WO2016078300A1 - 显示面板及其封装方法 - Google Patents

显示面板及其封装方法 Download PDF

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Publication number
WO2016078300A1
WO2016078300A1 PCT/CN2015/076422 CN2015076422W WO2016078300A1 WO 2016078300 A1 WO2016078300 A1 WO 2016078300A1 CN 2015076422 W CN2015076422 W CN 2015076422W WO 2016078300 A1 WO2016078300 A1 WO 2016078300A1
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WIPO (PCT)
Prior art keywords
substrate
adsorption layer
display panel
electromagnet
sealing material
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PCT/CN2015/076422
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English (en)
French (fr)
Inventor
高昕伟
王丹
洪瑞
孔超
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京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to EP15839057.5A priority Critical patent/EP3223331B1/en
Priority to US14/891,915 priority patent/US9660215B2/en
Publication of WO2016078300A1 publication Critical patent/WO2016078300A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a display panel and a packaging method thereof.
  • LED (Light Emitting Diode) display panels are mainly packaged with frit.
  • 1 is a schematic cross-sectional view of a conventional LED display panel.
  • the first substrate 1 and the second substrate 2 are packaged together by a sealing material 3 (for example, a frit), wherein the second substrate 2 is provided with a light emitting unit 4.
  • the solid sealing material 3 is irradiated with a laser to melt it, and after the sealing material 3 is cured again, the first substrate 1 and the second substrate 2 can be packaged together.
  • the laser can only irradiate the local sealing material 3 at a time, and the partial sealing material 3 is melted, a stress release phenomenon occurs between the first substrate 1 and the second substrate 2, and the released stress easily separates the two. As a result, the sealing material 3 cannot effectively encapsulate the first substrate 1 and the second substrate 2, thereby causing a problem of poor packaging.
  • one solution in the prior art is to provide a heat-expanded layer and other interlayers on the outer side of the first substrate 1 (ie, the side facing away from the second substrate 2), when the sealing material 3 is irradiated with laser light.
  • the generated heat is simultaneously transferred to the heat-expanded layer, and the heat-expanded layer is expanded by being heated, thereby pressing the first substrate 1 on the second substrate 2 to prevent separation of the two due to stress release.
  • this method needs to keep the laser from being irradiated from the bottom to the top (ie, from the second substrate 2 to the first substrate 1), which is inconvenient to operate, and at the same time, since the heat-expanded layer is generally made of an organic polymer material or an elastic rubber material. It is easy to cause environmental pollution.
  • Another solution in the prior art is to add a pressure plate assembly on the outer side of the first substrate 1 and the second substrate 2 to provide a clamping force for the first substrate 1 and the second substrate 2, and at the same time, a sensor induction pressure plate assembly is provided.
  • the magnitude of the pressure between the two is to prevent the sealing effect from being too small due to the clamping force being too small, or to damage the device due to excessive clamping force, thereby improving the package quality.
  • the distance between the first substrate 1 and the second substrate 2 is very small (usually below 20 ⁇ m), it is difficult for the sensor to effectively sense the platen assembly.
  • the magnitude of the pressure between them, and how to achieve effective integration of the sensor and the two substrates is also a problem.
  • a display panel includes a first substrate and a second substrate disposed opposite to each other, and the first substrate and the second substrate are packaged by a sealing material
  • one of the first substrate and the second substrate is provided with a first adsorption layer
  • the other is provided with a second adsorption layer
  • the first The adsorption layer and the second adsorption layer can be attracted to each other by magnetic force.
  • the first adsorption layer may be made of a ferromagnetic material, and the second adsorption layer may include an electromagnet.
  • the first adsorption layer may be disposed on a side of the first substrate opposite to the second substrate or on a side of the second substrate opposite to the first substrate.
  • the first adsorption layer may include a portion disposed outside the sealant and/or a portion disposed inside the sealant.
  • the first adsorption layer may be disposed in the vicinity of the sealing material.
  • the first adsorption layer may at least partially coincide with an orthographic projection of the second adsorption layer on the first substrate or the second substrate.
  • the electromagnet may include a plurality of independently controlled sub-electrodes that may be disposed around a display area of the display panel.
  • a plane formed by sequentially connecting the magnetic poles of the plurality of sub-electrodes may be parallel to a plane in which the first adsorption layer is located.
  • the display panel may further include an isolation layer disposed between the electromagnet and one of the first substrate and the second substrate in which the electromagnet is disposed, the isolation layer being Made of non-ferromagnetic material.
  • the electromagnet may be detachably disposed on the first substrate or the second substrate The outside.
  • the thickness of the first adsorption layer may be less than the thickness of the sealing material after melting.
  • the display panel may be a light emitting diode display panel.
  • the display panel includes a first substrate and a second substrate disposed opposite to each other, and the packaging method includes the following steps:
  • the molten sealant is cured.
  • the first adsorption layer may be made of a ferromagnetic material
  • the second adsorption layer may include an electromagnet, and in the step of melting the sealing material, energizing the electromagnet to make the second adsorption The layer generates a magnetic force that stops energizing the electromagnet during the step of curing the molten sealant.
  • the sealant may be melted by a laser, the electromagnet comprising a plurality of sub-electrodes independently controlled, the plurality of the sub-electromagnets being disposed around the display area, in melting the
  • the sub-electromagnet corresponding to the region irradiated by the laser is energized.
  • the intensity of the electrical signal applied to the sub-electromagnet may increase as the intensity of the laser beam irradiated to the region corresponding to the sub-electromagnet increases;
  • the intensity of the electrical signal applied to the sub-electromagnet may decrease as the intensity of the laser beam irradiated to the region corresponding to the sub-electromagnet decreases.
  • the display panel may be a light emitting diode display panel.
  • the invention can effectively avoid the first substrate and the second base during the melting process of the sealing material
  • the separation between the plates due to stress release improves the resulting poor packaging problems.
  • FIG. 1 is a schematic cross-sectional view of a conventional light emitting diode display panel
  • FIG. 2 is a schematic cross-sectional view of a light emitting diode display panel in an embodiment of the present invention
  • FIG. 3 is a perspective view of a light emitting diode display panel according to an embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view of a light emitting diode display panel in an embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view of a light emitting diode display panel in an embodiment of the present invention.
  • FIG. 6 is a schematic cross-sectional view of a light emitting diode display panel in an embodiment of the present invention.
  • Embodiments of the present invention provide a display panel, such as a light emitting diode display panel.
  • the display panel is a light-emitting diode display panel as an example for detailed description.
  • the LED display panel includes a first substrate 1 and a second substrate 2 disposed opposite to each other, and the first substrate 1 and the second substrate 2 are encapsulated by a sealing material 3.
  • one of the first substrate 1 and the second substrate 2 is provided with a first adsorption layer 5, and the other is provided with a second adsorption layer 6, the first adsorption The layer 5 and the second adsorption layer 6 can be attracted to each other by magnetic force.
  • the LED display panel may be an OLED (Organic Light Emitting Diode) display panel or an AMOLED (Active Matrix Organic Light Emitting Diode) display.
  • the first substrate 1 may be a cover plate
  • the second substrate 2 may be a display substrate including the light-emitting unit 4, or vice versa. If the second substrate 2 is a display substrate, the second substrate 2 may further include a thin film transistor device, a cathode, an anode, and the like.
  • the sealing material 3 is melted to connect the first substrate 1 and the second substrate 2, and after the first substrate 1 and the second substrate 2 are connected, the sealing material 3 in a molten state is cured to encapsulate the first substrate 1 and The second substrate 2.
  • the invention improves the design of the first substrate 1 and the second substrate 2 in the LED display panel.
  • the first adsorption layer 5 and the second adsorption layer 6 are attracted to each other by magnetic force, so that The first substrate 1 and the second substrate 2 are well pressed together, thereby avoiding separation due to stress release between the first substrate 1 and the second substrate 2 when the sealing material 3 is melted, thereby improving the thereby Poor packaging problems caused.
  • the compression method using magnetic attraction has the advantages of low cost, easy operation, and difficulty in damaging the display panel.
  • the specific structures of the first adsorption layer 5 and the second adsorption layer 6 are not particularly limited.
  • both the first adsorption layer 5 and the second adsorption layer 6 are magnets capable of generating a magnetic force, and the magnetic poles on the side of the first adsorption layer 6 on the second adsorption layer 6 and the second adsorption layer 6 are first on the first adsorption layer 5
  • the magnetic poles on the side of the adsorption layer 5 are opposite, so that the first adsorption layer 5 and the second adsorption layer 6 can be attracted to each other.
  • one of the first adsorption layer 5 and the second adsorption layer 6 is a magnet capable of generating a magnetic force, and the other is made of a ferromagnetic material that can be attracted by a magnetic force.
  • the magnet may be a permanent magnet or an electromagnet.
  • the magnet is an electromagnet, and the electromagnet is energized only when the sealant 3 is melted, and the electromagnet is not required to be energized at other stages.
  • the first adsorption layer 5 is made of a ferromagnetic material and the second adsorption layer 6 comprises an electromagnet.
  • the electromagnet can generate an adsorption force to the first adsorption layer 5 made of a ferromagnetic material, so that the first substrate 1 and the second substrate 2 are sealed with the molten state during the melting of the sealing material 3, respectively.
  • the material 3 is completely conformed, that is, the first substrate 1 and the second substrate 2 can be kept connected at all times.
  • the ferromagnetic material has good thermal conductivity and can also serve as a heat conducting layer to reduce the sealing.
  • the heat released when the material 3 is melted adversely affects the light-emitting unit 4. This improvement effect is more pronounced especially when the light-emitting unit 4 is an organic light-emitting unit.
  • a ferromagnetic material refers to a substance that is easily magnetized, such as iron, cobalt, nickel, or the like.
  • the position of the first adsorption layer 5 is not limited, but the position of the first adsorption layer 5 should correspond to the position of the second adsorption layer 6, and the first adsorption layer 5 can be disposed on the first substrate 1 for example.
  • the first adsorption layer 5 disposed outside the first substrate 1 or the second substrate 2 it can be shortened between the first substrate 1 and the second substrate 2 to shorten the relationship between the first adsorption layer 5 and the second adsorption layer 6.
  • the distance between the first adsorption layer 5 and the second adsorption layer 6 can be better applied to the first substrate 1 and the second substrate 2, so that the two substrates are pressed tightly, which is advantageous for enhancing the packaging effect.
  • the sealing material 3 forms a closed path between the first substrate 1 and the second substrate 2 (the area enclosed by the closed path is sufficient to accommodate the light emitting unit 4) to be packaged into a display panel
  • the first adsorption layer 5 includes a setting. a portion outside the sealing material 3, and/or a portion disposed inside the sealing material 3, and an outer side of the sealing material 3 refers to a periphery of the closed path, and an inner side of the sealing material 3 refers to the The inner circumference of the closed path, preferably the first adsorption layer 5 is disposed in the vicinity of the sealing material 3.
  • the orthographic projections of the first adsorption layer 5 and the second adsorption layer 6 on the first substrate 1 or the second substrate 2 at least partially overlap, so that the position of the first adsorption layer 5 and the position of the second adsorption layer 6 are correspond.
  • the second adsorption layer 6 includes an electromagnet, and the first adsorption layer 5 is disposed in the vicinity (outside and/or inside) of the sealing material 3, and the first adsorption layer is provided. 5 corresponding to the position of the second adsorption layer 6, can maximize the adsorption force of the electromagnet on the ferromagnetic material in the region where the sealing material 3 is located, so that when the sealing material 3 is melted, The first substrate 1 and the second substrate 2 are pressed to avoid Poor packaging due to stress release between the two substrates causes separation of the two substrates.
  • the sealing material 3 may be formed on the first substrate 1 by screen printing or the like.
  • the light emitting unit 4 may be formed on the second substrate 2 by vacuum evaporation, inkjet printing, spin coating, or the like, and the light emitting unit 4 may be an organic light emitting unit.
  • the first adsorption layer 5 may be formed on the first substrate 1 by sputtering or vacuum evaporation using a ferromagnetic material such as iron, cobalt, nickel or an alloy of the above metals.
  • the second adsorption layer 6 includes an electromagnet that is disposed outside the second substrate 2 by sticking or the like, that is, a side of the second substrate 2 facing away from the first substrate 1, and the electromagnet controls the magnitude of its magnetic force by an external power source.
  • the LED display panel further includes an isolation layer 7 on which the isolation layer 7 is disposed (including Between the second adsorption layer 6 and the second substrate 2, as shown in FIG.
  • FIG. 5 shows a case where the first adsorption layer 5 is provided on the second substrate 2, that is, the first adsorption layer 5 is provided on the side of the second substrate 2 facing the first substrate 1.
  • the sealing material 3 may be formed on the first substrate 1 by screen printing or the like.
  • the light emitting unit 4 may be formed on the second substrate 2 by vacuum evaporation, inkjet printing, spin coating, or the like, and the light emitting unit 4 may be an organic light emitting unit.
  • the first adsorption layer 5 may be formed on the second substrate 2 by sputtering or vacuum evaporation using a ferromagnetic material such as iron, cobalt, nickel or an alloy of the above metals.
  • the second adsorption layer 6 includes an electromagnet that is disposed outside the first substrate 1 by sticking or the like, that is, a side of the first substrate 1 facing away from the second substrate 2, and the electromagnet controls the magnitude of its magnetic force by an external power source.
  • the light emitting diode display panel further includes an isolation layer 7 on which the isolation layer 7 is disposed ( Included in the second adsorption layer 6) and the first substrate 1, as shown in FIG.
  • the spacer layer 7 in the present invention is made of a non-ferromagnetic material, and the non-ferromagnetic material refers to a material which does not generate magnetism under the action of a magnetic field, and therefore, the spacer layer 7 does not act on the electromagnet.
  • the magnetic field has an effect.
  • FIG. 3 is a perspective view of the LED display panel in the embodiment of the present invention.
  • the first adsorption layer 5 is disposed outside the sealing material 3.
  • the electromagnet included in the second adsorption layer 6 includes a plurality of sub-electrodes independently controlled, and the plurality of sub-electrodes are disposed around a display area of the LED display panel.
  • the magnetic poles of the plurality of sub-electrodes are sequentially connected (ie, the N pole is connected to the S pole), specifically, the N pole of each sub electromagnet is opposite to the S pole of the adjacent sub electromagnet Connected, the S poles of each sub-electromagnet are connected to the N poles of adjacent sub-electrodes.
  • a plane formed by sequentially connecting the magnetic poles of the plurality of sub-electrodes is parallel to a plane in which the first adsorption layer 5 is located to facilitate fabrication, and the first substrate 1 and the second substrate 2 can be subjected to The pressure is more even.
  • the electromagnet is detachably disposed on the outer side of the first substrate 1 or the second substrate 2, that is, the side of the first substrate 1 facing away from the second substrate 2 or the second substrate 2 facing away from the first substrate.
  • the electromagnet can be removed, thereby facilitating weight reduction and miniaturization of the LED display panel.
  • the thickness of the first adsorption layer 5 should be smaller than the thickness of the sealing material 3 after melting, so that the first substrate 1 and the second substrate 2 can be ensured. They are completely in contact with the sealing material 3 in the molten state.
  • the thickness of the first adsorption layer 5 is preferably greater than 5 nm.
  • the sealing material 3 is melted by laser irradiation, thereby connecting the first substrate 1 and the second substrate 2 together, thereby realizing packaging of the light emitting diode display panel.
  • the electrical signal applied to the electromagnet can be synchronized with the laser signal illuminating the sealing material 3, that is, as the scanning area of the laser on the sealing material 3 and the intensity of the light change, The range and intensity of the magnetic field generated by the electromagnet, thereby timely adjusting the pressure applied to the first substrate 1 and the second substrate 2 in the melting region of the sealing material 3 and its vicinity, and reducing the relationship between the first substrate 1 and the second substrate 2 Poor packaging due to stress relief.
  • the laser can be incident from a plurality of directions and a plurality of angles, and the operation is very convenient.
  • the present invention can precisely control the area of the applied magnetic field and the magnitude of the magnetic force.
  • the electromagnet is composed of four sub-electrodes that are connected end to end with N poles and S poles.
  • the laser is moved along the sealing material 3, it is possible to select only the sub-electromagnetic corresponding to the area where the laser is being irradiated.
  • the body is energized, and according to the current laser light intensity, the size of the electrical signal is adjusted, so that the LED display panel is evenly packaged in various regions.
  • the embodiment of the invention further provides a packaging method for a display panel, which may be, for example, a light emitting diode display panel.
  • a display panel which may be, for example, a light emitting diode display panel.
  • the packaging method is described in detail by taking the display panel as a light emitting diode display panel as an example.
  • the LED display panel includes a first substrate and a second substrate disposed opposite to each other.
  • the packaging method includes the following steps:
  • the molten sealant is cured.
  • the first adsorption layer is made of a ferromagnetic material
  • the second adsorption layer comprises an electromagnet.
  • the step of melting the sealing material energizing the electromagnet to generate a magnetic force in the second adsorption layer, thereby generating an adsorption force on the first adsorption layer made of a ferromagnetic material, thereby making the first
  • the substrate and the second substrate are respectively completely adhered to the sealing material in a molten state; in the step of solidifying the molten sealing material, energization of the electromagnet is stopped.
  • the sealing material is melted by a laser
  • the electromagnet includes a plurality of sub-electrodes independently controlled, and the plurality of sub-electrodes surround the LED display panel
  • the display area is arranged to energize the sub-electromagnet corresponding to the area in which the laser is being irradiated in the step of melting the sealing material.
  • the intensity of the electrical signal applied to the sub-electromagnet is irradiated to The intensity of the laser light of the region corresponding to the sub-electromagnet increases;
  • the intensity of the electrical signal applied to the sub-electromagnet decreases as the intensity of the laser light irradiated to the region corresponding to the sub-electromagnet decreases.
  • the invention can effectively avoid the separation between the first substrate and the second substrate due to stress release during the melting process of the sealing material, thereby improving the packaging defect problem caused thereby.
  • the first adsorption layer made of ferromagnetic material has good thermal conductivity, and can also serve as a heat conduction layer to reduce the adverse effect of the heat released when the sealing material is melted on the light-emitting unit.
  • the packaging method may include:
  • the preparation of the sealing material 3 is completed on the first substrate 1 by screen printing, spraying, etc., and the sealing material 3 is formed by a baking process;
  • the first adsorption layer 5 is formed on the first substrate 1 by a process such as vacuum film formation and photolithography.
  • the first adsorption layer 5 is made of a ferromagnetic material, wherein the thickness of the first adsorption layer 5 is preferably greater than 5 nm and less than The thickness of the sealing material 3 after melting;
  • the first substrate 1 and the second substrate 2 are bonded together, and the sealing material 3, the light emitting unit 4 and the first adsorption layer 5 are located between the first substrate 1 and the second substrate 2, so that the second adsorption layer 6 is located
  • the sealing material 3 is melted by laser irradiation, thereby connecting the first substrate 1 and the second substrate 2 together, and simultaneously being included in the second adsorption layer 6.
  • the electromagnet applies a voltage to make it magnetic, so as to adsorb the first adsorption layer 5 made of a ferromagnetic material, so that the first substrate 1 and the second substrate 2 are well pressed together;
  • the voltage signal applied to the electromagnet can be synchronized with the laser signal, and the adsorption range and the magnetic field size of the electromagnet can be adjusted in time for the stress change between the first substrate 1 and the second substrate 2, and then Timely adjusting the melting area of the sealing material 3 and Pressure applied to the first substrate 1 and the second substrate 2 in the vicinity thereof;
  • the voltage signal applied to the electromagnet is turned off to complete the packaging process.
  • the packaging method may include:
  • the preparation of the sealing material 3 is completed on the first substrate 1 by screen printing, spraying, etc., and the sealing material 3 is formed by a baking process;
  • the first adsorption layer 5 is formed on the second substrate 2 by a process such as vacuum film formation and photolithography.
  • the first adsorption layer 5 is made of a ferromagnetic material, wherein the thickness of the first adsorption layer 5 is preferably greater than 5 nm and less than The thickness of the sealing material 3 after melting;
  • the first substrate 1 and the second substrate 2 are bonded together, and the sealing material 3, the light emitting unit 4 and the first adsorption layer 5 are located between the first substrate 1 and the second substrate 2, so that the second adsorption layer 6 is located a side of the substrate 1 facing away from the second substrate 2, the sealing material 3 is melted by laser irradiation, thereby connecting the first substrate 1 and the second substrate 2 together, and simultaneously being included in the second adsorption layer 6.
  • the electromagnet applies a voltage to make it magnetic, so as to adsorb the first adsorption layer 5 made of a ferromagnetic material, so that the first substrate 1 and the second substrate 2 are well pressed together;
  • the voltage signal applied to the electromagnet can be synchronized with the laser signal, and the adsorption range and the magnetic field size of the electromagnet can be adjusted in time for the stress change between the first substrate 1 and the second substrate 2, and then Adjusting the pressure applied to the molten region of the sealing material 3 and the first substrate 1 and the second substrate 2 in the vicinity thereof in time;
  • the voltage signal applied to the electromagnet is turned off to complete the packaging process.
  • the seal material mentioned in the present invention may be an existing glass frit.
  • the invention effectively avoids the separation between the first substrate 1 and the second substrate 2 due to stress release during the melting process of the sealing material 3, thereby improving the resulting packaging failure problem.
  • the second adsorption layer made of ferromagnetic material has good thermal conductivity and It can be used as a heat conductive layer to reduce the adverse effect of the heat released when the sealing material 3 is melted on the light emitting unit 4.

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  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
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Abstract

一种发光二极管显示面板及其封装方法，涉及显示技术领域，所述发光二极管显示面板包括第一基板(1)、第二基板(2)、以及用于连接所述第一基板和所述第二基板的封接料(3)，在所述发光二极管显示面板的非显示区域中，所述第一基板(1)和所述第二基板(2)中的一者上设置有第一吸附层(5)，另一者上设置有第二吸附层(6)，所述第一吸附层(5)和所述第二吸附层(6)之间能够通过磁力互相吸引；可以有效避免封接料熔化过程中，第一基板(1)与第二基板(2)之间由于应力释放而导致的分离，从而改善了由此造成的封装不良问题；同时，铁磁性材料导热性良好，还可以作为导热层，减少封接料熔化时释放的热量对发光单元的不良影响。

Description

显示面板及其封装方法 技术领域
本发明涉及显示技术领域，尤其涉及显示面板及其封装方法。
背景技术
目前发光二极管(LED，Light Emitting Diode)显示面板主要采用玻璃料(Frit)来进行封装。图1是现有发光二极管显示面板的截面示意图，第一基板1和第二基板2之间通过封接料3(例如玻璃料)封装在一起，其中第二基板2上设置有发光单元4。封装过程中，使用激光照射固态的封接料3使之熔化，而在封接料3再次固化之后，就能够将第一基板1和第二基板2封装在一起。
由于激光一次只能对局部的封接料3进行照射，而局部封接料3熔化时，第一基板1与第二基板2之间会发生应力释放现象，释放的应力容易使两者分离，导致封接料3不能有效封装第一基板1和第二基板2，从而产生封装不良问题。
针对上述问题，现有技术中的一种解决方法是：在第一基板1的外侧(即背离第二基板2的一侧)设置受热膨胀层和其它夹层，当封接料3受到激光照射而熔化时，产生的热量同时传递给受热膨胀层，受热膨胀层受热后发生膨胀，从而将第一基板1压附在第二基板2上，以防止两者由于应力释放而发生分离。但是，这种方法需要保持激光由下向上照射(即从第二基板2向第一基板1的方向照射)，不方便操作，同时由于该受热膨胀层一般采用有机高分子材料或者弹性橡胶材料制作，容易造成环境污染。
现有技术中的另一种解决方法是：在第一基板1与第二基板2的外侧均添加压板组件，为第一基板1和第二基板2提供夹持力，同时设置传感器感应压板组件之间压力的大小，避免由于夹持力太小而造成密封效果差，或者由于夹持力过大而造成器件损伤，从而改善封装质量。但是，采用这种方法封装时，由于第一基板1与第二基板2的间距非常小(通常在20μm以下)，传感器很难有效感应压板组件 之间压力的大小，而且如何实现传感器与两基板的有效整合也是个难题。
发明内容
本发明的目的在于提供一种显示面板及其封装方法，以改善在封接料熔化时，显示面板的两基板之间由于应力释放而导致的封装不良问题。
为解决上述技术问题，作为本发明的第一个方面，提供一种显示面板，其包括相对设置的第一基板和第二基板，所述第一基板和所述第二基板通过封接料封装，在所述显示面板的非显示区域中，所述第一基板和所述第二基板中的一者上设置有第一吸附层，另一者上设置有第二吸附层，所述第一吸附层和所述第二吸附层之间能够通过磁力互相吸引。
所述第一吸附层可采用铁磁性材料制成，所述第二吸附层可包括电磁体。
所述第一吸附层可设置在所述第一基板上面对所述第二基板的一侧，或者设置在所述第二基板上面对所述第一基板的一侧。
所述第一吸附层可包括设置在所述封接料外侧的部分和/或设置在所述封接料内侧的部分。
所述第一吸附层可设置在所述封接料附近。
所述第一吸附层可与所述第二吸附层在所述第一基板或所述第二基板上的正投影至少部分重合。
所述电磁体可包括多个独立控制的子电磁体，多个所述子电磁体可环绕所述显示面板的显示区域设置。
多个所述子电磁体的磁极顺次连接后形成的图形所在的平面可与所述第一吸附层所在的平面平行。
所述显示面板还可包括隔离层，所述隔离层设置在所述电磁体与所述第一基板和所述第二基板中设置有所述电磁体的一者之间，所述隔离层由非铁磁性材料制成。
所述电磁体可以可拆卸地设置在所述第一基板或所述第二基板 的外侧。
所述第一吸附层的厚度可小于所述封接料熔化后的厚度。
所述显示面板可以为发光二极管显示面板。
作为本发明的第二个方面，还提供一种显示面板的封装方法，所述显示面板包括相对设置的第一基板和第二基板，所述封装方法包括以下步骤：
在所述第一基板和所述第二基板中的至少一者上设置固态的封接料；
在所述第一基板和所述第二基板中的一者上设置第一吸附层；
在所述第一基板和所述第二基板中的另一者上设置第二吸附层；
将所述第一基板和所述第二基板对盒；
熔化所述封接料，以将所述第一基板和所述第二基板连接，其中，当所述封接料熔化时，所述第一吸附层和所述第二吸附层之间通过磁力互相吸引；
将熔化的封接料固化。
所述第一吸附层可采用铁磁性材料制成，所述第二吸附层可包括电磁体，在熔化所述封接料的步骤中，向所述电磁体通电，以使所述第二吸附层产生磁力，在将熔化的封接料固化的步骤中，停止向所述电磁体通电。
在熔化所述封接料的步骤中，可利用激光熔化所述封接料，所述电磁体包括独立控制的多个子电磁体，多个所述子电磁体环绕显示区域设置，在熔化所述封接料的步骤中，向激光照射的区域对应的所述子电磁体通电。
施加在所述子电磁体上的电信号的强度可随照射至与所述子电磁体对应的区域的激光束的强度的增大而增大；
施加在所述子电磁体上的电信号的强度可随照射至与所述子电磁体对应的区域的激光束的强度的减小而减小。
所述显示面板可以为发光二极管显示面板。
本发明可以有效避免在封接料熔化过程中，第一基板与第二基 板之间由于应力释放而导致的分离，从而改善了由此造成的封装不良问题。
附图说明
附图是用来提供对本发明的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本发明，但并不构成对本发明的限制。
图1是现有发光二极管显示面板的截面示意图；
图2是本发明实施例中发光二极管显示面板的截面示意图；
图3是本发明实施例中发光二极管显示面板的立体示意图；
图4是本发明实施例中发光二极管显示面板的截面示意图；
图5是本发明实施例中发光二极管显示面板的截面示意图；以及
图6是本发明实施例中发光二极管显示面板的截面示意图。
具体实施方式
以下结合附图对本发明的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本发明，并不用于限制本发明。
本发明实施例提供了一种显示面板，例如发光二极管显示面板。在下面的具体实施例中以所述显示面板为发光二极管显示面板为例进行详细描述。如图2至图6中所示，所述发光二极管显示面板包括相对设置的第一基板1和第二基板2，第一基板1和第二基板2通过封接料3封装。在所述发光二极管显示面板的非显示区域中，第一基板1和第二基板2中的一者上设置有第一吸附层5，另一者上设置有第二吸附层6，第一吸附层5和第二吸附层6之间能够通过磁力互相吸引。
这里的发光二极管显示面板可以是OLED(Organic Light Emitting Diode，有机发光二极管)显示面板，或者AMOLED(Active Matrix Organic Light Emitting Diode，有源矩阵有机发光二极管)显 示面板。这里的第一基板1可以是盖板，第二基板2可以是包括发光单元4的显示基板，反之亦可。若第二基板2为显示基板，则第二基板2上还可包括薄膜晶体管器件、阴极、阳极等结构。
在制造发光二极管显示面板时，需要向第一基板1和第二基板2中的至少一者上形成固态的封接料3，并且在第一基板1和第二基板2对盒后，需要将封接料3熔化，以将第一基板1和第二基板2连接，在第一基板1和第二基板2连接之后，再将熔化状态的封接料3固化，以封装第一基板1和第二基板2。本发明改进了发光二极管显示面板中第一基板1和第二基板2的设计，在封接料3熔化的过程中，第一吸附层5和第二吸附层6之间通过磁力互相吸引，使第一基板1和第二基板2很好地压附在一起，避免了在封接料3熔化时第一基板1与第二基板2之间由于应力释放而导致的分离，从而改善了由此造成的封装不良问题。
与现有技术相比，采用磁力吸引的压附方式的优点在于成本低、便于操作，并且不容易损伤显示面板。
在本发明中，对第一吸附层5、第二吸附层6的具体结构并没有特殊的限定。例如，第一吸附层5和第二吸附层6均为能够产生磁力的磁体，且第一吸附层5上面对第二吸附层6一侧的磁极与第二吸附层6上面对第一吸附层5一侧的磁极相反，从而可以使得第一吸附层5和第二吸附层6互相吸引。或者，第一吸附层5和第二吸附层6中的一者为能够产生磁力的磁体，另一者采用能够被磁力所吸引的铁磁性材料制成。磁体可以是永磁体也可以是电磁体。为了便于控制，并且获得良好的显示效果，优选地，所述磁体为电磁体，且仅在封接料3熔化时，向电磁体通电，在其他阶段都不需向电磁体通电。
在一个示例中，第一吸附层5采用铁磁性材料制成，第二吸附层6包括电磁体。所述电磁体能够对采用铁磁性材料制成的第一吸附层5产生吸附力，从而在封接料3熔化的过程中，使第一基板1和第二基板2分别与熔化状态的封接料3完全贴合，即，可以保持第一基板1和第二基板2始终连接。
而且，铁磁性材料导热性良好，还可以作为导热层，以减少封 接料3熔化时释放的热量对发光单元4产生的不良影响。尤其当发光单元4为有机发光单元时，这种改善效果更为明显。
本领域技术人员应当理解的是，在本发明中，铁磁性材料是指易于磁化的物质，例如铁、钴、镍等。
本发明对第一吸附层5的设置位置没有限定，但第一吸附层5的位置应该与第二吸附层6的位置相对应，第一吸附层5例如可以设置在第一基板1上背离第二基板2的一侧，即第一基板1的外侧，或者可以设置在第二基板2上背离第一基板1的一侧，即第二基板2的外侧，优选地，第一吸附层5位于第一基板1和第二基板2之间(包括第一吸附层5设置在第一基板1上的情况，即第一吸附层5设置在第一基板1上面对第二基板2的一侧，和第一吸附层5设置在第二基板2上的情况，即第一吸附层5设置在第二基板2上面对第一基板1的一侧，具体将在下文中进行描述)。与第一吸附层5设置在第一基板1或第二基板2的外侧相比，其位于第一基板1和第二基板2之间能够缩短第一吸附层5与第二吸附层6之间的距离，使得由第一吸附层5和第二吸附层6之间产生的吸附力能够更好地作用于第一基板1和第二基板2，使两基板压紧，有利于增强封装效果。
本发明中，封接料3在第一基板1和第二基板2之间形成闭合路径(该闭合路径围成的区域足以容纳发光单元4)以封装成显示面板，第一吸附层5包括设置在封接料3外侧的部分，和/或设置在所述封接料3内侧的部分，而封接料3的外侧指的是该闭合路径的外围，封接料3的内侧指的是该闭合路径的内围，优选第一吸附层5设置在封接料3的附近。进一步地，第一吸附层5与第二吸附层6在第一基板1或第二基板2上的正投影至少部分重合，从而使得第一吸附层5的位置与第二吸附层6的位置相对应。
由于第一吸附层5采用铁磁性材料制成，第二吸附层6包括电磁体，将第一吸附层5设置在封接料3的附近(外侧和/或内侧)，并且使第一吸附层5与第二吸附层6的位置相对应，能够使所述电磁体对所述铁磁性材料的吸附力最大程度的作用于封接料3所在的区域，从而在封接料3熔化时，将第一基板1与第二基板2压紧，避免 由于两基板间的应力释放而导致两基板分离等封装不良。
下面以图2和图5中所示的结构分别进行说明。
图2示出了第一吸附层5设置在第一基板1上的情况，即第一吸附层5设置在第一基板1上面对第二基板2的一侧。在图2中，封接料3可以通过丝网印刷等方式形成在第一基板1上。发光单元4可以通过真空蒸镀、喷墨打印、旋涂等方式形成在第二基板2上，并且所述发光单元4可以是有机发光单元。第一吸附层5可采用诸如铁、钴、镍或上述金属的合金等铁磁性材料通过溅射或真空蒸镀等方式形成在第一基板1上。第二吸附层6包括电磁体，通过粘贴等方式设置在第二基板2外侧，即第二基板2上背离第一基板1的一侧，所述电磁体通过外接电源控制其磁性的大小。
为了防止包括在第二吸附层6中的电磁体直接贴附到第二基板2上时造成污染，所述发光二极管显示面板还包括隔离层7，隔离层7设置在所述电磁体(包括在第二吸附层6中)与第二基板2之间，如图4中所示。
图5示出了第一吸附层5设置在第二基板2上的情况，即第一吸附层5设置在第二基板2上面对第一基板1的一侧。在图5中，封接料3可以通过丝网印刷等方式形成在第一基板1上。发光单元4可以通过真空蒸镀、喷墨打印、旋涂等方式形成在第二基板2上，并且所述发光单元4可以是有机发光单元。第一吸附层5可采用诸如铁、钴、镍或上述金属的合金等铁磁性材料通过溅射或真空蒸镀等方式形成在第二基板2上。第二吸附层6包括电磁体，通过粘贴等方式设置在第一基板1外侧，即第一基板1背离第二基板2的一侧，所述电磁体通过外接电源控制其磁性的大小。
同样，为了防止包括在第二吸附层6中的电磁体直接贴附到第一基板1上时造成污染，所述发光二极管显示面板还包括隔离层7，隔离层7设置在所述电磁体(包括在第二吸附层6中)与第一基板1之间，如图6中所示。
本发明中的隔离层7由非铁磁性材料制成，非铁磁性材料是指在磁场的作用下不会产生磁性的材料，因而，隔离层7不会对电磁体 的磁场造成影响。
图3是本发明实施例中发光二极管显示面板的立体示意图，图3中第一吸附层5设置在封接料3的外侧。包括在第二吸附层6中的电磁体包括独立控制的多个子电磁体，多个所述子电磁体环绕所述发光二极管显示面板的显示区域设置。在图3中，例如，多个所述子电磁体的磁极顺次连接(即，N极与S极连接)，具体地，每个子电磁体的N极均与相邻子电磁体的S极连接，每个子电磁体的S极均与相邻子电磁体的N极连接。
优选地，多个所述子电磁体的磁极顺次连接后形成的图形所在的平面与第一吸附层5所在的平面平行，以便于制作，并且能够使第一基板1与第二基板2受到的压力更加均匀。
在本发明中，所述电磁体可拆卸地设置在第一基板1或第二基板2的外侧，即第一基板1上背离第二基板2的一侧或第二基板2上背离第一基板1的一侧，在第一基板1和第二基板2封装完成之后，可将电磁体拆除，从而有利于实现发光二极管显示面板的轻量化和小型化。
当第一吸附层5位于第一基板1和第二基板2之间时，第一吸附层5的厚度应当小于封接料3熔化后的厚度，从而可以确保第一基板1以及第二基板2分别与熔化状态的封接料3完全接触。为了方便生产制作，第一吸附层5的厚度优选大于5nm。
如上所述，封接料3通过激光照射熔化，从而将第一基板1和第二基板2连接在一起，实现发光二极管显示面板的封装。在本发明中，可以使施加在所述电磁体上的电信号与照射封接料3的激光信号同步，即随着激光在封接料3上的扫描区域和光强的变化，调整所述电磁体产生的磁场的范围和强度，从而及时调整对封接料3熔化区域及其附近的第一基板1和第二基板2施加的压力，减少由于第一基板1和第二基板2之间的应力释放所导致的封装不良。
与现有技术中激光只能从下向上照射相比，本发明中激光能够从多个方向以及多个角度入射，操作十分方便。
同时，本发明可以精确控制施加的磁场的区域以及磁力的大小。 例如在图3中，所述电磁体由四条N极、S极首尾相接的子电磁体构成，激光沿着封接料3移动照射时，可以选择只对激光正在照射的区域对应的子电磁体通电，并根据当前激光的光强，调整电信号的大小，使发光二极管显示面板在各个区域均匀封装。
本发明实施例还提供了一种显示面板的封装方法，所述显示面板例如可以为发光二极管显示面板。在下面的具体实施例中以所述显示面板为发光二极管显示面板为例详细描述所述封装方法。所述发光二极管显示面板包括相对设置的第一基板和第二基板。
所述封装方法包括以下步骤：
在所述第一基板和所述第二基板中的至少一者上设置固态的封接料；
在所述第一基板和所述第二基板中的一者上设置第一吸附层；
在所述第一基板和所述第二基板中的另一者上设置第二吸附层；
将所述第一基板和所述第二基板对盒；
熔化所述封接料，以将所述第一基板和所述第二基板连接，其中，当所述封接料熔化时，所述第一吸附层和所述第二吸附层之间通过磁力互相吸引；
将熔化的封接料固化。
进一步地，所述第一吸附层采用铁磁性材料制成，所述第二吸附层包括电磁体。在熔化所述封接料的步骤中，向所述电磁体通电，以使所述第二吸附层产生磁力，从而对采用铁磁性材料制成的第一吸附层产生吸附力，进而使第一基板和第二基板分别与熔化状态的封接料完全贴合；在将熔化的封接料固化的步骤中，停止向所述电磁体通电。
进一步地，在熔化所述封接料的步骤中，利用激光熔化所述封接料，所述电磁体包括独立控制的多个子电磁体，多个所述子电磁体环绕所述发光二极管显示面板的显示区域设置，在熔化所述封接料的步骤中，向激光正在照射的区域对应的所述子电磁体通电。
进一步地，施加在所述子电磁体上的电信号的强度随照射至与 所述子电磁体对应的区域的激光的强度的增大而增大；
施加在所述子电磁体上的电信号的强度随照射至与所述子电磁体对应的区域的激光的强度的减小而减小。
本发明可以有效避免在封接料熔化过程中，第一基板与第二基板之间由于应力释放而导致的分离，从而改善了由此造成的封装不良问题。同时，由铁磁性材料制成的第一吸附层导热性良好，还可以作为导热层，减少封接料熔化时释放的热量对发光单元产生的不良影响。
下面根据图2和图5中所示的结构，对本发明提供的封装方法进行详细的描述。
对于图2中所示的结构，所述封装方法可包括：
由传统的薄膜晶体管制作工艺及发光单元蒸镀工艺分别完成第二基板2和其上的发光单元4的制作；
通过丝网印刷、喷涂等方式在第一基板1上完成封接料3的制作，并通过烘烤工艺，使封接料3成型；
在第一基板1上通过真空成膜及光刻等工艺完成第一吸附层5的制作，第一吸附层5采用铁磁性材料制成，其中，第一吸附层5的厚度优选大于5nm且小于封接料3熔化后的厚度；
在第二基板2上设置第二吸附层6，这里第二吸附层6包括电磁体；
使第一基板1和第二基板2贴合，并使封接料3、发光单元4和第一吸附层5位于第一基板1和第二基板2之间，使第二吸附层6位于第二基板2上背离第一基板1的一侧，通过激光照射使封接料3熔化，从而将第一基板1与第二基板2连接在一起，同时，给包括在第二吸附层6中的电磁体施加电压使之产生磁性，以吸附采用铁磁性材料制成的第一吸附层5，进而使第一基板1和第二基板2很好地压附在一起；
另外，可以使施加在所述电磁体上的电压信号与激光信号同步，针对第一基板1与第二基板2之间的应力变化情况，及时调整所述电磁体的吸附范围和磁场大小，进而及时调整对封接料3的熔化区域及 其附近的第一基板1和第二基板2施加的压力；
封接料3熔化并完成第一基板1与第二基板2的封装后，关闭施加在所述电磁体上的电压信号，完成封装过程。
对于图5中所示的结构，所述封装方法可包括：
由传统的薄膜晶体管制作工艺及发光单元蒸镀工艺分别完成第二基板2和其上的发光单元4的制作；
通过丝网印刷、喷涂等方式在第一基板1上完成封接料3的制作，并通过烘烤工艺，使封接料3成型；
在第二基板2上通过真空成膜及光刻等工艺完成第一吸附层5的制作，第一吸附层5采用铁磁性材料制成，其中，第一吸附层5的厚度优选大于5nm且小于封接料3熔化后的厚度；
在第一基板1上设置第二吸附层6，这里第二吸附层6包括电磁体；
使第一基板1和第二基板2贴合，并使封接料3、发光单元4和第一吸附层5位于第一基板1和第二基板2之间，使第二吸附层6位于第一基板1上背离第二基板2的一侧，通过激光照射使封接料3熔化，从而将第一基板1与第二基板2连接在一起，同时，给包括在第二吸附层6中的电磁体施加电压使之产生磁性，以吸附采用铁磁性材料制成的第一吸附层5，进而使第一基板1和第二基板2很好地压附在一起；
另外，可以使施加在所述电磁体上的电压信号与激光信号同步，针对第一基板1与第二基板2之间的应力变化情况，及时调整所述电磁体的吸附范围和磁场大小，进而及时调整对封接料3的熔化区域及其附近的第一基板1和第二基板2施加的压力；
封接料3熔化并完成第一基板1与第二基板2的封装后，关闭施加在所述电磁体上的电压信号，完成封装过程。
本发明中提及的封接料可采用现有的玻璃料。
本发明有效避免了在封接料3熔化过程中，第一基板1与第二基板2之间由于应力释放而导致的分离，从而改善了由此造成的封装不良问题。同时，采用铁磁性材料制成的第二吸附层导热性良好，还 可以作为导热层，减少封接料3熔化时释放的热量对发光单元4产生的不良影响。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (17)

  1. 一种显示面板，包括相对设置的第一基板和第二基板，所述第一基板和所述第二基板通过封接料封装，其中，在所述显示面板的非显示区域中，所述第一基板和所述第二基板中的一者上设置有第一吸附层，另一者上设置有第二吸附层，所述第一吸附层和所述第二吸附层之间能够通过磁力互相吸引。
  2. 根据权利要求1所述的显示面板，其中，所述第一吸附层采用铁磁性材料制成，所述第二吸附层包括电磁体。
  3. 根据权利要求2所述的显示面板，其中，所述第一吸附层设置在所述第一基板上面对所述第二基板的一侧，或者设置在所述第二基板上面对所述第一基板的一侧。
  4. 根据权利要求3所述的显示面板，其中，所述第一吸附层包括设置在所述封接料外侧的部分和/或设置在所述封接料内侧的部分。
  5. 根据权利要求4所述的显示面板，其中，所述第一吸附层设置在所述封接料附近。
  6. 根据权利要求1至5中任意一项所述的显示面板，其中，所述第一吸附层与所述第二吸附层在所述第一基板或所述第二基板上的正投影至少部分重合。
  7. 根据权利要求2至5中任意一项所述的显示面板，其中，所述电磁体包括多个独立控制的子电磁体，多个所述子电磁体环绕所述显示面板的显示区域设置。
  8. 根据权利要求7所述的显示面板，其中，多个所述子电磁体的磁极顺次连接后形成的图形所在的平面与所述第一吸附层所在的平面平行。
  9. 根据权利要求2至5中任意一项所述的显示面板，其中，所述显示面板还包括隔离层，所述隔离层设置在所述电磁体与所述第一基板和所述第二基板中设置有所述电磁体的一者之间，所述隔离层由非铁磁性材料制成。
  10. 根据权利要求2至5中任意一项所述的显示面板，其中，所述电磁体可拆卸地设置在所述第一基板或所述第二基板的外侧。
  11. 根据权利要求3至5所述的显示面板，其中，所述第一吸附层的厚度小于所述封接料熔化后的厚度。
  12. 根据权利要求1至5中任意一项所述的显示面板，其中，所述显示面板为发光二极管显示面板。
  13. 一种显示面板的封装方法，所述显示面板包括相对设置的第一基板和第二基板，其中，所述封装方法包括以下步骤：
    在所述第一基板和所述第二基板中的至少一者上设置固态的封接料；
    在所述第一基板和所述第二基板中的一者上设置第一吸附层；
    在所述第一基板和所述第二基板中的另一者上设置第二吸附层；
    将所述第一基板和所述第二基板对盒；
    熔化所述封接料，以将所述第一基板和所述第二基板连接，其中，当所述封接料熔化时，所述第一吸附层和所述第二吸附层之间通过磁力互相吸引；
    将熔化的封接料固化。
  14. 根据权利要求13所述的封装方法，其中，所述第一吸附层采用铁磁性材料制成，所述第二吸附层包括电磁体，在熔化所述封接料的步骤中，向所述电磁体通电，以使所述第二吸附层产生磁力，在将熔化的封接料固化的步骤中，停止向所述电磁体通电。
  15. 根据权利要求14所述的封装方法，其中，在熔化所述封接料的步骤中，利用激光熔化所述封接料，所述电磁体包括独立控制的多个子电磁体，多个所述子电磁体环绕所述显示面板的显示区域设置，在熔化所述封接料的步骤中，向激光正在照射的区域对应的所述子电磁体通电。
  16. 根据权利要求15所述的封装方法，其中，施加在所述子电磁体上的电信号的强度随照射至与所述子电磁体对应的区域的激光的强度的增大而增大；
    施加在所述子电磁体上的电信号的强度随照射至与所述子电磁体对应的区域的激光的强度的减小而减小。
  17. 根据权利要求13至16中任意一项所述的封装方法，其中，所述显示面板为发光二极管显示面板。
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CN104362259B (zh) 2017-02-22
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