WO2016080350A1

WO2016080350A1 - Multilayer capacitor

Info

Publication number: WO2016080350A1
Application number: PCT/JP2015/082131
Authority: WO
Inventors: 畠中　英文; 啓太前原
Original assignee: 京セラ株式会社
Priority date: 2014-11-17
Filing date: 2015-11-16
Publication date: 2016-05-26
Also published as: JPWO2016080350A1

Abstract

A multilayer capacitor wherein: a first external terminal 4a is connected to a first external electrode 3a, and has a first electrode-side connection part 4a1 that is connected to the first external electrode 3a and a first substrate-side connection part 4a2 that is connected to a substrate; a second external terminal 4b is connected to a second external electrode 3b, and has a second electrode-side connection part 4b1 that is connected to the second external electrode 3b and a second substrate-side connection part 4b2 that is connected to the substrate; the first and second electrode-side connection parts 4a1, 4b1 have first and second projections 4a3, 4b3 that protrude toward the first and second external electrodes 3a, 3b; and the pair of external terminals 4 are joined with the pair of external electrodes 3 by means of the first and second projections 4a3, 4b3.

Description

Multilayer capacitor

The present invention relates to a multilayer capacitor, and particularly to a multilayer capacitor mounted on a substrate by a pair of external terminals provided on a pair of external electrodes.

In a multilayer capacitor, dielectric layers and internal electrodes are alternately laminated. As a ceramic material constituting the dielectric layer, a ferroelectric material such as barium titanate having a relatively high dielectric constant is generally used. It is used. When an AC voltage is applied to such a multilayer capacitor, distortion occurs in the dielectric layer due to the electrostrictive effect, and vibration occurs in the multilayer capacitor itself. The vibration of the multilayer capacitor propagates to the substrate on which the multilayer capacitor is mounted via solder or the like, the substrate resonates with the vibration propagated to the substrate, and the vibration is amplified, and vibration sound is generated in the substrate. When the vibration frequency of the substrate becomes an audible frequency band, an audible sound is generated from the substrate. That is, a so-called “sounding” phenomenon occurs. Specifically, in a multilayer capacitor, when a pair of external electrodes and a substrate electrode are mounted via solder, the vibration of the multilayer capacitor deforms the substrate via the solder attached to the pair of external electrodes. Therefore, vibration sound is generated in the substrate.

In order to reduce vibration noise in the substrate, a multilayer capacitor having a multilayer capacitor body having a pair of external electrodes on a pair of opposed end faces and a pair of external terminals joined to the pair of external electrodes is used. ing. In such a multilayer capacitor, a pair of external terminals are joined to a pair of external electrodes, and the multilayer capacitor body is mounted on the substrate separately from the substrate using the pair of external terminals. Such a configuration makes it difficult for vibration generated in the multilayer capacitor body to propagate to the substrate and suppresses generation of vibration noise on the substrate due to the multilayer capacitor body. An example of such a multilayer capacitor is disclosed in Patent Document 1.

JP 2012-212681 A

However, the above-mentioned multilayer capacitor suppresses the noise by making the multilayer capacitor body difficult to propagate to the substrate by providing the multilayer capacitor body away from the substrate using a pair of external terminals. However, the pair of external terminals are joined to the external electrodes via solder over the entire surface facing the pair of external electrodes, and it is difficult to further propagate the vibration of the multilayer capacitor body to the substrate. There was a problem.

The present invention has been made in view of the above-described problems, and an object of the present invention is to make it difficult for vibration generated in the multilayer capacitor body to propagate to the substrate and to suppress noise. It is to provide a capacitor.

A multilayer capacitor according to an embodiment of the present invention includes a plurality of dielectric layers stacked, a rectangular parallelepiped stacked body having a first end surface and a second end surface facing each other, and the above-described stacked body in the stacked body. A plurality of internal electrodes arranged at intervals in the stacking direction of the plurality of dielectric layers, and arranged on the first end face and the second end face, respectively, and electrically connected to different internal electrodes A first external electrode and a second external electrode, and a pair of external terminals joined to the first external electrode and the second external electrode, respectively. A first electrode-side connecting portion disposed opposite to the first external electrode and joined to the first external electrode and extending below the first external electrode; and the first external electrode At the end of the extended part of the electrode side connection A first external terminal having a first substrate-side connection portion disposed so as to be orthogonal to the first electrode-side connection portion, and disposed opposite to the second external electrode. The second electrode-side connection portion that is joined to the second external electrode and extends below the second external electrode, and the second electrode-side connection portion extends to the end of the second electrode-side connection portion. And a second external terminal having a second substrate-side connection portion arranged so as to be orthogonal to the electrode-side connection portion, wherein the first external terminal is on the first electrode side The connecting portion has a first protruding portion that faces the first external electrode with a gap and protrudes toward the first external electrode, and the first protruding portion and the The second external terminal is joined to the first external electrode, and the second electrode side connecting portion is connected to the second external terminal. The electrode has a second protruding portion that protrudes toward the second external electrode facing the gap with a gap, and the second protruding portion and the second external electrode are joined to each other It is characterized by being.

According to the multilayer capacitor of the present invention, the pair of external terminals are provided with protrusions that protrude toward the external electrode side, and the vibration generated in the multilayer capacitor body is formed by joining the external electrodes at the protrusions. Propagation can be made difficult.

1 is a schematic perspective view showing a multilayer capacitor according to a first embodiment. 1 is a multilayer capacitor body of the multilayer capacitor shown in FIG. 1, wherein (a) is a schematic perspective view showing the multilayer capacitor body, and (b) is an AA line view of the multilayer capacitor body shown in FIG. (C) is a cross-sectional view of another example of the multilayer capacitor body shown in (b). FIG. 2A is a cross-sectional view taken along the line AA of the multilayer capacitor shown in FIG. 1, and FIG. 2B is a cross-sectional view taken along the line BB of the multilayer capacitor shown in FIG. 6 is a schematic perspective view illustrating another example of the multilayer capacitor in accordance with Embodiment 1. FIG. (A) is a schematic perspective view showing a state in which the multilayer capacitor shown in FIG. 1 is mounted on a substrate, and (b) is a cross-sectional view taken along the line CC of the multilayer capacitor shown in (a). is there. (A) And (b) is explanatory drawing for demonstrating the manufacturing method of the multilayer capacitor | condenser shown in FIG. (A) And (b) is explanatory drawing for demonstrating the manufacturing method of the multilayer capacitor | condenser shown in FIG. 6 is a schematic perspective view showing a multilayer capacitor according to a second embodiment. FIG. FIG. 9A is a cross-sectional view taken along line DD of the multilayer capacitor shown in FIG. 8, and FIG. 9B is a cross-sectional view taken along line EE of the multilayer capacitor shown in FIG. FIG. 9A is a schematic perspective view showing a state in which the multilayer capacitor shown in FIG. 8 is mounted on a substrate, and FIG. 9B is a cross-sectional view of the multilayer capacitor shown in FIG. is there. (A) And (b) is explanatory drawing for demonstrating the manufacturing method of the multilayer capacitor | condenser shown in FIG. (A) And (b) is explanatory drawing for demonstrating the manufacturing method of the multilayer capacitor | condenser shown in FIG.

<Embodiment 1>
Hereinafter, the multilayer capacitor 10A according to the first embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a schematic perspective view showing a multilayer capacitor 10A according to Embodiment 1 of the present invention. The multilayer capacitor 10A includes a multilayer capacitor body 10 and a pair of external electrodes 3 ( A pair of external terminals 4 (first external terminal 4a and second external terminal 4b) joined to the first external electrode 3a and the second external electrode 3b) are provided. The pair of external terminals 4 are joined to the pair of external electrodes 3 by the first protrusion 4a3 and the second protrusion 4b3.

The multilayer capacitor body 10 includes a dielectric layer made of a ceramic material and internal electrodes 2 (first internal electrode 2a and second internal electrode 2b). The dielectric layers and the internal electrodes 2 are alternately arranged. A pair of external electrodes 3 (first external electrode 3a and second external electrode 3b) are electrically connected to the internal electrode 2 drawn out to the first end face 1c or the second end face 1d. ing. That is, in the internal electrode 2, the first internal electrode 2a is electrically connected to the first external electrode 3a, and the second internal electrode 2b is electrically connected to the second external electrode 3b. . For convenience, the multilayer capacitor 10A defines an orthogonal coordinate system XYZ and has the positive side in the Z direction upward. In addition, in each drawing, about the same member and the same part, the overlapping description is abbreviate | omitted using a common code | symbol.

The multilayer capacitor 10A is mounted via a solder 6 on a circuit board (hereinafter referred to as a board 9). The substrate 9 is used, for example, in a notebook computer, a smartphone, a mobile phone, or the like. For example, an electric circuit to which the multilayer capacitor 10A is electrically connected is formed on the surface.

As shown in FIG. 5, the substrate 9 is provided with, for example, a substrate electrode 9a and a substrate electrode 9b on the surface on which the multilayer capacitor 10A is mounted, and a wiring 9c extends from the substrate electrode 9a. The wiring 9d extends from the substrate electrode 9b. In the multilayer capacitor 10A, for example, the first external terminal 4a and the substrate electrode 9a are soldered by soldering, and the second external terminal 4b and the substrate electrode 9b are soldered by soldering.

First, the multilayer capacitor body 10 will be described below with reference to the drawings.

As shown in FIG. 2, the multilayer capacitor body 10 includes a multilayer body 1, internal electrodes 2 (first internal electrode 2a and second internal electrode 2b) formed in the multilayer body 1, a pair of The external electrode 3 (the 1st external electrode 3a and the 2nd external electrode 3b) is provided. The first external electrode 3a and the second external electrode 3b are respectively disposed on the first end surface 1c and the second end surface 1d of the multilayer body 1, and are drawn out to the first end surface 1c or the second end surface 1d. The internal electrode 2 is electrically connected.

The multilayer body 1 is formed in a rectangular parallelepiped shape by laminating a plurality of dielectric layers, and the first end surface 1c and the second end surface 1d facing each other are the first main surface 1a and the second main surface. The first side surface 1e and the second side surface 1f that are connected to each other and that face each other are between the first main surface 1a and the second main surface 1b, and between the first end surface 1c and the second side surface 1f. The end faces 1d are connected. Note that the rectangular parallelepiped shape includes not only a cubic shape or a rectangular parallelepiped shape, but also includes, for example, a shape in which a ridge line portion of a cube or a rectangular parallelepiped is chamfered so that the ridge line portion has an R shape.

The laminated body 1 is a sintered body obtained by laminating a plurality of dielectric layers and forming a rectangular parallelepiped, and laminating and firing a plurality of ceramic green sheets serving as dielectric layers. Thus, the laminated body 1 is formed in a rectangular parallelepiped shape, and is orthogonal to the first main surface 1a and the second main surface 1b facing each other, and the first main surface 1a and the second main surface 1b. The first side face 1c and the second end face 1d facing each other, and the first side face 1e and the second side face facing each other perpendicular to the first end face 1c and the second end face 1d. 1f. In addition, the laminate 1 has a rectangular plane that is a cross-section (XY plane) orthogonal to the stacking direction (Z direction) of the dielectric layers. In the multilayer capacitor body 10, each ridge line portion of the multilayer body 1 may be rounded.

The dimension of the multilayer capacitor body 10 having such a configuration is such that the length in the longitudinal direction (X direction) is, for example, 0.6 (mm) to 2.2 (mm), and the length in the short direction (Y direction). However, the length in the height direction (Z direction) is, for example, 0.3 (mm) to 1.5 (mm).

The dielectric layer has a rectangular shape in plan view from the stacking direction, and the thickness per layer is, for example, 0.5 (μm) to 3 (μm). In the laminate 1, for example, a plurality of dielectric layers composed of, for example, 10 (layers) to 1000 (layers) and internal electrodes 2 are laminated in the Z direction. In addition, the number of internal electrodes 2 in the multilayer body 1 is appropriately designed according to the characteristics of the multilayer capacitor body 10.

The dielectric layer is, for example, barium titanate (BaTiO ₃ ), calcium titanate (CaTiO ₃ ), strontium titanate (SrTiO ₃ ), or calcium zirconate (CaZrO ₃ ). The dielectric layer preferably uses barium titanate as a ferroelectric material having a high dielectric constant from the viewpoint of a high dielectric constant.

The plurality of internal electrodes 2 include a first internal electrode 2a and a second internal electrode 2b, and the first internal electrode 2a and the second internal electrode 2b are arranged at a predetermined interval in the stacking direction of the dielectric layers. 2b and 2c, the plurality of dielectric layers in the multilayer body 1 are alternately arranged at predetermined intervals in the laminating direction, as shown in FIG. 2 (b) and FIG. 2 (c). The laminated body 1 is provided so as to be substantially parallel to the first main surface 1a and the second main surface 1b, respectively. The first internal electrodes 2 a and the second internal electrodes 2 b form a pair of internal electrodes 2 and are alternately arranged in the stacked body 1.

Thus, the first internal electrode 2a and the second internal electrode 2b are arranged at a predetermined interval in the stacking direction of the plurality of dielectric layers in the stacked body 1, and are separated by the dielectric layers, Further, they are arranged to face each other, and at least one dielectric layer is sandwiched between the first internal electrode 2a and the second internal electrode 2b. A plurality of dielectric layers on which the internal electrodes 2 are formed are laminated to form the multilayer body 1 of the multilayer capacitor body 10.

The plurality of internal electrodes 2 are formed in the multilayer body 1 and have a rectangular shape in plan view from the stacking direction, and are arranged at intervals in the stacking direction of the plurality of dielectric layers in the stack body 1. Has been. In the multilayer capacitor body 10, as shown in FIGS. 2B and 2C, one end of the first internal electrode 2a is drawn out to the first end face 1c, and the second internal electrode As for 2b, one edge part is pulled out by the 2nd end surface 1d which opposes the 1st end surface 1c.

Further, the internal electrode 2 is provided so as to be exposed to one end face of the first end face 1c and the second end face 1d and not to be exposed to the first side face 1e and the second side face 1f.

The conductive material of the first internal electrode 2a and the second internal electrode 2b is, for example, a metal material such as nickel (Ni), copper (Cu), silver (Ag), palladium (Pd), or gold (Au), or For example, an alloy material such as an Ag—Pd alloy containing one or more of these metal materials. The first internal electrode 2a and the second internal electrode 2b have an electrode thickness of, for example, 0.5 (μm) to 2 (μm), and the thickness may be set appropriately depending on the application. The first internal electrode 2a and the second internal electrode 2b are preferably formed of the same metal material or alloy material.

In the multilayer capacitor 10A, as shown in FIG. 3, the multilayer capacitor body 10 is disposed between the pair of external terminals 4 so that the internal electrode 2 is parallel to the XY plane. Absent. In the multilayer capacitor 10A, the multilayer capacitor body 10 may be disposed between the pair of external terminals 4 so that the internal electrode 2 is parallel to the XZ plane. In this case, the 1st protrusion part 4a3 and the 2nd protrusion part 4b3 may each be located in the edge part of a Y direction.

The pair of external electrodes 3 are respectively disposed on the first end surface 1c and the second end surface 1d, and are electrically connected to the internal electrode 2 drawn out to the first end surface 1c or the second end surface 1d. Yes. Specifically, the first external electrode 3a is disposed on the first end face 1c, and is electrically connected to the first internal electrode 2a drawn out to the first end face 1c. The second external electrode 3b is disposed on the second end surface 1d, and is electrically connected to the second internal electrode 2b drawn to the second end surface 1d.

As described above, the pair of external electrodes 3 includes the first external electrode 3a and the second external electrode 3b, and is formed so as to cover the first end surface 1c and the second end surface 1d. The external electrode 3a and the second external electrode 3b are arranged so as to face each other. Further, as shown in FIG. 2, the pair of external electrodes 3 is formed so as to cover the first end face 1 c and the second end face 1 d, and in the stacked body 1, the first end face 1 c and the second end face 1 d are formed. The first main surface 1a and the second main surface 1b are respectively extended from the end surface 1d to the surfaces of the first main surface 1a and the second main surface 1b, and the first side surface 1e and the second side surface 1d are connected to the first end surface 1c and the second main surface 1d. Each of the side surfaces 1f is formed to extend.

The pair of external electrodes 3 includes a base electrode 3c and a plating layer 3d as shown in FIG. 2 (b). The base electrode 3c is electrically connected to the internal electrode 2 drawn out to the first end face 1c or the second end face 1d, and the plating layer 3d is formed on the surface of the base electrode 3c so as to cover the base electrode 3c. Is formed. The plating layer 3d is formed to protect the base electrode 3c, and is formed to improve the bonding property between the pair of external electrodes 3 and the pair of external terminals 4 in the melt bonding. Note that the pair of external electrodes 3 is not limited to the plating layer 3 d, but may be any metal layer that can be bonded to the pair of external terminals 4 so as to cover the base electrode 3 c. In particular, the pair of external electrodes 3 is preferably provided with a metal layer that can be melt bonded to the pair of external terminals 4 so as to cover the base electrode 3c.

The conductive material of the base electrode 3c includes, for example, a metal material such as nickel (Ni), copper (Cu), silver (Ag), palladium (Pd), or gold (Au), or one or more of these metal materials. For example, an alloy material such as an Ag—Pd alloy. The pair of base electrodes 3c is preferably formed of the same metal material or alloy material.

The base electrode 3c has a thickness on the first main surface 1a and the second main surface 1b of, for example, 4 (μm) to 10 (μm), and a thickness on the first end surface 1c and the second end surface 1d, For example, the thickness is 10 (μm) to 25 (μm), and the thickness on the first side surface 1e and the second side surface 1f is, for example, 4 (μm) to 10 (μm).

The base electrode 3c is formed to extend from the first end surface 1c and the second end surface 1d to the first main surface 1a and the second main surface 1b, and the first end surface 1c and the first end surface 1c The second end surface 1d is formed to extend from the first side surface 1e and the second side surface 1f. The plating layer 3 d is formed on the surface of the base electrode 3 c so as to cover the base electrode 3 c formed on the surface of the multilayer body 1.

Thus, as shown in FIG. 2B, the first external electrode 3a and the second external electrode 3b have the plating layer 3d formed on the surface of the base electrode 3c. A nickel (Ni) plating layer, a copper (Cu) plating layer, a gold (Au) plating layer, a tin (Sn) plating layer, or the like. Moreover, the plating layer 3d is formed using, for example, an electrolytic plating method.

In addition, as shown in FIG. 2B, the first external electrode 3a and the second external electrode 3b are formed with a single plating layer 3d, but as shown in FIG. In order to ensure the protection of the base electrode 3c, it may be composed of a plurality of plating layers. For example, as shown in FIG. 2 (c), the pair of external electrodes 3 is a laminate composed of a first plating layer 3d1 and a second plating layer 3d2 formed on the surface of the first plating layer 3d1. It may be formed on the surface. In the present embodiment, the pair of external electrodes 3 has a laminate in which the plating layer 3d is composed of the first plating layer 3d1 and the second plating layer 3d2. The configuration of the plating layer 3d is not limited to this.

For example, in the pair of external electrodes 3, a Ni plating layer (first plating layer 3d1) is formed on the surface of the base electrode 3c, and a Sn plating layer (second plating layer 3d2) is formed on the surface of the Ni plating layer. In addition, the plating layer 3d may be formed of a laminate of a Ni plating layer and a Sn plating layer. The first plating layer 3d1 has a thickness of, for example, 5 (μm) to 10 (μm), and the second plating layer 3d2 has a thickness of, for example, 3 (μm) to 5 (μm).

Here, the pair of external terminals 4 (first external terminal 4a and second external terminal 4b) will be described below with reference to the drawings.

As shown in FIG. 1, the pair of external terminals 4 includes a first external terminal 4a and a second external terminal 4b, which are joined to the first external electrode 3a and the second external electrode 3b, respectively. ing. As shown in FIG. 5, the pair of external terminals 4 is for disposing the multilayer capacitor body 10 away from the surface of the substrate 9 on which the multilayer capacitor 10A is mounted. Specifically, the first external terminal 4a is joined to the first external electrode 3a so that the multilayer capacitor body 10 is arranged away from the surface of the substrate 9, and the second external terminal 4b is The multilayer capacitor main body 10 is bonded to the second external electrode 3b so as to be disposed away from the surface of the substrate 9.

As shown in FIG. 3, the first external terminal 4a has a first electrode side connection portion 4a1 and a first substrate side connection portion 4a2. The first electrode side connection portion 4a1 is disposed to face the first external electrode 3a, is joined to the first external electrode 3a, and extends below the first external electrode 3a. The first substrate-side connection portion 4a2 is disposed at the end of the portion where the first electrode-side connection portion 4a1 extends so as to be orthogonal to the first electrode-side connection portion 4a1. Thus, the first substrate-side connection portion 4a2 is connected to one end of the first electrode-side connection portion 4a1, and the longitudinal direction of the multilayer capacitor body 10 from the first electrode-side connection portion 4a1. It extends to.

The second external terminal 4b has a second electrode side connection portion 4b1 and a second substrate side connection portion 4b2. The second electrode side connection portion 4b1 is disposed opposite to the second external electrode 3b, joined to the second external electrode 3b, and extends below the second external electrode 3b. The second substrate-side connection portion 4b2 is disposed at the end of the portion where the second electrode-side connection portion 4b1 extends so as to be orthogonal to the second electrode-side connection portion 4b1. As described above, the second substrate-side connecting portion 4b2 is connected to one end of the second electrode-side connecting portion 4b1, and the longitudinal direction of the multilayer capacitor body 10 from the second electrode-side connecting portion 4b1. It extends to.

The first substrate-side connecting portion 4a2 is orthogonal to the first electrode-side connecting portion 4a1, and the first substrate-side connecting portion 4a2 is opposite to the laminate 1 from the first electrode-side connecting portion 4a1. The thing arrange | positioned toward the side and the thing arrange | positioned toward the side of the laminated body 1 are included. That is, the first board side connection portion 4a2 includes those extending toward the outside of the multilayer capacitor body 10 and those extending toward the inside.

In addition, the second substrate-side connection portion 4b2 is orthogonal to the second electrode-side connection portion 4b1, and the second substrate-side connection portion 4b2 extends from the second electrode-side connection portion 4b1 to the laminate 1. And those arranged toward the side of the laminate 1 are included. That is, the second board side connection portion 4b2 includes those extending toward the outside of the multilayer capacitor body 10 and those extending toward the inside. In the first embodiment, the first substrate-side connection portion 4a2 is arranged orthogonal to the first electrode-side connection portion 4a1 and is disposed toward the opposite side of the stacked body 1, and the second substrate-side connection portion 4b2 is orthogonal to the second electrode side connection portion 4b1 and is disposed toward the opposite side of the laminate 1.

As shown in FIG. 3, the first external terminal 4a has a first substrate side connection portion 4a2 extending in a substantially vertical direction toward the opposite side of the multilayer body 1 with respect to the first electrode side connection portion 4a1. Exist. That is, in the first external terminal 4a, the first substrate-side connection portion 4a2 is bent at a substantially right angle toward the outside of the multilayer capacitor body 10 with respect to the first electrode-side connection portion 4a1. The first external terminal 4a has an L-shaped side surface as viewed from the side (Y direction) orthogonal to the first side surface 1e or the second side surface 1f, and has a single plate-like body. Is bent at a substantially right angle. The term “substantially perpendicular” means that the angle formed by the first electrode side connection portion 4a1 and the first substrate side connection portion 4a2 is in the range of 85 (°) to 95 (°).

Further, as shown in FIG. 3, the second external terminal 4b is formed symmetrically with the first external terminal 4a, and the second substrate side connection portion 4b2 is based on the second electrode side connection portion 4b1. Thus, it extends in a substantially vertical direction toward the opposite side of the laminate 1. That is, in the second external terminal 4b, the second substrate side connection portion 4b2 is bent at a substantially right angle toward the outside of the multilayer capacitor body 10 with respect to the second electrode side connection portion 4b1. The second external terminal 4b has a L-shaped side surface when viewed from the side (Y direction) orthogonal to the first side surface 1e or the second side surface 1f, and is a single plate-like body. Is bent at a substantially right angle. Note that the substantially right angle means that the angle formed by the second electrode side connection portion 4b1 and the second substrate side connection portion 4b2 is within a range of 85 (°) to 95 (°).

In the multilayer capacitor 10A, the pair of external terminals 4 are provided such that the first substrate side connection portion 4a2 and the second substrate side connection portion 4b2 extend in opposite directions toward the opposite side of the multilayer body 1. The first electrode side connection portion 4a1 and the first substrate side connection portion 4a2 are substantially perpendicular to each other, and the second electrode side connection portion 4b1 and the second substrate side connection portion 4b2 Is almost at right angles.

In this way, as shown in FIG. 3, the first external terminal 4a has the first electrode side connection portion 4a1 disposed so as to face the first external electrode 3a, and is joined to the first external electrode 3a. ing. Further, the first external terminal 4a is provided so as to be substantially perpendicular to the first electrode side connection portion 4a1 so that the first substrate side connection portion 4a2 faces the substrate 9. The substrate-side connection portion 4a2 is electrically connected to the substrate electrode 9a.

Further, as shown in FIG. 3, the first external terminal 4a is such that the first electrode side connection portion 4a1 faces the first external electrode 3a with a gap, and the first protruding portion 4a3 is opposed to the first external terminal 4a. The first protrusion 4a3 protrudes toward the first external electrode 3a. The first protrusion 4a3 and the first external electrode 3a are joined using, for example, solder joining or welding.

The first external terminal 4a is joined to the first external electrode 3a at the first protrusion 4a3 by using, for example, spot welding. Specifically, as shown in FIG. 3, the first external terminal 4a is formed by welding the first external electrode 3a and the first protruding portion 4a3 so that the welded portion 5 is connected to the first protruding portion 4a3. As a result, the first external electrode 3a and the first protrusion 4a3 are joined. In addition, the first external terminal 4a is joined to the first external electrode 3a only by the first protrusion 4a3, and the portions other than the first protrusion 4a3 are connected to the first external electrode 3a via a gap. Opposite to. In addition, the first external terminal 4a is preferably bonded so that the first protrusion 4a3 is in contact with the first external electrode 3a in order to ensure the bonding strength with the first external electrode 3a. .

In the first external terminal 4b, as shown in FIG. 3, the second substrate-side connection portion 4b1 is arranged to face the second external electrode 3b, and is joined to the second external electrode 3b. The second external terminal 4b is provided so as to be substantially perpendicular to the second electrode side connection portion 4b1 so that the second substrate side connection portion 4b2 faces the substrate 9. The substrate-side connecting portion 4b2 is electrically connected to the substrate electrode 9b.

As shown in FIG. 3, the second external terminal 4b has the second electrode side connection portion 4b1 opposed to the second external electrode 3b with a gap, and the second protruding portion 4b3. And the second protrusion 4b3 protrudes toward the second external electrode 3b. The second protrusion 4b3 and the second external electrode 3b are joined using, for example, solder joining or welding.

The second external terminal 4b is joined to the second external electrode 3b at the second protrusion 4b3 by using, for example, spot welding. Specifically, as shown in FIG. 3, the second external terminal 4b is formed by welding the second external electrode 3b and the second protruding portion 4b3 so that the welded portion 5 is connected to the second protruding portion 4b3. As a result, the second external electrode 3b and the second protrusion 4b3 are joined. In addition, the second external terminal 4b is joined to the second external electrode 3b only by the second protrusion 4b3, and a portion other than the second protrusion 4b3 is connected to the second external electrode 3b via a gap. Opposite to. The second external terminal 4b is preferably joined so that the second protruding portion 4b3 is in contact with the second external electrode 3b in order to ensure the bonding strength with the second external electrode 3b. .

The first protrusion 4a3 and the second protrusion 4b3 have a protrusion amount of, for example, 0.05 (mm) to 0.15 (mm). The first protrusion 4a3 is viewed from the direction (X direction) perpendicular to the first electrode side connection part 4a1, and the second protrusion 4b3 is perpendicular to the second electrode side connection part 4b1. When viewed from the (X direction), for example, it is circular, for example, the major axis is 0.15 (mm) to 0.45 (mm), and the minor axis is 0.1 (mm) to 0.3 (mm). ). For example, using the press working method, the first protrusion 4a3 is provided in the first electrode side connection part 4a1, and the second protrusion 4b3 is provided in the second electrode side connection part 4b1.

In the multilayer capacitor 10A, two first protrusions 4a3 and two second protrusions 4b3 are provided in the first electrode side connection part 4a1 and the second electrode side connection part 4b1, respectively. The number of the first protrusions 4a3 and the second protrusions 4b3 is not limited to this, but one or three or more depending on the size of the multilayer capacitor body 10 or the bonding strength between the pair of external electrodes 3 and the like. It may be.

A plurality of first protrusions 4a3 are located in the first diagonal direction D1 of the first end face 1c, and the second protrusions 4b3 are in the first diagonal direction D1 of the second end face 1d. A plurality may be located in the second diagonal direction D2 (not shown) that intersects.

For example, as shown in FIG. 4, two first protrusions 4a3 are located in the first diagonal direction D1 of the first end face 1c, and the second protrusion 4b3 is the second protrusion 4b3. Two end faces 1d are located in a second diagonal direction D2 that intersects the first diagonal direction D1. Note that the first diagonal direction D1 intersects with the second diagonal direction D2 as seen through from the direction (X direction) perpendicular to the first electrode-side connecting portion 4a1.

With such a configuration, for example, when the substrate 9 on which the multilayer capacitor 10A is mounted is bent upward, the first protrusion 4a3 (on the lower side (substrate 9 side)) ( Although there is a possibility that the joint portion of the second projecting portion 4b3) is likely to be peeled off, the joint can be held by the upper first projecting portion 4a3 (second projecting portion 4b3). Moreover, when the board | substrate 9 bends below, there exists a possibility that the junction part of the 1st protrusion part (2nd protrusion part) of an upper side may peel easily, but a lower side (board | substrate 9 side) The first protrusion (second protrusion) located at the position can hold the joint. Further, as shown in FIG. 4, two each of the first projecting portion 4a3 and the second projecting portion 4b3 are provided, but the present invention is not limited to this, and three or more may be provided.

As described above, the multilayer capacitor 10A is joined to the pair of external electrodes 3 so that the pair of external terminals 4 are disposed away from the surface of the substrate 9. The distance between the surface of the substrate 9 and the second main surface 1b of the multilayer capacitor body 10 is the size of the multilayer capacitor body 10, the mounting stability between the multilayer capacitor 10A and the substrate 9, or the substrate 9 The lengths of the first electrode side connection portion 4a1 and the second electrode side connection portion 4b1 can be adjusted according to the number of the multilayer capacitors 10A mounted on the first electrode side connection portion 4a1.

As shown in FIG. 1, the pair of external terminals 4 includes a first electrode-side connection portion 4a1 and a second electrode-side connection portion 4b1 that are rectangular plates, and the first external electrode 3a and the second external terminal 4b. It is substantially parallel to the electrode 3b, joined to the first external electrode 3a by the first protrusion 4a3, and joined to the second external electrode 3b by the second protrusion 4b3. The pair of external terminals 4 includes a substrate electrode 9a and a substrate of the substrate 9 on which the multilayer capacitor 10A is mounted, in which the first substrate side connection portion 4a2 and the second substrate side connection portion 4b2 are rectangular plates. It is substantially parallel to the electrode 9b and is connected to the substrate electrode 9a and the substrate electrode 9b via solder 6 as shown in FIG. The shape of the first electrode side connection portion 4a1 and the second electrode side connection portion 4b1 and the shape of the first substrate side connection portion 4a2 and the second substrate side connection portion 4b2 are not limited to a rectangular plate-like body, but a pair The external electrode 3 is appropriately set according to the shape of the substrate electrode 9a and the shape of the substrate electrode 9b.

The pair of external terminals 4 is, for example, a metal material such as iron (Fe), nickel (Ni), chromium (Cr), copper (Cu), silver (Ag), or cobalt (Co), or a kind of these metal materials. For example, an alloy material such as a stainless alloy or a copper alloy is included. The first external terminal 4a and the second external terminal 4b are preferably formed of the same metal material or alloy material.

In the first external terminal 4a and the second external terminal 4b, the thicknesses of the first electrode side connection portion 4a1 and the second electrode side connection portion 4b1 are 0.1 (mm) to 0.15 (mm), for example. Therefore, the thickness may be set appropriately according to the size or use of the multilayer capacitor body 10 so that the effect of suppressing vibration noise can be obtained.

Further, the first electrode side connection portion 4a1 and the second electrode side connection portion 4b1 have a thickness of, for example, 0.05 (mm) to 0.08 (mm) in order to improve the bondability in spot welding. Preferably there is. When the first electrode side connection portion 4a1 and the second electrode side connection portion 4b1 are thick, it is necessary to increase the output of laser light, for example, at the time of spot welding. When the output is increased, the laser beam reaches the base electrode 3c of the pair of external electrodes 3 and melts the base electrode 3c, so that the welded portion 5 and the internal electrode 2 are easily short-circuited, and the reliability is lowered.

It is preferable that the thickness of the first substrate side connection portion 4a2 and the second substrate side connection portion 4b2 is larger than the thickness of the first electrode side connection portion 4a1 and the second electrode side connection portion 4b1. That is, the first electrode-side connection portion 4a1 and the second electrode-side connection portion 4b1 are improved in spot weldability by reducing the thickness, and the first substrate-side connection portion 4a2 and the second electrode-side connection portion 4a2 The board-side connection portion 4b2 is improved in bondability with the board 9 by increasing the thickness.

For example, the first external terminal 4a and the second external terminal 4b have rigidity when the thickness of the first electrode side connection portion 4a1 and the second electrode side connection portion 4b1 is less than 0.1 (mm). Get smaller. As a result, the multilayer capacitor 10A is likely to absorb the vibration caused by the distortion generated in the multilayer capacitor body 10 by the first external terminal 4a and the second external terminal 4b. In the multilayer capacitor 10 </ b> A, the deformation of the multilayer capacitor body 10 is not easily transmitted to the substrate 9, and the vibration sound of the substrate 9 is likely to be reduced. However, when mounted on the substrate 9, the mounting stability is deteriorated. In the first electrode side connection portion 4a1 and the second electrode side connection portion 4b1, the portions not joined to the pair of external electrodes 3 absorb vibration due to distortion.

Conversely, the first external terminal 4a and the second external terminal 4b are rigid when the thickness of the first electrode side connection portion 4a1 and the second electrode side connection portion 4b1 is greater than 0.15 (mm). Becomes larger. As a result, the multilayer capacitor 10A is less likely to be absorbed by the first external terminal 4a and the second external terminal 4b due to distortion generated in the multilayer capacitor body 10. In the multilayer capacitor 10A, the deformation of the multilayer capacitor body 10 is easily transmitted to the substrate 9, and the vibration noise of the substrate 9 is likely to increase. Therefore, in the multilayer capacitor 10A, the thickness of the first external terminal 4a and the second external terminal 4b is set in consideration of the effect of suppressing vibration noise generated in the substrate 9 and the mounting stability.

In addition, the first external terminal 4a and the second external terminal 4b are configured so that the length of the first electrode side connection portion 4a1 and the second electrode side connection portion 4b1 is the size or use of the multilayer capacitor body 10. Accordingly, it may be set appropriately so as to obtain an effect of suppressing vibration noise.

For example, the rigidity of the first external terminal 4a and the second external terminal 4b decreases as the length of the first electrode side connection portion 4a1 and the second electrode side connection portion 4b1 increases. Thereby, in the multilayer capacitor 10A, vibration due to distortion generated in the multilayer capacitor body 10 is easily absorbed by the first external terminal 4a and the second external terminal 4b, and the deformation of the multilayer capacitor body 10 is applied to the substrate 9. However, when mounted on the substrate 9, the mounting stability is deteriorated.

Conversely, the rigidity of the first external terminal 4a and the second external terminal 4b increases as the length of the first electrode side connection portion 4a1 and the second electrode side connection portion 4b1 decreases. Thereby, in the multilayer capacitor 10A, the vibration due to the distortion generated in the multilayer capacitor body 10 is hardly absorbed by the first external terminal 4a and the second external terminal 4b, and the deformation of the multilayer capacitor body 10 is applied to the substrate 9. It is easy to be transmitted, and the vibration sound of the substrate 9 is likely to increase. In the multilayer capacitor 10A, the lengths of the first external terminal 4a and the second external terminal 4b are set in consideration of the effect of suppressing vibration noise generated in the substrate 9 and the mounting stability.

As shown in FIGS. 6 and 7, the pair of external terminals 4 has a plating layer 7 formed on the surface for solder bonding to the substrate electrode 9 a and the substrate electrode 9 b, and the plating layer 7 formed on the surface Is included. Further, the plating layer 7 performs a masking process or the like on a region of the pair of external terminals 4 where the plating layer 7 is not formed. For example, by using an electrolytic plating method or the like, the first substrate side connection portion 4a2 and the second substrate 2 It is formed in a region including the substrate side connection portion 4b2, and is also formed in a region at the lower end portion of the first electrode side connection portion 4a1 and the second electrode side connection portion 4b1. Note that the plating layer 7 may be formed not only on both main surfaces of the pair of external terminals 4 but also on a side surface located between both main surfaces.

The plating layer 7 is composed of a first plating layer and a second plating layer formed on the surface of the first plating layer. The first plating layer includes the first external terminal 4a and the first plating layer. The surface of the second external terminal 4b is covered, and the second plating layer is formed on the surface of the first plating layer and covers the surface of the first plating layer. Each of the first plating layer and the second plating layer may be composed of a plurality of plating layers.

The first plating layer is made of, for example, a metal material such as nickel (Ni), silver (Ag), or tin (Sn), or an alloy material containing one or more of these metal materials, such as an Sn—Ag alloy. is there. For example, the first plating layer is made of a metal material of nickel (Ni) or an alloy material containing nickel (Ni) as a main component, and has a thickness of, for example, 1 (μm) to 2 (μm).

The second plating layer is made of, for example, a metal material such as nickel (Ni), silver (Ag), or tin (Sn), or an alloy material of, for example, Sn—Ag alloy containing one or more of these metal materials. It is. For example, the second plating layer is made of a metal material of tin (Sn) or an alloy material containing tin (Sn) as a main component, and has a thickness of, for example, 1 (μm) to 2 (μm).

The first external terminal 4a has a plating layer 7 formed on the first electrode side connection portion 4a1 and the first substrate side connection portion 4a2, and is laminated via solder 6 as shown in FIG. Similarly, the second external terminal 4b has the plating layer 7 of the second electrode side connection portion 4b1 and the second substrate side connection portion 4b2. The multilayer capacitor 10 </ b> A is mounted on the substrate 9 via the solder 6.

Thus, as shown in FIG. 5, the first external terminal 4a is connected to the substrate electrode 9a on the substrate 9 via the solder 6, and the solder 6 is connected to the first electrode side connection portion 4a1. A solder fillet is formed from the lower end portion to the first substrate side connection portion 4a2 and the substrate electrode 9a. Further, as shown in FIG. 5, the second external terminal 4b is connected to the substrate electrode 9b on the substrate 9 via the solder 6, and the solder 6 is connected to the lower end portion of the second electrode side connection portion 4b1. From this, the solder fillet is formed over the second substrate side connection portion 4b2 and the substrate electrode 9b. As the solder, for example, Sn—Sb or Sn—Ag—Cu solder material can be used.

In the multilayer capacitor, for example, when the multilayer capacitor main body is composed mainly of barium titanate (BaTiO ₃ ), etc. as a dielectric layer, when an AC voltage is applied to the multilayer capacitor main body, Due to the electrostrictive effect, distortion occurs in the dielectric layer in accordance with the magnitude of the AC voltage. In the multilayer capacitor, the distortion causes vibration in the multilayer capacitor body itself, and the vibration propagates to the substrate to vibrate the substrate. When this vibration is in an audible frequency band, the vibration of the substrate appears as vibration sound.

In such a multilayer capacitor, in order to improve the effect of suppressing vibration noise, the effect of suppressing vibration sound is improved by using a pair of external terminals, but the pair of external terminals is connected to a pair of external terminals via solder. The entire surface of the portion facing the electrode is joined to the external electrode, and it becomes difficult to further prevent the vibration of the multilayer capacitor body from propagating to the substrate 9.

However, in the multilayer capacitor 10A according to the first embodiment, the first external terminal 4a and the first external electrode 3a are joined to each other by the weld 5 at the first protrusion 4a3. The external terminal 4b and the second external electrode 3b are joined by the weld 5 at the second protrusion 4b3. In this way, the joint between the first external terminal 4a and the first external electrode 3a is in point contact, and the joint between the second external terminal 4b and the second external electrode 3b is in point contact. Therefore, the vibration of the multilayer capacitor main body 10 can be further prevented from propagating to the substrate 9. Here, the point contact means having a circular joint portion (welded portion 5) having a diameter of 30 (μm) to 50 (μm).

As described above, in the multilayer capacitor 10A, the first external terminal 4a and the first external electrode 3a are joined by point contact by the welded portion 5, and the first external terminal 4a is connected to the first external electrode 3a. Further, the second external terminal 4b and the second external electrode 4a are joined by point contact by the welded portion 5, and the second external terminal 4b is restrained by the second external electrode 3b. It becomes difficult to be done.

Therefore, in the multilayer capacitor 10A, vibration due to distortion of the multilayer capacitor body 10 is easily absorbed by the first external terminal 4a and the second external terminal 4b, and the vibration of the multilayer capacitor body 10 is absorbed by the first external terminal 4a. Propagation to the substrate 9 via the terminal 4a and the second external terminal 4b can be effectively suppressed. Thus, since the multilayer capacitor 10A suppresses the generation of vibration noise, it is difficult for noise to occur and the effect of suppressing vibration noise can be improved.

The first external terminal 4a has a first protruding portion 4a3 provided at an end in the Y direction of the first electrode side connecting portion 4a1, and the second external terminal 4b The protruding portion 4b3 is provided at the end portion in the Y direction of the second electrode side connecting portion 4b1. In addition, if it is an edge part of a Y direction, the position of a lamination direction (Z direction) will not be specifically limited. Thus, in the multilayer capacitor 10A, the first protruding portion 4a3 and the second protruding portion 4b3 are the central portions in the left-right direction (Y direction) of the first outer electrode 3a and the second outer electrode 3b, that is, Since the pair of external electrodes 3 are not located in the central portion in the direction orthogonal to the stacking direction of the multilayer body 1, the pair of external terminals 4 are formed at portions where deformation caused by the electrostrictive effect of the multilayer capacitor body 10 is smaller. And the pair of external electrodes 3 are joined together, so that noise can be effectively suppressed.

As shown in FIG. 1, the first projecting portion 4a3 and the second projecting portion 4b3 are not positioned at the center in the left-right direction (Y direction) of the first outer electrode 3a and the second outer electrode 3b. Furthermore, by being positioned at the center in the stacking direction (Z direction) of the stacked body 1, bonding can be performed in a region where vibration is small.

The first external terminal 4a is joined to the first external electrode 3a at the bottom of the first projecting portion 4a3, and the joining area of the welded portion 5 at the joint with the first external electrode 3a is reduced. In addition, the second external terminal 4b is joined to the second external electrode 3b at the bottom of the second protrusion 4b3, and the joint region of the welded portion 5 that is a joint with the second external electrode 3b. Can be reduced. Therefore, in the multilayer capacitor 10A, the first external terminal 4a is not easily restrained by the first external electrode 3a, and the first external terminal 4b is hardly restrained by the second external electrode 3b. Vibration due to distortion of the capacitor body 10 is easily absorbed. For example, in the case of laser spot welding, the size of the joining region can be adjusted by the beam diameter of the irradiated laser beam or the laser emission output.

The pair of external terminals 4 are joined only by the first protrusion 4a3 and the second protrusion 4b3, and the first external terminal 4a has a portion other than the first protrusion 4a3 through a gap. The second external terminal 4b is opposed to the first external electrode 3a, and the second external terminal 4b is opposed to the second external electrode 3b with a gap other than the second protrusion 4b3. Therefore, the pair of external terminals 4 are likely to be elastically deformed, and easily absorb the vibration of the multilayer capacitor body 10 along with the elastic deformation. Therefore, the multilayer capacitor 10A can suppress the generation of vibration noise on the substrate 9, so that it is difficult for noise to occur and the effect of suppressing vibration noise can be improved.

Here, an example of a manufacturing method of the multilayer capacitor 10A shown in FIG. 1 will be described below.

First, a method for manufacturing the multilayer capacitor body 10 will be described below.

Prepare a plurality of first and second ceramic green sheets. The first ceramic green sheet is to form the first internal electrode 2a, and the second ceramic green sheet is to form the second internal electrode 2b.

In order to form the first internal electrode 2a, the plurality of first ceramic green sheets have the first internal electrode 2a arranged so that the pattern shape of the first internal electrode 2a is arranged on the ceramic green sheet. A conductor paste layer is formed using a conductor paste for the first internal electrode 2a. In the first ceramic green sheet, a plurality of first internal electrodes 2 a are formed in one ceramic green sheet in order to obtain a large number of multilayer capacitor bodies 10.

Further, the plurality of second ceramic green sheets are formed so that the pattern shape of the second internal electrode 2b is arranged on the ceramic green sheet in order to form the second internal electrode 2b. A 2b conductor paste layer is formed using a conductor paste for the second internal electrode 2b. In the second ceramic green sheet, a plurality of second internal electrodes 2b are formed in one ceramic green sheet in order to obtain a large number of multilayer capacitor bodies 10.

The conductive paste layer of the first internal electrode 2a and the conductive paste layer of the second internal electrode 2b described above are each formed in a predetermined pattern shape on the ceramic green sheet by using, for example, a screen printing method or the like. It is formed by printing.

The first and second ceramic green sheets are dielectric layers, the conductive paste layer of the first internal electrode 2a is the first internal electrode 2a, and the conductive paste layer of the second internal electrode 2b is the second internal electrode 2a. It becomes the internal electrode 2b.

Examples of the material of the ceramic green sheet used as the dielectric layer include dielectric ceramics such as barium titanate (BaTiO ₃ ), calcium titanate (CaTiO ₃ ), strontium titanate (SrTiO ₃ ), or calcium zirconate (CaZrO ₃ ). Is the main component. For example, a Mn compound, Fe compound, Cr compound, Co compound, or Ni compound may be added as the accessory component.

The first and second ceramic green sheets are produced by adding a suitable organic solvent to the dielectric ceramic raw material powder and the organic binder and mixing them, and using a doctor blade method or the like. Obtained by molding.

The conductive paste for the first internal electrode 2a and the second internal electrode 2b is formed by adding additives (dielectric materials), binders, solvents, dispersants, etc. to the above-described conductive material (metal material) powders of the internal electrodes. It is produced by adding and kneading. The conductive material of the first and second

internal electrodes

2a, 2b is, for example, a metal material such as nickel (Ni), copper (Cu), silver (Ag), palladium (Pd) or gold (Au), or these metal materials For example, an alloy material such as an Ag—Pd alloy is included. The first internal electrode 2a and the second internal electrode 2b are preferably formed of the same metal material or alloy material.

The first ceramic green sheet is formed with a first internal electrode 2a, and the second ceramic green sheet is formed with a second internal electrode 2b. A plurality of the ceramic green sheets 2 are alternately stacked, and the ceramic green sheets not formed with the internal electrodes are stacked on the outermost layer in the stacking direction, thereby manufacturing a stacked body made of the ceramic material.

As described above, the laminated body composed of the plurality of first and second ceramic green sheets is pressed and integrated to form a large-sized raw laminated body including a large number of raw laminated bodies. By cutting this large green laminate, a green laminate that becomes the laminate 1 of the multilayer capacitor 10 shown in FIG. 1 can be obtained. The large green laminate can be cut using, for example, a dicing blade.

The laminate 1 can be obtained by firing the green laminate at, for example, 800 (° C.) to 1300 (° C.). By this step, the plurality of first and second ceramic green sheets become dielectric layers, the conductive paste layer of the first internal electrode 2a becomes the first internal electrode 2a, and the conductive paste layer of the second internal electrode 2b Becomes the second internal electrode 2b. Moreover, the laminated body 1 can round a corner | angular part or a side part using grinding | polishing means, such as barrel grinding | polishing, for example. The laminated body 1 becomes a thing which a corner | angular part or a side part cannot be easily chipped by rounding a corner | angular part or a side part.

Next, the base electrode 3c of the external electrode 3 is applied to the first end face 1c and the second end face 1d of the multilayer body 1 by applying and baking a conductive paste for the base electrode 3c to be the base electrode 3c of the external electrode 3. Form.

The conductive paste for the base electrode 3c is prepared by adding a binder, a solvent, a dispersant, and the like to the metal material powder constituting the base electrode 3c and kneading. Note that the conductive material of the base electrode includes, for example, a metal material such as nickel (Ni), copper (Cu), silver (Ag), palladium (Pd), or gold (Au), or one or more of these metal materials. For example, an alloy material such as an Ag—Pd alloy. Further, as a method for forming the base electrode 3c, a thin film forming method such as a vapor deposition method, a plating method, or a sputtering method may be used in addition to the method of baking the conductor paste.

Next, a plating layer 3d is formed on the surface of the base electrode 3c so as to cover the base electrode 3c of the external electrode 3. The plating layer 3d is formed on the surface of the base electrode 3c using, for example, an electrolytic plating method or the like. The plating layer 3d is, for example, a nickel (Ni) plating layer, a copper (Cu) plating layer, a gold (Au) plating layer, a tin (Sn) plating layer, or the like. The plating layer 3d may be formed from a single plating layer. In the multilayer capacitor main body 10, the plating layer 3d is composed of a first plating layer 3d1 and a second plating layer 3d2, and these multilayer bodies are formed on the surface. For example, in the multilayer capacitor body 10, the first plating layer 3d1 is a nickel (Ni) plating layer, the second plating layer 3d2 is a tin (Sn) plating layer, and the second plating layer 3d2 has a tin ( The Sn) plating layer is formed so as to cover the nickel (Ni) plating layer of the first plating layer 3d1.

Next, an example of a method for manufacturing the multilayer capacitor 10A will be described below with reference to FIGS.

First, an example of a method for manufacturing the pair of external terminals 4 will be described. One strip-shaped metal plate is prepared. The band-shaped metal plate has a thickness of, for example, 0.1 (mm) to 0.15 (mm), a length of, for example, 100 (mm) to 250 (mm), and is made of, for example, a stainless alloy.

For example, as shown in FIG. 6A, the first external terminal 4aa serving as the first external terminal 4a and the second external terminal 4bb serving as the second external terminal 4b are arranged to face each other. Then, according to the pattern shape of each of the first external terminal 4aa and the first external terminal 4bb, for example, a punching process is performed on the band-shaped metal plate using a press punching process. In this way, the strip-shaped metal plate is punched, and as shown in FIG. 6A, the strip-shaped metal plate has a pair of external terminals composed of the first external terminal 4aa and the second external terminal 4bb. A plurality of 8a are provided. In the following description, a strip-shaped metal plate formed with a plurality of external terminal bodies 8a is used as the lead frame 8. As described above, the plurality of multilayer capacitors 10 </ b> A can be efficiently manufactured by using the lead frame 8.

The first protrusion 4a3 and the second protrusion 4b3 are formed in the first electrode side connection part 4a1 and the second electrode side connection part 4b1 by deep drawing using, for example, pressing. be able to.

The lead frame 8 is formed with a plating layer 7 by plating the plurality of external terminal pairs 8a. The lead frame 8 is subjected to plating by masking a non-formation region of the plating layer 7 in the central portion in the longitudinal direction. As shown in FIG. 6A, the external terminal pair 8a includes a region including the first electrode-side connection portion 4a1 and the first substrate-side connection portion 4a2 of the first external terminal 4aa and the second substrate-side connection portion 4a2. The plating layer 7 is formed in the region including the second electrode side connection portion 4b1 and the second substrate side connection portion 4b2 of the external terminal 4bb by using, for example, an electrolytic plating method. The plating layer 7 is formed in a region including the front surface, the back surface, and the side surface of the external terminal pair 8a. The masking can be performed using, for example, a low hardness rubber sheet or the like.

In the above-described processing, the lead frame 8 is subjected to a plating process after being punched. However, the lead frame 8 may be subjected to a punching process after being plated. The processing order is appropriately set in consideration of the shape of the first external terminal 4aa and the second external terminal 4bb.

As shown in FIG. 1, the first external terminal 4aa and the second external terminal 4bb are connected to the boundary between the first electrode side connection portion 4a1 and the first substrate side connection portion 4a2, and to the second electrode side connection. In order to obtain a structure having a bent portion at the boundary between the portion 4b1 and the second substrate side connecting portion 4b2, the lead frame 8 includes a first fold line L1 and a second fold line L1, as shown in FIG. The folding line L2 is set, and the bending process is performed along the first folding line L1 and the second folding line L2. Specifically, the lead frame 8 is set with a first fold line L1 and a second fold line L2. The first fold line L1 is set at the boundary between the first electrode side connection portion 4a1 and the first substrate side connection portion 4a2, and the second fold line L2 is set between the second electrode side connection portion 4b1 and the second electrode side connection portion 4b1. Is set at the boundary with the board-side connecting portion 4b2. In addition, the 1st bending line L1 and the 2nd bending line L2 are shown by the dotted line in Fig.6 (a).

As shown in FIG. 6B, the bending process is performed by bending the first electrode side connection portion 4a1 upward with respect to the first bend line L1, and the first electrode side connection portion 4a1. The boundary portion with the first substrate side connection portion 4a2 is bent at a substantially right angle, and the second electrode side connection portion 4b1 is bent upward with respect to the second bending line L2, and the second A boundary portion between the electrode side connection portion 4b1 and the second substrate side connection portion 4b2 is bent at a substantially right angle.

In this way, by using a bending process for the lead frame 8, as shown in FIG. 6B, the first external terminal 4aa is connected to the first electrode side connecting portion 4a1 and the first substrate side. The second external terminal 4bb is bent between the second electrode side connection portion 4b1 and the second substrate side connection portion 4b2 and has a structure having a bent portion (bending portion) between the connection portion 4a2. It becomes a structure which has a part (bending part). The first external terminal 4aa and the second external terminal 4bb are bent so as to have a bent portion at a substantially right angle. The bending process is performed on the first fold line L1 and the second fold line L2 using, for example, a bending die that matches the shape of the bent portion.

Next, as shown in FIG. 7A, for example, using an automatic mounting machine equipped with a suction nozzle, the first external terminal 4aa and the second external terminal 4bb which are bent are stacked. A capacitor body 10 is mounted. Then, after mounting the multilayer capacitor main body 10, the first external terminal 4aa and the first external electrode 3a are applied to the first protrusion 4a3 and the second protrusion 4b3 by using, for example, laser spot welding. And the second external terminal 4bb and the second external electrode 3b are joined by the welded portion 5.

In this case, the first external terminal 4aa has the first projecting portion 4a3 in contact with the first external electrode 3a and joined by the welded portion 5, and the second external terminal 4bb It is preferable that the protruding portion 4b3 contacts the second external electrode 3b and is joined by the welded portion 5. Thus, by joining the pair of external electrodes 3 and the pair of external terminals 4 with the welded portion 5, the joining process is greatly simplified, and the process is excellent in mass productivity.

In addition, since the pair of external electrodes 3 and the pair of external terminals 4 are welded, soldering is not necessary, and the multilayer capacitor 10A has a joint (welded portion) between the pair of external electrodes 3 and the pair of external terminals 4. 5) is less affected by the soldering temperature when mounted on the substrate 9, and the deterioration of reliability is suppressed.

In the multilayer capacitor, for example, when the peripheral portions of the first protrusion 4a3 and the second protrusion 4b3 and the pair of external electrodes 3 are joined via solder, the solder easily flows downward. Therefore, sufficient bondability cannot be ensured. On the other hand, the multilayer capacitor 10A includes a pair of external electrodes 3 and the first protrusions 4a3 and 4a3 by welding the first protrusions 4a3 and the second protrusions 4b3 and the pair of external electrodes 3 by welding. The second protrusion 4a3 can be reliably joined.

Further, the welding joint is spot welding such as arc spot welding or laser spot welding. In laser spot welding, for example, an energy beam such as a YAG laser is spot-irradiated to the first protrusion 4a3 and the second protrusion 4b3, and the first protrusion 4a3 and the first external electrode 3a are irradiated. And the second projecting portion 4b3 and the second external electrode 3b are joined together. By irradiating the first protrusion 4a3 and the second protrusion 4b3 with an energy beam in a spot manner, the first protrusion 4a3 and the second protrusion 4b3 are locally heated, for example, When the melting temperature of the stainless alloy of the pair of external terminals 4 reaches 1400 (° C.) to 1450 (° C.), the first protrusion 4a3 and the second protrusion 4b3 and the pair of external electrodes 3 are melted, The first protrusion 4a3 and the second protrusion 4b3 are joined to the pair of external electrodes 3.

In the multilayer capacitor 10A, when a nickel (Ni) plating layer is used for the plating layer 3d of the pair of external electrodes 3 and a stainless alloy is used for the pair of external terminals 4, the nickel (Ni) plating layer and the stainless alloy are melted. The temperatures are similar, and the bondability between the pair of external terminals 4 and the pair of external electrodes 3 can be improved. As described above, the multilayer capacitor 10A has similar melting temperatures to the plating layer 3d of the pair of external electrodes 3 and the pair of external terminals 4 in joining the pair of external electrodes 3 and the pair of external terminals 4. By using the material, it becomes easy to control the joining region of the welded portion 5.

In this way, the multilayer capacitor body 10 uses the spot welding to join the first external terminal 4aa to the first external electrode 3a by the weld 5 and the second external terminal 4bb to the first external terminal 4bb. The two external electrodes 3b are joined by the welded portion 5.

Next, as shown in FIG. 7A, the lead frame 8 has the first cutting line S1 and the second cutting line S2, and the first cutting line S1 and the second cutting line S2. Is cut. For example, the external terminal pair 8 a on which the multilayer capacitor main body 10 is mounted is separated from the lead frame 8 using a cutting die. As a result, a plurality of multilayer capacitors 10A are obtained from the lead frame 8, as shown in FIG. The first cutting line S1 and the second cutting line S2 are indicated by dotted lines in FIG.

As described above, by using the lead frame 8, the multilayer capacitor 10A shown in FIG. 1 can be efficiently manufactured. In the multilayer capacitor 10A, the pair of external terminals 4 are joined to the pair of external electrodes 3 by welding, and the pair of external terminals 4 are heated by soldering the multilayer capacitor 10A onto the substrate 9. Can be prevented from separating from the pair of external electrodes 3.

The present invention is not limited to the multilayer capacitor 10A of the first embodiment described above, and various modifications and improvements can be made without departing from the scope of the present invention. Hereinafter, other embodiments will be described. Note that, among the multilayer capacitors according to other embodiments, the same portions as those of the multilayer capacitor 10A according to the first embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

<Embodiment 2>
Hereinafter, the multilayer capacitor 10B according to the second embodiment of the present invention will be described with reference to the drawings.

In the multilayer capacitor 10B, as shown in FIG. 8, the pair of external terminals 40 includes a first external terminal 4A and a second external terminal 4B, and the first external terminal 4A is a first board-side connection portion. 4a2 is arranged from the first electrode side connection portion 4a1 toward the laminated body 1 side, and the second external terminal 4B has the second substrate side connection portion 4b2 as the second electrode side connection portion. It arrange | positions toward the laminated body 1 side from 4b1. In this way, the pair of external terminals 40 has the end portion of the first board side connection portion 4a2 and the end portion of the second board side connection portion 4b2 facing each other below the multilayer capacitor body 10, and The first board-side connecting portion 4a2 and the second board-side connecting portion 4b2 face the second main surface 1b of the multilayer capacitor body 10, respectively. The multilayer capacitor 10B is different from the multilayer capacitor 10A according to the first embodiment in that the first substrate-side connection portion 4a2 of the first external terminal 4A and the second substrate-side connection portion 4b2 of the second external terminal 4B. The first substrate side connecting portion 4a2 is arranged from the first electrode side connecting portion 4a1 toward the laminated body 1 side, and the second substrate side connecting portion 4b2 is the second electrode. It arrange | positions toward the laminated body 1 side from the side connection part 4b1.

Further, as shown in FIG. 8, the first external terminal 4A has the first extending portion 4a4 at the end of the first electrode side connecting portion 4a1 opposite to the first substrate side connecting portion 4a2. In the second external terminal 4B, the second extending portion 4b4 is provided at the end of the second electrode side connecting portion 4b1 opposite to the second substrate side connecting portion 4b2. . When the first external terminal 4A and the second external terminal 4B are manufactured using a lead frame 8A described later, the first extension portion 4a4 is formed in the first electrode side connection portion 4a1. The second extending portion 4b4 may be formed in the second electrode side connecting portion 4a1. Moreover, the 1st extension part 4a4 and the 2nd extension part 4b4 do not need to be formed.

As shown in FIG. 8, the first external terminal 4A has a first electrode side connection portion 4a1 and a first substrate side connection portion 4a2. Similarly to the first external terminal 4a, the first electrode-side connecting portion 4a1 is disposed to face the first external electrode 3a and is joined to the first external electrode 3a and the first external electrode. It extends below 3a. The first substrate-side connection portion 4a2 is disposed at the end of the portion where the first electrode-side connection portion 4a1 extends so as to be orthogonal to the first electrode-side connection portion 4a1. The first substrate side connection portion 4a2 is arranged in a substantially vertical direction toward the laminated body 1 with respect to the first electrode side connection portion 4a1. The first electrode side connection portion 4a1 is disposed to face the first external electrode 3a, is disposed on the first end face 1c side, and is joined to the first external electrode 3a. The first substrate side connection portion 4a2 is provided so as to face the substrate 9 on which the multilayer capacitor 10B is mounted, and is electrically connected to the substrate electrode 9a.

Further, the first external terminal 4A has the first electrode side connection portion 4a1 opposed to the first external electrode 3a with a gap, and has the first protrusion 4a3. The protruding portion 4a3 protrudes toward the first external electrode 3a. The first protrusion 4a3 and the first external electrode 3a are joined using, for example, solder joining or welding. The first projecting portion 4a3 is provided in the first electrode side connecting portion 4a1 by using, for example, a press working method.

The first external terminal 4A is joined to the first external electrode 3a at the first protrusion 4a3 by using, for example, spot welding. That is, by welding the first external electrode 3a and the first protruding portion 4a3, as shown in FIG. 9, the welded portion 5 is formed, and the first external electrode 3a and the first protruding portion are formed. 4a3 is joined. In addition, the first external terminal 4A is joined to the first external electrode 3a only by the first protrusion 4a3, and the portions other than the first protrusion 4a3 are connected to the first external electrode 3a via a gap. Opposite to. In addition, the first external terminal A may be melt-bonded with the first protruding portion 4a3 coming into contact with the first external electrode 3a in order to ensure the bonding strength with the first external electrode 3a. preferable.

As shown in FIG. 8, the first external terminal 4B has a second electrode side connection portion 4b1 and a second substrate side connection portion 4b2. Similar to the first external terminal 4b, the second electrode-side connecting portion 4b1 is disposed so as to face the second external electrode 3b and is joined to the second external electrode 3b and the second external electrode. It extends below 3b. The second substrate-side connection portion 4b2 is disposed at the end of the portion where the second electrode-side connection portion 4b1 extends so as to be orthogonal to the second electrode-side connection portion 4b1. The second substrate side connection portion 4b2 is disposed in a substantially vertical direction toward the laminate 1 with respect to the second electrode side connection portion 4b1. The second electrode side connection portion 4b1 is disposed to face the second external electrode 3b, is disposed on the second end face 1d side, and is joined to the second external electrode 3b. The second substrate side connection portion 4b2 is provided so as to face the substrate 9 on which the multilayer capacitor 10B is mounted, and is electrically connected to the substrate electrode 9b.

The second external terminal 4B has the second electrode-side connecting portion 4b1 facing the second external electrode 3b with a gap, and has the first protruding portion 4a3. The protruding portion 4b3 protrudes toward the second external electrode 3b. The first protrusion 4a3 and the first external electrode 3a are joined using, for example, solder joining or welding. The second protruding portion 4b3 is provided in the second electrode side connecting portion 4b1, for example, using a press working method.

The second external terminal 4B is joined to the second external electrode 3b at the second protrusion 4b3 using, for example, spot welding. That is, the second external electrode 3b and the second protrusion 4b3 are welded to form a weld 5 as shown in FIG. 9, and the second external electrode 3b and the second protrusion are formed. 4b3 is joined. Further, the second external terminal 4B is joined to the second external electrode 3b only by the first protrusion 4b3, and the second external electrode 3b is interposed through a gap at a portion other than the second protrusion 4b3. Opposite to. Further, the first external terminal A is preferably joined with the first protruding portion 4a3 being in contact with the first external electrode 3a in order to ensure the bonding strength with the second external electrode 3b. .

As shown in FIG. 10, in the first external terminal 4A, the first substrate side connection portion 4a2 is connected to the substrate electrode 9a of the substrate 9, and the first electrode side connection portion 4a1 is connected to the first external electrode 3a. The second external terminal 4B is formed symmetrically with the first external terminal 4A, the second substrate side connection portion 4b2 is connected to the substrate electrode 9b of the substrate 9, and the second external terminal 4B is connected to the substrate electrode 9b of the substrate 9. The electrode side connection portion 4b1 is connected to the second external electrode 3b. The multilayer capacitor 10B is provided on the first external electrode 3a so that the first external terminal 4A is separated from the surface of the substrate 9, and the second external terminal 4B is laminated from the surface of the substrate 9. The capacitor body 10 is provided on the second external electrode 3b so as to be separated.

The first substrate side connection portion 4a2 faces the multilayer capacitor main body 10, is provided so as to be substantially parallel to the substrate 9, and is laminated at the boundary with the first electrode side connection portion 4a1. The capacitor body 10 is bent inward toward the center. The first substrate-side connection portion 4b2 faces the multilayer capacitor body 10 and is provided so as to be substantially parallel to the substrate 9, and at the boundary with the first electrode-side connection portion 4b1. The multilayer capacitor body 10 is bent inwardly toward the center.

As described above, the multilayer capacitor 10B includes the first substrate-side external connection portion 4a2 that is bent at a substantially right angle inside the multilayer capacitor body 10 with respect to the first electrode-side connection portion 4a1. The connection portion 4a1 is provided so as to extend toward the central portion of the multilayer capacitor body 10, and the second substrate side connection portion 4b2 is provided with respect to the second electrode side connection portion 4b1. Is bent at a substantially right angle to extend from the second electrode side connection portion 4b1 toward the center of the multilayer capacitor body 10.

Therefore, the multilayer capacitor 10B can shorten the distance between the first substrate side connection portion 4a2 and the second substrate side connection portion 4b2 in the X direction. The substantially right angle means an angle formed between the first electrode side connection portion 4a1 and the first substrate side connection portion 4a2 and an angle formed between the second electrode side connection portion 4b1 and the second substrate side connection portion 4b2. Is in the range of 85 (°) to 95 (°). As described above, the first external terminal 4A and the second external terminal 4B are side-viewed from the direction (Y direction) orthogonal to the first side surface 1e or the second side surface 1f, and the side surfaces are L-shaped. And a single plate-like body bent at a substantially right angle.

As described above, the multilayer capacitor 10B includes a multilayer capacitor such that the first substrate side connection portion 4a2 and the second substrate side connection portion 4b2 are positioned below the multilayer capacitor body 10 as shown in FIG. It is provided so as to bend inside the main body 10 (center side), and the vibration of the substrate 9 is suppressed, making it difficult for noise to occur, and the effect of suppressing vibration noise can be improved. Since the length can be shortened, the mounting area is reduced and high-density mounting is possible. Also, the multilayer capacitor 10B is different from the multilayer capacitor 10A of the first embodiment in that the first substrate-side connection portion 4a2 and the second substrate-side connection portion 4b2 are located on the inner side (center side) of the multilayer capacitor body 10. ), The length in the X direction is shortened by the amount bent.

Here, an example of a method for manufacturing the multilayer capacitor 10B will be described below with reference to FIGS.

First, an example of a method for manufacturing the pair of external terminals 40 will be described. One strip-shaped metal plate is prepared. The band-shaped metal plate has a thickness of, for example, 0.1 (mm) to 0.15 (mm), a length of, for example, 100 (mm) to 250 (mm), and is made of, for example, a stainless alloy.

For example, as shown in FIG. 11A, the first external terminal 4Aa to be the first external terminal 4A and the second external terminal 4Bb to be the second external terminal 4B are arranged to face each other. Then, in accordance with the pattern shapes of the first external terminal 4A and the first external terminal 4B, for example, a punching process is performed on the band-shaped metal plate using a press punching process. In this way, the strip metal plate is punched, and as shown in FIG. 10A, the strip metal plate is formed of the first external terminal 4Aa and the second external terminal 4Bb. A plurality of terminal pairs 8a are provided. In the following description, a strip metal plate having a plurality of external terminal bodies 8a is used as the lead frame 8A. Thus, the plurality of multilayer capacitors 10B can be efficiently manufactured by using the lead frame 8A.

In the lead frame 8A, the plating layer 7 is formed by plating the plurality of external terminal pairs 8a. The lead frame 8A performs plating by masking the non-formation region of the plating layer 7 in the central portion in the longitudinal direction. As shown in FIG. 11A, the external terminal pair 8a (the first external terminal 4Aa and the second external terminal 4Bb) is connected to the first board-side connecting portion 4a2 of the first external terminal 4Aa. For example, an electrolytic plating method is used for the region including the first electrode side connection portion 4a1 and the region including the second substrate side connection portion 4b2 and the second electrode side connection portion 4b1 of the second external terminal 4Bb. Then, the plating layer 7 is formed. The plating layer 7 is formed in a region including the front surface, the back surface, and the side surface of the external terminal pair 8a. The masking can be performed using, for example, a low hardness rubber sheet or the like.

In the above description, the plating is performed after the lead frame 8A is punched, but the punching may be performed after the lead frame 8A is plated. The processing order is appropriately set in consideration of the shape of the terminal 40 and the like.

As shown in FIG. 8, the first external terminal 4Aa and the second external terminal 4Bb are connected to the boundary between the first electrode side connection portion 4a1 and the first substrate side connection portion 4a2 and to the second electrode side connection. As shown in FIG. 11 (a), the lead frame 8A has a structure having a bent portion at the boundary between the portion 4b1 and the second substrate side connecting portion 4b2, as shown in FIG. To L6 are set, and bending is performed along the first to fourth folding lines L3 to L6. Specifically, the first fold line L3 to the fourth fold line L4 are set in the lead frame 8A. The first fold line L3 is set at the boundary between the first electrode side connection portion 4a1 and the first substrate side connection portion 4a2, and the second fold line L4 is set to the second electrode side connection portion 4b1 and the second side. Is set at the boundary with the board-side connecting portion 4b2. The third fold line L5 is set at the boundary between the first electrode side connection portion 4a1 and the first extension portion 4a4, and the fourth fold line L6 is connected to the second electrode side connection portion 4b1. 2 is set at the boundary with the extended portion 4b4. Note that the first fold line L3 to the fourth fold line L6 are indicated by dotted lines in FIG.

In the bending process, as shown in FIG. 11B, the first substrate side connection portion 4a2 is bent upward with respect to the first bend line L3, and the first electrode side connection portion 4a1 The second electrode side connection is formed by bending the boundary portion with the first substrate side connection portion 4a2 at a substantially right angle and bending the second substrate side connection portion 4b2 upward with respect to the second fold line L3. The boundary portion between the portion 4b1 and the second substrate side connection portion 4b2 is bent at a substantially right angle.

Then, the first electrode-side connection portion 4a1 is bent downward with respect to the third fold line L5, and the boundary portion between the first electrode-side connection portion 4a1 and the first extension portion 4a4 is made substantially perpendicular. The second electrode side connection portion 4b1 is bent downward with respect to the fourth bend line L6, and the boundary portion between the second electrode side connection portion 4b1 and the second extension portion 4b4 is made substantially perpendicular. Bend it.

In this way, by using a bending process for the lead frame 8A, as shown in FIG. 7, the first external terminal 4Aa is connected to the first electrode side connection portion 4a1 and the first substrate side connection portion 4a2. Between the first electrode side connecting portion 4a1 and the first extending portion 4a4, and the second external terminal 4Bb is connected to the second electrode side. The structure has a bent portion (bent portion) between the connection portion 4b1 and the first substrate side connection portion 4b2 and between the second electrode side connection portion 4b1 and the second extension portion 4b4. The first external terminal 4Aa and the second external terminal 4Bb have substantially right-angled bent portions. The bending process is performed on the first folding line L3 and the second folding line L4, and the folding process is performed on the third folding line L5 and the fourth folding line L6. This is done by using a bending die that matches the shape of.

Next, as shown in FIG. 12A, the lead frame 8A has a pair of external terminals 8a (first external terminal 4Aa and second external terminal 4Bb) bent and includes, for example, a suction nozzle. The multilayer capacitor body 10 is mounted between the bent first external terminal 4Aa and the second external terminal 4Bb using an automatic mounting machine. Then, after mounting the multilayer capacitor body 10, the first external terminal 4Aa and the first external electrode 3a are applied to the first protrusion 4a3 and the second protrusion 4b3 by using, for example, laser spot welding. And the second external terminal 4Bb and the second external electrode 3b are joined by the welded portion 5. In this case, the first external terminal 4Aa is joined by the welded portion 5 with the first protruding portion 4a3 contacting the first external electrode 3a, and the second external terminal 4Bb is connected to the first external terminal 4Aa. It is preferable that the protruding portion 4b3 contacts the second external electrode 3b and is joined by the welded portion 5. In this way, by joining the pair of external electrodes 3 and the pair of external terminals 40 with the welded portion 5, the joining process is greatly simplified, and the process is excellent in mass productivity.

In addition, since the pair of external electrodes 3 and the pair of external terminals 40 are welded, solder joining is not necessary, and the multilayer capacitor 10B has a joint portion (welded portion) between the pair of external electrodes 3 and the pair of external terminals 40. 5) is less affected by the soldering temperature when mounted on the substrate 9, and the deterioration of reliability is suppressed.

In this way, in the multilayer capacitor body 10B, by using spot welding, the first external terminal 4Aa is joined to the first external electrode 3a by the welding portion 5, and the second external terminal 4Bb is welded. The portion 5 is joined to the second external electrode 3b.

Next, as shown in FIG. 12A, in the lead frame 8A, the first cutting line S3 and the second cutting line S4 are set, and the first cutting line S3 and the second cutting line S4 are set. Is cut. For example, the lead frame 8A is separated from the lead frame 8A by using a cutting die in which the external terminal pair 8a on which the multilayer capacitor body 10 is mounted. As a result, as shown in FIG. 12B, a plurality of multilayer capacitors 10B are obtained from the lead frame 8A. The first cutting line S3 and the second cutting line S4 are indicated by dotted lines in FIG.

As described above, the multilayer capacitor 10B shown in FIG. 8 can be efficiently manufactured by using the lead frame 8A. In the multilayer capacitor 10B, a pair of external terminals 40 are joined to the pair of external electrodes 3 by welding, and the pair of external terminals 40 are heated by soldering the multilayer capacitor 10B on the substrate 9. Can be prevented from separating from the pair of external electrodes 3.

The present invention is not particularly limited to Embodiment 1 and Embodiment 2 described above, and various modifications and improvements can be made within the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Laminate 1a 1st main surface 1b 2nd main surface 1c 1st end surface 1d 2nd end surface 1e 1st side surface 1f 2nd side surface 2 Internal electrode 2a 1st internal electrode 2b 2nd internal electrode 3 external electrode 3a first external electrode 3b second external electrode 3c ground electrode 3d plating layer 3d1 first plating layer 3d2 second plating layer 4

external terminal

4a, 4A first external terminal 4a1 first substrate side Connection part 4a2 1st electrode side connection part 4a3

1st protrusion part

4b, 4B 2nd external terminal 4b1 2nd board | substrate side connection part 4b2 2nd electrode side connection part 4b3 2nd protrusion part 5 Welding part 6 Solder 7

Plating layer

8, 8A Lead frame 8a External terminal pair 9

Substrate

9a,

9b Substrate electrode

9c, 9d Wiring 10 Multilayer capacitor

main body

10A, 10B Multilayer capacitor L1-L6 Bending line S1-S4 Cutting line

Claims

A plurality of dielectric layers are laminated, and a rectangular parallelepiped laminate having a first end face and a second end face facing each other, and an interval in the lamination direction of the plurality of dielectric layers in the laminate. A plurality of arranged internal electrodes, and a first external electrode and a second external electrode arranged on the first end face and the second end face, respectively, and electrically connected to the different internal electrodes An electrode, and a pair of external terminals respectively joined to the first external electrode and the second external electrode;
The pair of external terminals are arranged opposite to the first external electrode, joined to the first external electrode, and extended below the first external electrode. And a first substrate-side connection portion disposed so as to be orthogonal to the first electrode-side connection portion at an end portion of the portion extending from the first electrode-side connection portion. An external terminal, a second electrode-side connecting portion disposed opposite to the second external electrode and joined to the second external electrode and extending below the second external electrode; and A second external terminal having a second substrate-side connection portion disposed at an end of the extending portion of the second electrode-side connection portion so as to be orthogonal to the second electrode-side connection portion; Contains
The first external terminal includes a first projecting portion in which the first electrode side connection portion faces the first external electrode with a gap and projects toward the first external electrode side. And the first projecting portion and the first external electrode are joined, and the second external terminal is connected to the second external electrode by the second electrode side connecting portion. The second projecting portion projecting toward the second external electrode side with a gap therebetween and the second projecting portion and the second external electrode are joined to each other. A multilayer capacitor characterized by comprising:
In the first external terminal, the first protruding portion and the first external electrode are joined by a welding portion, and the second external terminal is connected to the first protruding portion and the second external terminal. The multilayer capacitor according to claim 1, wherein the external electrode is joined by a welded portion.
The first substrate-side connection portion is disposed from the first electrode-side connection portion toward the opposite side of the stacked body, and the second substrate-side connection portion is the second electrode-side connection. 3. The multilayer capacitor according to claim 1, wherein the multilayer capacitor is disposed from a portion toward the opposite side of the multilayer body.
The first substrate-side connection portion is disposed from the first electrode-side connection portion toward the laminated body, and the second substrate-side connection portion is the second electrode-side connection portion. The multilayer capacitor according to claim 1, wherein the multilayer capacitor is disposed toward the side of the multilayer body.
The first projecting portion and the second projecting portion are not located in a central portion in a direction perpendicular to the stacking direction of the stacked body of the first external electrode and the second external electrode. The multilayer capacitor according to any one of claims 1 to 4, wherein the multilayer capacitor is characterized in that:
The first projecting portion and the second projecting portion are located in a central portion of the first external electrode and the second external electrode in the stacking direction of the stacked body. The multilayer capacitor according to any one of claims 1 to 5.
A plurality of the first protrusions are located in the first diagonal direction of the first end face, and the second protrusions intersect the first diagonal direction of the second end face. The multilayer capacitor according to claim 1, wherein a plurality of capacitors are located in the second diagonal direction.