CN203104979U - Inductance coil through hole reflow soldering fixture - Google Patents

Inductance coil through hole reflow soldering fixture Download PDF

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Publication number
CN203104979U
CN203104979U CN 201320067033 CN201320067033U CN203104979U CN 203104979 U CN203104979 U CN 203104979U CN 201320067033 CN201320067033 CN 201320067033 CN 201320067033 U CN201320067033 U CN 201320067033U CN 203104979 U CN203104979 U CN 203104979U
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CN
China
Prior art keywords
hole
reflow soldering
loam cake
inductance
inductance coil
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Expired - Fee Related
Application number
CN 201320067033
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Chinese (zh)
Inventor
魏子陵
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NANJING TOPTRY ELECTRONIC INFORMATION MANUFACTURING Co Ltd
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NANJING TOPTRY ELECTRONIC INFORMATION MANUFACTURING Co Ltd
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Priority to CN 201320067033 priority Critical patent/CN203104979U/en
Application granted granted Critical
Publication of CN203104979U publication Critical patent/CN203104979U/en
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Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses an inductance coil through hole reflow soldering fixture, belonging to an auxiliary soldering device for a printed circuit board (PCB). The inductance coil through hole reflow soldering fixture at least comprises a soldering tray, a demoulding support disc and an inductor locating upper cover, wherein the inductor locating upper cover is fixed above the soldering tray; the demoulding support disc is arranged under the soldering tray; the demoulding support disc is provided with a demoulding ejector rod, and the soldering tray is provided with an ejector rod hole corresponding to the demoulding ejector rod; the soldering tray is also provided with a plurality of support pillars and avoidance through holes; and a locating rod used for introducing the second surface of a soldering circuit board is arranged on the soldering tray at the edges of the support pillars and the avoidance through holes. After being patched, the circuit board is supported by the support pillars when being subjected to reflow soldering, so that soldering points at the back of the circuit board are arranged in the avoidance through holes so as to be isolated from one another, and the soldering points are prevented from being damaged by an inductance coil; and the inductance coil through hole reflow soldering fixture is simple in structure, is especially suitable for being taken as the auxiliary device used for the reflow soldering of the PCB, and is suitable for industrial production and easy to popularize.

Description

A kind of inductance coil through hole reflow soldering fixture
Technical field
The utility model relates to a kind of printed circuit board auxiliary welding equipment, and in particular, the utility model relates generally to a kind of inductance coil through hole reflow soldering fixture.
Background technology
PCB(PrintedCircuitBoard) printed circuit board is a kind of important electron parts, is the supporter of electronic devices and components, also is the supplier that electronic devices and components are electrically connected.And the many employings of the welding of the coil on PCB at present manual welding, efficient and low, coil consistency radially is also lower when welding simultaneously, makes troubles for the debugging of product overall performance.And in recent years, the circuit board reflow solder technique is popularized gradually, it utilizes the inductance coil heater circuit of welding equipment inside, air or nitrogen are heated to sufficiently high temperature after-blow to the circuit board that posts element, allow the scolder of elements on either side melt back and mainboard bonding, welding efficiency is higher, and because its temperature in welding process is more easy to control, therefore consistency of product is also higher, but during at the two-sided welding of circuit board, owing to there is not special-purpose aid, solder joint after the back of circuit board reflow soldering is destroyed easily, and since in batches in the welding process distance between inductance coil and the circuit board have fluctuation, therefore still can debug with overall performance and impact the consistency of final products.And then, be necessary to do further research and improvement at the aid of circuit board reflow soldering based on foregoing problems.
Summary of the invention
One of the purpose of this utility model is at above-mentioned deficiency, a kind of inductance coil through hole reflow soldering fixture is provided, low with manual coil welding efficiency in the expectation solution prior art, adopt reflow soldering easily the back side pad of circuit board to be caused damage, and the technical problems such as distance between wayward inductance coil and the circuit board.
For solving above-mentioned technical problem, the utility model by the following technical solutions:
A kind of inductance coil through hole reflow soldering fixture provided by the utility model, at least comprise welding pallet, demoulding supporting disk and inductance location loam cake in the described welding fixture, described inductance location loam cake places the top of welding pallet, demoulding supporting disk places the below of welding pallet, described demoulding supporting disk is provided with demoulding push rod, and the welding pallet is provided with and the corresponding jogger hole of demoulding push rod; Also be provided with a plurality of support columns on the described welding pallet and dodge through hole, and support column and dodge on the welding pallet at through hole edge and also be provided with the backstay that is used for second importing of soldered circuit board; Cover on the described inductance location and be provided with a plurality of strip through holes, and also be provided with and weld the corresponding loam cake contraposition of pallet bar on its edge.
As preferably, further technical scheme is: the side of described demoulding supporting disk also is provided with symmetrical rectangular indentation.
Further technical scheme is: a plurality of on the described welding pallet dodge the yi word pattern that through hole and support column all be multiple row and arrange, and are support column that yi word pattern arranges and place and dodge between the through hole.
Further technical scheme is: described welding pallet upper ejector pin hole also is provided with the loam cake registration holes that matches with loam cake contraposition bar on the outward extending edge.
Further technical scheme is: also be provided with symmetrical guide rail transmission clip slot on the both sides at least of described welding pallet.
Further technical scheme is: cover on the described inductance location and also be provided with the bolt that is used to adjust distance between inductance location loam cake and the welding pallet.
Further technical scheme is: described strip through hole parallels with a wherein side of inductance location loam cake at least.
Compared with prior art, one of the beneficial effects of the utility model are: be provided with the welding pallet of dodging through hole and support column by the top, make when circuit board carries out reflow soldering behind paster, supported by support column, make the pad at its back side place to dodge through hole and isolate, avoid being destroyed by inductance coil, and the inductance that places welding pallet top is located the strip through hole of loam cake, can make inductance coil radially with circuit board between distance remain consistently, welding is finished the back and the circuit board that welds in the pallet can be taken off by the demoulding push rod on the demoulding supporting disk; A kind of inductance coil through hole reflow soldering fixture provided by the utility model is simple in structure simultaneously, especially is suitable for the servicing unit as the printed circuit board reflow soldering, and is suitable for suitability for industrialized production, is easy to promote.
Description of drawings
Fig. 1 is the demoulding supporting disk structural representation that is used for illustrating an embodiment of the utility model;
Fig. 2 is the inductance location superstructure schematic diagram that is used for illustrating an embodiment of the utility model;
Fig. 3 is the welding support holder structure schematic diagram that is used for illustrating an embodiment of the utility model;
Fig. 4 is that the A of Fig. 3 is to schematic diagram;
Among the figure, 1 for the welding pallet, 11 for jogger hole, 12 for support column, 13 for dodge through hole, 14 for backstay, 15 for the loam cake registration holes, 16 for guide rail transmission clip slot, 2 for demoulding supporting disk, 21 for demoulding push rod, 22 for rectangular indentation, 3 for inductance location loam cake, 31 be that strip through hole, 32 is that loam cake contraposition bar, 33 is a bolt.
Embodiment
Below in conjunction with accompanying drawing the utility model is further elaborated.
With reference to figure 1, Fig. 2 and shown in Figure 3, an embodiment of the present utility model is a kind of inductance coil through hole reflow soldering fixture, it is as a kind of servicing unit of reflow soldering in the prior art, promptly weld and to comprise welding pallet 1, demoulding supporting disk 2 and inductance location loam cake 3 in the fixture at least, described inductance location loam cake 3 places the top of welding pallet 1, demoulding supporting disk 2 places the below of welding pallet 1, described demoulding supporting disk 2 is provided with demoulding push rod 21, and welding pallet 1 is provided with and demoulding push rod 21 corresponding jogger holes 11; Also be provided with a plurality of support columns 12 on the described welding pallet 1 and dodge through hole 13, and also be provided with the backstay 14 that is used for second importing of soldered circuit board on support column 12 and the welding pallet 1 of dodging through hole 13 edges; Described inductance location loam cake 3 is provided with a plurality of strip through holes 31, and also is provided with and welds pallet 1 corresponding loam cake contraposition bar 32 on its edge.In the present embodiment, the effect of dodging through hole 13 and support column 12 on the aforementioned welding pallet 1 is when circuit board places on the welding pallet 1, supported by support column 12, the back side as circuit board has formed pad, to then this pad be placed so and dodge through hole 13, promptly the solder joint to back of circuit board forms isolation, avoids it to be used to coil inductance heating of welding once more, thereby causes former pad destroyed; On the loam cake 3 of aforementioned inductance location the effect of a plurality of strip through holes 31 be make coil inductance radially and the distance between the circuit board be consistent, and then make the circuit board product consistency after the welding be improved.
Present embodiment in actual use, PCB board production flow process according to routine, can earlier welding pallet 1 be placed on the demoulding supporting disk 2, again circuit board is placed on the welding pallet 1 and supports by support column 12, utilize chip mounter on circuit board, to carry out paster, after paster is finished, again inductance is located loam cake 3 and place the top of welding pallet 1, then coil inductance is radially put into the strip through hole 31 on the loam cake 3 of inductance location, and then formation location, and the paster components and parts on the heater circuit plate, make the scolder of components and parts both sides melt and the circuit board welding, make the circuit board after the welding break away from welding pallet 1 by the demoulding push rod 21 on the demoulding supporting disk 2 after the reflow soldering, i.e. product welding is finished.And the importing location of circuit board two sides welding can be realized by backstay 14, and the loam cake contraposition bar 32 on the loam cake 3 of inductance location can guarantee that it with position, welding pallet 1 overlapping back the plane does not take place and departs from simultaneously.
With reference to shown in Figure 3, in another embodiment of the present utility model, for making the stability of circuit board on welding pallet 1 better, and improve and dodge the universality of pad on 13 pairs of various circuit boards of through hole, therefore will weld a plurality of on the pallet 1 and dodge the yi word pattern that through holes 13 and support column 12 all be set to be multiple row and arrange, and the support column 12 that is the yi word pattern arrangement places and dodges between the through hole 13.
Again with reference to shown in Figure 3, mention in the utility model the above embodiments, welding pallet 1 is located between the loam cake 3 with inductance and is guaranteed that by loam cake contraposition bar 32 their overlapping combination backs are not offset on relative position, plane, as preferably, on welding 11 outward extending edges, pallet 1 upper ejector pin hole, set up the loam cake registration holes 15 that matches with loam cake contraposition bar 32.
With reference to shown in Figure 4, for making inductance coil through hole reflow soldering fixture to be used with the reflow soldering equipment of present main flow, again among another embodiment of the utility model, also can on the both sides at least of welding pallet 1, set up symmetrical guide rail transmission clip slot 16, it can be entered by the guide rail drive carry out circuit board paster and reflow soldering in the reflow soldering equipment.
With reference to shown in Figure 1,, preferably set up symmetrical rectangular indentation 22 in its side more again for increasing the hand-held convenience of demoulding supporting disk 2 in the foregoing description.
In addition, the inventor also finds when testing, when carrying out the reflow soldering of various boards paster, the required welding temperature of the different components and parts of its paster is also inequality, and the distance that the difference of this heat can be adjusted between coil inductance and the circuit board under the regular situation realizes, but coil inductance is located owing to set up strip through hole 31 at inductance location loam cake 3 in the utility model, therefore can't directly adjust, and for addressing this problem, with reference to shown in Figure 2, the inventor is used for the embodiment that the technical solution problem is more preferably at the utility model, on the loam cake 3 of inductance location, set up the bolt 33 that is used for it and welds distance between the pallet 1, by the distance between these bolt 33 adjustment inductance location loam cakes 3 and the welding pallet 1, promptly in strip through hole 31 coil inductance of location radially and on the welding pallet 1 distance between the circuit board also can change thereupon, promptly satisfy the various boards components and parts and carry out the required welding temperature of reflow soldering.
Simultaneously, preferred as another of the foregoing description, the strip through hole 31 on the loam cake 3 of inductance location can be set to the form that parallels with a wherein side of inductance location loam cake 3 at least shown in Figure 2.
Except that above-mentioned, " embodiment ", " another embodiment " that also need to prove in this manual to be spoken of, " embodiment " etc. refer to concrete feature, structure or the characteristics described in conjunction with this embodiment and are included among at least one embodiment that the application's generality describes.A plurality of local appearance statement of the same race is not necessarily to refer to same embodiment in specification.Furthermore, when describing a concrete feature, structure or characteristics in conjunction with arbitrary embodiment, what advocate is to realize that in conjunction with other embodiment this feature, structure or characteristics also drop in the scope of the present utility model.
Although with reference to a plurality of explanatory embodiment of the present utility model the utility model is described here, but, should be appreciated that, those skilled in the art can design a lot of other modification and execution modes, and these are revised and execution mode will drop within the disclosed principle scope and spirit of the application.More particularly, in the scope of, accompanying drawing open and claim, can carry out multiple modification and improvement to the building block and/or the layout of subject combination layout in the application.Except modification that building block and/or layout are carried out with improving, to those skilled in the art, other purposes also will be tangible.

Claims (7)

1. inductance coil through hole reflow soldering fixture, it is characterized in that: comprise welding pallet (1), demoulding supporting disk (2) and inductance location loam cake (3) in the described welding fixture at least, described inductance location loam cake (3) places the top of welding pallet (1), demoulding supporting disk (2) places the below of welding pallet (1), described demoulding supporting disk (2) is provided with demoulding push rod (21), and welding pallet (1) is provided with and the corresponding jogger hole of demoulding push rod (21) (11); Also be provided with a plurality of support columns (12) on the described welding pallet (1) and dodge through hole (13), and support column (12) also is provided with the backstay (14) that is used for second importing of soldered circuit board with dodging on the welding pallet (1) at through hole (13) edge; Described inductance location loam cake (3) is provided with a plurality of strip through holes (31), and also is provided with and welds pallet (1) corresponding loam cake contraposition bar (32) on its edge.
2. inductance coil through hole reflow soldering fixture according to claim 1, it is characterized in that: the side of described demoulding supporting disk (2) also is provided with symmetrical rectangular indentation (22).
3. inductance coil through hole reflow soldering fixture according to claim 1, it is characterized in that: a plurality of on the described welding pallet (1) dodge through holes (13) and arrange with the yi word pattern that support column (12) all is multiple row, and are support column (12) that yi word pattern arranges and place and dodge between the through hole (13).
4. according to claim 1 or 3 described inductance coil through hole reflow soldering fixtures, it is characterized in that: also be provided with the loam cake registration holes (15) that matches with loam cake contraposition bar (32) on the outward extending edge, described welding pallet (1) upper ejector pin hole (11).
5. inductance coil through hole reflow soldering fixture according to claim 4 is characterized in that: also be provided with symmetrical guide rail transmission clip slot (16) on the both sides at least of described welding pallet (1).
6. inductance coil through hole reflow soldering fixture according to claim 1 is characterized in that: also be provided with the bolt (33) that is used to adjust distance between inductance location loam cake (3) and the welding pallet (1) on the described inductance location loam cake (3).
7. according to claim 1 or 6 described inductance coil through hole reflow soldering fixtures, it is characterized in that: described strip through hole (31) parallels with a wherein side of inductance location loam cake (3) at least.
CN 201320067033 2013-02-06 2013-02-06 Inductance coil through hole reflow soldering fixture Expired - Fee Related CN203104979U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201320067033 CN203104979U (en) 2013-02-06 2013-02-06 Inductance coil through hole reflow soldering fixture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320067033 CN203104979U (en) 2013-02-06 2013-02-06 Inductance coil through hole reflow soldering fixture

Publications (1)

Publication Number Publication Date
CN203104979U true CN203104979U (en) 2013-07-31

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201320067033 Expired - Fee Related CN203104979U (en) 2013-02-06 2013-02-06 Inductance coil through hole reflow soldering fixture

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106312235A (en) * 2016-11-29 2017-01-11 北京北广科技股份有限公司 Cage-type PCB (printed circuit board) inductor welding fixture
CN106392229A (en) * 2016-11-29 2017-02-15 北京北广科技股份有限公司 Welding method for cage type PCB inductors

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106312235A (en) * 2016-11-29 2017-01-11 北京北广科技股份有限公司 Cage-type PCB (printed circuit board) inductor welding fixture
CN106392229A (en) * 2016-11-29 2017-02-15 北京北广科技股份有限公司 Welding method for cage type PCB inductors
CN106312235B (en) * 2016-11-29 2018-05-25 北京北广科技股份有限公司 Cage PCB induction soldering frocks

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130731

Termination date: 20190206

CF01 Termination of patent right due to non-payment of annual fee