WO2016090859A1 - 可降解导热铝基覆铜板用热固性树脂组合物、导热铝基覆铜板、制备方法及其回收方法 - Google Patents

可降解导热铝基覆铜板用热固性树脂组合物、导热铝基覆铜板、制备方法及其回收方法 Download PDF

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WO2016090859A1
WO2016090859A1 PCT/CN2015/079974 CN2015079974W WO2016090859A1 WO 2016090859 A1 WO2016090859 A1 WO 2016090859A1 CN 2015079974 W CN2015079974 W CN 2015079974W WO 2016090859 A1 WO2016090859 A1 WO 2016090859A1
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aluminum
epoxy resin
resin
heat
copper foil
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PCT/CN2015/079974
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English (en)
French (fr)
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邓华阳
黄增彪
佘乃东
杨中强
王鹏
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广东生益科技股份有限公司
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Publication of WO2016090859A1 publication Critical patent/WO2016090859A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C217/00—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton
    • C07C217/02—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton
    • C07C217/04—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated
    • C07C217/06—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated having only one etherified hydroxy group and one amino group bound to the carbon skeleton, which is not further substituted
    • C07C217/08—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups and amino groups bound to acyclic carbon atoms of the same carbon skeleton the carbon skeleton being acyclic and saturated having only one etherified hydroxy group and one amino group bound to the carbon skeleton, which is not further substituted the oxygen atom of the etherified hydroxy group being further bound to an acyclic carbon atom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Definitions

  • the invention belongs to the field of copper clad laminates, and in particular relates to a degradable heat conductive aluminum-based copper clad laminate and a preparation method thereof.
  • the integration of circuit boards is getting higher and higher, more and more components are being mounted, and more and more heat is emitted per unit area during operation, in order to ensure The performance stability and reliability of electronic components are increasingly required for the heat dissipation of copper clad laminates.
  • the conventional FR-4 has a low thermal conductivity, generally 0.18-0.35 W/m ⁇ K, which does not meet the customer's requirements.
  • PCBs are the foundation of the electronics industry and are an indispensable component of all types of electronic products. With the upgrading and replacement of electronic products, more and more discarded PCBs have become more and more, and the recycling of used PCBs has gradually become an emerging industry. How to effectively recycle the waste of electronic waste such as PCB has become a new topic facing our country.
  • the aluminum-based copper clad plate is generally composed of an aluminum plate, a heat conductive insulating layer and a copper foil.
  • the middle heat conductive insulating layer functions as heat conduction, bonding and insulation.
  • the heat conduction is mainly due to the addition of a large amount of heat conductive filler, and the main cost of the aluminum substrate is made of aluminum plate. It consists of copper foil and thermal conductive filler, so it has important practical significance and recovery value for the recovery of aluminum sheet, copper foil and thermal conductive filler in waste aluminum-based copper clad laminate or PCB.
  • aluminum base The main method for recycling the copper clad laminate is manual cutting or mechanical pulverization and chemical etching, which is high in recovery cost, low in efficiency, and incapable of separating the thermally conductive filler in the resin composition.
  • the object of the present invention is to provide a thermosetting resin composition for a thermally degradable aluminum-based copper clad laminate, a thermally conductive aluminum-based copper clad laminate prepared therefrom, a preparation method and a recovery method thereof, and the present invention adopts the present invention.
  • the degradable curing agent acts as a curing agent for the epoxy resin, so that the prepared heat conductive aluminum-based copper clad plate is efficiently and greenly recycled, and the resource is effectively reused.
  • thermosetting resin composition for a degradable thermally conductive aluminum-based copper clad plate comprising an epoxy resin, a degradable curing agent, a thermally conductive filler and an auxiliary agent; wherein the degradable curing agent has the following structure:
  • n 2, 3 or 4; and the sum of m and n is 4;
  • Each R 1 is independently selected from the group consisting of hydrogen, alkyl, cycloalkyl, heterocycle, heterocycloalkyl, alkenyl, cycloalkenyl, aryl, heteroaryl, alkoxyalkyl or alkynyl;
  • Each A is independently selected from the group consisting of alkyl, alkane, alkene-iso-olefin, alkene-heterocycle-olefin, alkene, alkene-oxy-olefin, 1,4 alkyl substituted pipe a azine, a carbonyl group, a thiocarbonyl group, an aryl group or a heterocyclic aryl group;
  • Each R 2 is independently selected from -NHR 3 , -SH or heterocycloalkyl, wherein each R 3 is independently hydrogen, alkyl, aminoalkyl, alkyl-amino-alkyl, cycloalkyl a heterocyclic ring, an alkenyl group, an aryl group or a heterocyclic aryl group;
  • every two -OAR 2 groups and their attached carbon atoms may independently form a ring of not less than 4 members of dioxane, and in addition to one of the carbon atoms attached to the -OAR 2 group or
  • the plurality of ring carbon atoms may be each substituted by one or more independent amino groups or aminoalkyl groups, each of which is independently a primary or secondary amine.
  • the ratio of the number of moles of epoxy groups of the epoxy resin to the number of moles of active hydrogen in the degradable curing agent is 0.8 to 1.2, such as 0.82, 0.84, 0.86, 0.88, 0.90, 0.93, 0.96, 0.99, 1.02, 1.05, 1.08, 1.11, 1.14 or 1.17.
  • the epoxy resin is an epoxy resin having more than two or more epoxy groups in one molecular epoxy resin, and is specifically a bisphenol A type epoxy resin and a bisphenol F type ring.
  • Oxygen resin, bisphenol S type epoxy resin, biphenyl type epoxy resin, isocyanate modified epoxy resin, o-cresol epoxy resin, naphthalene epoxy resin, alicyclic epoxy resin, isophthalic acid Any one or at least two of a phenol type epoxy resin, a polyethylene glycol type epoxy resin, a trifunctional epoxy resin, a tetrafunctional epoxy resin, a dicyclopentadiene epoxy resin, or a novolac epoxy resin mixture.
  • the thermally conductive filler comprises any one of a metal, a metal oxide, a boron nitride, an aluminum nitride, a silicon carbide or a ceramic filler or a mixture of at least two, the metal being aluminum, magnesium or zinc. Any one or a mixture of at least two.
  • the thermally conductive filler is 50-85% by weight of the resin composition, such as 54%, 58%, 62%, 66%, 70%, 74%, 78% or 80%.
  • the auxiliary agent is any one or a mixture of at least two of a coupling agent, an antifoaming agent, a leveling agent, a dispersing agent, an antioxidant or a thickening agent.
  • a degradable thermally conductive aluminum-based copper clad laminate comprising, in order from bottom to top, an aluminum plate, a thermally conductive insulating layer formed of the thermosetting resin composition as described above, and a copper foil.
  • the invention adopts a degradable thermosetting resin composition as a degradable thermal conductive insulating layer, and realizes efficient and feasible recovery of the aluminum-based copper clad laminate.
  • the copper foil is an electrolytic copper foil or a rolled copper foil having a thickness of 12 to 150 ⁇ m.
  • the aluminum plate includes two types of surface treatment and non-surface treatment, wherein the surface treatment method includes physical methods and chemical methods, and the aluminum plate has a thickness of 0.05 to 3.0 mm.
  • a third object of the present invention is to provide a method for preparing a degradable thermally conductive aluminum-based copper clad laminate as described above, the method comprising the steps of:
  • a fourth object of the present invention is to provide a method for recovering a degradable thermally conductive aluminum-based copper clad laminate as described above, the method comprising the steps of:
  • thermosetting resin composition (1) etching a thermally conductive aluminum-based copper clad plate to obtain a copper ion recovery liquid, and then placing the thermally conductive insulating layer and the aluminum plate in an acidic organic solvent, heating for 1 to 4 hours, and decomposing the thermosetting resin composition to obtain an aluminum plate and degrading liquid;
  • the aluminum plate can be reused repeatedly, and the degradation liquid is filtered to obtain a heat conductive filler. After the heat conductive filler is washed, it can be reused. In the remaining degradation liquid, alkali is added for neutralization, and the resin is precipitated and filtered. The degraded resin is isolated and the resin can be reused.
  • the present invention has the following beneficial effects:
  • the method of the invention can produce high thermal conductivity ( ⁇ 2.0W/mk), high peel strength ( ⁇ 0.65N/mm) and high breakdown voltage ( ⁇ 6.5kV), and can be completely degraded.
  • the base copper clad plate realizes efficient and green recycling of the aluminum plate, the heat conductive filler and the resin, and the method is simple to manufacture. Art is feasible and low cost.
  • FIG. 1 is a schematic structural view of a thermally conductive aluminum-based copper clad laminate, wherein: 10-aluminum plate; 20-thermally conductive insulating layer; 30-copper foil.
  • Biphenyl epoxy resin NC-3000H, epoxy equivalent of 288 g/mol, Nippon Kayaku Co., Ltd.
  • Silicon micropowder particle size 1.5 ⁇ m, Lianyungang Donghai Silicon Micropowder Factory.
  • the glue is mixed uniformly to obtain a uniformly dispersed thermal conductive glue.
  • the thermal conductive glue is coated on the copper foil by a coating device, and baked at 155 ° C for 2 min to obtain a resin-coated copper foil having a thickness of 100 ⁇ m. .
  • the resin-coated copper foil and the oxidized aluminum plate are stacked according to the structure shown in FIG. 1 and placed in a press, and cured at 190 ° C for 60 min, and the applied pressure is 300-500 PSI, thereby obtaining a heat-conductive aluminum base. CCL.
  • Biphenyl epoxy resin NC-3000H, epoxy equivalent of 288 g/mol, Nippon Kayaku Co., Ltd.
  • Amino ketal curing agent Prepared according to the method of CN 103249712 A.
  • Silicon micropowder particle size 1.5 ⁇ m, Lianyungang Donghai Silicon Micropowder Factory.
  • the glue is mixed uniformly to obtain a uniformly dispersed thermal conductive glue.
  • the thermal conductive glue is coated on the copper foil by a coating device, and baked at 155 ° C for 2 min to obtain a resin-coated copper foil having a thickness of 100 ⁇ m. .
  • the resin-coated copper foil and the oxidized aluminum plate are stacked according to the structure shown in FIG. 1 and placed in a press, and cured at 190 ° C for 60 min, and the applied pressure is 300-500 PSI, thereby obtaining a heat-conductive aluminum base. CCL.
  • the thermally conductive aluminum-based copper clad plate prepared above is first etched away to obtain a recoverable copper recovery liquid, and the thermal conductive insulating layer and the aluminum plate are placed in an ethylene glycol solvent, and the pH is adjusted to 4-6 with hydrochloric acid at 100 °C, hold for 2h, the resin is completely degraded, and the aluminum plate and the degradation liquid are obtained.
  • the aluminum plate can be washed and reused, and the thermal decomposition filler can be obtained by filtering the degradation liquid, and the sodium hydroxide solution is added to the remaining degradation liquid to adjust the pH value to 7.
  • the resin is precipitated, and the filter is dried to obtain a linear resin, thereby realizing the recovery of all components in the thermally conductive aluminum substrate.
  • Biphenyl epoxy resin NC-3000H, epoxy equivalent of 288 g/mol, Nippon Kayaku Co., Ltd.
  • Amino acid ester curing agent Prepared according to the method of CN 103249712 A.
  • Silicon micropowder particle size 1.5 ⁇ m, Lianyungang Donghai Silicon Micropowder Factory.
  • 80 parts of the above biphenyl epoxy resin, 17.5 parts of amino orthoester curing agent, 32.5 parts of boron nitride, 162.5 parts of alumina, 32.5 parts of silicon micropowder, 126.4 parts of butanone, 0.7 parts of dispersing agent, and the solid content is 72% glue, evenly distributed to obtain a uniform dispersion of thermal conductive glue, coating the thermal paste on the copper foil with a coating device, baking at 155 ° C for 2 min, you can get the resin coated copper foil, the thickness of the thermal insulation layer It is 100 ⁇ m.
  • the resin-coated copper foil and the oxidized aluminum plate are stacked according to the structure shown in FIG. 1 and placed in a press, and cured at 190 ° C for 60 min, and the applied pressure is 300-500 PSI, thereby obtaining a heat-conductive aluminum base. CCL.
  • the thermally conductive aluminum-based copper clad laminate obtained above is first etched away from the copper foil to obtain a recoverable copper recovery liquid.
  • the thermal conductive insulating layer and the aluminum plate are placed in an ethylene glycol solvent, the pH is adjusted to 4-6 with hydrochloric acid, and the resin is completely degraded at 100 ° C for 2 h to obtain an aluminum plate and a degradation liquid.
  • the aluminum plate can be reused for further filtration and the degradation liquid is filtered.
  • the heat conductive filler can be obtained, and the sodium hydroxide solution is added dropwise to the remaining degradation liquid to adjust the pH value to 7, and the resin composition is precipitated, and the filter is dried to obtain a linear resin. Thereby, the recovery of all components in the thermally conductive aluminum substrate is achieved.
  • Biphenyl epoxy resin NC-3000H, epoxy equivalent of 288 g/mol, Nippon Kayaku Co., Ltd.
  • Silicon micropowder particle size 1.5 ⁇ m, Lianyungang Donghai Silicon Micropowder Factory.
  • the thermally conductive aluminum-based copper clad laminate obtained above is first etched away from the copper foil to obtain a recoverable copper recovery liquid.
  • the thermal conductive insulating layer and the aluminum plate are placed in an ethylene glycol solvent, the pH is adjusted to 4-6 with hydrochloric acid, and the resin is completely degraded at 100 ° C for 2 h to obtain an aluminum plate and a degradation liquid.
  • the aluminum plate can be reused for further filtration and the degradation liquid is filtered.
  • the heat conductive filler can be obtained, and the sodium hydroxide solution is added dropwise to the remaining degradation liquid to adjust the pH value to 7, and the resin composition is precipitated, and the filter is dried to obtain a linear resin. Thereby, the recovery of all components in the thermally conductive aluminum substrate is achieved.
  • Biphenyl epoxy resin NC-3000H, epoxy equivalent of 288 g/mol, Nippon Kayaku Co., Ltd.
  • Thiol carbonate curing agent Prepared according to the method of CN 103249712 A.
  • Silicon micropowder particle size 1.5 ⁇ m, Lianyungang Donghai Silicon Micropowder Factory.
  • thermoconductive glue 80 parts of the above biphenyl epoxy resin, 18 parts of a thiol carbonate curing agent, 32.5 parts of boron nitride, 162.5 parts of alumina, 32.5 parts of silicon micropowder, 126.4 parts of butanone, 0.7 parts of dispersing agent, and a solid content. It is a 72% glue, which is uniformly mixed to obtain a uniformly dispersed thermal conductive glue.
  • the thermal conductive glue is coated on the copper foil by a coating device, and baked at 155 ° C for 2 min to obtain a resin-coated copper foil, a thermally conductive insulating layer. The thickness is 100 ⁇ m.
  • the resin-coated copper foil and the oxidized aluminum plate are stacked according to the structure shown in FIG. 1 and placed in a press, and cured at 190 ° C for 60 min, and the applied pressure is 300-500 PSI, thereby obtaining a heat-conductive aluminum base. CCL.
  • the thermally conductive aluminum-based copper clad laminate obtained above is first etched away from the copper foil to obtain a recoverable copper recovery liquid.
  • the thermal conductive insulating layer and the aluminum plate are placed in an ethylene glycol solvent, the pH is adjusted to 4-6 with hydrochloric acid, and the resin is completely degraded at 100 ° C for 2 h to obtain an aluminum plate and a degradation liquid.
  • the aluminum plate can be reused for further filtration and the degradation liquid is filtered.
  • the heat conductive filler can be obtained, and the sodium hydroxide solution is added dropwise to the remaining degradation liquid to adjust the pH value to 7, and the resin composition is precipitated, and the filter is dried to obtain a linear resin. Thereby, the recovery of all components in the thermally conductive aluminum substrate is achieved.
  • Biphenyl epoxy resin NC-3000H, epoxy equivalent of 288 g/mol, Nippon Kayaku Co., Ltd.
  • Thiol carbonate curing agent Prepared according to the method of CN 103249712 A.
  • Silicon micropowder particle size 1.5 ⁇ m, Lianyungang Donghai Silicon Micropowder Factory.
  • the thermally conductive aluminum-based copper clad laminate obtained above is first etched away from the copper foil to obtain a recoverable copper recovery liquid.
  • the thermal conductive insulating layer and the aluminum plate are placed in an ethylene glycol solvent, the pH is adjusted to 4-6 with hydrochloric acid, and the resin is completely degraded at 100 ° C for 2 h to obtain an aluminum plate and a degradation liquid.
  • the aluminum plate can be reused for further filtration and the degradation liquid is filtered.
  • the heat conductive filler can be obtained, and the sodium hydroxide solution is added dropwise to the remaining degradation liquid to adjust the pH value to 7, and the resin composition is precipitated, and the filter is dried to obtain a linear resin. Thereby, the recovery of all components in the thermally conductive aluminum substrate is achieved.
  • Bisphenol A type epoxy resin DER 530, epoxy equivalent of 430 g/mol, DOW CHEMICAL.
  • Amino ketal curing agent Prepared according to the method of CN 103249712 A.
  • Silicon micropowder particle size 1.5 ⁇ m, Lianyungang Donghai Silicon Micropowder Factory.
  • the thermally conductive aluminum-based copper clad laminate obtained above is first etched away from the copper foil to obtain a recoverable copper recovery liquid.
  • the thermal conductive insulating layer and the aluminum plate are placed in an ethylene glycol solvent, the pH is adjusted to 4-6 with hydrochloric acid, and the resin is completely degraded at 100 ° C for 2 h to obtain an aluminum plate and a degradation liquid.
  • the aluminum plate can be reused for further filtration and the degradation liquid is filtered.
  • the heat conductive filler can be obtained, and the sodium hydroxide solution is added dropwise to the remaining degradation liquid to adjust the pH value to 7, the resin is precipitated, and the linear resin is obtained by filtering and drying, thereby realizing the recovery of all components in the heat conductive aluminum substrate.
  • Biphenyl epoxy resin NC-3000H, epoxy equivalent of 288 g/mol, Nippon Kayaku Co., Ltd.
  • Silicon micropowder particle size 1.5 ⁇ m, Lianyungang Donghai Silicon Micropowder Factory.
  • thermoconductive glue 80 parts of the above biphenyl epoxy resin, 4 parts of dicyandiamide curing agent, 21 parts of boron nitride, 84 parts of alumina, 21 parts of silicon powder, 113.1 parts of butanone, 0.5 parts of dispersing agent, and a solid content of 65 % glue, mixing evenly to obtain a uniform dispersion of thermal conductive glue, coating the thermal conductive glue on the copper foil with a coating device, baking at 155 ° C for 2 min, to obtain a resin coated copper foil, the thickness of the thermal conductive insulation layer is 100 ⁇ m.
  • the resin-coated copper foil and the oxidized aluminum plate are stacked according to the structure shown in FIG. 1 and placed in a press, and cured at 190 ° C for 60 min, and the applied pressure is 300-500 PSI, thereby obtaining a heat-conductive aluminum base. CCL.
  • the thermally conductive aluminum-based copper clad plate prepared above is first etched away to obtain a recoverable copper recovery liquid, and the thermal conductive insulating layer and the aluminum plate are placed in an ethylene glycol solvent, and the pH is adjusted to 4-6 with hydrochloric acid at 100 °C, for 2h, the thermal insulation layer did not degrade significantly, and the thermal insulation layer and the aluminum plate were firmly bonded together. It is not possible to separate the thermal insulation layer and the aluminum plate.
  • Biphenyl epoxy resin NC-3000H, epoxy equivalent of 288 g/mol, Nippon Kayaku Co., Ltd.
  • Silicon micropowder particle size 1.5 ⁇ m, Lianyungang Donghai Silicon Micropowder Factory.
  • thermo conductive glue is coated on the copper foil by a coating device, and baked at 155 ° C for 2 minutes to obtain a resin-coated copper foil.
  • the thickness of the thermally conductive insulating layer was 100 ⁇ m.
  • the resin-coated copper foil and the oxidized aluminum plate are stacked according to the structure shown in FIG. 1 and placed in a press, and cured at 190 ° C for 60 min, and the applied pressure is 300-500 PSI, thereby obtaining a heat-conductive aluminum base. CCL.
  • the thermally conductive aluminum-based copper clad plate prepared above is first etched away to obtain a recoverable copper recovery liquid, and the thermal conductive insulating layer and the aluminum plate are placed in an ethylene glycol solvent, and the pH is adjusted to 4-6 with hydrochloric acid at 100 °C, for 2h, the thermal insulation layer did not degrade significantly, and the thermal insulation layer and the aluminum plate were firmly bonded together, and the thermal insulation layer and the aluminum plate could not be separated.
  • Biphenyl epoxy resin NC-3000H, epoxy equivalent of 288 g/mol, Nippon Kayaku Co., Ltd.
  • Amino ketal curing agent Prepared according to the method of CN 103249712 A.
  • Silicon micropowder particle size 1.5 ⁇ m, Lianyungang Donghai Silicon Micropowder Factory.
  • the glue is mixed uniformly to obtain a uniformly dispersed thermal conductive glue.
  • the thermal conductive glue is coated on the copper foil by a coating device, and baked at 155 ° C for 2 min to obtain a resin-coated copper foil having a thickness of 100 ⁇ m. .
  • the resin-coated copper foil and the oxidized aluminum plate are stacked according to the structure shown in FIG. 1 and placed in a press, and cured at 190 ° C for 60 min, and the applied pressure is 300-500 PSI, thereby obtaining a heat-conductive aluminum base. CCL.
  • the thermally conductive aluminum-based copper clad plate prepared above is first etched away to obtain a recoverable copper recovery liquid, and the thermal conductive insulating layer and the aluminum plate are placed in an ethylene glycol solvent, and the pH is adjusted to 4-6 with hydrochloric acid at 100 °C, hold for 2h, the resin is completely degraded, and the aluminum plate and the degradation liquid are obtained.
  • the aluminum plate can be washed and reused, and the thermal decomposition filler can be obtained by filtering the degradation liquid, and the sodium hydroxide solution is added to the remaining degradation liquid to adjust the pH value to 7.
  • the resin is precipitated, and the filter is dried to obtain a linear resin, thereby realizing the recovery of all components in the thermally conductive aluminum substrate.
  • Biphenyl epoxy resin NC-3000H, epoxy equivalent of 288 g/mol, Nippon Kayaku Co., Ltd.
  • Amino ketal curing agent Prepared according to the method of CN 103249712 A.
  • Silicon micropowder particle size 1.5 ⁇ m, Lianyungang Donghai Silicon Micropowder Factory.
  • the thermally conductive aluminum-based copper clad plate prepared above is first etched away to obtain a recoverable copper recovery liquid, and the thermal conductive insulating layer and the aluminum plate are placed in an ethylene glycol solvent, and the pH is adjusted to 4-6 with hydrochloric acid at 100 °C, hold for 2h, the resin is completely degraded, and the aluminum plate and the degradation liquid are obtained.
  • the aluminum plate can be washed and reused, and the thermal decomposition filler can be obtained by filtering the degradation liquid, and the sodium hydroxide solution is added to the remaining degradation liquid to adjust the pH value to 7.
  • the resin is precipitated, and the filter is dried to obtain a linear resin, thereby realizing the recovery of all components in the thermally conductive aluminum substrate.
  • Thermal conductivity The test uses the ASTM-D5470 method
  • Breakdown voltage IPC-TM-650 2.5.6;
  • both the degradable amine curing agent and the thiol curing agent can realize efficient recovery of the heat conductive aluminum-based copper clad plate, and the conventional amine curing agent cannot realize the effective and green of each component.
  • Environmentally friendly recycling In order to obtain a comprehensive performance of the degradable thermally conductive aluminum-based copper clad laminate, the content of each component must be within a reasonable range.

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  • Organic Chemistry (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
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Abstract

本发明属于覆铜板领域，涉及可降解导热铝基覆铜板用热固性树脂组合物、导热铝基覆铜板、制备方法及其回收方法。所述制备方法将环氧树脂、可降解固化剂、导热填料以及其他助剂分散均匀，制得分散均匀的分散液，然后将分散液涂覆在铜箔上，并进行烘烤，得到涂树脂铜箔。接着将涂树脂铜箔和铝板进行叠合，进行高温层压，便可得到导热铝基覆铜板。通过本发明的方法能制得导热系数高、剥离强度高和击穿电压高等综合性能优异且能完全降解的导热铝基覆铜板，实现了对铝板、导热填料和树脂高效、绿色回收。

Description

可降解导热铝基覆铜板用热固性树脂组合物、导热铝基覆铜板、制备方法及其回收方法 技术领域
本发明属于覆铜板领域，尤其涉及一种可降解的导热铝基覆铜板及其制备方法。
背景技术
随着电子产品的“轻、薄、短、小”化，电路板的集成度越来越高，搭载的元器件越来越多，在工作时单位面积散发的热量越来越多，为了保证电子元器件的工作稳定性、可靠性等性能对覆铜板的散热性要求越来越高。然而，传统的FR-4的热导率比较低，一般为0.18-0.35W/m·K，不能很好地满足客户的使用要求。
高导热铝基覆铜板由于具有相对较高的散热能力，可以满足市场越来越高的要求。近年来随着LED照明、大功率电器、LED-TV背光源以及各种电源的迅速发展，使得铝基覆铜板的年增长率超过了20％。印制电路板(PCB)是电子工业的基础，是各类电子产品不可或缺的重要元器件。随着电子产品的升级和换代更新，废弃的PCB越来越多，废旧PCB的回收逐渐成为一个新兴的产业。如何有效地对废弃的PCB等电子废弃物的资源化回收处理，已成为当前我们国家面临的一项新课题。
铝基覆铜板一般由铝板、导热绝缘层和铜箔构成，中间的导热绝缘层起到导热、粘结和绝缘的作用，导热主要是由于添加了大量的导热填料，铝基板的主要成本由铝板、铜箔和导热填料构成，因此对于废旧铝基覆铜板或PCB中的铝板、铜箔以及导热填料的回收具有重要的现实意义和回收价值。目前，铝基 覆铜板的回收主要方法是人工切割或机械粉碎并辅以化学蚀刻，此种方法回收成本高，效率低，且无法分离树脂组合物中的导热填料。
发明内容
针对已有技术的问题，本发明的目的在于提供一种可降解的导热铝基覆铜板用热固性树脂组合物、由其制备得到的导热铝基覆铜板、制备方法及其回收方法，本发明采用可降解的固化剂作为环氧树脂的固化剂，使所制得的导热铝基覆铜板得到高效且绿色环保的回收，真正实现了资源有效再利用。
为了实现上述目的，本发明采用了如下技术方案：
一种可降解的导热铝基覆铜板用热固性树脂组合物，其包括环氧树脂、可降解固化剂、导热填料和助剂；其中，所述可降解固化剂具有如下结构：
Figure PCTCN2015079974-appb-000001
m为2、1或0；n为2、3或4；且m和n的和为4；
每一个R1都独立地选自氢、烷基、环烷基、杂环、杂环烷基、烯基、环烯基、芳香基、杂芳基、烷氧基烷基或炔基；
每一个A都独立地选自烷基、烷烃基、烯烃基-异-烯烃基、烯烃基-杂环-烯烃基、烯烃基、烯烃基-氧-烯烃基、1，4烷基取代的哌嗪、羰基、硫羰基、芳基或杂环芳基；
每一个R2都独立地选自-NHR3、-SH或杂环烷基，其中每个R3都独立地是氢、烷基、氨基烷基、烷基-氨基-烷基、环烷基、杂环、烯基、芳基或杂环芳基；
或者，每两个-O-A-R2基及其连接的碳原子可以独立地形成一个不少于4元的二氧六环的环，且除了与-O-A-R2基团连接的碳原子之外的一个或者多个环碳 原子可以分别被一个或者多个独立的氨基或者氨基烷基取代，其中每一个氨基都独立地是一级或二级胺。
优选地，所述环氧树脂的环氧基摩尔数与可降解固化剂中的活泼氢的摩尔数的比值为0.8～1.2，例如0.82、0.84、0.86、0.88、0.90、0.93、0.96、0.99、1.02、1.05、1.08、1.11、1.14或1.17。
优选地，所述环氧树脂为1个分子环氧树脂中具有多于两个或两个以上环氧基团的环氧树脂，其具体为双酚A型环氧树脂、双酚F型环氧树脂、双酚S型环氧树脂、联苯型环氧树脂、异氰酸酯改性环氧树脂、邻甲酚类环氧树脂、萘类环氧树脂、脂环族类环氧树脂、间苯二酚型环氧树脂、聚乙二醇型环氧树脂、三官能团环氧树脂、四官能团环氧树脂、双环戊二烯类环氧树脂或酚醛型环氧树脂中的任意一种或者至少两种的混合物。
优选地，所述导热填料包括金属、金属氧化物、氮化硼、氮化铝、碳化硅或陶瓷填料中的任意一种或者至少两种的混合物，所述金属为铝、镁或锌中的任意一种或者至少两种的混合物。
优选地，所述导热填料的重量百分比为树脂组合物的50-85％，例如54％、58％、62％、66％、70％、74％、78％或80％。
优选地，所述助剂为偶联剂、消泡剂、流平剂、分散剂、抗氧剂或增稠剂中的任意一种或者至少两种的混合物。
一种可降解的导热铝基覆铜板，其自下而上依次包括铝板、如上所述的热固性树脂组合物形成的导热绝缘层以及铜箔。
本发明采用可降解的热固性树脂组合物作为可降解导热绝缘层，实现了铝基覆铜板的高效、可行的回收。
所述铜箔为电解铜箔或压延铜箔，其厚度为12～150μm。
所述铝板包括经表面处理和不经表面处理的两种，其中表面处理方法包括物理法和化学法，铝板厚度为0.05～3.0mm。
本发明的目的之三在于提供一种如上所述的可降解的导热铝基覆铜板的制备方法，所述方法包括以下步骤：
(1)将配方量的环氧树脂、可降解固化剂、导热填料和助剂混合均匀，得到分散液；
(2)将上述分散液用涂覆设备涂覆在铜箔上，并进行烘烤，得到涂树脂铜箔；
(3)将上述涂树脂铜箔和铝板进行叠合，进行高温层压，得到可降解的导热铝基覆铜板。
本发明的目的之四在于提供一种如上所述的可降解的导热铝基覆铜板的回收方法，所述方法包括以下步骤：
(1)将导热铝基覆铜板进行蚀刻，得到铜离子回收液，然后将导热绝缘层和铝板置于偏酸性的有机溶剂中，加热1～4小时，热固性树脂组合物分解，得到铝板和降解液；
(2)铝板洗净可重复再利用，对降解液进行过滤，便得到导热填料，导热填料洗净后可再利用，在剩余的降解液中，加入碱进行中和，树脂便会析出，过滤分离得到降解后的树脂，该树脂可重复使用。
由此可知，导热铝基覆铜板中的各组分都得到了有效的回收和再利用。
与已有技术相比，本发明具有如下有益效果：
通过本发明的方法能制得导热系数高(≥2.0W/m.k)、剥离强度高(≥0.65N/mm)和击穿电压高(≥6.5kV)等综合性能优异且能完全降解的导热铝基覆铜板，实现了对铝板、导热填料和树脂高效、绿色回收且该方法制作简单、工 艺可行且成本低廉。
附图说明
图1是导热铝基覆铜板的结构示意图，其中：10-铝板；20-导热绝缘层；30-铜箔。
具体实施方式
下面通过具体实施方式来进一步说明本发明的技术方案。
实施例1
联苯环氧树脂，NC-3000H，环氧当量为288g/mol，日本化药株式会社。
氨基缩酮固化剂
Figure PCTCN2015079974-appb-000002
按照CN 103249712 A的方法制得。
氮化硼，粒径12μm，迈图高新材料陶瓷事业部生产。
氧化铝，粒径5μm，百图高新材料有限公司。
硅微粉，粒径1.5μm，连云港东海硅微粉厂。
分散剂，BYK-903，德国BYK有限公司。
丁酮，兰州石化有限公司
取上述联苯环氧80份、氨基缩酮固化剂19份，氮化硼35份，氧化铝49份，硅微粉15份，丁酮106.6份，分散剂0.5份，配制成固含量为65％胶液，混合均匀得到分散均匀的导热胶液，用涂覆设备将导热胶液涂覆在铜箔上，155℃下烘烤2min，便可得到涂树脂铜箔，导热绝缘层的厚度为100μm。将涂树脂铜箔与经氧化处理后的铝板按照如图1所示的结构进行叠配并置于压机中，在190℃下固化60min，施加的压力为300～500PSI，即得到导热铝基覆铜板。
将上述制得的导热铝基覆铜板，先蚀刻掉铜箔，得到可回收的铜回收液，导热绝缘层和铝板置于乙二醇溶剂中，用盐酸调节pH值为4-6，在100℃，保持2h，树脂完全降解，得到铝板和降解液，铝板洗净可再使用，过滤降解液便可得到导热填料，往剩下的降解液中滴加氢氧化钠溶液调节pH值为7，树脂便会析出，过滤干燥便得到线性树脂，从而实现了导热铝基板中所有组份的回收。
实施例2
联苯环氧树脂，NC-3000H，环氧当量为288g/mol，日本化药株式会社。
氨基缩酮固化剂
Figure PCTCN2015079974-appb-000003
按照CN 103249712 A的方法制得。
氮化硼，粒径12μm，迈图高新材料陶瓷事业部生产。
氧化铝，粒径5μm，百图高新材料有限公司。
硅微粉，粒径1.5μm，连云港东海硅微粉厂。
分散剂，BYK-903，德国BYK有限公司。
丁酮，兰州石化有限公司
取上述联苯环氧80份、氨基缩酮固化剂19份，氮化硼24.7份，氧化铝99份，硅微粉24.7份，丁酮133.5份，分散剂0.5份，配制成固含量为65％胶液，混合均匀得到分散均匀的导热胶液，用涂覆设备将导热胶液涂覆在铜箔上，155℃下烘烤2min，便可得到涂树脂铜箔，导热绝缘层的厚度为100μm。将涂树脂铜箔与经氧化处理后的铝板按照如图1所示的结构进行叠配并置于压机中，在190℃下固化60min，施加的压力为300～500PSI，即得到导热铝基覆铜板。
将上述制得的导热铝基覆铜板，先蚀刻掉铜箔，得到可回收的铜回收液，导热绝缘层和铝板置于乙二醇溶剂中，用盐酸调节pH值为4-6，在100℃，保持2h，树脂完全降解，得到铝板和降解液，铝板洗净可再使用，过滤降解液便可得到导热填料，往剩下的降解液中滴加氢氧化钠溶液调节pH值为7，树脂便会析出，过滤干燥便得到线性树脂，从而实现了导热铝基板中所有组份的回收。
实施例3
联苯环氧树脂，NC-3000H，环氧当量为288g/mol，日本化药株式会社。
氨基原酸酯固化剂
Figure PCTCN2015079974-appb-000004
按照CN 103249712 A的方法制得。
氮化硼，粒径12μm，迈图高新材料陶瓷事业部生产。
氧化铝，粒径5μm，百图高新材料有限公司。
硅微粉，粒径1.5μm，连云港东海硅微粉厂。
分散剂，BYK-903，德国BYK有限公司。
丁酮，兰州石化有限公司。
取上述联苯环氧树脂80份、氨基原酸酯固化剂17.5份，氮化硼32.5份，氧化铝162.5份，硅微粉32.5份，丁酮126.4份，分散剂0.7份，配制成固含量为72％胶液，混合均匀得到分散均匀的导热胶液，用涂覆设备将导热胶液涂覆在铜箔上，155℃下烘烤2min，便可得到涂树脂铜箔，导热绝缘层的厚度为100μm。将涂树脂铜箔与经氧化处理后的铝板按照如图1所示的结构进行叠配并置于压机中，在190℃下固化60min，施加的压力为300～500PSI，即得到导热铝基覆铜板。
将上述制得的导热铝基覆铜板，先蚀刻掉铜箔，得到可回收的铜回收液， 导热绝缘层和铝板置于乙二醇溶剂中，用盐酸调节pH值为4-6，在100℃，保持2h，树脂完全降解，得到铝板和降解液，铝板洗净可再使用，过滤降解液便可得到导热填料，往剩下的降解液中滴加氢氧化钠溶液调节pH值为7，树脂组合物便会析出，过滤干燥便得到线性树脂。从而实现了导热铝基板中所有组份的回收。
实施例4
联苯环氧树脂，NC-3000H，环氧当量为288g/mol，日本化药株式会社。
硫醇原酸酯固化剂
Figure PCTCN2015079974-appb-000005
按照CN 103249712 A的方法制得。
氮化硼，粒径12μm，迈图高新材料陶瓷事业部生产。
氧化铝，粒径5μm，百图高新材料有限公司。
硅微粉，粒径1.5μm，连云港东海硅微粉厂。
分散剂，BYK-903，德国BYK有限公司。
丁酮，兰州石化有限公司
取上述联苯环氧树脂80份、硫醇原酸酯固化剂18份，氮化硼24.7份，氧化铝99份，硅微粉24.7份，丁酮133.5份，分散剂0.5份，配制成固含量为65％胶液，混合均匀得到分散均匀的导热胶液，用涂覆设备将导热胶液涂覆在铜箔上，155℃下烘烤2min，便可得到涂树脂铜箔，导热绝缘层的厚度为100μm。将涂树脂铜箔与经氧化处理后的铝板按照如图1所示的结构进行叠配并置于压机中，在190℃下固化60min，施加的压力为300～500PSI，即得到导热铝基覆铜板。
将上述制得的导热铝基覆铜板，先蚀刻掉铜箔，得到可回收的铜回收液， 导热绝缘层和铝板置于乙二醇溶剂中，用盐酸调节pH值为4-6，在100℃，保持2h，树脂完全降解，得到铝板和降解液，铝板洗净可再使用，过滤降解液便可得到导热填料，往剩下的降解液中滴加氢氧化钠溶液调节pH值为7，树脂组合物便会析出，过滤干燥便得到线性树脂。从而实现了导热铝基板中所有组份的回收。
实施例5
联苯环氧树脂，NC-3000H，环氧当量为288g/mol，日本化药株式会社。
硫醇原碳酸酯固化剂
Figure PCTCN2015079974-appb-000006
按照CN 103249712 A的方法制得。
氮化硼，粒径12μm，迈图高新材料陶瓷事业部生产。
氧化铝，粒径5μm，百图高新材料有限公司。
硅微粉，粒径1.5μm，连云港东海硅微粉厂。
分散剂，BYK-903，德国BYK有限公司。
丁酮，兰州石化有限公司
取上述联苯环氧树脂80份、硫醇原碳酸酯固化剂18份，氮化硼32.5份，氧化铝162.5份，硅微粉32.5份，丁酮126.4份，分散剂0.7份，配制成固含量为72％胶液，混合均匀得到分散均匀的导热胶液，用涂覆设备将导热胶液涂覆在铜箔上，155℃下烘烤2min，便可得到涂树脂铜箔，导热绝缘层的厚度为100μm。将涂树脂铜箔与经氧化处理后的铝板按照如图1所示的结构进行叠配并置于压机中，在190℃下固化60min，施加的压力为300～500PSI，即得到导热铝基覆铜板。
将上述制得的导热铝基覆铜板，先蚀刻掉铜箔，得到可回收的铜回收液， 导热绝缘层和铝板置于乙二醇溶剂中，用盐酸调节pH值为4-6，在100℃，保持2h，树脂完全降解，得到铝板和降解液，铝板洗净可再使用，过滤降解液便可得到导热填料，往剩下的降解液中滴加氢氧化钠溶液调节pH值为7，树脂组合物便会析出，过滤干燥便得到线性树脂。从而实现了导热铝基板中所有组份的回收。
实施例6
联苯环氧树脂，NC-3000H，环氧当量为288g/mol，日本化药株式会社。
硫醇原碳酸酯固化剂
Figure PCTCN2015079974-appb-000007
按照CN 103249712 A的方法制得。
氮化硼，粒径12μm，迈图高新材料陶瓷事业部生产。
氧化铝，粒径5μm，百图高新材料有限公司。
硅微粉，粒径1.5μm，连云港东海硅微粉厂。
分散剂，BYK-903，德国BYK有限公司。
丁酮，兰州石化有限公司
取上述联苯环氧树脂40份、硫醇原碳酸酯固化剂9份，氮化硼42.5份，氧化铝168.5份，硅微粉67.6份，丁酮127份，分散剂0.7份，配制成固含量为72％胶液，混合均匀得到分散均匀的导热胶液，用涂覆设备将导热胶液涂覆在铜箔上，155℃下烘烤2min，便可得到涂树脂铜箔，导热绝缘层的厚度为100μm。将涂树脂铜箔与经氧化处理后的铝板按照如图1所示的结构进行叠配并置于压机中，在190℃下固化60min，施加的压力为300～500PSI，即得到导热铝基覆铜板。
将上述制得的导热铝基覆铜板，先蚀刻掉铜箔，得到可回收的铜回收液， 导热绝缘层和铝板置于乙二醇溶剂中，用盐酸调节pH值为4-6，在100℃，保持2h，树脂完全降解，得到铝板和降解液，铝板洗净可再使用，过滤降解液便可得到导热填料，往剩下的降解液中滴加氢氧化钠溶液调节pH值为7，树脂组合物便会析出，过滤干燥便得到线性树脂。从而实现了导热铝基板中所有组份的回收。
实施例7
双酚A型环氧树脂，DER530，环氧当量为430g/mol，DOW CHEMICAL。
氨基缩酮固化剂
Figure PCTCN2015079974-appb-000008
按照CN 103249712 A的方法制得。
氮化硼，粒径12μm，迈图高新材料陶瓷事业部生产。
氧化铝，粒径5μm，百图高新材料有限公司。
硅微粉，粒径1.5μm，连云港东海硅微粉厂。
分散剂，BYK-903，德国BYK有限公司。
丁酮，兰州石化有限公司
取上述双酚A型环氧树脂120份、氨基缩酮固化剂19份，氮化硼38份，氧化铝52份，硅微粉18份，丁酮110.6份，分散剂0.5份，配制成固含量为65％胶液，混合均匀得到分散均匀的导热胶液，用涂覆设备将导热胶液涂覆在铜箔上，155℃下烘烤2min，便可得到涂树脂铜箔，导热绝缘层的厚度为100μm。将涂树脂铜箔与经氧化处理后的铝板按照如图1所示的结构进行叠配并置于压机中，在190℃下固化60min，施加的压力为300～500PSI，即得到导热铝基覆铜板。
将上述制得的导热铝基覆铜板，先蚀刻掉铜箔，得到可回收的铜回收液， 导热绝缘层和铝板置于乙二醇溶剂中，用盐酸调节pH值为4-6，在100℃，保持2h，树脂完全降解，得到铝板和降解液，铝板洗净可再使用，过滤降解液便可得到导热填料，往剩下的降解液中滴加氢氧化钠溶液调节pH值为7，树脂便会析出，过滤干燥便得到线性树脂，从而实现了导热铝基板中所有组份的回收。
比较例1
联苯环氧树脂，NC-3000H，环氧当量为288g/mol，日本化药株式会社。
双氰胺固化剂，DICY，宁夏大荣化学有限公司。
氮化硼，粒径12μm，迈图高新材料陶瓷事业部生产。
氧化铝，粒径5μm，百图高新材料有限公司。
硅微粉，粒径1.5μm，连云港东海硅微粉厂。
分散剂，BYK-903，德国BYK有限公司。
丁酮，兰州石化有限公司
取上述联苯环氧树脂80份、双氰胺固化剂4份，氮化硼21份，氧化铝84份，硅微粉21份，丁酮113.1份，分散剂0.5份，配制成固含量为65％胶液，混合均匀得到分散均匀的导热胶液，用涂覆设备将导热胶液涂覆在铜箔上，155℃下烘烤2min，便可得到涂树脂铜箔，导热绝缘层的厚度为100μm。将涂树脂铜箔与经氧化处理后的铝板按照如图1所示的结构进行叠配并置于压机中，在190℃下固化60min，施加的压力为300～500PSI，即得到导热铝基覆铜板。
将上述制得的导热铝基覆铜板，先蚀刻掉铜箔，得到可回收的铜回收液，导热绝缘层和铝板置于乙二醇溶剂中，用盐酸调节pH值为4-6，在100℃，保持2h，导热绝缘层没有发生明显降解，导热绝缘层和铝板还是牢牢的粘在一起， 无法分离导热绝缘层和铝板。
比较例2
联苯环氧树脂，NC-3000H，环氧当量为288g/mol，日本化药株式会社。
4，4-二氨基二苯砜，河北建新化工有限公司。
氮化硼，粒径12μm，迈图高新材料陶瓷事业部生产。
氧化铝，粒径5μm，百图高新材料有限公司。
硅微粉，粒径1.5μm，连云港东海硅微粉厂。
分散剂，BYK-903，德国BYK有限公司。
丁酮，兰州石化有限公司
取上述联苯环氧树脂80份、4，4-二氨基二苯砜固化剂11份，氮化硼30.3份，氧化铝151.6份，硅微粉30.3份，丁酮118.2份，分散剂0.7份，配制成固含量为72％胶液，混合均匀得到分散均匀的导热胶液，用涂覆设备将导热胶液涂覆在铜箔上，155℃下烘烤2min，便可得到涂树脂铜箔，导热绝缘层的厚度为100μm。将涂树脂铜箔与经氧化处理后的铝板按照如图1所示的结构进行叠配并置于压机中，在190℃下固化60min，施加的压力为300～500PSI，即得到导热铝基覆铜板。
将上述制得的导热铝基覆铜板，先蚀刻掉铜箔，得到可回收的铜回收液，导热绝缘层和铝板置于乙二醇溶剂中，用盐酸调节pH值为4-6，在100℃，保持2h，导热绝缘层没有发生明显降解，导热绝缘层和铝板还是牢牢的粘在一起，无法分离导热绝缘层和铝板。
比较例3
联苯环氧树脂，NC-3000H，环氧当量为288g/mol，日本化药株式会社。
氨基缩酮固化剂
Figure PCTCN2015079974-appb-000009
按照CN 103249712 A的方法制得。
氮化硼，粒径12μm，迈图高新材料陶瓷事业部生产。
氧化铝，粒径5μm，百图高新材料有限公司。
硅微粉，粒径1.5μm，连云港东海硅微粉厂。
分散剂，BYK-903，德国BYK有限公司。
丁酮，兰州石化有限公司
取上述联苯环氧120份、氨基缩酮固化剂28.5份，氮化硼15份，氧化铝40份，硅微粉8.6份，丁酮112份，分散剂0.5份，配制成固含量为65％胶液，混合均匀得到分散均匀的导热胶液，用涂覆设备将导热胶液涂覆在铜箔上，155℃下烘烤2min，便可得到涂树脂铜箔，导热绝缘层的厚度为100μm。将涂树脂铜箔与经氧化处理后的铝板按照如图1所示的结构进行叠配并置于压机中，在190℃下固化60min，施加的压力为300～500PSI，即得到导热铝基覆铜板。
将上述制得的导热铝基覆铜板，先蚀刻掉铜箔，得到可回收的铜回收液，导热绝缘层和铝板置于乙二醇溶剂中，用盐酸调节pH值为4-6，在100℃，保持2h，树脂完全降解，得到铝板和降解液，铝板洗净可再使用，过滤降解液便可得到导热填料，往剩下的降解液中滴加氢氧化钠溶液调节pH值为7，树脂便会析出，过滤干燥便得到线性树脂，从而实现了导热铝基板中所有组份的回收。
比较例4
联苯环氧树脂，NC-3000H，环氧当量为288g/mol，日本化药株式会社。
氨基缩酮固化剂
Figure PCTCN2015079974-appb-000010
按照CN 103249712 A的方法制得。
氮化硼，粒径12μm，迈图高新材料陶瓷事业部生产。
氧化铝，粒径5μm，百图高新材料有限公司。
硅微粉，粒径1.5μm，连云港东海硅微粉厂。
分散剂，BYK-903，德国BYK有限公司。
丁酮，兰州石化有限公司
取上述联苯环氧20份、氨基缩酮固化剂4.8份，氮化硼55份，氧化铝140份，硅微粉28.2份，丁酮83份，分散剂0.5份，配制成固含量为75％胶液，混合均匀得到分散均匀的导热胶液，用涂覆设备将导热胶液涂覆在铜箔上，155℃下烘烤2min，便可得到涂树脂铜箔，导热绝缘层的厚度为100μm。将涂树脂铜箔与经氧化处理后的铝板按照如图1所示的结构进行叠配并置于压机中，在190℃下固化60min，施加的压力为300～500PSI，即得到导热铝基覆铜板。
将上述制得的导热铝基覆铜板，先蚀刻掉铜箔，得到可回收的铜回收液，导热绝缘层和铝板置于乙二醇溶剂中，用盐酸调节pH值为4-6，在100℃，保持2h，树脂完全降解，得到铝板和降解液，铝板洗净可再使用，过滤降解液便可得到导热填料，往剩下的降解液中滴加氢氧化钠溶液调节pH值为7，树脂便会析出，过滤干燥便得到线性树脂，从而实现了导热铝基板中所有组份的回收。
针对上述制作的覆铜板，测试其导热系数(λ)、击穿电压、剥离强度和可降解性等性能。测试结果如下表1和表2。
表1 导热铝基覆铜板的性能测试结果
Figure PCTCN2015079974-appb-000011
表2 导热铝基覆铜板的性能测试结果
Figure PCTCN2015079974-appb-000012
以上性能测试方法如下：
导热系数：测试使用ASTM-D5470方法；
击穿电压：IPC-TM-650 2.5.6；
剥离强度：测试使用IPC-TM-650 2.4.8方法；
可降解性：采用如实施例和比较例所述的方法。
通过实施例和比较例可知，可降解的胺固化剂和硫醇固化剂都是实现导热铝基覆铜板的高效回收，而用常规的胺类固化剂并不能实现各组分的有效、绿 色环保的回收。若要得到综合性能佳的可降解导热铝基覆铜板，其各组分含量必须在合理的范围内。
当然，以上所述之实施例，只是本发明的较佳实例而已，并非用来限制本发明的实施范围，故凡依本发明申请专利范围所述的构造、特征及原理所做的等效变化或修饰，均包括于本发明申请专利范围内。
申请人声明，本发明通过上述实施例来说明本发明的详细方法，但本发明并不局限于上述详细方法，即不意味着本发明必须依赖上述详细方法才能实施。所属技术领域的技术人员应该明了，对本发明的任何改进，对本发明产品各原料的等效替换及辅助成分的添加、具体方式的选择等，均落在本发明的保护范围和公开范围之内。

Claims (10)

  1. 一种可降解的导热铝基覆铜板用热固性树脂组合物，其包括环氧树脂、可降解固化剂、导热填料和助剂；其中，所述可降解固化剂具有如下结构：
    Figure PCTCN2015079974-appb-100001
    m为2、1或0；n为2、3或4；且m和n的和为4；
    每一个R1都独立地选自氢、烷基、环烷基、杂环、杂环烷基、烯基、环烯基、芳香基、杂芳基、烷氧基烷基或炔基；
    每一个A都独立地选自烷基、烷烃基、烯烃基-异-烯烃基、烯烃基-杂环-烯烃基、烯烃基、烯烃基-氧-烯烃基、1，4烷基取代的哌嗪、羰基、硫羰基、芳基或杂环芳基；
    每一个R2都独立地选自-NHR3、-SH或杂环烷基，其中每个R3都独立地是氢、烷基、氨基烷基、烷基-氨基-烷基、环烷基、杂环、烯基、芳基或杂环芳基；
    或者，每两个-O-A-R2基及其连接的碳原子可以独立地形成一个不少于4元的二氧六环的环，且除了与-O-A-R2基团连接的碳原子之外的一个或者多个环碳原子可以分别被一个或者多个独立的氨基或者氨基烷基取代，其中每一个氨基都独立地是一级或二级胺。
  2. 如权利要求1所述的热固性树脂组合物，其特征在于，所述环氧树脂的环氧基摩尔数与可降解固化剂中的活泼氢的摩尔数的比值为0.8～1.2。
  3. 如权利要求1或2所述的热固性树脂组合物，其特征在于，所述环氧树脂为双酚A型环氧树脂、双酚F型环氧树脂、双酚S型环氧树脂、联苯型环氧树脂、异氰酸酯改性环氧树脂、邻甲酚类环氧树脂、萘类环氧树脂、脂环族类环氧树脂、间苯二酚型环氧树脂、聚乙二醇型环氧树脂、三官能团环氧树脂、 四官能团环氧树脂、双环戊二烯类环氧树脂或酚醛型环氧树脂中的任意一种或者至少两种的混合物。
  4. 如权利要求1-3之一所述的热固性树脂组合物，其特征在于，所述导热填料包括金属、金属氧化物、氮化硼、氮化铝、碳化硅或陶瓷填料中的任意一种或者至少两种的混合物，所述金属为铝、镁或锌中的任意一种或者至少两种的混合物。
  5. 如权利要求1-4之一所述的热固性树脂组合物，其特征在于，所述导热填料的重量百分比为树脂组合物的50-85％；
    优选地，所述助剂为偶联剂、消泡剂、流平剂、分散剂、抗氧剂或增稠剂中的任意一种或者至少两种的混合物。
  6. 一种可降解的导热铝基覆铜板，其自下而上依次包括铝板、如权利要求1-5之一所述的热固性树脂组合物形成的导热绝缘层以及铜箔。
  7. 如权利要求6所述的覆铜板，其特征在于，所述铜箔为电解铜箔或压延铜箔，其厚度为12～150μm。
  8. 如权利要求6或7所述的覆铜板，其特征在于，所述铝板经过表面处理，表面处理方法为物理法和化学法，铝板厚度为0.05～3.0mm。
  9. 一种如权利要求6-8之一所述的可降解的导热铝基覆铜板的制备方法，所述方法包括以下步骤：
    (1)将配方量的环氧树脂、可降解固化剂、导热填料和助剂混合均匀，得到分散液；
    (2)将上述分散液用涂覆设备涂覆在铜箔上，并进行烘烤，得到涂树脂铜箔；
    (3)将上述涂树脂铜箔和铝板进行叠合，进行层压，得到可降解的导热铝 基覆铜板。
  10. 一种如权利要求6-8之一所述的可降解的导热铝基覆铜板的回收方法，所述方法包括以下步骤：
    (1)将导热铝基覆铜板进行蚀刻，得到铜离子回收液，然后将导热绝缘层和铝板置于偏酸性的有机溶剂中，加热1～4小时，热固性树脂组合物分解，得到铝板和降解液；
    (2)铝板洗净可重复再利用，对降解液进行过滤，便得到导热填料，导热填料洗净后可再利用，在剩余的降解液中，加入碱进行中和，树脂便会析出，过滤分离得到降解后的树脂，该树脂可重复使用。
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CN111154330A (zh) * 2020-02-28 2020-05-15 苏州世华新材料科技股份有限公司 一种导热绝缘油墨、制备方法及其在铜箔胶带上的应用
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CN115104940A (zh) * 2022-07-25 2022-09-27 陕西天柔华创电子科技有限公司 一种加热马桶座垫及其制备工艺
CN115537131A (zh) * 2022-10-12 2022-12-30 广东焯烨新材料科技有限公司 一种导热胶膜的制备方法

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CN109551247A (zh) * 2018-12-06 2019-04-02 西安华运天成通讯科技有限公司 一种用于移动通讯电路板的铜基树脂半固化片生产设备
CN109551247B (zh) * 2018-12-06 2024-05-14 广东诚越新材料科技有限公司 一种用于移动通讯电路板的铜基树脂半固化片生产设备
CN113087964A (zh) * 2019-12-23 2021-07-09 财团法人工业技术研究院 热固型树脂的降解方法、所使用的催化剂组合物及所得的树脂组合物
CN113087964B (zh) * 2019-12-23 2023-08-08 财团法人工业技术研究院 热固型树脂的降解方法、所使用的催化剂组合物及所得的树脂组合物
CN111154330A (zh) * 2020-02-28 2020-05-15 苏州世华新材料科技股份有限公司 一种导热绝缘油墨、制备方法及其在铜箔胶带上的应用
CN112111074A (zh) * 2020-09-28 2020-12-22 常州中英科技股份有限公司 一种可交联碳氢树脂组合物的均匀分散液及其制备的半固化片和高导热热固型覆铜板
CN112111074B (zh) * 2020-09-28 2023-08-18 常州中英科技股份有限公司 一种可交联碳氢树脂组合物的均匀分散液及其制备的半固化片和高导热热固型覆铜板
CN112297541A (zh) * 2020-10-29 2021-02-02 河南省科学院应用物理研究所有限公司 一种铝基覆铜板及其制备方法
CN114621543A (zh) * 2020-12-08 2022-06-14 河南爱彼爱和新材料有限公司 高频半固化片、高频覆铜板及其制备方法
CN114621543B (zh) * 2020-12-08 2024-03-29 河南爱彼爱和新材料有限公司 高频半固化片、高频覆铜板及其制备方法
CN113178545A (zh) * 2021-04-23 2021-07-27 中南大学 一种金属锂/纳米h-BN粉膜层的构造及其制备方法和应用
CN114103305B (zh) * 2021-11-04 2023-07-21 江苏耀鸿电子有限公司 一种高Tg高导热的金属基覆铜板及其加工工艺
CN114103305A (zh) * 2021-11-04 2022-03-01 江苏耀鸿电子有限公司 一种高Tg高导热的金属基覆铜板及其加工工艺
CN114393891A (zh) * 2022-03-10 2022-04-26 康熹智能科技（东莞）有限公司 一种高导热覆铜板及其制备方法
CN114393891B (zh) * 2022-03-10 2023-10-20 江苏高驰新材料科技有限公司 一种高导热覆铜板及其制备方法
CN114928935A (zh) * 2022-04-28 2022-08-19 江苏诺德新材料股份有限公司 一种高导热型超厚铜基覆铜板及其制作方法
CN114928935B (zh) * 2022-04-28 2024-01-26 江苏诺德新材料股份有限公司 一种高导热型超厚铜基覆铜板及其制作方法
CN115104940A (zh) * 2022-07-25 2022-09-27 陕西天柔华创电子科技有限公司 一种加热马桶座垫及其制备工艺
CN115104940B (zh) * 2022-07-25 2023-09-01 陕西天柔华创电子科技有限公司 一种加热马桶座垫及其制备工艺
CN115537131A (zh) * 2022-10-12 2022-12-30 广东焯烨新材料科技有限公司 一种导热胶膜的制备方法

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