CN204347073U - With the chip test base of heating temperatures test - Google Patents
With the chip test base of heating temperatures test Download PDFInfo
- Publication number
- CN204347073U CN204347073U CN201420805502.7U CN201420805502U CN204347073U CN 204347073 U CN204347073 U CN 204347073U CN 201420805502 U CN201420805502 U CN 201420805502U CN 204347073 U CN204347073 U CN 204347073U
- Authority
- CN
- China
- Prior art keywords
- test
- chip
- lid
- transverse slat
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model provides a kind of chip test base with heating temperatures test, comprise: lid and plate body, described lid is provided with a heating module, described plate body is provided with chip testing parts, when described lid is covered on described plate body, described heating module is just to described chip testing parts.Described heating module is arranged in described lid, chip under test is positioned on the described test component of described plate body, described lid is covered on described plate body, and the distance between described heating module and described chip under test is short, having a narrow range of temperature of described heating module and chip under test surface.The temperature constant of described heating module, without the need to the stand-by period, improves production capacity, and described lid closes after on described plate body and just starts heating simultaneously, and operating personnel can not contact high temperature in operation, reduce the risk of operating personnel.
Description
Technical field
The utility model relates to integrated circuit manufacturing equipment technical field, especially a kind of chip test base with heating temperatures test.
Background technology
In chip production flow process, an important step to the detection of chip, when carrying out the chip testing of batch, enterprise generally uses the chip testing machine of robotization to carry out large batch of test to chip, one core assembly sheet is generally installed on test bench when chip testing by existing chip testing machine, pressed down by light inductive lamp box or miscellaneous part, make the contact on chip stitch and test bench, whether test chip is working properly, thus judge the quality of chip, but existing test machine carries out work all at normal temperatures, and various types of chip to differ or due to heating when self works due to purposes, likely can carry out work at relatively high temperatures, thus need can at high temperature normally work to chip to test.
The automatic moving machine high-temperature testing method of general use and hot air type heating means in prior art, wherein, under automatic moving machine high-temperature testing method, chip under test cannot reach predetermined temperature, such as the temperature of moving machine setting is automatically 120 DEG C, but the temperature of chip surface is lower than 120 DEG C, may can only reaches 100 DEG C, effective high temperature test cannot be carried out to chip under test.Under hot air type heating means, need an additional board, carry out high temperature test by described board to chip under test, in this method, first, the temperature needs of the hot blast of blowout wait for a period of time could be constant, affects production capacity; Secondly, because air outlet has certain distance from chip under test surface, the temperature of temperature lower than hot blast on chip under test surface is caused; Again, the temperature of hot blast at about 125 DEG C, operating personnel operating process in be easy to be scalded by the hot blast of high temperature.
Utility model content
The purpose of this utility model is to provide a kind of chip test base with heating temperatures test, cannot reach to solve chip under test in prior art the problem that the low and operating personnel of predetermined temperature, production capacity have a big risk.
In order to achieve the above object, the utility model provides a kind of chip test base with heating temperatures test, comprise: lid and plate body, described lid is provided with a heating module, described plate body is provided with chip testing parts, when described lid is covered on described plate body, described heating module is just to described chip testing parts.
Preferably, in the chip test base of above-mentioned band heating temperatures test, described heating module comprises a framework, a heat-conducting plate and a heating plate;
Described framework is detachable is connected to described lid;
Described heat-conducting plate is positioned at described framework;
Described heating plate is positioned at described heat-conducting plate towards in the one side of described lid.
Preferably, in the chip test base of above-mentioned band heating temperatures test, described heating plate arcuately.
Preferably, in the chip test base of above-mentioned band heating temperatures test, the size of described heat-conducting plate is mated with the size of described heating plate.
Preferably, in the chip test base of above-mentioned band heating temperatures test, described framework is vertically formed by connecting in turn by the first transverse slat, the second transverse slat, the 3rd transverse slat and the 4th transverse slat.
Preferably, in the chip test base of above-mentioned band heating temperatures test, the inner side of described first transverse slat is provided with one first back up pad, the inner side of described 3rd transverse slat is provided with one second back up pad, described first back up pad and described second back up pad support described heat-conducting plate, and described heat-conducting plate is arranged at described first back up pad and described second back up pad towards in the one side of described lid.
Preferably, in the chip test base of above-mentioned band heating temperatures test, described second transverse slat is provided with one first hole slot towards described lid side, and described 4th transverse slat is provided with one second hole slot towards described lid side.
Preferably, in the chip test base of above-mentioned band heating temperatures test, position corresponding with described first hole slot and described second hole slot on described lid is respectively provided with a magnet.
Preferably, in the chip test base of above-mentioned band heating temperatures test, one first through hole is provided with bottom described first hole slot, described first through hole runs through the one side that described second transverse slat deviates from described lid, one first conductive pole is provided with in described first hole slot, described first conductive pole is through described first through hole, and the diameter at the two ends of described first conductive pole is greater than the diameter of described first through hole.
Preferably, in the chip test base of above-mentioned band heating temperatures test, one second through hole is provided with bottom described second hole slot, described second through hole runs through the one side that described 4th transverse slat deviates from described lid, one second conductive pole is provided with in described second hole slot, described second conductive pole is through described second through hole, and the diameter at the two ends of described second conductive pole is greater than the diameter of described second through hole.
Preferably, in the chip test base of above-mentioned band heating temperatures test, described first conductive pole and be provided with a conductive slider between described second conductive pole and described magnet, described conductive slider is connected with described heating plate.
In the chip test base of the band heating temperatures test provided at the utility model, described heating module is arranged in described lid, chip under test is positioned on the described test component of described plate body, described lid is covered on described plate body, distance between described heating module and described chip under test is short, having a narrow range of temperature of described heating module and chip under test surface.The temperature constant of described heating module, without the need to the stand-by period, improves production capacity, and described lid closes after on described plate body and just starts heating simultaneously, and operating personnel can not contact high temperature in operation, reduce the risk of operating personnel.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model embodiment;
Fig. 2 is the structural representation of lid in the utility model embodiment;
Fig. 3 is the cut-open view along A-A ' in Fig. 2;
Fig. 4 is the cut-open view along B-B ' in Fig. 2;
In figure: 101-lid; 102-plate body; 103-heated mould; 104-heat-conducting plate; 105-heating plate; 106-first transverse slat; 107-second transverse slat; 108-the 3rd transverse slat; 109-the 4th transverse slat; 110-first back up pad; 111-second back up pad; 112a, 112b-magnet; 113-first hole slot; 114-second hole slot; 115-first conductive pole; 116-second conductive pole; 117a, 117b-conductive slider; 118-first through hole; 119-second through hole; 120-framework.
Embodiment
Below in conjunction with schematic diagram, embodiment of the present utility model is described in detail.According to following description and in conjunction with claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts the form that simplifies very much and all uses non-ratio accurately, only in order to object that is convenient, aid illustration the utility model embodiment lucidly.
The utility model provides a kind of chip test base with heating temperatures test, as shown in Figure 1, comprise: lid 101 and plate body 102, described lid 101 is provided with a heating module 103, described plate body 102 is provided with chip testing parts, when described lid 101 is covered on described plate body 102, described heating module 103 is just to described chip testing parts.
Concrete, as shown in Figure 2, described heating module 103 comprises framework 120, heat-conducting plate 104 and a heating plate 105, described framework 120 is vertically formed by connecting in turn by the first transverse slat 106, second transverse slat 107, the 3rd transverse slat 108 and the 4th transverse slat 109, and described framework 120 is detachable is connected to described lid 101.As shown in Figure 4, the inner side of described first transverse slat 106 is provided with one first back up pad 110, the inner side of described 3rd transverse slat 108 is provided with one second back up pad 111, first back up pad 110 and the second back up pad 111 are for supporting heat-conducting plate 104, described heat-conducting plate 104 is arranged at described first back up pad 110 with described second back up pad face 111 in the one side of described lid 101, and described heating plate 105 is positioned at described heat-conducting plate 104 towards in the one side of described lid 101.
Further, the size of described heat-conducting plate 104 is mated with the size of described heating plate 105.In actual applications, the size of described heat-conducting plate 104 and described heating plate 105 can be adjusted according to the size of chip under test.When chip under test size is larger, described heat-conducting plate 104 and the described heating plate 105 of large-size just can be used; When chip under test size is less, described heat-conducting plate 104 and the described heating plate 105 of reduced size just can be used.In the process of size adjusting described heat-conducting plate 104 and described heating plate 105 according to chip under test, described heat-conducting plate 104 is positioned at directly over described chip under test and described chip under test all can be covered, to guarantee that described chip under test surface can by hyperthermia radiation, also to ensure that described heating plate 105 can cover the one side of described heat-conducting plate 104 towards described lid completely simultaneously, to guarantee the temperature equalization of described whole heat-conducting plate 104, ensure that the surface temperature of whole chip under test is balanced further.
Further, described framework 120 is bakelite, can thermal insulation very heat-resisting again, described heating module can be made to have longer serviceable life.
In the present embodiment, described heating plate 105 arcuately.Increase described heating plate 105 and the contact area of described heat-conducting plate 104, the temperature of described heat-conducting plate 104 can be raised fast, reach rapidly the high temperature of needs.
Further, as shown in Figure 3, described second transverse slat 107 is provided with one first hole slot 113 towards described lid 101 side, and described 4th transverse slat 109 is provided with one second hole slot 114 towards described lid 101 side.Position corresponding with described first hole slot 113 and described second hole slot 114 on described lid 101 is respectively provided with a magnet (112a, 112b).One first through hole 118 is provided with bottom described first hole slot 113, described first through hole 118 runs through the one side that described second transverse slat 107 deviates from described lid 101, one first conductive pole 115 is provided with in described first hole slot 113, described first conductive pole 115 is through described first through hole 118, and the diameter at the two ends of described first conductive pole 115 is greater than the diameter of described first through hole 118.Prevent described first conductive pole 115 landing from going out described first through hole 118.
One second through hole 119 is provided with bottom described second hole slot 114, described second through hole 119 runs through the one side that described 4th transverse slat 109 deviates from described lid 101, one second conductive pole 116 is provided with in described second hole slot 119, described second conductive pole 116 is through described second through hole 119, and the diameter at the two ends of described second conductive pole 116 is greater than the diameter of described second through hole 119.Prevent described second conductive pole 116 landing from going out described second through hole 119.In an embodiment, described first conductive pole 115 and described second conductive pole 116 are copper post, not only can conduct electricity but also can by attraction.In other embodiments of the present utility model, described first conductive pole 115 and described second conductive pole 116 can also be other materials, as long as not only can conduct electricity but also can by attraction, and such as iron etc.
Described first conductive pole 115 and be provided with a conductive slider (117a, 117b) between described second conductive pole 116 and described magnet (112a, 112b), described conductive slider (117a, 117b) can not by described attraction, and described conductive slider (117a, 117b) is connected with described heating plate 105.When described lid 101 is covered on described plate body 102, described magnet (112a, described first conductive pole 115 and described second conductive pole 116 112b) is attracted to move to described lid 101 direction, described first conductive pole 115 and the mobile of described second conductive pole 116 promote described conductive slider (117a, 117b) move to described lid 101 direction, described conductive slider (117a, 117b) contact with heating plate 105, thus make described heating plate 105 electrified regulation, described heating plate 105 makes described heat-conducting plate 104 homogeneous heating rapidly after heating, thus high temperature test is carried out to described chip under test.When described lid 101 leaves described plate body 102, described magnet 112a, and the attractive force between described first conductive pole 115 be less than described first conductive pole 115 and described conductive slider 117a gravity and, attractive force between described magnet 112b and described second conductive pole 116 be less than described second conductive pole 116 and described conductive slider 117b gravity and, described magnet (112a, 112b) depart from described first conductive pole 115 and described second conductive pole 116, described conductive slider (117a, 117b) be separated with described heating plate 105 under gravity, the power-off of described heating plate 105, to no longer heat.
The present embodiment is not limited at the utility model, in other embodiments of the present utility model, can also described first back up pad 110 and described second back up pad 111 be arranged on described second transverse slat 107 and described 4th transverse slat 109 respectively, described first hole slot 113 and described second hole slot 114 be set on described first transverse slat 106 and described 3rd transverse slat 108 simultaneously.Also multiple first hole slot 113 and described second hole slot 114 can be set respectively on described first transverse slat 106 and described three transverse slats 108.Or multiple first hole slot 113 and described second hole slot 114 are set respectively on described second transverse slat 107 and described 4th transverse slat 109.Do not repeat them here.
To sum up, in the chip test base of the band heating temperatures test provided in the utility model embodiment, described heating module is arranged in described lid, chip under test is positioned on the described test component of described plate body, described lid is covered on described plate body, distance between described heating module and described chip under test is short, having a narrow range of temperature of described heating module and chip under test surface.The temperature constant of described heating module, without the need to the stand-by period, improves production capacity, and described lid closes after on described plate body and just starts heating simultaneously, and operating personnel can not contact high temperature in operation, reduce the risk of operating personnel.
Above are only preferred embodiment of the present utility model, any restriction is not played to the utility model.Any person of ordinary skill in the field; not departing from the scope of the technical solution of the utility model; the technical scheme disclose the utility model and technology contents make the variations such as any type of equivalent replacement or amendment; all belong to the content not departing from the technical solution of the utility model, still belong within protection domain of the present utility model.
Claims (11)
1. the chip test base with heating temperatures test, it is characterized in that, comprise: lid and plate body, described lid is provided with a heating module, described plate body is provided with chip testing parts, when described lid is covered on described plate body, described heating module is just to described chip testing parts.
2. the chip test base of band heating temperatures as claimed in claim 1 test, it is characterized in that, described heating module comprises a framework, a heat-conducting plate and a heating plate;
Described framework is detachable is connected to described lid;
Described heat-conducting plate is positioned at described framework;
Described heating plate is positioned at described heat-conducting plate towards in the one side of described lid.
3. the chip test base of band heating temperatures as claimed in claim 2 test, it is characterized in that, described heating plate arcuately.
4. the chip test base of band heating temperatures as claimed in claim 2 test, it is characterized in that, the size of described heat-conducting plate is mated with the size of described heating plate.
5. the chip test base of band heating temperatures as claimed in claim 2 test, it is characterized in that, described framework is vertically formed by connecting in turn by the first transverse slat, the second transverse slat, the 3rd transverse slat and the 4th transverse slat.
6. the chip test base of band heating temperatures as claimed in claim 5 test, it is characterized in that, the inner side of described first transverse slat is provided with one first back up pad, the inner side of described 3rd transverse slat is provided with one second back up pad, described first back up pad and described second back up pad support described heat-conducting plate, and described heat-conducting plate is arranged at described first back up pad and described second back up pad towards in the one side of described lid.
7. the chip test base of band heating temperatures as claimed in claim 5 test, it is characterized in that, described second transverse slat is provided with one first hole slot towards described lid side, and described 4th transverse slat is provided with one second hole slot towards described lid side.
8. the chip test base of band heating temperatures as claimed in claim 7 test, is characterized in that, position corresponding with described first hole slot and described second hole slot on described lid is respectively provided with a magnet.
9. the chip test base of band heating temperatures as claimed in claim 8 test, it is characterized in that, one first through hole is provided with bottom described first hole slot, described first through hole runs through the one side that described second transverse slat deviates from described lid, one first conductive pole is provided with in described first hole slot, described first conductive pole is through described first through hole, and the diameter at the two ends of described first conductive pole is greater than the diameter of described first through hole.
10. the chip test base of band heating temperatures as claimed in claim 9 test, it is characterized in that, one second through hole is provided with bottom described second hole slot, described second through hole runs through the one side that described 4th transverse slat deviates from described lid, one second conductive pole is provided with in described second hole slot, described second conductive pole is through described second through hole, and the diameter at the two ends of described second conductive pole is greater than the diameter of described second through hole.
The chip test bases of 11. as claimed in claim 10 band heating temperatures tests, is characterized in that, described first conductive pole and be provided with a conductive slider between described second conductive pole and described magnet, and described conductive slider is connected with described heating plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420805502.7U CN204347073U (en) | 2014-12-17 | 2014-12-17 | With the chip test base of heating temperatures test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420805502.7U CN204347073U (en) | 2014-12-17 | 2014-12-17 | With the chip test base of heating temperatures test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204347073U true CN204347073U (en) | 2015-05-20 |
Family
ID=53230334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420805502.7U Expired - Fee Related CN204347073U (en) | 2014-12-17 | 2014-12-17 | With the chip test base of heating temperatures test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204347073U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106483343A (en) * | 2016-11-03 | 2017-03-08 | 苏州创瑞机电科技有限公司 | Manual staight needle test jack with heating function |
| CN107677394A (en) * | 2017-09-13 | 2018-02-09 | 莱茵技术-商检（宁波）有限公司 | A kind of temperature-sensing element (device) durability test equipment |
| CN109459683A (en) * | 2018-12-26 | 2019-03-12 | 上海捷策创电子科技有限公司 | A kind of apparatus for testing chip |
| CN109883748A (en) * | 2019-04-02 | 2019-06-14 | 无锡厦泰生物科技有限公司 | A kind of separate type low-heat leads TEC detection device |
| CN113466664A (en) * | 2021-07-02 | 2021-10-01 | 深圳市宏旺微电子有限公司 | DDR chip testing method and device, terminal device and storage medium |
-
2014
- 2014-12-17 CN CN201420805502.7U patent/CN204347073U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106483343A (en) * | 2016-11-03 | 2017-03-08 | 苏州创瑞机电科技有限公司 | Manual staight needle test jack with heating function |
| CN107677394A (en) * | 2017-09-13 | 2018-02-09 | 莱茵技术-商检（宁波）有限公司 | A kind of temperature-sensing element (device) durability test equipment |
| CN109459683A (en) * | 2018-12-26 | 2019-03-12 | 上海捷策创电子科技有限公司 | A kind of apparatus for testing chip |
| CN109883748A (en) * | 2019-04-02 | 2019-06-14 | 无锡厦泰生物科技有限公司 | A kind of separate type low-heat leads TEC detection device |
| CN113466664A (en) * | 2021-07-02 | 2021-10-01 | 深圳市宏旺微电子有限公司 | DDR chip testing method and device, terminal device and storage medium |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204347073U (en) | With the chip test base of heating temperatures test | |
| CN102581418B (en) | Solar battery series welding device and solar battery series welding head | |
| CN202430352U (en) | High-temperature spinning manifold | |
| CN209728081U (en) | Chip heating device | |
| US7675306B2 (en) | Prober apparatus and operating method therefor | |
| CN205844493U (en) | A kind of lithium battery renovation short-circuit detecting device | |
| CN207396436U (en) | A kind of qualification rate detection device for the silicon chip that is carbonized | |
| CN208844220U (en) | A kind of modularization electroplating machine | |
| CN201464938U (en) | Automatic heating constant temperature control system for base station | |
| CN203900689U (en) | Adjustable solar cell welding jig | |
| CN104827156B (en) | Electromagnetism heat-conducting heat-dissipating frame of electric iron | |
| CN209231463U (en) | A kind of integrated circuit testing plate with self-checking function | |
| CN206180707U (en) | Wireless heating device | |
| CN205301513U (en) | PTC electric performance detection device of core that generates heat | |
| CN203104979U (en) | Inductance coil through hole reflow soldering fixture | |
| CN103521880B (en) | Electromagnetism draws pendulum-type electric iron to fall apart warm frame | |
| CN209496293U (en) | A kind of dust collector ash hopper electric heating control device | |
| CN203896517U (en) | Novel heating device | |
| CN202214384U (en) | High frequency heat-treating machine | |
| CN204652703U (en) | A kind of bearing heating equipment | |
| CN205039028U (en) | From electronic transformer that dispels heat and to report to police | |
| CN205270045U (en) | Heating device is glued to optical device point | |
| CN105070463A (en) | Self-radiating alarming electronic transformer | |
| CN205869833U (en) | Polymer lithium ion battery resistance weld universal tool structure | |
| CN209119146U (en) | The temperature control equipment of cell piece lamination under energized state |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150520 Termination date: 20191217 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |