EP3211664B1 - Vacuum absorption system and method of packaging mother board and packaging device - Google Patents

Vacuum absorption system and method of packaging mother board and packaging device Download PDF

Info

Publication number
EP3211664B1
EP3211664B1 EP15787886.9A EP15787886A EP3211664B1 EP 3211664 B1 EP3211664 B1 EP 3211664B1 EP 15787886 A EP15787886 A EP 15787886A EP 3211664 B1 EP3211664 B1 EP 3211664B1
Authority
EP
European Patent Office
Prior art keywords
packaged
adsorption
mother substrate
carrying platform
vacuum adsorption
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP15787886.9A
Other languages
German (de)
French (fr)
Other versions
EP3211664A4 (en
EP3211664A1 (en
Inventor
Jiuxia Yang
Feng Bai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Beijing BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Beijing BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Beijing BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Publication of EP3211664A1 publication Critical patent/EP3211664A1/en
Publication of EP3211664A4 publication Critical patent/EP3211664A4/en
Application granted granted Critical
Publication of EP3211664B1 publication Critical patent/EP3211664B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present invention relates to the field of substrate packaging technology, and particularly, to a vacuum adsorption system for a mother substrate to be packaged, a packaging device including the vacuum adsorption system and an adsorption method for the vacuum adsorption system.
  • OLED Organic Light-emitting Diode
  • luminescent and function materials within the display device are sensitive to moisture and oxygen, where the parameter requirements for moisture resistance and oxygen resistance of the corresponding products are in that: permeability of oxygen is required to be less than 10 -3 cc/m 2 /day and permeability of moisture is required to be less than 10 -6 g/m 2 /day.
  • permeability of oxygen is required to be less than 10 -3 cc/m 2 /day and permeability of moisture is required to be less than 10 -6 g/m 2 /day.
  • OLED display devices in middle or small size are packaged by means of printing frit.
  • packaging by means of printing frit includes the following steps: placing first a mother substrate 20 to be packaged on a vacuum adsorption platform 10 of a vacuum adsorption system, and then adsorbing, by vacuumizing, the mother substrate 20 to be packaged to fix it on the vacuum adsorption platform 10; subsequently, placing an alignment substrate (Mask substrate, not shown in Fig. 1 ), which is used for determining positions of frit, on the mother substrate 20 to be packaged, and then printing the frit to the mother substrate 20 to be packaged along grooves of the alignment substrate; finally, removing the alignment substrate and packaging another mother substrate with the mother substrate 20 to be packaged, so as to form a package assembly.
  • an alignment substrate Mosk substrate, not shown in Fig. 1
  • a plurality of grooves which may be in a rectangular ring shape, are provided on the alignment substrate, and area on the mother substrate 20 to be packaged may be divided into a plurality of display areas 22, a plurality of packaging areas 21 and a plurality of cutting areas 23, wherein the size, shape and position of each of the grooves on the alignment substrate correspond to those of a packaging area 21 on the mother substrate 20 to be packaged and thus the packaging area 21 may be in a rectangular ring shape as well, as shown in Fig. 1 .
  • the area surrounded by one packaging area 21 is one display area 22, and the areas between adjacent packaging areas 21 are the cutting areas 23, wherein a plurality of display panels can be formed by cutting the package assembly that has been packaged along the cutting areas 23.
  • the inventors have found that at least the following problems exist in the prior art.
  • Most of vacuum adsorption systems used in the prior art adopt grooves or adsorption holes on the vacuum adsorption platforms.
  • a common disadvantage to these two types of vacuum adsorption platforms is that positions on the mother substrate to be packaged (i.e., the packaging areas on the mother substrate to be packaged) on the vacuum adsorption platform corresponding to the grooves on the alignment substrate will be deformed due to action of the adsorption force from the vacuum adsorption platform, which in turn causes large step on the surface of the printed frit, so that poor packaging due to untightness may occur when packaging the mother substrate to be packaged with another mother substrate and thus the service life of the display device will be affected.
  • Document CN 102610399 A discloses a sensitized solar cell packaging system and a sensitized solar cell packaging method.
  • the present invention provides a vacuum adsorption system, an adsorption method and a packaging device used for a mother substrate to be packaged, so that the surface of the printed frit on the mother substrate to be packaged may be flat, and the mother substrate to be packaged can be packaged properly with another mother substrate.
  • a vacuum adsorption system used for a mother substrate to be packaged which includes a vacuum adsorption platform, and the vacuum adsorption system further includes:
  • the plurality of adsorption units may be distributed uniformly on the carrying platform.
  • the structure of the adsorption unit may be a round hole, a square hole or a rectangular hole.
  • the detection unit may be an optical range unit.
  • the vacuum adsorption system may further include: a control unit, configured to control the adjustment unit to adjust the position of the carrying platform based on the positional relationships between the positions of the adsorption units on the carrying platform and the packaging areas on the mother substrate to be packaged output by the detection unit, such that the positions of at least part of the adsorption units on the carrying platform are not overlapped with the packaging areas of the mother substrate to be packaged.
  • a control unit configured to control the adjustment unit to adjust the position of the carrying platform based on the positional relationships between the positions of the adsorption units on the carrying platform and the packaging areas on the mother substrate to be packaged output by the detection unit, such that the positions of at least part of the adsorption units on the carrying platform are not overlapped with the packaging areas of the mother substrate to be packaged.
  • the vacuum adsorption system may further include: a vacuumizing device, configured to enable the mother substrate to be packaged to be adsorbed and fixed on the carrying platform through adsorption holes on the vacuum adsorption platform and the adsorption units on the carrying platform.
  • a packaging device including the above vacuum adsorption system.
  • an adsorption method for a vacuum adsorption system which is the vacuum adsorption system as described above, and the adsorption method includes the following steps of:
  • the step of detecting the positional relationships between the adsorption units on the carrying platform and the packaging areas on the mother substrate to be packaged may be a step of detecting distances between each adsorption unit on the carrying platform and a packaging area on the mother substrate to be packaged adjacent to the adsorption unit.
  • the method may further include the following step of: adsorbing the mother substrate to be packaged onto the carrying platform through vacuumizing.
  • the carrying platform has been added to the vacuum adsorption system of the present invention, by which the case that the vacuum adsorption platform in the prior art directly contacts and carries the mother substrate to be packaged is avoided.
  • the detection unit and the adjustment unit are added, through which the positional relationships between the packaging areas on the mother substrate to be packaged and the adsorption units on the carrying platform can be detected, and when they are overlapped with each other, the position of the carrying platform can be adjusted, so that the packaging areas on the mother substrate to be packaged are not overlapped with the positions of at least part of the adsorption units on the carrying platform, which in turn allows the mother substrate to be packaged to have a flat surface after being printed with frit and can be packaged properly with another mother substrate to form a package assembly, such that devices between the mother substrates can be sealed properly.
  • At least part of the adsorption units on the carrying platform can be caused to not overlap with the packaging areas on the mother substrate to be packaged according to the adsorption method for the vacuum adsorption system of the present invention, and in this way, the surface of the printed frit on the mother substrate to be packaged may be flat, and the mother substrate to be packaged may be packaged with another mother substrate properly without gaps at packaged positions, such that devices packaged between the mother substrates can have longer service lives and be safe.
  • the present embodiment provides a vacuum adsorption system used for a mother substrate 20 to be packaged, which may be packaged with another mother substrate to form a package assembly, and a plurality of display panels may be formed by cutting the package assembly.
  • the vacuum adsorption system includes a vacuum adsorption platform 10, a carrying platform 30 that is provided on the vacuum adsorption platform 10 and edges thereof are sealed with edges of the vacuum adsorption platform 10, a detection unit and an adjustment unit.
  • the carrying platform 30 is configured to carry the mother substrate 20 to be packaged and is provided thereon with a plurality of adsorption units 31, and the adsorption units 31 are configured to cooperate with the vacuum adsorption platform 10 to adsorb the mother substrate 20 to be packaged so as to fix it ;
  • the detection unit is configured to detect the positional relationships of the adsorption units 31 on the carrying platform 30 and packaging areas 21 on the mother substrate 20 to be packaged;
  • the adjustment unit is configured to adjust position of the carrying platform 30 when the detection unit detects that the positions of the adsorption units 31 on the carrying platform 30 are overlapped with the packaging areas 21 on the mother substrate 20 to be packaged, so that positions of at least part of the adsorption units 31 on the carrying platform 30 are not overlapped with the packaging areas 21 on the mother substrate 20 to be packaged.
  • the carrying platform 30 has been added to the vacuum adsorption system of the present embodiment, by which the case that the vacuum adsorption platform 10 in the prior art directly contacts and carries the mother substrate 20 to be packaged is avoided. Further, to avoid the problems in the prior art, the detection unit and the adjustment unit are added, through which relationships between positions of the packaging areas 21 on the mother substrate 20 to be packaged and positions of the adsorption units 31 on the carrying platform 30 can be detected, and when the positions of the packaging areas 21 on the mother substrate 20 to be packaged and the positions of the adsorption units 31 on the carrying platform 30 are overlapped with each other, the position of the carrying platform 30 may be adjusted, so that the packaging areas 21 on the mother substrate 20 to be packaged are not overlapped with positions of at least part of the adsorption units 31 on the carrying platform 30, which in turn allows the mother substrate to be packaged 10 to have a flat surface after being printed with frit (which is printed within the packaging areas 21 on the mother substrate 20 to be packaged) and may be properly packaged with another mother substrate
  • the area on the mother substrate 20 to be packaged may be divided into a plurality of display areas 22, a plurality of packaging areas 21 and a plurality of cutting areas 23, wherein each of the packaging areas 21 may be in a rectangular ring shape (as shown in Fig. 2 ), the area surrounded by one packaging area 21 is one display area 22, and the areas between the adjacent packaging areas 21 are the cutting areas 23, along which the package assembly is cut to form a plurality of display panels.
  • the adjustment unit can adjust the carrying platform 30 so as to move in a horizontal direction or vertical direction.
  • moving in a horizontal direction or vertical direction refers to move in the same plane, so that when the position of the carrying platform 30 is adjusted by the adjustment unit, the positions corresponding to the adsorption units 31 on the carrying platform 30 can be adjusted to correspond to the cutting areas 23 on the mother substrate to be packaged 23, so as to keep away from the packaging areas 21 on the mother substrate 20 to be packaged.
  • the plurality of adsorption units 32 on the carrying platform 30 are distributed uniformly on the carrying platform 30, so that the mother substrate 20 to be packaged that is adsorbed on the carrying platform 30 is subjected to a more uniform adsorption force, which prevents the mother substrate to be packaged from being damaged due to application of uneven force.
  • structure of the adsorption unit 31 may be a round hole, a square hole or a rectangular hole, and needless to say, the structure of the adsorption unit 31 is not limited to these three shapes, but may be in a shape of opening or groove.
  • the detection unit in the present embodiment is an optical range unit, and the optical range unit may be used to detect a distance between the packaging area 21 on the mother substrate 20 to be packaged and the adsorption unit 31 on the carrying platform 30. It should be noted that, this distance refers to a distance between the packaging area 21 on the mother substrate to be packaged and the adsorption unit 31 adjacent thereto.
  • the adjustment unit can adjust the position of the carrying platform 30 according to information of the distance, such that positions of at least part of the adsorption units 31 on the carrying platform 30 can be not overlapped with the packaging areas 21 on the mother substrate 20 to be packaged.
  • the vacuum adsorption system further includes a control unit, which is configured to control the adjustment unit to adjust the position of the carrying platform 30 based on the positional relationships between the positions of the adsorption units 31 and the packaging areas 21 on the mother substrate to be packaged output by the detection unit, such that positions of at least part of the adsorption units 31 on the carrying platform 30 can be not overlapped with the packaging areas 21 on the mother substrate 20 to be packaged.
  • the control unit may be a microprocessor or a PLC (Programmable Logic Controller) device.
  • the vacuum adsorption system in this embodiment further includes a vacuumizing device, and the vacuumizing device is configured to enable the mother substrate 20 to be packaged to be adsorbed and fixed on the carrying platform 30 through adsorption holes (or other structures for adsorption) on the vacuum adsorption platform 10 and the adsorption units 31 on the carrying platform 30.
  • the present embodiment further provides a packaging device, which includes the above described vacuum adsorption system.
  • the present embodiment provides an adsorption method for a vacuum adsorption system, which may be the vacuum adsorption system as described in Embodiment 1.
  • the adsorption method will be described in details below in conjunction with Fig. 2 .
  • the adsorption method specifically includes the following steps of S01 to S04.
  • a mother substrate 20 to be packaged is placed above a carrying platform 30.
  • the mother substrate 20 to be packaged may be suspended above the carrying platform 30 by a mechanical arm, and distance between the mother substrate 20 to be packaged and the carrying platform 30 should not be too large, otherwise, inaccuracies may occur in subsequent steps.
  • step S02 the positional relationships between the adsorption units 31 on the carrying platform 30 and the packaging areas 21 on the mother substrate 20 to be packaged are detected.
  • the specifically procedure of this step is: detecting a distance between the adsorption unit 31 on the carrying platform 30 and the packaging area 21 on the mother substrate 20 to be packaged adjacent thereto, so as to determine the positional relationship between the adsorption unit 31 on the carrying platform 30 and the packaging area 21 on the mother substrate 20 to be packaged adjacent thereto.
  • the position of the carrying platform 30 is kept as it is; and if it is detected that the positions of the adsorption units 31 are overlapped with the packaging areas 21 on the mother substrate 20 to be packaged, the next step is performed.
  • step S03 if it is detected that the positions of the adsorption units 31 are overlapped with the packaging areas 21 on the mother substrate 20 to be packaged, the position of the carrying platform 30 is adjusted, such that at least part of the adsorption units 31 thereon are not overlapped with the packaging areas 21 on the mother substrate 20 to be packaged.
  • the mother substrate 20 to be packaged is adsorbed onto the carrying platform 30 by vacuumizing.
  • the adsorption method for the vacuum adsorption system in the present embodiment at least part of the adsorption units 31 on the carrying platform 30 can be not overlapped with the packaging areas 21 on the mother substrate 20 to be packaged, and in this way, the surface of the printed frit on the mother substrate to be packaged may be flat, and the mother substrate to be packaged may be packaged with another mother substrate properly without gaps at packaged positions, such that devices packaged between the mother substrates may have longer service lives and be safe.
  • Figs. 1 and 2 are simply schematic diagrams, and only part of adsorption holes 11/adsorption units 31 are illustrated for ease of understanding. It should be understood that a plurality of adsorption holes 11/adsorption units 31 in rows/columns are provided on the vacuum adsorption platform 10/carrying platform 30.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electroluminescent Light Sources (AREA)
  • Manipulator (AREA)

Description

    FIELD OF THE INVENTION
  • The present invention relates to the field of substrate packaging technology, and particularly, to a vacuum adsorption system for a mother substrate to be packaged, a packaging device including the vacuum adsorption system and an adsorption method for the vacuum adsorption system.
    • BACKGROUND OF THE INVENTION
  • As a novel display device, Organic Light-emitting Diode (OLED) display device has the advantages of good color saturation and wide angle of view. However, luminescent and function materials within the display device are sensitive to moisture and oxygen, where the parameter requirements for moisture resistance and oxygen resistance of the corresponding products are in that: permeability of oxygen is required to be less than 10-3cc/m2/day and permeability of moisture is required to be less than 10-6g/m2/day. Currently, OLED display devices in middle or small size are packaged by means of printing frit.
  • As shown in Fig. 1, packaging by means of printing frit includes the following steps: placing first a mother substrate 20 to be packaged on a vacuum adsorption platform 10 of a vacuum adsorption system, and then adsorbing, by vacuumizing, the mother substrate 20 to be packaged to fix it on the vacuum adsorption platform 10; subsequently, placing an alignment substrate (Mask substrate, not shown in Fig. 1), which is used for determining positions of frit, on the mother substrate 20 to be packaged, and then printing the frit to the mother substrate 20 to be packaged along grooves of the alignment substrate; finally, removing the alignment substrate and packaging another mother substrate with the mother substrate 20 to be packaged, so as to form a package assembly. It should be noted that, a plurality of grooves, which may be in a rectangular ring shape, are provided on the alignment substrate, and area on the mother substrate 20 to be packaged may be divided into a plurality of display areas 22, a plurality of packaging areas 21 and a plurality of cutting areas 23, wherein the size, shape and position of each of the grooves on the alignment substrate correspond to those of a packaging area 21 on the mother substrate 20 to be packaged and thus the packaging area 21 may be in a rectangular ring shape as well, as shown in Fig. 1. The area surrounded by one packaging area 21 is one display area 22, and the areas between adjacent packaging areas 21 are the cutting areas 23, wherein a plurality of display panels can be formed by cutting the package assembly that has been packaged along the cutting areas 23.
  • The inventors have found that at least the following problems exist in the prior art. Most of vacuum adsorption systems used in the prior art adopt grooves or adsorption holes on the vacuum adsorption platforms. A common disadvantage to these two types of vacuum adsorption platforms is that positions on the mother substrate to be packaged (i.e., the packaging areas on the mother substrate to be packaged) on the vacuum adsorption platform corresponding to the grooves on the alignment substrate will be deformed due to action of the adsorption force from the vacuum adsorption platform, which in turn causes large step on the surface of the printed frit, so that poor packaging due to untightness may occur when packaging the mother substrate to be packaged with another mother substrate and thus the service life of the display device will be affected.
  • Document CN 102610399 A discloses a sensitized solar cell packaging system and a sensitized solar cell packaging method.
    • SUMMARY OF THE INVENTION
  • In view of the problems in the existing vacuum adsorption systems, the present invention provides a vacuum adsorption system, an adsorption method and a packaging device used for a mother substrate to be packaged, so that the surface of the printed frit on the mother substrate to be packaged may be flat, and the mother substrate to be packaged can be packaged properly with another mother substrate.
  • As an aspect of the present invention, there is provided a vacuum adsorption system used for a mother substrate to be packaged, which includes a vacuum adsorption platform, and the vacuum adsorption system further includes:
    • a carrying platform, which is provided on the vacuum adsorption platform and edges thereof are sealed with edges of the vacuum adsorption platform, configured to carrying the mother substrate to be packaged and provided thereon with a plurality of adsorption units, the adsorption units being used for adsorbing, in cooperation with the vacuum adsorption platform, the mother substrate to be packaged so as to fix the mother substrate to be packaged;
    • a detection unit, configured to detect positional relationships between the adsorption units on the carrying platform and packaging areas on the mother substrate to be packaged; and
    • an adjustment unit, configured to adjust the position of the carrying platform when the detection unit detects that the positions of the adsorption units on the carrying platform are overlapped with the packaging areas on the mother substrate to be packaged, so that positions of at least part of the adsorption units on the carrying platform are not overlapped with the packaging areas on the mother substrate to be packaged.
  • The plurality of adsorption units may be distributed uniformly on the carrying platform.
  • The structure of the adsorption unit may be a round hole, a square hole or a rectangular hole.
  • The detection unit may be an optical range unit.
  • The vacuum adsorption system may further include:
    a control unit, configured to control the adjustment unit to adjust the position of the carrying platform based on the positional relationships between the positions of the adsorption units on the carrying platform and the packaging areas on the mother substrate to be packaged output by the detection unit, such that the positions of at least part of the adsorption units on the carrying platform are not overlapped with the packaging areas of the mother substrate to be packaged.
  • The vacuum adsorption system may further include:
    a vacuumizing device, configured to enable the mother substrate to be packaged to be adsorbed and fixed on the carrying platform through adsorption holes on the vacuum adsorption platform and the adsorption units on the carrying platform.
  • As another aspect of the present invention, there is provided a packaging device including the above vacuum adsorption system.
  • As yet another aspect of the present invention, there is provided an adsorption method for a vacuum adsorption system, which is the vacuum adsorption system as described above, and the adsorption method includes the following steps of:
    • placing the mother substrate to be packaged above the carrying platform;
    • detecting the positional relationships between the adsorption units on the carrying platform and the packaging areas on the mother substrate to be packaged, and if it is detected that the positions of the adsorption units on the carrying platform are not overlapped with the packaging areas on the mother substrate to be packaged, the position of the carrying platform is kept as it is; and if it is detected that the positions of the adsorption units on the carrying platform are overlapped with the packaging areas on the mother substrate to be packaged, the following step is performed; and
    • adjusting the position of the carrying platform, such that at least part of the adsorption units on the carrying platform are not overlapped with the packaging areas on the mother substrate to be packaged.
  • The step of detecting the positional relationships between the adsorption units on the carrying platform and the packaging areas on the mother substrate to be packaged may be a step of detecting distances between each adsorption unit on the carrying platform and a packaging area on the mother substrate to be packaged adjacent to the adsorption unit.
  • After the step of adjusting the position of the carrying platform, such that at least part of the adsorption units on the carrying platform are not overlapped with the packaging areas on the mother substrate to be packaged, the method may further include the following step of:
    adsorbing the mother substrate to be packaged onto the carrying platform through vacuumizing.
  • Compared to the prior art, the carrying platform has been added to the vacuum adsorption system of the present invention, by which the case that the vacuum adsorption platform in the prior art directly contacts and carries the mother substrate to be packaged is avoided. Further, to avoid the problems in the prior art, the detection unit and the adjustment unit are added, through which the positional relationships between the packaging areas on the mother substrate to be packaged and the adsorption units on the carrying platform can be detected, and when they are overlapped with each other, the position of the carrying platform can be adjusted, so that the packaging areas on the mother substrate to be packaged are not overlapped with the positions of at least part of the adsorption units on the carrying platform, which in turn allows the mother substrate to be packaged to have a flat surface after being printed with frit and can be packaged properly with another mother substrate to form a package assembly, such that devices between the mother substrates can be sealed properly.
  • At least part of the adsorption units on the carrying platform can be caused to not overlap with the packaging areas on the mother substrate to be packaged according to the adsorption method for the vacuum adsorption system of the present invention, and in this way, the surface of the printed frit on the mother substrate to be packaged may be flat, and the mother substrate to be packaged may be packaged with another mother substrate properly without gaps at packaged positions, such that devices packaged between the mother substrates can have longer service lives and be safe.
    • BRIEF DESCRIPTION OF THE DRAWINGS
    • Fig. 1 is a schematic diagram of an existing vacuum adsorption system.
    • Fig. 2 is a schematic diagram of a vacuum adsorption system of Embodiment 1 of the present invention.
    DETAILED DESCRIPTION OF THE EMBODIMENTS
  • To make those skilled in the art better understand the technical solutions of the present invention, the present invention will be further described in conjunction with the accompanying drawings and specific implementations.
    • [Embodiment 1]
  • As shown in Fig. 2, the present embodiment provides a vacuum adsorption system used for a mother substrate 20 to be packaged, which may be packaged with another mother substrate to form a package assembly, and a plurality of display panels may be formed by cutting the package assembly. The vacuum adsorption system includes a vacuum adsorption platform 10, a carrying platform 30 that is provided on the vacuum adsorption platform 10 and edges thereof are sealed with edges of the vacuum adsorption platform 10, a detection unit and an adjustment unit. The carrying platform 30 is configured to carry the mother substrate 20 to be packaged and is provided thereon with a plurality of adsorption units 31, and the adsorption units 31 are configured to cooperate with the vacuum adsorption platform 10 to adsorb the mother substrate 20 to be packaged so as to fix it ; the detection unit is configured to detect the positional relationships of the adsorption units 31 on the carrying platform 30 and packaging areas 21 on the mother substrate 20 to be packaged; and the adjustment unit is configured to adjust position of the carrying platform 30 when the detection unit detects that the positions of the adsorption units 31 on the carrying platform 30 are overlapped with the packaging areas 21 on the mother substrate 20 to be packaged, so that positions of at least part of the adsorption units 31 on the carrying platform 30 are not overlapped with the packaging areas 21 on the mother substrate 20 to be packaged.
  • Compared to the prior art, the carrying platform 30 has been added to the vacuum adsorption system of the present embodiment, by which the case that the vacuum adsorption platform 10 in the prior art directly contacts and carries the mother substrate 20 to be packaged is avoided. Further, to avoid the problems in the prior art, the detection unit and the adjustment unit are added, through which relationships between positions of the packaging areas 21 on the mother substrate 20 to be packaged and positions of the adsorption units 31 on the carrying platform 30 can be detected, and when the positions of the packaging areas 21 on the mother substrate 20 to be packaged and the positions of the adsorption units 31 on the carrying platform 30 are overlapped with each other, the position of the carrying platform 30 may be adjusted, so that the packaging areas 21 on the mother substrate 20 to be packaged are not overlapped with positions of at least part of the adsorption units 31 on the carrying platform 30, which in turn allows the mother substrate to be packaged 10 to have a flat surface after being printed with frit (which is printed within the packaging areas 21 on the mother substrate 20 to be packaged) and may be properly packaged with another mother substrate to form a package assembly, so that devices between the mother substrates may be packaged hermetically and properly.
  • It should be noted that, the area on the mother substrate 20 to be packaged may be divided into a plurality of display areas 22, a plurality of packaging areas 21 and a plurality of cutting areas 23, wherein each of the packaging areas 21 may be in a rectangular ring shape (as shown in Fig. 2), the area surrounded by one packaging area 21 is one display area 22, and the areas between the adjacent packaging areas 21 are the cutting areas 23, along which the package assembly is cut to form a plurality of display panels. The adjustment unit can adjust the carrying platform 30 so as to move in a horizontal direction or vertical direction. Herein, "move in a horizontal direction or vertical direction" refers to move in the same plane, so that when the position of the carrying platform 30 is adjusted by the adjustment unit, the positions corresponding to the adsorption units 31 on the carrying platform 30 can be adjusted to correspond to the cutting areas 23 on the mother substrate to be packaged 23, so as to keep away from the packaging areas 21 on the mother substrate 20 to be packaged.
  • Preferably, the plurality of adsorption units 32 on the carrying platform 30 are distributed uniformly on the carrying platform 30, so that the mother substrate 20 to be packaged that is adsorbed on the carrying platform 30 is subjected to a more uniform adsorption force, which prevents the mother substrate to be packaged from being damaged due to application of uneven force. Further preferably, structure of the adsorption unit 31 may be a round hole, a square hole or a rectangular hole, and needless to say, the structure of the adsorption unit 31 is not limited to these three shapes, but may be in a shape of opening or groove.
  • Preferably, the detection unit in the present embodiment is an optical range unit, and the optical range unit may be used to detect a distance between the packaging area 21 on the mother substrate 20 to be packaged and the adsorption unit 31 on the carrying platform 30. It should be noted that, this distance refers to a distance between the packaging area 21 on the mother substrate to be packaged and the adsorption unit 31 adjacent thereto. The adjustment unit can adjust the position of the carrying platform 30 according to information of the distance, such that positions of at least part of the adsorption units 31 on the carrying platform 30 can be not overlapped with the packaging areas 21 on the mother substrate 20 to be packaged.
  • Preferably, the vacuum adsorption system further includes a control unit, which is configured to control the adjustment unit to adjust the position of the carrying platform 30 based on the positional relationships between the positions of the adsorption units 31 and the packaging areas 21 on the mother substrate to be packaged output by the detection unit, such that positions of at least part of the adsorption units 31 on the carrying platform 30 can be not overlapped with the packaging areas 21 on the mother substrate 20 to be packaged. The control unit may be a microprocessor or a PLC (Programmable Logic Controller) device.
  • Needless to say, the vacuum adsorption system in this embodiment further includes a vacuumizing device, and the vacuumizing device is configured to enable the mother substrate 20 to be packaged to be adsorbed and fixed on the carrying platform 30 through adsorption holes (or other structures for adsorption) on the vacuum adsorption platform 10 and the adsorption units 31 on the carrying platform 30.
  • Accordingly, the present embodiment further provides a packaging device, which includes the above described vacuum adsorption system.
    • [Embodiment 2]
  • The present embodiment provides an adsorption method for a vacuum adsorption system, which may be the vacuum adsorption system as described in Embodiment 1. The adsorption method will be described in details below in conjunction with Fig. 2.
  • The adsorption method specifically includes the following steps of S01 to S04.
  • At step S01, a mother substrate 20 to be packaged is placed above a carrying platform 30.
  • In this step, the mother substrate 20 to be packaged may be suspended above the carrying platform 30 by a mechanical arm, and distance between the mother substrate 20 to be packaged and the carrying platform 30 should not be too large, otherwise, inaccuracies may occur in subsequent steps.
  • At step S02, the positional relationships between the adsorption units 31 on the carrying platform 30 and the packaging areas 21 on the mother substrate 20 to be packaged are detected.
  • The specifically procedure of this step is: detecting a distance between the adsorption unit 31 on the carrying platform 30 and the packaging area 21 on the mother substrate 20 to be packaged adjacent thereto, so as to determine the positional relationship between the adsorption unit 31 on the carrying platform 30 and the packaging area 21 on the mother substrate 20 to be packaged adjacent thereto.
  • If it is detected that the positions of the adsorption units 31 are not overlapped with the packaging areas 21 on the mother substrate 20 to be packaged, the position of the carrying platform 30 is kept as it is; and if it is detected that the positions of the adsorption units 31 are overlapped with the packaging areas 21 on the mother substrate 20 to be packaged, the next step is performed.
  • At step S03, if it is detected that the positions of the adsorption units 31 are overlapped with the packaging areas 21 on the mother substrate 20 to be packaged, the position of the carrying platform 30 is adjusted, such that at least part of the adsorption units 31 thereon are not overlapped with the packaging areas 21 on the mother substrate 20 to be packaged.
  • At step S04, the mother substrate 20 to be packaged is adsorbed onto the carrying platform 30 by vacuumizing.
  • According to the adsorption method for the vacuum adsorption system in the present embodiment, at least part of the adsorption units 31 on the carrying platform 30 can be not overlapped with the packaging areas 21 on the mother substrate 20 to be packaged, and in this way, the surface of the printed frit on the mother substrate to be packaged may be flat, and the mother substrate to be packaged may be packaged with another mother substrate properly without gaps at packaged positions, such that devices packaged between the mother substrates may have longer service lives and be safe.
  • Figs. 1 and 2 are simply schematic diagrams, and only part of adsorption holes 11/adsorption units 31 are illustrated for ease of understanding. It should be understood that a plurality of adsorption holes 11/adsorption units 31 in rows/columns are provided on the vacuum adsorption platform 10/carrying platform 30.
  • It should be understood that the foregoing implementations are merely the exemplary embodiments used for explaining the principle of the present invention, and the present invention is not limited thereto. Various variations and improvements can be made by those skilled in the art without departing from the protection scope of the present invention.

Claims (10)

  1. A vacuum adsorption system for a mother substrate (20) to be packaged, which includes a vacuum adsorption platform (10), wherein the vacuum adsorption system further includes:
    a carrying platform (30), which is provided on the vacuum adsorption platform (10) and edges thereof are sealed with edges of the vacuum adsorption platform (10), configured to carrying the mother substrate (20) to be packaged and provided thereon with a plurality of adsorption units (31), the adsorption units (31) being used for adsorbing, in cooperation with the vacuum adsorption platform (10), the mother substrate (20) to be packaged so as to fix the mother substrate (20) to be packaged;
    a detection unit, configured to detect positional relationships between the adsorption units (31) on the carrying platform (30) and packaging areas on the mother substrate (20) to be packaged; and
    an adjustment unit,
    the vacuum adsorption system being characterized in that:
    said adjustment unit is configured to adjust the position of the carrying platform (30) when the detection unit detects that the positions of the adsorption units (31) on the carrying platform (30) are overlapped with the packaging areas on the mother substrate (20) to be packaged, so that positions of at least part of the adsorption units (31) on the carrying platform (30) are not overlapped with the packaging areas on the mother substrate (20) to be packaged.
  2. The vacuum adsorption system according to claim 1, wherein the plurality of adsorption units are distributed uniformly on the carrying platform.
  3. The vacuum adsorption system according to claim 1 or 2, wherein the structure of the adsorption unit is a round hole, a square hole or a rectangular hole.
  4. The vacuum adsorption system according to claim 1, wherein the detection unit is an optical range unit.
  5. The vacuum adsorption system according to claim 1, wherein the vacuum adsorption system further includes:
    a control unit, configured to control the adjustment unit to adjust the position of the carrying platform based on the positional relationships between the positions of the adsorption units on the carrying platform and the packaging areas on the mother substrate to be packaged output by the detection unit, such that the positions of at least part of the adsorption units on the carrying platform are not overlapped with the packaging areas of the mother substrate to be packaged.
  6. The vacuum adsorption system according to claim 1, wherein the vacuum adsorption system further includes:
    a vacuumizing device, configured to enable the mother substrate to be packaged to be adsorbed and fixed on the carrying platform through adsorption holes on the vacuum adsorption platform and the adsorption units on the carrying platform.
  7. A packaging device, wherein the packaging device includes the vacuum adsorption system according to any one of claims 1 to 6.
  8. An adsorption method for a vacuum adsorption system, which is the vacuum adsorption system according to any one of claims 1 to 6, and the adsorption method includes the following steps of:
    placing the mother substrate (20) to be packaged above the carrying platform (30);
    detecting the positional relationships between the adsorption units (31) on the carrying platform (30) and the packaging areas on the mother substrate (20) to be packaged, and if it is detected that the positions of the adsorption units (31) on the carrying platform (30) are not overlapped with the packaging areas on the mother substrate (20) to be packaged, the position of the carrying platform (30) is kept as it is; and if it is detected that the positions of the adsorption units (31) on the carrying platform (30) are overlapped with the packaging areas on the mother substrate (20) to be packaged, the following step is performed; and
    adjusting the position of the carrying platform (30), such that at least part of the adsorption units (31) on the carrying platform (30) are not overlapped with the packaging areas on the mother substrate (20) to be packaged.
  9. The adsorption method for the vacuum adsorption system according to claim 8, wherein,
    the step of detecting the positional relationships between the adsorption units on the carrying platform and the packaging areas on the mother substrate to be packaged is a step of detecting distances between each adsorption unit on the carrying platform and a packaging area on the mother substrate to be packaged adjacent to the adsorption unit.
  10. The adsorption method for the vacuum adsorption system according to claim 8, wherein, after the step of adjusting the position of the carrying platform, such that at least part of the adsorption units on the carrying platform are not overlapped with the packaging areas on the mother substrate to be packaged, the method further includes the following step of:
    adsorbing the mother substrate to be packaged onto the carrying platform through vacuumizing.
EP15787886.9A 2014-10-22 2015-04-16 Vacuum absorption system and method of packaging mother board and packaging device Active EP3211664B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410568435.6A CN104377157B (en) 2014-10-22 2014-10-22 Vacuum absorption system and method of packaging mother board and packaging device
PCT/CN2015/076707 WO2016062038A1 (en) 2014-10-22 2015-04-16 Vacuum absorption system and method of packaging mother board and packaging device

Publications (3)

Publication Number Publication Date
EP3211664A1 EP3211664A1 (en) 2017-08-30
EP3211664A4 EP3211664A4 (en) 2018-06-20
EP3211664B1 true EP3211664B1 (en) 2019-04-03

Family

ID=52555992

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15787886.9A Active EP3211664B1 (en) 2014-10-22 2015-04-16 Vacuum absorption system and method of packaging mother board and packaging device

Country Status (6)

Country Link
US (1) US10204815B2 (en)
EP (1) EP3211664B1 (en)
JP (1) JP6458158B2 (en)
KR (1) KR101813774B1 (en)
CN (1) CN104377157B (en)
WO (1) WO2016062038A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104377157B (en) * 2014-10-22 2017-05-10 京东方科技集团股份有限公司 Vacuum absorption system and method of packaging mother board and packaging device
CN106154609A (en) * 2015-04-09 2016-11-23 鸿富锦精密工业（深圳）有限公司 Liquid crystal display panel preparation method
CN106129218B (en) * 2016-06-27 2019-02-05 纳晶科技股份有限公司 A kind of packaging system of light-transparent carrier and electroluminescent device
CN108279367A (en) * 2016-12-30 2018-07-13 致茂电子(苏州)有限公司 absorption type test device
US11897177B2 (en) * 2017-01-02 2024-02-13 Sabic Global Technologies B.V. Method for manufacturing a structural beam, structural beam, and building comprising such a beam
CN108511632A (en) * 2018-06-11 2018-09-07 京东方科技集团股份有限公司 A kind of display master blank and preparation method thereof
CN111251262B (en) * 2020-01-20 2022-01-28 成都京东方光电科技有限公司 Display panel bearing table

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3552765B2 (en) 1994-11-11 2004-08-11 オリンパス株式会社 Inverted microscope
JP3495436B2 (en) 1994-11-11 2004-02-09 三洋電機株式会社 Display panel processing method and processing apparatus
JPH09243982A (en) * 1996-03-13 1997-09-19 Matsushita Electron Corp Substrate sticking device and production of liquid crystal cell
JP3483809B2 (en) * 1999-08-31 2004-01-06 シャープ株式会社 Substrate bonding method and bonding apparatus, and liquid crystal display device manufacturing method
JP2001077529A (en) * 1999-09-08 2001-03-23 Canon Inc Method and device for pasting substrate
JP2001305977A (en) * 2000-04-24 2001-11-02 Seiko Epson Corp Device and method for manufacturing electrooptical apparatus
JP2002236292A (en) * 2001-02-09 2002-08-23 Matsushita Electric Ind Co Ltd Manufacturing method for liquid crystal panel and substrate sticking device
JP2006276579A (en) 2005-03-30 2006-10-12 Sanyo Epson Imaging Devices Corp Method for manufacturing electrooptic device, electrooptic device, and electronic equipment
JP2008083327A (en) * 2006-09-27 2008-04-10 Seiko Epson Corp Method of manufacturing liquid crystal device
KR100843222B1 (en) * 2006-12-22 2008-07-02 삼성전자주식회사 Apparatus for transferring a semiconductor chip and method of transferring a semiconductor chip using the same
JP5526862B2 (en) * 2010-02-25 2014-06-18 カシオ計算機株式会社 Substrate adsorption method and substrate adsorption apparatus
CN102184935B (en) * 2011-04-02 2012-08-08 东莞宏威数码机械有限公司 OLED (Organic Light Emitting Diode) display screen packaging equipment and compression packaging method
KR101328886B1 (en) 2011-05-07 2013-11-13 주식회사 야스 An Apparatus for attaching and detaching a substrate using a ring shape adhesive
CN102610399B (en) * 2012-03-09 2014-08-27 上海北京大学微电子研究院 Sensitized solar cell package system and method
EP2874179A4 (en) * 2012-07-10 2016-05-11 Lg Chemical Ltd Printed material fixing piece, printing device, and printing method
CN104377157B (en) * 2014-10-22 2017-05-10 京东方科技集团股份有限公司 Vacuum absorption system and method of packaging mother board and packaging device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Also Published As

Publication number Publication date
EP3211664A4 (en) 2018-06-20
CN104377157B (en) 2017-05-10
WO2016062038A1 (en) 2016-04-28
JP6458158B2 (en) 2019-01-23
KR20160059461A (en) 2016-05-26
JP2017535933A (en) 2017-11-30
US20160254175A1 (en) 2016-09-01
CN104377157A (en) 2015-02-25
US10204815B2 (en) 2019-02-12
KR101813774B1 (en) 2017-12-29
EP3211664A1 (en) 2017-08-30

Similar Documents

Publication Publication Date Title
EP3211664B1 (en) Vacuum absorption system and method of packaging mother board and packaging device
CN105097885B (en) Oled panel and its packaging method, display device
CN101090997B (en) Mask aligning mechanism for film forming apparatus, and film forming apparatus
US20170194579A1 (en) Flexible display panel, package method thereof and display device
CN102255056A (en) Method for reinforcing sealing performance of Organic Light-Emitting Diode (OLED) device sealed by glass material
CN105895827A (en) Organic light-emitting display device, and packaging method and display device thereof
US20160329528A1 (en) Oled panel,l method for fabricating the same, screen printing plate, display device
CN106887533B (en) A kind of separation equipment and separation method
WO2018059089A1 (en) Base stage, laser cutting device and control method therefor
WO2011005952A3 (en) Methods for forming fritted cover sheets with masks and glass packages comprising the same
US20170040568A1 (en) Oled display motherboard, packaging method thereof and packaging system
US10749145B2 (en) Screen plate, packaging method, display panel and display device
CN106450043B (en) Manufacturing method of organic light-emitting display panel
CN103413897A (en) OLED packaging structure and packaging method
CN104078402A (en) Auxiliary device for mechanical arm position adjusting
CN104637843A (en) Encapsulating equipment and encapsulating method
US20150232323A1 (en) Method for producing a micromechanical component, and micromechanical component
CN106311681A (en) A mask foreign matter removing method and a mask foreign matter removing apparatus
CN107026186B (en) OLED display device and preparation method thereof
CN109638048B (en) Display panel, preparation method thereof and display device
CN202702249U (en) Mechanical arm and conveying device
JP2013539197A (en) Edge detection
JPH078760U (en) Device for detecting missing contents of PTP packaging
US20160263883A1 (en) Screen assembly, screen printing system and screen printing method
CN203902928U (en) Structure on image detection portion of braider

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20151111

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20180522

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 21/60 20060101ALI20180515BHEP

Ipc: H01L 21/68 20060101ALI20180515BHEP

Ipc: H01L 21/683 20060101AFI20180515BHEP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 602015027680

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: H01L0021683000

Ipc: H01L0021670000

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 21/683 20060101ALI20181005BHEP

Ipc: H01L 21/68 20060101ALI20181005BHEP

Ipc: H01L 21/67 20060101AFI20181005BHEP

INTG Intention to grant announced

Effective date: 20181030

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

Ref country code: AT

Ref legal event code: REF

Ref document number: 1116767

Country of ref document: AT

Kind code of ref document: T

Effective date: 20190415

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602015027680

Country of ref document: DE

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: NL

Ref legal event code: FP

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1116767

Country of ref document: AT

Kind code of ref document: T

Effective date: 20190403

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190703

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190803

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190703

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190704

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20190430

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190803

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190416

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602015027680

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190430

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190430

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190430

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

26N No opposition filed

Effective date: 20200106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190416

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20150416

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190403

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20230420

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20240418

Year of fee payment: 10

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20240419

Year of fee payment: 10

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20240425

Year of fee payment: 10