CN106129218B - A kind of packaging system of light-transparent carrier and electroluminescent device - Google Patents
A kind of packaging system of light-transparent carrier and electroluminescent device Download PDFInfo
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- CN106129218B CN106129218B CN201610505286.8A CN201610505286A CN106129218B CN 106129218 B CN106129218 B CN 106129218B CN 201610505286 A CN201610505286 A CN 201610505286A CN 106129218 B CN106129218 B CN 106129218B
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- transparent carrier
- electroluminescent device
- negative pressure
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 21
- 238000010521 absorption reaction Methods 0.000 claims abstract description 37
- 230000005540 biological transmission Effects 0.000 claims description 20
- 238000007789 sealing Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 230000004888 barrier function Effects 0.000 claims description 8
- 230000009969 flowable effect Effects 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 238000005401 electroluminescence Methods 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 238000009738 saturating Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 33
- 238000000034 method Methods 0.000 abstract description 16
- 239000011521 glass Substances 0.000 abstract description 13
- 238000010438 heat treatment Methods 0.000 abstract description 9
- 229920002799 BoPET Polymers 0.000 abstract description 8
- 238000001816 cooling Methods 0.000 abstract description 7
- 238000005520 cutting process Methods 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 description 14
- 238000001179 sorption measurement Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 10
- 239000003292 glue Substances 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 238000012937 correction Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
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- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 208000033999 Device damage Diseases 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
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- 238000013461 design Methods 0.000 description 1
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- 239000005357 flat glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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Classifications
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- H01L33/48—
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- H01L33/00—
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- H01L33/56—
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- H01L2933/0033—
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses the packaging systems of a kind of light-transparent carrier and electroluminescent device, the packaging system of electroluminescent device includes light-transparent carrier, light-transparent carrier includes the absorption surface for being bonded with absorption object, the negative pressure gap for adsorbing with absorption object, the negative port for connecting with negative pressure device, negative port is located inside light-transparent carrier, light-transparent carrier further includes airflow channel, for being connected to negative pressure gap and negative port.Cooperate the suction-operated of negative pressure device by above-mentioned light-transparent carrier, it is used in the packaging system of electroluminescent device, electroluminescent device can be effectively prevented during UV adhesive curing, due to leading to the alice and metaboly of glass or PET film substrate or cover board in the heating cooling procedure in technical process, keep double glazing or double-layer PET film surface more smooth, improves the service life of cutting yield, IC bonding yield and product.
Description
Technical field
The present invention relates to the encapsulation technology field of display device more particularly to a kind of light-transparent carriers and electroluminescent device
Packaging system.
Background technique
Generally, electroluminescent device includes substrate, cover board and the light-emitting component being arranged between substrate and cover board, in electricity
When the light-emitting component preparation of electroluminescence device, no matter vapour deposition method while preparing (reflecting electrode device be up to 60-80 degrees Celsius) or
Heat drying (80-150 degrees Celsius) when prepared by solwution method can all cause substrate temperature to increase, and heating up and leading in cooling procedure
Causing glass substrate (very thin) or polyethylene terephthalate (PET) ilm substrate, deformation occurs, so that glass substrate or PET
Ilm substrate is deformed or is tilted, and glass substrate after encapsulation, cover board, the resultant force between UV glue can be caused uneven, eventually lead to envelope
Glass or PET film cover board also deform after dress.The yield of cutting and the binding yield of IC circuit are influenced, or even influences the longevity of product
Life.
As shown in Figure 1, general sealed in unit all uses halogen lamp to carry out UV encapsulation, the light generated due to halogen light source
Be it is full wave, containing a large amount of infrared lights, the light of this part infrared band can be by the quartz glass (quartz below cover-plate glass
Glass is the light-transparent carrier of sealed in unit) it is absorbed, cause quartz glass to generate heat, the heat of quartz glass is transmitted on cover board,
Cover board temperature and substrate temperature are inconsistent when making to encapsulate, and after good glass to be packaged restores normal temperature, glass substrate and cover board are shunk
It is inconsistent, lead to the deformation or tilting of double glazing after encapsulation.Influence the yield of cutting and the binding yield or even shadow of IC circuit
Ring the service life of product.
Summary of the invention
Goal of the invention of the invention is to solve to lead to glass in the heating cooling procedure in device manufacturing process
The problem of alice and deformation of substrate or PET film, provides the packaging system of a kind of light-transparent carrier and electroluminescent device, Ke Yiyou
Effect prevent electroluminescent device during UV adhesive curing, due to cause in the heating cooling procedure in technical process glass or
The alice and metaboly of PET film substrate or cover board keep double glazing or double-layer PET film surface more smooth, raising cutting yield,
The service life of IC bonding yield and product.
In order to achieve the above-mentioned object of the invention, the invention adopts the following technical scheme: a kind of light-transparent carrier, and the light transmission carries
Body includes the absorption surface for being bonded with absorption object, the negative pressure gap for adsorbing with the absorption object, is used for and bears
The negative port of pressure device connection, the negative port are located inside the light-transparent carrier, and the light-transparent carrier further includes air-flow
Channel, for being connected to the negative pressure gap and negative port.
The gap of one or more negative pressure is generated between negative pressure gap and absorption object, the either large or small shape in gap is different,
Negative pressure gap can be groove, cavity, hole or other etc..
When adsorbing object is electroluminescent device, since electroluminescent device generally comprises display area and non-display area
Domain since display area includes important light-emitting component, therefore it is preferred that does not generate negative pressure in the display area of electroluminescent device
Absorption can carry out absorption correction only for non-display area, protect electroluminescent device.
Absorption surface can may be curved surface for plane, even complicated warp surface, and absorption surface only needs same inhale
Attached object, which matches, can be realized negative-pressure adsorption and correction, therefore not be defined to the absorption surface of light-transparent carrier in the present invention.
Absorption object may include it is any need to correct deformation in encapsulation process have certain flexible object.
Preferably, the negative pressure gap includes the groove positioned at absorption surface, and the negative port is connected by airflow channel
Logical groove, groove can be closed annular groove, can be the annular groove of semi-closure, be also possible to by multiple strips or its
The open figure that the groove of his irregular shape is combined into, such as C-shaped, E shape；Preferably, groove is in a closed ring shape.
Scheme as a further preference, when adsorbing object is electroluminescent device, above-mentioned groove corresponds to electroluminescent
The non-display area edge distribution of device, and it is in a closed ring shape.
Preferably, negative pressure gap includes the negative pressure through-hole positioned at absorption surface, and each negative pressure through-hole is logical by air-flow
Road is connected to negative port, and when adsorbing object is electroluminescent device, the negative pressure through-hole is at least distributed in light-transparent carrier pair
It answers in the non-display area of electroluminescent device.
Preferably, the pore diameter range of each negative pressure through-hole is 2~10mm, and aperture is smaller, and negative pressure through-hole density is bigger,
Then adsorption capacity is more uniform, and rectification effect is better.
Above-mentioned negative pressure gap on light-transparent carrier distribution can according to absorption object deformation characteristics, absorption object it is big
It is small to design.
The material of light-transparent carrier with no restriction, can be any light transmission and the material with certain flintiness, preferably quartzy
Glass.
It is encapsulated present invention is especially suited for the cover board of electroluminescent device with the contraposition containing light emitting element substrate.With the prior art
It compares, using the light-transparent carrier of above-mentioned technical proposal, has the following beneficial effects:
In electroluminescent device encapsulation, the cover board of encapsulation is disposed on light-transparent carrier surface, light-transparent carrier surface
For the flat surface for being used to support cover board, which is equipped with negative pressure gap, and negative pressure gap passes through airflow channel and negative port
Connection can generate negative pressure on light-transparent carrier surface, by the lid on its surface when negative port connection air extractor generates negative pressure
Plate firmly adsorbs.
Because causing the glass substrate of alice or deformation or PET film to be corrected by heating up or cooling down in technique manufacturing process
It is smooth, it closes in UV glue laminated in solidification process, keeps the flatness of cover board and substrate, guarantee the yield and IC circuit of subsequent cutting
Binding yield.
In order to achieve the above-mentioned object of the invention, present invention employs another following technical solutions: a kind of electroluminescent device
Packaging system, from the bottom to top successively include light source, above-mentioned light-transparent carrier, drive electroluminescent device transport establishment, also
Including mobilizable cover portion, the cover portion has pressure modulating opening, is formed between the cover portion and light-transparent carrier for electroluminescent device
The sealing space of encapsulation, light source can connect negative pressure device and take out the gas in sealing space towards sealing space at pressure modulating opening
It takes.
Preferably, the insulating assembly of light-permeable is equipped with below the light-transparent carrier, the insulating assembly is located at light-transparent carrier
Between light source, as long as insulating assembly is in below light-transparent carrier, heat can be isolated, be got a desired effect, every
The position of hot component, can be between light-transparent carrier and the light-emitting surface of light source.
Or described light source itself includes insulating assembly, the insulating assembly is located at the light-emitting surface of light source.
In the present invention, light source can be the light source of special transmitting 200-500nm light, can also be using white light source (such as
Halogen lamp) cooperation filter coating achievees the effect that the light source for emitting identical wave band, and the position of filter coating is in below light-transparent carrier
, i.e. light is filtered before reaching light-transparent carrier.
Preferably, the insulating assembly includes the second transmission plane carrier, and the second transmission plane carrier, which is equipped with, to be supplied
Wavelength be 200-500nm light penetrate filter coating, filter coating may be provided at the second transmission plane carrier upper surface or under
Surface.
Preferably, the packaging system of electroluminescent device in the present invention further includes air interchanger, the insulating assembly with
Insulated cavity is formed between the light-transparent carrier, the insulated cavity is connected to air interchanger, and the insulated cavity is filled with can
The air-flow of flowing.
Preferably, the light barrier passed through for controlling source light is additionally provided with below the light-transparent carrier.The position of light barrier
The control that need to only carry out light intensity before light exposes to light-transparent carrier is set, therefore is arranged below light-transparent carrier, it can
Below insulating assembly, in insulating assembly, above insulating assembly or other positions.
Compared with prior art, using the packaging system of the electroluminescent device of above-mentioned technical proposal, have has as follows
Beneficial effect:
In electroluminescent device encapsulation, substrate has a flexure plane, cover board be for burnishing surface, if light source it is heat-insulated compared with
Good, then cover board when encapsulation finishes is still burnishing surface, and curved substrate bonds simultaneously quilt with cover board by UV gluing connects cover plate
Drawing forms burnishing surface；When light source is heat-insulated bad, the deformation of cover board also will affect the flatness of substrate, therefore need to use
The negative-pressure adsorption of light-transparent carrier acts on, and the surface that cover board is firmly adsorbed in light-transparent carrier by negative pressure makes it flatten, and
The shape of substrate follows cover board to become smooth together.
In electroluminescent device encapsulation, cover board is disposed on light-transparent carrier surface, and light-transparent carrier surface is for propping up
The flat surface of cover board is supportted, which is equipped with negative pressure gap, and negative pressure gap is connected to by airflow channel with negative port, when negative
When crimping mouth connection air extractor generation negative pressure, negative pressure can be generated on light-transparent carrier surface, firmly by the cover board on its surface
Absorption.
Because causing the glass substrate of alice or deformation or PET film to carry out by heating up or cooling down in technique manufacturing process
Correct it is smooth, UV glue laminated close and solidification process in, keep cover board and substrate flatness, guarantee the yield and IC of subsequent cutting
The binding yield of circuit.
Detailed description of the invention
Fig. 1 is the encapsulation schematic diagram of electroluminescent device in the prior art；
Fig. 2 is the structural schematic diagram of the packaging system embodiment 1 or 2 or 3 of electroluminescent device of the present invention；
Fig. 3 is the structural schematic diagram of light-transparent carrier in the present embodiment 1；
Fig. 4 is the half section structure diagram of light-transparent carrier in the present embodiment 1；
Fig. 5 is the top view of light-transparent carrier in the present embodiment 1；
Fig. 6 is the cross-sectional view in Fig. 5 at A-A；
Fig. 7 is the structural schematic diagram of light-transparent carrier in the present embodiment 2；
Fig. 8 is the top view of light-transparent carrier in the present embodiment 2；
Fig. 9 is the cross-sectional view in Fig. 8 at B-B；
Figure 10 is the structural schematic diagram of light-transparent carrier in the present embodiment 3；
Figure 11 is the cross-sectional view of light-transparent carrier in the present embodiment 3.
Appended drawing reference: 100, light source；101, light barrier；102, the second transmission plane carrier；103, supporting element；105, it seals
Space；106, adsorption tool；107, transport establishment；108, substrate；109, cover board；110, insulated cavity；111, light-emitting component；2,
Cover portion；4, light-transparent carrier；40, negative port；41, airflow channel；42, groove；43, negative pressure through-hole.
Specific embodiment
The present invention is described further with reference to the accompanying drawing.
Embodiment 1:
A kind of packaging system of electroluminescent device as shown in Figure 2, including light source 100, cover portion 2, adsorption tool 106,
The light transmission of insulating assembly 110, the second transmission plane carrier 102, the transport establishment 107 for driving adsorption tool 106 and negative-pressure adsorption
Carrier 4 forms the sealing space 105 encapsulated for electroluminescent device between cover portion 2 and light-transparent carrier 4.
Mobilizable cover portion 2 is used to open and close the sealing space 105 of packaging system, passes through driving absorption for transport establishment 107
Electroluminescent device is moved to the absorption surface of light-transparent carrier 4 by tool 106, is packaged and adsorbs correction.
Cover portion 2 is equipped with pressure modulating opening, will be sealed by connecing negative pressure device (can be common aspiration pump etc.) at pressure modulating opening
Air pressure in space 105 is adjusted, or even sealing space 105 is adjusted to vacuum state.
For white light source (can be halogen lamp), the second transmission plane carrier 102 is located at the light source used in the present embodiment
Above light source, 102 upper surface of the second transmission plane carrier or lower surface are equipped with filter coating, and filter coating is only 200- for wavelength
The light (i.e. the light of ultraviolet band) of 500nm penetrates, and the light of other wavelength (light including infrared band) is filtered out,
A large amount of heat, the second transmission plane carrier 102 and this hair can be generated when being mapped to filter coating due to the illumination of infrared band
Insulating assembly 110 in bright fits, and filter coating also can be set in 100 surface of light source or other positions.
Ultraviolet light also can be used in the light source used in the present embodiment, like that there is no need to still further increase filter out it is infrared
The filter coating of light.
Insulating assembly includes air interchanger and insulated cavity 110, by the second transmission plane carrier 102 and light-transparent carrier
Supporting element 103 is set between 4, props up the second transmission plane carrier 102 and light-transparent carrier 4 to form insulated cavity 110, supporting element
103 can be supported using polymer glue, polymer glue poor thermal conductivity, and heat insulation is more preferable.
Insulated cavity 110 is connected to air interchanger, and insulated cavity 110 is filled with flowable air-flow, the second transmission plane
Carrier 102 is attached at 110 lower section of insulated cavity, is blown into outside air or nitrogen or inert gas by constantly heat-insulated
The heat of the second transmission plane carrier 102 generation is taken away in cavity 110.Its heat dissipation effect is good, and it is at low cost to radiate, and leads to
Heat transferring medium be preferably nitrogen or inert gas, reduce water oxygen and penetrate into sealing space, reduce to electroluminescent device
Damage.
The light barrier 101 that control 100 light of light source passes through, 100 direction of light source are equipped with below second transmission plane carrier 102
Sealing space 105.The effect of light barrier 101 is to control whether light exposes in sealing space 105, and light barrier 101 can be with
It is blocked using various ways such as sliding, folds.Preferred light barrier 101 uses shutter, advantage in the present embodiment
It is that the intensity of light can carry out the adjusting of adaptability, regional computer adjusting can be carried out in intensity, and slide and turn down
Shielding mode can only control the opening and closing of light.
As shown in Figures 3 to 6, light-transparent carrier 4, light-transparent carrier surface are the flat surface for being used to support cover board, and light transmission carries
Body surface face is densely covered with negative pressure through-hole 43, and the negative port 40 of same negative pressure device connection, negative port 40 are additionally provided on light-transparent carrier
It is connected to negative pressure through-hole 43 by the hollow cavity completion inside light-transparent carrier.
Negative pressure device can use the vacuum pump etc. of pumping.
The binding domain of the absorption surface of light-transparent carrier 4 is divided into display area corresponding with electroluminescent device and non-aobvious
Show that region, display area are the position where light-emitting component 111, important light-emitting component 111 is in the corresponding display area
It is interior, and corresponding non-display area is at gap or bonding glue；Therefore the present embodiment, need to be for non-aobvious when adsorbing correction
Show that region is adsorbed, if being adsorbed for electroluminescent device display area, easily light-emitting component 111 is damaged, shadow
Ring the service life of final finished.
As shown in Figures 3 to 5, negative pressure through-hole 43 are uniformly distributed in the non-display area of light-transparent carrier, light-transparent carrier
Middle part display area in be not provided with negative pressure through-hole 43, the distribution of negative pressure through-hole 43 and 109 shape of cover board and light-emitting component 111
Position it is related, light-transparent carrier position of the negative pressure through-hole 43 of most peripheral along 109 peripheral distribution of cover board, where electroluminescent device
Inside it is not provided with negative pressure through-hole 43, it is therefore intended that protection electroluminescent device avoids being drawn in heating temperature-fall period by external force
It pulls and is damaged.
In electroluminescent device encapsulation, substrate 108 has a flexure plane, and cover board 109 is for burnishing surface, if light source
100 it is heat-insulated preferably, then cover board 109 of encapsulation when finishing is still burnishing surface, and curved substrate 108 passes through UV glue sticking lid
Plate 109 is bonded and is pulled with cover board 109, and substrate 108 forms burnishing surface；When light source 100 is heat-insulated bad, the change of cover board 109
Shape also will affect the flatness of substrate 10, therefore need to use the negative-pressure adsorption effect of light-transparent carrier 4, by negative pressure by cover board
109 surfaces for being firmly adsorbed in light-transparent carrier 4 make it flatten, and the shape of substrate 108 follows cover board 109 to become flat together
It is whole.
When cover board 109 is placed on 4 surface of light-transparent carrier, the negative pressure through-hole 43 on light-transparent carrier surface is complete by cover board 109
Covering, avoids negative pressure air leakage.
The position of negative port 40 can be in the side wall of light-transparent carrier, can also be in the lower surface of light-transparent carrier, as long as negative
Crimping mouth 40 is connected to groove 42 can reach effect.
When light-emitting component 111 encapsulates, cover board 109 is disposed on 4 surface of light-transparent carrier, light-transparent carrier surface be for
The flat surface of cover board is supported, which is equipped with negative pressure through-hole 43, and negative pressure through-hole 43 passes through airflow channel 41 and negative port
40 connections can generate negative pressure on light-transparent carrier surface, by its surface when negative port 40, which connects air extractor, generates negative pressure
Cover board 109 firmly adsorb.
Because causing the cover board 109 of alice or deformation and substrate 108 to be corrected by heating up or cooling down in technique manufacturing process
It is smooth, UV glue laminated close and solidification process in, keep cover board 109 and substrate 108 flatness, guarantee subsequent cutting yield and
The binding yield of IC circuit.
The insulating assembly of light-permeable is equipped with below light-transparent carrier 4, insulating assembly is between light-transparent carrier 4 and light source.Every
Hot component is to reduce heating for avoiding the heat transfer of light source to 4 surface of light-transparent carrier.
The application method of the packaging system of electroluminescent device in the present invention, comprising the following steps:
A. unencapsulated light-emitting component 111, substrate 108 and cover board 109 are got out by the prior art, on 109 periphery of cover board
It is coated with UV glue；
B. cover portion 2 is opened, cover board 109 is placed on 4 surface of light-transparent carrier by transport establishment 107, and driving adsorption tool 106 is again
Light-emitting component 111 and substrate 108 are carried out absorption to lift, it is to be packaged that transport establishment 107 controls adsorption tool 106 etc.；
C. negative pressure device is evacuated from the negative port of light-transparent carrier 4, and negative pressure gap generates negative-pressure adsorption cover board 109, light transmission
Micro- closed negative pressure space that carrier 4 and cover board 109 are formed, cover board 109 are tightly attached on absorption light-transparent carrier 4 under the influence of negative pressure
On surface；
D. negative pressure device is connected at the pressure modulating opening of cover portion 2, certain vacuum degree will be pumped in sealing space 105, is sealed
105 air pressure of space is greater than the air pressure of micro- closed negative pressure space；
E. unencapsulated electroluminescent device is put to 109 top free-falling of cover board by transport establishment 107 or is directly placed
On 109 surface of cover board；
F. it is slowly added into nitrogen or other inert gases to sealing space 105, until 105 air pressure of sealing space and atmospheric pressure
Unanimously, after sealing space 105 is inflated, pressure is generated to the space between substrate 106 and rear cover 109, UV glue is pressed, etc.
Make light expose to electroluminescent device after light source is preheated and carries out UV adhesive curing；
After g.UV adhesive curing, stop the suction function of negative port, is filled with nitrogen or other inert gases, makes to prepare
Good electroluminescent device is detached from light-transparent carrier 4, takes out finished product.
Embodiment 2:
The present embodiment compares embodiment 1, and distinctive points are: the negative pressure gap structure of light-transparent carrier 4 is different.
As shown in Figure 7 to 9, the negative pressure gap on the surface of the light-transparent carrier 4 in the present embodiment is groove 42,42 edge of groove
Light-transparent carrier peripheral distribution is in a closed ring shape, and negative port 40 passes through 41 communication groove 42 of airflow channel.
Likewise, groove 42 is also distributed across in the non-display area of light-transparent carrier 4, groove 42 can be single can also be with
Be it is a plurality of, groove in the present embodiment is an annular groove 42, and is arranged on the inside of the periphery of non-display area, i.e.,
Basic absorption correction demand can be met.
By extracting air in negative port 40, negative pressure is generated in entire annular groove 42, negative pressure is generated simultaneously to cover board
Adsorb cover board 109.
Groove in the present embodiment can be closed rectangle or annular groove 42, and rectangle or the annular that can be semi-closure are recessed
Slot 42 is also possible to the open figure being combined by the groove of multiple strips or other irregular shapes.Semi-closure such as C-shaped, E
Shape etc., the present embodiment is not listed one by one.
The periphery of the distribution reference cover board 109 of rectangular recess 42 in the present embodiment, cover board 109 are pressed on 4 table of light-transparent carrier
When face, entire rectangular recess 42 can all be covered, gas leakage is not present, adsorption capacity is strong.
And groove 42 is located at the surface of light-transparent carrier, and processing technology is simple, and cost is relatively low, and the position of negative port 40 can
With in the side wall of light-transparent carrier, can also in the lower surface of light-transparent carrier, as long as negative port 40 be connected to groove 42 it is i.e. reachable
To effect.
Embodiment 3:
As shown in Figure 10 and Figure 11, the present embodiment is the combination of embodiment 1 and embodiment 2, the absorption surface of light-transparent carrier 4
The groove 42 of existing annular has negative pressure through-hole 43 again, and further groove 42 and negative pressure through-hole 43 are respectively positioned on the non-display area of absorption surface
In domain.
As shown in Figure 10, negative pressure through-hole 43 is located in groove 42, and the ring-type that groove 42 is square, groove 42 is along non-display area
Arrangement, negative pressure through-hole 43 are distributed in groove 42 to the non-display area at display area edge on the inside of the periphery in domain.
Compared with Example 1, groove 42 is good for the periphery adsorption effect of cover board, and cover board is not easy to take off for the present embodiment
It falls.Compared with Example 2, negative pressure through-hole 43 also compensates for the problem of lacking absorption on the inside of cover board to the present embodiment.It is equivalent to concentration
The advantages of embodiment 1 and embodiment 2.
Make the preferred embodiment of the present invention above, does not depart from original of the invention for those of ordinary skill in the art
Under the premise of reason, several variations and modifications can also be made, these also should be regarded as protection scope of the present invention.
Claims (10)
1. a kind of light-transparent carrier, it is characterised in that: the light-transparent carrier include for absorption object be bonded absorption surface, use
In with it is described absorption object absorption negative pressure gap, the negative port (40) for being connect with negative pressure device, the negative port
(40) it is located inside the light-transparent carrier, the light-transparent carrier further includes airflow channel (41), for being connected to the negative pressure gap
With negative port (40)；The negative pressure gap includes groove (42)；When the absorption object is electroluminescent device, the electricity
Electroluminescence device includes display area and non-display area, the non-display area of the corresponding electroluminescent device of the groove (42)
Domain is distributed in the light-transparent carrier.
2. a kind of light-transparent carrier, it is characterised in that: the light-transparent carrier include for absorption object be bonded absorption surface, use
In with it is described absorption object absorption negative pressure gap, the negative port (40) for being connect with negative pressure device, the negative port
(40) it is located inside the light-transparent carrier, the light-transparent carrier further includes airflow channel (41), for being connected to the negative pressure gap
With negative port (40)；Negative pressure gap includes multiple negative pressure through-holes (43)；When the absorption object is electroluminescent device, institute
Stating electroluminescent device includes display area and non-display area, and the negative pressure through-hole (43) corresponds to the electroluminescent device
Non-display area is distributed in the light-transparent carrier, or display area and the non-display area of the corresponding electroluminescent device
It is distributed in the light-transparent carrier.
3. light-transparent carrier according to claim 2, it is characterised in that: the pore diameter range of negative pressure through-hole (43) is 2 ~ 10mm.
4. a kind of packaging system of electroluminescent device, it is characterised in that: successively wanted from the bottom to top including light source (100), right
The transport establishment (107) for seeking light-transparent carrier described in any one of 1-3 (4), driving electroluminescent device, further includes mobilizable
Cover portion (2), the cover portion have pressure modulating opening, are formed between the cover portion (2) and light-transparent carrier (4) and are encapsulated for electroluminescent device
Sealing space (105), light source (100) is towards sealing space (105).
5. the packaging system of electroluminescent device according to claim 4, it is characterised in that: under the light-transparent carrier (4)
Side is equipped with the insulating assembly of light-permeable, and the insulating assembly is located between light-transparent carrier (4) and light source (100).
6. the packaging system of electroluminescent device according to claim 4, it is characterised in that: the light source (100) includes
Insulating assembly, the insulating assembly are located at the light-emitting surface of light source (100).
7. the packaging system of electroluminescent device according to claim 5, it is characterised in that: the insulating assembly includes
Second transmission plane carrier (102), the second transmission plane carrier (102) are equipped with saturating for the light of 200-500nm for wavelength
The filter coating crossed.
8. the packaging system of electroluminescent device according to claim 5, it is characterised in that: it further include air interchanger, institute
State formation insulated cavity (110), the insulated cavity (110) and air interchanger between insulating assembly and the light-transparent carrier (4)
Connection, the insulated cavity (110) are filled with flowable air-flow.
9. the packaging system of electroluminescent device according to claim 6, it is characterised in that: it further include air interchanger, institute
State formation insulated cavity (110), the insulated cavity (110) and air interchanger between insulating assembly and the light-transparent carrier (4)
Connection, the insulated cavity (110) are filled with flowable air-flow.
10. the packaging system of electroluminescent device according to claim 4, it is characterised in that: under the light-transparent carrier (4)
Side is additionally provided with the light barrier (101) passed through for controlling light source (100) light.
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| CN201610505286.8A CN106129218B (en) | 2016-06-27 | 2016-06-27 | A kind of packaging system of light-transparent carrier and electroluminescent device |
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| CN106129218B true CN106129218B (en) | 2019-02-05 |
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| NL2021006B1 (en) * | 2018-05-29 | 2019-12-04 | Suss Microtec Lithography Gmbh | Holding apparatus and method for holding a substrate |
| CN114441532B (en) * | 2022-01-25 | 2022-12-06 | 广州诺顶智能科技有限公司 | Thin film circuit appearance detection device and thin film circuit appearance detection structure |
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