CN106450043B - A kind of manufacturing method thereof of organic light emitting display panel - Google Patents
A kind of manufacturing method thereof of organic light emitting display panel Download PDFInfo
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- CN106450043B CN106450043B CN201610996998.4A CN201610996998A CN106450043B CN 106450043 B CN106450043 B CN 106450043B CN 201610996998 A CN201610996998 A CN 201610996998A CN 106450043 B CN106450043 B CN 106450043B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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Abstract
The present invention discloses a kind of manufacturing method thereof of organic light emitting display panel, and the manufacturing method thereof includes the following steps: to form multiple sub-panel units on a substrate, be spaced apart from each other between multiple sub-panel units, forms spacer region；The sub-panel unit includes the thin film transistor array layer being sequentially formed on the substrate, organic luminous layer；Thin-film encapsulation layer is formed away from the side of the substrate in the organic luminous layer, the thin-film encapsulation layer covers the organic luminous layer of the multiple sub-panel unit；One protective film is attached in the thin-film encapsulation layer; wherein; further include following steps in the step of attaching the protective film: forming the first glue-line between the protective film and the thin-film encapsulation layer; the projection of first glue-line on the substrate is located at the region where the projection of the spacer region on the substrate, and the protective film is attached in the thin-film encapsulation layer by first glue-line.
Description
Technical field
The present invention relates to field of display technology, the in particular to manufacturing method thereof of organic light emitting display panel.
Background technique
Compared with many display panels, organic light emitting display panel has actively luminous, high contrast, no angle limit etc.
Plurality of advantages.Organic light emitting display panel is not only more frivolous in volume, also below original device in power consumption, helps to be promoted
The cruising ability of equipment, therefore, organic light emitting display panel has been widely used in field of display technology, will become and show from now on
Show the mainstream of device consumption.
During organic light emitting display panel processing procedure, when vapor deposition organic luminous layer on completing substrate and thin-film package is carried out
Afterwards, it will usually a protective film with weak adhesion strength is attached in thin-film encapsulation layer, and interim protection is carried out to its surface, also,
It needs to remove the protective film after entire large substrates are carried out with cutting and forms each individual display panel, and attaches one again partially
Mating plate.
For the ease of the removal of subsequent protective film, currently, usually being inhaled using one during attaching said protection film
After adsorption device adsorbs the protective film, then by the protective film with weak adhesion strength glue-line side towards thin-film encapsulation layer, will
Protective film is attached in thin-film encapsulation layer.However, the glue-line viscous force due to protective film side is weaker, in the mistake actually attached
Cheng Zhong, protective film can not be often attached in thin-film encapsulation layer, and be still adsorbed on adsorbent equipment.Therefore, the guarantor can be made
Cuticula can not play the role of protecting organic light emitting display panel, in turn, lead to the finished product of organic light emitting display panel
Rate decline.
Summary of the invention
For the defects in the prior art, the object of the present invention is to provide a kind of processing procedure sides of organic light emitting display panel
Method can effectively ensure that protective film is attached in thin-film encapsulation layer during organic light emitting display panel processing procedure, make this
Protective film plays the role of due protection display panel and improves the yield rate of organic light emitting display panel in turn.
A kind of manufacturing method thereof of organic light emitting display panel, the manufacturing method thereof packet are provided according to an aspect of the present invention
It includes following steps: forming multiple sub-panel units on a substrate, be spaced apart from each other between multiple sub-panel units, between formation
Septal area；The sub-panel unit includes the thin film transistor array layer being sequentially formed on the substrate, organic luminous layer；Institute
It states organic luminous layer and forms thin-film encapsulation layer away from the side of the substrate, the thin-film encapsulation layer covers the multiple sub-panel
The organic luminous layer of unit；One protective film is attached in the thin-film encapsulation layer, wherein attach the step of the protective film
Further include following steps in rapid: forming the first glue-line, first glue-line between the protective film and the thin-film encapsulation layer
Projection on the substrate is located at the region where the projection of the spacer region on the substrate, and the protective film passes through institute
The first glue-line is stated to be attached in the thin-film encapsulation layer.
Optionally, further include following steps in the step of forming first glue-line: first glue-line is coated on
Behind the side of the protective film, the protective film is attached in the thin-film encapsulation layer.
Optionally, further include following steps in the step of forming first glue-line: first glue-line is coated on
The protective film is attached in the thin-film encapsulation layer by the thin-film encapsulation layer behind the side of the substrate.
Optionally, the manufacturing method thereof further includes following steps: before forming first glue-line, in the protective film
The same side surface of formation first glue-line form the second glue-line, wherein second glue-line at least covers the multiple
Sub-panel unit, and the viscous force of second glue-line is less than the viscous force of first glue-line.
Optionally, second glue-line is formed in the whole surface of the protective film, and first glue-line is formed in described
Second glue-line deviates from the side of the protective film.
Optionally, second glue-line is formed in the surface of the protective film, and the throwing of the second glue-line on the substrate
Shadow is located at the region where the projection of the sub-panel unit on the substrate.
Optionally, arranged in arrays be formed on the substrate of the multiple sub-panel unit makes the spacer region in grid
Shape.
Optionally, first glue-line is corresponding with the spacer region grid-shaped.
Optionally, the manufacturing method thereof include the following steps: complete protective film attach the step of after, to the spacer region into
Row cutting, meanwhile, remove first glue-line at spacer region.
Optionally, the manufacturing method thereof includes the following steps: after cutting the spacer region, to each thin-film encapsulation layer
Protective film be removed.
Optionally, the manufacturing method thereof includes the following steps: after removing the protective film, pastes in the thin-film encapsulation layer
Attached polaroid.
Compared with the prior art, due to protecting in the manufacturing method thereof of organic light emitting display panel provided in an embodiment of the present invention
Stronger first glue-line of viscous force is formed between cuticula and thin-film encapsulation layer, which, which can ensure that, is attached at film for protective film
On encapsulated layer, therefore, the protective film can be made to play the role of due protection display panel, in turn, improve organic light emitting display
The yield rate of panel.Also, again due to the first glue-line in spacer region of the projection between sub-panel unit on substrate in base
The region where projection on plate, and the region where the spacer region projects on substrate needs be subsequently formed each display
It is cut during panel, cutting while can remove first glue-line, and therefore, after removing the first glue-line protective film is still
So can easily it be removed from thin-film encapsulation layer, thus, optimize entire organic light emitting display panel is made step.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other feature of the invention,
Objects and advantages will become more apparent upon:
Fig. 1 is a kind of flow chart of the manufacturing method thereof of organic light emitting display panel of the invention；
Fig. 2 be a kind of organic light emitting display panel of the invention manufacturing method thereof in form the base after multiple sub-panel units
Plate top view；
Fig. 3 be a kind of organic light emitting display panel of the invention manufacturing method thereof in form the base after multiple sub-panel units
The cross section structure schematic diagram of plate；
Fig. 4 is that the substrate after thin-film encapsulation layer is formed in a kind of manufacturing method thereof of organic light emitting display panel of the invention
Cross section structure schematic diagram；
Fig. 5 is the flow chart that protective film is attached in a kind of manufacturing method thereof of organic light emitting display panel of the invention；
Fig. 6 be a kind of organic light emitting display panel of the invention manufacturing method thereof between protective film and thin-film encapsulation layer
Form the flow chart of the first glue-line；
Fig. 7 be a kind of organic light emitting display panel of the invention manufacturing method thereof in form the protective film after the first glue-line
Structural schematic diagram；
Fig. 8 is the first glue-line and son after attaching protective film in a kind of manufacturing method thereof of organic light emitting display panel of the invention
Structural schematic diagram between panel unit；
Fig. 9 is the cross section structure schematic diagram of protective film in a kind of manufacturing method thereof of organic light emitting display panel of the invention；
Figure 10 is that the organic light emission after polaroid is attached in a kind of manufacturing method thereof of organic light emitting display panel of the invention
The cross section structure schematic diagram of display panel；
Figure 11 be another organic light emitting display panel of the invention manufacturing method thereof in form the first glue-line and the second glue
The structural schematic diagram of protective film after layer；
Figure 12 is in the manufacturing method thereof of another organic light emitting display panel of the invention in protective film and thin-film encapsulation layer
Between form the flow chart of the first glue-line.
Specific embodiment
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to embodiment set forth herein；On the contrary, thesing embodiments are provided so that the present invention will
Fully and completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.It is identical attached in figure
Icon note indicates same or similar structure, thus will omit repetition thereof.
Described feature, structure or characteristic can be incorporated in one or more embodiments in any suitable manner
In.In the following description, many details are provided to provide and fully understand to embodiments of the present invention.However,
One of ordinary skill in the art would recognize that without one or more in specific detail, or using other methods, constituent element, material
Material etc., can also practice technical solution of the present invention.In some cases, be not shown in detail or describe known features, material or
Person operates to avoid the fuzzy present invention.
Purport is conceived according to the present invention, and the manufacturing method thereof of organic light emitting display panel of the invention includes the following steps:
Multiple sub-panel units are formed on one substrate, are spaced apart from each other between multiple sub-panel units, and spacer region is formed；Sub-panel unit packet
Include the thin film transistor array layer being sequentially formed on substrate, organic luminous layer；Deviate from the side shape of substrate in organic luminous layer
At thin-film encapsulation layer, thin-film encapsulation layer covers the organic luminous layer of multiple sub-panel units；One protective film is attached at film envelope
It fills on layer, wherein further include following steps in the step of attaching protective film: forming first between protective film and thin-film encapsulation layer
Glue-line, projection of first glue-line on substrate are located at the region where projection of the spacer region on substrate, and protective film passes through first
Glue-line is attached in thin-film encapsulation layer.
Technology contents of the invention are described further with reference to the accompanying drawings and examples.
Referring to Figure 1, it illustrates a kind of flow charts of the manufacturing method thereof of organic light emitting display panel of the invention.Such as figure
Shown in 1, in an embodiment of the present invention, the manufacturing method thereof of the organic light emitting display panel includes the following steps:
Step S10: forming multiple sub-panel units on a substrate, be spaced apart from each other between multiple sub-panel units, is formed
Spacer region.Please also refer to Fig. 2 and Fig. 3, which respectively show a kind of manufacturing method thereofs of organic light emitting display panel of the invention
The middle top view and cross section structure schematic diagram for forming the substrate after multiple sub-panel units.Wherein, Fig. 3 is in Fig. 2 at A-A
Cross section structure schematic diagram.As shown in Fig. 2, multiple sub-panel units 2 are formed in a side surface of substrate 1 (shown in Fig. 2 and Fig. 3
It is the upper surface of substrate 1 in embodiment).Specifically, in the embodiment shown in Figure 2, multiple sub-panel units 2 are arranged in matrix
Column are formed on substrate 1, and are spaced apart from each other between multiple sub-panel units 2, and spacer region 3 is formed.In turn, due to multiple sub-panels
Unit 2 is arranged in arrays, therefore, keeps spacer region 3 grid-shaped.It should be noted that only to be in embodiment shown in Fig. 2
It is illustrated for the sub-panel unit of matrix arrangement, but in actual making technology, the arrangement mode of sub-panel unit is simultaneously
It is without being limited thereto, it can be changed according to actual process requirements, it will not be described here.
As shown in figure 3, each sub-panel unit 2 includes at least the thin film transistor array layer being sequentially formed on substrate 1
21 and organic luminous layer 22.Specifically, thin film transistor array layer 21 is formed on substrate 1.Wherein, thin film transistor (TFT) array
Layer 21 can be any structure in existing display panel, such as may include multiple thin film transistor, a plurality of
Data line and a plurality of gate line etc., it will not be described here.Organic luminous layer 22 is formed in thin film transistor array layer 21
Away from the side of substrate 1 (organic luminous layer 22 is formed in above thin film transistor array layer 21 in Fig. 3).Wherein, organic light emission
Layer 22 can be any structure in existing organic light emitting display panel, such as may include anode layer, organic luminous layer
And cathode layer etc., it will not be described here.
Step S20: thin-film encapsulation layer is formed away from the side of substrate in organic luminous layer, thin-film encapsulation layer covers multiple sons
The organic luminous layer of panel unit.Fig. 4 is referred to, it illustrates a kind of manufacturing method thereofs of organic light emitting display panel of the invention
The cross section structure schematic diagram of substrate after middle formation thin-film encapsulation layer.Specifically, thin-film encapsulation layer 4 is formed in organic luminous layer
22 deviate from the side of substrate 1.In the embodiment shown in fig. 4, thin-film encapsulation layer 4 is formed in thin film transistor array layer 21 and has
On machine luminescent layer 22, cover the organic luminous layer 22 of each sub-panel unit 2, with to avoid outside water oxygen intrusion after with it is organic
Luminescent layer 22 contacts, to guarantee the display performance and service life of organic light emitting display panel.It should be noted that film
Organic luminescent layer 22 is completely covered in encapsulated layer 4, and spacer region can cover (as shown in Figure 4) by thin-film encapsulation layer 4 completely, can also
It is depending on the circumstances not exclusively to be covered by thin-film encapsulation layer.
Step S30: a protective film is attached in thin-film encapsulation layer.It should be noted that protective film in this step
It is usually to be needed in existing making technology for carrying out interim protection to it during organic light emitting display panel processing procedure
It is removed.Specifically, Fig. 5 is referred to, it illustrates a kind of processing procedures of organic light emitting display panel of the invention
The flow chart of protective film is attached in method.Further include in the step of (i.e. attaching protective film) as shown in figure 5, above-mentioned steps S30 as
Lower step:
Step S301: the first glue-line is formed between protective film and thin-film encapsulation layer.Projection of first glue-line on substrate
Region where projection of the spacer region on substrate, protective film are attached in thin-film encapsulation layer by the first glue-line.Wherein,
The viscous force of first glue-line is the viscous force for being enough to avoid being mutually disengaged between protective film and thin-film encapsulation layer, existing so as to avoid
The problems such as protective film occurred in making technology can not be pasted in organic light emitting display panel.Further, since the first glue-line exists
Projection on substrate is located at the region where projection of the spacer region on substrate, therefore, is cut when subsequent to spacer region
In the process, the first glue-line can be removed together, so as to be convenient for protective film by being removed in organic light emitting display panel.
Further, refer to Fig. 6, it illustrates in a kind of manufacturing method thereof of organic light emitting display panel of the invention
The flow chart of the first glue-line is formed between protective film and thin-film encapsulation layer.As shown in fig. 6, (forming the first glue in step S301
Layer the step of) in further include following steps:
Step S3011: the first glue-line is coated on to the side of a protective film.Fig. 7 is referred to, it illustrates of the invention one
The structural schematic diagram of the protective film after the first glue-line is formed in the manufacturing method thereof of kind organic light emitting display panel.Specifically, exist
In embodiment shown in Fig. 7, the size of protective film 5 and size (i.e. the length and width) of substrate 1 are identical, the formation of the first glue-line 6
In the side of protective film 5.Since spacer region 3 is grid-shaped (reference can be made to Fig. 2), in order to make protective film 5 be pasted to film envelope
It fills the projection of rear, the first glue-line 6 on substrate 1 on layer 4 and is located at the region where the projection of spacer region 3 on substrate 1, therefore,
First glue-line 6 is correspondingly grid-shaped with spacer region 3.It should be noted that in other embodiments of the invention, guaranteeing
While the projection of first glue-line 6 on substrate 1 is located at the region where the projection of spacer region 3 on substrate 1, the first glue-line 6
It is also possible to other shapes, for example, the first glue-line 6 can be formed only at latticed point of intersection in Fig. 7；Or first glue
Layer 6 can be formed only in Fig. 7 in latticed multirow or multiple row, these embodiments can save used in the first glue-line 6
While material, similar attaching effect is played, it will not be described here.
Step S3012: protective film is attached in thin-film encapsulation layer.Fig. 8 is referred to, it illustrates one kind of the invention to have
Structural schematic diagram in the manufacturing method thereof of machine light emitting display panel after attaching protective film between the first glue-line and sub-panel unit.Tool
For body, after forming protective film 5 shown in fig. 7, the side that the first glue-line 6 is formed on protective film 5 is sealed towards film
Dress layer 4 is simultaneously attached at the surface of thin-film encapsulation layer 4, and then forms structure as shown in Figure 8, it should be noted that in Fig. 8 in order to
More clearly the positional relationship between sub- panel unit 2 and the first glue-line 6 is illustrated, therefore, substrate 1 is omitted.
It further, in the embodiment shown in fig. 5, should before step S301 (the step of forming the first glue-line)
Manufacturing method thereof further includes step S300: forming the second glue-line in the same side surface of the first glue-line of formation of protective film.Wherein,
Two glue-lines at least cover multiple sub-panel units, and the viscous force of the second glue-line is less than the viscous force of the first glue-line.Fig. 9 is referred to,
Show the cross section structure schematic diagram of protective film in a kind of manufacturing method thereof of organic light emitting display panel of the invention.Wherein, Fig. 9
It can be understood as the cross section structure schematic diagram in above-mentioned Fig. 7 at B-B.As shown in figure 9, the second glue-line 7 is formed in protective film 5
Whole surface, the first glue-line 6 are formed in the side that the second glue-line 7 deviates from protective film 5.Specifically, embodiment shown in Fig. 9
In, the second glue-line 7 is formed in the entire upper surface of protective film 5, and the first glue-line 6 is formed in the upper surface of the second glue-line 7.First glue
The shape of layer 6 can be found in Fig. 7, the formation of the second glue-line 7 can be played avoid the first glue-line 6 from removing after protective film 5 directly from having
The effect to fall off on machine light emitting display panel, it will not be described here.
Further, in the embodiment shown in fig. 1, which includes step S40: completing the step that protective film attaches
After rapid, spacer region is cut, meanwhile, remove the first glue-line at spacer region.Specifically, since the first glue-line is in substrate
On projection be located at projection of the spacer region on substrate where region, therefore, while being cut to spacer region, first
Glue-line can remove together with spacer region.
Further, in the embodiment shown in fig. 1, which includes step S50: after cutting spacer region, to every
Protective film in a thin-film encapsulation layer is removed.Specifically, since the first glue-line with stronger viscous force is in above-mentioned steps
It is removed in S40, therefore, protective film can be removed from thin-film encapsulation layer more conveniently.
Further, in the embodiment shown in fig. 1, which includes the following steps S60: after removal protective film,
Polaroid is attached in thin-film encapsulation layer.Referring to Figure 10, it illustrates a kind of systems of organic light emitting display panel of the invention
The cross section structure schematic diagram of the organic light emitting display panel after polaroid is attached in Cheng Fangfa.To be formed with list after cutting in Figure 10
It is illustrated for the organic light emitting display panel of a sub- panel unit.As shown in Figure 10, polaroid 8 is attached at thin-film encapsulation layer
On 4, optical effect is protected and improved to the surface of organic light emitting display panel.The organic light emitting display face formed in Figure 10
Plate is the display panel being applied in various terminals electronic equipment.
In conjunction with above-mentioned Fig. 1 to embodiment illustrated in fig. 10, in the manufacturing method thereof of organic light emitting display panel of the invention due to
Stronger first glue-line of viscous force is formed between protective film and thin-film encapsulation layer, which, which can ensure that, is attached at protective film
In thin-film encapsulation layer, therefore, the protective film can be made to play the role of due protection display panel, in turn, improve organic light emission
The yield rate of display panel.Also, again since the first glue-line is in spacer region of the projection between sub-panel unit on substrate
The region where projection on substrate, and the spacer region projected on substrate where region need be subsequently formed it is each
It is cut during display panel, cutting while can remove first glue-line, therefore, protect after removing the first glue-line
Film still can be removed easily from thin-film encapsulation layer, thus, optimize entire organic light emitting display panel is made step.
Figure 11 is another embodiment of the manufacturing method thereof of organic light emitting display panel of the invention, refers to figure
11, after forming the first glue-line and the second glue-line in the manufacturing method thereof of another organic light emitting display panel of the invention
Protective film structural schematic diagram.In this embodiment, the second glue-line 7 is formed in the surface of protective film.With above-mentioned Fig. 7 to Fig. 9
Shown in unlike protective film, projection of second glue-line on substrate is located at where projection of the sub-panel unit on substrate
Region, projection of first glue-line 6 on substrate are located at the region where the projection of spacer region 3 on substrate 1.Specifically, such as
Shown in Figure 11, the second glue-line 7 is not the whole surface for being formed in protective film 5 in embodiment as shown in Figure 7 to 9, but
Surface arranged in arrays in protective film 5, wherein each projection of the second glue-line 7 on substrate 1 is located at sub-panel unit 2
Region on substrate where 1 projection.In the embodiment shown in fig. 11, the size of the second glue-line 7 is greater than sub-panel unit 2
Size, can equally play protective film 5 after avoiding first base 6 from removing and directly fall off from organic light emitting display panel
Effect, it will not be described here.
Figure 12 is another embodiment of the manufacturing method thereof of organic light emitting display panel of the invention, refers to figure
12, it illustrates in the manufacturing method thereof of another organic light emitting display panel of the invention between protective film and thin-film encapsulation layer
Form the flow chart of the first glue-line.Unlike above-mentioned embodiment illustrated in fig. 6, the first glue-line be to be formed thin-film encapsulation layer it
Afterwards, be coated on sub-panel unit, between spacer region.Specifically, as shown in figure 12, (the first glue is formed in step S301
Layer the step of) in include the following steps:
Step S3011 ': the first glue-line is coated on the side that thin-film encapsulation layer deviates from substrate.Wherein, the first glue-line is in base
Projection on plate is still located on the region where projection of the spacer region on substrate.
Step S3011 ': protective film is attached in thin-film encapsulation layer.Wherein, protective film can be as in above-described embodiment
One side surface is formed with the protective film of the second glue-line, is also possible to the protective film only containing the second glue-line, wherein can be whole face
It is coated with the projection of the protective film or the second glue-line of the second glue-line on substrate and is located at projection institute of the sub-panel unit on substrate
Protective film in region.
The effect similar with above-mentioned first embodiment shown in fig. 6 may be implemented in the embodiment, and it will not be described here.
In conclusion in the manufacturing method thereof of organic light emitting display panel provided in an embodiment of the present invention due in protective film and
Stronger first glue-line of viscous force is formed between thin-film encapsulation layer, which, which can ensure that, is attached at thin-film encapsulation layer for protective film
On, therefore, the protective film can be made to play the role of due protection display panel and improve organic light emitting display panel in turn
Yield rate.Also, again due to the first glue-line in spacer region of the projection between sub-panel unit on substrate on substrate
Region where projecting, and the region where the spacer region projects on substrate needs be subsequently formed each display panel
It is cut in the process, cutting while can remove first glue-line, and therefore, protective film still can be just after removing the first glue-line
Prompt ground is removed from thin-film encapsulation layer, thus, optimize entire organic light emitting display panel is made step.
Although the present invention is disclosed as above with alternative embodiment, it is not intended to limit the invention.Belonging to the present invention
Those skilled in the art, without departing from the spirit and scope of the present invention, when various change and modification can be made.Therefore,
Protection scope of the present invention is subject to the range defined depending on claims.
Claims (11)
1. a kind of manufacturing method thereof of organic light emitting display panel, which is characterized in that the manufacturing method thereof includes the following steps:
Multiple sub-panel units are formed on a substrate, are spaced apart from each other between multiple sub-panel units, and spacer region is formed；
The sub-panel unit includes the thin film transistor array layer being sequentially formed on the substrate, organic luminous layer；
Thin-film encapsulation layer is formed away from the side of the substrate in the organic luminous layer, the thin-film encapsulation layer covering is described more
The organic luminous layer of a sub- panel unit；
One protective film is attached in the thin-film encapsulation layer, wherein further include walking in the step of attaching the protective film as follows
It is rapid:
The first glue-line, the throwing of first glue-line on the substrate are formed between the protective film and the thin-film encapsulation layer
Shadow is located at the region where the projection of the spacer region on the substrate, and the protective film is attached at by first glue-line
In the thin-film encapsulation layer, and between the protective film and the thin-film encapsulation layer, the viscous force of the spacer region is greater than multiple
The viscous force of sub-panel unit.
2. manufacturing method thereof as described in claim 1, which is characterized in that in the step of forming first glue-line further include as
Lower step: after first glue-line is coated on the side of the protective film, the protective film is attached at the thin-film package
On layer.
3. manufacturing method thereof as described in claim 1, which is characterized in that in the step of forming first glue-line further include as
Lower step: first glue-line is coated on the thin-film encapsulation layer behind the side of the substrate, the protective film is pasted
It invests in the thin-film encapsulation layer.
4. manufacturing method thereof as claimed any one in claims 1 to 3, which is characterized in that the manufacturing method thereof further includes as follows
Step: before forming first glue-line, the is formed in the same side surface of formation first glue-line of the protective film
Two glue-lines, wherein second glue-line at least covers the multiple sub-panel unit, and the viscous force of second glue-line is less than institute
State the viscous force of the first glue-line.
5. manufacturing method thereof as claimed in claim 4, which is characterized in that second glue-line is formed in the entire of the protective film
Surface, first glue-line are formed in the side that second glue-line deviates from the protective film.
6. manufacturing method thereof as claimed in claim 4, which is characterized in that second glue-line is formed in the table of the protective film
Face, and the projection of the second glue-line on the substrate is located at the area where the projection of the sub-panel unit on the substrate
Domain.
7. manufacturing method thereof as claimed any one in claims 1 to 3, which is characterized in that the multiple sub-panel unit is in square
Battle array arrangement, which is formed on the substrate, keeps the spacer region grid-shaped.
8. manufacturing method thereof as claimed in claim 7, which is characterized in that first glue-line corresponding with the spacer region is in net
Trellis.
9. manufacturing method thereof as claimed any one in claims 1 to 3, which is characterized in that the manufacturing method thereof includes following step
It is rapid: after completing the step of protective film attaches, the spacer region is cut, meanwhile, remove first glue at spacer region
Layer.
10. manufacturing method thereof as claimed in claim 9, which is characterized in that the manufacturing method thereof includes the following steps: described in cutting
After spacer region, the protective film in each thin-film encapsulation layer is removed.
11. manufacturing method thereof as claimed in claim 10, which is characterized in that the manufacturing method thereof includes the following steps: to remove institute
After stating protective film, polaroid is attached in the thin-film encapsulation layer.
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|---|---|---|---|---|
| CN108054142B (en) * | 2017-12-14 | 2021-01-29 | 京东方科技集团股份有限公司 | Display substrate manufacturing method and display substrate |
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