WO2016106947A1 - 组合式掩模板及其制作方法 - Google Patents

组合式掩模板及其制作方法 Download PDF

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Publication number
WO2016106947A1
WO2016106947A1 PCT/CN2015/072597 CN2015072597W WO2016106947A1 WO 2016106947 A1 WO2016106947 A1 WO 2016106947A1 CN 2015072597 W CN2015072597 W CN 2015072597W WO 2016106947 A1 WO2016106947 A1 WO 2016106947A1
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WIPO (PCT)
Prior art keywords
rafts
mask
raft
grooves
jaw
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PCT/CN2015/072597
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English (en)
French (fr)
Inventor
吴聪原
刘亚伟
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深圳市华星光电技术有限公司
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Priority to US14/429,777 priority Critical patent/US20160343994A1/en
Publication of WO2016106947A1 publication Critical patent/WO2016106947A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/80—Etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/861—Repairing

Definitions

  • the present invention relates to the field of fabrication of organic light emitting diode displays, and more particularly to a combined mask and a method of fabricating the same.
  • OLED Organic Light Emitting Diode
  • the OLED has an anode, an organic light-emitting layer, and a cathode which are sequentially formed on a substrate.
  • the functional material layer and the cathode metal layer film of the OLED are prepared by a vacuum thermal evaporation process, and the vacuum thermal evaporation process requires the use of a mask.
  • the role of the mask is to evaporate the OLED material to the design location, so the location, shape and surface flatness of the mask are important.
  • FIG. 1 is a schematic view showing a vacuum thermal evaporation process of an OLED material, in which an OLED material 200 to be evaporated is added in a crucible 100, and in a vacuum environment of less than 10 ⁇ 5 Pa, the crucible 100 is slowly heated to reach the gas of the OLED material 200. After the temperature, the OLED material 200 gradually becomes gaseous sublimation, and passes through the opening of the mask 300, and gaseous molecules are deposited on the surface of the substrate 400, and are cooled and solidified into solid molecules. The continuous accumulation of molecules of the OLED material slowly forms a thin film on the substrate 400.
  • FIG. 2 to FIG. 6 are schematic diagrams showing a process of fabricating a small-sized mask for vacuum thermal evaporation of an existing OLED material.
  • the manufacturing process generally includes: Step 1. As shown in FIG. 2, a stainless steel mask frame 10 is formed; and in step 2, as shown in FIG. 3, a mask substrate 20' is provided, and the mask substrate 20' is generally 20 a sheet of micron to 100 micron stainless steel or nickel-iron alloy steel; step 3, as shown in FIG. 4, the mask substrate 20' is patterned, that is, a small hole 21 is formed in the mask substrate 20' to form a mask. 20; Step 4, as shown in FIG.
  • Step 5 a certain force is applied around the mask 20 to make the surface flat, and the opening 21 is not deformed, and then the mask 20 is aligned with the mask frame 10; Step 5 As shown in FIG. 6, laser spot welding causes the mask 20 to be soldered to the mask frame 10. After the above manufacturing process is completed, the surface of the mask 20 is flat, the opening 21 is not deformed, and the mask 20 can be conveniently accessed by moving the mask frame 10.
  • the mask used has a mask substrate size of 1500mm x 1800mm or more, and the size is large, and there is no corresponding flat whole material.
  • the sheet can be hollowed out to make a mask, and a combined mask is required.
  • the object of the present invention is to provide a combined mask, wherein the mask frame does not need to be grooved, and the thickness of the mask is uniform, which can reduce the processing difficulty of the flatness of the mask frame during repair and polishing, and is easy to reuse the mask frame. And avoid the generation of shadow effects.
  • the object of the present invention is to provide a method for fabricating a mask, which is suitable for fabricating a combined mask of a larger size.
  • the combined mask made by the method does not need to be grooved or masked.
  • the uniform thickness can reduce the processing difficulty of the flatness of the mask frame during rework and polishing, and it is easy to reuse the mask frame and avoid the shadow effect.
  • the present invention firstly provides a combined mask comprising a mask frame, a plurality of first jaws juxtaposed parallel to the long side of the mask frame, and a plurality of parallel sides parallel to the short side of the mask frame.
  • the two ends of the plurality of first rafts are fixed to the short sides of the mask frame by spot welding, and the two ends of the plurality of second rafts are fixed to the long sides of the mask frame by spot welding; a plurality of first rafts and a plurality of second rafts overlap each other to form a grid-like structure having a plurality of film-forming holes;
  • the plurality of first rafts and the plurality of second rafts are equal in thickness; the first raft and the second raft overlap each other with a first groove extending through the width of the first raft a portion of the second raft that overlaps the first raft is provided with a second groove extending through the width of the second raft; the first and second rafts are fitted to each other by the first and second grooves, The overlapping and the upper and lower surfaces of the first and second jaws are respectively located on the same plane.
  • the dimension of the first groove along the length of the first jaw is equal to the width of the second jaw, and the dimension of the second groove along the length of the second jaw is equal to the width of the first jaw.
  • the sum of the depths of the first and second grooves is equal to the thickness of the first or second raft.
  • the depth of the first and second grooves is 1/2 of the thickness of the first raft or the second raft.
  • the first and second jaws are firmly connected to the second jaw by laser welding through the portions where the first and second grooves are fitted and overlapped with each other.
  • the invention also provides a method for manufacturing a combined mask, comprising the following steps:
  • Step 1 Manufacture a plurality of first rafts and a plurality of second rafts by etching or laser;
  • the plurality of first rafts and the plurality of second rafts are equal in thickness; the first slab and the second slab are overlapped with a first groove extending through the width of the first raft. a portion of the second seesaw and the first seesaw to be overlapped is provided with a second recess extending through the width of the second seesaw;
  • Step 2 providing a mask frame, and fixing both ends of the plurality of first jaws to the short side of the mask frame by spot welding, and fixing the two ends of the plurality of second jaws to the mask by spot welding On the long side of the film frame;
  • the plurality of first rafts and the plurality of second rafts overlap each other to form a grid-like structure having a plurality of film-forming holes; the first and second dams pass each other through the first and second grooves Engaging, overlapping, and positioning the upper and lower surfaces of the first and second jaws in the same plane;
  • Step 3 Laser welding the portions of the first and second rafts that are fitted and overlapped by the first and second grooves, so that the first raft and the second raft are firmly connected.
  • a plurality of first slabs are overlapped with a plurality of second slabs, and then both ends of the first and second slabs are fixed to the mask frame by spot welding.
  • the two ends of the first rafts or the two ends of the second raft are fixed to the mask frame by spot welding, and then the two ends of the second raft or the first raft are correspondingly Both ends are fixed to the mask frame by spot welding.
  • a dimension of the first groove along a length direction of the first seesaw is equal to a width of the second seesaw, and a dimension of the second groove along a length direction of the second seesaw is equal to a width of the first seesaw; the first The sum of the depths of the second grooves is equal to the thickness of the first or second raft.
  • the depth of the first and second grooves is 1/2 of the thickness of the first raft or the second raft.
  • the invention also provides a combined mask comprising a mask frame, a plurality of first slabs juxtaposed parallel to the long side of the mask frame, and a plurality of second slabs juxtaposed parallel to the short sides of the mask frame;
  • the two ends of the plurality of first rafts are fixed to the short sides of the mask frame by spot welding, and the two ends of the plurality of second rafts are fixed to the long sides of the mask frame by spot welding; a plurality of first rafts and a plurality of second rafts overlap each other to form a grid-like structure having a plurality of film-forming holes;
  • the plurality of first rafts and the plurality of second rafts are equal in thickness; the first raft and the second raft overlap each other with a first groove extending through the width of the first raft a portion of the second raft that overlaps the first raft is provided with a second groove extending through the width of the second raft; the first and second rafts are fitted to each other by the first and second grooves, Overlap, and the upper and lower surfaces of the first and second jaws are respectively located on the same plane;
  • the dimension of the first groove along the length of the first seesaw is equal to the width of the second seesaw, and the dimension of the second groove along the length of the second seesaw is equal to the width of the first seesaw;
  • the sum of the depths of the first and second grooves is equal to the thickness of the first or second raft.
  • a combined mask and a manufacturing method thereof the mask frame is combined with the first and second jaws, and the first and second jaws are provided with the same thickness, and 1.
  • the second jaws are mutually fitted and overlapped by the first and second grooves, so that the upper and lower surfaces of the first and second jaws are respectively located on the same plane, and the first and second jaws overlap.
  • the thickness of the portion is still the thickness of the first first or second slab, so that the mask frame does not need to be grooved, and the thickness of the mask is uniform, which can reduce the processing difficulty of the flatness of the mask frame during rework polishing, and is easy to mask.
  • the border is reused to avoid the shadowing effect of the existing combined mask.
  • FIG. 1 is a schematic view of a vacuum thermal evaporation process of an OLED material
  • FIG. 2 is a schematic view showing a step 1 of a conventional mask manufacturing process
  • FIG. 3 is a schematic view showing a step 2 of a conventional mask manufacturing process
  • FIG. 4 is a schematic view showing a step 3 of a conventional mask manufacturing process
  • FIG. 5 is a schematic view showing a step 4 of a conventional mask manufacturing process
  • FIG. 6 is a schematic view showing a step 5 of a conventional mask manufacturing process
  • Figure 7 is a top plan view of the combined mask of the present invention.
  • Figure 8 is a schematic view showing a grid-like structure in which the first and second jaws of the combined mask of the present invention overlap each other;
  • Figure 9 is a cross-sectional view corresponding to C-C in Figure 8.
  • Figure 10 is a cross-sectional view corresponding to D-D in Figure 8.
  • Figure 11 is a perspective view of the first jaw of the combined mask of the present invention.
  • FIG. 12 is a perspective view of a second jaw of the combined mask of the present invention.
  • FIG. 13 is a flow chart of a method for fabricating a combined mask of the present invention.
  • FIGS. 14A and 14B are schematic views showing a first embodiment of step 2 of the method for fabricating a combined mask according to the present invention.
  • 15A and 15B are schematic views showing a second embodiment of the second step of the method for fabricating the combined mask of the present invention.
  • the present invention first provides a combined mask comprising:
  • the mask frame 1 includes four sides, the four sides surrounding an open area;
  • the two ends of the plurality of first rafts 2 are fixed to the short sides of the mask frame 1 by spot welding, and the two ends of the plurality of second rafts 3 are fixed to the long sides of the mask frame 1 by spot welding.
  • the plurality of first rafts 2 and the plurality of second rafts 3 overlap each other to form a grid-like structure having a plurality of film-forming holes 4, which constitute a mask pattern.
  • the thicknesses of the plurality of first rafts 2 and the plurality of second rafts 3 are equal. a portion of the first raft 2 overlapping the second raft 3 is provided with a first recess 21 extending through the width of the first raft 2; the second raft 3 is overlapped with the first raft 2 The portion is provided with a second recess 31 extending through the width of the second raft 3.
  • the first and second jaws 2, 3 are mutually fitted and overlapped by the first and second grooves 21, 31, and the upper and lower surfaces of the first and second jaws 2, 3 are respectively Located in the same plane, the thickness of the overlap of the first and second jaws 2, 3 is still the thickness of the individual first or second jaws 2, 3, and the thickness of the mask is uniform.
  • Such an arrangement does not need to dig a groove on the mask frame 1 on the one hand, can reduce the processing difficulty of the flatness of the mask frame 1 during rework and polishing, and is easy to reuse the mask frame 1; on the other hand, the existing comparison is solved.
  • a large-sized combined mask has a technique in which a difference in thickness of a mask occurs at a mask overlapping position to cause a shadow effect.
  • the dimension of the first groove 21 along the length direction of the first raft 2 is equal to the width of the second raft 3
  • the dimension of the second groove 31 along the length of the second raft 3 is equal to the first ⁇
  • the width of the plate 2 is such that the first and second jaws 2, 3 are relatively closely fitted to each other through the first and second grooves 21, 31.
  • the sum of the depths of the first and second grooves 21, 31 is equal to the thickness of the first raft 2 or the second raft 3, preferably, the depth of the first and second grooves 21, 31 It is 1/2 of the thickness of the first slab 2 or the second slab 3, so that the first and second slabs 2, 3 are mutually engaged and intersected by the first and second grooves 21, 31.
  • the upper surfaces of the first and second jaws 2, 3 are located on the same plane, and the lower surfaces of the first and second jaws 2, 3 are also in the same plane.
  • first and second jaws 2, 3 are laser-welded to the first jaw 2 and the second jaw through the portions where the first and second grooves 21, 31 are fitted and overlapped with each other.
  • the board 3 is firmly connected.
  • the combined mask can be applied to the evaporation of inorganic materials such as OLED organic materials and lithium fluoride (LiF), and can also be applied to other vacuum thermal evaporation fields, and can also be applied to other methods of film formation, such as Screen printing, laser transfer, spray filming, etc.
  • inorganic materials such as OLED organic materials and lithium fluoride (LiF)
  • LiF lithium fluoride
  • the present invention further provides a method for fabricating a combined mask, comprising the following steps:
  • Step 1 Several first rafts 2 and a plurality of second rafts 3 are produced by etching or laser.
  • the plurality of first rafts 2 and the plurality of second rafts 3 have the same thickness; the portions of the first raft 2 and the second raft 3 that are to overlap each other are provided with a width extending through the first raft 2
  • the dimension of the first groove 21 along the length direction of the first raft 2 is equal to the width of the second raft 3
  • the dimension of the second groove 31 along the length of the second raft 3 is equal to the first ⁇ The width of the board 2.
  • the sum of the depths of the first and second grooves 21, 31 is equal to the thickness of the first raft 2 or the second raft 3, preferably, the depth of the first and second grooves 21, 31 It is 1/2 of the thickness of the first slab 2 or the second slab 3 .
  • Step 2 providing a mask frame 1 , and fixing both ends of the plurality of first jaws 2 to the short side of the mask frame 1 by spot welding, and the two ends of the plurality of second jaws 3 pass through the point The solder is fixed to the long side of the mask frame 1.
  • the plurality of first rafts 2 and the plurality of second rafts 3 overlap each other to form a grid-like structure having a plurality of film-forming holes 4, which constitute a mask pattern.
  • the first and second jaws 2, 3 are mutually fitted and overlapped by the first and second grooves 21, 31, and the upper and lower sides of the first and second jaws 2, 3 are made The surfaces are in the same plane.
  • the step 2 can have two implementations. As shown in FIG. 14A and FIG. 14B, in step 2, a plurality of first slabs 2 and a plurality of second slabs 3 are overlapped to form a grid-like structure, and then a plurality of first and second rafts are formed. Both ends of the plates 2, 3 are fixed to the mask frame 1 by spot welding.
  • the step 2 can also fix the two ends of the plurality of first rafts 2 to the mask frame 1 by spot welding, and then pass the two ends of the second raft 3 accordingly.
  • Spot welding is fixed on the mask frame 1 to form a grid structure.
  • both ends of the plurality of second rafts 3 may be first fixed to the mask frame 1 by spot welding, and then both ends of the first raft 2 are fixed by spot welding.
  • a grid structure is formed on the mask frame 1, a grid structure is formed.
  • Step 3 laser welding the first and second jaws 2, 3 through the first and second grooves 21, 31 to be mutually fitted and overlapped, so that the first jaw 2 and the second The seesaw 3 is firmly connected.
  • the combined mask made by the above method has no mask groove 1 and the thickness of the mask is uniform, which can reduce the processing difficulty of the flatness of the mask frame 1 during rework and polishing, and is easy to reuse the mask frame 1. This avoids the shadow effect of the existing larger size combined mask.
  • the composite mask provided by the present invention and the manufacturing method thereof the mask frame is combined with the first and second jaws, and the first and second jaws are provided with the same thickness, and the first and the first The second and second recesses are mutually fitted and overlapped by the first and second recesses, such that the upper and lower surfaces of the first and second jaws are respectively located on the same plane, and the thickness of the first and second jaws overlaps. It is still the thickness of the first first or second slab, so that the mask frame does not need to be grooved, and the thickness of the mask is uniform, which can reduce the processing difficulty of the flatness of the mask frame during the polishing and polishing, and is easy to repeat the mask frame. Utilize, to avoid the shadow effect of the existing larger size combined mask.

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Abstract

一种组合式掩膜板及其制作方法。该组合式掩膜板包括掩膜边框(1)、数条第一摭板(2)、及数条第二摭板(3)；所述数条第一摭板(2)与数条第二摭板(3)相互交叠，形成具有多个成膜孔(4)的网格状结构；所述数条第一摭板(2)与数条第二摭板(3)的厚度相等；所述第一摭板(2)与第二摭板(3)交叠的部位设有贯穿该第一摭板(2)宽度的第一凹槽(21)，所述第二摭板(3)与第一摭板(2)交叠的部位设有贯穿该第二摭板(3)宽度的第二凹槽(31)；所述第一、第二摭板(2、3)通过第一、第二凹槽(21、31)相互嵌合、交叠，并使得所述第一、第二摭板(2、3)的上、下表面分别位于同一平面。

Description

组合式掩模板及其制作方法 技术领域
本发明涉及有机发光二极管显示器的制作领域，尤其涉及一种组合式掩模板及其制作方法。
背景技术
有机发光二级管显示器(Organic Light Emitting Diode，OLED)是一种极具发展前景的平板显示技术，它具有十分优异的显示性能，特别是自发光、结构简单、超轻薄、响应速度快、宽视角、低功耗及可实现柔性显示等特性，被誉为“梦幻显示器”，再加上其生产设备投资远小于TFT-LCD，得到了各大显示器厂家的青睐，已成为显示技术领域中第三代显示器件的主力军。目前OLED已处于大规模量产的前夜，随着研究的进一步深入，新技术的不断涌现，OLED显示器件必将有一个突破性的发展。
OLED具有依次形成于基板上的阳极、有机发光层和阴极。OLED各功能材料层与阴极金属层薄膜通过真空热蒸镀工艺制备，真空热蒸镀工艺需要使用到掩膜板(Mask)。掩膜板的作用是使OLED材料蒸镀到设计的位置，因此掩膜板的开孔位置、形状以及表面平整度都相当重要。图1所示为OLED材料真空热蒸镀过程的示意图，坩埚100内添置有待蒸镀的OLED材料200，在小于10-5Pa的真空度环境下，坩埚100缓慢升温，到达OLED材料200的气化温度以后，OLED材料200慢慢变成气态升华上来，穿过掩膜板300的开孔，气态分子在基板400表面沉积，并降温凝结成固态分子。OLED材料分子的不断堆积慢慢形成薄膜于基板400上。
请参阅图2至图6，为现有的OLED材料真空热蒸镀用的尺寸较小的掩膜板制作过程的示意图。该制作过程一般包括：步骤1、如图2所示，制作不锈钢掩膜边框(Frame)10；步骤2、如图3所示，提供掩膜基板20’，该掩膜基板20’一般是20微米至100微米的不锈钢或镍铁合金钢的薄片；步骤3、如图4所示，对掩膜基板20’进行图案化处理，即在掩膜基板20’上开一些小孔21，形成掩膜20；步骤4、如图5所示，在掩膜20四周施加一定的力，使其表面平整，并且开孔21无变形，然后将掩膜20与掩膜边框10对位好；步骤5、如图6所示，激光点焊，使掩膜20与掩膜边框10焊接在一起。完成上述制作过程后，掩膜20的表面平整，开孔21无形变，并且通过挪动掩膜边框10可以方便取用掩膜20。
对于白光OLED(WOLED)高世代线，特别是6代或以上，所使用的掩膜板，其掩膜基板尺寸在1500mm x 1800mm以上，尺寸较大，已无相对应的平坦整片式的原料板材可挖空来制做掩膜，而需采用组合式的掩膜。
现有的用于WOLED高世代线的较大尺寸的组合式掩膜板，由于掩膜重叠区域的厚度不一样，为避免基板贴合时出现破片需在掩膜边框上挖槽，并存在阴影效应问题。
发明内容
本发明的目的在于提供一种组合式掩膜板，其掩膜边框无需挖槽，掩膜的厚度均匀，能够降低掩膜边框返修抛光时平面度的加工难度，易于对掩膜边框进行重复利用，并避免阴影效应的产生。
本发明的目的还在于提供一种掩膜板的制作方法，适用于制作较大尺寸的组合式掩膜板，采用该方法制作的组合式掩膜板，其掩膜边框无需挖槽，掩膜的厚度均匀，能够降低掩膜边框返修抛光时平面度的加工难度，易于对掩膜边框进行重复利用，并避免阴影效应的产生。
为实现上述目的，本发明首先提供一种组合式掩膜板，包括掩膜边框、数条并列平行于掩膜边框长边的第一摭板、及数条并列平行于掩膜边框短边的第二摭板；
所述数条第一摭板的两端通过点焊固定于掩膜边框的短边上，所述数条第二摭板的两端通过点焊固定于掩膜边框的长边上；所述数条第一摭板与数条第二摭板相互交叠，形成具有多个成膜孔的网格状结构；
所述数条第一摭板与数条第二摭板的厚度相等；所述第一摭板与第二摭板交叠的部位设有贯穿该第一摭板宽度的第一凹槽，所述第二摭板与第一摭板交叠的部位设有贯穿该第二摭板宽度的第二凹槽；所述第一、第二摭板通过第一、第二凹槽相互嵌合、交叠，并使得所述第一、第二摭板的上、下表面分别位于同一平面。
所述第一凹槽沿第一摭板长度方向的尺寸等于第二摭板的宽度，所述第二凹槽沿第二摭板长度方向的尺寸等于第一摭板的宽度。
所述第一、第二凹槽的深度之和等于所述第一摭板或第二摭板的厚度。
所述第一、第二凹槽的深度均为所述第一摭板或第二摭板厚度的1/2。
所述第一、第二摭板通过第一、第二凹槽相互嵌合、交叠的部位再经激光焊接使所述第一摭板与第二摭板牢固连接。
本发明还提供一种组合式掩膜板的制作方法，包括如下步骤：
步骤1、通过蚀刻或激光制作数条第一摭板与数条第二摭板；
所述数条第一摭板与数条第二摭板的厚度相等；所述第一摭板与第二摭板欲交叠的部位设有贯穿该第一摭板宽度的第一凹槽，所述第二摭板与第一摭板欲交叠的部位设有贯穿该第二摭板宽度的第二凹槽；
步骤2、提供掩膜边框，将所述数条第一摭板的两端通过点焊固定于掩膜边框的短边上，所述数条第二摭板的两端通过点焊固定于掩膜边框的长边上；
所述数条第一摭板与数条第二摭板相互交叠，形成具有多个成膜孔的网格状结构；所述第一、第二摭板通过第一、第二凹槽相互嵌合、交叠在一起，并使得所述第一、第二摭板的上、下表面分别位于同一平面；
步骤3、对所述第一、第二摭板通过第一、第二凹槽相互嵌合、交叠的部位进行激光焊接，使所述第一摭板与第二摭板牢固连接。
所述步骤2先将数条第一摭板与数条第二摭板进行交叠，再将数条第一、第二摭板的两端通过点焊固定于掩膜边框上。
所述步骤2先将所述数条第一摭板的两端或第二摭板的两端通过点焊固定于掩膜边框上，再相应将第二摭板的两端或第一摭板的两端通过点焊固定于掩膜边框上。
所述第一凹槽沿第一摭板长度方向的尺寸等于第二摭板的宽度，所述第二凹槽沿第二摭板长度方向的尺寸等于第一摭板的宽度；所述第一、第二凹槽的深度之和等于所述第一摭板或第二摭板的厚度。
所述第一、第二凹槽的深度均为所述第一摭板或第二摭板厚度的1/2。
本发明还提供一种组合式掩膜板，包括掩膜边框、数条并列平行于掩膜边框长边的第一摭板、及数条并列平行于掩膜边框短边的第二摭板；
所述数条第一摭板的两端通过点焊固定于掩膜边框的短边上，所述数条第二摭板的两端通过点焊固定于掩膜边框的长边上；所述数条第一摭板与数条第二摭板相互交叠，形成具有多个成膜孔的网格状结构；
所述数条第一摭板与数条第二摭板的厚度相等；所述第一摭板与第二摭板交叠的部位设有贯穿该第一摭板宽度的第一凹槽，所述第二摭板与第一摭板交叠的部位设有贯穿该第二摭板宽度的第二凹槽；所述第一、第二摭板通过第一、第二凹槽相互嵌合、交叠，并使得所述第一、第二摭板的上、下表面分别位于同一平面；
其中，所述第一凹槽沿第一摭板长度方向的尺寸等于第二摭板的宽度，所述第二凹槽沿第二摭板长度方向的尺寸等于第一摭板的宽度；
其中，所述第一、第二凹槽的深度之和等于所述第一摭板或第二摭板的厚度。
本发明的有益效果：本发明提供的一种组合式掩膜板及其制作方法，将掩膜边框与第一、第二摭板组合，设置第一、第二摭板的厚度相同，且第一、第二摭板通过第一、第二凹槽相互嵌合、交叠，使得所述第一、第二摭板的上、下表面分别位于同一平面，第一、第二摭板交叠处的厚度仍为单独的第一或第二摭板的厚度，从而实现掩膜边框无需挖槽，掩膜的厚度均匀，能够降低掩膜边框返修抛光时平面度的加工难度，易于对掩膜边框进行重复利用，避免了现有的组合式掩膜板阴影效应的产生。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为OLED材料真空热蒸镀过程的示意图；
图2为现有的掩膜板制作过程步骤1的示意图；
图3为现有的掩膜板制作过程步骤2的示意图；
图4为现有的掩膜板制作过程步骤3的示意图；
图5为现有的掩膜板制作过程步骤4的示意图；
图6为现有的掩膜板制作过程步骤5的示意图；
图7为本发明组合式掩膜板的俯视示意图；
图8为本发明组合式掩膜板的第一、第二摭板相互交叠形成的网格状结构的示意图；
图9为对应图8中C-C处的剖视图；
图10为对应图8中D-D处的剖视图；
图11为本发明组合式掩膜板的第一摭板的立体示意图；
图12为本发明组合式掩膜板的第二摭板的立体示意图；
图13为本发明组合式掩膜板的制作方法的流程图；
图14A、图14B为本发明组合式掩膜板的制作方法的步骤2的第一种实施方式的示意图；
图15A、图15B为本发明组合式掩膜板的制作方法的步骤2的第二种实施方式的示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请同时参阅图7至图12，本发明首先提供一种组合式掩膜板，包括：
掩膜边框1，所述掩膜边框1包括四条边，该四条边围拢出一开口区域；
数条第一摭板2，所述数条第一摭板2并列平行于掩膜边框1的长边；
及数条第二摭板3，所述数条第二摭板3并列平行于掩膜边框1的短边。
所述数条第一摭板2的两端通过点焊固定于掩膜边框1的短边上，所述数条第二摭板3的两端通过点焊固定于掩膜边框1的长边上；所述数条第一摭板2与数条第二摭板3相互交叠，形成具有多个成膜孔4的网格状结构，该网格结构即构成掩膜图形。
需要重点说明的是，所述数条第一摭板2与数条第二摭板3的厚度相等。所述第一摭板2与第二摭板3交叠的部位设有贯穿该第一摭板2宽度的第一凹槽21；所述第二摭板3与第一摭板2交叠的部位设有贯穿该第二摭板3宽度的第二凹槽31。所述第一、第二摭板2、3通过第一、第二凹槽21、31相互嵌合、交叠，并使得所述第一、第二摭板2、3的上、下表面分别位于同一平面，第一、第二摭板2、3交叠处的厚度仍为单独的第一或第二摭板2、3的厚度，掩膜的厚度均匀。这样的设置一方面不需要在掩膜边框1上挖槽，能够降低掩膜边框1返修抛光时平面度的加工难度，易于对掩膜边框1进行重复利用；另一方面解决了现有的较大尺寸的组合式掩膜板在掩膜重叠位置处存在一个掩膜的厚度差而产生阴影效应(Shadow effect)的技术问题。
具体的，所述第一凹槽21沿第一摭板2长度方向的尺寸等于第二摭板3的宽度，所述第二凹槽31沿第二摭板3长度方向的尺寸等于第一摭板2的宽度，使得所述第一、第二摭板2、3通过第一、第二凹槽21、31较为紧密的相互嵌合。
所述第一、第二凹槽21、31的深度之和等于所述第一摭板2或第二摭板3的厚度，优选的，所述第一、第二凹槽21、31的深度均为所述第一摭板2或第二摭板3厚度的1/2，从而所述第一、第二摭板2、3通过第一、第二凹槽21、31相互嵌合、交叠后，所述第一、第二摭板2、3的上表面位于同一平面，所述第一、第二摭板2、3的下表面亦位于同一平面。
进一步的，所述第一、第二摭板2、3通过第一、第二凹槽21、31相互嵌合、交叠的部位再经激光焊接使所述第一摭板2与第二摭板3牢固连接。
所述组合式掩膜板可应用于OLED有机材料以及氟化锂(LiF)等无机材料的蒸镀，也可应用于其它真空热蒸镀领域，还可应用于其它方式的成膜制程，如网印、镭射转印、喷涂成膜等。
请参阅图13，结合图7至图12，本发明还提供一种组合式掩膜板的制作方法，包括如下步骤：
步骤1、通过蚀刻或激光制作数条第一摭板2与数条第二摭板3。
所述数条第一摭板2与数条第二摭板3的厚度相等；所述第一摭板2与第二摭板3欲交叠的部位设有贯穿该第一摭板2宽度的第一凹槽21，所述第二摭板3与第一摭板2欲交叠的部位设有贯穿该第二摭板3宽度的第二凹槽31。
具体的，所述第一凹槽21沿第一摭板2长度方向的尺寸等于第二摭板3的宽度，所述第二凹槽31沿第二摭板3长度方向的尺寸等于第一摭板2的宽度。所述第一、第二凹槽21、31的深度之和等于所述第一摭板2或第二摭板3的厚度，优选的，所述第一、第二凹槽21、31的深度均为所述第一摭板2或第二摭板3厚度的1/2。
步骤2、提供掩膜边框1，将所述数条第一摭板2的两端通过点焊固定于掩膜边框1的短边上，所述数条第二摭板3的两端通过点焊固定于掩膜边框1的长边上。
所述数条第一摭板2与数条第二摭板3相互交叠，形成具有多个成膜孔4的网格状结构，该网格结构即构成掩膜图形。所述第一、第二摭板2、3通过第一、第二凹槽21、31相互嵌合、交叠在一起，并使得所述第一、第二摭板2、3的上、下表面分别位于同一平面。
所述步骤2可以有两种实施方式。如图14A、14B所示，该步骤2可先将数条第一摭板2与数条第二摭板3进行交叠，形成网格状结构之后，再将数条第一、第二摭板2、3的两端通过点焊固定于掩膜边框1上。
如图15A、15B所示，该步骤2还可先将所述数条第一摭板2的两端通过点焊固定于掩膜边框1上，再相应将第二摭板3的两端通过点焊固定于掩膜边框1上，形成网格状结构。当然，在该实施方式中，也可先将所述数条第二摭板3的两端通过点焊固定于掩膜边框1上，再相应将第一摭板2的两端通过点焊固定于掩膜边框1上，形成网格状结构。
步骤3、对所述第一、第二摭板2、3通过第一、第二凹槽21、31相互嵌合、交叠的部位进行激光焊接，使所述第一摭板2与第二摭板3牢固连接。
至此，完成该组合式掩膜板的制作。
通过上述方法制作的组合式掩膜板，其掩膜边框1无需挖槽，掩膜的厚度均匀，能够降低掩膜边框1返修抛光时平面度的加工难度，易于对掩膜边框1进行重复利用，避免了现有较大尺寸的组合式掩膜板阴影效应的产生。
综上所述，本发明提供的组合式掩膜板及其制作方法，将掩膜边框与第一、第二摭板组合，设置第一、第二摭板的厚度相同，且第一、第二摭板通过第一、第二凹槽相互嵌合、交叠，使得所述第一、第二摭板的上、下表面分别位于同一平面，第一、第二摭板交叠处的厚度仍为单独的第一或第二摭板的厚度，从而实现掩膜边框无需挖槽，掩膜的厚度均匀，能够降低掩膜边框返修抛光时平面度的加工难度，易于对掩膜边框进行重复利用，避免了现有的较大尺寸的组合式掩膜板阴影效应的产生。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (13)

  1. 一种组合式掩膜板，包括掩膜边框、数条并列平行于掩膜边框长边的第一摭板、及数条并列平行于掩膜边框短边的第二摭板；
    所述数条第一摭板的两端通过点焊固定于掩膜边框的短边上，所述数条第二摭板的两端通过点焊固定于掩膜边框的长边上；所述数条第一摭板与数条第二摭板相互交叠，形成具有多个成膜孔的网格状结构；
    所述数条第一摭板与数条第二摭板的厚度相等；所述第一摭板与第二摭板交叠的部位设有贯穿该第一摭板宽度的第一凹槽，所述第二摭板与第一摭板交叠的部位设有贯穿该第二摭板宽度的第二凹槽；所述第一、第二摭板通过第一、第二凹槽相互嵌合、交叠，并使得所述第一、第二摭板的上、下表面分别位于同一平面。
  2. 如权利要求1所述的组合式掩膜板，其中，所述第一凹槽沿第一摭板长度方向的尺寸等于第二摭板的宽度，所述第二凹槽沿第二摭板长度方向的尺寸等于第一摭板的宽度。
  3. 如权利要求1所述的组合式掩膜板，其中，所述第一、第二凹槽的深度之和等于所述第一摭板或第二摭板的厚度。
  4. 如权利要求3所述的组合式掩膜板，其中，所述第一、第二凹槽的深度均为所述第一摭板或第二摭板厚度的1/2。
  5. 如权利要求1所述的组合式掩膜板，其中，所述第一、第二摭板通过第一、第二凹槽相互嵌合、交叠的部位再经激光焊接使所述第一摭板与第二摭板牢固连接。
  6. 一种组合式掩膜板的制作方法，包括如下步骤：
    步骤1、通过蚀刻或激光制作数条第一摭板与数条第二摭板；
    所述数条第一摭板与数条第二摭板的厚度相等；所述第一摭板与第二摭板欲交叠的部位设有贯穿该第一摭板宽度的第一凹槽，所述第二摭板与第一摭板欲交叠的部位设有贯穿该第二摭板宽度的第二凹槽；
    步骤2、提供掩膜边框，将所述数条第一摭板的两端通过点焊固定于掩膜边框的短边上，所述数条第二摭板的两端通过点焊固定于掩膜边框的长边上；
    所述数条第一摭板与数条第二摭板相互交叠，形成具有多个成膜孔的网格状结构；所述第一、第二摭板通过第一、第二凹槽相互嵌合、交叠在一起，并使得所述第一、第二摭板的上、下表面分别位于同一平面；
    步骤3、对所述第一、第二摭板通过第一、第二凹槽相互嵌合、交叠的部位进行激光焊接，使所述第一摭板与第二摭板牢固连接。
  7. 如权利要求6所述的组合式掩膜板的制作方法，其中，所述步骤2先将数条第一摭板与数条第二摭板进行交叠，再将数条第一、第二摭板的两端通过点焊固定于掩膜边框上。
  8. 如权利要求6所述的组合式掩膜板的制作方法，其中，所述步骤2先将所述数条第一摭板的两端或第二摭板的两端通过点焊固定于掩膜边框上，再相应将第二摭板的两端或第一摭板的两端通过点焊固定于掩膜边框上。
  9. 如权利要求6所述的组合式掩膜板的制作方法，其中，所述第一凹槽沿第一摭板长度方向的尺寸等于第二摭板的宽度，所述第二凹槽沿第二摭板长度方向的尺寸等于第一摭板的宽度；所述第一、第二凹槽的深度之和等于所述第一摭板或第二摭板的厚度。
  10. 如权利要求9所述的组合式掩膜板的制作方法，其中，所述第一、第二凹槽的深度均为所述第一摭板或第二摭板厚度的1/2。
  11. 一种组合式掩膜板，包括掩膜边框、数条并列平行于掩膜边框长边的第一摭板、及数条并列平行于掩膜边框短边的第二摭板；
    所述数条第一摭板的两端通过点焊固定于掩膜边框的短边上，所述数条第二摭板的两端通过点焊固定于掩膜边框的长边上；所述数条第一摭板与数条第二摭板相互交叠，形成具有多个成膜孔的网格状结构；
    所述数条第一摭板与数条第二摭板的厚度相等；所述第一摭板与第二摭板交叠的部位设有贯穿该第一摭板宽度的第一凹槽，所述第二摭板与第一摭板交叠的部位设有贯穿该第二摭板宽度的第二凹槽；所述第一、第二摭板通过第一、第二凹槽相互嵌合、交叠，并使得所述第一、第二摭板的上、下表面分别位于同一平面；
    其中，所述第一凹槽沿第一摭板长度方向的尺寸等于第二摭板的宽度，所述第二凹槽沿第二摭板长度方向的尺寸等于第一摭板的宽度；
    其中，所述第一、第二凹槽的深度之和等于所述第一摭板或第二摭板的厚度。
  12. 如权利要求11所述的组合式掩膜板，其中，所述第一、第二凹槽的深度均为所述第一摭板或第二摭板厚度的1/2。
  13. 如权利要求11所述的组合式掩膜板，其中，所述第一、第二摭板通过第一、第二凹槽相互嵌合、交叠的部位再经激光焊接使所述第一摭板与第二摭板牢固连接。
PCT/CN2015/072597 2014-12-31 2015-02-09 组合式掩模板及其制作方法 WO2016106947A1 (zh)

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CN106019819A (zh) * 2016-07-22 2016-10-12 京东方科技集团股份有限公司 掩膜板及其制作方法
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