WO2016062038A1 - 用于封装母板的真空吸附系统及吸附方法、封装装置 - Google Patents

用于封装母板的真空吸附系统及吸附方法、封装装置 Download PDF

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WO2016062038A1
WO2016062038A1 PCT/CN2015/076707 CN2015076707W WO2016062038A1 WO 2016062038 A1 WO2016062038 A1 WO 2016062038A1 CN 2015076707 W CN2015076707 W CN 2015076707W WO 2016062038 A1 WO2016062038 A1 WO 2016062038A1
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Prior art keywords
adsorption
mother board
package
platform
unit
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PCT/CN2015/076707
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English (en)
French (fr)
Inventor
杨久霞
白峰
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京东方科技集团股份有限公司
北京京东方光电科技有限公司
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Priority to JP2017541153A priority Critical patent/JP6458158B2/ja
Priority to EP15787886.9A priority patent/EP3211664B1/en
Priority to KR1020157033165A priority patent/KR101813774B1/ko
Priority to US14/785,641 priority patent/US10204815B2/en
Publication of WO2016062038A1 publication Critical patent/WO2016062038A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the invention belongs to the technical field of substrate packaging, and particularly relates to a vacuum adsorption system for packaging a mother board, a packaging device including the vacuum adsorption system, and an adsorption method of a vacuum adsorption system.
  • An organic light-emitting diode (OLED) display device is a novel display device, which has the advantages of good color saturation and wide viewing angle.
  • the luminescent materials and functional materials in the display device are sensitive to water and gas, and the water and gas resistance parameters of the corresponding products are required to have a permeability to oxygen of less than 10 -3 cc/m 2 /day; The permeability requirement is less than 10 -6 g/m 2 /day.
  • small and medium-sized organic light emitting diode display devices are often packaged by means of a printed frit.
  • the package is printed by means of printing frit.
  • the package mother board 20 is first placed on the vacuum adsorption platform 10 of the vacuum adsorption system, and the package mother board 20 is adsorbed by vacuuming to be fixed in the vacuum. Adsorbing the platform 10; then placing an alignment substrate (Mask substrate, not shown in FIG. 1) for determining the position of the printing frit on the package mother board 20, and then placing the glass along the slot on the alignment substrate
  • the material is printed onto the package mother board 20; finally, the alignment substrate is removed, and the other mother board is sealed with the package mother board 20 to form a package assembly.
  • a plurality of slots are formed on the alignment substrate, and the shape thereof may be a rectangular ring shape, and the area on the package mother board 20 may be divided into a plurality of display areas 22, a plurality of package areas 21, and a cutting area 23.
  • the size, shape and position of each slot on the alignment substrate correspond to the size, shape and position of a package area 21 on the package mother board 20. Therefore, the shape of the package area 21 may also be a rectangular ring shape ( As shown in FIG. 1 , the area surrounded by each package area 21 is a display area 22 , and the area between adjacent package areas 21 is a cutting area 23 , and the sealed package component is cut along the cutting area 23 .
  • a plurality of display panels are formed.
  • the vacuum adsorption platform of the vacuum adsorption system used in the prior art mostly adopts a groove manner or a method of adsorbing holes.
  • the common disadvantage is that the position on the package mother board on the vacuum adsorption platform corresponding to the slot on the alignment substrate, that is, the package area on the package mother board is bound to be due to vacuum
  • the adsorption force of the adsorption platform is deformed, which results in a large difference in the surface section of the printed glass frit. Therefore, when the package mother board is sealed with another mother board, the sealing is poor due to tight adhesion, thereby Affects the life of the display device.
  • the present invention provides a vacuum adsorption system for packaging a mother board, an adsorption method, and a packaging device, which can ensure the surface of the glass frit printed on the package mother board is flat, thereby making the The package mother board can be well sealed to another motherboard.
  • a vacuum adsorption system for a package motherboard comprising a vacuum adsorption platform, the vacuum adsorption system further comprising:
  • a carrying platform is disposed on the vacuum adsorption platform and has an edge sealed with an edge of the vacuum adsorption platform, the carrying platform is configured to carry a packaging mother board, and a plurality of adsorption units are disposed thereon, the adsorption unit and The vacuum adsorption platform cooperates to adsorb to fix the package mother board;
  • a detecting unit configured to detect a positional relationship between the adsorption unit on the carrying platform and a packaging area on the package mother board;
  • an adjusting unit configured to: when the detecting unit detects that the position of the adsorption unit on the carrying platform coincides with the packaging area on the packaging mother board, adjust the position of the carrying platform, so that at least part of the adsorption unit on the carrying platform is located The position does not coincide with the package area on the package mother board.
  • a plurality of the adsorption units may be evenly distributed on the carrier platform.
  • the structure of the adsorption unit may be a circular hole, a square hole or a rectangular hole.
  • the detecting unit may be an optical ranging unit.
  • the vacuum adsorption system may further include:
  • control unit configured to control, according to a positional relationship between a location of the adsorption unit on the loading platform and a packaging area on the package motherboard output by the detecting unit, to adjust the position of the loading platform So that at least a portion of the adsorption unit on the carrying platform does not coincide with a package area on the package mother board.
  • the vacuum adsorption system may further include:
  • an air suction device configured to adsorb the package mother board through the adsorption hole on the vacuum adsorption platform and the adsorption unit on the bearing platform to be fixed on the bearing platform.
  • a package device including the above vacuum adsorption system is provided.
  • adsorption method for adsorbing a vacuum adsorption system, wherein the vacuum adsorption system employs the above vacuum adsorption system, and the adsorption method comprises the following steps:
  • the detecting the positional relationship between the adsorption unit on the carrying platform and the packaging area on the package mother board may be: detecting the adsorption unit on the carrying platform and the package adjacent to the adsorption unit on the packaging mother board The distance between the areas.
  • the step of adjusting the position of the carrying platform so that at least a part of the adsorption unit on the carrying platform does not overlap with the packaging area on the packaging mother board may further include the following steps:
  • the package mother board is vacuum adsorbed onto the carrier platform.
  • the vacuum adsorption system of the invention increases the bearing platform, and the vacuum adsorption platform of the prior art is directly contacted and carried by the bearing platform.
  • the mother board is installed, and in order to avoid the problems in the prior art, the detecting unit and the adjusting unit are further added, so that the positional relationship between the packaging board packaging area and the adsorption unit on the carrying platform can be detected, when the two are coincident
  • the position of the carrying platform can be adjusted by the adjusting unit, so that the packaging area on the packaging mother board does not overlap with at least the position of the adsorption unit on the carrying platform, so that the surface of the packaging mother board is still flat after the printing of the glass material. It can be well sealed with another motherboard to form a package assembly, so that the components between the two motherboards can be well sealed.
  • the adsorption method of the vacuum adsorption system of the present invention can at least make the partial adsorption unit on the carrier platform not overlap with the package area on the package mother board, so that the glass frit printed on the package mother board can be made by the adsorption method of the present invention.
  • the surface is flat, so that the package mother board can be well sealed with another mother board, and there is no gap at the sealing position, so that the components packaged between the two mother boards have a longer life and are safer.
  • Figure 1 is a schematic view of a conventional vacuum adsorption system
  • Example 2 is a schematic view of a vacuum adsorption system of Example 1 of the present invention.
  • the embodiment provides a vacuum adsorption system for packaging the motherboard 20.
  • the package mother board 20 is sealed with another motherboard to form a package assembly, and the package assembly is formed by cutting.
  • a plurality of display panels, the vacuum adsorption system comprising a vacuum adsorption platform 10, a load bearing platform 30 disposed on the vacuum adsorption platform 10 and having an edge sealed with an edge of the vacuum adsorption platform, a detection unit, and an adjustment unit.
  • the carrying platform 30 is configured to carry the package mother board 20, and is provided with a plurality of adsorption units 31, and the adsorption unit 31 cooperates with the vacuum adsorption platform 10 to adsorb
  • the detecting unit is configured to detect the positional relationship between the adsorption unit 31 on the carrying platform 30 and the packaging area 21 on the package mother board 20; the adjusting unit is configured to detect the adsorption on the carrying platform 30 when the detecting unit detects When the location of the unit 31 coincides with the encapsulation area 21 on the package mother board 20, the position of the carrier platform 30 is adjusted such that at least a portion of the adsorption unit 31 on the carrier platform 30 does not coincide with the package area 21 on the package mother board 20.
  • the vacuum adsorption system of the present embodiment increases the load bearing platform 30.
  • the load-bearing platform 30 avoids the vacuum adsorption platform 10 of the prior art directly contacting and carrying the package mother board 20, and at the same time, in order to avoid the prior art.
  • the problem is that the detecting unit and the adjusting unit are also added, so that the positional relationship between the package area 21 of the package mother board 20 and the adsorption unit 31 on the carrying platform 30 can be detected. When the two are coincident, the adjusting unit can be adjusted.
  • the position of the carrying platform 30 is adjusted such that the package area 21 on the package mother board 20 does not overlap with at least the position of the partial adsorption unit 31 on the carrying platform 30, so that the package mother board 20 is printed with the glass frit (the glass frit)
  • the back surface of the package area 21 printed on the package mother board 20 is still flat, and can be well sealed with another mother board to form a package assembly, so that the package between the two mother boards can be well sealed. .
  • the area on the package mother board 20 may be divided into a plurality of display areas 22, a plurality of package areas 21, and a cutting area 23, wherein each of the package areas 21 may have a rectangular shape (see FIG. 2). As shown, the area surrounded by each package area 21 is a display area 22, and the area between adjacent package areas 21 is a cutting area 23, and the sealed package component is cut along the cutting area 23 to form a plurality of Display panels.
  • the adjusting unit can adjust the loading platform 30 to move in the horizontal direction or in the vertical direction.
  • the moving in the horizontal direction and the vertical direction as described herein refers to moving on the same horizontal plane, so when the adjusting unit adjusts the position of the carrying platform 30
  • the position corresponding to the adsorption unit 31 of the carrying platform 30 can be adjusted to correspond to the cutting area 23 on the package mother board 20, thereby avoiding the package area 21 on the package mother board 20.
  • a plurality of the adsorption units 31 on the carrying platform 30 are evenly distributed on the carrying platform 30, so that the packaging mother board 20 is adsorbed onto the carrying platform 30.
  • the adsorption force is more uniform, so as to avoid damage to the package mother board due to uneven force.
  • the structure of the adsorption unit 31 may be a circular hole, a square hole or a rectangular hole.
  • the structure of the adsorption unit 31 is not limited to these three shapes, and may be an open or slotted shape.
  • the detecting unit in this embodiment is an optical ranging unit, so that the distance between the package area 21 on the package mother board 20 and the adsorption unit 31 on the carrying platform 30 can be detected by the optical ranging unit.
  • the distance refers to the distance between the package area 21 on the package mother board 20 and the adsorption unit 31 adjacent to the area.
  • the adjusting unit can adjust the position of the carrying platform 30 according to the distance information, so that at least part of the adsorption unit 31 on the carrying platform 30 does not coincide with the packaging area 21 on the package mother board 20.
  • the vacuum adsorption system further includes: a control unit configured to control the adjustment unit to adjust the load bearing platform 30 according to the positional relationship between the position of the adsorption unit 31 and the package area 21 on the package mother board 20 output by the detection unit.
  • the position is such that at least a portion of the adsorption unit 31 on the carrier platform 30 does not coincide with the package area 21 on the package mother board 20.
  • the control unit may be a microprocessor or a PLC (Programmable Logic Controller) device.
  • the vacuum adsorption system in this embodiment preferably further includes an air suction device for passing through the adsorption holes (or other structures for adsorption) on the vacuum adsorption platform 10 and the load bearing platform 30.
  • the upper adsorption unit 31 adsorbs the package mother board 20 to be fixed on the carrier platform 30.
  • the present embodiment also provides a packaging device including the vacuum adsorption system described above.
  • This embodiment provides a method for adsorbing a vacuum adsorption system, which may be the vacuum adsorption system described in Embodiment 1, and the adsorption method will be described in detail below with reference to FIG.
  • the adsorption method specifically includes the following steps S01 to S04.
  • the package mother board 20 is placed above the carrier platform 30.
  • the package mother board 20 can be suspended above the carrier platform 30 by a robot, but the distance between the package mother board 20 and the carrier platform 30 is prevented from being excessive, so as to avoid the following steps being inaccurate.
  • the step is specifically: detecting the distance between the adsorption unit 31 on the carrying platform 30 and the package area 21 on the package mother board 20 adjacent to the adsorption unit 31, so as to determine the adsorption unit 31 and the package mother board 20 on the carrier platform 30. The positional relationship of the package area 21 adjacent to the adsorption unit 31.
  • the position of the carrier platform 30 is maintained; if the location of the adsorption unit 31 and the package area on the package mother board 20 are detected 21 coincides, then proceed to the next step.
  • the position of the carrier platform 30 is adjusted such that at least part of the adsorption unit 31 and the package area 21 on the package mother board 20 are thereon. No coincidence.
  • the package mother board 20 is vacuum-adsorbed onto the carrying platform 30.
  • the adsorption method of the vacuum adsorption system of the present embodiment can at least partially overlap the portion of the adsorption unit 31 on the carrier platform 30 with the package region 21 on the package mother board 20. Therefore, the package method can be made by the adsorption method of this embodiment.
  • the surface of the printed glass frit 20 is flat, so that the package mother board 20 can be well sealed with another mother board, and there is no gap at the sealing position, so that the life of the components packaged between the two mother boards is further improved. Long and safer.
  • FIG. 1 and FIG. 2 are only schematic views. For the sake of convenience, only a part of the adsorption holes 11/adsorption units 31 are shown. It should be understood that a plurality of adsorption holes arranged in rows/columns are disposed on the vacuum adsorption platform 10/support platform 30. 11 / adsorption unit 31.

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Abstract

本发明提供一种用于封装母板的真空吸附系统及其吸附方法、封装装置，属于基板封装技术领域。本发明的用于封装母板的真空吸附系统包括：真空吸附平台；承载平台，设于所述真空吸附平台上且其边缘与所述真空吸附平台的边缘密封，用于承载封装母板，且其上设置有多个吸附单元，所述吸附单元和所述真空吸附平台相配合以吸附从而固定所述封装母板；检测单元，用于检测所述承载平台上的吸附单元与所述封装母板上的封装区域的位置关系；以及调整单元，用于当检测单元检测到所述承载平台上的吸附单元所在位置与所述封装母板上的封装区域重合时，调整所述承载平台位置，使得所述承载平台上的至少部分吸附单元所在位置与所述封装母板上的封装区域无重合。

Description

用于封装母板的真空吸附系统及吸附方法、封装装置 技术领域
本发明属于基板封装技术领域，具体涉及一种用于封装母板的真空吸附系统、一种包括所述真空吸附系统的封装装置、以及一种真空吸附系统的吸附方法。
背景技术
有机发光二极管(Organic Light-Emitting Diode，OLED)显示器件作为新型显示器件，其具有良好的色彩饱和度和广视角的优点。但是其显示器件内的发光材料和功能材料对水和气比较敏感，其相应产品的耐水和耐气的参数要求有：对氧的渗透率要求小于10-3cc/m2/day；对水的渗透率要求小于10-6g/m2/day。目前中小尺寸的有机发光二极管显示器件多采用印刷玻璃料(Frit)的方式进行封装。
如图1所示，采用印刷玻璃料的方式进行封装具体为：首先将封装母板20放置在真空吸附系统的真空吸附平台10上，通过抽真空的方式将封装母板20吸附从而固定在真空吸附平台10上；然后将用于确定印刷玻璃料位置的对位基板(Mask基板，图1中未示出)放置在封装母板20上，再然后沿着对位基板上的开槽将玻璃料印刷到封装母板20上；最后将对位基板取下来，将另一母板与封装母板20封接，以形成封装组件。需要说明的是，对位基板上设置有多个开槽，其形状可以为矩形环状，封装母板20上的区域可划分为多个显示区域22、多个封装区域21、以及切割区域23，对位基板上的每个开槽的尺寸、形状和位置均与封装母板20上的一个封装区域21的尺寸、形状和位置相对应，故封装区域21的形状也可以为矩形环状(如图1所示)，每个封装区域21围绕的区域为一个显示区域22，相邻封装区域21之间的区域为切割区域23，沿着切割区域23将封接好的封装组件进行切割就形成了多个显示面板。
发明人发现现有技术中至少存在如下问题：现有技术中采用的真空吸附系统的真空吸附平台多采用沟槽的方式或吸附孔的方式。对于上述两种真空吸附平台，其共同的缺点是：位于真空吸附平台上的封装母板上与对位基板上的开槽相对应的位置处，即封装母板上的封装区域势必会由于真空吸附平台的吸附力作用而产生变形，进而导致所印刷的玻璃料表面段差较大，因此在封装母板与另一母板进行封接时就会因密合不严而造成封接不良，从而影响显示器件的寿命。
发明内容
针对现有的真空吸附系统存在的上述问题，本发明提供了一种用于封装母板的真空吸附系统及吸附方法、封装装置，能够保证封装母板上印刷的玻璃料表面平整，从而使得该封装母板可以与另一母板很好的密封。
作为本发明的一个方面，提供了一种用于封装母板的真空吸附系统，包括真空吸附平台，所述真空吸附系统还包括：
承载平台，设于所述真空吸附平台上且其边缘与所述真空吸附平台的边缘密封，所述承载平台用于承载封装母板，且其上设置有多个吸附单元，所述吸附单元和所述真空吸附平台相配合以吸附从而固定所述封装母板；
检测单元，用于检测所述承载平台上的吸附单元与所述封装母板上的封装区域的位置关系；以及，
调整单元，用于当检测单元检测到所述承载平台上的吸附单元所在位置与所述封装母板上的封装区域重合时，调整承载平台位置，使得所述承载平台上的至少部分吸附单元所在位置与所述封装母板上的封装区域无重合。
多个所述吸附单元可以均匀分布在所述承载平台上。
所述吸附单元的结构可以为圆形孔、方形孔或矩形孔。
所述检测单元可以为光学测距单元。
所述真空吸附系统还可以包括：
控制单元，用于根据所述检测单元输出的所述承载平台上的吸附单元所在位置与所述封装母板上的封装区域之间的位置关系，控制所述调整单元调整所述承载平台的位置，以使得所述承载平台上的至少部分吸附单元所在位置与所述封装母板上的封装区域无重合。
所述真空吸附系统还可以包括：
抽气装置，用于通过所述真空吸附平台上的吸附孔和所述承载平台上的吸附单元将封装母板吸附从而固定在承载平台上。
作为本发明的另一方面，提供了一种包括上述真空吸附系统的封装装置。
作为本发明的又一方面，提供了一种真空吸附系统的吸附方法，所述真空吸附系统采用上述的真空吸附系统，所述吸附方法包括如下步骤：
将所述封装母板放置在所述承载平台上方；
检测所述承载平台上的吸附单元与所述封装母板上的封装区域的位置关系，若检测到所述承载平台上的吸附单元所在位置与所述封装母板上的封装区域无重合，则保持承载平台的位置；若检测到所述承载平台上的吸附单元所在位置与所述封装母板上的封装区域重合，则执行下一步；
调整所述承载平台的位置，以使所述承载平台上的至少部分吸附单元与所述封装母板上的封装区域无重合。
检测所述承载平台上的吸附单元与所述封装母板上的封装区域的位置关系的步骤可以为：检测所述承载平台上的吸附单元与所述封装母板上和该吸附单元邻近的封装区域之间的距离。
调整所述承载平台的位置，以使所述承载平台上的至少部分吸附单元与所述封装母板上的封装区域无重合的步骤后还可以包括如下步骤：
将所述封装母板真空吸附至所述承载平台上。
本发明的真空吸附系统与现有技术相比增加了承载平台，通过承载平台避免了现有技术中的真空吸附平台直接接触并承载封 装母板，同时为了避免现有技术中所存在的问题，还增加了检测单元和调整单元，从而可以检测到封装母板封装区域与承载平台上的吸附单元的位置关系，当两者重合时，则可以通过调整单元调整承载平台的位置，以使得封装母板上的封装区域至少与承载平台上的部分吸附单元所在位置无重合，进而使得该封装母板在印刷完玻璃料后表面依然平整，可以很好的与另一母板进行封接以形成封装组件，从而可以很好的密封封装位于两母板之间的元件。
通过本发明的真空吸附系统的吸附方法至少可以使得承载平台上的部分吸附单元与封装母板上的封装区域无重合，故通过本发明的吸附方法，可以使得封装母板上印刷的玻璃料的表面平整，使得该封装母板可以很好的与另一母板封接，且在封接位置处无空隙，进而使得封装在两母板间的元器件寿命更长，更加安全。
附图说明
图1为现有的真空吸附系统的示意图；
图2为本发明的实施例1的真空吸附系统的示意图。
具体实施方式
为使本领域技术人员更好地理解本发明的技术方案，下面结合附图和具体实施方式对本发明作进一步详细描述。
[实施例1]
如图2所示，本实施例提供一种用于封装母板20的真空吸附系统，所述封装母板20与另一母板封接后形成封装组件，对所述封装组件进行切割后形成多个显示面板，所述真空吸附系统包括真空吸附平台10、设于所述真空吸附平台10上且其边缘与所述真空吸附平台的边缘密封的承载平台30、检测单元、以及调整单元。其中，承载平台30用于承载封装母板20，且其上设置有多个吸附单元31，所述吸附单元31和真空吸附平台10相配合以吸附从而 固定封装母板20；检测单元用于检测承载平台30上的吸附单元31与封装母板20上的封装区域21的位置关系；调整单元用于当检测单元检测到所述承载平台30上的吸附单元31所在位置与封装母板20上的封装区域21重合时，调整承载平台30位置，使得承载平台30上的至少部分吸附单元31所在位置与封装母板20上的封装区域21无重合。
本实施例的真空吸附系统与现有技术相比增加了承载平台30，通过承载平台30避免了现有技术中的真空吸附平台10直接接触并承载封装母板20，同时为了避免现有技术中所存在的问题，还增加了检测单元和调整单元，从而可以检测到封装母板20的封装区域21与承载平台30上的吸附单元31的位置关系，当两者重合时，则可以通过调整单元调整承载平台30的位置，以使得封装母板20上的封装区域21至少与承载平台30上的部分吸附单元31所在位置无重合，进而使得该封装母板20在印刷完玻璃料(该玻璃料印刷在封装母板20上的封装区域21内)后表面依然平整，可以很好的与另一母板进行封接以形成封装组件，从而可以很好的密封封装位于两母板之间的元件。
应当理解的是，封装母板20上的区域可划分为多个显示区域22、多个封装区域21，以及切割区域23，其中，每个封装区域21的形状可以为矩形环状(如图2所示)，每个封装区域21围绕的区域为一个显示区域22，相邻封装区域21之间的区域为切割区域23，沿着切割区域23将封接好的封装组件进行切割就形成了多个显示面板。该调整单元可以调整承载平台30沿水平方向移动或者沿垂直方向移动，此处所述的沿水平方向、垂直方向移动是指在同一水平面上移动，所以调整单元对承载平台30的位置进行调整时，可以将承载平台30的吸附单元31所对应的位置调整至与封装母板20上的切割区域23对应，从而避开了封装母板20上的封装区域21。
优选地，承载平台30上的多个所述吸附单元31均匀分布在所述承载平台30上，从而使得封装母板20吸附到承载平台30上 时所受到的吸附力更加均匀，以免由于受力不均而造成封装母板破损。进一步优选地，吸附单元31的结构可以为圆形孔、方形孔或矩形孔，当然吸附单元31的结构也不局限于这三种形状，还可以是开口、开槽的形状。
优选地，本实施例中的检测单元为光学测距单元，故可以通过该光学测距单元检测出封装母板20上的封装区域21与承载平台30上的吸附单元31的之间的距离。应当理解的是，该距离是指封装母板20上的封装区域21与该区域相邻的吸附单元31之间的距离。调整单元可以根据该距离信息调整承载平台30的位置，以使承载平台30上的至少部分吸附单元31所在位置与封装母板20上的封装区域21无重合。
优选地，真空吸附系统还包括：控制单元，用于根据检测单元输出的所述吸附单元31所在位置与封装母板20上的封装区域21之间的位置关系，控制调整单元调整承载平台30的位置，以使承载平台30上的至少部分吸附单元31所在位置与封装母板20上的封装区域21无重合。该控制单元可以是微处理器也可以是PLC(Programmable Logic Controller，可编程逻辑控制器)器件。
当然，本实施例中的真空吸附系统还优选地包括抽气装置，该抽气装置用于通过所述真空吸附平台10上的吸附孔(或其它用于吸附的结构)和所述承载平台30上的吸附单元31将封装母板20吸附从而固定在承载平台30上。
相应地，本实施例还提供了一种封装装置，该封装装置包括上述的真空吸附系统。
[实施例2]
本实施例提供一种真空吸附系统的吸附方法，该真空吸附系统可以是实施例1中所述的真空吸附系统，下面结合图2详细描述所述吸附方法。
所述吸附方法具体包括如下步骤S01至S04。
S01，将封装母板20放置在承载平台30上方。
在该步骤中，可以通过机械手将封装母板20悬置在承载平台30上方，但是要避免封装母板20与承载平台30之间的距离过大，以免下述步骤不精确。
S02，检测承载平台30上的吸附单元31与封装母板20上的封装区域21的位置关系。
该步骤具体为：检测承载平台30上的吸附单元31与封装母板20上和该吸附单元31邻近的封装区域21之间的距离，以判断承载平台30上的吸附单元31与封装母板20上和该吸附单元31邻近的封装区域21的位置关系。
若检测到所述吸附单元31所在位置与封装母板20上的封装区域21无重合，则保持承载平台30的位置；若检测到所述吸附单元31所在位置与封装母板20上的封装区域21重合，则执行下一步。
S03，若检测到所述吸附单元31所在位置与封装母板20上的封区域21重合时，则调整承载平台30位置，使得其上至少部分吸附单元31与封装母板20上的封装区域21无重合。
S04，将封装母板20真空吸附至承载平台30上。
通过本实施例的真空吸附系统的吸附方法至少可以使得承载平台30上的部分吸附单元31与封装母板20上的封装区域21无重合，故通过本实施例的吸附方法，可以使得封装母板20上印刷的玻璃料的表面平整，使得该封装母板20可以很好的与另一母板封接，且在封接位置处无空隙，进而使得封装在两母板间的元器件寿命更长，更加安全。
图1和图2只是示意图，为了方便理解只示出了部分吸附孔11/吸附单元31，应当理解的是，在真空吸附平台10/承载平台30上设置有成行/成列的多个吸附孔11/吸附单元31。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况 下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (10)

  1. 一种用于封装母板的真空吸附系统，包括真空吸附平台，其中，所述真空吸附系统还包括：
    承载平台，设于所述真空吸附平台上且其边缘与所述真空吸附平台的边缘密封，所述承载平台用于承载封装母板，且其上设置有多个吸附单元，所述吸附单元和所述真空吸附平台相配合以吸附从而固定所述封装母板；
    检测单元，用于检测所述承载平台上的吸附单元与所述封装母板上的封装区域的位置关系；以及，
    调整单元，用于当检测单元检测到所述承载平台上的吸附单元所在位置与所述封装母板上的封装区域重合时，调整承载平台位置，使得所述承载平台上的至少部分吸附单元所在位置与所述封装母板上的封装区域无重合。
  2. 根据权利要求1所述的真空吸附系统，其中，多个所述吸附单元均匀分布在所述承载平台上。
  3. 根据权利要求1或2所述的真空吸附系统，其中，所述吸附单元的结构为圆形孔、方形孔或矩形孔。
  4. 根据权利要求1所述的真空吸附系统，其中，所述检测单元为光学测距单元。
  5. 根据权利要求1所述的真空吸附系统，其中，所述真空吸附系统还包括：
    控制单元，用于根据所述检测单元输出的所述承载平台上的吸附单元所在位置与所述封装母板上的封装区域之间的位置关系，控制所述调整单元调整所述承载平台的位置，以使得所述承载平台上的至少部分吸附单元所在位置与所述封装母板上的封装 区域无重合。
  6. 根据权利要求1所述的真空吸附系统，其中，所述真空吸附系统还包括：
    抽气装置，用于通过所述真空吸附平台上的吸附孔和所述承载平台上的吸附单元将封装母板吸附从而固定在承载平台上。
  7. 一种封装装置，其中，所述封装装置包括如权利要求1至6中任一项所述的真空吸附系统。
  8. 一种真空吸附系统的吸附方法，其中，所述真空吸附系统采用如权利要求1至6中任一项所述的真空吸附系统，所述吸附方法包括如下步骤：
    将所述封装母板放置在所述承载平台上方；
    检测所述承载平台上的吸附单元与所述封装母板上的封装区域的位置关系，若检测到所述承载平台上的吸附单元所在位置与所述封装母板上的封装区域无重合，则保持所述承载平台的位置；若检测到所述承载平台上的吸附单元所在位置与所述封装母板上的封装区域重合，则执行下一步；
    调整所述承载平台的位置，以使所述承载平台上的至少部分吸附单元与所述封装母板上的封装区域无重合。
  9. 根据权利要求8所述的真空系统的吸附方法，其中，检测所述承载平台上的吸附单元与所述封装母板上的封装区域的位置关系的步骤为：检测所述承载平台上的吸附单元与所述封装母板上和该吸附单元邻近的封装区域之间的距离。
  10. 根据权利要求8所述的真空系统的吸附方法，其中，调整所述承载平台的位置，以使所述承载平台上的至少部分吸附单元与所述封装母板上的封装区域无重合的步骤后还包括如下步 骤：
    将所述封装母板真空吸附至所述承载平台上。
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EP3211664B1 (en) 2019-04-03
KR101813774B1 (ko) 2017-12-29
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US10204815B2 (en) 2019-02-12
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US20160254175A1 (en) 2016-09-01

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