CN107452863A - A kind of LED encapsulation structure of radiating - Google Patents
A kind of LED encapsulation structure of radiating Download PDFInfo
- Publication number
- CN107452863A CN107452863A CN201710907703.6A CN201710907703A CN107452863A CN 107452863 A CN107452863 A CN 107452863A CN 201710907703 A CN201710907703 A CN 201710907703A CN 107452863 A CN107452863 A CN 107452863A
- Authority
- CN
- China
- Prior art keywords
- substrate
- side wall
- mounting groove
- heat conductive
- radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 239000011324 bead Substances 0.000 claims abstract description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000000741 silica gel Substances 0.000 claims abstract description 15
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 210000003850 cellular structure Anatomy 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000428 dust Substances 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a kind of LED encapsulation structure of radiating, including substrate, the substrate is hollow structure, the mounting groove of multiple array arrangements is provided with the side side wall of substrate, LED lamp bead is installed in the bottom side wall of mounting groove, LED lamp bead is surrounded by light collecting barrel, light collecting barrel is sticked in the surrounding side wall of mounting groove, the outside of mounting groove is provided with transparent sealed cover, fresh air inlet is provided between adjacent fitting grooves, fresh air inlet is located in the side wall of substrate, the bottom of mounting groove is provided with through hole, through hole is located on substrate, heat conductive silica gel is fixed with through hole, one end of heat conductive silica gel is in contact with LED lamp bead, one end of heat conductive silica gel is connected with heat conductive rod, heat conductive rod is located at the inside of substrate, multiple equally distributed first fin are installed in the surrounding side wall of heat conductive rod.The present invention can LED lamp bead carry out quick heat radiating, good heat dissipation effect, while prevent dust to be attached to LED lamp bead extends the service life of LED lamp bead.
Description
Technical field
The present invention relates to LED technical field, more particularly to a kind of LED encapsulation structure of radiating.
Background technology
LED encapsulates the encapsulation for referring to luminescence chip, has relatively big difference compared to integrated antenna package.LED encapsulation not only will
Wick can be protected by asking, but also will being capable of printing opacity.So LED encapsulation has special requirement to encapsulating material.Existing LED envelopes
Dress is generally enclosed construction, therefore heat dispersion is particularly critical, and the bad service life that LED can be caused to encapsulate of radiating effect is significantly
Shorten, a kind of cooling LED encapsulating structure is proposed in patent CN206040701 U, it is entered by the natural flowing of air
Row radiating, radiating effect is poor, and LED chip directly contacts with air, and dust is easily sticked in LED chip, for this we
It is proposed a kind of LED encapsulation structure of radiating.
The content of the invention
The invention aims to solve shortcoming present in prior art, and a kind of LED of the radiating proposed is encapsulated
Structure.
To achieve these goals, present invention employs following technical scheme：
A kind of LED encapsulation structure of radiating, including substrate, the substrate are hollow structure, are provided with the side side wall of substrate more
The mounting groove of individual array arrangement, LED lamp bead is installed in the bottom side wall of mounting groove, LED lamp bead is surrounded by light collecting barrel, gathers
Light cylinder is sticked in the surrounding side wall of mounting groove, and the outside of mounting groove is provided with transparent sealed cover, be provided between adjacent fitting grooves into
Air holes, fresh air inlet are located in the side wall of substrate, and the bottom of mounting groove is provided with through hole, and through hole is located on substrate, is fixed with through hole
Heat conductive silica gel, one end of heat conductive silica gel are in contact with LED lamp bead, and one end of heat conductive silica gel is connected with heat conductive rod, and heat conductive rod is located at
The inside of substrate, multiple equally distributed first fin are installed in the surrounding side wall of heat conductive rod, substrate is away from mounting groove
Multiple equally distributed guide ducts are connected with the side wall of side, one end of guide duct is connected with chimney fan, and one end of chimney fan is set
There is opening, the opening of chimney fan is provided with the fan of exhausting from inside to outside.
Preferably, the inside of the fresh air inlet is provided with Air Filter.
Preferably, the substrate is aluminium base or copper base.
Preferably, first fin is cellular structure.
Preferably, it is equipped with heat radiating fin in the surrounding side wall of the guide duct.
Preferably, the substrate, fresh air inlet and mounting groove are integral type structure.
Preferably, multiple the second fin being uniformly arranged are respectively connected with the surrounding side wall of the chimney fan, second dissipates
The inside for extending to chimney fan of backing.
Beneficial effects of the present invention：By fan, chimney fan, guide duct, substrate, the first fin, heat conductive rod, transparent close
The setting of sealing cover, fresh air inlet, LED lamp bead, light collecting barrel, heat conductive silica gel, Air Filter and mounting groove, it is transparent can to prevent that dust from entering
Seal closure, at the same can to caused by LED lamp bead heat carry out quick heat radiating, good heat dissipation effect, the present apparatus can LED lamp bead enter
Row quick heat radiating, good heat dissipation effect, while prevent dust to be attached to LED lamp bead, extend the service life of LED lamp bead.
Brief description of the drawings
Fig. 1 is a kind of structural representation of the LED encapsulation structure of radiating proposed by the present invention；
Fig. 2 is a kind of partial structural diagram of the LED encapsulation structure of radiating proposed by the present invention.
In figure：1 fan, 2 chimney fans, 3 guide ducts, 4 substrates, 5 first fin, 6 heat conductive rods, 7 transparent sealed covers, 8 are entered
Air holes, 9 LED lamp beads, 10 light collecting barrels, 11 heat conductive silica gels, 12 Air Filters, 13 mounting grooves.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.
Reference picture 1-2, a kind of LED encapsulation structure of radiating, including substrate 4, substrate 4 are hollow structure, the side of substrate 4
The mounting groove 13 of multiple array arrangements is provided with side wall, LED lamp bead 9, LED lamp bead 9 are installed in the bottom side wall of mounting groove 13
Be surrounded by light collecting barrel 10, light collecting barrel 10 is sticked in the surrounding side wall of mounting groove 13, and the outside of mounting groove 13 is provided with transparent
Seal closure 7, fresh air inlet 8 is provided between adjacent fitting grooves 13, fresh air inlet 8 is located in the side wall of substrate 4, and the bottom of mounting groove 13 is opened
There is through hole, through hole is located on substrate 4, and heat conductive silica gel 11 is fixed with through hole, and one end of heat conductive silica gel 11 connects with LED lamp bead 9
Touch, one end of heat conductive silica gel 11 is connected with heat conductive rod 6, and heat conductive rod 6 is located at the inside of substrate 4, pacified in the surrounding side wall of heat conductive rod 6
Equipped with multiple equally distributed first fin 5, substrate 4 is connected with multiple be uniformly distributed in the side side wall away from mounting groove 13
Guide duct 3, one end of guide duct 3 is connected with chimney fan 2, and one end of chimney fan 2 is provided with opening, the opening peace of chimney fan 2
Fan 1 equipped with exhausting from inside to outside, the inside of fresh air inlet 8 are provided with Air Filter 8, and substrate 4 is aluminium base or copper base, and first dissipates
Backing 5 is cellular structure, and heat radiating fin is equipped with the surrounding side wall of guide duct 3, and substrate 4, fresh air inlet 8 and mounting groove 13 are one
Body formula structure, multiple the second fin being uniformly arranged, the extension of the second fin are respectively connected with the surrounding side wall of chimney fan 2
To the inside of chimney fan 2.
Application process：Start the fan 1 in discharge pipe 2, after LED lamp bead 9 is lighted, heat transfer caused by LED lamp bead 9
To on heat conductive silica gel 11 and substrate 4, the heat on heat conductive silica gel 11 is delivered on the first fin 5 by heat conductive rod 6, fan 1
The air in the external world is sucked to the inside of substrate 4 by fresh air inlet 8, the heat on the first fin 5 is taken away, is entered by ventilating duct 3
Enter in chimney fan 2 and discharge, the second fin on heat radiating fin and chimney fan 2 on ventilating duct 3 transfers heat away from.
The foregoing is only a preferred embodiment of the present invention, but protection scope of the present invention be not limited thereto,
Any one skilled in the art the invention discloses technical scope in, technique according to the invention scheme and its
Inventive concept is subject to equivalent substitution or change, should all be included within the scope of the present invention.
Claims (7)
1. a kind of LED encapsulation structure of radiating, including substrate（4）, it is characterised in that the substrate（4）For hollow structure, substrate
（4）Side side wall on be provided with the mounting grooves of multiple array arrangements（13）, mounting groove（13）Bottom side wall on LED is installed
Pearl（9）, LED lamp bead（9）Be surrounded by light collecting barrel（10）, light collecting barrel（10）Stick in mounting groove（13）Surrounding side wall on,
Mounting groove（13）Outside be provided with transparent sealed cover（7）, adjacent fitting grooves（13）Between be provided with fresh air inlet（8）, fresh air inlet（8）Position
In substrate（4）Side wall on, mounting groove（13）Bottom be provided with through hole, through hole is located at substrate（4）On, heat conduction is fixed with through hole
Silica gel（11）, heat conductive silica gel（11）One end and LED lamp bead（9）It is in contact, heat conductive silica gel（11）One end be connected with heat conductive rod
（6）, heat conductive rod（6）Positioned at substrate（4）Inside, heat conductive rod（6）Surrounding side wall on be provided with multiple equally distributed first
Fin（5）, substrate（4）Away from mounting groove（13）Side side wall on be connected with multiple equally distributed guide ducts（3）, wind-guiding
Pipe（3）One end be connected with chimney fan（2）, chimney fan（2）One end be provided with opening, chimney fan（2）Opening be provided with by
The fan of exhausting from inside to outside（1）.
A kind of 2. LED encapsulation structure of radiating according to claim 1, it is characterised in that the fresh air inlet（8）Inside
Provided with Air Filter（8）.
A kind of 3. LED encapsulation structure of radiating according to claim 1, it is characterised in that the substrate（4）For aluminium base
Or copper base.
A kind of 4. LED encapsulation structure of radiating according to claim 1, it is characterised in that first fin（5）For
Cellular structure.
A kind of 5. LED encapsulation structure of radiating according to claim 1, it is characterised in that the guide duct（3）Surrounding
Heat radiating fin is equipped with side wall.
A kind of 6. LED encapsulation structure of radiating according to claim 1, it is characterised in that the substrate（4）, fresh air inlet
（8）And mounting groove（13）For integral type structure.
A kind of 7. LED encapsulation structure of radiating according to claim 1, it is characterised in that the chimney fan（2）Surrounding
Multiple the second fin being uniformly arranged are respectively connected with side wall, the second fin extends to chimney fan（2）Inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710907703.6A CN107452863A (en) | 2017-09-29 | 2017-09-29 | A kind of LED encapsulation structure of radiating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710907703.6A CN107452863A (en) | 2017-09-29 | 2017-09-29 | A kind of LED encapsulation structure of radiating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107452863A true CN107452863A (en) | 2017-12-08 |
Family
ID=60498448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710907703.6A Withdrawn CN107452863A (en) | 2017-09-29 | 2017-09-29 | A kind of LED encapsulation structure of radiating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107452863A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107845349A (en) * | 2017-12-21 | 2018-03-27 | 南宁棵树标识制作有限公司 | A kind of aluminium-plastic panel inlays acrylic light emitting character construction |
| CN108493316A (en) * | 2018-05-23 | 2018-09-04 | 广东工业大学 | A kind of LED packagings |
| CN109243324A (en) * | 2018-10-16 | 2019-01-18 | 安徽宏路新材料科技有限公司 | A kind of environmental protection actively shines building board |
-
2017
- 2017-09-29 CN CN201710907703.6A patent/CN107452863A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107845349A (en) * | 2017-12-21 | 2018-03-27 | 南宁棵树标识制作有限公司 | A kind of aluminium-plastic panel inlays acrylic light emitting character construction |
| CN108493316A (en) * | 2018-05-23 | 2018-09-04 | 广东工业大学 | A kind of LED packagings |
| CN109243324A (en) * | 2018-10-16 | 2019-01-18 | 安徽宏路新材料科技有限公司 | A kind of environmental protection actively shines building board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20171208 |
|
| WW01 | Invention patent application withdrawn after publication |