WO2017208660A1 - 表示装置および電子機器 - Google Patents
表示装置および電子機器 Download PDFInfo
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- WO2017208660A1 WO2017208660A1 PCT/JP2017/015898 JP2017015898W WO2017208660A1 WO 2017208660 A1 WO2017208660 A1 WO 2017208660A1 JP 2017015898 W JP2017015898 W JP 2017015898W WO 2017208660 A1 WO2017208660 A1 WO 2017208660A1
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- insulating film
- pixels
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- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
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Definitions
- the present disclosure relates to a display device and an electronic apparatus using an organic electroluminescence element that emits light by an organic electroluminescence (EL) phenomenon.
- EL organic electroluminescence
- an insulating film called a partition is used to separate pixels. Thereby, ink can be dripped for every pixel and the organic layer of each luminescent color can be pattern-formed.
- a display device includes a plurality of pixels that are two-dimensionally arranged and each include an organic electroluminescence element that emits light of any one of a plurality of colors.
- Each emission color is arranged in a region between a first insulating film arranged in one direction for each emission color and having an opening for each pixel and pixels of different emission colors on the first insulation film.
- Having a second insulating film extending along the arrangement direction and an organic layer formed in the opening and including a light emitting layer, and the first insulating film has the same light emission among the plurality of pixels. It includes a recess that connects the openings of the color pixels.
- An electronic apparatus includes the display device according to the embodiment of the present disclosure.
- the first insulating film having an opening for each pixel includes a recess that connects the openings of the pixels having the same emission color, and such an opening.
- An organic layer is formed.
- a second insulating film extending along the arrangement direction for each luminescent color is formed in a region between pixels of different luminescent colors on the first insulating film.
- the first insulating film having an opening for each pixel includes a recess that connects the openings of the pixels having the same emission color, and such an opening.
- An organic layer is formed.
- a second insulating film extending along the arrangement direction for each luminescent color is formed in a region between pixels of different luminescent colors on the first insulating film.
- FIG. 1 is a block diagram illustrating an overall configuration of a display device according to an embodiment of the present disclosure.
- FIG. 2 is a cross-sectional view illustrating a configuration of the display device (pixel unit) illustrated in FIG. 1. It is a plane schematic diagram showing the principal part structure of a pixel circuit. It is a schematic diagram showing an example of a pixel arrangement.
- FIG. 3 is a schematic diagram illustrating a planar configuration of the pixel isolation film illustrated in FIG. 2.
- FIG. 3 is an enlarged cross-sectional view illustrating a configuration near an opening illustrated in FIG. 2.
- FIG. 5B is a diagram showing a cross-sectional configuration along line B11-B12 shown in FIG. 5A.
- 5B is a diagram showing a cross-sectional configuration taken along line C11-C12 shown in FIG. 5A. It is a schematic diagram for demonstrating the taper angle of the opening part of a 1st insulating film. It is a schematic diagram for demonstrating the taper angle of a recessed part. It is a schematic diagram for demonstrating the structure of the pixel separation film which concerns on a comparative example. It is a schematic diagram for demonstrating the effect by the pixel separation film shown to FIG. 5A. It is a schematic diagram for demonstrating the effect by the pixel separation film shown to FIG. 5A. It is a block diagram showing the structure of the electronic device which concerns on an application example. It is sectional drawing showing the other structural example of a pixel separation film (1st insulating film).
- Embodiments of the present disclosure will be described in detail in the following order with reference to the drawings. 1. Embodiment (Example in which a concave portion connecting openings is provided in a region between pixels of the same color in the first insulating film) 2. Application examples (examples of electronic devices)
- FIG. 1 is a block diagram illustrating an overall configuration of a display device (display device 1) according to an embodiment of the present disclosure.
- the display device 1 is, for example, an organic EL display using an organic electroluminescence element, and for example, light of any color of R (red), G (green), and B (blue) is emitted from the upper surface side.
- This is a top emission type (top emission type) display device.
- the display device 1 includes a pixel unit 2 having a plurality of pixels (pixels pr, pg, pb) arranged two-dimensionally and a circuit unit (scanning line driving unit 3, signal line driving unit) for driving the pixel unit 2. 4 and a power line driver 5).
- a pixel unit 2 having a plurality of pixels (pixels pr, pg, pb) arranged two-dimensionally and a circuit unit (scanning line driving unit 3, signal line driving unit) for driving the pixel unit 2. 4 and a power line driver 5).
- the pixel unit 2 displays an image based on a video signal input from the outside by, for example, an active matrix method.
- the pixel unit 2 includes a plurality of scanning lines WSL extending along the row direction of the pixel array, a plurality of signal lines DTL extending along the column direction, and a plurality of signal lines DTL extending along the row direction.
- a power supply line DSL is provided.
- These scanning lines WSL, signal lines DTL, and power supply lines DSL are electrically connected to the pixels pr, pg, pb.
- Each of the pixels pr, pg, and pb corresponds to, for example, a sub-pixel, and a set of these pixels pr, pg, and pb forms one pixel (pixel PX).
- the pixel pr includes, for example, an organic EL element 10R that emits red light.
- the pixel pg includes, for example, an organic EL element 10G that emits green light.
- the pixel pb includes, for example, an organic EL element 10B that emits blue light.
- pixel P when it is not necessary to distinguish each of the pixels pr, pg, and pb, it will be referred to as “pixel P”. Further, when it is not necessary to distinguish each of the organic EL elements 10R, 10G, and 10B, the description will be given as “organic EL element 10”.
- the scanning line WSL is for supplying each pixel P with a selection pulse for selecting a plurality of pixels P arranged in the pixel unit 2 for each row.
- the scanning line WSL is connected to an output end (not shown) of the scanning line driving unit 3 and a gate electrode of a writing transistor WsTr described later.
- the signal line DTL is for supplying a signal pulse (signal potential Vsig and reference potential Vofs) corresponding to the video signal to each pixel P.
- the signal line DTL is connected to an output end (not shown) of the signal line driver 4 and a source electrode or a drain electrode of a write transistor WsTr described later.
- the power supply line DSL is for supplying a fixed potential (Vcc) to each pixel P as electric power.
- the power supply line DSL is connected to an output end (not shown) of the power supply line driving unit 5 and a source electrode or a drain electrode of a drive transistor DsTr described later.
- the cathode (second electrode 16 described later) of the organic EL element 10 is connected to a common potential line (cathode line).
- the scanning line driving unit 3 outputs a predetermined selection pulse to each scanning line WSL in a line-sequential manner, thereby performing operations such as anode reset, Vth correction, signal potential Vsig writing, mobility correction, and light emission operation, for example.
- Each pixel P is executed at a predetermined timing.
- the signal line drive unit 4 generates an analog video signal corresponding to a digital video signal input from the outside, and outputs the analog video signal to each signal line DTL.
- the power line driver 5 outputs a constant potential to each power line DSL.
- the scanning line driving unit 3, the signal line driving unit 4, and the power supply line driving unit 5 are controlled so as to operate in conjunction with each other by a timing control signal output from a timing control unit (not shown).
- a digital video signal input from the outside is corrected by a video signal receiving unit (not shown) and then input to the signal line driving unit 4.
- FIG. 2 illustrates a cross-sectional configuration of the display device 1 (pixel unit 2).
- FIG. 2 shows only a region corresponding to a part of the organic EL elements 10R, 10G, and 10B (the organic electroluminescent element 10R and a part of the organic electroluminescent element 10G).
- a plurality of organic EL elements 10 are two-dimensionally arranged on the drive substrate 11a.
- substrate 20 is bonded together through the protective film 17, the sealing layer 18, and the CF / BM layer 19, for example.
- the drive substrate 11a is formed on the first substrate 11 made of, for example, glass or plastic, and the pixel circuit (pixel circuit PXLC, not shown in FIG. 2) for driving the interlayer insulating film 122 and each organic EL element 10. Z).
- the surface of the driving substrate 11a is flattened by a flattening film 123.
- the pixel circuit PXLC controls light emission and quenching of the organic EL element 10, and for example, the organic EL element 10 (any one of the organic EL elements 10R, 10G, and 10B), a storage capacitor Cs, and a write transistor WsTr. And a drive transistor DsTr.
- the write transistor WsTr controls application of a video signal (signal voltage) to the gate electrode of the drive transistor DsTr. Specifically, the write transistor WsTr samples the voltage (signal voltage) of the signal line DTL according to the voltage applied to the scanning line WSL, and writes the signal voltage to the gate electrode of the drive transistor DsTr.
- the drive transistor DsTr is connected in series to the organic EL element 10 and controls the current flowing through the organic EL element 10 according to the magnitude of the signal voltage sampled by the write transistor WsTr.
- the drive transistor DsTr and the write transistor WsTr are formed by, for example, an n-channel MOS type or a p-channel MOS type thin film transistor (TFT: Thin Film Transistor). These drive transistor DsTr and write transistor WsTr may be a single gate type or a dual gate type.
- the holding capacitor Cs holds a predetermined voltage between the gate electrode and the source electrode of the driving transistor DsTr.
- the gate electrode of the writing transistor WsTr is connected to the scanning line WSL.
- One of the source electrode and the drain electrode of the write transistor WsTr is connected to the signal line DTL, and the other electrode is connected to the gate electrode of the drive transistor DsTr.
- One of the source electrode and the drain electrode of the drive transistor DsTr is connected to the power supply line DSL, and the other electrode is connected to an anode (first electrode 13 described later) of the organic EL element 10.
- the storage capacitor Cs is inserted between the gate electrode of the drive transistor DsTr and the electrode on the organic EL element 10 side.
- FIG. 3 shows an example of the wiring layout of the main part of the pixel circuit PXLC as described above.
- the pixel circuit PXLC includes, for example, a plurality of wiring layers (first metal layer M1, second metal layer M2), a semiconductor layer S1, and interlayer connections (contact holes c11 to c1) between the first metal layer M1 and the second metal layer M2. c13).
- the gate electrode 125g1 of the write transistor WsTr, the gate electrode 125g2 of the drive transistor DsTr, the lower electrode 126a of the storage capacitor Cs, and the signal line DTL are included in the first metal layer M1. Is arranged.
- the gate electrode 125g1 of the write transistor WsTr and the scanning line WSL are connected to each other through a contact hole c11.
- the source / drain electrode 125sd1 of the write transistor WsTr is connected to the signal line DTL through the contact hole c12.
- the source / drain electrode 125sd2 of the write transistor WsTr is interlayer-connected to the lower electrode 126a of the storage capacitor Cs and the gate electrode 125g2 of the drive transistor DsTr through the contact hole c13.
- the upper electrode 126b of the storage capacitor Cs is connected to the anode (first electrode 13, not shown in FIG. 3) of the organic EL element 10 through a contact portion C1 (anode contact).
- the circuit configuration of 2Tr1C is illustrated here as the pixel circuit PXLC, the configuration of the pixel circuit PXLC is not limited to this.
- the pixel circuit PXLC may have a circuit configuration in which various capacitors, transistors, and the like are further added to such a 2Tr1C circuit.
- the organic EL elements 10R, 10G, and 10B are formed in a regular arrangement on the drive substrate 11a as described above.
- FIG. 4 shows an example of a pixel arrangement (an arrangement of the organic EL elements 10).
- the arrangement of the pixels pr, pg, and pb is not particularly limited. However, when a wet process such as printing is used in the film formation process of the organic EL element 10, a plurality of pixels pr, pg, and pb emit light. It is desirable to arrange each color along one direction.
- the pixel pr (organic EL element 10R) is arranged on one line along the arrangement direction d
- the pixel pg organic EL element 10G
- the pixel pb Organic EL element 10B
- the surface shape of each pixel pr, pg, pb is not particularly limited, but has, for example, a rectangular shape.
- the arrangement direction d is along the longitudinal direction of each surface shape (rectangular shape) of the pixels pr, pg, and pb.
- the organic layers 15R, 15G, and 15B are formed by dropping ink of each emission color for each line along the arrangement direction d.
- the organic EL element 10 ⁇ / b> R has an organic layer 15 ⁇ / b> R including a red light emitting layer between the first electrode 13 and the second electrode 16.
- the organic EL element 10 ⁇ / b> G has an organic layer 15 ⁇ / b> G including a green light emitting layer between the first electrode 13 and the second electrode 16.
- the organic EL element 10 ⁇ / b> B has an organic layer 15 ⁇ / b> B including a blue light emitting layer between the first electrode 13 and the second electrode 16.
- the first electrode 13 functions as an anode, for example, and is provided for each pixel P.
- the constituent material of the first electrode 13 for example, aluminum (Al), chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), tungsten (W), or silver (Ag) ) And the like.
- the first electrode 13 may include a laminated film of a metal film made of a single element or an alloy of these metal elements and a light-transmitting conductive material (transparent conductive film).
- transparent conductive film include indium tin oxide (ITO), indium zinc oxide (IZO), tungsten oxide (WO x ), and zinc oxide (ZnO) based materials.
- the zinc oxide-based material include zinc oxide (AZO) to which aluminum (Al) is added and zinc oxide (GZO) to which gallium (Ga) is added.
- Each of the organic layers 15R, 15G, and 15B causes recombination of electrons and holes by applying an electric field, and generates an organic electroluminescent layer (red light emitting layer, green light emitting light) of any one of R, G, and B. Layer, blue light emitting layer).
- Examples of a method for forming these organic layers 15R, 15G, and 15B include wet processes such as a printing method and a coating method. Examples thereof include an ink jet printing method and a nozzle coating method.
- the organic layers 15R, 15G, and 15B may include, for example, a hole injection layer, a hole transport layer, and an electron transport layer, as necessary, in addition to the organic electroluminescent layer.
- an electron injection layer may be formed between the organic layers 15R, 15G, and 15B and the second electrode 16.
- the second electrode 16 functions as, for example, a cathode, and is formed over the entire surface of the pixel unit 2 (as an electrode common to all pixels).
- the second electrode 16 is made of a transparent conductive film, for example.
- the same oxide materials as listed for the first electrode 13 can be used.
- the thickness of the second electrode 16 is not particularly limited, but may be set in consideration of conductivity and light transmittance.
- an alloy of magnesium and silver may be used for the second electrode 16.
- the organic layers 15R, 15G, and 15B of these organic EL elements 10R, 10G, and 10B are formed in regions (opening portions H1) defined by the pixel separation film 14, respectively.
- the pixel separation film 14 is formed on the first electrode 13 and has an opening H ⁇ b> 1 facing the first electrode 13.
- the pixel separation film 14 defines a light emitting region of each pixel P in a desired shape and has a function of separating organic layers (organic layers having different emission colors) of adjacent pixel columns. Further, the pixel isolation film 14 ensures insulation between the first electrode 13 and the second electrode 16.
- the pixel isolation film 14 includes, for example, a first insulating film 14A including the opening H1, and a second insulating film 14B stacked in a predetermined region on the first insulating film 14A.
- FIG. 5A shows a planar configuration (configuration of a plane parallel to the substrate surface) of the pixel separation film 14.
- FIG. 5A shows a configuration in which three pixels pr, pg, and pb are arranged along the arrangement direction d for simplification.
- FIG. 5B is an enlarged view of the vicinity of the opening of the first insulating film 14A in the cross-sectional configuration of FIG.
- the structure shown in FIG. 2 corresponds to the cross-sectional structure taken along the line A11-A12 of FIG. 5A.
- the first insulating film 14A has the opening H1 for each pixel P (for each first electrode 13).
- the opening H1 includes one or more sub-openings.
- the opening H1 has a reflector (reflection structure) and is constituted by two sub-openings H1a.
- Each sub-opening H1a has a rectangular shape extending along the arrangement direction d.
- the first insulating film 14A is made of, for example, a photosensitive resin such as an acrylic resin, a polyimide resin, a fluorine resin, a silicon resin, a fluorine polymer, a silicon polymer, a novolac resin, an epoxy resin, or a norbornene resin. It is configured to include. Or what disperse
- a photosensitive resin such as an acrylic resin, a polyimide resin, a fluorine resin, a silicon resin, a fluorine polymer, a silicon polymer, a novolac resin, an epoxy resin, or a norbornene resin. It is configured to include. Or what disperse
- the first insulating film 14A is desirably lyophilic (affinity with ink when forming the organic layers 15R, 15G, and 15B). This is because when the film is formed, the ink spreading of the organic layers 15R, 15G, and 15B becomes good and unevenness in film thickness can be made difficult to occur.
- the refractive index of the first insulating film 14A is set to be smaller than the refractive indexes of the protective film 17 and the sealing layer 18 described later, for example.
- the thickness of the first insulating film 14A is, for example, not less than 1 ⁇ m and not more than 10 ⁇ m.
- an organic layer 15R (or organic layers 15G and 15B, and so on) is formed so as to cover their bottoms.
- the light emitted from the organic layer 15R is not only light traveling in the front direction L1 but also light traveling in the direction L2 shifted from the front direction L1 (oblique direction). Light).
- the light traveling in the oblique direction L2 is reflected and rises in the front direction L1.
- the second insulating film 14B is arranged in the region between the pixels P of different emission colors on the first insulating film 14A (the region between the openings H1 arranged in different pixel columns) along the arrangement direction d. It is extended and provided.
- the second insulating film 14B may be made of the same material as the first insulating film 14A or may be made of a different material. However, it is desirable that at least the upper surface of the second insulating film 14B has liquid repellency. For this reason, it is desirable that the second insulating film 14B be subjected to a liquid repellent treatment after the film formation.
- the thickness of the second insulating film 14B is, for example, not less than 0.5 ⁇ m and not more than 10 ⁇ m.
- the first insulating film 14A includes a concave portion (concave portion H2) that connects the openings H1 of the pixels P of the same emission color among the plurality of pixels P.
- FIG. 6A shows a cross-sectional configuration (a cross-sectional configuration of a region between adjacent pixels Pr) taken along line B11-B12 in FIG. 5A.
- FIG. 6B shows a cross-sectional configuration taken along line C11-C12 in FIG. 5A.
- each region between adjacent pixels pr (or between pixels pg and between pixels pb) in the arrangement direction d has a recess H2 (recess formation region H2a).
- the recess H2 connects the openings H1 of the pixels P (pixel pr, pixel pg, or pixel pb) of the same emission color, and the ink flow path of the organic layer (organic layer 15R, organic layer 15G, or organic layer 15B). It functions as.
- sub opening H1a is connected through the recessed part H2 between adjacent pixels pr. Two sub-openings H1a constituting one opening H1 may or may not be connected in the recess H2.
- the shape, width b1, depth b2, etc. of the recess H2 are not particularly limited. As shown in FIGS.
- the first insulating film 14A may have a thickness (t1) at the bottom of the recess H2.
- the thickness t1 is not less than 0.1 ⁇ m and not more than 2 ⁇ m. That is, it is desirable that the end portion of the first electrode 13 is configured to be covered with the first insulating film 14A. This is because it is possible to suppress an electrical short circuit between the first electrode 13 and the second electrode 16.
- the thickness t1 of the first insulating film 14A is desirably formed to be sufficiently smaller than the depth b2.
- the organic layer 15R is also formed in the recess H2 so as to cover the bottom surface.
- the organic layer 15R is formed so as to spread out through the recess H2 to the adjacent opening H1 during film formation.
- the bottom surface of the recess H2 is not necessarily covered by the organic layer 15R. Only a selective region of the bottom surface of the recess H2 may be covered with the organic layer 15R.
- the contact angle of the surface (side surface) of the recess H2 is desirably smaller than the contact angle of the upper surface of the second insulating film 14B.
- the taper angle d2 on the side surface of the recess H2 is smaller than the taper angle d1 on the side surface of the opening H1a of the first insulating film 14A (d1> d2). Is desirable. This is because pinning is reduced and the ink is more easily spread and spread more uniformly.
- the taper angles d1 and d2 have the above relationship.
- FIG. 6B shows the TFT 12 on the drive substrate 11a.
- the TFT 12 corresponds to the drive transistor DsTr shown in FIGS. 1 and 3, for example.
- the TFT 12 has, for example, a semiconductor layer 124 (a part of the semiconductor layer S1 shown in FIG. 3) in a selective region on the first substrate 11, and a gate insulating film 121 is interposed on the semiconductor layer 124.
- An interlayer insulating film 122 is formed on the gate electrode 125g2. On this interlayer insulating film 122, source / drain electrodes 125sd3 and 125sd4 are provided.
- the source / drain electrodes 125 sd 3 and 125 sd 4 are electrically connected to the semiconductor layer 124 through contact holes c 21 and c 22 provided in the interlayer insulating film 122.
- the source / drain electrode 125sd4 is electrically connected to the first electrode 13 through the contact portion C1.
- the pixel isolation film 14 as described above can be formed, for example, as follows. That is, first, after forming the plurality of first electrodes 13 on the drive substrate 11a, the first insulating film 14A made of the above-described photosensitive resin or the like is formed so as to cover the plurality of first electrodes 13, for example, A film is formed with a predetermined thickness by coating or the like. Thereafter, exposure is performed using, for example, a photomask, and through steps such as development, washing, and drying, an opening H1 (sub-opening H1a) and a recess H2 are formed.
- the first insulating film 14A is exposed so that the exposure amounts of the formation region of the sub-opening H1a and the recess formation region H2a are different from each other.
- the sub-openings H1a and the recesses H2 having different depths can be formed.
- a photomask for forming the sub-opening H1a and a photomask for forming the recess H2 may be prepared, and exposure may be performed in separate steps.
- the first insulating film 14A is formed by using, for example, a CVD method and then etched using, for example, a photolithography method.
- the sub-opening H1a and the recess H2 can be formed.
- the second insulating film 14B is patterned in a predetermined region on the first insulating film 14A. Thereby, the pixel separation film 14 having the above-described configuration can be formed. After the pixel separation film 14 is formed, the organic layers 15R, 15G, and 15B are formed in the openings H1 by a wet process such as inkjet printing.
- the protective film 17 may be made of either an insulating material or a conductive material.
- Insulating materials include inorganic amorphous insulating materials such as amorphous silicon ( ⁇ -Si), amorphous silicon carbide ( ⁇ -SiC), amorphous silicon nitride ( ⁇ -Si 1-x N x ), amorphous carbon ( ⁇ -C) and the like.
- ⁇ -Si amorphous silicon
- ⁇ -SiC amorphous silicon carbide
- ⁇ -Si 1-x N x amorphous carbon
- ⁇ -C amorphous carbon
- silicon nitride, silicon oxide, silicon oxynitride, or the like may be used.
- the sealing layer 18 is formed almost uniformly on the protective film 17 and functions as, for example, an adhesive layer.
- Examples of the material of the sealing layer 18 include acrylic resins, polyimide resins, fluorine resins, silicon resins, fluorine polymers, silicon polymers, epoxy resins, and norbornene resins.
- the refractive indexes of the materials of the protective film 17 and the sealing layer 18 affect the light extraction efficiency of the reflector structure, an appropriate material is selected in consideration of the sealing performance and the light extraction efficiency. Good.
- the CF / BM layer 19 is a layer including a color filter layer (a red filter 19R, a green filter 19G, and a blue filter 19B) and a black matrix layer BM.
- the red filter 19R, the green filter 19G, and the blue filter 19B are respectively disposed in regions facing the opening H1.
- the red filter 19R, the green filter 19G, and the blue filter 19B are each composed of a resin mixed with a pigment.
- the black matrix layer BM is configured by, for example, a resin film mixed with a black colorant, or a thin film filter using thin film interference.
- the thin film filter is formed by, for example, laminating one or more thin films made of metal, metal nitride, or metal oxide, and attenuating light by utilizing interference of the thin film.
- Specific examples of the thin film filter include a filter in which Cr and chromium oxide (III) (Cr 2 O 3 ) are alternately laminated.
- Cr and chromium oxide (III) Cr 2 O 3
- the second substrate 20 seals the organic EL element 10 together with the sealing layer 18.
- the second substrate 20 is made of a material that is transparent to the light generated by the organic EL element 10, such as glass or plastic.
- the selection pulse is supplied from the scanning line driving unit 3 to the writing transistor WsTr of each pixel P, whereby the pixel P is selected.
- a signal voltage corresponding to the video signal is supplied from the signal line driver 4 to the selected pixel P and is held in the holding capacitor Cs.
- the drive transistor DsTr is on / off controlled in accordance with the signal held in the holding capacitor Cs, and a drive current is injected into the organic EL element 10.
- the organic EL element 10 organic electroluminescent layer
- This light passes through the second electrode 16, the protective film 17, the sealing layer 18, the CF / BM layer 19, and the second substrate 20 and is extracted, for example.
- a color video image is displayed by additive color mixing of the colored lights emitted from the respective pixels P (pixels pr, pg, pb).
- the organic layer 15R (or the organic layers 15G and 15B) including the light emitting layer is formed, not the dry process such as the vapor deposition method but the printing method or the like. It is desirable to use a wet process. In the wet process, since the organic layer (light emitting layer) can be formed in the atmosphere, a vacuum environment is not necessary, and the maintenance of the equipment can be simplified. Further, a mask for shielding is not necessary, and mask replacement for each model is not necessary. That is, the non-operation time of the facility for forming the organic layer can be shortened, and the productivity can be further improved.
- the distance between the deposition source and the substrate increases as the panel size increases, and it is difficult to form the organic layer uniformly.
- the organic layer can be applied in a necessary amount to a necessary portion, so that the utilization efficiency of the material of the organic layer is also increased.
- FIG. 8 shows a planar configuration of a pixel separation film 104 according to a comparative example of the present embodiment.
- the pixel isolation film 104 includes a first insulating film 104A including the opening H100, and a second insulating film 104B stacked in a predetermined region on the first insulating film 104A.
- the opening H100 defines the shape of the light emitting region, and is provided for each pixel.
- the second insulating film 104B is provided extending in one direction in a region between the openings H100 on the first insulating film 104A.
- the pixel arrangement in this comparative example is the same as that shown in FIG.
- the thickness of the peripheral edge of the opening H100 of the first insulating film 104A is substantially constant, and the region between the pixels pr has a shape without a dent. ing.
- the first insulating film 14 ⁇ / b> A includes a recess H ⁇ b> 2 that connects the openings H ⁇ b> 1 of the pixels of the same emission color among the plurality of pixels P. Specifically, a region between the openings H1 of the adjacent pixels pr, a region between the openings H1 of the adjacent pixels pg, and a region between the openings H1 of the adjacent pixels pb. A recess H2 is formed.
- the effect of the recess H2 is particularly effective when the opening H1 has a reflector (reflection structure).
- the material, the thickness, the shape of the sub-opening H1a, and the like of the first insulating film 14A are designed to satisfy various conditions.
- the first insulating film 14A is designed with a large thickness. For this reason, wetting and spreading of the ink between pixels of the same light emission color is poor, and as described above, a portion where ink is not sufficiently dripped or a non-dropped portion remains as it is, and luminance unevenness may occur. is there.
- the thickness of the first insulating film 14A is designed to be relatively large by connecting the openings H1 using the recess H2 as in the present embodiment, it is possible to prevent the ink from spreading and preventing the ink from spreading.
- a membrane can be performed. That is, it is possible to reduce the luminance unevenness caused by the wet process while increasing the light extraction efficiency of the organic EL element 10, and to realize a display with higher image quality.
- the first insulating film 14 ⁇ / b> A having the opening H ⁇ b> 1 for each pixel P includes the openings H ⁇ b> 1 of the pixels P (pixel pr, pixel pg, or pixel pb) having the same emission color.
- the organic layers 15R, 15G, and 15B are formed in the opening H1 including the connecting recess H2.
- a second insulating film 14B extending along the arrangement direction for each luminescent color is formed in a region between the pixels P of different luminescent colors on the first insulating film 14A.
- the organic layers 15R, 15G, and 15B are formed using a wet process such as printing, ink spreading is suppressed between the pixels P having different emission colors, and the openings H1 having the same emission color are formed in the openings H1.
- the ink spreads evenly through the recess H2, and the film thickness unevenness of the organic layers 15R, 15G, and 15B can be reduced. Therefore, luminance unevenness can be reduced and display image quality can be improved.
- FIG. 11 shows a functional block configuration of an electronic device (electronic device 1A) to which the display device 1 is applied.
- the electronic device 1A include a television device, a personal computer (PC), a smartphone, a tablet PC, a mobile phone, a digital still camera, a digital video camera, and the like.
- the electronic apparatus 1A includes, for example, the display device 1 and the interface unit 30 described above.
- the interface unit 30 is an input unit to which various signals, a power source, and the like are input from the outside.
- the interface unit 30 may also include a user interface such as a touch panel, a keyboard, or operation buttons.
- the pixel isolation film 14 is configured by a laminated structure of the first insulating film 14A and the second insulating film 14B, and the first insulating film 14A and the second insulating film 14B are respectively formed.
- the configuration of the pixel isolation film 14 is not limited to this.
- the second insulating film 14B is not necessarily provided as long as the region between the pixel columns (between pixels having different emission colors) can be sufficiently separated.
- the first insulating film 14A and the second insulating film 14B may be formed integrally (as a single layer film).
- the first insulating film 14A may have a portion corresponding to the second insulating film 14B (the first insulating film 14A may have a structure also serving as the second insulating film 14B).
- the first insulating film 14A functions as the pixel isolation film 14 of the above embodiment, and the opening H1 (sub-opening H1a) and the recess H2 (not shown in FIG. 12).
- a protrusion 14A1 may be provided in a region between pixels P of different emission colors.
- the planar configuration of the protrusion 14A1 can be the same as that of the second insulating film 14B shown in FIG. 5A. Also in this case, it is desirable that a selective portion corresponding to the protrusion 14A1 has liquid repellency.
- the shape of the sub opening H1a formed in the first insulating film 14A is rectangular, but the shapes of the opening H1 and the sub opening H1a are not limited to rectangular shapes. . In addition to the rectangular shape, various shapes such as a circular shape, an elliptical shape, and a polygonal shape can be taken. Further, the number of sub-openings H1a is not limited to two, and may be one or three or more. When one opening H1 includes a plurality of sub-openings H1a, the shapes of the plurality of sub-openings H1a may be the same or different.
- the layout of the shape, position, number, and the like of the openings and sub-openings is not particularly limited as long as a configuration in which the openings (sub-openings) are connected by the recesses H2 can be realized.
- each layer described in the above embodiments and the like, or the film formation method and film formation conditions are not limited, and may be other materials and thicknesses, or other film formation methods and Film forming conditions may be used.
- the configuration of the organic EL element 10 is specifically described. However, it is not necessary to provide all the layers, and other layers may be further provided.
- the present disclosure can also be applied to a passive matrix display device.
- the configuration of the pixel circuit PXLC for active matrix driving is not limited to that described in the above embodiment, and a capacitor or a transistor may be added as necessary.
- a necessary driving circuit may be added in addition to the scanning line driving unit 3, the signal line driving unit 4, and the power line driving unit 5 described above in accordance with the change of the pixel circuit PXLC.
- a plurality of pixels that are two-dimensionally arranged and each include an organic electroluminescent element that emits light of any one of a plurality of colors
- the plurality of pixels are: A first insulating film disposed along one direction for each emission color, and having an opening for each pixel; A second insulating film extending along an arrangement direction for each light emitting color in a region between pixels of different light emitting colors on the first insulating film; An organic layer formed in the opening and including a light emitting layer,
- the first insulating film includes a recess that connects openings of pixels of the same light emission color among the plurality of pixels.
- the first insulating film and the second insulating film are integrally provided, The display device according to any one of (1) to (5), wherein the second insulating film forms a protrusion on the first insulating film. (7) The display device according to (6), wherein a selective portion corresponding to the protruding portion of the first insulating film has liquid repellency. (8) The display device according to any one of (1) to (7), wherein the first insulating film has a thickness at a bottom portion of the concave portion. (9) The opening includes a plurality of sub-openings, The display device according to any one of (1) to (8), wherein each of the plurality of sub-openings is provided to extend along the arrangement direction.
- the plurality of pixels are: A first insulating film disposed along one direction for each emission color, and having an opening for each pixel; A second insulating film extending along an arrangement direction for each light emitting color in a region between pixels of different light emitting colors on the first insulating film; An organic layer formed in the opening and including a light emitting layer,
- the electronic device including a display device, wherein the first insulating film includes a recess that connects openings of pixels of the same light emission color among the plurality of pixels.
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Abstract
Description
1.実施の形態(第1絶縁膜のうちの同色の画素間の領域に、開口部同士を繋ぐ凹部を設けた例)
2.適用例(電子機器の例)
[構成]
図1は、本開示の一実施の形態に係る表示装置(表示装置1)の全体構成を表すブロック図である。この表示装置1は、例えば、有機電界発光素子を用いた有機ELディスプレイ等であり、例えばR(赤),G(緑),B(青)のいずれかの色の光が上面側から出射される、上面発光型(トップエミッション型)の表示装置である。
図2は、表示装置1(画素部2)の断面構成を表したものである。図2では、有機EL素子10R,10G,10Bのうちの一部(有機電界発光素子10Rと、有機電界発光素子10Gの一部)に対応する領域についてのみ示している。画素部2では、駆動基板11a上に、複数の有機EL素子10が2次元配置されている。これらの有機EL素子10の上には、例えば、保護膜17、封止層18およびCF/BM層19を介して第2基板20が貼り合わせられている。
上記のような表示装置1では、走査線駆動部3から各画素Pの書き込みトランジスタWsTrへ選択パルスが供給されることで、画素Pが選択される。この選択された画素Pに、信号線駆動部4から映像信号に応じた信号電圧が供給され、保持容量Csに保持される。この保持容量Csに保持された信号に応じて駆動トランジスタDsTrがオンオフ制御され、有機EL素子10に駆動電流が注入される。これにより、有機EL素子10(有機電界発光層)では、正孔と電子とが再結合して発光を生じる。この光は、例えば第2電極16、保護膜17、封止層18、CF/BM層19および第2基板20を透過して取り出される。このようにして各画素P(画素pr,pg,pb)から射出された色光の加法混色により、カラーの映像表示がなされる。
上記実施の形態において説明した表示装置1は、様々なタイプの電子機器に用いることができる。図11に、表示装置1が適用される電子機器(電子機器1A)の機能ブロック構成を示す。電子機器1Aとしては、例えばテレビジョン装置、パーソナルコンピュータ(PC)、スマートフォン、タブレット型PC、携帯電話機、デジタルスチルカメラおよびデジタルビデオカメラ等が挙げられる。
(1)
2次元配置されると共に、それぞれが複数色のうちのいずれかの色の光を発する有機電界発光素子を含む複数の画素を備え、
前記複数の画素は、
発光色毎に一方向に沿って配置され、かつ
前記画素毎に開口部を有する第1の絶縁膜と、
前記第1の絶縁膜上の異なる発光色の画素同士の間の領域に、前記発光色毎の配列方向に沿って延在する第2の絶縁膜と、
前記開口部に形成されると共に発光層を含む有機層と
を有し、
前記第1の絶縁膜は、前記複数の画素のうちの同一の発光色の画素の開口部同士を繋ぐ凹部を含む
表示装置。
(2)
前記凹部の表面の接触角は、前記第2の絶縁膜の上面の接触角よりも小さい
上記(1)に記載の表示装置。
(3)
前記凹部の側面のテーパ角は、前記開口部の側面のテーパ角よりも小さい
上記(1)または(2)に記載の表示装置。
(4)
前記凹部は、前記発光色毎の配列方向において隣り合う画素間の領域に形成されている
上記(1)~(3)のいずれか1つに記載の表示装置。
(5)
前記第2の絶縁膜は撥液性を有する
上記(1)~(4)のいずれか1つに記載の表示装置。
(6)
前記第1の絶縁膜と前記第2の絶縁膜とは一体的に設けられ、
前記第2の絶縁膜は、前記第1の絶縁膜上において突条部を構成する
上記(1)~(5)のいずれか1つに記載の表示装置。
(7)
前記第1の絶縁膜の前記突条部に対応する選択的な部分が撥液性を有する
上記(6)に記載の表示装置。
(8)
前記第1の絶縁膜は、前記凹部の底部において厚みを有する
上記(1)~(7)のいずれか1つに記載の表示装置。
(9)
前記開口部は、複数のサブ開口を含んで構成され、
前記複数のサブ開口はそれぞれ、前記配列方向に沿って延在して設けられている
上記(1)~(8)のいずれか1つに記載の表示装置。
(10)
前記開口部は、リフレクタを有する
上記(1)~(9)のいずれか1つに記載の表示装置。
(11)
2次元配置されると共に、それぞれが複数色のうちのいずれかの色の光を発する有機電界発光素子を含む複数の画素を備え、
前記複数の画素は、
発光色毎に一方向に沿って配置され、かつ
前記画素毎に開口部を有する第1の絶縁膜と、
前記第1の絶縁膜上の異なる発光色の画素同士の間の領域に、前記発光色毎の配列方向に沿って延在する第2の絶縁膜と、
前記開口部に形成されると共に発光層を含む有機層と
を有し、
前記第1の絶縁膜は、前記複数の画素のうちの同一の発光色の画素の開口部同士を繋ぐ凹部を含む
表示装置を備えた電子機器。
Claims (11)
- 2次元配置されると共に、それぞれが複数色のうちのいずれかの色の光を発する有機電界発光素子を含む複数の画素を備え、
前記複数の画素は、
発光色毎に一方向に沿って配置され、かつ
前記画素毎に開口部を有する第1の絶縁膜と、
前記第1の絶縁膜上の異なる発光色の画素同士の間の領域に、前記発光色毎の配列方向に沿って延在する第2の絶縁膜と、
前記開口部に形成されると共に発光層を含む有機層と
を有し、
前記第1の絶縁膜は、前記複数の画素のうちの同一の発光色の画素の開口部同士を繋ぐ凹部を含む
表示装置。 - 前記凹部の表面の接触角は、前記第2の絶縁膜の上面の接触角よりも小さい
請求項1に記載の表示装置。 - 前記凹部の側面のテーパ角は、前記開口部の側面のテーパ角よりも小さい
請求項1に記載の表示装置。 - 前記凹部は、前記発光色毎の配列方向において隣り合う画素間の領域に形成されている
請求項1に記載の表示装置。 - 前記第2の絶縁膜は撥液性を有する
請求項1に記載の表示装置。 - 前記第1の絶縁膜と前記第2の絶縁膜とは一体的に設けられ、
前記第2の絶縁膜は、前記第1の絶縁膜上において突条部を構成する
請求項1に記載の表示装置。 - 前記第1の絶縁膜の前記突条部に対応する選択的な部分が撥液性を有する
請求項6に記載の表示装置。 - 前記第1の絶縁膜は、前記凹部の底部において厚みを有する
請求項1に記載の表示装置。 - 前記開口部は、複数のサブ開口を含んで構成され、
前記複数のサブ開口はそれぞれ、前記配列方向に沿って延在して設けられている
請求項1に記載の表示装置。 - 前記開口部は、リフレクタを有する
請求項1に記載の表示装置。 - 2次元配置されると共に、それぞれが複数色のうちのいずれかの色の光を発する有機電界発光素子を含む複数の画素を備え、
前記複数の画素は、
発光色毎に一方向に沿って配置され、かつ
前記画素毎に開口部を有する第1の絶縁膜と、
前記第1の絶縁膜上の異なる発光色の画素同士の間の領域に、前記発光色毎の配列方向に沿って延在する第2の絶縁膜と、
前記開口部に形成されると共に発光層を含む有機層と
を有し、
前記第1の絶縁膜は、前記複数の画素のうちの同一の発光色の画素の開口部同士を繋ぐ凹部を含む
表示装置を備えた電子機器。
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110391347A (zh) * | 2018-04-18 | 2019-10-29 | 株式会社日本有机雷特显示器 | 有机el显示面板及其制造方法、有机el显示装置 |
CN112056006A (zh) * | 2018-05-08 | 2020-12-08 | 索尼半导体解决方案公司 | 显示设备及其制造方法以及电子设备 |
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CN110767835B (zh) * | 2019-03-29 | 2021-01-26 | 昆山国显光电有限公司 | 透明显示面板、显示屏、显示装置及掩膜板 |
CN113611723A (zh) * | 2020-07-28 | 2021-11-05 | 广东聚华印刷显示技术有限公司 | 像素结构及显示器件 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040119066A1 (en) * | 2002-11-06 | 2004-06-24 | Chang-Wook Han | Organic electroluminescent device having sloped banks and coating fabrication technique |
US20060028124A1 (en) * | 2004-08-05 | 2006-02-09 | Wen-Kuo Chu | Active matrix organic electro-luminescent display panel and fabrication method thereof |
JP2007234232A (ja) * | 2006-02-27 | 2007-09-13 | Hitachi Displays Ltd | 画像表示装置 |
JP2008091070A (ja) * | 2006-09-29 | 2008-04-17 | Seiko Epson Corp | 発光装置及び電子機器 |
JP2009146848A (ja) * | 2007-12-18 | 2009-07-02 | Seiko Epson Corp | 発光装置及び電子機器 |
JP2009288735A (ja) * | 2008-06-02 | 2009-12-10 | Sony Corp | 画像表示装置及び画像表示装置の製造方法 |
WO2010032514A1 (ja) * | 2008-09-19 | 2010-03-25 | シャープ株式会社 | 薄膜付き基板、有機エレクトロルミネセンス表示装置、カラーフィルタ基板及び薄膜付き基板の製造方法 |
JP2011034849A (ja) * | 2009-08-03 | 2011-02-17 | Toshiba Mobile Display Co Ltd | 有機el装置 |
US20140070175A1 (en) * | 2012-09-10 | 2014-03-13 | Samsung Display Co., Ltd. | Organic light emitting diode display and method of fabricating the same |
JP2015144087A (ja) * | 2014-01-31 | 2015-08-06 | ソニー株式会社 | 有機電界発光装置および電子機器 |
WO2015136579A1 (ja) * | 2014-03-13 | 2015-09-17 | 株式会社Joled | 有機el表示パネルおよびその製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3915810B2 (ja) * | 2004-02-26 | 2007-05-16 | セイコーエプソン株式会社 | 有機エレクトロルミネッセンス装置、その製造方法、及び電子機器 |
JP4328383B2 (ja) * | 2007-05-28 | 2009-09-09 | パナソニック株式会社 | 有機elデバイス及び表示装置 |
JP2009122278A (ja) * | 2007-11-13 | 2009-06-04 | Dainippon Printing Co Ltd | カラーフィルタ形成用基板およびカラーフィルタの製造方法 |
JP5835770B2 (ja) | 2011-10-13 | 2015-12-24 | 株式会社Joled | 表示パネルの製造方法および表示パネル |
JP6082907B2 (ja) | 2012-02-17 | 2017-02-22 | 株式会社Joled | 表示装置及び表示装置の製造方法 |
CN104465671B (zh) * | 2014-12-26 | 2016-08-31 | 京东方科技集团股份有限公司 | 一种显示基板及其制作方法、显示装置 |
-
2017
- 2017-04-20 CN CN201780027456.9A patent/CN109315048B/zh active Active
- 2017-04-20 KR KR1020187034330A patent/KR20180132935A/ko not_active IP Right Cessation
- 2017-04-20 JP JP2018520712A patent/JP6808729B2/ja active Active
- 2017-04-20 US US16/303,128 patent/US11404501B2/en active Active
- 2017-04-20 WO PCT/JP2017/015898 patent/WO2017208660A1/ja active Application Filing
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040119066A1 (en) * | 2002-11-06 | 2004-06-24 | Chang-Wook Han | Organic electroluminescent device having sloped banks and coating fabrication technique |
US20060028124A1 (en) * | 2004-08-05 | 2006-02-09 | Wen-Kuo Chu | Active matrix organic electro-luminescent display panel and fabrication method thereof |
JP2007234232A (ja) * | 2006-02-27 | 2007-09-13 | Hitachi Displays Ltd | 画像表示装置 |
JP2008091070A (ja) * | 2006-09-29 | 2008-04-17 | Seiko Epson Corp | 発光装置及び電子機器 |
JP2009146848A (ja) * | 2007-12-18 | 2009-07-02 | Seiko Epson Corp | 発光装置及び電子機器 |
JP2009288735A (ja) * | 2008-06-02 | 2009-12-10 | Sony Corp | 画像表示装置及び画像表示装置の製造方法 |
WO2010032514A1 (ja) * | 2008-09-19 | 2010-03-25 | シャープ株式会社 | 薄膜付き基板、有機エレクトロルミネセンス表示装置、カラーフィルタ基板及び薄膜付き基板の製造方法 |
JP2011034849A (ja) * | 2009-08-03 | 2011-02-17 | Toshiba Mobile Display Co Ltd | 有機el装置 |
US20140070175A1 (en) * | 2012-09-10 | 2014-03-13 | Samsung Display Co., Ltd. | Organic light emitting diode display and method of fabricating the same |
JP2015144087A (ja) * | 2014-01-31 | 2015-08-06 | ソニー株式会社 | 有機電界発光装置および電子機器 |
WO2015136579A1 (ja) * | 2014-03-13 | 2015-09-17 | 株式会社Joled | 有機el表示パネルおよびその製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110391347A (zh) * | 2018-04-18 | 2019-10-29 | 株式会社日本有机雷特显示器 | 有机el显示面板及其制造方法、有机el显示装置 |
JP2019192337A (ja) * | 2018-04-18 | 2019-10-31 | 株式会社Joled | 有機el表示パネル、有機el表示装置、及び、有機el表示パネルの製造方法 |
CN110391347B (zh) * | 2018-04-18 | 2022-03-01 | 株式会社日本有机雷特显示器 | 有机el显示面板及其制造方法、有机el显示装置 |
CN112056006A (zh) * | 2018-05-08 | 2020-12-08 | 索尼半导体解决方案公司 | 显示设备及其制造方法以及电子设备 |
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US11404501B2 (en) | 2022-08-02 |
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CN109315048B (zh) | 2022-06-10 |
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