CN101261283A - Test bench wafer suction disc device - Google Patents
Test bench wafer suction disc device Download PDFInfo
- Publication number
- CN101261283A CN101261283A CN 200810023654 CN200810023654A CN101261283A CN 101261283 A CN101261283 A CN 101261283A CN 200810023654 CN200810023654 CN 200810023654 CN 200810023654 A CN200810023654 A CN 200810023654A CN 101261283 A CN101261283 A CN 101261283A
- Authority
- CN
- China
- Prior art keywords
- negative pressure
- sucker
- subpressure
- test bench
- wafer suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a detecting device for a wafer, in particular to a detecting wafer osculum device to fix the wafers in a vacuum adsorption way while being detected. According to the technical proposal provided by the invention, a heater is arranged between a subpressure sucker and an adiabatic tray; a plurality of subpressure air drains are arranged on the surface of the subpressure sucker; a subpressure pore communicated with the subpressure air drain is arranged inside the subpressure sucker and a subpressure gas-type fitting is arranged in the subpressure sucker, which is communicated with the subpressure pore; a discharge hole which runs through the subpressure sucker, the heater and the adiabatic tray are arranged in the subpressure sucker. While in use, the detecting device for a wafer is very convenient in fixing or unloading the wafer, which can greatly reduce detecting time, improve detecting sufficiency and effectively reduce detecting cost.
Description
Technical field
The present invention relates to a kind of testing apparatus of wafer, specifically a kind of mode by negative-pressure adsorption realizes fixing test bench wafer suction disc device to wafer when testing.
Background technology
At present, in the wafer sort field, test machine and the method for testing that generally adopts is manual test or semi-automatic test at present.Manual test is artificial each wafer of placing, with manual test behind each tube core of optics microscope alignment, and inefficiency and make measuring accuracy lower; Semi-automatic test is manually wafer to be placed on the test board, again by optical microscope scanning, the angle of manual adjustment wafer and the position of first tube core.Each tube core on the test wafer successively again after adjusting.Manually wafer is put back in the wafer film magazine after testing every wafer, taken out next wafer again and repeat above-mentioned test process.So manually-operated has increased the time of wafer sort greatly, certainly will also increase testing cost.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, provide the fixing of a kind of wafer and dismounting all easily, can shorten the test duration greatly, improve testing efficiency and can reduce the test bench wafer suction disc device of testing cost.
According to technical scheme provided by the invention, between negative pressure sucker and thermal insulating disc, be provided with well heater, be provided with some negative pressure air drains at the negative pressure sucker upper surface, in negative pressure sucker, be provided with the negative pressure pore that is communicated with the negative pressure air drain, on negative pressure sucker, be provided with the negative pressure gas-tpe fitting, described negative pressure gas-tpe fitting is communicated with the negative pressure pore, is provided with the dumping pit that runs through negative pressure sucker, well heater and thermal insulating disc on negative pressure sucker.
The concentric circles cell body that described negative pressure air drain is offered for the negative pressure sucker upper surface.Dumping pit is more than three or three, and they are arranged between the adjacent two negative pressure air drains equably.Between negative pressure sucker and well heater, be provided with hot buffer disc.Described hot buffer disc is made by thermosetting plastics DMC.Between well heater and thermal insulating disc, be provided with cover plate.Lower surface at negative pressure sucker is provided with the lower convex ring that stretches out to thermal insulating disc, correspondingly the thermal insulating disc upper surface be provided with to negative pressure sucker stretch out on bulge loop, the lower surface of lower convex ring contacts with last bulge loop upper surface and well heater, hot buffer disc and cover plate is contained in it.Be provided with temperature sensor at the negative pressure sucker sidewall.
The present invention is fixing in use can to shorten the test duration greatly with to unload wafer all very convenient, improves testing efficiency, and effectively can reduce testing cost.
Description of drawings
Fig. 1 is an one-piece construction synoptic diagram of the present invention.
Fig. 2 is the explosive view of each parts of the present invention.
Embodiment
The invention will be further described below in conjunction with concrete drawings and Examples.
As shown in the figure: the well heater 3 that between negative pressure sucker 1 and thermal insulating disc 2, is provided with, be provided with some negative pressure air drains 4 at negative pressure sucker 1 upper surface, in negative pressure sucker 1, be provided with the negative pressure pore 5 that is communicated with negative pressure air drain 4, on negative pressure sucker 1, be provided with negative pressure gas-tpe fitting 6, described negative pressure gas-tpe fitting 6 is communicated with negative pressure pore 5, is provided with the dumping pit 7 that runs through negative pressure sucker 1, well heater 3 and thermal insulating disc 2 on negative pressure sucker 1.
The concentric circles cell body that described negative pressure air drain 4 is offered for negative pressure sucker 1 upper surface.Dumping pit 7 is more than three or three, and they are arranged between the adjacent two negative pressure air drains 4 equably.Between negative pressure sucker 1 and well heater 3, be provided with hot buffer disc 8.Described hot buffer disc 8 is made by thermosetting plastics DMC.Between well heater 3 and thermal insulating disc 2, be provided with cover plate 9.Lower surface at negative pressure sucker 1 is provided with the lower convex ring 10 that stretches out to thermal insulating disc 2, correspondingly thermal insulating disc 2 upper surfaces be provided with to negative pressure sucker 1 stretch out on bulge loop 11, the lower surface of lower convex ring 10 contacts with last bulge loop 11 upper surfaces and well heater 3, hot buffer disc 8 and cover plate 9 is contained in it.Be provided with temperature sensor 12 at negative pressure sucker 1 sidewall.
For preferably laminar wafer being fixed, consider fixing firmly and factor such as even, the present invention takes the mode of vacuum suction.As shown in Figure 2, be about to go out for example ten concentric circular negative pressure air drains 4 in order to vacuum cup 1 surface working of absorption wafer, each negative pressure air drain 4 all has a negative pressure pore 5, also can be divided into three groups to these ten negative pressure air drains 4 in addition, every group has independent gas circuit air feed, connect negative pressure pore 5 by negative pressure gas-tpe fitting 6 and connect, so just formed vacuum suction system by three gas circuit controls with outside tracheae.Firm and the uniform and stable of this system's absorption in test process, can be carried out the gentle pressure-controlled of switch respectively to these three gas circuits according to the difference of wafer specification.Location for ease of test is shaped on identification marking at the center of vacuum cup 1.Based on the needs of wafer, on vacuum cup 1, be processed with dumping pit 7 last and the thimble lifting of when unloading.
Temperature requirement when satisfying wafer sort, the present invention takes electrically heated mode, this heating action is finished by well heater 3, temperature detect switch (TDS) 14 is installed on the extension line of well heater, and the 12 pairs of temperature of temperature sensor of packing in vacuum cup 1 are monitored, be able to switch control to be implemented in when too high or too low for temperature, make wafer sort in the temperature environment of expection, to finish.
Well heater cover plate 9 can be fixed on well heater 3 glands on the vacuum cup 1, has ground wire 15 to draw on the well heater cover plate 9, the security when guaranteeing to test.Consider the requirement of wafer sort simultaneously to the stability of temperature, hot buffer disc 8 and thermal insulating disc 2 have been involved in the device of the present invention, hot buffer disc 8 and thermal insulating disc 2 are to be made by a kind of thermosetting plastics DMC, it absorbs heat slow and the slow material properties of heat release has the function that preferably temperature is stored, and has also played heat-blocking action preferably simultaneously when installing with outside parts.
Claims (8)
1, a kind of test bench wafer suction disc device, comprise the well heater (3) that is arranged between negative pressure sucker (1) and the thermal insulating disc (2), it is characterized in that: the upper surface at negative pressure sucker (1) is provided with some negative pressure air drains (4), in negative pressure sucker (1), be provided with the negative pressure pore (5) that is communicated with negative pressure air drain (4), on negative pressure sucker (1), be provided with negative pressure gas-tpe fitting (6), described negative pressure gas-tpe fitting (6) is communicated with negative pressure pore (5), is provided with the dumping pit (7) that runs through negative pressure sucker (1), well heater (3) and thermal insulating disc (2) on negative pressure sucker (1).
2, test bench wafer suction disc device as claimed in claim 1 is characterized in that: the concentric circles cell body that described negative pressure air drain (4) is offered for negative pressure sucker (1) upper surface.
3, test bench wafer suction disc device as claimed in claim 1 is characterized in that: dumping pit (7) is more than three or three, and they are arranged between the adjacent two negative pressure air drains (4) equably.
4, test bench wafer suction disc device as claimed in claim 1 is characterized in that: be provided with hot buffer disc (8) between negative pressure sucker (1) and well heater (3).
5, test bench wafer suction disc device as claimed in claim 4 is characterized in that: described hot buffer disc (8) is made by thermosetting plastics DMC.
6, test bench wafer suction disc device as claimed in claim 1 is characterized in that: be provided with cover plate (9) between well heater (3) and thermal insulating disc (2).
7, test bench wafer suction disc device as claimed in claim 1, it is characterized in that: the lower surface at negative pressure sucker (1) is provided with the lower convex ring (10) that stretches out to thermal insulating disc (2), correspondingly the upper surface at thermal insulating disc (2) is provided with the last bulge loop (11) that stretches out to negative pressure sucker (1), and the lower surface of lower convex ring (10) contacts with the upper surface of last bulge loop (11) and well heater (3), hot buffer disc (8) are contained in it with cover plate (9).
8, test bench wafer suction disc device as claimed in claim 1 is characterized in that: the sidewall at negative pressure sucker (1) is provided with temperature sensor (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810023654 CN101261283B (en) | 2008-04-14 | 2008-04-14 | Test bench wafer suction disc device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810023654 CN101261283B (en) | 2008-04-14 | 2008-04-14 | Test bench wafer suction disc device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101261283A true CN101261283A (en) | 2008-09-10 |
| CN101261283B CN101261283B (en) | 2010-08-18 |
Family
ID=39961873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810023654 Expired - Fee Related CN101261283B (en) | 2008-04-14 | 2008-04-14 | Test bench wafer suction disc device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101261283B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106129218A (en) * | 2016-06-27 | 2016-11-16 | 纳晶科技股份有限公司 | A kind of light-transparent carrier and the packaging system of electroluminescent device |
| CN107053037A (en) * | 2016-12-08 | 2017-08-18 | 广东工业大学 | Based on fuzzy control self-adaptive electromagnetic formula vacuum cup |
| CN108414910A (en) * | 2018-02-27 | 2018-08-17 | 上海华岭集成电路技术股份有限公司 | Data Identification method in the test of semiconductor volume production |
| CN109216239A (en) * | 2018-08-14 | 2019-01-15 | 广东利扬芯片测试股份有限公司 | Wafer cleaning equipment and cleaning method |
| WO2019105422A1 (en) * | 2017-11-30 | 2019-06-06 | 上海微电子装备（集团）股份有限公司 | Heating device and heating method |
| CN109901280A (en) * | 2019-04-10 | 2019-06-18 | 无锡盈芯半导体科技有限公司 | A kind of objective table with vacuum suction and heating function |
-
2008
- 2008-04-14 CN CN 200810023654 patent/CN101261283B/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106129218A (en) * | 2016-06-27 | 2016-11-16 | 纳晶科技股份有限公司 | A kind of light-transparent carrier and the packaging system of electroluminescent device |
| CN106129218B (en) * | 2016-06-27 | 2019-02-05 | 纳晶科技股份有限公司 | A kind of packaging system of light-transparent carrier and electroluminescent device |
| CN107053037A (en) * | 2016-12-08 | 2017-08-18 | 广东工业大学 | Based on fuzzy control self-adaptive electromagnetic formula vacuum cup |
| WO2019105422A1 (en) * | 2017-11-30 | 2019-06-06 | 上海微电子装备（集团）股份有限公司 | Heating device and heating method |
| CN108414910A (en) * | 2018-02-27 | 2018-08-17 | 上海华岭集成电路技术股份有限公司 | Data Identification method in the test of semiconductor volume production |
| CN109216239A (en) * | 2018-08-14 | 2019-01-15 | 广东利扬芯片测试股份有限公司 | Wafer cleaning equipment and cleaning method |
| CN109901280A (en) * | 2019-04-10 | 2019-06-18 | 无锡盈芯半导体科技有限公司 | A kind of objective table with vacuum suction and heating function |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101261283B (en) | 2010-08-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101261283B (en) | Test bench wafer suction disc device | |
| CN101261306B (en) | Full-automatic wafer test method and equipment accomplishing the method | |
| CN109119354B (en) | Solar cell efficiency testing method | |
| JP2010503231A5 (en) | ||
| CN103149524A (en) | Reversed LED (Light Emitting Diode) chip tester and test method | |
| CN105374766A (en) | Cooling method of semiconductor wafer and cooling device of semiconductor wafer | |
| CN201196654Y (en) | Wafer suction disc apparatus for test bench | |
| CN105789082A (en) | System for detecting silicon chip subfissure | |
| CN101283437A (en) | Workpiece handling alignment system | |
| CN107883907A (en) | Thickness of workpiece detecting system and its battery core OCV test equipments | |
| CN115791029A (en) | Fire valve water pressure resistance detection device and detection method | |
| CN108045945A (en) | Battery core feeding system and its battery core OCV test equipments | |
| CN108067436A (en) | Battery core transfer mechanism, battery core transferring system, battery core OCV test equipments | |
| CN107591342B (en) | Automatic square resistance measuring equipment | |
| CN107492509B (en) | A kind of wafer goes gas chamber and PVD equipment | |
| CN100578243C (en) | Full-automatic each specification wafer test and discriminating device | |
| CN109786279A (en) | Heating platform, heat treatment and manufacturing method | |
| CN110666412A (en) | Full-automatic welding machine and production method | |
| CN109950179B (en) | A integration sorting device that is used for damage prevention of chip processing | |
| US9885648B2 (en) | Particle detecting apparatus | |
| CN115616027A (en) | PVC calendering membrane temperature resistant detection device and detecting system | |
| CN202150448U (en) | Wafer supporting stage for wafer test machine | |
| CN206947297U (en) | Substrate alignment and detection device and substrate processing machine | |
| TWI509253B (en) | Probe station | |
| CN201233433Y (en) | Full automatic testing and discriminating gear for wafer of each specification |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100818 Termination date: 20140414 |