CN108414910A - Data Identification method in the test of semiconductor volume production - Google Patents

Abstract

A kind of Data Identification method in being tested the present invention relates to semiconductor volume production, finished semiconductor is taken out to be put into test machine and be tested by manipulator platform from the charging tray area to be measured labeled as T, and the finished semiconductor tested is put back to the charging tray zone position originally taken out by manipulator platform after the completion of test；Several charging trays to be measured stack short transverse and are set as Z axis, the finished semiconductor direction of each charging tray first row test is X-axis, charging tray other direction is Y-axis, the positioning of any one finished semiconductor XYZ coordinate is set in the charging tray of stacking, automatic test machine is communicated with mechanical mobile phone, ensure that the finished semiconductor in each charging tray has unique correspondence, solves batch mixing during finished semiconductor is tested automatically, sub-material, the problem that test data and actual test finished semiconductor can not correspond to, realize that automatic volume production carries out effective sub-material according to corresponding expired entry and data correspond to, it improves board and is applicable in ability.

Description

Data Identification method in the test of semiconductor volume production

Technical field

The present invention relates to a kind of detection technique, more particularly to Data Identification method in a kind of semiconductor volume production test.

Background technology

FT is tested：Finished semiconductor electrical testing；Manipulator：The certain holding functions for imitating human hand and arm, to press fixation Program crawl, the automatic pilot for carrying object or operation instrument；ATE：Automatic test equipment carries out semiconductor and tests automatically Instrument；Tray disks（Charging tray）：When finished semiconductor electrical testing, manipulator is used for putting the container of finished product.

The FT finished products of solution are tested sub-material, test data and actual test circuit and corresponding can not be limited to automatically, satisfaction pair Statistics, subpackage, analysis demand when finished product test.

In finished product is tested automatically, each circuit under test that ATE is put into manipulator station can carry out corresponding program Test, printed according to final testing result and preserve corresponding data.But it is occupied by manipulator board sub-material and practical Tray disks The excessive limitation of area can only often carry out qualified and underproof product differentiation usually in fruiting area timesharing.ATE is caused to produce Raw data can not carry out one-to-one relationship with actual circuit, can only carry out yield statistics.The test later stage is had When body failure analysis, because data can not be corresponded to corresponding actual circuit, certain difficulty is caused.

Simultaneously as manipulator board is limited to by itself, the circuit laser label tested can not be scanned really Recognize, may slip up the case where causing different batches charging tray to mix because of manual operation, be put into again by manipulator after test The case where mixing in different charging trays, cause batch mixing influences the quality of production, reduces yield.

Existing manipulator blowing area schematic after a test as shown in Figure 1, point four regions, a charging tray area to be sorted, One qualified charging tray area and two unqualified charging tray areas, the test that ATE can fail in actual test according to actual circuit at present Item carries out corresponding sub-material, to distinguish different failures.But by manipulator board sub-material ability and practical Tray disks area occupied Influence can only carry out qualified and unqualified classification or a small amount of unqualified classification, therefore causing can not in actual test volume production The division specifically failed and statistics, the data of corresponding data and actual semiconductor correspond, caused by maloperation The problem of batch mixing.

Invention content

Sub-material, the test number of all unqualified test items can not be carried out in being tested the present invention be directed to present finished semiconductor A kind of the problem of according to corresponding, maloperation batch mixing can not be carried out with actual circuit, it is proposed that Data Identification in semiconductor volume production test Method, solving batch mixing, sub-material, test data and actual test finished semiconductor during finished semiconductor is tested automatically can not correspond to The problem of, the ability of manipulator board is effectively improved, is met customer need.

The technical scheme is that：Data Identification method in a kind of test of semiconductor volume production, specifically comprises the following steps：

1）Finished semiconductor is taken out to be put into test machine and be tested by manipulator platform from the charging tray area to be measured labeled as T, is surveyed The finished semiconductor tested is put back to the charging tray zone position originally taken out by manipulator platform after the completion of examination, according to position record half Conductor finished product test data；

2）Several charging trays to be measured stack short transverse and are set as Z axis, and the finished semiconductor direction of each charging tray first row test is X Axis, charging tray other direction are Y-axis, in the charging tray of stacking the positioning of any one finished semiconductor XYZ coordinate set；

3）Automatic test machine is communicated with mechanical mobile phone, and the charging tray position that every finished semiconductor is placed is fetched from mechanical mobile phone platform Corresponding information is set, picks and places the XY information of material including the Z axis information and single charging tray of overlapping charging tray, and be stored in every half and lead It in body finished product data, is preserved in a standard format, ensures that the finished semiconductor in each charging tray has unique correspondence；

4）Mechanical mobile phone is dispensed by correspondence, and qualified finished product and the unqualified finished product of variety classes are respectively put into qualified material In disk and the unqualified charging tray of the unqualified type of mark, sub-material is completed.

The beneficial effects of the present invention are：Data Identification method in semiconductor volume production test of the present invention, realizes automatic volume production Effective sub-material is carried out according to corresponding expired entry and data correspond to, and is improved board and is applicable in ability.

Description of the drawings

Fig. 1 is existing manipulator blowing area schematic after a test；

Fig. 2 is charging tray functional schematic to be measured before the present invention does not test；

Fig. 3 is to produce charging tray functional schematic in present invention test；

Fig. 4 is charging tray respective coordinates relation schematic diagram of the present invention；

Fig. 5 is sorting function schematic diagram of the present invention.

Specific implementation mode

Based on the limitation in actual machine hand blowing region, a block panel can be only used in volume production and carries out volume production survey Examination.It is put into finished product to be measured in charging tray area to be measured, in practical volume production opportunity tool hand platform by finished semiconductor from labeled as the to be measured of T Charging tray area takes out to be put into test machine and be tested, and is illustrated in fig. 2 shown below charging tray functional schematic to be measured before not testing.

The finished semiconductor tested is put back to the position originally taken out by manipulator platform after the completion of test, it is ensured that same material Finished semiconductor will not be solved because of the problem of different charging trays causes batch mixing has been replaced because maloperation causes batch mixing in disk And the problem of influence amount yield and quality, yield.It is illustrated in fig. 3 shown below charging tray functional schematic to be measured in test, charging tray to be measured can at this time Charging tray is referred to as produced, qualified finished semiconductor 1, unqualified finished semiconductor 2,3 are put back to charging tray according to original position, do not tested For T.After the completion of test, all finished semiconductors are still returned in original charging tray to be measured by original position.

It is illustrated in fig. 4 shown below charging tray respective coordinates relation schematic diagram, several charging trays to be measured stack short transverse and are set as Z axis, The finished semiconductor direction of each charging tray first row test is X-axis, and charging tray other direction is Y-axis, all on a charging tray partly to lead Body finished product can be set with XY coordinate settings, any one finished semiconductor can be positioned with XYZ coordinate and be set in the charging tray of stacking.

It is communicated using ATE tester tables and manipulator board, qualified and unqualified classification hair is only carried out original On the basis of sending instruction, the charging tray position corresponding information that every finished semiconductor is placed is fetched from mechanical mobile phone platform, including The Z axis information and single charging tray for being overlapped charging tray pick and place the XY information of material, and are stored in every finished semiconductor data, with standard Format is preserved, and ensures that the finished semiconductor in each charging tray has unique correspondence.

The test data of corresponding finished semiconductor is had recorded in the data that test machine itself generates simultaneously, which includes surveys Test result and sub-material definition completely have recorded institute's information in need and correspondence in volume production in conjunction with respective coordinates information, Database server is uploaded to simultaneously carries out data preservation, so that the later stage checks, data analysis operation.It is brought avoiding maloperation Outside the influence of batch mixing, the demand that greatly improves volume production quality, meet the later stage to data analysis.

Subsequently if necessary to when being dispensed according to test result sub-material to the finished circuit for having tested completion, only need handle The charging tray surveyed is put into grading manipulator board, and corresponding Z axis coordinate is currently expected in board acquirement and that takes out every time individually partly leads The XY information of body finished product is as foundation, the data of corresponding coordinate from database server, according to test result sub-material before It is dispensed, and according to the coordinate information after sorting, generates new corresponding relation data, saved as sorting data and upload to data Library server is preserved.Packing rule can be customized according to customer requirement.Example：Only sorting certified products material 1, defective work material 2 With material 4 or certain specific material.It is illustrated in fig. 5 shown below.

The corresponding data of product and generation after being sorted as requested meets the later stage under the premise of ensureing quality Logarithm it is investigated that test, engineering batch data analysis, volume production sorting demand, efficiently solve FT test handlers batch mixing, sub-material and Problem corresponding to data.

Claims (1)

1. a kind of Data Identification method in semiconductor volume production test, which is characterized in that specifically comprise the following steps：

1）Finished semiconductor is taken out to be put into test machine and be tested by manipulator platform from the charging tray area to be measured labeled as T, is surveyed The finished semiconductor tested is put back to the charging tray zone position originally taken out by manipulator platform after the completion of examination, according to position record half Conductor finished product test data；

2）Several charging trays to be measured stack short transverse and are set as Z axis, and the finished semiconductor direction of each charging tray first row test is X Axis, charging tray other direction are Y-axis, in the charging tray of stacking the positioning of any one finished semiconductor XYZ coordinate set；

3）Automatic test machine is communicated with mechanical mobile phone, and the charging tray position that every finished semiconductor is placed is fetched from mechanical mobile phone platform Corresponding information is set, picks and places the XY information of material including the Z axis information and single charging tray of overlapping charging tray, and be stored in every half and lead It in body finished product data, is preserved in a standard format, ensures that the finished semiconductor in each charging tray has unique correspondence；

4）Mechanical mobile phone is dispensed by correspondence, and qualified finished product and the unqualified finished product of variety classes are respectively put into qualified material In disk and the unqualified charging tray of the unqualified type of mark, sub-material is completed.