WO2016080350A1 - Condensateur à multiples couches - Google Patents

Condensateur à multiples couches Download PDF

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Publication number
WO2016080350A1
WO2016080350A1 PCT/JP2015/082131 JP2015082131W WO2016080350A1 WO 2016080350 A1 WO2016080350 A1 WO 2016080350A1 JP 2015082131 W JP2015082131 W JP 2015082131W WO 2016080350 A1 WO2016080350 A1 WO 2016080350A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrode
external
side connection
connection portion
multilayer capacitor
Prior art date
Application number
PCT/JP2015/082131
Other languages
English (en)
Japanese (ja)
Inventor
畠中　英文
啓太 前原
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to JP2016560210A priority Critical patent/JPWO2016080350A1/ja
Publication of WO2016080350A1 publication Critical patent/WO2016080350A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Abstract

La présente invention concerne un condensateur à multiples couches dans lequel : une première borne externe 4a est connectée à une première électrode externe 3a et a une première pièce de connexion côté électrode 4a1 qui est connectée à la première électrode externe 3a et une première partie de connexion côté substrat 4a2 qui est connectée à un substrat; une seconde borne externe 4b est connectée à une seconde électrode externe 3b et a une seconde partie de connexion côté électrode 4b1 qui est connectée à la seconde électrode externe 3b et une seconde partie de connexion côté substrat 4b2 qui est connectée au substrat; les première et seconde parties de connexion côté électrode 4a1, 4b1 ont des première et secondes projections 4a3, 4b3 qui font saillie vers les première et seconde électrodes externes 3a, 3b; et la paire de bornes externes 4 est reliée à la paire d'électrodes externes 3 au moyen des première et seconde projections 4a3, 4b3.
PCT/JP2015/082131 2014-11-17 2015-11-16 Condensateur à multiples couches WO2016080350A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016560210A JPWO2016080350A1 (ja) 2014-11-17 2015-11-16 積層型コンデンサ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-232774 2014-11-17
JP2014232774 2014-11-17

Publications (1)

Publication Number Publication Date
WO2016080350A1 true WO2016080350A1 (fr) 2016-05-26

Family

ID=56013887

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/082131 WO2016080350A1 (fr) 2014-11-17 2015-11-16 Condensateur à multiples couches

Country Status (2)

Country Link
JP (1) JPWO2016080350A1 (fr)
WO (1) WO2016080350A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150114697A1 (en) * 2013-10-29 2015-04-30 Kemet Electronics Corporation Ceramic Capacitors with Improved Lead Designs
US20170287645A1 (en) * 2016-03-31 2017-10-05 Tdk Corporation Electronic component
JP2021027053A (ja) * 2019-07-31 2021-02-22 太陽誘電株式会社 積層セラミック電子部品及び電子部品実装基板
JP2021515417A (ja) * 2018-02-27 2021-06-17 テーデーカー エレクトロニクス アーゲー 外部コンタクトを有する多層素子
US20220084750A1 (en) * 2020-09-17 2022-03-17 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component and mounting structure of the multilayer ceramic electronic component

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223359A (ja) * 1999-01-29 2000-08-11 Murata Mfg Co Ltd セラミック電子部品
JP2000235931A (ja) * 1998-12-15 2000-08-29 Murata Mfg Co Ltd 積層セラミックコンデンサ
JP2012023322A (ja) * 2010-07-13 2012-02-02 Maruwa Co Ltd チップ型積層セラミックコンデンサ及びその製造方法
JP2012033659A (ja) * 2010-07-29 2012-02-16 Tdk Corp セラミックコンデンサ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014187322A (ja) * 2013-03-25 2014-10-02 Murata Mfg Co Ltd 電子部品

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000235931A (ja) * 1998-12-15 2000-08-29 Murata Mfg Co Ltd 積層セラミックコンデンサ
JP2000223359A (ja) * 1999-01-29 2000-08-11 Murata Mfg Co Ltd セラミック電子部品
JP2012023322A (ja) * 2010-07-13 2012-02-02 Maruwa Co Ltd チップ型積層セラミックコンデンサ及びその製造方法
JP2012033659A (ja) * 2010-07-29 2012-02-16 Tdk Corp セラミックコンデンサ

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150114697A1 (en) * 2013-10-29 2015-04-30 Kemet Electronics Corporation Ceramic Capacitors with Improved Lead Designs
US10056320B2 (en) * 2013-10-29 2018-08-21 Kemet Electronics Corporation Ceramic capacitors with improved lead designs
US20170287645A1 (en) * 2016-03-31 2017-10-05 Tdk Corporation Electronic component
US10242805B2 (en) * 2016-03-31 2019-03-26 Tdk Corporation Electronic device with external terminal
JP2021515417A (ja) * 2018-02-27 2021-06-17 テーデーカー エレクトロニクス アーゲー 外部コンタクトを有する多層素子
JP7090747B2 (ja) 2018-02-27 2022-06-24 テーデーカー エレクトロニクス アーゲー 外部コンタクトを有する多層素子
US11387045B2 (en) 2018-02-27 2022-07-12 Tdk Electronics Ag Multilayer component with external contact
JP2021027053A (ja) * 2019-07-31 2021-02-22 太陽誘電株式会社 積層セラミック電子部品及び電子部品実装基板
JP7319133B2 (ja) 2019-07-31 2023-08-01 太陽誘電株式会社 積層セラミック電子部品及び電子部品実装基板
US20220084750A1 (en) * 2020-09-17 2022-03-17 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component and mounting structure of the multilayer ceramic electronic component
US11887787B2 (en) * 2020-09-17 2024-01-30 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component including metal terminals with recess portions and mounting structure of the multilayer ceramic electronic component

Also Published As

Publication number Publication date
JPWO2016080350A1 (ja) 2017-07-13

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