WO2016086535A1 - Oled封装结构及其封装方法 - Google Patents

Oled封装结构及其封装方法 Download PDF

Info

Publication number
WO2016086535A1
WO2016086535A1 PCT/CN2015/072480 CN2015072480W WO2016086535A1 WO 2016086535 A1 WO2016086535 A1 WO 2016086535A1 CN 2015072480 W CN2015072480 W CN 2015072480W WO 2016086535 A1 WO2016086535 A1 WO 2016086535A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
disposed
oled
desiccant
sealant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/072480
Other languages
English (en)
French (fr)
Inventor
曾维静
吴泰必
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US14/424,922 priority Critical patent/US20160343976A1/en
Publication of WO2016086535A1 publication Critical patent/WO2016086535A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing

Definitions

  • the present invention relates to the field of display technologies, and in particular, to an OLED package structure and a packaging method thereof.
  • OLED is an Organic Light-Emitting Diode, which has the characteristics of self-illumination, high brightness, wide viewing angle, high contrast, flexibility, low energy consumption, etc., and has received extensive attention as a new generation display mode. It has gradually replaced traditional LCD monitors and is widely used in mobile phone screens, computer monitors, and full-color TVs. OLED display technology is different from traditional liquid crystal display technology. It does not require a backlight. It uses a very thin coating of organic materials and a glass substrate. When there is current, these organic materials will emit light. However, since organic materials are easily reacted with water vapor or oxygen, as an organic material-based display device, the OLED display has a very high requirement for packaging.
  • OLED luminescent layer Most organic materials in the OLED luminescent layer are very sensitive to atmospheric pollutants, oxygen and water vapor. Electrochemical corrosion is prone to occur in environments containing moisture, which seriously affects the service life of OLED devices. Therefore, it is essential for the stable illumination of OLED devices to improve the internal sealing of the device by the packaging of the OLED device and to isolate it from the external environment as much as possible.
  • the commonly used packaging methods are as follows: 1) encapsulating the frame glue and bonding the desiccant, that is, etching a groove of a certain depth at a specific position of the package cover, and attaching the (dry sheet) water-absorbing sheet to the groove, and Spray a circle of UV-curable adhesive outside the effective display area.
  • This kind of packaging method is mature in technology, clear in material, but complicated in process, and can only be used as a bottom light-emitting device, and the package efficiency is low.
  • the glass glue laser package forms a frit glass on the package cover plate, and uses the laser beam to move the glass glue in the sealing area to melt, and the molten glass glue is cooled and formed between the package cover plate and the substrate to be packaged. Closed package space.
  • the packaging method has good sealing performance, but due to the influence of the laser energy distribution, there are certain restrictions on the rubber width and the rubber height.
  • the glass glue is heated to generate stress.
  • the residual stress inside the package structure may cause cracking of the package structure. Or peeling, resulting in failure of the seal of the package structure.
  • the glass is packaged to have good sealing performance and mechanical strength. By setting the desiccant only outside the effective light-emitting area, it can be applied to both the top emission and bottom emission type OLED device packages.
  • Another object of the present invention is to provide an OLED packaging method, in which a packaged glass is used for packaging, and a bonding material of the package cover and the substrate is added in combination with a sealant package to reduce the use of frit glass.
  • the glass glue is cracked or peeled off due to internal residual stress during packaging, and the mechanical strength is further improved while improving the sealing property.
  • the present invention provides an OLED package structure, including a package cover, a substrate disposed opposite the package cover, and an OLED device disposed between the package cover and the substrate and disposed on the substrate.
  • a desiccant disposed between the package cover and the substrate and disposed on a periphery of the OLED device, a sealant disposed on the periphery of the desiccant to bond the package cover and the substrate, and a sealant disposed on the sealant
  • the frit glass of the package cover and the substrate is bonded to the periphery.
  • the OLED device includes an anode conductive layer disposed on the substrate, an organic layer disposed on the anode conductive layer, and a cathode conductive layer disposed on the organic layer.
  • a recess is disposed on the package cover corresponding to the OLED device, and an inner space of the recess is adapted to a size of the OLED device.
  • the desiccant is a polymer material containing a hygroscopic component, and a distance between the desiccant and the frit glass is greater than or equal to 500 um.
  • the sealant is a UV sealant, and a spacing between the sealant and the desiccant is less than or equal to 500 um.
  • the invention also provides an OLED packaging method, comprising the following steps:
  • Step 1 providing a package cover and a substrate
  • An OLED device is disposed on the substrate, and a recess is disposed on the package cover corresponding to the OLED device, and an inner space of the recess is adapted to a size of the OLED device;
  • Step 2 coating a ring of glass glue on the package cover plate, and forming a frit glass by high temperature pre-sintering;
  • Step 3 applying a ring of desiccant on the inside of the frit glass and the outside of the groove on the package cover, and curing the desiccant by low temperature baking;
  • Step 4 applying a ring of sealant on the inside of the frit glass and outside the desiccant on the package cover;
  • Step 5 the package cover plate and the substrate are relatively adhered under vacuum conditions, and the frame sealant is cured by UV light irradiation;
  • Step 6 Melting the frit glass by laser irradiation, and bonding with the package cover and the substrate, thereby completing encapsulation of the package cover to the substrate.
  • the package cover and the substrate in the step 1 are both glass substrates, and the OLED device includes an anode conductive layer disposed on the substrate, an organic layer disposed on the anode conductive layer, and an organic layer disposed on the organic layer.
  • the glass glue is coated on the package cover by screen printing or dispensing.
  • the desiccant in the step 3 is a polymer material containing a hygroscopic component, and the distance between the desiccant and the frit glass is greater than or equal to 500 ⁇ m.
  • the sealant in the step 4 is a UV sealant, and the distance between the sealant and the desiccant is less than or equal to 500 um.
  • the present invention also provides an OLED package structure, including a package cover plate, a substrate disposed opposite the package cover plate, and an OLED device disposed between the package cover plate and the substrate and disposed on the substrate.
  • a desiccant disposed between the cover plate and the substrate and disposed on a periphery of the OLED device, a sealant disposed on the periphery of the desiccant to bond the package cover and the substrate, and a bonding place disposed on the periphery of the sealant a frit glass for encapsulating the cover plate and the substrate;
  • the OLED device includes an anode conductive layer disposed on the substrate, an organic layer disposed on the anode conductive layer, and a cathode conductive layer disposed on the organic layer;
  • a position of the package cover corresponding to the OLED device is provided with a groove, and an inner space of the groove is adapted to the size of the OLED device.
  • the invention has the beneficial effects that the OLED package structure of the invention is packaged by using the frame glue and the frit glass at the same time, and the mechanical strength is improved while having good sealing performance, and the desiccant is disposed on the outer side of the OLED device, Suitable for package of top emitting and bottom emitting OLED devices.
  • the OLED packaging method of the present invention is packaged by using frit glass to improve the sealing property, and combined with the advantages of the sealant package, the setting of the sealant can increase the bonding area of the package cover and the substrate, and reduce the use of the frit glass package.
  • the packaging method can be applied to both the top emission and bottom emission type OLED devices.
  • FIG. 1 is a schematic view of an OLED package structure of the present invention
  • FIG. 2 is a schematic view of an OLED device of an OLED package structure of the present invention.
  • FIG. 3 is a schematic flow chart of an OLED packaging method according to the present invention.
  • step 1 of the OLED packaging method of the present invention is a schematic diagram of step 1 of the OLED packaging method of the present invention.
  • step 2 of the OLED packaging method of the present invention is a schematic diagram of step 2 of the OLED packaging method of the present invention.
  • FIG. 6 is a schematic diagram of step 3 of the OLED packaging method of the present invention.
  • step 4 of the OLED packaging method of the present invention is a schematic diagram of step 4 of the OLED packaging method of the present invention.
  • step 5 of the OLED packaging method of the present invention is a schematic diagram of step 5 of the OLED packaging method of the present invention.
  • FIG. 9 is a schematic diagram of step 6 of the OLED packaging method of the present invention.
  • the present invention provides an OLED package structure, including a package cover plate 1 , a substrate 2 disposed opposite to the package cover plate 1 , and between the package cover plate 1 and the substrate 2 .
  • An OLED device 21 disposed on the substrate 2, a desiccant 12 disposed between the package cover 1 and the substrate 2 and disposed at a periphery of the OLED device 21, and being disposed on the periphery of the desiccant 12
  • the sealant 13 of the package cover 1 and the substrate 2, and the frit glass 11 of the package cover 1 and the substrate 2 are bonded to the periphery of the sealant 13.
  • the OLED device 21 includes an anode conductive layer 211 disposed on the substrate 2, an organic layer 212 disposed on the anode conductive layer 211, and an organic layer 212 disposed on the organic layer 212.
  • a recess 14 is disposed on the package cover 1 corresponding to the OLED device 21.
  • the internal space of the recess 14 is adapted to the size of the OLED device 21 to accommodate the OLED device. twenty one.
  • the desiccant 12 is a polymer material containing a moisture absorbing component.
  • the distance between the desiccant 12 and the frit glass 11 is greater than or equal to 500 um.
  • the sealant 13 is a UV sealant.
  • the spacing between the sealant 13 and the desiccant 12 is less than or equal to 500 um.
  • the sealant 13 is used to increase the bonding area between the package cover and the substrate, and to reduce cracking or peeling of the glass glue due to internal residual stress when the package is sintered using the frit glass, thereby further improving the mechanical strength of the OLED package structure.
  • the present invention provides an OLED packaging method, including the following steps:
  • Step 1 As shown in FIG. 4, a package cover 1 and a substrate 2 are provided.
  • An OLED device 21 is disposed on the substrate 2, and a recess 14 is disposed on the package cover 1 corresponding to the OLED device 21.
  • the internal space of the recess 14 is adapted to the size of the OLED device 21.
  • the package cover 1 and the substrate 2 are both glass substrates.
  • the OLED device 21 includes an anode conductive layer 211 disposed on the substrate 2, an organic layer 212 disposed on the anode conductive layer 211, and an organic layer 212 disposed on the organic layer 212.
  • Step 2 As shown in FIG. 5, a ring of glass glue is coated on the package cover 1 and the frit glass 11 is formed by high temperature pre-sintering.
  • the glass glue is applied to the package cover 1 by screen printing or dispensing.
  • Step 3 as shown in FIG. 6, a strip of desiccant 12 is coated on the inside of the frit glass 11 on the inside of the frit glass 11 and outside the recess 14 and the desiccant is made by low temperature baking. 12 curing.
  • the desiccant 12 is a polymer material containing a hygroscopic component.
  • the distance between the desiccant 12 and the frit glass 11 is greater than or equal to 500 um.
  • Step 4 as shown in FIG. 7, on the package cover plate 1 is coated on the inside of the frit glass 11 and outside the desiccant 12, and a ring of sealant 13 is applied.
  • the sealant 13 is a UV sealant.
  • the spacing between the sealant 13 and the dry desiccant 12 is less than or equal to 500 um.
  • Step 5 as shown in FIG. 8, the package cover 1 and the substrate 2 are relatively bonded under vacuum conditions, and the sealant 13 is cured by UV light irradiation.
  • Step 6 As shown in FIG. 9, the region sealed by the frit glass 11 is irradiated with a laser to melt the frit glass 11 and adhere to the package cover 1 and the substrate 2 to complete the package. The cover of the cover plate 1 to the substrate 2.
  • a frit glass package is used to enhance the sealing performance, and a sealant is coated on the inner side of the frit glass to increase the bonding area between the package cover and the substrate, and to reduce the use of frit glass.
  • the glass glue is cracked or peeled off due to internal residual stress during packaging, which further improves the mechanical strength of the package, and provides a desiccant on the outside of the OLED device, effectively blocking the infiltration of water and oxygen, and is suitable for both top emission and The package of the bottom emission type OLED device.
  • the OLED package structure of the present invention is simultaneously packaged with frit glass and frit glass, and has good sealing performance while improving mechanical strength, and the desiccant is disposed outside the OLED device, and can be simultaneously applied.
  • the OLED packaging method of the present invention is packaged by using frit glass to improve sealing performance.
  • the setting of the sealant can increase the area of the cover plate and the substrate, and reduce the cracking or peeling of the glass glue caused by the internal residual stress when using the frit glass package, further increasing the package.
  • Mechanical strength, and the desiccant is disposed outside the OLED device, so that the packaging method can be applied to both the package of the top emission and bottom emission type OLED devices.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本发明提供一种OLED封装结构及其封装方法，其结构包括封装盖板(1)、与所述封装盖板(1)相对设置的基板(2)、位于所述封装盖板(1)与基板(2)之间且设于所述基板(2)上的OLED器件(21)、位于所述封装盖板(1)与基板(2)之间且设于所述OLED器件(21)外围的干燥剂(12)、设于所述干燥剂(12)外围粘结所述封装盖板(1)与基板(2)的框胶(13)、及设于所述框胶(13)外围粘结所述封装盖板(1)与基板(2)的熔结玻璃(11)；该结构采用框胶与熔结玻璃共同进行封装，在具有良好的密封性能的同时增强了机械强度，并将干燥剂设置在OLED器件的外侧，可同时适用于顶发射与底发射型OLED器件的封装。

Description

OLED封装结构及其封装方法 技术领域
本发明涉及显示技术领域，尤其涉及一种OLED封装结构及其封装方法。
背景技术
OLED即有机发光二极管(Organic Light-Emitting Diode)，具备自发光、高亮度、宽视角、高对比度、可挠曲、低能耗等特性，因此受到广泛的关注，并作为新一代的显示方式，已开始逐渐取代传统液晶显示器，被广泛应用在手机屏幕、电脑显示器、全彩电视等。OLED显示技术与传统的液晶显示技术不同，无需背光灯，采用非常薄的有机材料涂层和玻璃基板，当有电流通过时，这些有机材料就会发光。但是由于有机材料易与水汽或氧气反应，作为基于有机材料的显示设备，OLED显示屏对封装的要求非常高。
OLED发光层的多数有机物质对于大气中的污染物、氧气以及水汽都十分敏感。在含有水汽的环境中容易发生电化学腐蚀，严重影响OLED器件的使用寿命。因此，通过OLED器件的封装提高器件内部的密封性，尽可能的与外部环境隔离，对于OLED器件的稳定发光至关重要。
目前，常用的封装方法有：1)封装框胶结合干燥剂，即在封装盖板的特定位置蚀刻一定深度的凹槽，将(干燥片)吸水片贴覆于所述凹槽中，并在有效显示区之外喷涂一圈UV固化胶。这种封装方式工艺成熟，材料明确，但工艺复杂，只能做底发光器件，且封装效能较低。2)玻璃胶镭射封装，即在封装盖板上形成熔结玻璃，并利用激光束移动使位于密封区域的玻璃胶熔融，熔化后的玻璃胶冷却后与封装盖板和待封装的基板间形成密闭的封装空间。该封装方法密封性好，但由于受到激光能量分布的影响，对胶宽及胶高有一定的限制。此外，在激光镭射熔融的过程中，由于玻璃胶受热会产生应力，当玻璃胶熔融冷却形成与封装盖板和待封装基板固定的封装结构后，封装结构内部残存的应力会使封装结构发生开裂或剥离，从而导致封装结构的密封失效。
发明内容
本发明的目的在于提供一种OLED封装结构，同时使用将框胶与熔结 玻璃进行封装，从而具有良好的密封性能与机械强度，通过将干燥剂仅设置在有效发光区的外侧，可同时适用于顶发射与底发射型OLED器件的封装。
本发明的另一目的在于提供一种OLED封装方法，在采用熔结玻璃进行封装的同时，结合框胶封装的方式，增加封装盖板与基板粘合的面积，以减少在使用熔结玻璃进行封装时由于内部残存应力而导致的玻璃胶开裂或剥离，在提高密封性的同时，进一步提高了机械强度。
为实现上述目的，本发明提供一种OLED封装结构，包括封装盖板、与所述封装盖板相对设置的基板、位于所述封装盖板与基板之间且设于所述基板上的OLED器件、位于所述封装盖板与基板之间且设于所述OLED器件外围的干燥剂、设于所述干燥剂外围粘结所述封装盖板与基板的框胶、及设于所述框胶外围粘结所述封装盖板与基板的熔结玻璃。
所述OLED器件包括设于所述基板上的阳极导电层、设于所述阳极导电层上的有机层、及设于所述有机层上的阴极导电层。
所述封装盖板上对应所述OLED器件的位置设有一凹槽，所述凹槽的内部空间与所述OLED器件的大小相适应。
所述干燥剂为含吸湿成分的高分子材料，所述干燥剂与所述熔结玻璃的间距大于或等于500um。
所述框胶为UV框胶，所述框胶与所述干燥剂的间距小于或等于500um。
本发明还提供一种OLED封装方法，包括如下步骤：
步骤1、提供封装盖板与基板；
所述基板上设有OLED器件，所述封装盖板上对应所述OLED器件的位置设有一凹槽，所述凹槽的内部空间与所述OLED器件的大小相适应；
步骤2、在所述封装盖板上涂布一圈玻璃胶材，并通过高温预烧结形成熔结玻璃；
步骤3、在所述封装盖板上于所述熔结玻璃内侧、所述凹槽外侧涂布一圈干燥剂，并通过低温烘烤使所述干燥剂固化；
步骤4、在所述封装盖板上于所述熔结玻璃内侧、所述干燥剂外侧涂布一圈框胶；
步骤5、将所述封装盖板与基板在真空条件下相对贴合，并通过UV光照射使所述框胶固化；
步骤6、通过激光照射使所述熔结玻璃熔化，并与所述封装盖板及基板相粘结，从而完成封装盖板对基板的封装。
所述步骤1中的封装盖板与基板均为玻璃基板，所述OLED器件包括设于所述基板上的阳极导电层、设于所述阳极导电层上的有机层、及设于所述有机层上的阴极导电层。
所述步骤2中采用丝网印刷或点胶的方式将所述玻璃胶材涂布在封装盖板上。
所述步骤3中的干燥剂为含吸湿成分的高分子材料，所述干燥剂与所述熔结玻璃的间距大于或等于500um。
所述步骤4中的框胶为UV框胶，所述框胶与所述干燥剂的间距小于或等于500um。
本发明还提供一种OLED封装结构，包括封装盖板、与所述封装盖板相对设置的基板、位于所述封装盖板与基板之间且设于所述基板上的OLED器件、位于所述封装盖板与基板之间且设于所述OLED器件外围的干燥剂、设于所述干燥剂外围粘结所述封装盖板与基板的框胶、及设于所述框胶外围粘结所述封装盖板与基板的熔结玻璃；
其中，所述OLED器件包括设于所述基板上的阳极导电层、设于所述阳极导电层上的有机层、及设于所述有机层上的阴极导电层；
其中，所述封装盖板上对应所述OLED器件的位置设有一凹槽，所述凹槽的内部空间与所述OLED器件的大小相适应。
本发明的有益效果：本发明的OLED封装结构，同时使用框胶与熔结玻璃进行封装，在具有良好的密封性能的同时提高了机械强度，并将干燥剂设置在OLED器件的外侧，可同时适用于顶发射与底发射型OLED器件的封装。本发明的OLED封装方法，在采用熔结玻璃进行封装以提高密封性的同时，结合框胶封装的优点，框胶的设置可以增加封装盖板与基板粘合的面积，减少使用熔结玻璃封装时由于内部残存应力而导致的玻璃胶开裂或剥离，进一步提高了封装的机械强度，并且将干燥剂设置在OLED器件的外侧，使该封装方法可同时适用于顶发射与底发射型OLED器件的封装。
附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为本发明OLED封装结构的示意图；
图2为本发明OLED封装结构的OLED器件的示意图；
图3为本发明OLED封装方法的示意流程图；
图4为本发明OLED封装方法的步骤1的示意图；
图5为本发明OLED封装方法的步骤2的示意图；
图6为本发明OLED封装方法的步骤3的示意图；
图7为本发明OLED封装方法的步骤4的示意图；
图8为本发明OLED封装方法的步骤5的示意图；
图9为本发明OLED封装方法的步骤6的示意图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请同时参阅图1与图2，本发明提供一种OLED封装结构，包括封装盖板1、与所述封装盖板1相对设置的基板2、位于所述封装盖板1与基板2之间且设于所述基板2上的OLED器件21、位于所述封装盖板1与基板2之间且设于所述OLED器件21外围的干燥剂12、设于所述干燥剂12外围粘结所述封装盖板1与基板2的框胶13、及设于所述框胶13外围粘结所述封装盖板1与基板2的熔结玻璃11。
进一步的，如图2所示，所述OLED器件21包括设于所述基板2上的阳极导电层211、设于所述阳极导电层211上的有机层212、及设于所述有机层212上的阴极导电层213。
如图1所示，所述封装盖板1上对应所述OLED器件21的位置设有一凹槽14，所述凹槽14的内部空间与所述OLED器件21的大小相适应，以容纳OLED器件21。
通过使用熔结玻璃11进行封装，有效提高了OLED封装结构的密封性。
所述干燥剂12为含吸湿成分的高分子材料，优选的，所述干燥剂12与所述熔结玻璃11的间距大于或等于500um。通过将所述干燥剂12设于OLED器件21的外围，可以使本发明的OLED封装结构同时适用于顶发射与底发射型OLED器件的封装。
所述框胶13为UV框胶，优选的，所述框胶13与所述干燥剂12的间距小于或等于500um。所述框胶13用于增加封装盖板与基板粘合的面积，减少使用熔结玻璃进行封装时由于内部残存应力而导致的玻璃胶开裂或剥离，进一步提高了OLED封装结构的机械强度。
请参阅图3，本发明提供一种OLED封装方法，包括如下步骤：
步骤1、如图4所示，提供封装盖板1与基板2。
所述基板2上设有OLED器件21，所述封装盖板1上对应所述OLED器件21的位置设有一凹槽14，所述凹槽14的内部空间与所述OLED器件21的大小相适应。优选的，所述封装盖板1与基板2均为玻璃基板。
进一步的，请参阅图2，所述OLED器件21包括设于所述基板2上的阳极导电层211、设于所述阳极导电层211上的有机层212、及设于所述有机层212上的阴极导电层213。
步骤2、如图5所示，在所述封装盖板1上涂布一圈玻璃胶材，并通过高温预烧结形成熔结玻璃11。
具体地，采用丝网印刷或点胶的方式将所述玻璃胶材涂布在封装盖板1上。
步骤3、如图6所示，在所述封装盖板1上于所述熔结玻璃11内侧、所述凹槽14外侧涂布一圈干燥剂12，并通过低温烘烤使所述干燥剂12固化。
所述干燥剂12为含吸湿成分的高分子材料。优选的，所述干燥剂12与所述熔结玻璃11的间距大于或等于500um。
步骤4、如图7所示，在所述封装盖板1上于所述熔结玻璃11内侧、所述干燥剂12外侧，涂布一圈框胶13。
所述框胶13为UV框胶。优选的，所述框胶13与所述干所述燥剂12的间距小于或等于500um。
步骤5、如图8所示，将所述封装盖板1与基板2在真空条件下相对贴合，并通过UV光照射使所述框胶13固化。
步骤6、如图9所示，通过激光对使用熔结玻璃11密封的区域进行照射，使所述熔结玻璃11熔化，并与所述封装盖板1及基板2相粘结，从而完成封装盖板1对基板2的封装。
在上述OLED的封装方法中，使用熔结玻璃封装，以增强密封性能的同时，在熔结玻璃的内侧涂布框胶，用以增加封装盖板与基板粘合的面积，减少使用熔结玻璃封装时由于内部残存应力而导致的玻璃胶开裂或剥离，进一步提高了封装的机械强度，并在OLED器件的外侧设置干燥剂，有效阻挡了水及氧气的渗入，并可同时适用于顶发射与底发射型OLED器件的封装。
综上所述，本发明的OLED封装结构，同时使用框胶与熔结玻璃进行封装，在具有良好的密封性能的同时提高了机械强度，并将干燥剂设置在OLED器件的外侧，可同时适用于顶发射与底发射型OLED器件的封装。本发明的OLED封装方法，在采用熔结玻璃进行封装以提高密封性的同 时，结合框胶封装的优点，框胶的设置可以增加封装盖板与基板粘合的面积，减少使用熔结玻璃封装时由于内部残存应力而导致的玻璃胶开裂或剥离，进一步增加了封装的机械强度，并且将干燥剂设置在OLED器件的外侧，使该封装方法可同时适用于顶发射与底发射型OLED器件的封装。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (13)

  1. 一种OLED封装结构，包括封装盖板、与所述封装盖板相对设置的基板、位于所述封装盖板与基板之间且设于所述基板上的OLED器件、位于所述封装盖板与基板之间且设于所述OLED器件外围的干燥剂、设于所述干燥剂外围粘结所述封装盖板与基板的框胶、及设于所述框胶外围粘结所述封装盖板与基板的熔结玻璃。
  2. 如权利要求1所述的OLED封装结构，其中，所述OLED器件包括设于所述基板上的阳极导电层、设于所述阳极导电层上的有机层、及设于所述有机层上的阴极导电层。
  3. 如权利要求1所述的OLED封装结构，其中，所述封装盖板上对应所述OLED器件的位置设有一凹槽，所述凹槽的内部空间与所述OLED器件的大小相适应。
  4. 如权利要求1所述的OLED封装结构，其中，所述干燥剂为含吸湿成分的高分子材料，所述干燥剂与所述熔结玻璃的间距大于或等于500um。
  5. 如权利要求1所述的OLED封装结构，其中，所述框胶为UV框胶，所述框胶与所述干燥剂的间距小于或等于500um。
  6. 一种OLED封装方法，包括如下步骤：
    步骤1、提供封装盖板与基板；
    所述基板上设有OLED器件，所述封装盖板上对应所述OLED器件的位置设有一凹槽，所述凹槽的内部空间与所述OLED器件的大小相适应；
    步骤2、在所述封装盖板上涂布一圈玻璃胶材，并通过高温预烧结形成熔结玻璃；
    步骤3、在所述封装盖板上于所述熔结玻璃内侧、所述凹槽外侧涂布一圈干燥剂，并通过低温烘烤使所述干燥剂固化；
    步骤4、在所述封装盖板上于所述熔结玻璃内侧、所述干燥剂外侧涂布一圈框胶；
    步骤5、将所述封装盖板与基板在真空条件下相对贴合，并通过UV光照射使所述框胶固化；
    步骤6、通过激光照射使所述熔结玻璃熔化，并与所述封装盖板及基板相粘结，从而完成封装盖板对基板的封装。
  7. 如权利要求6所述的OLED封装方法，其中，所述步骤1中的封装盖板与基板均为玻璃基板，所述OLED器件包括设于所述基板上的阳极导 电层、设于所述阳极导电层上的有机层、及设于所述有机层上的阴极导电层。
  8. 如权利要求6所述的OLED封装方法，其中，所述步骤2中采用丝网印刷或点胶的方式将所述玻璃胶材涂布在封装盖板上。
  9. 如权利要求6所述的OLED封装方法，其中，所述步骤3中的干燥剂为含吸湿成分的高分子材料，所述干燥剂与所述熔结玻璃的间距大于或等于500um。
  10. 如权利要求6所述的OLED封装方法，其中，所述步骤4中的框胶为UV框胶，所述框胶与所述干燥剂的间距小于或等于500um。
  11. 一种OLED封装结构，包括封装盖板、与所述封装盖板相对设置的基板、位于所述封装盖板与基板之间且设于所述基板上的OLED器件、位于所述封装盖板与基板之间且设于所述OLED器件外围的干燥剂、设于所述干燥剂外围粘结所述封装盖板与基板的框胶、及设于所述框胶外围粘结所述封装盖板与基板的熔结玻璃；
    其中，所述OLED器件包括设于所述基板上的阳极导电层、设于所述阳极导电层上的有机层、及设于所述有机层上的阴极导电层；
    其中，所述封装盖板上对应所述OLED器件的位置设有一凹槽，所述凹槽的内部空间与所述OLED器件的大小相适应。
  12. 如权利要求11所述的OLED封装结构，其中，所述干燥剂为含吸湿成分的高分子材料，所述干燥剂与所述熔结玻璃的间距大于或等于500um。
  13. 如权利要求11所述的OLED封装结构，其中，所述框胶为UV框胶，所述框胶与所述干燥剂的间距小于或等于500um。
PCT/CN2015/072480 2014-12-04 2015-02-09 Oled封装结构及其封装方法 Ceased WO2016086535A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/424,922 US20160343976A1 (en) 2014-12-04 2015-02-09 Oled package structure and package method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410734373.1 2014-12-04
CN201410734373.1A CN104505465B (zh) 2014-12-04 2014-12-04 Oled封装结构及其封装方法

Publications (1)

Publication Number Publication Date
WO2016086535A1 true WO2016086535A1 (zh) 2016-06-09

Family

ID=52947201

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/072480 Ceased WO2016086535A1 (zh) 2014-12-04 2015-02-09 Oled封装结构及其封装方法

Country Status (3)

Country Link
US (1) US20160343976A1 (zh)
CN (1) CN104505465B (zh)
WO (1) WO2016086535A1 (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104900603B (zh) * 2015-06-23 2018-09-28 上海天马有机发光显示技术有限公司 显示装置、显示面板及其制作方法
CN105161515B (zh) * 2015-08-11 2018-03-23 京东方科技集团股份有限公司 有机发光二极管显示面板及其封装方法、显示装置
CN106784379A (zh) * 2016-12-29 2017-05-31 长春海谱润斯科技有限公司 一种有机发光显示面板及其制造方法
CN206758439U (zh) 2017-04-14 2017-12-15 京东方科技集团股份有限公司 显示面板和显示装置
CN107170772A (zh) * 2017-05-23 2017-09-15 深圳市华星光电技术有限公司 微发光二极管阵列基板的封装结构
CN107180922A (zh) * 2017-06-20 2017-09-19 合肥市惠科精密模具有限公司 一种高防水性amoled封装结构
CN107359269A (zh) * 2017-06-20 2017-11-17 合肥市惠科精密模具有限公司 一种新型amole结构
CN107359271A (zh) * 2017-06-20 2017-11-17 合肥市惠科精密模具有限公司 一种一体式amoled封装结构
CN107359270A (zh) * 2017-06-20 2017-11-17 合肥市惠科精密模具有限公司 一种amoled器件的封装结构
CN107275375A (zh) * 2017-06-20 2017-10-20 合肥市惠科精密模具有限公司 一种有源矩阵有机发光二极体封装结构
CN107359273A (zh) * 2017-06-20 2017-11-17 合肥市惠科精密模具有限公司 一种高强度amoled封装结构
CN107293648A (zh) * 2017-06-20 2017-10-24 合肥市惠科精密模具有限公司 一种基于熔接玻璃的amoled封装结构
CN107359272A (zh) * 2017-06-20 2017-11-17 合肥市惠科精密模具有限公司 一种双重干燥型amoled封装结构
CN107293649A (zh) * 2017-06-20 2017-10-24 合肥市惠科精密模具有限公司 一种amoled封装结构
CN107565050A (zh) * 2017-08-25 2018-01-09 京东方科技集团股份有限公司 有机发光二极管封装结构、电子装置及封装方法
CN107884971A (zh) * 2017-09-16 2018-04-06 合肥惠科金扬科技有限公司 一种液晶面板制程干燥剂涂布机
CN108539046B (zh) * 2018-05-04 2020-12-11 昆山国显光电有限公司 封装结构、显示屏及显示装置
CN110767819A (zh) * 2018-07-26 2020-02-07 Oppo广东移动通信有限公司 Oled屏幕及其制造方法和电子装置
CN110429206B (zh) * 2019-08-07 2021-11-23 京东方科技集团股份有限公司 封装盖板、显示装置、显示面板及显示面板的封装方法
CN110993819B (zh) * 2019-12-04 2021-07-23 深圳市华星光电半导体显示技术有限公司 显示面板及其制作方法
CN111403441B (zh) * 2020-03-20 2023-05-30 京东方科技集团股份有限公司 一种显示屏封装结构及其封装方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7078726B2 (en) * 2004-09-09 2006-07-18 Osram Opto Semiconductors Gmbh Sealing of electronic device using absorbing layer for glue line
TW201136438A (en) * 2010-04-13 2011-10-16 Au Optronics Corp Electro-luminescent device package and packaging process thereof
CN102231429A (zh) * 2011-06-30 2011-11-02 四川虹视显示技术有限公司 一种oled显示器件及其封装结构和封装方法
CN103325813A (zh) * 2013-05-24 2013-09-25 京东方科技集团股份有限公司 一种oled显示面板及其封装方法、显示装置
CN103579294A (zh) * 2013-11-21 2014-02-12 四川虹视显示技术有限公司 一种oled显示器件的封装结构及封装方法
CN103985826A (zh) * 2014-05-30 2014-08-13 深圳市华星光电技术有限公司 Oled基板的封装方法及oled结构
CN104157798A (zh) * 2014-08-21 2014-11-19 深圳市华星光电技术有限公司 Oled的封装方法及结构

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003228302A (ja) * 2002-02-04 2003-08-15 Toshiba Electronic Engineering Corp 表示装置及びその製造方法
EP1655790B1 (en) * 2004-10-21 2010-08-04 LG Display Co., Ltd. Organic electroluminescent device and method of manufacturing the same
US8830695B2 (en) * 2007-01-25 2014-09-09 Osram Opto Semiconductors Gmbh Encapsulated electronic device
KR100883075B1 (ko) * 2007-03-02 2009-02-10 엘지전자 주식회사 전계발광소자
KR101376319B1 (ko) * 2007-07-27 2014-03-20 주식회사 동진쎄미켐 디스플레이 소자의 실링방법
DE102008032126B4 (de) * 2008-07-08 2017-02-09 Osram Oled Gmbh Organisches, optoelektronisches Bauteil und Verfahren zur Herstellung eines organischen, optoelektronischen Bauteils
US20130069105A1 (en) * 2009-09-25 2013-03-21 Yijian Shi Method for encapsulation of organic electronic devices
KR101754916B1 (ko) * 2010-11-08 2017-07-20 삼성디스플레이 주식회사 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법
KR101820795B1 (ko) * 2011-04-12 2018-01-23 삼성디스플레이 주식회사 유기 발광 표시 장치의 제조방법 및 그 제조방법에 사용되는 봉지시트
WO2014119579A1 (ja) * 2013-02-01 2014-08-07 ナミックス株式会社 ガラスフリット
KR102093795B1 (ko) * 2013-07-19 2020-03-27 삼성디스플레이 주식회사 유기 발광 표시 장치

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7078726B2 (en) * 2004-09-09 2006-07-18 Osram Opto Semiconductors Gmbh Sealing of electronic device using absorbing layer for glue line
TW201136438A (en) * 2010-04-13 2011-10-16 Au Optronics Corp Electro-luminescent device package and packaging process thereof
CN102231429A (zh) * 2011-06-30 2011-11-02 四川虹视显示技术有限公司 一种oled显示器件及其封装结构和封装方法
CN103325813A (zh) * 2013-05-24 2013-09-25 京东方科技集团股份有限公司 一种oled显示面板及其封装方法、显示装置
CN103579294A (zh) * 2013-11-21 2014-02-12 四川虹视显示技术有限公司 一种oled显示器件的封装结构及封装方法
CN103985826A (zh) * 2014-05-30 2014-08-13 深圳市华星光电技术有限公司 Oled基板的封装方法及oled结构
CN104157798A (zh) * 2014-08-21 2014-11-19 深圳市华星光电技术有限公司 Oled的封装方法及结构

Also Published As

Publication number Publication date
US20160343976A1 (en) 2016-11-24
CN104505465B (zh) 2016-06-29
CN104505465A (zh) 2015-04-08

Similar Documents

Publication Publication Date Title
CN104505465B (zh) Oled封装结构及其封装方法
CN104505466B (zh) Oled封装结构及其封装方法
CN104600204B (zh) Oled封装结构及封装方法
CN104659269B (zh) Oled封装方法及oled封装结构
CN104538555A (zh) Oled封装结构及oled封装方法
CN103337511B (zh) Oled面板及其封装方法
CN103636023B (zh) 用于光电子器件的封装结构和用于封装光电子器件的方法
CN107623085B (zh) Oled面板的封装方法及封装结构
CN104538566A (zh) Oled的封装方法及oled封装结构
CN104538420A (zh) 柔性oled显示装置及其制造方法
US20160293886A1 (en) Organic light-emitting diode (oled) display panel and manufacturing method thereof
CN103325958A (zh) 有机电致发光器件封装盖板、有机电致发光器件及显示器
CN106684259A (zh) Oled封装方法与oled封装结构
CN104157799A (zh) Oled的封装方法及oled封装结构
CN102255056A (zh) 一种增强玻璃料密封oled器件密封性能的方法
CN104576697A (zh) 双面oled显示装置及其制作方法
CN104241542A (zh) Oled的封装方法及oled封装结构
WO2016086533A1 (zh) Oled封装方法及oled封装结构
WO2016169153A1 (zh) 显示面板及其封装方法、显示装置
CN104600092A (zh) Oled触控显示装置及其制造方法
CN103943657A (zh) 一种显示面板及其封装方法、显示装置
CN102709479B (zh) Oled器件的封装结构及封装方法
CN101931058B (zh) 一种有机电致发光器件的封装结构及其封装方法
WO2019127702A1 (zh) Oled面板及其制作方法
CN102709480A (zh) 有机电致发光器件及显示器

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 14424922

Country of ref document: US

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15865739

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15865739

Country of ref document: EP

Kind code of ref document: A1