JP6287233B2 - Infrared detector cap and infrared detector - Google Patents

Description

  The present invention relates to an infrared detector that detects infrared rays generated by an object, and a cap of the infrared detector.

  A general infrared detector that detects infrared rays generated by an object has an infrared detection element housed in a cap. The cap of the infrared detector is desired to have the following functions.

(1) A function of suppressing infrared rays from outside the visual field range from being reflected on the inner surface of the cap and entering the infrared detection element. (2) When the temperature of the environment where the infrared detector is placed changes rapidly. Function to suppress temperature difference between infrared detector and cap

  When the resin inner cap is provided on the inner surface of the cap, the above two functions can be imparted to the cap. Therefore, a cap with an inner cap is often used. However, as shown in FIG. 10, an existing cap with an inner cap has an infrared ray transmission inside a metal outer cap. A member (an optical member that transmits infrared rays) and a resin inner cap are accommodated (see, for example, Patent Document 1).

  That is, the existing cap including the inner cap requires a complicated operation of inserting the infrared transmitting member and the inner cap into the outer cap and fixing the inner cap to the inner surface of the outer cap at the time of assembly. It has become a thing.

Japanese Patent No. 5287906 Special table 2007-501404 JP 2007-024829 A JP 2002-296108 A Japanese Patent Laid-Open No. 2004-077741

  The present invention has been made in view of the above-described present situation, and the problem is that an easily assembled cap of the type having an inner cap and an infrared ray that is easy to assemble because such a cap is used. And providing a detector.

  In order to solve the above-described problems, the cap of the infrared detector of the present invention includes a covered cylindrical outer cap having a lid portion in which an infrared introduction hole is formed, and a resin inner cap that covers the inner surface of the outer cap. And an optical member that transmits infrared rays and is disposed on the outer surface of the lid portion of the outer cap so as to cover the infrared introduction hole, and a holding portion that is disposed outside the outer cap and holds the optical member. Prepare.

That is, the cap of the infrared detector of the present invention basically provides the above two functions by providing an inner cap. However, the cap of the infrared detector of the present invention has a configuration that does not require the work of inserting and fixing an optical member that transmits infrared rays (an infrared transmitting member such as an infrared lens or an infrared filter) inside the outer cap at the time of assembly. Have. Therefore, the cap of the infrared detector of the present invention is more assembled than the existing cap (FIG. 18) that requires an operation of inserting and fixing an infrared transmitting member (optical member) inside the outer cap. Can be said to be easy.

  As the holding portion of the cap of the infrared detector of the present invention, “having a shape covering the outer edge of the surface of the optical member that does not face the lid portion of the outer cap” and “the outer cap of the outer cap” A member for regulating the arrangement position of the optical member on the outer surface of the lid portion can be employed. In other words, as the holding portion, a holding portion (hereinafter referred to as a first holding portion) having a portion extending to the upper surface of the optical member (the surface on the side not facing the lid portion of the outer cap), and the optical member It is possible to employ a holding part having a shape that can be inserted from above (hereinafter referred to as a second holding part).

  The cap having the first holding portion can be realized (manufactured) without using insert molding, or a portion including the inner cap and the outer cap can be formed by insert molding, and then the holding portion can be provided on the outer surface of the portion. It can also be realized by providing the inner cap on the inner surface of the part after forming the part composed of the outer cap and the holding part by insert molding. However, if the portion composed of the optical member, the inner cap, the outer cap, and the holding portion is formed by insert molding (“the inner cap and the holding portion are formed once on the surface of the outer cap and the optical member. If the “configuration formed by injection molding / the configuration in which the inner cap and the holding part are part of a continuous member is adopted”, a cap that does not require assembly work itself can be realized.

  Moreover, the cap provided with the 2nd holding | maintenance part can also be implement | achieved by various procedures. However, if the portion composed of the inner cap, the outer cap and the holding portion is formed by insert molding (“the inner cap and the holding portion are formed by one injection molding on the outer surface and the inner surface of the outer cap. "If the structure / inner cap and the holding part are part of a continuous member, it is not necessary to fix the inner cap and the holding part to the outer cap." A cap can be realized.

  When the inner cap and the holding part are formed by a single injection molding to the outer cap or the outer cap and the optical member, etc., in order to avoid using a complicated mold, the outer cap is injected into the lid part of the outer cap. It is preferable to form at least one resin flow hole that functions as a resin flow path during molding.

  The optical member used for the cap of the infrared detector of the present invention may be an infrared filter or an infrared lens. In addition, there exists a tendency for an assembly operation (accommodating in a holding | maintenance part etc.) to be easy when the shape of an optical member is near circular. The lens is originally manufactured in a circular shape, but manufacturing a circular filter requires a manufacturing cost. Therefore, when a filter that transmits infrared rays in a predetermined wavelength region is used as the optical member, the shape of the filter is a quadrangle or six that is a shape that can be manufactured at a relatively low manufacturing cost by dicing a large optical member. It is preferable to use a square shape.

The second holding unit can regulate the position of the optical member disposed on the lid (on the outer surface of the lid) (in other words, can limit the amount of horizontal movement of the optical member on the lid). Stuff). Therefore, the second holding portion may be a member fixed to the lid portion of the outer cap or a member fixed to the outer surface of the outer cap. Further, the second holding portion may be a single cylindrical member or an assembly of a plurality of members fixed to the outer cap.

  Further, the protruding length (amount) of the second holding portion from the outer surface of the lid portion is not particularly limited. However, if the protrusion length of the second holding portion from the outer surface of the lid portion is excessively small, only a slight force is applied until the adhesive between the optical member and the outer surface of the lid portion of the outer cap is solidified. Thus, the optical member is displaced from the arrangement position regulated by the holding portion. In addition, only a relatively small force is applied during normal use, and the optical member is displaced from the arrangement position regulated by the holding portion. For this reason, the cap of the infrared detector of the present invention has the following: “The protruding length of the holding portion (second holding portion) from the outer surface of the lid portion of the outer cap is that of the outer cap portion of the outer cap of the optical member. It is preferable to adopt a configuration that is “the height from the outer surface or more”.

  Moreover, the cap provided with the 2nd holding | maintenance part of the infrared detector of this invention implement | achieves as an optical member being fixed on a cover part with an adhesive agent, or an optical member is used without using an adhesive agent. It can also be realized as being fixed on the lid. When the cap of the infrared detector of the present invention is realized as the former type, in order to increase the margin of the amount of adhesive applied to assemble the cap having the performance as designed, A configuration may be adopted in which a groove having a shape surrounding the infrared introduction hole is formed on the outer surface to accommodate an excessively applied adhesive when the optical member is fixed to the outer surface.

  And the infrared detector of this invention was arrange | positioned on the metal plate-like member arrange | positioned on the cap of the above-mentioned infrared detector of this invention, a board | substrate, the board | substrate, and a metal plate-like member. An infrared detection element, and a cap is disposed on the metal plate-like portion so as to cover the infrared detection element.

  Therefore, the infrared detector of the present invention is easy to assemble because the cap used is easy to assemble.

  ADVANTAGE OF THE INVENTION According to this invention, the type | mold provided with an inner cap, the cap which is easy to assemble, and the infrared detector which is easy to assemble because such a cap is used can be provided.

FIG. 1 is a partially cutaway perspective view of an infrared detector according to the first embodiment of the present invention. FIG. 2 is a top view of the infrared detector according to the first embodiment in a state where a cap is not attached. FIG. 3 is a perspective view of an outer cap used for the cap of the infrared detector according to the first embodiment. FIG. 4 is a cross-sectional view of the cap of the infrared detector according to the first embodiment. FIG. 5A is an explanatory diagram of a shape example of a holding portion including a pressure rib. FIG. 5B is an explanatory diagram of a modified example of the cap of the infrared detector according to the first embodiment. FIG. 6 is a partially cutaway perspective view of an infrared detector according to the second embodiment of the present invention. FIG. 7 is a perspective view of an outer cap used for the cap of the infrared detector according to the second embodiment. FIG. 8 is a cross-sectional view of the cap of the infrared detector according to the second embodiment. FIG. 9 is an external view of a cap of an infrared detector according to the third embodiment of the present invention. FIG. 10 is an external view of the cap of the infrared detector according to the third embodiment. FIG. 11 is an external view in which a part of the cap of the infrared detector according to the third embodiment is made transparent. FIG. 12 is an external view in which a part of the cap of the infrared detector according to the third embodiment is made transparent. FIG. 13 is a top view in which a part of the cap of the infrared detector according to the third embodiment is made transparent. FIG. 14 is an explanatory diagram of an example of the shape of the inner cap of the cap of the infrared detector according to the third embodiment. FIG. 15 is an explanatory diagram of an example of the shape of the inner cap of the cap of the infrared detector according to the third embodiment. FIG. 16 is an explanatory diagram of a modified example of the cap of the infrared detector according to the second embodiment. FIG. 17 is an explanatory diagram of a modified example of the cap of the infrared detector according to the third embodiment. FIG. 18 is an explanatory diagram of a configuration of an existing cap including an inner cap.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<< First Embodiment >>
Figure 1 shows a first embodiment perspective view out portion cut-out of the infrared detectors 10 ₁ according to the embodiment of the present invention, shown in FIG. 2, a top view of an infrared detector 10 ₁ in a state that is not fitted with a cap 30 . In the above description and the following description, the upper surface and the surface are the upper surface in FIG. Similarly, in the following description, “upper” and “lower” refer to the upward direction and the downward direction in FIG. 1, respectively.

As is shown in FIGS. 1 and 2, the infrared detector 10 ₁ according to this embodiment, the substrate 11, a metal stem 20, the infrared sensing element 13, ASIC (Application Specific Integrated Circuit ) 14, a plurality of electronic components 15 The cap 30 and the connector 35 are provided.

  The infrared detection element 13 is an element that detects infrared light that is incident through an infrared transmission member 31 (details will be described later) of the cap 30 (measures the amount of temperature increase due to the infrared light). As the infrared detection element 13, an element capable of measuring a temperature rise amount (temperature difference from the temperature of the metal stem 20) at one place (one region) of the own element or a temperature rise quantity at a plurality of places of the own element is measured. Elements that can be used (so-called array sensors) are used. The operating principle of the infrared detection element 13 is not particularly limited. Therefore, as the infrared detection element 13, a thermopile type sensor such as a thermopile type, a bolometer type or a pyroelectric type, or a quantum type infrared sensor can be used.

The ASIC 14 is an integrated circuit connected to the infrared detection element 13 by a wire and having a function of amplifying the output of the infrared detection element 13. The ASIC 14 is usually a circuit having at least a function of amplifying the output of the infrared detecting element 13 and a function of detecting the temperature of the metal stem 20 (for example, PTAT (Proportional To Absolute Temperature) that outputs a voltage proportional to the absolute temperature. ) A circuit including a voltage source and a chopper amplifier is used. However, ASIC 14 is that's low function, not necessary to increase the number of elements to be mounted on the infrared detector 10 _1. Therefore, the ASIC 14 has the above-described two functions, a function of removing noise from the output of the infrared detection element 13, a function of converting the output of the infrared detection element 13 after amplification and removal of noise into digital data, and an infrared ray converted into digital data. function of performing arithmetic processing based on the output or the like of the detection element 13, the temperature using another device (infrared detectors 10 ₁ the processing result of the output or operation processing via the connector 35 of the infrared detecting element 13 is converted into digital data It is preferable to use a circuit that also has a function of transmitting to an information processing device that measures and outputs).

A plurality of electronic components 15 to the infrared detector 10 ₁ is provided (Fig. 2), in combination with ASIC 14 (electrically connected), actually to function as a sensor that allows the measurement of the temperature of the infrared detector 10 ₁ These are the surface mount type electronic components (chip resistor, chip capacitor, etc.) constituting the electronic circuit.

  The metal stem 20 is a metal plate-like member on which the infrared detection element 13 and the ASIC 14 are mounted.

As is shown in FIG. 2, the infrared detector 10 ₁ of the metal stem 20, a first portion 21a of the strip width can be implemented infrared detecting element 13, the to be perpendicular to the first portion 21a first Three openings 22a to 22c are formed so that a band-shaped second portion 21b extending in one direction from one portion 21a and having a width capable of mounting the ASIC 14 remains in the central portion. Further, the opening 22a is in one of the two regions obtained by dividing into two by a straight line passing through substantially the center of the first portion 21a (approximately the center of the infrared detecting element 13 fixed to the first portion 21a). The openings 22b and 22c are formed in the other region of the two regions so as to sandwich the second portion 21b therebetween. Further, the first portion 21 a of the metal stem 20 is formed with an opening 23 used for fixing the metal stem 20 to the substrate 11 with cream solder 80 (hereinafter also simply referred to as solder 80). Has been.

  As a constituent material of the metal stem 20, it is preferable to use iron, copper, aluminum or the like having good thermal conductivity. Moreover, it is also preferable to employ | adopt the member to which the surface coating (for example, nickel plating) is given as metal stem 20 in order to suppress generation | occurrence | production of rust and to make solderability favorable.

  The substrate 11 is a wiring board on which wiring for electrically connecting the ASIC 14, the plurality of electronic components 15, and the connector 35 is formed.

The back surface of the substrate 11 (FIG. 1), power supply terminals of the infrared detector 10 _1, functions as an output terminal or the like, a surface mount type connector 35 is provided.

  Electrodes (not shown) for attaching each electronic component 15 with cream solder are formed in a region below the opening 22a of the metal stem 20 on the surface of the substrate 11 (FIG. 2). In addition, a plurality of electrodes for connecting the ASIC 14 are formed in a region on the surface of the substrate 11 below the opening 22b. A plurality of electrodes for connecting the ASIC 14 are also formed in a region on the surface of the substrate 11 below the opening 22c.

  Lands 10 a for fixing (mounting) the four corners of the metal stem 20 to the surface of the substrate 11 with solder 80 are provided on the surface of the substrate 11.

As already described, each electronic component 15 is also a surface-mount type electronic component. Therefore, the metal stem 20 and each electronic component 15 are fixed to the substrate 11 by any of the following procedures.
After mounting the metal stem 20 on the substrate 11, each electronic component 15 is mounted on the substrate 11 (on the region in the opening 22 a of the substrate 11).
After mounting each electronic component 15 on the substrate 11, the metal stem 20 is mounted on the substrate 11.
Each electronic component 15 and the metal stem 20 are mounted on the substrate 11 at the same time.

  Further, the infrared detection element 13 and the ASIC 14 are fixed on the metal stem 20 after fixing the metal stem 20 to the substrate 11 and using an adhesive having good thermal conductivity.

  The cap 30 (FIG. 1) is a covered cylindrical member in which the infrared transmitting member 31, the outer cap 32, the inner cap 33, and the holding portion 34 are combined. The infrared transmitting member 31 used for the cap 30 is a filter or lens made of a material that transmits infrared rays, such as germanium (Ge) and silicon (Si). Note that the assembly of the cap 30 tends to be easier when the shape of the infrared transmitting member 31 is closer to a circle. The lens is originally manufactured in a circular shape, but manufacturing a circular filter requires a manufacturing cost. Therefore, when the infrared transmitting member 31 is a filter, the shape is preferably a hexagon that can be manufactured at a relatively low manufacturing cost by dicing a large optical member.

  Hereinafter, the outer cap 32, the inner cap 33 and the holding portion 34 of the cap 30 will be described with reference to FIGS. 3 and 4. Of these drawings, FIG. 3 is a perspective view of the outer cap 32, and FIG. 4 is a cross-sectional view of the cap 30.

  The outer cap 32 is a covered cylindrical member made of metal, such as iron, copper, or aluminum, having good thermal conductivity. In addition, as this outer cap 32, the member to which surface coating (for example, nickel plating) for suppressing generation | occurrence | production of rust and making solderability favorable can be employ | adopted.

As shown in FIG. 3, an infrared introduction hole 32 a for introducing infrared rays into the infrared detection element 13 is formed at the center of the lid portion of the outer cap 32 (the end portion of the outer cap 32 that is not open). Is formed. In the case infrared transmission member 31 is a filter, the size of the external inlet holes 32a (diameter) is determined based on the viewing angle required for the infrared detector 10 ₁ to be manufactured.

  Further, a groove 32c having a shape surrounding the infrared introduction hole 32a is formed at the center of the lid portion of the outer cap 32. The function / use of the groove 32c will be described later.

  As shown in FIG. 4, the inner cap 33 is a member having an outer surface shape along the inner surface shape of the outer cap 32. The constituent material of the inner cap 33 may be a resin that is an infrared absorbing material. However, the constituent material of the inner cap 33 is preferably a resin having good dimensional stability and moldability (for example, polybutylene terephthalate).

As already described, the inner cap 33 has “(1) a function of suppressing infrared rays from outside the visual field range from being reflected by the inner surface of the cap and entering the infrared detection element” and “(2) infrared detection. When the temperature of the environment in which the vessel is placed changes rapidly, a function capable of suppressing the occurrence of a temperature difference between the infrared detector and the cap ”can be imparted to the cap 30 (1 ) Is realized when the inner cap 33 absorbs (does not reflect) the infrared rays incident on the cap 30 obliquely and reaching the inner surface of the cap 30. Therefore, it is desirable that the inner cap 33 covers the entire inner surface of the outer cap 32. However, the infrared light reflected by the lower end portion of the inner cap 33 is hardly incident on the infrared detection element 13. Therefore, the inner cap 33 can have a shape that does not cover the entire inner surface of the outer cap 32 (FIG. 4). Of course, the inner cap 33 may be shaped to cover the entire inner surface of the outer cap 32.

  Further, the function (2) of the cap 30 can be realized by matching the heat capacities and thermal time constants of the cap 30 and the metal stem 20. That is, regarding the function (2), the inner cap 33 functions as a member that can adjust the heat capacity and the thermal time constant on the cap 30 side by changing the thickness and the like. Accordingly, the specific shape of the inner cap 33 is determined by theoretically calculating an appropriate shape, or by measuring the temperature difference between the infrared detector and the cap that occurs when a thermal shock is applied. It is done.

  The holding part 34 (FIG. 4) is a thick cylindrical member. The holding portion 34 is incorporated in the cap 30 as a member for regulating the arrangement position of the infrared transmitting member 31 on the outer cap 32 (see FIG. 1). Accordingly, the constituent material of the holding portion 34 is not particularly limited, but the infrared transmitting member 31 can be easily inserted when the holding portion 34 has a certain degree of flexibility. In addition, when the holding portion 34 is manufactured from metal, there arises a problem that the cap 30 becomes heavy. Therefore, it is preferable that the constituent material of the holding part 34 is resin.

  In addition, the shape of the holding portion 34 is a shape that can regulate the arrangement position of the infrared transmitting member 31 on the outer cap 32, that is, a shape that can limit the amount of horizontal movement of the infrared transmitting member 31 accommodated in the holding portion 34. If it is good.

  Accordingly, as the shape of the holding portion 34, a shape having an inner surface with an inner diameter slightly larger than the diameter of the circumscribed circle of the infrared transmitting member 31 (see FIG. 1), or as shown in FIG. A shape having an inner surface with an inner diameter slightly larger than the diameter of the circle and having pressure ribs for mechanically fixing the infrared transmitting member 31 provided at a plurality of locations on the inner surface can be employed. Further, in order to be able to mechanically fix the infrared transmitting member 31, the shape of the holding portion 34 may be a shape having an inner surface with an inner diameter slightly smaller than the diameter of the circumscribed circle of the infrared transmitting member 31, or an infrared transmitting member. It can also be set as the shape which has the inner surface of an internal diameter comparable as the diameter of 31 circumscribed circle, and the nail | claw extended toward the inner side in the several places of the upper part of an inner surface.

  Furthermore, as shown in FIG. 5B, the holding portion 34 can be a member fixed to the outer surface of the outer cap 32. Of course, the holding portion 34 may be provided with the above-described pressure ribs and claws.

  The protrusion length (amount) of the holding portion 34 from the upper surface of the outer cap 32 may be an amount that can limit the amount of movement of the infrared transmitting member 31 accommodated in the holding portion 34 in the horizontal direction. However, when the protruding length of the holding portion 34 is excessively small, a slight force is applied until the adhesive (details will be described later) between the infrared transmitting member 31 and the upper surface of the lid portion of the outer cap 32 is solidified. As a result, the infrared transmitting member 31 jumps out of the holding portion 34. Therefore, the protrusion length of the holding portion 34 from the upper surface of the outer cap 32 is a certain length, for example, “more than the height of the outer edge portion of the infrared transmitting member 31 from the outer surface of the lid portion of the outer cap 32”. It is preferable to keep the length.

Hereinafter, the assembly procedure infrared detector 10 _1, will be mainly described procedure of assembling the cap 30.

  When the cap 30 is assembled, first, the holding portion 34 and the inner cap 33 are fixed to the outer cap 32 with an adhesive or the like.

  Next, an adhesive is applied to the peripheral portion of the lower surface of the infrared transmitting member 31 or the portion of the upper surface of the outer cap 32 that faces the peripheral portion of the lower surface of the infrared transmitting member 31. Thereafter, the infrared transmitting member 31 is inserted into the holding portion 34 (in the space defined by the inner surface of the holding portion 34 and the upper surface of the lid portion of the outer cap 32), and the applied adhesive is solidified. The infrared transmitting member 31 is fixed to the upper surface of the lid portion of the outer cap 32. These steps can be performed manually or by using a die bonder.

  The groove 32c (FIGS. 3 and 4) on the upper surface of the lid portion of the outer cap 32 is provided in order to increase the margin of the application amount of the adhesive in the assembly process.

  Specifically, when the groove 32 c is not formed in the outer cap 32, depending on the application amount of the adhesive, “the adhesive reaches the infrared introduction hole 32 a, and as a result, the infrared transmission member 31 and the infrared introduction hole It is conceivable that the amount of infrared light incident on the infrared detection element 13 via 32a is reduced. On the other hand, if the groove 32c is formed in the outer cap 32, even if the applied amount of the adhesive is slightly increased (about the volume of the groove 32c), excess adhesive is accommodated in the groove 32c. Therefore, the adhesive does not reach the infrared introduction hole 32a.

  As described above, if the groove 32c having a shape surrounding the infrared introduction hole 32a is formed on the upper surface of the lid portion of the outer cap 32, the margin of the adhesive application amount for assembling the cap 30 having the performance as designed is increased. be able to. Therefore, the groove 32 c having the above shape is formed on the upper surface of the lid portion of the outer cap 32.

Use at the time of assembly of the infrared detector 10 _1, the assembly of the cap 30 described above, the cap 30 other than the portion of the infrared detector 10 ₁ (hereinafter, referred to as the substrate assembly) is a surface mount technology (reflow soldering) Assembled by work or work using adhesives.

Then, on the metal stem 20 of the substrate assembly assembled, the cap 30 (the outer cap 32), is fixed by solder or an adhesive with a good thermal conductivity such as an infrared detector 10 ₁ is assembled.

As described above, the cap 30 of the infrared detector 10 ₁ according to this embodiment, the holding portion 34 and the outer cap 32 fitted with the inner cap 33, that is inserted from the top infrared transmission member 31, the existing It can be assembled by simpler work than the cap assembly work. Thus, the infrared detector 10 ₁ according to the present embodiment, the partial assembly is easy cap, it can be said that the assembly than conventional infrared detector is a simplified.

<< Second Embodiment >>
Figure 6 shows a perspective view out portion cut-out of the infrared detector 10 ₂ according to the second embodiment of the present invention.
As apparent from the comparison between FIG. 6 and FIG. 1, the infrared detector 10 ₂ according to the present embodiment, the cap 30 of the infrared detector 10 _1, and has a replaced with a cap 40. Therefore, in the following, mainly the construction and assembling procedure of the cap 40, to be described the construction and assembling procedure of the infrared detector 10 _2.

Cap of an infrared detector 10 ₂ 40, similar to the cap 30, a lidded cylindrical member including a holding portion 44 and the infrared transmission member 31 and the outer cap 42 and inner cap 43. The infrared transmitting member 31 of the cap 40 is the same as the infrared transmitting member 31 described above (G
e, a filter or lens made of a material that transmits infrared rays such as Si.

  A portion (hereinafter also referred to as a main body portion) of the cap 40 consisting of the outer cap 42, the inner cap 43, and the holding portion 44 is a main portion of the cap 30 (a portion consisting of the outer cap 32, the inner cap 33, and the holding portion 34). ) And a structure having the same shape and function. However, the main body of the cap 40 is manufactured by one insert molding (one injection molding on the surface of the outer cap 42).

  Further, the cap 40 adopts an outer cap 42 having the shape shown in FIG. 7 in order to facilitate manufacture of the main body portion by insert molding (details will be described later).

  That is, the lid portion of the outer cap 42 of the cap 40 has a plurality (six in FIG. 6) of resin flow holes in addition to the infrared introduction holes 42a and the grooves 42c corresponding to the infrared introduction holes 32a and the grooves 32c, respectively. 42b is formed. As shown in FIG. 8, the positions of the plurality of resin flow holes 42b are determined so that each resin flow hole 42b is below the thick cylindrical holding portion 44 manufactured by injection molding. ing. The positions of the plurality of resin flow holes 42b are also determined so as to be rotationally symmetric with respect to the center of the outer cap 42 (FIG. 7).

  In short, the main body of the cap 30 (see FIGS. 1 and 4) (the main body using the outer cap 32 in which the resin flow hole 42b is not provided in the lid) is also formed in the shape of the mold (the gate If the outer cap 42 in which the resin flow holes 42b are formed in the lid portion is used, the shape can be made relatively simple. The body part can be manufactured with this mold. In addition, if the resin flow hole 42b is provided so as to be rotationally symmetric with respect to the center of the outer cap 42, it is possible to suppress the possibility that air bubbles (Void) easily remain in a specific portion. Therefore, the outer cap 42 having the above shape (configuration) is adopted as the cap 40.

  When the cap 40 is assembled (when the infrared transmitting member 31 is fixed to the main body of the cap 40), similarly to the fixing of the infrared transmitting member 31 to the main body of the cap 30, the peripheral edge of the lower surface of the infrared transmitting member 31; Alternatively, an adhesive is applied to a portion of the upper surface of the outer cap 42 that faces the peripheral portion of the lower surface of the infrared transmitting member 31. Thereafter, the infrared transmitting member 31 is inserted into the holding portion 44, and the applied adhesive is solidified to fix the infrared transmitting member 31 to the upper surface of the lid portion of the outer cap 42.

The infrared detector 10 ₂ according to the present embodiment, manufacturing the cap 40 assembled as described above, the assembled board assembly, soldering, by fixing the adhesive with a good thermal conductivity such as It is to be (assembled).

As described above, the cap 40 of the infrared detector 10 ₂ according to the present embodiment has assumed that fewer parts than the cap of an existing infrared detector (Figure 10). Further, the cap 40 is not required to be attached to the outer cap 42 (32) of the holding portion 44 (34) and the inner cap 43 (33), which is necessary when the cap 30 is assembled. ing. Thus, the infrared detector 10 ₂ according to the present embodiment, the partial assembly is easy cap assembly than the infrared detector 10 ₁ according to the first embodiment existing infrared detector or above become a simple You can say.

<< Third Embodiment >>
The substrate assembly (part other than the cap) of the infrared detector according to the third embodiment of the present invention is the same as the above-described substrate assembly. Therefore, hereinafter, only the configuration and manufacturing procedure of the cap 50 included in the infrared detector according to the present embodiment will be described with reference to FIGS. 9 to 15. 9 and 10 are external views of the cap 50, and FIG. 11 is an external view of the cap 50 when the holding portion 54 and the inner cap 52 are transparent. FIGS. 12 and 13 are an external view and a top view of the cap 50 when the holding portion 54, the inner cap 52, and the infrared transmitting member 31 are transparent, respectively. FIGS. It is explanatory drawing of the other example of a shape of the cap 52. FIG.

  As shown in FIGS. 9 and 10, the cap 50 is a member including the infrared transmitting member 51, the outer cap 52, the inner cap 53, and the holding portion 54, similar to the caps 30 and 40.

Similar to the infrared transmitting member 31, the infrared transmitting member 51 is an optical member that transmits infrared rays (a filter or a lens made of a material that transmits infrared rays such as Ge and Si). When the infrared transmitting member 51 is a filter that transmits infrared rays in a predetermined wavelength range, as the infrared transmitting member 51, a rectangular member is usually used as shown in FIGS.

  Similar to the outer caps 32 and 42, the outer cap 52 is a covered cylindrical member made of metal, such as iron, copper, or aluminum, having good thermal conductivity. As shown in FIGS. 11 to 13, an infrared introduction hole 52 a and a plurality of resin flow holes 52 b are formed in the lid portion of the outer cap 52, similarly to the outer cap 42 (FIG. 7). However, the cap 50 according to the present embodiment is manufactured without using an adhesive, as will be described later. Therefore, a groove (a groove corresponding to the groove 42c) for accommodating an excess adhesive is not formed in the lid portion of the outer cap 52. 13 and the like show the outer cap 52 in which the infrared introduction hole 52a having a relatively small size (diameter) is formed in the lid portion, the size of the infrared introduction hole 52a is required. It should be determined based on the viewing angle. For example, when it is desired to obtain an infrared detector with a wide viewing angle in which the infrared transmitting member 51 is a filter, the size of the infrared introduction hole 52a may be increased as shown in FIGS.

  The inner cap 53 and the holding portion 54 (see FIGS. 10 to 13) are members manufactured by one injection molding (insert molding), like the inner cap 43 and the holding portion 44. However, as is clear from the shape of the holding portion 54 covering the outer edge portion of the upper surface of the infrared transmitting member 51 (see FIG. 11 and the like), the inner cap 53 and the holding of the cap 50 according to the present embodiment. The portion 54 is manufactured (molded) by inserting the outer cap 52 and the infrared transmitting member 51 into a predetermined mold and injecting resin around the outer cap 52 and the infrared transmitting member 51 inserted into the mold. Is done.

  The holding portion 54 shown in FIG. 12 and the like has a shape that covers the four corners of the rectangular infrared transmitting member 51. However, the holding portion 54 may be an infrared ray as long as it does not hide the opening 52a. Even if it covers the entire outer edge portion of the upper surface of the transmission member 51, it may cover a plurality of locations (3 locations, 6 locations, etc.) of the outer edge portion of the upper surface of the infrared transmission member 51. Further, the shape of the infrared transmitting member 51 need not be square. However, when the infrared transmitting member 51 is a filter, if the shape is a square, the infrared transmitting member 51 (filter) can be cut out from a large optical member without waste, and the mold can be easily manufactured. Therefore, when the infrared transmitting member 51 is a filter, the shape is preferably a square.

As described above, the cap 50 of the infrared detector according to the present embodiment does not require an assembling operation (an attaching operation of the infrared transmitting member 51 using an adhesive or the like). Therefore, the infrared detector according to the present embodiment is easier to assemble than the existing infrared detectors and the infrared detectors according to the above-described embodiments because the cap assembly work is unnecessary. I can do it.

<Deformation>
Each cap (30, 40, 50) described above can be applied to any infrared detector. Therefore, an infrared detector is configured by combining a cap and a substrate assembly using a metal stem having no opening 22a (a substrate assembly in which the electronic component 15 is disposed on the substrate 11 outside the cap). You can also. Also, a board assembly using a cap and a metal stem with leads (a board assembly in which the electronic component 15 is disposed on the board 11 outside the cap, and leads (pins) of the metal stem protrude from the back surface of the board 11. ) Can be combined to form an infrared detector.

  In addition, the cap 40 according to the second embodiment can be modified to have a configuration (see FIG. 5B) in which the cylindrical holding portion 44 extends upward from the outer surface of the outer cap 42. Further, as shown in FIG. 16, the cap 40 according to the second embodiment has an outer cap 42 in which a plurality of resin flow holes 42 b are formed on the side surface, and the plurality of resins that function as the holding portion 44. It can also be modified to include a plurality of members extending upward from a portion in the vicinity of the flow hole 42b.

  As the holding portions 34 and 44, those that cover almost the entire region of the lid portions of the outer caps 32 and 42 may be employed. In addition, when the holding parts 34 and 44 having such a shape are employed, a groove for accommodating excess adhesive is not provided on the lid part of the outer caps 32 and 42 but on the lids of the holding parts 34 and 44. It can be formed on the part covering the part.

  As shown in FIG. 17, the shape of the cap 50 may be a square tube. Naturally, the shape of the caps 30 and 40 can be a square tube.

  The holding portion 34 (see FIG. 4) is a member having a shape like the holding portion 54, that is, “the shape that is fixed to the outer cap 32 after the infrared transmitting member 31 is disposed on the lid portion of the outer cap 32. The member 30 and the cap 30 which is “a member fixed to the outer cap 32 after the infrared transmitting member 31 is accommodated therein” also includes the infrared transmitting member and the inner cap inside the outer cap. Thus, it can be assembled by a simpler work than the work of fixing (see FIG. 18). Therefore, the holding portion 34 of the cap 30 may be a member having a shape like the holding portion 54. When the holding portion 34 of the cap 30 is such a member, the holding portion 34 may be fixed to the outer cap 32 with an adhesive, or the holding portion 34 and the outer cap 32 may be locked in some way. It is also possible to provide a mechanism (such as a locking claw and a locking hole, a mechanism in which the holding portion 34 is screwed with the outer cap 32 by rotating the holding portion 34).

10 ₁ , 10 ₂ Infrared detector 11 Substrate 13 Infrared detector 14 ASIC
20 Metal stem 30, 40, 50 Cap 31, 51 Infrared transmitting member 32, 42, 52 Outer cap 33, 43, 53 Inner cap 34, 44, 54 Holding part 35 Connector

Claims (7)

A covered cylindrical outer cap having a lid part in which an infrared introduction hole is formed;
A resin inner cap covering the inner surface of the outer cap;
An optical member that transmits infrared rays, disposed on the outer surface of the lid portion of the outer cap so as to cover the infrared introduction hole;
A holding portion for holding the optical member, which is disposed outside the outer cap;
Equipped with a,
The holding portion has a shape that covers an outer edge portion of a surface of the optical member that is not opposed to the lid portion of the outer cap,
An infrared detector cap, wherein the inner cap and the holding portion are formed by one injection molding to the outer cap and the optical member . A covered cylindrical outer cap having a lid part in which an infrared introduction hole is formed;
A resin inner cap covering the inner surface of the outer cap;
An optical member that transmits infrared rays, disposed on the outer surface of the lid portion of the outer cap so as to cover the infrared introduction hole;
A holding part that is disposed outside the outer cap and holds the optical member and restricts the arrangement position of the optical member on the outer surface of the lid part of the outer cap;
With
The inner cap and the holding portion are formed by one injection molding on the outer surface and the inner surface of the outer cap.
An infrared detector cap characterized by that . A groove having a shape surrounding the infrared introduction hole is formed on the outer surface of the lid portion of the outer cap to accommodate an excessively applied adhesive when the optical member is fixed to the outer surface. An infrared detector cap according to claim 2. The protrusion length of the outer cap from the outer surface of the lid portion of the holding portion is equal to or greater than the height of the outer edge portion of the optical member from the outer surface of the lid portion of the outer cap. An infrared detector cap according to 2 or 3. The outer cap, the infrared detector according to any one of claims 1 to 4, characterized in that one or more resin flow holes that function as flow paths of the resin during injection molding is formed cap. The infrared detector cap according to any one of claims 1 to 5, wherein the optical member is a quadrangular or hexagonal filter that transmits infrared rays in a predetermined wavelength range .   A cap of the infrared detector according to any one of claims 1 to 6;
  A substrate,
  A metal plate-like member disposed on the substrate;
  An infrared detecting element disposed on the metal plate member;
  Including
  The cap is disposed on the metal plate member so as to cover the infrared detecting element.
  An infrared detector characterized by that.