WO2016074437A1 - 封装装置和封装方法 - Google Patents

封装装置和封装方法 Download PDF

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Publication number
WO2016074437A1
WO2016074437A1 PCT/CN2015/076708 CN2015076708W WO2016074437A1 WO 2016074437 A1 WO2016074437 A1 WO 2016074437A1 CN 2015076708 W CN2015076708 W CN 2015076708W WO 2016074437 A1 WO2016074437 A1 WO 2016074437A1
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Prior art keywords
substrate
adsorbing member
electromagnet
display panel
sub
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PCT/CN2015/076708
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English (en)
French (fr)
Inventor
高昕伟
王丹
洪瑞
孔超
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京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to EP15839058.3A priority Critical patent/EP3220412B1/en
Priority to US14/892,414 priority patent/US9673356B2/en
Publication of WO2016074437A1 publication Critical patent/WO2016074437A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

Definitions

  • the present invention relates to the field of display panel manufacturing technologies, and in particular, to a packaging device and a packaging method.
  • LED (Light Emitting Diode) display panels are mainly packaged with frit.
  • 1 is a schematic view of a conventional packaging method in which a first substrate 1 and a second substrate 2 are packaged together by a sealing material 3 (for example, a glass frit), wherein the second substrate 2 is provided with a light emitting unit 4.
  • the solid substrate seal 3 is irradiated with the laser 7 to melt it, and after the sealant 3 is cured again, the first substrate 1 and the second substrate 2 can be packaged together.
  • the laser can only irradiate the local sealing material 3 at a time, and the partial sealing material 3 is melted, a stress release phenomenon occurs between the first substrate 1 and the second substrate 2, and the released stress easily separates the two. As a result, the sealing material 3 cannot effectively encapsulate the first substrate 1 and the second substrate 2, thereby causing a problem of poor packaging.
  • one solution in the prior art is to provide a heat-expanded layer and other interlayers on the outer side of the first substrate 1 (ie, the side facing away from the second substrate 2), when the sealing material 3 is irradiated by the laser.
  • the generated heat is simultaneously transferred to the heat-expanded layer, and the heat-expanded layer is expanded by being heated, thereby pressing the first substrate 1 on the second substrate 2 to prevent separation of the two due to stress release.
  • this method needs to keep the laser from being irradiated from the bottom to the top (ie, from the second substrate 2 toward the first substrate 1), which is inconvenient to operate, and since the heat-expanded layer is generally made of an organic polymer material or an elastic rubber material. It is easy to cause environmental pollution.
  • Another solution in the prior art is to add a pressure plate assembly on the outer side of the first substrate 1 and the second substrate 2 to provide a clamping force for the first substrate 1 and the second substrate 2, and at the same time, a sensor is provided to sense both.
  • the magnitude of the pressure between them is avoided due to the clamping force being too small
  • the sealing effect is poor, or the device is damaged due to excessive clamping force, thereby improving the package quality.
  • the distance between the first substrate 1 and the second substrate 2 is very small (usually below 20 ⁇ m), it is difficult for the sensor to effectively sense the pressure between the first substrate 1 and the second substrate 2, And how to achieve effective integration of the sensor and the two substrates is also a problem.
  • a packaging device for packaging a display panel including a first substrate and a second substrate disposed opposite to each other, the first substrate and the The second substrate can be packaged by a sealing material
  • the packaging device includes a first adsorption member and a second adsorption member capable of mutually attracting each other by magnetic force, and one of the first adsorption member and the second adsorption member is configured The other is detachably disposed outside the first substrate, and the other is configured to be detachably disposed outside the second substrate.
  • the first adsorbing member is made of a ferromagnetic material
  • the second adsorbing member comprises an electromagnet
  • the packaging device further comprises a first adsorbent carrier, the first adsorbent being disposed on the first adsorbent carrier.
  • the first adsorbing member comprises a plurality of sub-adsorbing members, and a plurality of the sub-adsorbing members are formed with a space therebetween, and at least a portion of the first adsorbing member carrier corresponding to the spacing is capable of transmitting light.
  • the packaging device further includes a spacer disposed between the electromagnet and one of the first substrate and the second substrate on which an outer side of the electromagnet is disposed,
  • the spacer is made of a non-ferromagnetic material.
  • the electromagnet comprises a plurality of sub-electromagnets that are independently controlled.
  • the display panel is a light emitting diode display panel.
  • a packaging method for packaging display The display panel includes a first substrate and a second substrate disposed opposite to each other, and the packaging method includes the following steps:
  • One of the first adsorbing member and the second adsorbing member is disposed outside the first substrate;
  • the molten sealant is cured.
  • the orthographic projection of the first adsorbing member and the second adsorbing member on the first substrate and/or the second substrate at least partially coincide.
  • the positions of the first adsorbing member and the second adsorbing member correspond to the position of the sealing material.
  • the first adsorbing member is made of a ferromagnetic material
  • the second adsorbing member comprises an electromagnet
  • in the step of melting the sealing material energizing the electromagnet to make the second
  • the adsorbing member generates a magnetic force; in the step of solidifying the molten sealing material, energization of the electromagnet is stopped.
  • the sealing material is melted by a laser, the electromagnet comprising a plurality of sub-electrodes independently controlled, the plurality of sub-electromagnets being disposed around a display area of the display panel, in melting the sealing material
  • the sub electromagnet corresponding to the region irradiated by the laser is energized.
  • the intensity of the electrical signal applied to the sub-electromagnet increases as the intensity of the laser light irradiated to the region corresponding to the sub-electromagnet increases;
  • the intensity of the electrical signal applied to the sub-electromagnet decreases as the intensity of the laser light irradiated to the region corresponding to the sub-electromagnet decreases.
  • the invention can effectively avoid the first substrate and the second base during the melting process of the sealing material
  • the separation between the plates due to stress release improves the resulting poor packaging problems.
  • the first adsorbing member and the second adsorbing member in the invention are all external accessories of the display panel, and can be repeatedly used for recycling, thereby saving cost.
  • FIG. 1 is a schematic view of a conventional packaging method
  • FIG. 2 is a schematic diagram of a packaging device in an embodiment of the present invention.
  • FIG. 3 is a second schematic view of a packaging device in an embodiment of the present invention.
  • FIG. 4 is a perspective view of a packaging device in an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of the LED display panel after the package is completed.
  • the present invention provides a packaging device for packaging a display panel, such as a light emitting diode display panel.
  • a packaging device for packaging a display panel, such as a light emitting diode display panel.
  • the packaging device is described in detail by taking the display panel as a light emitting diode display panel as an example.
  • 2 shows a light emitting diode display panel comprising a first substrate 1 and a second substrate 2 which are disposed opposite each other, and the first substrate 1 and the second substrate 2 can be encapsulated by a sealing material 3.
  • the packaging device includes a first adsorbing member 5 and a second adsorbing member 8 capable of attracting each other by magnetic force, and one of the first adsorbing member 5 and the second adsorbing member 8 is configured to be detachably disposed on the first substrate 1
  • the outer side that is, the side facing away from the second substrate 2, the other is configured to be detachably disposed outside the second substrate 2, that is, the side facing away from the first substrate 1.
  • the LED display panel may be an OLED (Organic Light Emitting Diode) display panel or an AMOLED (Active Matrix Organic Light Emitting Diode) display.
  • the first substrate 1 may be a cover plate
  • the second substrate 2 may be a display substrate including the light-emitting unit 4, or vice versa.
  • the light-emitting unit 4 can be formed on the second substrate 2 by vacuum evaporation, inkjet printing, spin coating, or the like.
  • the second substrate 2 may further include a thin film transistor device, a cathode, an anode, and the like.
  • the sealing material 3 When manufacturing the light emitting diode display panel, it is necessary to form a solid sealing material 3 by screen printing or the like on at least one of the first substrate 1 and the second substrate 2, and on the first substrate 1 and the second substrate 2 After the cassette is attached, the sealing material 3 needs to be melted to connect the first substrate 1 and the second substrate 2. After the first substrate 1 and the second substrate 2 are connected, the sealing material 3 in a molten state is solidified to The first substrate 1 and the second substrate 2 are packaged.
  • the first adsorbing member 5 and the second adsorbing member 8 are attracted to each other by magnetic force, so that the first substrate 1 and the second substrate 2 are well pressed together to avoid
  • the separation between the first substrate 1 and the second substrate 2 due to stress release when the sealing material 3 is melted improves the resulting packaging failure problem.
  • the compression method using magnetic attraction has the advantages of low cost, easy operation, and difficulty in damaging the display panel.
  • the specific structures of the first adsorbing member 5 and the second adsorbing member 8 are not particularly limited.
  • the first adsorbing member 5 and the second adsorbing member 8 are both magnets capable of generating a magnetic force, and both can be attracted to each other.
  • one of the first adsorbing member 5 and the second adsorbing member 8 is a magnet capable of generating a magnetic force, and the other is made of a ferromagnetic material capable of being attracted by a magnetic force.
  • the magnet may be a permanent magnet or an electromagnet.
  • the magnet is an electromagnet, and the electromagnet is energized only when the sealant 3 is melted, and the electromagnet is not required to be energized at other stages.
  • the first adsorbent 5 is made of a ferromagnetic material and the second adsorbent 8 comprises an electromagnet.
  • the electromagnet can generate an adsorption force to the first adsorbing member 5 made of a ferromagnetic material, so that the first substrate 1 and the second substrate 2 are completely sealed with the molten state during the melting of the sealing material 3.
  • the material 3 is bonded, that is, the first substrate 1 and the second substrate 2 can be kept connected at all times.
  • the ferromagnetic material has good thermal conductivity, and if it is in direct contact with the display panel, it can also serve as a heat conducting layer to reduce the heat released when the sealing material 3 is melted to the light emitting unit 4 The adverse effects produced. This improvement effect is more pronounced especially when the light-emitting unit 4 is an organic light-emitting unit.
  • a ferromagnetic material means a substance which is easily magnetized, such as iron, cobalt, nickel, or the like.
  • the packaging device further includes a first adsorbent carrier 6, and the first adsorbent 5 is disposed on the first adsorbent carrier 6.
  • the first adsorbing member 5 may be formed on the first adsorbent carrier 6 by sputtering or vacuum evaporation using a ferromagnetic material such as iron, cobalt, nickel or an alloy of the above metals.
  • the use of the first adsorbent carrier 6 facilitates the installation, alignment, etc. of the first adsorbent 5.
  • the first adsorbing member 5 includes a plurality of sub-adsorbing members, and a plurality of the sub-adsorbing members are formed with a space therebetween, and at least a portion of the first adsorbing member carrier 6 corresponding to the interval is capable of transmitting light.
  • the position of the space should be made to correspond to the position of the sealing material 3 so that the laser light emitted from the laser 7 can be irradiated onto the sealing material 3 and melted.
  • the first adsorbent carrier 6 can also transmit light as a whole, so that the illumination angle of the laser 7 is more free and easy to operate. Since the wavelength of the laser light which melts the sealing material 3 is usually 600-1000 nm, the first adsorbent carrier 6 can be made of a material having good transmittance to infrared light (600-1000 nm) by glass, quartz or the like having good flatness. production.
  • the packaging device provided by the present invention further includes a spacer 9.
  • the spacer 9 is disposed between the electromagnet and one of the first substrate 1 and the second substrate 2 on the outer side of which the electromagnet is disposed.
  • the electromagnet is disposed on the outer side of the second substrate 2, that is, the side of the second substrate 2 facing away from the first substrate 1, and the spacer 9 is disposed between the electromagnet and the second substrate 2. .
  • the spacer 9 is made of a non-ferromagnetic material, which means a material that does not generate magnetism under the action of a magnetic field, and therefore, the spacer 9 does not affect the magnetic field of the electromagnet.
  • the packaging device is installed, that is, after the first adsorbing member 5 and the second adsorbing member 8 are disposed on the first substrate 1 and the second substrate 2, the first adsorbing member 5 and the second adsorbing member
  • the orthographic projection of the member 8 on the first substrate 1 or the second substrate 2 is at least partially heavy
  • the first adsorbing member 5 corresponds to the position of the second adsorbing member 8, so that the adsorption force generated between the two adsorbing members can be better applied to the first substrate 1 and the second substrate 2, so that the two substrates are pressed. It is beneficial to enhance the packaging effect.
  • the first adsorbing member 5 includes a plurality of sub-adsorbing members, and the plurality of sub-adsorbing members may respectively correspond to the periphery and/or the inner circumference of the position of the sealing material 3.
  • the second adsorption member 8 in FIG. 4 includes a plurality of sub-electrodes independently controlled, and the plurality of sub-electrodes surround the display area of the LED display panel. Settings.
  • the magnetic poles of the plurality of sub-electromagnets are sequentially connected, that is, the N poles of each sub-electromagnet are connected to the S poles of the adjacent sub-electromagnets, and the S poles of each sub-electromagnet are adjacent to each other.
  • the N-pole connection of the sub-electromagnets are sequentially connected, that is, the N poles of each sub-electromagnet are connected to the S poles of the adjacent sub-electromagnets, and the S poles of each sub-electromagnet are adjacent to each other.
  • a plane formed by sequentially connecting the magnetic poles of the plurality of sub-electrodes is parallel to a plane in which the first adsorbing member 5 is located, so as to be fabricated, and the first substrate 1 and the second substrate 2 can be made. The pressure between them is more uniform.
  • the electrical signal applied to the electromagnet can be synchronized with the laser signal emitted by the laser 7, that is, as the scanning area of the laser on the sealing material 3 and the intensity of the light change, the electromagnet is adjusted.
  • the range and strength of the magnetic field thereby timely adjusting the pressure applied to the molten region of the sealing material 3 and the first substrate 1 and the second substrate 2 in the vicinity thereof, reducing the stress release due to the first substrate 1 and the second substrate 2
  • the resulting package is poor.
  • the laser can be incident from multiple directions and multiple angles in comparison with the laser, and the operation is very convenient.
  • the present invention can precisely control the area of the applied magnetic field and the magnitude of the magnetic force.
  • the electromagnet is composed of four sub-electrodes that are connected end to end with N poles and S poles.
  • the laser is moved along the sealing material 3, it is possible to select only the sub-electromagnetic corresponding to the area where the laser is being irradiated.
  • the body is energized, and according to the current laser light intensity, the size of the electrical signal is adjusted, so that the OLED display panel is uniformly packaged in various regions.
  • the present invention also provides a packaging method for packaging a display panel, such as a light emitting diode display panel.
  • a display panel such as a light emitting diode display panel.
  • the packaging method is described in detail by taking the display panel as a light emitting diode display panel as an example.
  • the LED display panel includes a first substrate and a second substrate disposed opposite to each other.
  • the packaging method includes the following steps:
  • the molten sealant is cured.
  • the orthographic projection of the first adsorbing member and the second adsorbing member on the first substrate and/or the second substrate at least partially coincides, that is, the positions of the first adsorbing member and the second adsorbing member
  • the positions of the first adsorbing member and the second adsorbing member correspond to the position of the sealing material.
  • the first adsorbing member is made of a ferromagnetic material
  • the second adsorbing member comprises an electromagnet.
  • the step of melting the sealing material energizing the electromagnet to generate a magnetic force of the second adsorbing member, thereby generating an adsorption force on the first adsorbing member made of a ferromagnetic material, thereby making the first
  • the substrate and the second substrate are completely bonded to the sealing material in a molten state; in the step of curing the molten sealing material, energization of the electromagnet is stopped.
  • the sealing material is melted by a laser
  • the electromagnet includes a plurality of sub-electrodes independently controlled, and the plurality of sub-electrodes are disposed around a display area of the LED display panel to melt the sealing
  • the sub-electromagnet corresponding to the region irradiated with the laser is energized.
  • the intensity of the electrical signal applied to the sub-electromagnet increases as the intensity of the laser light irradiated into the corresponding region of the sub-electromagnet increases;
  • the intensity of the electrical signal applied to the sub-electromagnet decreases as the intensity of the laser light irradiated to the region corresponding to the sub-electromagnet decreases.
  • the packaging method specifically includes:
  • the fabrication of the second substrate 2 and the light-emitting unit 4 is completed by a conventional thin film transistor fabrication process and a light-emitting unit evaporation process;
  • the preparation of the sealing material 3 is completed on one side of the first substrate 1 by screen printing, spraying, etc., and the sealing material 3 is formed by a baking process;
  • the first adsorbing member 5 is formed on the first adsorbing member carrier 6 by vacuum film forming and photolithography, and the first adsorbing member 5 is made of a ferromagnetic material, wherein the thickness of the first adsorbing member 5 is preferably greater than 5 nm.
  • the first adsorbing member 5 may include a plurality of sub-adsorbing members, each of the sub-adsorbing members preferably having a single side width of less than 50 mm;
  • the first adsorbing member 5 is disposed on a side of the first substrate 1 where the sealing material 3 is not disposed (ie, the outer side of the first substrate 1);
  • the second adsorbing member 8 is disposed on a side of the second substrate 2 where the light emitting unit 4 is not disposed (ie, the outer side of the second substrate 2), where the second adsorbing member 8 refers to an electromagnet;
  • the first substrate 1 and the second substrate 2 are paired with a box, and then the laser light emitted from the laser 7 is irradiated to the sealing material 3 to be melted, thereby connecting the first substrate 1 and the second substrate 2 together, and simultaneously
  • the electromagnet is applied with a voltage to generate magnetism to adsorb the first adsorbing member 5 made of a ferromagnetic material, so that the first substrate 1 and the second substrate 2 are well pressed together;
  • the voltage signal applied to the electromagnet can be synchronized with the laser signal emitted by the laser 7, and the adsorption range of the electromagnet can be adjusted in time for the change of the stress between the first substrate 1 and the second substrate 2.
  • the size of the magnetic field, and then the pressure applied to the first substrate 1 and the second substrate 2 in the melting region of the sealing material 3 and its vicinity is adjusted in time;
  • the first adsorbent carrier 6 (and the first adsorbing member 5 disposed thereon) and the second adsorbing member 8 are disassembled to obtain a packaged LED display panel as shown in FIG.
  • the seal material mentioned in the present invention may be an existing glass frit.
  • the invention can effectively avoid the separation between the first substrate 1 and the second substrate 2 due to stress release during the melting process of the sealing material 3, thereby improving the packaging defect problem caused thereby.
  • the first adsorbing member 5 and the second adsorbing member 8 in the present invention are both visible
  • the external attachment of the display panel, that is, detachably disposed on the first substrate 1 and the second substrate 2 can be repeatedly used for recycling, thereby saving cost.

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  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
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Abstract

本发明公开了一种封装装置和一种封装方法，涉及显示面板制造技术领域。所述封装装置用于封装显示面板，所述显示面板包括相对设置的第一基板和第二基板，所述第一基板和所述第二基板能够通过封接料封装，所述封装装置包括能够通过磁力互相吸引的第一吸附件和第二吸附件，所述第一吸附件和所述第二吸附件中的一者配置为可拆卸地设置在所述第一基板的外侧，另一者配置为可拆卸地设置在所述第二基板的外侧。本发明可以有效避免在封接料熔化过程中，第一基板与第二基板之间由于应力释放而导致的分离，从而改善了由此造成的封装不良问题。同时，本发明中的第一吸附件和第二吸附件均是显示面板的外加附件，可重复循环使用，节约成本。

Description

封装装置和封装方法 技术领域
本发明涉及显示面板制造技术领域，尤其涉及一种封装装置和一种封装方法。
背景技术
目前发光二极管(LED，Light Emitting Diode)显示面板主要采用玻璃料(Frit)来进行封装。图1是现有封装方式的示意图，第一基板1和第二基板2之间通过封接料3(例如玻璃料)封装在一起，其中第二基板2上设置有发光单元4。封装过程中，使用激光器7照射固态的封接料3使之熔化，而在封接料3再次固化之后，就能够将第一基板1和第二基板2封装在一起。
由于激光器一次只能对局部的封接料3进行照射，而局部封接料3熔化时，第一基板1与第二基板2之间会发生应力释放现象，释放的应力容易使两者分离，导致封接料3不能有效封装第一基板1和第二基板2，从而产生封装不良问题。
针对上述问题，现有技术中的一种解决方法是：在第一基板1的外侧(即背离第二基板2的一侧)设置受热膨胀层和其它夹层，当封接料3受到激光器照射而熔化时，产生的热量同时传递给受热膨胀层，受热膨胀层受热后发生膨胀，从而将第一基板1压附在第二基板2上，以防止两者由于应力释放而发生分离。但是，这种方法需要保持激光器由下向上照射(即从第二基板2向第一基板1的方向照射)，不方便操作，而且，由于该受热膨胀层一般采用有机高分子材料或者弹性橡胶材料制作，容易造成环境污染。
现有技术中的另一种解决方法是：在第一基板1与第二基板2的外侧均添加压板组件，为第一基板1和第二基板2提供夹持力，同时设置传感器感应两者之间压力的大小，避免由于夹持力太小而造成 密封效果差，或者由于夹持力过大而造成器件损伤，从而改善封装质量。但是，这种方法在封装时，由于第一基板1与第二基板2的间距非常小(通常在20μm以下)，传感器很难有效感应第一基板1和第二基板2之间压力的大小，而且如何实现传感器与两基板的有效整合也是个难题。
发明内容
本发明的目的在于提供一种封装装置和一种封装方法，以改善封接料熔化时，发光二极管显示面板的两基板之间由于应力释放而导致的封装不良问题。
为解决上述技术问题，作为本发明的第一个方面，提供一种封装装置，用于封装显示面板，所述显示面板包括相对设置的第一基板和第二基板，所述第一基板和所述第二基板能够通过封接料封装，所述封装装置包括能够通过磁力互相吸引的第一吸附件和第二吸附件，所述第一吸附件和所述第二吸附件中的一者配置为可拆卸地设置在所述第一基板的外侧，另一者配置为可拆卸地设置在所述第二基板的外侧。
优选地，所述第一吸附件采用铁磁性材料制成，所述第二吸附件包括电磁体。
优选地，所述封装装置还包括第一吸附件载体，所述第一吸附件设置在所述第一吸附件载体上。
优选地，所述第一吸附件包括多个子吸附件，多个所述子吸附件之间形成有间隔，所述第一吸附件载体上至少对应于所述间隔的部分能够透光。
优选地，所述封装装置还包括隔离件，所述隔离件设置在所述电磁体与所述第一基板和所述第二基板中外侧设置有所述电磁体的一者之间，所述隔离件由非铁磁性材料制成。
优选地，所述电磁体包括独立控制的多个子电磁体。
优选地，所述显示面板为发光二极管显示面板。
作为本发明的第二个方面，还提供一种封装方法，用于封装显 示面板，所述显示面板包括相对设置的第一基板和第二基板，所述封装方法包括以下步骤：
在所述第一基板和所述第二基板的至少一者上设置固态的封接料；
将所述第一基板和所述第二基板对盒；
将第一吸附件和第二吸附件中的一者设置在所述第一基板的外侧；
将第一吸附件和第二吸附件中的另一者设置在所述第二基板的外侧；
熔化所述封接料，以将所述第一基板和所述第二基板连接，其中，至少当所述封接料熔化时，所述第一吸附件和所述第二吸附件之间通过磁力互相吸引；以及
将熔化的封接料固化。
优选地，所述第一吸附件与所述第二吸附件在所述第一基板和/或所述第二基板上的正投影至少部分重合。
优选地，所述第一吸附件和所述第二吸附件的位置对应于所述封接料的位置。
优选地，所述第一吸附件采用铁磁性材料制成，所述第二吸附件包括电磁体，在熔化所述封接料的步骤中，向所述电磁体通电，以使所述第二吸附件产生磁力；在将熔化的封接料固化的步骤中，停止向所述电磁体通电。
优选地，利用激光熔化所述封接料，所述电磁体包括独立控制的多个子电磁体，多个所述子电磁体环绕所述显示面板的显示区域设置，在熔化所述封接料的步骤中，向激光照射的区域对应的所述子电磁体通电。
优选地，施加在所述子电磁体上的电信号的强度随照射至与所述子电磁体对应的区域的激光的强度的增大而增大；
施加在所述子电磁体上的电信号的强度随照射至与所述子电磁体对应的区域的激光的强度的减小而减小。
本发明可以有效避免在封接料熔化过程中，第一基板与第二基 板之间由于应力释放而导致的分离，从而改善了由此造成的封装不良问题。同时，本发明中的第一吸附件和第二吸附件均是显示面板的外加附件，可重复循环使用，节约成本。
附图说明
附图是用来提供对本发明的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本发明，但并不构成对本发明的限制。
图1是现有封装方式的示意图；
图2是本发明实施例中的封装装置的示意图之一；
图3是本发明实施例中的封装装置的示意图之二；
图4是本发明实施例中的封装装置的立体示意图；以及
图5是封装完成后的发光二极管显示面板的示意图。
具体实施方式
以下结合附图对本发明的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本发明，并不用于限制本发明。
本发明提供了一种封装装置，用于封装显示面板，例如发光二极管显示面板。在下面的具体实施例中以所述显示面板为发光二极管显示面板为例详细描述所述封装装置。图2示出了发光二极管显示面板，其包括相对设置的第一基板1和第二基板2，第一基板1和第二基板2能够通过封接料3封装。所述封装装置包括能够通过磁力互相吸引的第一吸附件5和第二吸附件8，第一吸附件5和第二吸附件8中的一者设配置为可拆卸地置在第一基板1的外侧，即背离第二基板2的一侧，另一者配置为可拆卸地设置在第二基板2的外侧，即背离第一基板1的一侧。
这里的发光二极管显示面板可以是OLED(Organic Light Emitting Diode，有机发光二极管)显示面板，或者AMOLED(Active Matrix Organic Light Emitting Diode，有源矩阵有机发光二极管)显 示面板。这里的第一基板1可以是盖板，第二基板2可以是包括发光单元4的显示基板，反之亦可。若第二基板2为显示基板，则发光单元4可以通过真空蒸镀、喷墨打印、旋涂等方式形成在第二基板2上。此外，第二基板2上还可包括薄膜晶体管器件、阴极、阳极等结构。
在制造发光二极管显示面板时，需要向第一基板1和第二基板2中的至少一者上通过丝网印刷等方式形成固态的封接料3，并且在第一基板1和第二基板2对盒后，需要将封接料3熔化，以将第一基板1和第二基板2连接，在第一基板1和第二基板2连接之后，再将熔化状态的封接料3固化，以封装第一基板1和第二基板2。
本发明在封接料3熔化的过程中，第一吸附件5和第二吸附件8之间通过磁力互相吸引，使第一基板1和第二基板2被很好地压附在一起，避免了封接料3熔化时第一基板1与第二基板2之间由于应力释放而导致的分离，从而改善了由此造成的封装不良问题。与现有技术相比，采用磁力吸引的压附方式的优点在于成本低、便于操作，并且不容易损伤显示面板。
在本发明中，对第一吸附件5和第二吸附件8的具体结构并没有特殊的限定。例如，第一吸附件5和第二吸附件8均为能够产生磁力的磁体，且两者能够互相吸引。或者，第一吸附件5和第二吸附件8中的一者为能够产生磁力的磁体，另一者采用能够被磁力所吸引的铁磁性材料制成。磁体可以是永磁体也可以是电磁体。为了便于控制，并且获得良好的显示效果，优选地，所述磁体为电磁体，且仅在封接料3熔化时，向电磁体通电，在其他阶段都不需向电磁体通电。
在一个示例中，第一吸附件5采用铁磁性材料制成，第二吸附件8包括电磁体。所述电磁体能够对采用铁磁性材料制成的第一吸附件5产生吸附力，从而在封接料3熔化的过程中，使第一基板1和第二基板2均完全与熔化状态的封接料3贴合，即，可以保持第一基板1和第二基板2始终连接。
而且，铁磁性材料导热性良好，如果其与显示面板直接接触，还可以作为导热层，以减少封接料3熔化时释放的热量对发光单元4 产生的不良影响。尤其当发光单元4为有机发光单元时，这种改善效果更为明显。
本领域技术人员应当理解的是，在本发明中，铁磁性材料是指易于磁化的物质，比如铁、钴、镍等。
进一步地，所述封装装置还包括第一吸附件载体6，第一吸附件5设置在第一吸附件载体6上。本发明中，第一吸附件5可采用诸如铁、钴、镍或上述金属的合金等铁磁性材料通过溅射或真空蒸镀等方式形成在第一吸附件载体6上。使用第一吸附件载体6有利于第一吸附件5的安装、对位等操作。
在图2中，第一吸附件5包括多个子吸附件，多个所述子吸附件之间形成有间隔，第一吸附件载体6上至少对应于所述间隔的部分能够透光。在对发光二极管显示面板进行封装时，应该使所述间隔的位置对应于封接料3所在的位置，以使激光器7发射的激光能够照射到封接料3上，并使之熔化。
显然，第一吸附件载体6也可以整体透光，这样激光器7的照射角度更加自由，便于操作。由于使封接料3熔化的激光的波长通常在600-1000nm，因此，第一吸附件载体6可以由平坦度良好的玻璃、石英等对红外光(600-1000nm)透过性能较好的材料制成。
为了防止第二吸附件8中的电磁体直接贴附到第一基板1或第二基板2上时造成污染，本发明所提供的封装装置还包括隔离件9。隔离件9设置在所述电磁体与第一基板1和第二基板2中外侧设置有所述电磁体的一者之间。例如在图3中，所述电磁体设置在第二基板2的外侧，即第二基板2背离第一基板1的一侧，那么隔离件9设置在所述电磁体与第二基板2之间。
隔离件9由非铁磁性材料制成，非铁磁性材料是指在磁场的作用下不会产生磁性的材料，因而，隔离件9不会对所述电磁体的磁场造成影响。
优选地，当所述封装装置设置完成后，即，当第一吸附件5与第二吸附件8被设置在第一基板1和第二基板2上后，第一吸附件5与第二吸附件8在第一基板1或第二基板2上的正投影至少部分重 合，即第一吸附件5与第二吸附件8的位置相对应，使得两者之间产生的吸附力能够更好地作用于第一基板1和第二基板2，使两基板被压紧，有利于增强封装效果。
如上所述，第一吸附件5包括多个子吸附件，多个所述子吸附件可以分别对应于封接料3位置的外围和/或内围。
图4是本发明实施例中的封装装置的立体示意图，图4中的第二吸附件8包括独立控制的多个子电磁体，多个所述子电磁体环绕所述发光二极管显示面板的显示区域设置。例如在图4中，多个所述子电磁体的磁极顺次连接，即每个子电磁体的N极均与相邻子电磁体的S极连接，每个子电磁体的S极均与相邻子电磁体的N极连接。
优选地，多个所述子电磁体的磁极顺次连接后形成的图形所在的平面与第一吸附件5所在的平面平行，以便于制作，并且能够使第一基板1与第二基板2之间受到的压力更加均匀。
在本发明中，可以使施加在电磁体上的电信号与激光器7发射的激光信号同步，即随着激光在封接料3上的扫描区域和光强的变化，调整所述电磁体产生的磁场的范围和强度，从而及时调整对封接料3的熔化区域及其附近的第一基板1和第二基板2施加的压力，减少由于第一基板1和第二基板2之间的应力释放所导致的封装不良。
与现有技术中，激光器只能从下向上照射相比，本发明中激光器能够从多个方向以及多个角度入射，操作十分方便。
同时，本发明可以精确控制施加的磁场的区域以及磁力的大小。例如在图4中，所述电磁体由四条N极、S极首尾相接的子电磁体构成，激光沿着封接料3移动照射时，可以选择只对激光正在照射的区域对应的子电磁体通电，并根据当前激光的光强，调整电信号的大小，使有机发光二极管显示面板在各个区域均匀封装。
本发明还提供了一种封装方法，用于封装显示面板，例如发光二极管显示面板。在下面的具体实施例中以所述显示面板为发光二极管显示面板为例详细描述所述封装方法。所述发光二极管显示面板包括相对设置的第一基板和第二基板。
所述封装方法包括以下步骤：
在所述第一基板和所述第二基板的至少一者上设置固态的封接料；
将所述第一基板和所述第二基板对盒；
将第一吸附件和第二吸附件中的一者设置在所述第一基板的外侧，即背离第二基板的一侧；
将第一吸附件和第二吸附件中的另一者设置在所述第二基板的外侧，即背离第一基板的一侧；
熔化所述封接料，以将所述第一基板和所述第二基板连接，其中，当所述封接料熔化时，所述第一吸附件和所述第二吸附件之间通过磁力互相吸引；
将熔化的封接料固化。
优选地，所述第一吸附件与所述第二吸附件在所述第一基板和/或所述第二基板上的正投影至少部分重合，即第一吸附件与第二吸附件的位置相对应，且所述第一吸附件和所述第二吸附件的位置均对应于所述封接料的位置。
进一步地，所述第一吸附件采用铁磁性材料制成，所述第二吸附件包括电磁体。在熔化所述封接料的步骤中，向所述电磁体通电，以使所述第二吸附件产生磁力，从而对采用铁磁性材料制成的第一吸附件产生吸附力，进而使第一基板和第二基板完全与熔化状态的封接料贴合；在将熔化的封接料固化的步骤中，停止向所述电磁体通电。
进一步地，利用激光熔化所述封接料，所述电磁体包括独立控制的多个子电磁体，多个所述子电磁体环绕所述发光二极管显示面板的显示区域设置，在熔化所述封接料的步骤中，向激光照射的区域对应的所述子电磁体通电。
进一步地，施加在所述子电磁体上的电信号的强度随照射至所述子电磁体对应的区域内的激光的强度的增大而增大；
施加在所述子电磁体上的电信号的强度随照射至与所述子电磁体对应的区域的的激光的强度的减小而减小。
下面根据图2中所示的结构，对本发明提供的封装方法进行详细的描述。
对于图2中所示的结构，所述封装方法具体包括：
由传统的薄膜晶体管制作工艺及发光单元蒸镀工艺分别完成第二基板2和发光单元4的制作；
通过丝网印刷、喷涂等方式在第一基板1的一侧上完成封接料3的制作，并通过烘烤工艺，使封接料3成型；
在第一吸附件载体6上通过真空成膜及光刻等工艺完成第一吸附件5的制作，第一吸附件5采用铁磁性材料制成，其中，第一吸附件5的厚度优选大于5nm，第一吸附件5可以包括多个子吸附件，每个所述子吸附件的单边宽度优选小于50mm；
将第一吸附件5设置在第一基板1的未设置封接料3的一侧(即，第一基板1的外侧)；
将第二吸附件8设置在第二基板2的未设置有发光单元4的一侧(即，第二基板2的外侧)，这里第二吸附件8指电磁体；
将第一基板1和第二基板2对盒，再使激光器7发射出的激光照射封接料3使之熔化，从而将第一基板1与第二基板2连接在一起，同时，给所述电磁体加电压使之产生磁性，以吸附采用铁磁性材料制成的第一吸附件5，进而使第一基板1和第二基板2被很好地压附在一起；
另外，可以使施加在所述电磁体上的电压信号与激光器7发射的激光信号同步，针对第一基板1与第二基板2之间的应力变化情况，及时调整所述电磁体的吸附范围和磁场大小，进而及时调整对封接料3的熔化区域及其附近针对第一基板1和第二基板2施加的压力；
封接料3熔化并完成第一基板1与第二基板2的封装后，关闭施加在所述电磁体上的电压信号；
拆卸第一吸附件载体6(以及设置在其上的第一吸附件5)和第二吸附件8，得到封装完成的发光二极管显示面板，如图5中所示。
本发明中提及的封接料可采用现有的玻璃料。
本发明可以有效避免在封接料3熔化过程中，第一基板1与第二基板2之间由于应力释放而导致的分离，从而改善了由此造成的封装不良问题。同时，本发明中的第一吸附件5和第二吸附件8均是显 示面板的外加附件，即，以可拆卸的方式设置在第一基板1与第二基板2上，可重复循环使用，节约成本。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (14)

  1. 一种封装装置，用于封装显示面板，所述显示面板包括相对设置的第一基板和第二基板，所述第一基板和所述第二基板能够通过封接料封装，其特征在于，所述封装装置包括能够通过磁力互相吸引的第一吸附件和第二吸附件，所述第一吸附件和所述第二吸附件中的一者配置为可拆卸地设置在所述第一基板的外侧，另一者配置为可拆卸地设置在所述第二基板的外侧。
  2. 根据权利要求1所述的封装装置，其特征在于，所述第一吸附件采用铁磁性材料制成，所述第二吸附件包括电磁体。
  3. 根据权利要求2所述的封装装置，其特征在于，所述封装装置还包括第一吸附件载体，所述第一吸附件设置在所述第一吸附件载体上。
  4. 根据权利要求3所述的封装装置，其特征在于，所述第一吸附件包括多个子吸附件，多个所述子吸附件之间形成有间隔，所述第一吸附件载体上至少对应于所述间隔的部分能够透光。
  5. 根据权利要求2所述的封装装置，其特征在于，所述封装装置还包括隔离件，所述隔离件设置在所述电磁体与所述第一基板和所述第二基板中外侧设置有所述电磁体的一者之间，所述隔离件由非铁磁性材料制成。
  6. 根据权利要求2所述的封装装置，其特征在于，所述电磁体包括独立控制的多个子电磁体。
  7. 根据权利要求1-6中任一项所述的封装装置，其特征在于，所述显示面板为发光二极管显示面板。
  8. 一种封装方法，用于封装显示面板，所述显示面板包括相对设置的第一基板和第二基板，其特征在于，所述封装方法包括以下步骤：
    在所述第一基板和所述第二基板的至少一者上设置固态的封接料；
    将所述第一基板和所述第二基板对盒；
    将第一吸附件和第二吸附件中的一者设置在所述第一基板的外侧；
    将第一吸附件和第二吸附件中的另一者设置在所述第二基板的外侧；
    熔化所述封接料，以将所述第一基板和所述第二基板连接，其中，至少当所述封接料熔化时，所述第一吸附件和所述第二吸附件之间通过磁力互相吸引；以及
    将熔化的封接料固化。
  9. 根据权利要求8所述的封装方法，其特征在于，所述第一吸附件与所述第二吸附件在所述第一基板或所述第二基板上的正投影至少部分重合。
  10. 根据权利要求8所述的封装方法，其特征在于，所述第一吸附件和所述第二吸附件的位置对应于所述封接料的位置。
  11. 根据权利要求8至10中任意一项所述的封装方法，其特征在于，所述第一吸附件采用铁磁性材料制成，所述第二吸附件包括电磁体，在熔化所述封接料的步骤中，向所述电磁体通电，以使所述第二吸附件产生磁力；在将熔化的封接料固化的步骤中，停止向所述电磁体通电。
  12. 根据权利要求11所述的封装方法，其特征在于，利用激光 熔化所述封接料，所述电磁体包括独立控制的多个子电磁体，多个所述子电磁体环绕所述显示面板的显示区域设置，在熔化所述封接料的步骤中，向激光照射的区域对应的所述子电磁体通电。
  13. 根据权利要求12所述的封装方法，其特征在于，施加在所述子电磁体上的电信号的强度随照射至与所述子电磁体对应的区域的激光的强度的增大而增大；
    施加在所述子电磁体上的电信号的强度随照射至与所述子电磁体对应的区域的激光的强度的减小而减小。
  14. 根据权利要求11所述的封装方法，其特征在于，所述显示面板为发光二极管显示面板。
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