WO2016101452A1 - 显示基板及其制作方法、显示装置 - Google Patents

显示基板及其制作方法、显示装置 Download PDF

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Publication number
WO2016101452A1
WO2016101452A1 PCT/CN2015/077060 CN2015077060W WO2016101452A1 WO 2016101452 A1 WO2016101452 A1 WO 2016101452A1 CN 2015077060 W CN2015077060 W CN 2015077060W WO 2016101452 A1 WO2016101452 A1 WO 2016101452A1
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Prior art keywords
pixel
film layer
display
partition wall
display substrate
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PCT/CN2015/077060
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English (en)
French (fr)
Inventor
王辉锋
刘则
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京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/894,003 priority Critical patent/US9768382B2/en
Priority to EP15794047.9A priority patent/EP3240029A4/en
Publication of WO2016101452A1 publication Critical patent/WO2016101452A1/zh

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/10OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a display substrate, a method of fabricating the same, and a display device.
  • OLED display devices have the advantages of self-luminescence, fast response, wide viewing angle, high brightness, colorful color, thinness and lightness compared with liquid crystal displays, and are considered as next-generation display technologies.
  • the main structure of the OLED display device is an OLED display substrate comprising a plurality of pixel regions defined by a pixel defining layer, each pixel region comprising an OLED emitting a particular color of light.
  • the film formation methods for forming the OLED mainly include an evaporation process and a solution process.
  • the evaporation process is mature in the application of small-sized display devices, and the technology has been applied to mass production.
  • the solution process mainly includes inkjet printing, nozzle coating, spin coating, screen printing, etc. Among them, inkjet printing technology is considered to be a large-sized OLED display device due to its high material utilization rate and large size. An important way of producing.
  • the head of the inkjet printing apparatus includes a plurality of nozzles while forming a plurality of display film layers (eg, organic light-emitting layers) of the same-color pixel region.
  • display film layers eg, organic light-emitting layers
  • the head of the inkjet printing apparatus includes a plurality of nozzles while forming a plurality of display film layers (eg, organic light-emitting layers) of the same-color pixel region.
  • display film layers eg, organic light-emitting layers
  • the pixel regions in the prior art are distributed in a matrix, and are generally elongated (eg, red pixel region 2, green pixel region 3, and blue pixel region 4).
  • the head 13 is generally equipped with 256 or 512 nozzles 1, so for mass production, for a 3840 ⁇ 2160 resolution TV, if a nozzle 13 equipped with 256 nozzles 1 is used, 5 nozzles 13 are required to complete 3840 peers and same color pixels.
  • the display film of the area is printed, and then the five heads 13 are simultaneously moved, as shown by the direction of the arrow in FIG. 1, to complete the printing of all the lines of the same color OLED.
  • An object of the present disclosure is to provide a display substrate and a method of fabricating the same, which are used to solve the problem that when the inkjet printing forms a pixel film layer of a pixel unit, there are different thicknesses, resulting in a difference in uniformity between pixels.
  • Another object of the present disclosure is to provide a display device for solving the problem that the film thickness unevenness of the display film layer seriously affects the display quality.
  • a method for manufacturing a display substrate including the following steps:
  • the steps of fabricating the pixel partition include:
  • first pixel partition wall and a second pixel partition wall Forming a first pixel partition wall and a second pixel partition wall, wherein a height of the first pixel partition wall is greater than a height of the second pixel partition wall, the first pixel partition wall defining a first pixel area, the second The pixel partition defines a second pixel area, and the plurality of adjacent second pixel areas are located in the same first pixel area;
  • the step of forming a display film layer in the pixel region by inkjet printing includes:
  • the height is greater than the height of the second pixel partition.
  • the first pixel regions are elongated and distributed in a matrix.
  • the short side of the first pixel region extends in a row direction through a plurality of nozzles
  • the showerhead simultaneously inkjets the same display material in all of the first pixel regions of the same column, and moves the showerhead to inkjet print the corresponding material in the first pixel region of all columns.
  • the same material is inkjet printed in each of the first pixel regions by at least two nozzles.
  • the steps of fabricating the first pixel partition wall and the second pixel partition wall include:
  • the first film layer being located in an area where the first pixel partition wall and the second pixel partition wall are located;
  • the display substrate is an organic light emitting diode display substrate or a color filter substrate of the liquid crystal panel.
  • an organic light emitting diode emitting a specific color light is formed in the second pixel region.
  • the manufacturing method of the display substrate further includes:
  • first pixel partition on the substrate on which the second pixel partition is formed, the first pixel partition defining a first pixel area, and the plurality of adjacent second pixel areas being located in the same first pixel area;
  • the color of the light emitted by the display film layer in the first pixel region is different.
  • the display film layer comprises an organic light emitting layer.
  • the display substrate further includes a display substrate, including a pixel partition wall, for defining a pixel area of the display substrate, the pixel partition wall includes a first pixel partition wall and a second pixel partition wall, and the first pixel partition The height of the wall is greater than the height of the second pixel partition, the first pixel partition defines a first pixel area, the second pixel partition defines a second pixel area, and the plurality of adjacent second pixel areas are located Within the same first pixel area;
  • the same display film layer is disposed in the plurality of second pixel regions located in the same first pixel region, and the height of the display film layer is greater than the height of the second pixel partition wall.
  • the first pixel regions are elongated and distributed in a matrix.
  • the short sides of the first pixel region extend in the row direction, and the display film layer materials in all the first pixel regions of the same column are the same material and are formed by one inkjet printing process.
  • the first pixel partition wall comprises a first film layer and a second film layer on the first film layer; and the second pixel partition wall comprises a first film layer.
  • the first film layer has a thickness of 10 nm to 100 ⁇ m.
  • the second film layer has a thickness of 100 nm to 100 ⁇ m.
  • the material of the first film layer and the second film layer is resin, silicone or silicon dioxide.
  • the display substrate is an organic light emitting diode display substrate or a color filter substrate of the liquid crystal panel.
  • an organic light emitting diode emitting a specific color light is disposed in the second pixel region.
  • the display substrate includes:
  • a second pixel partition wall for defining a second pixel region
  • a first pixel partition wall for defining a first pixel region, wherein the plurality of adjacent second pixel regions are located in the same first pixel region
  • a display film layer emitting light of the same color is disposed in the plurality of second pixel regions in each of the first pixel regions, and the color of the light emitted by the display film layer in the first pixel region of the adjacent column is different.
  • the display film layer comprises an organic light emitting layer.
  • three adjacent second pixel regions are located in the same first pixel region.
  • a display device including the display substrate as described above is also provided in the embodiment of the present disclosure.
  • the pixel partition wall of the display substrate includes a first pixel partition wall defining a first pixel region and a second pixel partition wall defining a second pixel region, wherein the first The height of the pixel partition wall is greater than the height of the second pixel partition wall, and the plurality of adjacent second pixel regions are located in the same first pixel region, so that when the same display material is inkjet printed in the first pixel region, Forming a plurality of second pixel regions in the first pixel region Forming the same display film layer, and setting the height of the display film layer to be greater than the height of the second pixel partition wall, that is, the display film layer in the first pixel region is connected, and is printed in the first pixel by short edge printing Printing the corresponding pixel film layer in the area ensures that the film thickness of the display film layer in the second pixel region is the same, the quality of the display substrate is improved, and the display quality is improved.
  • FIG. 1 is a schematic view showing the effect of inkjet printing to form a display film layer of a pixel region of the same color in the prior art
  • FIG. 2 is a schematic structural view of a display substrate in an embodiment of the present disclosure
  • Figure 3 is a cross-sectional view taken along line A-A of Figure 2;
  • Figure 4 is a cross-sectional view taken along line B-B of Figure 2;
  • Fig. 5 is a view showing the process of inkjet printing to form a display film layer of a pixel region of the same color in the embodiment of the present disclosure.
  • the present disclosure provides a method for fabricating a display substrate, which solves the problem of uneven film thickness when inkjet printing forms a display film layer of a pixel region in the prior art, resulting in a difference in uniformity between pixels.
  • the manufacturing method includes: forming a first pixel partition wall to define a first pixel area, and forming a second pixel partition wall to define a second pixel area, wherein a height of the first pixel partition wall is greater than a height of the second pixel partition wall, and The adjacent second pixel regions are located in the same first pixel region. Therefore, when the same display material is ink-jet printed in the first pixel region, the same display film layer may be formed in the plurality of second pixel regions in the first pixel region, and the height of the display film layer may be set.
  • the display film layer in the first pixel area is connected to the height of the second pixel partition, and the corresponding pixel film layer is printed in the first pixel area by short-side printing, thereby ensuring the second pixel area.
  • the display film thickness is the same, the quality of the display substrate is improved, and the display quality is improved.
  • a method for fabricating a display substrate including:
  • a pixel partition wall is formed for defining a pixel area of the display substrate; and a display film layer is formed in the pixel area by inkjet printing.
  • the steps of fabricating the pixel partition include:
  • first pixel partition wall and a second pixel partition wall Forming a first pixel partition wall and a second pixel partition wall, wherein a height of the first pixel partition wall is greater than a height of the second pixel partition wall, the first pixel partition wall defining a first pixel area, the second The pixel partition defines a second pixel area, and the plurality of adjacent second pixel areas are located in the same first pixel area.
  • the step of forming a display film layer in the pixel region by inkjet printing includes: inkjet printing the same display material in the first pixel region by at least one nozzle, thereby being in the first pixel region
  • the same display film layer is formed in the plurality of second pixel regions, and the height of the display film layer is greater than the height of the second pixel partition wall.
  • the first pixel regions are elongated and distributed in a matrix.
  • the short side of the first pixel region extends in a row direction, and the same display material is simultaneously inkjet printed in all the first pixel regions of the same column by a nozzle including a plurality of nozzles, and the nozzle is moved in all columns.
  • the corresponding material is inkjet printed in the first pixel area.
  • the display substrate By manufacturing the display substrate by the above steps, it is possible to ensure uniformity of the thickness of the display film layer in the pixel region, and to improve the quality of the display substrate.
  • the present disclosure further provides a display substrate including a pixel partition wall for defining a pixel area of a display substrate, and a display film layer, as shown in FIG. 2 to FIG. Within the pixel area.
  • the pixel partition wall includes a first pixel partition wall 101 and a second pixel partition wall 102.
  • the height of the first pixel partition wall 101 is greater than the height of the second pixel partition wall 102, that is, the top surface of the first pixel partition wall 101 is high.
  • the first pixel partition 101 defines a first pixel region 200
  • the second pixel partition 102 defines a second pixel region 201
  • a plurality of adjacent second pixel regions 201 are located within the same first pixel region 200.
  • the display film layer materials in the plurality of second pixel regions 201 in the same first pixel region 200 are the same, and the height of the display film layer is greater than the height of the second pixel partition wall 102.
  • the first pixel regions 200 are elongated and distributed in a matrix, and the short sides of the first pixel region 200 extend in the row direction, and all the first pixel regions in the same column
  • the display film layers within 200 are of the same material and are formed by an inkjet printing process as shown in FIG.
  • three adjacent second pixel regions 201 may be disposed in the same first pixel region 200.
  • the first pixel region 200 in the same column is a same color pixel region, that is, the display film layer material in the same column of the first pixel region 200 is the same, and the first pixel region 200 of the adjacent column is a different color pixel region.
  • it can be RGB, RGB, RGB... Only one column of the second pixel region 201 is included in each of the first pixel regions 200. That is, when the short sides of the first pixel region 200 extend in the row direction, the long sides of the first pixel region 200 extend in the column direction.
  • R represents a red pixel area
  • G represents a green pixel area
  • B represents a blue pixel area.
  • the short side of the first pixel region 200 extends in the row direction does not specifically mean that the short side of the first pixel region 200 is parallel to the row axis, and the short side of the first pixel region 200 may also be a broken line. , curve or slash, the angle between the extension direction of the starting point and the end point and the row direction is not a right angle.
  • the long side of the first pixel region 200 extends in the column direction does not specifically mean that the long side of the first pixel region 200 is parallel to the column axis.
  • the same display material may be simultaneously inkjet printed in all the first pixel regions 200 of the same column by the showerhead 13 including a plurality of nozzles, and the showerhead is moved to perform inkjet printing in the first pixel region of all the columns.
  • the material includes only one row of the first pixel region 200 in FIG.
  • the corresponding materials can also be ink-jet printed in all the first pixel regions 200 by other printing methods, for example, the corresponding display materials are simultaneously ink-jet printed in all the first pixel regions 200 of the same by a nozzle including a plurality of nozzles. And moving the showerhead to inkjet print the corresponding material in the first pixel region 200 of all rows.
  • the corresponding material is inkjet printed in all of the first pixel regions 200 by random printing.
  • each of the first pixel regions 200 is disposed to correspond to at least two nozzles (such as the nozzles 10, 11, 12 in FIG. 5), that is, inkjet printing is performed in the first pixel region 200 by at least two nozzles.
  • the display material since the material printed by each of the first pixel regions 200 is from a plurality of different nozzles, the inkjet volume error of the nozzles is averaged, and the film thickness error between the first pixel regions 200 can be further reduced. It also increases production efficiency. In practical applications, it is preferable to set the models of the nozzles 10, 11, and 12 differently, so that the effect of the average error is better.
  • first pixel partition wall and a second pixel partition wall defining the first pixel area and the second pixel area:
  • the first film layer Forming a pattern of the first film layer, the first film layer being located in a region where the first pixel partition wall 101 and the second pixel partition wall 102 are located;
  • a pattern of a second film layer is formed on the first film layer, the second film layer being located in a region where the first pixel partition wall 101 is located.
  • the first pixel partition 101 formed by the above steps includes a first film layer 1011 and a second film layer 1012.
  • the second pixel partition wall 102 is made of a first film layer, and the first pixel partition wall 101 and the second pixel partition are separated.
  • the height difference of the wall 102 is the thickness of the second film layer.
  • the material of the first film layer and the second film layer may be selected from a resin (for example, polyimide), silicone or silicon dioxide.
  • the thickness of the first film layer may be set to be 10 nm to 100 ⁇ m, exemplarily 50 nm to 500 nm.
  • the second film layer has a thickness of from 100 nm to 100 ⁇ m, exemplarily from 500 nm to 1500 nm. That is, the height of the second pixel partition wall 102 is the thickness of the first film layer: 10 nm - 100 ⁇ m, and the height of the first pixel partition wall 101 is the sum of the thicknesses of the first film layer and the second film layer: 110 nm - 200 ⁇ m.
  • the display substrate in the embodiment of the present disclosure may be a color filter substrate of a liquid crystal panel or an organic light emitting diode display substrate.
  • the pixel partition wall may specifically be a black matrix
  • the display film layer is a filter layer that transmits light of a specific color.
  • the method for manufacturing the corresponding display substrate may further include:
  • a flat layer is formed on the display film layer.
  • the common electrode is formed on the color filter substrate, and the method for manufacturing the display substrate further includes:
  • a common electrode is formed on the flat layer for forming a longitudinal electric field with the pixel electrode on the array substrate to drive the liquid crystal molecules to deflect to realize display of a specific color.
  • the pixel partition wall is a pixel defining layer, and an organic light emitting diode emitting a specific color light is formed in the second pixel region.
  • the method for manufacturing the corresponding display substrate specifically includes:
  • first pixel partition on the substrate on which the second pixel partition is formed, the first pixel partition defining a first pixel area, and the plurality of adjacent second pixel areas being located in the same first pixel area;
  • the color of the light emitted by the display film layer in the first pixel region is different.
  • the display film layer is specifically an organic light-emitting layer.
  • the display film layer may further include other film layers such as an electron transport layer and a hole transport layer.
  • the bottom electrode may be an anode of the organic light emitting diode or a cathode of the organic light emitting diode, which may be selected according to device design requirements, and the disclosure is not limited.
  • the same display material is inkjet printed in a first pixel region 200 by at least two nozzles (such as nozzles 10, 11, 12 in FIG. 5) and passed through a showerhead comprising a plurality of nozzles
  • the same display material is simultaneously inkjet printed in all of the first pixel regions 200 of the same column, and then the showerhead is moved to ink-jet print the corresponding material in the first pixel region 200 of all columns.
  • the first pixel regions 200 defining the adjacent three columns are respectively a red pixel region, a green pixel region, and a blue pixel region, and are specifically inkjet printed in the first pixel region 200 of the first column by a showerhead including a plurality of nozzles.
  • An organic light emitting layer emitting red light each first pixel region 200 corresponding to at least two nozzles, and then moving the shower head, after two columns are spaced apart, inkjet printing organic light emitting red light in the first pixel region 200 of the column Layer until the organic light-emitting layer emitting red light is inkjet printed in all red pixel regions. Then, the above steps are repeated to ink-print the organic light-emitting layer that emits green light in all the green pixel regions, and the organic light-emitting layer that emits blue light is ink-jet-printed in all the blue pixel regions.
  • the manufacturing process of the display substrate in the embodiment of the present disclosure is specifically described below by taking the manufacturing process of the organic light emitting diode display substrate as an example:
  • Step S1 forming a bottom electrode 5 of the organic light emitting diode on the substrate 100, wherein the bottom electrode 5 corresponds to the second pixel region 201, and the material may be a magnesium alloy, a magnesium silver alloy having a reflective effect, Calcium-silver alloy, etc., corresponding to the top-emitting organic light-emitting diode display substrate, may also be ITO, IZO, AZO, etc. having a light-transmitting effect, corresponding to a bottom-emitting or double-sided emitting organic light-emitting diode display substrate.
  • the material may be a magnesium alloy, a magnesium silver alloy having a reflective effect, Calcium-silver alloy, etc., corresponding to the top-emitting organic light-emitting diode display substrate, may also be ITO, IZO, AZO, etc. having a light-transmitting effect, corresponding to a bottom-emitting or double-sided emitting organic light-emitting diode display substrate.
  • the substrate may be a transparent substrate such as a glass substrate, a quartz substrate, or an organic resin substrate.
  • Step S2 forming a first film layer on the substrate 100 completing step S1, and patterning the first film layer to form a pattern of the first film layer, wherein the pattern of the first film layer is located in the first pixel partition wall 101 and The area where the second pixel partition 102 is located;
  • the material of the first film layer may be resin, silicone or silicon dioxide;
  • the remaining photoresist is peeled off to form the first film layer 1011 and the second pixel partition wall 102 of the first pixel partition 101.
  • Step S3 forming a second film layer on the substrate 100 completing step S2, and patterning the second film layer to form a pattern of the second film layer, wherein the pattern of the second film layer is located at the first pixel partition wall region;
  • the material of the second film layer may be resin, silicone or silicon dioxide;
  • the remaining photoresist is stripped to form a second film layer 1012 of the first pixel partition 101.
  • the fabrication of the first pixel partition wall 101 and the second pixel partition wall 102 is completed, wherein the first pixel partition wall 101 includes a first film layer 1011 and a second film layer 1012, and the second pixel partition wall 102 is only composed of the first film layer
  • the height difference between the first pixel partition wall 101 and the second pixel partition wall 102 is the thickness of the second film layer 1012.
  • the first pixel regions 200 defined by the first pixel partition walls 101 are distributed in a matrix, the second pixel partition walls 102 define the second pixel regions 201, and the plurality of adjacent second pixel regions 201 are located in the same first pixel region 200.
  • Step S4 forming an organic light-emitting layer 6 in the first pixel region 200 on the substrate 100 in which the step S3 is completed, thereby forming an organic light-emitting layer 6 in the second pixel region 201 in the first pixel region 200, wherein the organic light-emitting layer 6
  • the height of the second film layer 1012 is greater than the height of the second film layer 1012, so that the organic light-emitting layer 6 in the first pixel region 200 is uniform, and the film thickness of the organic light-emitting layer 6 in the second pixel region 201 in the first pixel region 200 is uniform.
  • the organic light-emitting layer 6 may be a single organic material, or may be a dopant, a phosphorescent material, or a fluorescent material.
  • Step S5 forming a top electrode (not shown) on the substrate 100 completing step S4, and passing carriers (electrons and holes) after applying a suitable bias voltage between the top electrode and the bottom electrode 5.
  • the implantation, transmission and recombination cause the organic light-emitting layer to be excited by the light, thereby achieving the purpose of display.
  • the organic light emitting diode display substrate may further include other film layer structures such as an electron transport layer and a hole transport layer.
  • film layer structures such as an electron transport layer and a hole transport layer.
  • the first pixel partition wall and the second pixel partition wall formed by the above steps may be used to form a black matrix defining a pixel region.
  • inkjet printing in the pixel region is a filter layer that transmits light of a specific color.
  • the specific manufacturing process is referred to the prior art, and details are not described herein again.
  • a display device including the display substrate as described above is further provided in the embodiment of the present disclosure, and the display quality of the display device is improved because the film thickness of the display film layer is uniform.
  • the display device may be any product or component having a display function, such as a liquid crystal panel, an electronic paper, an OLED panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and the like.
  • the technical solution of the present disclosure is that the first pixel region and the second pixel region are formed, and the top surface of the first pixel region is higher than the top surface of the second pixel region, and the adjacent plurality of second pixel regions are located in the same first pixel region. Therefore, when the display material is inkjet printed in the first pixel region, the top surface of the formed display film layer may be disposed higher than the top surface of the second pixel region, so that the display film layer in the first pixel region is connected, thereby ensuring The thickness of the display film layer in the second pixel region is uniform, which improves the quality of the display substrate Quantity, improved display quality.

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Abstract

一种显示基板及其制作方法、显示装置。所述显示基板的像素隔墙包括限定第一像素区域(200)的第一像素隔墙(101)和限定第二像素区域(201)的第二像素隔墙(102)。其中第一像素隔墙(101)的高度大于第二像素隔墙(102)的高度,且多个相邻的第二像素区域(201)位于同一第一像素区域(200)内。

Description

显示基板及其制作方法、显示装置
相关申请的交叉引用
本申请主张在2014年12月26日在中国提交的中国专利申请号No.201410831907.2的优先权,其全部内容通过引用包含于此。
技术领域
本公开涉及显示技术领域,特别是涉及一种显示基板及其制作方法、显示装置。
背景技术
有机电致发光二极管(Organic Light-Emitting Diode,简称OLED)显示器件相对于液晶显示器具有自发光、反应快、视角广、亮度高、色彩艳、轻薄等优点,被认为是下一代显示技术。
OLED显示器件的主体结构为OLED显示基板,其包括由像素界定层限定的多个像素区域,每个像素区域包括发出特定颜色光线的OLED。OLED显示基板的制作工艺中,形成OLED的成膜方式主要有蒸镀制程和溶液制程。蒸镀制程在小尺寸显示器件的应用较为成熟,目前该技术已经应用于量产中。而溶液制程主要有喷墨打印、喷嘴涂覆、旋涂、丝网印刷等,其中喷墨打印技术由于其材料利用率较高、可以实现大尺寸化,被认为是大尺寸OLED显示器件实现量产的重要方式。
为了提高生产效率,喷墨打印设备的喷头包括多个喷嘴,同时形成多个同色像素区域的显示膜层(如:有机发光层)。但是,实际制作工艺中,并不能完全保证每个喷嘴的喷墨量完全一致。因此,喷墨打印前需要精确矫正喷头中每个喷嘴的喷墨量,并保证单位时间内喷嘴的喷墨体积误差小于±0.3%,因为大于此误差,显示器件点亮后人眼即可以分辨出由此误差导致的像素间发光均匀性差异,因此喷墨打印的核心技术之一即是如何提高像素间均匀性。
如图1所示:现有技术中的像素区域为矩阵分布,且一般为长条状(如红色像素区域2、绿色像素区域3和蓝色像素区域4),目前设备厂商每个喷 头13一般配备256或512个喷嘴1,因此量产时对于3840×2160分辨率电视来说,如果采用配备256个喷嘴1的喷头13,需要配备5个喷头13才能完成3840个同行且同色像素区域的显示膜层打印,然后同时移动5个喷头13,如图1中的箭头方向,完成所有行同色OLED的打印。由于1280个喷嘴1的体积误差必须控制在0.3%以内,将256个喷嘴1的体积误差矫正到0.3%以内,一般需要3-5个小时。可以想象对于1280个喷嘴1,其喷墨体积误差矫正过程将是个漫长反复的过程,且经过一段时间需要重新对1280个喷嘴1的喷墨体积重新矫正,这将耗费大量时间和墨水,图1中不同灰度代表形成的红色像素单元2中的显示膜层膜厚不同。
发明内容
本公开的目的是提供一种显示基板及其制作方法,用以解决喷墨打印形成像素单元的像素膜层时,存在厚度不同,造成像素间均匀性差异的问题。
本公开的另一目的是提供一种显示装置,用以解决显示膜层的膜厚不均匀严重影响显示质量的问题。
为解决上述技术问题,本公开实施例中提供一种制作显示基板的方法,包括以下步骤:
制作像素隔墙,用于限定显示基板的像素区域;和
通过喷墨打印的方式在所述像素区域内形成显示膜层,
其中制作所述像素隔墙的步骤包括:
制作第一像素隔墙和第二像素隔墙,所述第一像素隔墙的高度大于所述第二像素隔墙的高度,所述第一像素隔墙限定第一像素区域,所述第二像素隔墙限定第二像素区域,多个相邻的第二像素区域位于同一第一像素区域内;
通过喷墨打印的方式在所述像素区域内形成显示膜层的步骤包括:
通过至少一个喷嘴在所述第一像素区域内喷墨打印同一显示材料,从而在所述第一像素区域内的多个第二像素区域内形成相同的显示膜层,且所述显示膜层的高度大于所述第二像素隔墙的高度。
可选地,所述第一像素区域为长条状,并呈矩阵分布。
可选地,所述第一像素区域的短边沿行方向延伸,通过包括多个喷嘴的 喷头在同列的所有第一像素区域内同时喷墨打印同一显示材料,并移动所述喷头,在所有列的第一像素区域内喷墨打印对应的材料。
可选地,通过至少两个喷嘴在每个所述第一像素区域内喷墨打印同一材料。
可选地,制作第一像素隔墙和第二像素隔墙的步骤包括:
形成第一膜层的图案,所述第一膜层位于所述第一像素隔墙和第二像素隔墙所在的区域;以及
在所述第一膜层上形成第二膜层的图案,所述第二膜层位于所述第一像素隔墙所在的区域。
可选地,所述显示基板为有机发光二极管显示基板或液晶面板的彩膜基板。
可选地,所述显示基板为有机发光二极管显示基板时,所述第二像素区域内形成有发出特定颜色光线的有机发光二极管,
所述显示基板的制作方法进一步包括:
在基板上形成有机发光二极管的底电极;
在形成有底电极的基板上形成第二像素隔墙,所述第二像素隔墙限定第二像素区域;
在形成有第二像素隔墙的基板上形成第一像素隔墙,所述第一像素隔墙限定第一像素区域,多个相邻的第二像素区域位于同一第一像素区域内;以及
通过至少一个喷嘴在所述第一像素区域内喷墨打印同一显示材料,从而在所述第一像素区域内的多个第二像素区域内形成发出同一颜色光线的显示膜层,且相邻列第一像素区域内的显示膜层发出的光线颜色不同。
可选地,所述显示膜层包括有机发光层。
本公开实施例中还提供一种显示基板,包括像素隔墙,用于限定显示基板的像素区域,所述像素隔墙包括第一像素隔墙和第二像素隔墙,所述第一像素隔墙的高度大于所述第二像素隔墙的高度,所述第一像素隔墙限定第一像素区域,所述第二像素隔墙限定第二像素区域,多个相邻的第二像素区域位于同一第一像素区域内;以及
位于同一第一像素区域内的多个第二像素区域内设置有相同的显示膜层,且所述显示膜层的高度大于所述第二像素隔墙的高度。
可选地,所述第一像素区域为长条状,并呈矩阵分布。
可选地,所述第一像素区域的短边沿行方向延伸,同列的所有第一像素区域内的显示膜层材料相同,并通过一次喷墨打印过程形成。
可选地,所述第一像素隔墙包括第一膜层和位于所述第一膜层上的第二膜层;所述第二像素隔墙包括第一膜层。
可选地,所述第一膜层的厚度为10nm-100μm。
可选地,所述第二膜层的厚度为100nm-100μm。
可选地,所述第一膜层和第二膜层的材料为树脂、有机硅或二氧化硅。
可选地,所述显示基板为有机发光二极管显示基板或液晶面板的彩膜基板。
可选地,所述显示基板为有机发光二极管显示基板时,所述第二像素区域内设置有发出特定颜色光线的有机发光二极管,
所述显示基板包括:
有机发光二极管的底电极;
第二像素隔墙,用于限定第二像素区域;以及
第一像素隔墙,用于限定第一像素区域,多个相邻的第二像素区域位于同一第一像素区域内,
其中每个第一像素区域内的多个第二像素区域内设置有发出同一颜色光线的显示膜层,且相邻列第一像素区域内的显示膜层发出的光线颜色不同。
可选地,所述显示膜层包括有机发光层。
可选地,3个相邻的第二像素区域位于同一第一像素区域内。
本公开实施例中还提供一种显示装置,包括如上所述的显示基板。
本公开的上述技术方案的有益效果如下:上述技术方案中,显示基板的像素隔墙包括限定第一像素区域的第一像素隔墙和限定第二像素区域的第二像素隔墙,其中第一像素隔墙的高度大于第二像素隔墙的高度,且多个相邻的第二像素区域位于同一第一像素区域内,从而在所述第一像素区域内喷墨打印同一显示材料时,可以在所述第一像素区域内的多个第二像素区域内形 成相同的显示膜层,并设置所述显示膜层的高度大于所述第二像素隔墙的高度,即第一像素区域内的显示膜层连通,并通过短边打印的方式在第一像素区域内打印对应的像素膜层,保证了第二像素区域内的显示膜层膜厚相同,提高了显示基板的质量,改善了显示质量。
附图说明
为了更清楚地说明本公开实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本公开的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。
图1表示现有技术中喷墨打印形成同色像素区域的显示膜层的效果示意图;
图2表示本公开实施例中显示基板的结构示意图;
图3表示图2沿A-A的剖视图;
图4表示图2沿B-B的剖视图;以及
图5表示本公开实施例中喷墨打印形成同色像素区域的显示膜层的过程示意图。
具体实施方式
本公开提供一种显示基板的制作方法,用以解决现有技术中喷墨打印形成像素区域的显示膜层时,存在膜厚不均,造成像素间均匀性差异的问题。
所述制作方法包括:制作第一像素隔墙限定第一像素区域,并制作第二像素隔墙限定第二像素区域,其中第一像素隔墙的高度大于第二像素隔墙的高度,且多个相邻的第二像素区域位于同一第一像素区域内。从而在所述第一像素区域内喷墨打印同一显示材料时,可以在所述第一像素区域内的多个第二像素区域内形成相同的显示膜层,并设置所述显示膜层的高度大于所述第二像素隔墙的高度,即第一像素区域内的显示膜层连通,并通过短边打印的方式在第一像素区域内打印对应的像素膜层,保证了第二像素区域内的显示膜层膜厚相同,提高了显示基板的质量,改善了显示质量。
下面将结合附图和实施例,对本公开的具体实施方式作进一步详细描述。以下实施例用于说明本公开,但不用来限制本公开的范围。
本公开实施例中提供一种显示基板的制作方法,包括:
制作像素隔墙,用于限定显示基板的像素区域;和通过喷墨打印的方式在所述像素区域内形成显示膜层。
其中制作所述像素隔墙的步骤包括:
制作第一像素隔墙和第二像素隔墙,所述第一像素隔墙的高度大于所述第二像素隔墙的高度,所述第一像素隔墙限定第一像素区域,所述第二像素隔墙限定第二像素区域,多个相邻的第二像素区域位于同一第一像素区域内。
其中通过喷墨打印的方式在所述像素区域内形成显示膜层的步骤包括:通过至少一个喷嘴在所述第一像素区域内喷墨打印同一显示材料,从而在所述第一像素区域内的多个第二像素区域内形成相同的显示膜层,且所述显示膜层的高度大于所述第二像素隔墙的高度。
可选地,所述第一像素区域为长条状,并呈矩阵分布。
可选地,所述第一像素区域的短边沿行方向延伸,通过包括多个喷嘴的喷头在同列的所有第一像素区域内同时喷墨打印同一显示材料,并移动所述喷头,在所有列的第一像素区域内喷墨打印对应的材料。
通过上述步骤制作显示基板,能够保证像素区域内的显示膜层膜厚均一,提高了显示基板的质量。
相应地,结合图2-图4所示,本公开还提供一种显示基板,包括像素隔墙和显示膜层,所述像素隔墙用于限定显示基板的像素区域,所述显示膜层位于所述像素区域内。其中所述像素隔墙包括第一像素隔墙101和第二像素隔墙102,第一像素隔墙101的高度大于第二像素隔墙102的高度,即第一像素隔墙101的顶面高于第二像素隔墙102的顶面。第一像素隔墙101限定第一像素区域200,第二像素隔墙102限定第二像素区域201,且多个相邻的第二像素区域201位于同一第一像素区域200内。并设置同一第一像素区域200内的多个第二像素区域201内的显示膜层材料相同,且所述显示膜层的高度大于第二像素隔墙102的高度。第一像素区域200为长条状,并呈矩阵分布,第一像素区域200的短边沿行方向延伸,且同列的所有第一像素区域 200内的显示膜层材料相同,并通过一次喷墨打印过程形成,如图4所示。
通常地,可以设置3个相邻的第二像素区域201位于同一第一像素区域200内。
在一个可选的实施方式中,同列第一像素区域200为同色像素区域,即同列第一像素区域200内的显示膜层材料相同,且相邻列的第一像素区域200为不同色像素区域,具体可以为RGB、RGB、RGB......。每个第一像素区域200内只包括一列第二像素区域201。即第一像素区域200的短边沿行方向延伸时,第一像素区域200的长边沿列方向延伸。其中R代表红色像素区域,G代表绿色像素区域,B代表蓝色像素区域。
需要说明的是,这里的“第一像素区域200的短边沿行方向延伸”并不是特指第一像素区域200的短边平行于行轴,其中第一像素区域200的短边也可以为折线、曲线或斜线,其起点和终点的连线延伸方向与行方向的夹角不为直角。同理,“第一像素区域200的长边沿列方向延伸”也并不是特指第一像素区域200的长边平行于列轴。
进一步地,可以通过包括多个喷嘴的喷头13在同列的所有第一像素区域200内同时喷墨打印同一显示材料,并移动所述喷头,在所有列的第一像素区域内喷墨打印对应的材料,如图5所示,图5中只包括一行第一像素区域200。当然,也可以通过其他打印方式在所有第一像素区域200内喷墨打印对应的材料,例如:通过包括多个喷嘴的喷头在同行的所有第一像素区域200内同时喷墨打印对应的显示材料,并移动所述喷头,在所有行的第一像素区域200内喷墨打印对应的材料。或通过随机打印的方式在所有第一像素区域200内喷墨打印对应的材料。
可选地,设置每个第一像素区域200对应至少两个喷嘴(如图5中的喷嘴10、11、12),即通过至少两个喷嘴在所述第一像素区域200内喷墨打印同一显示材料,由于每个第一像素区域200打印的材料来自于多个不同喷嘴,喷嘴的喷墨体积误差得到一定的平均化,可以进一步降低第一像素区域200之间的膜厚误差,同时,还提高了生产效率。在实际应用中,最好设置喷嘴10、11、12的型号不同,使得平均误差的效果更好。
为了形成本公开实施例中的第一像素区域和第二像素区域,可以通过以 下步骤来分别形成限定第一像素区域和第二像素区域的第一像素隔墙和第二像素隔墙:
形成第一膜层的图案,所述第一膜层位于第一像素隔墙101和第二像素隔墙102所在的区域;
在所述第一膜层上形成第二膜层的图案,所述第二膜层位于第一像素隔墙101所在的区域。
通过上述步骤形成的第一像素隔墙101包括第一膜层1011和第二膜层1012,第二像素隔墙102由第一膜层制作而成,第一像素隔墙101和第二像素隔墙102的高度差为第二膜层的厚度。
其中所述第一膜层和第二膜层的材料可以选择树脂(例如聚酰亚胺)、有机硅或二氧化硅。
具体的,可以设置所述第一膜层的厚度为10nm-100μm,示例性地为50nm-500nm。所述第二膜层的厚度为100nm-100μm,示例性地为500nm-1500nm。即第二像素隔墙102的高度为所述第一膜层的厚度:10nm-100μm,第一像素隔墙101的高度为所述第一膜层和第二膜层的厚度之和:110nm-200μm。
本公开实施例中的显示基板可以为液晶面板的彩膜基板,也可以为有机发光二极管显示基板。
当所述显示基板为液晶面板的彩膜基板时,所述像素隔墙具体可以为黑矩阵,所述显示膜层为透射特定颜色光线的滤光层。对应的显示基板的制作方法还可以包括:
在所述显示膜层上形成平坦层。
对于纵向电场的液晶面板,其公共电极形成在彩膜基板上,则所述显示基板的制作方法还包括:
在平坦层上形成公共电极,用于与阵列基板上的像素电极形成纵向电场,驱动液晶分子偏转,实现特定的颜色的显示。
当所述显示基板为有机发光二极管显示基板时,所述像素隔墙为像素界定层,所述第二像素区域内形成有发出特定颜色光线的有机发光二极管。对应的显示基板的制作方法具体包括:
在基板上形成有机发光二极管的底电极;
在形成有底电极的基板上形成第二像素隔墙,所述第二像素隔墙限定第二像素区域;
在形成有第二像素隔墙的基板上形成第一像素隔墙,所述第一像素隔墙限定第一像素区域,多个相邻的第二像素区域位于同一第一像素区域内;以及
通过至少一个喷嘴在所述第一像素区域内喷墨打印同一显示材料,从而在所述第一像素区域内的多个第二像素区域内形成发出同一颜色光线的显示膜层,且相邻列第一像素区域内的显示膜层发出的光线颜色不同。
其中所述显示膜层具体为有机发光层,当然所述显示膜层还可以包括电子传输层、空穴传输层等其他膜层。
另外,底电极可以为有机发光二极管的阳极,也可以为有机发光二极管的阴极,其可根据器件设计需要来进行选择,本公开不做限制。
在一个可选的实施方式中,通过至少两个喷嘴(如图5中的喷嘴10、11、12)在一个第一像素区域200内喷墨打印同一显示材料,并通过包括多个喷嘴的喷头在同列的所有第一像素区域200内同时喷墨打印同一显示材料,然后移动所述喷头,在所有列的第一像素区域200内喷墨打印对应的材料。例如:定义相邻三列的第一像素区域200分别为红色像素区域、绿色像素区域和蓝色像素区域,具体通过包括多个喷嘴的喷头在第一列的第一像素区域200内喷墨打印发出红色光线的有机发光层,每个第一像素区域200对应至少两个喷嘴,然后移动喷头,间隔两列后,在所述列的第一像素区域200内喷墨打印发出红色光线的有机发光层,直至在所有红色像素区域内喷墨打印发出红色光线的有机发光层。然后重复上述步骤分别在所有绿色像素区域内喷墨打印发出绿色光线的有机发光层、在所有蓝色像素区域内喷墨打印发出蓝色光线的有机发光层。
结合图2-图5所示,下面以有机发光二极管显示基板的制作过程为例,来具体介绍本公开实施例中显示基板的制作方法:
步骤S1、在基板100上形成有机发光二极管的底电极5,其中底电极5对应第二像素区域201,材料可以为具有反光作用的镁铝合金、镁银合金、 钙银合金等,对应顶发射有机发光二极管显示基板,也可以为具有透光作用的ITO、IZO、AZO等,对应底发射或双面发射有机发光二极管显示基板。
其中基板可以选取玻璃基板、石英基板、有机树脂基板等透明基板。
步骤S2、在完成步骤S1的基板100上形成第一膜层,并对第一膜层进行构图工艺,形成第一膜层的图案,其中第一膜层的图案位于第一像素隔墙101和第二像素隔墙102所在的区域;
具体通过溅射、沉积、旋涂、印刷等成膜工艺在形成有底电极5的基板100上形成第一膜层,第一膜层的材料可以为树脂、有机硅或二氧化硅;
在所述第一膜层上涂覆光刻胶,并采用普通掩膜板对光刻胶进行曝光,形成光刻胶保留区域和光刻胶不保留区域,其中光刻胶保留区域对应第一像素隔墙101和第二像素隔墙102所在的区域,光刻胶不保留区域对应其他区域;
采用干法刻蚀去除光刻胶不保留区域的第一膜层;以及
剥离剩余的光刻胶,形成第一像素隔墙101的第一膜层1011和第二像素隔墙102。
步骤S3、在完成步骤S2的基板100上形成第二膜层,并对第二膜层进行构图工艺,形成第二膜层的图案,其中第二膜层的图案位于第一像素隔墙所在的区域;
具体通过溅射、沉积、旋涂、印刷等成膜工艺在完成步骤S2的基板100上形成第二膜层,第二膜层的材料可以为树脂、有机硅或二氧化硅;
在所述第二膜层上涂覆光刻胶,并采用普通掩膜板对光刻胶进行曝光,形成光刻胶保留区域和光刻胶不保留区域,其中光刻胶保留区域对应第一像素隔墙101,光刻胶不保留区域对应其他区域;
采用干法刻蚀去除光刻胶不保留区域的第二膜层;以及
剥离剩余的光刻胶,形成第一像素隔墙101的第二膜层1012。
至此完成第一像素隔墙101和第二像素隔墙102的制作,其中第一像素隔墙101包括第一膜层1011和第二膜层1012,第二像素隔墙102仅由第一膜层制作而成,第一像素隔墙101和第二像素隔墙102的高度差为第二膜层1012的厚度。
第一像素隔墙101限定的第一像素区域200呈矩阵分布,第二像素隔墙102限定第二像素区域201,多个相邻的第二像素区域201位于同一第一像素区域200内。
步骤S4、在完成步骤S3的基板100上的第一像素区域200内形成有机发光层6,从而在第一像素区域200内的第二像素区域201内形成有机发光层6,其中有机发光层6的高度大于第二膜层1012的高度,使得第一像素区域200内的有机发光层6连通,保证第一像素区域200内的第二像素区域201内的有机发光层6膜厚均一。
有机发光层6可以为单一的有机物,也可以为掺杂物、磷光材料、荧光材料。
步骤S5、在完成步骤S4的基板100上形成顶电极(图中未示出),当所述顶电极与底电极5之间施加合适的偏压后,通过载流子(电子和空穴)注入、传输和复合致使有机发光层受激发光,进而达到显示的目的。
至此完成有机发光二极管显示基板的制作。
当然,有机发光二极管显示基板还可以包括电子传输层、空穴传输层等其他膜层结构,其具体制作工艺参见现有技术,在此不再详述。
对于彩膜基板,可以通过上述步骤形成的第一像素隔墙和第二像素隔墙,来组成黑矩阵,限定像素区域。与有机发光二极管显示基板不同的是,在像素区域内喷墨打印的是透射特定颜色光线的滤光层。对于彩膜基板的其他结构,如:平坦层、公共电极,具体的制作工艺参见现有技术,在此不再赘述。
本公开实施例中还提供一种显示装置,其包括如上所述的显示基板,由于显示膜层的膜厚均一,改善了显示装置的显示质量。所述显示装置可以为:液晶面板、电子纸、OLED面板、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
本公开的技术方案通过制作第一像素区域和第二像素区域,且第一像素区域的顶面高于第二像素区域的顶面,相邻的多个第二像素区域位于同一第一像素区域内,从而在第一像素区域内喷墨打印显示材料时,可以设置形成的显示膜层的顶面高于第二像素区域的顶面,使得第一像素区域内的显示膜层连通,保证了第二像素区域内的显示膜层膜厚均一,提高了显示基板的质 量,改善了显示质量。
以上所述仅是本公开的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本公开原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视本公开的保护范围。

Claims (20)

  1. 一种制作显示基板的方法,包括以下步骤:
    制作像素隔墙,用于限定显示基板的像素区域;以及
    通过喷墨打印的方式在所述像素区域内形成显示膜层,
    其中制作所述像素隔墙的步骤包括:
    制作第一像素隔墙和第二像素隔墙,所述第一像素隔墙的高度大于所述第二像素隔墙的高度,所述第一像素隔墙限定第一像素区域,所述第二像素隔墙限定第二像素区域,多个相邻的第二像素区域位于同一第一像素区域内,
    通过喷墨打印的方式在所述像素区域内形成显示膜层的步骤包括:
    通过至少一个喷嘴在所述第一像素区域内喷墨打印同一显示材料,从而在所述第一像素区域内的多个第二像素区域内形成相同的显示膜层,且所述显示膜层的高度大于所述第二像素隔墙的高度。
  2. 根据权利要求1所述的方法,其中所述第一像素区域为长条状,并呈矩阵分布。
  3. 根据权利要求1或2所述的方法,其中所述第一像素区域的短边沿行方向延伸,通过包括多个喷嘴的喷头在同列的所有第一像素区域内同时喷墨打印同一显示材料,并移动所述喷头,在所有列的第一像素区域内喷墨打印对应的材料。
  4. 根据权利要求1至3任一项所述的方法,其中通过至少两个喷嘴在每个所述第一像素区域内喷墨打印同一材料。
  5. 根据权利要求1至4任一项所述的方法,其中制作第一像素隔墙和第二像素隔墙的步骤包括:
    形成第一膜层的图案,所述第一膜层位于所述第一像素隔墙和第二像素隔墙所在的区域;以及
    在所述第一膜层上形成第二膜层的图案,所述第二膜层位于所述第一像素隔墙所在的区域。
  6. 根据权利要求1至5任一项所述的方法,其中所述显示基板为有机发光二极管显示基板或液晶面板的彩膜基板。
  7. 根据权利要求6所述的方法,其中所述显示基板为有机发光二极管显示基板时,所述第二像素区域内形成有发出特定颜色光线的有机发光二极管;
    所述显示基板的制作方法进一步包括:
    在基板上形成有机发光二极管的底电极;
    在形成有底电极的基板上形成第二像素隔墙,所述第二像素隔墙限定第二像素区域;
    在形成有第二像素隔墙的基板上形成第一像素隔墙,所述第一像素隔墙限定第一像素区域,多个相邻的第二像素区域位于同一第一像素区域内;以及
    通过至少一个喷嘴在所述第一像素区域内喷墨打印同一显示材料,从而在所述第一像素区域内的多个第二像素区域内形成发出同一颜色光线的显示膜层,且相邻列第一像素区域内的显示膜层发出的光线颜色不同。
  8. 根据权利要求7所述的方法,其中所述显示膜层包括有机发光层。
  9. 一种显示基板,包括像素隔墙,用于限定显示基板的像素区域,其中所述像素隔墙包括第一像素隔墙和第二像素隔墙,所述第一像素隔墙的高度大于所述第二像素隔墙的高度,所述第一像素隔墙限定第一像素区域,所述第二像素隔墙限定第二像素区域,多个相邻的第二像素区域位于同一第一像素区域内;以及
    位于同一第一像素区域内的多个第二像素区域内设置有相同的显示膜层,且所述显示膜层的高度大于所述第二像素隔墙的高度。
  10. 根据权利要求9所述的显示基板,其中所述第一像素区域为长条状,并呈矩阵分布。
  11. 根据权利要求9或10所述的显示基板,其中所述第一像素区域的短边沿行方向延伸,同列的所有第一像素区域内的显示膜层材料相同,并通过一次喷墨打印过程形成。
  12. 根据权利要求9至11任一项所述的显示基板,其中所述第一像素隔墙包括第一膜层和位于所述第一膜层上的第二膜层;
    所述第二像素隔墙包括第一膜层。
  13. 根据权利要求12所述的显示基板,其中所述第一膜层的厚度为10nm -100μm。
  14. 根据权利要求12或13所述的显示基板,其中所述第二膜层的厚度为100nm-100μm。
  15. 根据权利要求12至14任一项所述的显示基板,其中所述第一膜层和第二膜层的材料为树脂、有机硅或二氧化硅。
  16. 根据权利要求9-15任一项所述的显示基板,其中所述显示基板为有机发光二极管显示基板或液晶面板的彩膜基板。
  17. 根据权利要求16所述的显示基板,其中所述显示基板为有机发光二极管显示基板时,所述第二像素区域内设置有发出特定颜色光线的有机发光二极管,
    所述显示基板包括:
    有机发光二极管的底电极;
    第二像素隔墙,用于限定第二像素区域;以及
    第一像素隔墙,用于限定第一像素区域,多个相邻的第二像素区域位于同一第一像素区域内,
    其中每个第一像素区域内的多个第二像素区域内设置有发出同一颜色光线的显示膜层,且相邻列第一像素区域内的显示膜层发出的光线颜色不同。
  18. 根据权利要求17所述的显示基板,其中所述显示膜层包括有机发光层。
  19. 根据权利要求9-18任一项所述的显示基板,其中3个相邻的第二像素区域位于同一第一像素区域内。
  20. 一种显示装置,包括权利要求9-19任一项所述的显示基板。
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CN113437119A (zh) * 2021-06-10 2021-09-24 深圳市华星光电半导体显示技术有限公司 显示面板及其制作方法、显示装置
KR20230084358A (ko) * 2021-12-03 2023-06-13 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
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