a is formed with a light guide portion 23 for guiding infrared rays and a shielding portion 24 for shielding infrared rays.

  The light guide 23 has an opening 23a on the front side, and is formed in a substantially rectangular parallelepiped cylindrical shape by a side wall 21c and a partition wall 21d. The partition wall 21 d is located at the boundary between the light guide 23 and the shield 24 and serves to partition the light guide 23 and the shield 24. In addition, you may make it form an infrared rays absorption layer in the inner peripheral surface of the light guide part 23 as needed, for example by performing black coating, an alumite process, etc. Further, the reflection surface may be formed by metal polishing the inner peripheral surface of the light guide portion 23 or metal plating the inner peripheral surface.

  The shielding part 24 is disposed adjacent to the light guide part 23, and is formed in a substantially symmetric form with the light guide part 23 with the partition wall 21d as an axis. The shielding part 24 has a shielding wall 24a on the front surface side, and is formed in a substantially rectangular parallelepiped cavity by the side wall 21c and the partition wall 21d. Moreover, the back side facing the shielding wall 24a is opened.

  The second case 22 includes a substantially rectangular parallelepiped main body portion 22a projecting to the back side (the lower side in FIG. 2B) and a substantially rectangular flange portion 22b formed around the main body portion 22a. I have. The main body portion 22 a is formed in a form that substantially matches the shape of the back surface side of the main body portion 21 a in the first case 21, and is continuous on the inner side corresponding to the light guide portion 23 and the shielding portion 24. A space 22c is formed.

  The film 3 is a resin film formed in a substantially rectangular shape. A wiring pattern (not shown) is formed on one surface, and the infrared detecting thermal element 4 and the temperature compensating thermal element 5 are connected to the wiring pattern. Yes. An external lead terminal is formed at the end of the wiring pattern, and the external lead wire 6 is electrically connected to the external lead terminal by means such as soldering or welding.

  For the film 3, a resin made of a polymer material such as fluorine, silicon, polyimide, polyester, polyethylene, polycarbonate, or PPS (polyphenylene sulfide) can be used. Other materials may be used as long as they absorb infrared rays. Furthermore, carbon black or an inorganic pigment (one or more of chrome yellow, petal, titanium white, and ultramarine) may be mixed and dispersed in these resins to use a material that can absorb infrared rays of almost all wavelengths.

  The film 3 is interposed between the flange portion 21b of the first case 21 and the flange portion 22b of the second case 22 by combining and joining the first case 21 and the second case 22. It is designed to be fixed. In this case, the infrared detecting thermal element 4 is disposed at a position corresponding to the light guide 23, and the temperature compensating thermal element 5 is disposed at a position corresponding to the shielding part 24. The case 22 is positioned on the space 22c side.

  The infrared detecting thermal element 4 detects infrared rays from the detection target and measures the temperature of the detection target. The temperature-compensating thermal element 5 detects the ambient temperature and measures the ambient temperature. These infrared detecting thermal element 4 and temperature compensating thermal element 5 are composed of thermal elements having at least substantially equal temperature characteristics, and are disposed on the film 3.

  Specifically, the infrared detecting thermal element 4 and the temperature compensating thermal element 5 are made of a ceramic semiconductor such as a thermistor containing a metal oxide of Mn, Co, Ni, Ti, Al, Zn, Cu and Fe. ing. Since this ceramic semiconductor has a high B constant which is a temperature coefficient, it is possible to detect a temperature change of the film 3 that absorbs infrared rays with high sensitivity.

  The ceramic semiconductor preferably has a crystal structure having a cubic spinel phase as a main phase. In this case, since there is no anisotropy and no impurity layer, the electrical characteristics of the ceramic sintered body are not obtained. The variation is small, and highly accurate measurement is possible when using a plurality of infrared temperature sensors. In addition, because of the stable crystal structure, the environment resistance is high. As the ceramic semiconductor, a single-phase crystal structure composed of a cubic spinel phase is most desirable.

  Further, the infrared detecting thermal element 4 and the temperature compensating thermal element 5 are selected from thermistor elements and thin film thermistors obtained from the same wafer formed of ceramics semiconductors by resistance values within a predetermined tolerance. It is preferable that

  In this case, the relative error of the B constant is reduced between the pair of infrared detecting thermal element 4 and temperature compensating thermal element 5, and at the same time, the temperature difference between the two detecting temperatures can be detected with high accuracy. In addition, for the infrared detecting thermal element 4 and the temperature compensating thermal element 5, the B constant selection operation and the resistance value adjusting step are not required, and the productivity can be improved.

  The thermistor elements used for the infrared detecting thermal element 4 and the temperature compensating thermal element 5 may be any of bulk, laminated, thick film and thin film, for example.

  In the infrared temperature sensor 1 configured as described above, variations in dimensions and the like of each member such as the light guide unit 23 and the film 3 constituting the infrared temperature sensor 1 occur, that is, variations in output characteristics of the individual infrared temperature sensors, The output characteristics may vary.

  Therefore, it is necessary to select a reference infrared temperature sensor, adjust the detected temperature characteristic of the reference infrared temperature sensor to be equal to the detected temperature characteristic of the unadjusted infrared temperature sensor 1, and correct the variation. .

  For this reason, in the present embodiment, as shown in FIGS. 3A and 3B, a method of adjusting the incident amount of the infrared light by adjusting the visual field area of the light guide unit 23 with respect to the infrared light is adopted. .

  Specifically, FIG. 3A shows an example in which a part of the opening 23a in the light guide 23 is removed (cut) so as to expand the visual field region, that is, the visual field angle Va. The inner side of the side wall 21c on the side of the opening 23a forming the light guide 23 is inclined and cut so as to expand toward the side of the opening 23a. By the adjustment method having such a removal step, adjustment and correction can be performed so that the amount of incident infrared rays increases.

FIG. 3B shows an example in which an adhesive is adhered to a part of the opening 23a in the light guide 23 so as to reduce the viewing area, that is, the viewing angle Va. An adhesive is bonded so as to protrude inside the side wall 21c on the side of the opening 23a forming the light guide 23. By the adjustment method having such an adhesion step, adjustment and correction can be made so that the amount of incident infrared rays is reduced. In this case, a small piece of the same material as that for forming the light guide 23 may be bonded so as to protrude to the inside of the light guide 23 on the opening 23a side.

  In the adjustment method as described above, when a part of the opening 23a in the light guide 23 is removed (cut) so as to enlarge the field of view, the field of view enlarged portion Ve is formed in the light guide 23, When an adhesive is bonded to a part of the opening 23 a in the light guide portion 23 so as to reduce the visual field region, the visual field region reduced portion Vd (adhesive) is formed in the light guide portion 23.

  In addition, the formation site | part of the visual field area expansion part Ve and the visual field area reduction | decrease part Vd is not specifically limited, If the incident amount of infrared rays can be adjusted, you may form in the partition wall 21d in the light guide part 23, Moreover, you may make it form in the perimeter of the opening part 23a.

Next, the operation of the infrared temperature sensor 1 will be described. Infrared radiation radiated from the surface of the detection object enters through the opening 23 a in the light guide 23 of the infrared temperature sensor 1, is guided to the light guide 23, passes through the light guide 23, and reaches the film 3. The infrared rays that have reached the film 3 are absorbed by the film 3 and converted into thermal energy.

  The converted thermal energy is transmitted to the infrared detecting thermal element 4 to increase the temperature of the infrared detecting thermal element 4. The infrared detection thermal element 4 and the temperature compensation thermal element 5 are ceramic semiconductors having at least substantially equal temperature characteristics, and the resistance value of the infrared detection thermal element 4 changes due to infrared rays from the detection target.

  At the same time, infrared rays are shielded by the shielding wall 24a of the shielding part 24, but the temperature of the case 2 rises due to the radiant heat from the object to be detected and the ambient atmosphere temperature. The resistance value changes corresponding to the rise.

  In this case, since the light guide part 23 and the shielding part 24 are formed in a substantially symmetric form with the partition wall 21d as an axis, the infrared detecting thermal element 4 and the temperature compensating thermal element 5 have an ambient temperature. It changes similarly with respect to a change, can prevent the influence with respect to a thermal disturbance, and it becomes possible to detect the temperature change by the infrared rays from a detection target object reliably.

  When the case 2 is formed of a material having thermal conductivity such as metal, the temperature change of the infrared temperature sensor 1 can be made uniform as a whole following the change in ambient temperature.

  As described above, according to the present embodiment, since the amount of incident infrared rays can be adjusted by forming the visual field region enlargement portion Ve or the visual field region reduction portion Vd, the output of each infrared temperature sensor 1 can be achieved with a simple configuration. It is possible to easily perform correction work for characteristic fluctuations.

  Next, an infrared temperature sensor according to a second embodiment of the present invention will be described with reference to FIGS. 4A is a plan view, and FIG. 4B is a cross-sectional view. FIG. 5A shows a state where a part of the light guide is removed, and FIG. 5B shows a state where an adhesive is adhered to a part of the light guide. In addition, the same code | symbol is attached | subjected to the part which is the same as that of 1st Embodiment, or an equivalent part, and the overlapping description is abbreviate | omitted.

In the present embodiment, a protrusion 23b that protrudes to the inner peripheral side is formed on the side wall 21c of the opening 23a in the light guide 23. The protrusions 23b are formed at a plurality of locations in the opening 23a and have a comb shape. Specifically, three protrusions 23b are formed at three locations on the upper end of the side wall 21c.
In such a configuration, as shown in FIGS. 5A and 5B, the amount of incident infrared light is adjusted by adjusting the visual field area of the light guide 23 with respect to the incident infrared light.

  Specifically, FIG. 5 (a) removes the protrusion 23b of the opening 23a in the light guide 23 so as to enlarge the viewing area, that is, the area of the opening 23a, and enlarge the viewing angle Va. An example of cutting by folding is shown.

  By the adjustment method having such a removal step, adjustment and correction can be performed so that the amount of incident infrared rays increases. Moreover, since the protrusion 23b can be folded and cut, the amount of incident infrared rays can be finely adjusted.

  FIG. 3B shows an example in which an adhesive is bonded between the protrusions 23b of the opening 23a in the light guide 23 so as to reduce the viewing area, that is, the area of the opening 23a, and reduce the viewing angle Va. Is shown.

  By the adjustment method having such an adhesion step, fine adjustment and correction can be performed so that the amount of incident infrared rays is reduced. In this case, an adhesive may be adhered to a plurality of locations between the protrusions 23b.

  In the adjustment method as described above, when the projection 23b of the opening 23a in the light guide 23 is removed (folded and cut) so as to enlarge the field of view, the field of view enlarged portion Ve is formed in the light guide 23. When the adhesive is bonded between the projections 23b of the opening 23a in the light guide 23 so as to reduce the visual field area, the visual field reduction part Vd (adhesive) is formed in the light guide 23. The

  As described above, according to the present embodiment, similarly to the first embodiment, it is possible to easily perform correction work for fluctuations in output characteristics of the individual infrared temperature sensors 1 with a simple configuration.

  Next, an infrared temperature sensor according to a third embodiment of the present invention will be described with reference to FIGS. 6A is a plan view, and FIG. 6B is a cross-sectional view. FIG. 7 shows a state in which a part of the light guide is removed. In addition, the same code | symbol is attached | subjected to the part which is the same as that of 1st Embodiment, or an equivalent part, and the overlapping description is abbreviate | omitted.

In the present embodiment, the main body portion 21a of the first case 21 protrudes to the front surface side (the upper side in FIG. 6B), and a substantially rectangular parallelepiped hollow portion 21e is formed. In the hollow portion 21e, a formed body 25 in which a light guide portion 23 for guiding infrared rays and a shielding portion 24 for shielding infrared rays are formed is mounted.
Here, the first case 21 and the second case 22 are made of, for example, a metal material having thermal conductivity, and the formed body 25 is made of a resin material.

  If the first case 21 is made of a metal material having good thermal conductivity such as aluminum by a method such as die casting, it is difficult to ensure the dimensional accuracy of the opening 23a of the light guide 23, and infrared light incident on the light guide 23 is incident. The amount tends to vary. For this reason, it is possible to reduce the variation in the amount of incident infrared rays of the light guide unit 23 by making the light guide unit 23 and the shielding unit 24 from a resin that can easily ensure dimensional accuracy.

On the other hand, since the first case 21 and the second case 22 are formed of a metal material having thermal conductivity, the temperature change of the infrared temperature sensor 1 is made uniform as a whole following the temperature change of the surroundings. Can do.
In such a configuration, the amount of incident infrared light is adjusted by adjusting the visual field area of the light guide 23 with respect to the incident infrared light as shown in FIG.

  Specifically, FIG. 7 shows an example in which a part of the opening 23a in the light guide 23 is removed (cut) so as to enlarge the visual field region, that is, the visual field angle Va. The inside of the partition wall 21d on the side of the opening 23a forming the light guide 23 is inclined and cut so as to expand toward the side of the opening 23a. By the adjustment method having such a removal step, adjustment and correction can be performed so that the amount of incident infrared rays increases.

  In the adjustment method as described above, when a part of the opening 23a in the light guide portion 23 is removed (cut) so as to enlarge the visual field region, the visual field region enlarged portion Ve is formed in the light guide portion 23. . In addition, you may make it adhere | attach an adhesive agent so that it may protrude inside the partition wall 21d by the side of the opening part 23a which forms the light guide part 23. FIG. In this case, similarly to the above, the visual field area reduction part Vd (adhesive) is formed in the light guide part 23.

  As described above, according to this embodiment, in addition to the same effects as those of the first embodiment, the light guide 23 and the shield 24 are made of resin, so that the dimensional accuracy of the light guide 23 and the shield 24 is improved. Since it is easy to ensure, variation in the incident amount of infrared rays of the light guide portion 23 can be reduced. Further, since the first case 21 and the second case 22 are made of a material having thermal conductivity, the temperature change of the infrared temperature sensor 1 can be made uniform as a whole.

  Next, an infrared temperature sensor according to a fourth embodiment of the present invention will be described with reference to FIGS. FIG. 8A is a plan view and FIG. 8B is a cross-sectional view. FIG. 9 shows a state where a part of the light guide is removed. In addition, the same code | symbol is attached | subjected to the part which is the same as that of 3rd Embodiment, or an equivalent part, and the overlapping description is abbreviate | omitted.

In the present embodiment, the protrusion 23 b is formed in the opening 23 a in the light guide 23. Specifically, a protrusion 23b that protrudes toward the inner peripheral side of the light guide 23 is formed at one location on the upper end of the side wall 25c of the opening 23a.
In such a configuration, as shown in FIG. 9, the amount of incident infrared light is adjusted by adjusting the visual field area of the light guide 23 with respect to the incident infrared light.

Specifically, FIG. 9 shows an example in which the projection 23b of the opening 23a in the light guide 23 is removed (folded and cut) so as to expand the viewing area, that is, the viewing angle Va.
By the adjustment method having such a removal step, adjustment and correction can be performed so that the amount of incident infrared rays increases.

In the adjustment method as described above, when the projection 23b of the opening 23a in the light guide 23 is removed (folded and cut) so as to enlarge the field of view, the field of view enlarged portion Ve is formed in the light guide 23. Formed and formed.
Therefore, according to this embodiment, the same effect as that of the third embodiment can be obtained.

  Subsequently, an infrared temperature sensor according to a fifth embodiment of the present invention will be described with reference to FIGS. FIG. 10A is a plan view, and FIG. 10B is a cross-sectional view. FIG. 11 shows a state where an adhesive is bonded to a part of the light guide. In addition, the same code | symbol is attached | subjected to the part which is the same as that of 4th Embodiment, or an equivalent part, and the overlapping description is abbreviate | omitted.

In the present embodiment, a plurality of protrusions 23b projecting inwardly on the side wall 25c of the opening 23a in the light guide 23 are formed so as to form a pair at a plurality of locations, specifically at two locations (two). Is.
In such a configuration, as shown in FIG. 11, the amount of incident infrared light is adjusted by adjusting the visual field area of the light guide 23 for incident infrared light.

Specifically, an example in which an adhesive is bonded between the pair of protrusions 23b of the opening 23a in the light guide 23 so as to reduce the viewing area, that is, the area of the opening 23a, and reduce the viewing angle Va. Is shown. By the adjustment method having such an adhesion step, fine adjustment and correction can be performed so that the amount of incident infrared rays is reduced.
In addition, you may adjust so that the projection part 23b in the light guide part 23 may be removed (folded and cut) so that a visual field area may be expanded.

In the adjustment method as described above, when an adhesive is bonded between the protrusions 23b of the opening 23a in the light guide 23 so as to reduce the visual field, the visual field reduction part Vd (adhesion) is attached to the light guide 23. Agent) is formed. Further, when the projection 23 b is removed (folded and cut) so as to enlarge the visual field region, the visual field region enlarged portion Ve is formed in the light guide portion 23.
Therefore, according to this embodiment, the same effects as those of the above-described embodiments can be obtained.

  Next, an infrared temperature sensor according to a sixth embodiment of the present invention will be described with reference to FIG. 12A is a plan view, and FIG. 12B is a cross-sectional view. FIG. 12C is a plan view for explaining the wiring connection relationship, and FIG. 12D is a cross-sectional view showing a state before the lead wires are connected. In addition, the same code | symbol is attached | subjected to the part which is the same as that of 5th Embodiment, or an equivalent part, and the overlapping description is abbreviate | omitted.

  In the present embodiment, the basic configuration of the infrared temperature sensor is the same as that of the fifth embodiment, but the connection configuration of the external lead wire 6 is different. As representatively shown in FIG. 12C, a wiring pattern 7 is formed on one surface of the film 3, and the infrared detecting thermal element 4 and the temperature compensating thermal element 5 are connected to the wiring pattern 7 and arranged. An external lead terminal 8 is formed and connected to the end of the wiring pattern 7.

  The external lead terminal 8 is connected to the external lead wire 6 via the relay terminal 9. The relay terminal 9 includes a slightly wide connection terminal portion 91 and a lead portion 92 extending from the connection terminal portion 91. The relay terminal 9 is integrated with a holding member 93 made of a resin material by insert molding.

  In such a relay terminal 9, the lead portion 92 is electrically connected to the external lead terminal 8 by means such as soldering or welding, and then the second case is coupled to the first case. The holding member 93 is fixed to the second case 22 side by fixing means (not shown).

  According to such a configuration, since the connection terminal portion 91 of the relay terminal 9 is exposed to the outside of the case 2 (see FIG. 12D), the first case and the second case After being coupled, any external lead wire 6 can be connected to the connection terminal 91 by means such as soldering or welding.

Therefore, since the external lead wire 6 is not connected directly to the external lead terminal 8 but is connected via the relay terminal 9, it is possible to cope with various kinds of products having different lengths of the external lead wire 6 and the like. It becomes possible to improve the property. That is, the infrared temperature sensor 1 can be managed in a state where the external lead wire 6 is not connected (see FIG. 12D), and the length of the external lead wire 6 is different from the infrared temperature sensor 1. The external lead wire 6 can be connected according to the product type. In addition, the amount of incident infrared rays in the infrared temperature sensor 1 can be adjusted and corrected in a state where the external lead wire 6 is not connected.
As described above, according to the present embodiment, the number of varieties with different lengths of the external lead wires 6 increases, and mass productivity can be ensured even when the number of varieties is small.

  Next, an infrared temperature sensor according to a seventh embodiment of the present invention will be described with reference to FIG. FIG. 13A is a plan view, and FIG. 13B is a cross-sectional view. FIG. 13C is a plan view for explaining the wiring connection relationship, and FIG. 13D is a cross-sectional view showing a state before the lead wires are connected. In addition, the same code | symbol is attached | subjected to the same or equivalent part as 6th Embodiment, and the overlapping description is abbreviate | omitted.

  The present embodiment shows the connection configuration of the external lead wire 6, and has the same basic configuration as the sixth embodiment. A different configuration is that the relay terminal 9 is integrally insert-molded in a formed body 25 in which the light guide portion 23 and the shielding portion 24 are formed.

Specifically, one end side of the shielding portion 24 is extended in the direction of the connecting portion of the external lead wire 6 to form an extending portion 24b, and a holding member 93 is integrally formed at the distal end portion of the extending portion 24b. The relay terminal 9 is insert-molded on the member 93.
According to such a configuration, in addition to the effects of the sixth embodiment, since the relay terminal 9 is formed integrally with the forming body 25, the number of parts can be reduced.

  The infrared temperature sensor 1 in each of the embodiments described above can be applied to various apparatuses such as a fixing device of a copying machine, a battery unit, and an IH cooking heater. The specially applied device is not limited.

  The present invention is not limited to the configuration of each of the embodiments described above, and various modifications can be made without departing from the spirit of the invention. Moreover, each said embodiment is shown as an example and is not intending limiting the range of invention.

  For example, the position where the visual field area enlargement part or the visual field area reduction part is formed is not limited, and may be any part of the light guide part that can adjust the amount of incident infrared rays. The whole circumference may be sufficient, and a side wall or a partition wall may be sufficient.

  In addition, as a thermal sensing element for infrared detection and a thermal compensation element for temperature compensation, a thin film thermistor or a chip thermistor formed of a ceramic semiconductor is preferably used. Can do.

DESCRIPTION OF SYMBOLS 1 ... Infrared temperature sensor 2 ... Case 3 ... Film 4 ... Infrared detection thermal element 5 ... Temperature compensation thermal element 6 ... External lead wire 7 ... Wiring pattern 8 ..External lead terminal 9 ... relay terminal 21 ... first case (holding body)
21d: partition wall 22: second case (lid member)
23 ... light guide 23a ... opening 23b ... projection 24 ... shielding portion 24a ... shielding wall Ve ... field-of-view area enlargement part Vd ... field-of-view area reduction part

Claims (6)

A light guide part having an opening for guiding infrared light, a case having a shielding wall having a shielding wall for shielding infrared light, and the light guide part disposed opposite to the light guide part and the shielding part, A film that absorbs infrared rays that pass through the film, a heat-sensitive element for infrared detection that is disposed on the film and disposed at a position corresponding to the light guide unit, and the shielding unit that is disposed on the film. An infrared temperature sensor comprising a temperature-compensating thermosensitive element disposed at a position corresponding to
A removal step of removing a part of the opening of the light guide part to enlarge the field of view, or a field of view area by adhering an adhesive or an additional member to a part of the opening of the light guide part A method for manufacturing an infrared temperature sensor, comprising a bonding step of forming the wafer so as to be reduced. 2. The infrared temperature sensor according to claim 1, wherein the case is made of a material having thermal conductivity, and the portions forming the light guide part and the shielding part are made of a resin material. Way . At least one projection in the opening of the light guide is provided with a projection that protrudes toward the inner peripheral side, and the projection is enlarged so that the viewing area is enlarged by removing the projection. 3. The method for manufacturing an infrared temperature sensor according to claim 1, further comprising a visual field region reduction portion formed so that the visual field region is reduced by bonding an adhesive or an additional member to the portion. . 4. The infrared temperature sensor according to claim 1, wherein the light guide portion and the shielding portion are formed in a substantially symmetrical form with a partition wall separating them as an axis. 5. Manufacturing method . The film is provided with a wiring pattern to which the infrared detecting thermal element and the temperature compensating thermal element are connected, and the external lead terminal and the external lead wire connected to the wiring pattern are connected via a relay terminal. The infrared temperature sensor manufacturing method according to claim 1 , wherein the infrared temperature sensor is connected . 6. The method of manufacturing an infrared temperature sensor according to claim 5, wherein the relay terminal is integrally formed with a resin material that forms the light guide portion and the shielding portion.

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