CN201196654Y - Wafer suction disc apparatus for test bench - Google Patents
Wafer suction disc apparatus for test bench Download PDFInfo
- Publication number
- CN201196654Y CN201196654Y CN 200820035163 CN200820035163U CN201196654Y CN 201196654 Y CN201196654 Y CN 201196654Y CN 200820035163 CN200820035163 CN 200820035163 CN 200820035163 U CN200820035163 U CN 200820035163U CN 201196654 Y CN201196654 Y CN 201196654Y
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- CN
- China
- Prior art keywords
- negative pressure
- disc
- test bench
- wafer
- pressure sucker
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to wafer testing equipment, in particular to a wafer adhesive disc device of a test bench for realizing the fixing of the wafer in testing in a negative pressure adsorption mode. According to the technical proposal of the utility model, a heater is arranged between a negative pressure adhesive disc and a heat insulation disc; a plurality of negative pressure air grooves are arranged on the upper surface of the negative pressure adhesive disc; the inside of the negative pressure adhesive disc is provided with negative pressure air holes communicated with the negative pressure air grooves; a negative pressure windpipe joint is arranged on the negative pressure adhesive disc and is communicated with the negative pressure air holes; and a discharge hole running through the negative pressure adhesive disc, the heater and the heat insulation disc is arranged on the negative pressure adhesive disc. In use, the wafer is convenient to fix and detach, and the wafer adhesive device can greatly shorten the testing time, improve testing efficiency and effectively reduce testing cost.
Description
Technical field
The utility model relates to a kind of testing apparatus of wafer, and specifically a kind of mode by negative-pressure adsorption realizes fixing test bench wafer suction disc device to wafer when testing.
Background technology
At present, in the wafer sort field, test machine and the method for testing that generally adopts is manual test or semi-automatic test at present.Manual test is artificial each wafer of placing, with manual test behind each tube core of optics microscope alignment, and inefficiency and make measuring accuracy lower; Semi-automatic test is manually wafer to be placed on the test board, again by optical microscope scanning, the angle of manual adjustment wafer and the position of first tube core.Each tube core on the test wafer successively again after adjusting.Manually wafer is put back in the wafer film magazine after testing every wafer, taken out next wafer again and repeat above-mentioned test process.So manually-operated has increased the time of wafer sort greatly, certainly will also increase testing cost.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, provide the fixing of a kind of wafer and dismounting all easily, can shorten the test duration greatly, improve testing efficiency and can reduce the test bench wafer suction disc device of testing cost.
The technical scheme that provides according to the utility model, between negative pressure sucker and thermal insulating disc, be provided with well heater, be provided with some negative pressure air drains at the negative pressure sucker upper surface, in negative pressure sucker, be provided with the negative pressure pore that is communicated with the negative pressure air drain, on negative pressure sucker, be provided with the negative pressure gas-tpe fitting, described negative pressure gas-tpe fitting is communicated with the negative pressure pore, is provided with the dumping pit that runs through negative pressure sucker, well heater and thermal insulating disc on negative pressure sucker.
The concentric circles cell body that described negative pressure air drain is offered for the negative pressure sucker upper surface.Dumping pit is more than three or three, and they are arranged between the adjacent two negative pressure air drains equably.Between negative pressure sucker and well heater, be provided with hot buffer disc.Described hot buffer disc is made by thermosetting plastics DMC.Between well heater and thermal insulating disc, be provided with cover plate.Lower surface at negative pressure sucker is provided with the lower convex ring that stretches out to thermal insulating disc, correspondingly the thermal insulating disc upper surface be provided with to negative pressure sucker stretch out on bulge loop, the lower surface of lower convex ring contacts with last bulge loop upper surface and well heater, hot buffer disc and cover plate is contained in it.Be provided with temperature sensor at the negative pressure sucker sidewall.
The utility model is fixing in use can to shorten the test duration greatly with to unload wafer all very convenient, improves testing efficiency, and effectively can reduce testing cost.
Description of drawings
Fig. 1 is an one-piece construction synoptic diagram of the present utility model.
Fig. 2 is the explosive view of each parts of the present utility model.
Embodiment
The utility model is described in further detail below in conjunction with concrete drawings and Examples.
As shown in the figure: the well heater 3 that between negative pressure sucker 1 and thermal insulating disc 2, is provided with, be provided with some negative pressure air drains 4 at negative pressure sucker 1 upper surface, in negative pressure sucker 1, be provided with the negative pressure pore 5 that is communicated with negative pressure air drain 4, on negative pressure sucker 1, be provided with negative pressure gas-tpe fitting 6, described negative pressure gas-tpe fitting 6 is communicated with negative pressure pore 5, is provided with the dumping pit 7 that runs through negative pressure sucker 1, well heater 3 and thermal insulating disc 2 on negative pressure sucker 1.
The concentric circles cell body that described negative pressure air drain 4 is offered for negative pressure sucker 1 upper surface.Dumping pit 7 is more than three or three, and they are arranged between the adjacent two negative pressure air drains 4 equably.Between negative pressure sucker 1 and well heater 3, be provided with hot buffer disc 8.Described hot buffer disc 8 is made by thermosetting plastics DMC.Between well heater 3 and thermal insulating disc 2, be provided with cover plate 9.Lower surface at negative pressure sucker 1 is provided with the lower convex ring 10 that stretches out to thermal insulating disc 2, correspondingly thermal insulating disc 2 upper surfaces be provided with to negative pressure sucker 1 stretch out on bulge loop 11, the lower surface of lower convex ring 10 contacts with last bulge loop 11 upper surfaces and well heater 3, hot buffer disc 8 and cover plate 9 is contained in it.Be provided with temperature sensor 12 at negative pressure sucker 1 sidewall.
For preferably laminar wafer being fixed, consider fixing firmly and factor such as even, the present invention takes the mode of vacuum suction.As shown in Figure 2, be about to go out for example ten concentric circular negative pressure air drains 4 in order to vacuum cup 1 surface working of absorption wafer, each negative pressure air drain 4 all has a negative pressure pore 5, also can be divided into three groups to these ten negative pressure air drains 4 in addition, every group has independent gas circuit air feed, connect negative pressure pore 5 by negative pressure gas-tpe fitting 6 and connect, so just formed vacuum suction system by three gas circuit controls with outside tracheae.Firm and the uniform and stable of this system's absorption in test process, can be carried out the gentle pressure-controlled of switch respectively to these three gas circuits according to the difference of wafer specification.Location for ease of test is shaped on identification marking at the center of vacuum cup 1.Based on the needs of wafer, on vacuum cup 1, be processed with dumping pit 7 last and the thimble lifting of when unloading.
Temperature requirement when satisfying wafer sort, the utility model is taked electrically heated mode, this heating action is finished by well heater 3, temperature detect switch (TDS) 14 is installed on the extension line of well heater, and the 12 pairs of temperature of temperature sensor of packing in vacuum cup 1 are monitored, be able to switch control to be implemented in when too high or too low for temperature, make wafer sort in the temperature environment of expection, to finish.
Well heater cover plate 9 can be fixed on well heater 3 glands on the vacuum cup 1, has ground wire 15 to draw on the well heater cover plate 9, the security when guaranteeing to test.Consider the requirement of wafer sort simultaneously to the stability of temperature, hot buffer disc 8 and thermal insulating disc 2 have been involved in the device of the present utility model, hot buffer disc 8 and thermal insulating disc 2 are to be made by a kind of thermosetting plastics DMC, it absorbs heat slow and the slow material properties of heat release has the function that preferably temperature is stored, and has also played heat-blocking action preferably simultaneously when installing with outside parts.
Claims (8)
1. test bench wafer suction disc device, comprise the well heater (3) that is arranged between negative pressure sucker (1) and the thermal insulating disc (2), it is characterized in that: the upper surface at negative pressure sucker (1) is provided with some negative pressure air drains (4), in negative pressure sucker (1), be provided with the negative pressure pore (5) that is communicated with negative pressure air drain (4), on negative pressure sucker (1), be provided with negative pressure gas-tpe fitting (6), described negative pressure gas-tpe fitting (6) is communicated with negative pressure pore (5), is provided with the dumping pit (7) that runs through negative pressure sucker (1), well heater (3) and thermal insulating disc (2) on negative pressure sucker (1).
2. test bench wafer suction disc device as claimed in claim 1 is characterized in that: the concentric circles cell body that described negative pressure air drain (4) is offered for negative pressure sucker (1) upper surface.
3. test bench wafer suction disc device as claimed in claim 1 is characterized in that: dumping pit (7) is more than three or three, and they are arranged between the adjacent two negative pressure air drains (4) equably.
4. test bench wafer suction disc device as claimed in claim 1 is characterized in that: be provided with hot buffer disc (8) between negative pressure sucker (1) and well heater (3).
5. test bench wafer suction disc device as claimed in claim 4 is characterized in that: described hot buffer disc (8) is made by thermosetting plastics DMC.
6. test bench wafer suction disc device as claimed in claim 1 is characterized in that: be provided with cover plate (9) between well heater (3) and thermal insulating disc (2).
7. test bench wafer suction disc device as claimed in claim 1, it is characterized in that: the lower surface at negative pressure sucker (1) is provided with the lower convex ring (10) that stretches out to thermal insulating disc (2), correspondingly the upper surface at thermal insulating disc (2) is provided with the last bulge loop (11) that stretches out to negative pressure sucker (1), and the lower surface of lower convex ring (10) contacts with the upper surface of last bulge loop (11) and well heater (3), hot buffer disc (8) are contained in it with cover plate (9).
8. test bench wafer suction disc device as claimed in claim 1 is characterized in that: the sidewall at negative pressure sucker (1) is provided with temperature sensor (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200820035163 CN201196654Y (en) | 2008-04-14 | 2008-04-14 | Wafer suction disc apparatus for test bench |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200820035163 CN201196654Y (en) | 2008-04-14 | 2008-04-14 | Wafer suction disc apparatus for test bench |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201196654Y true CN201196654Y (en) | 2009-02-18 |
Family
ID=40416289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200820035163 Expired - Fee Related CN201196654Y (en) | 2008-04-14 | 2008-04-14 | Wafer suction disc apparatus for test bench |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201196654Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104942697A (en) * | 2014-03-24 | 2015-09-30 | 盛美半导体设备（上海）有限公司 | Wafer grinding head and wafer absorbing method |
| WO2019105422A1 (en) * | 2017-11-30 | 2019-06-06 | 上海微电子装备（集团）股份有限公司 | Heating device and heating method |
-
2008
- 2008-04-14 CN CN 200820035163 patent/CN201196654Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104942697A (en) * | 2014-03-24 | 2015-09-30 | 盛美半导体设备（上海）有限公司 | Wafer grinding head and wafer absorbing method |
| CN104942697B (en) * | 2014-03-24 | 2019-02-19 | 盛美半导体设备（上海）有限公司 | Grinding wafer head and wafer adsorption method |
| WO2019105422A1 (en) * | 2017-11-30 | 2019-06-06 | 上海微电子装备（集团）股份有限公司 | Heating device and heating method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090218 Termination date: 20130414 |