WO2016051682A1 - 半導体単結晶引上げ装置及びこれを用いた半導体単結晶の再溶融方法 - Google Patents
半導体単結晶引上げ装置及びこれを用いた半導体単結晶の再溶融方法 Download PDFInfo
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- WO2016051682A1 WO2016051682A1 PCT/JP2015/004578 JP2015004578W WO2016051682A1 WO 2016051682 A1 WO2016051682 A1 WO 2016051682A1 JP 2015004578 W JP2015004578 W JP 2015004578W WO 2016051682 A1 WO2016051682 A1 WO 2016051682A1
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
- C30B15/22—Stabilisation or shape controlling of the molten zone near the pulled crystal; Controlling the section of the crystal
- C30B15/28—Stabilisation or shape controlling of the molten zone near the pulled crystal; Controlling the section of the crystal using weight changes of the crystal or the melt, e.g. flotation methods
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
- C30B15/22—Stabilisation or shape controlling of the molten zone near the pulled crystal; Controlling the section of the crystal
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/14—Heating of the melt or the crystallised materials
Definitions
- the present invention relates to a method for producing a single crystal by the Czochralski method (hereinafter also referred to as CZ method), and relates to a remelting method in the case where dislocations are formed during single crystal growth.
- the Czochralski method is known as a method for producing a silicon single crystal.
- a raw material lump is accommodated in a quartz crucible installed in a chamber, heated with a heater, and the raw material in the crucible is made into a melt. Then, a seed crystal is deposited on the surface of the raw material melt and pulled up while rotating to grow a silicon single crystal having a desired diameter and quality.
- the diameter of the neck is narrowed once to 3-4 mm in the dash necking process to remove the dislocations contained in the seed crystal and the dislocations generated by heat shock at the time of landing.
- a cone process for gradually increasing the diameter to a desired diameter is performed to form a straight body portion to be a product.
- a tail portion that reduces the diameter is formed and separated from the silicon melt.
- the remelting step first the temperature of the melt is raised to a temperature at which the crystals melt. Thereafter, the crystal is immersed in the melt and melted. At this time, since it is necessary to take care that the crystal does not contact the bottom of the crucible, it is preferable to immerse the crystal in a range of approximately 20 to 50 mm. After confirming that the immersed crystal is melted, the operation of immersing the crystal in the melt is repeated in the same manner, and all the crystals produced so far are melted.
- An object of the present invention is to provide a semiconductor single crystal pulling apparatus and a remelting method capable of melting.
- a single crystal pulling apparatus comprising: a heater that heats and holds a crucible containing a melt; and a wire that is grown while pulling a semiconductor single crystal from the melt. And When the single crystal pulling device is immersed in the melt and remelted the lower end portion of the semiconductor single crystal with the wire, the lower end portion of the semiconductor single crystal is obtained from the change in the weight of the semiconductor single crystal.
- a remelt detection device for detecting the completion of remelting, By applying a voltage between the crucible and the wire, when the semiconductor single crystal is wound up with the wire while applying a voltage between the semiconductor single crystal and the melt, the semiconductor single crystal And a bottom end detection device for detecting a bottom end of the semiconductor single crystal from a position where no current flows between the melt and the melt. .
- a method for immersing and remelting the lower end portion of the semiconductor single crystal in the melt using the semiconductor single crystal pulling apparatus as described above A crystal immersing step of lowering the wire of the single crystal pulling apparatus, immersing the lower end portion of the semiconductor single crystal in the melt, and remelting the lower end portion; Using the remelting detection device, from a change in the weight of the semiconductor single crystal, a remelting detection step of detecting that melting of the lower end portion of the semiconductor single crystal immersed in the melt is completed, Winding the semiconductor single crystal with the wire while applying a voltage between the semiconductor single crystal and the melt, and using the lowermost end detection device, a current flows between the semiconductor single crystal and the melt.
- a method for remelting a semiconductor single crystal comprising: a determination step for determining whether to start a crystal dipping step again or end remelting after the bottom end detection step is completed.
- the semiconductor single crystal pulling apparatus of the present invention since the semiconductor single crystal pulling apparatus of the present invention is used, it is not necessary to visually confirm the completion of remelting of the lower end portion of the immersed semiconductor single crystal, so that remelting can be performed efficiently.
- the remelt detection step When the change in the weight of the semiconductor single crystal falls within a predetermined value set in advance, it can be detected that the remelting of the lower end portion of the immersed semiconductor single crystal has been completed. Thus, when the change in the weight of the semiconductor single crystal is within a predetermined value set in advance, if it is detected that the remelting of the lower end of the immersed semiconductor single crystal is completed, the lower end of the semiconductor single crystal It can be detected more accurately that the remelting is completed.
- the determination step when the weight of the semiconductor single crystal becomes equal to or less than a predetermined weight set in advance, it can be determined that the remelting is finished. In this way, when the weight of the semiconductor single crystal is equal to or less than a predetermined weight set in advance, the end of remelting can be determined.
- the length of the lower end portion of the semiconductor single crystal immersed in the melt is less than the depth of the melt in the crucible from the detected lower end of the semiconductor single crystal. It is preferable that By doing so, the length of the lower end portion of the semiconductor single crystal immersed in the melt is less than the depth of the melt in the crucible even when there is an undissolved portion at the lower end portion of the semiconductor single crystal. Therefore, it is possible to prevent the semiconductor single crystal from contacting the crucible bottom.
- the semiconductor single crystal can be remelted automatically by automatically performing the crystal dipping step, the remelt detection step, the bottom end detection step, and the determination step.
- the semiconductor single crystal can be remelted automatically, it can be efficiently remelted.
- the semiconductor single crystal pulling apparatus of the present invention is a semiconductor single crystal remelting method, it is possible to detect whether remelting of the lower end portion of the semiconductor single crystal is completed from the change in the weight of the semiconductor single crystal. It is not necessary to visually confirm that the remelting of the lower end portion of the semiconductor single crystal has been completed. Moreover, since the lowest end of the semiconductor single crystal can be detected electrically, it can be detected accurately. Further, if the semiconductor single crystal remelting method using the semiconductor single crystal pulling apparatus of the present invention, since it is not necessary to visually confirm the completion of remelting of the lower end portion of the immersed semiconductor single crystal, Remelting can be performed efficiently.
- Example 1 It is the schematic which showed an example of the semiconductor single crystal pulling apparatus of this invention.
- Example 1 it is the figure which showed the relationship between the weight of a crystal
- 10 is a process diagram of a semiconductor single crystal remelting method in Example 2.
- FIG. It is the figure which showed the relationship between the length of the crystal
- a semiconductor single crystal pulling apparatus 1 of the present invention includes a heater 4 that heats and holds a crucible 3 that contains a melt 2, and a wire 6 that is grown while pulling up a semiconductor single crystal 5 from the melt 2.
- the remelting detection device 7 and the lowermost end detection device 8 are provided.
- the remelting detection device 7 can measure the weight of the semiconductor single crystal 5 by the weight measuring device 10 connected to the wire winding unit 9. Then, when the remelting detection device 7 unwinds the wire 6 and immerses the lower end portion of the semiconductor single crystal 5 in the melt 2 and remelts it, the remelting detection device 7 detects the change in the weight of the semiconductor single crystal 5 from the change in weight of the semiconductor single crystal 5. It can be detected that the remelting of the lower end of the crystal 5 has been completed.
- the weight measuring device 10 can be a load cell, for example.
- the power source 11 and the ammeter 12 of the lowermost end detection device 8 are electrically connected to the crucible 3 and the wire 6.
- the wire winding part 9 and the wire 6 are insulated with respect to the earth (ground). Therefore, when a power source 11 is connected between the crucible 3 and the wire 6 and a voltage is applied, when the semiconductor single crystal 5 is in contact with the melt 2, a closed circuit is formed and a minute current flows. On the other hand, since the closed circuit is not formed when the semiconductor single crystal 5 is separated from the melt 2, no current flows.
- the lowest end detection device 8 applies a voltage between the crucible 3 and the wire 6, thereby applying a voltage between the semiconductor single crystal 5 and the melt 2.
- the semiconductor single crystal 5 is wound up at 6, the lowermost end of the semiconductor single crystal 5 is detected from the position where no current flows between the semiconductor single crystal 5 and the melt 2.
- the wire winding unit 9 can be controlled by the control device 13 connected to the remelting detection device 7 and the lowermost end detection device 8.
- the change in the weight of the semiconductor single crystal 5 is within a predetermined value set in advance, it is preferable to detect that the remelting of the lower end portion of the immersed semiconductor single crystal 5 is completed.
- the change in the weight of the semiconductor single crystal 5 is equal to or less than a predetermined weight set in advance, the end of remelting can be determined. That is, as the melting of the single crystal proceeds, the weight of the single crystal gradually decreases, but it can be determined that remelting has been completed when this change is almost eliminated.
- the semiconductor single crystal 5 is wound up by the wire 6 while applying a voltage between the semiconductor single crystal 5 and the melt 2. Then, the position where the current no longer flows between the semiconductor single crystal 5 and the melt 2 using the lowermost end detection device 8, that is, the position where the lowermost end of the semiconductor single crystal 5 is separated from the melt is determined. The lowermost end of the single crystal 5 is detected.
- the crystal Since the lowest end of the semiconductor single crystal 5 can be accurately detected in this way, the crystal can be immersed again from the lowest end of the detected semiconductor single crystal 5 when remelted. Thereby, for example, even when there is an undissolved portion at the lower end of the semiconductor single crystal 5, it is possible to always immerse the crystal in the melt by the same length without abutting the single crystal against the bottom of the crucible.
- the weight of the semiconductor single crystal 5 is equal to or less than a predetermined weight set in advance, it can be determined that almost all the single crystals are melted and the remelting is finished.
- the length of the lower end portion of the semiconductor single crystal 5 to be dipped in the melt 2 in the subsequent crystal dipping process is detected in the lowest end detecting process. It is preferable that the depth of the melt 2 in the crucible 3 is less than the depth of the melted semiconductor single crystal 5.
- the length of the lower end portion of the semiconductor single crystal 5 immersed in the melt 2 is set to be less than the depth of the melt 2 in the crucible 3 from the lowest end of the detected semiconductor single crystal 5. It is possible to reliably prevent the crucible 3 from being damaged by the lower end portion of the single crystal 5 coming into contact with the bottom of the crucible 3.
- the semiconductor single crystal can be remelted automatically by automatically performing the above-described crystal immersion step, remelting detection step, bottom end detection step, and discrimination step.
- the semiconductor single crystal can be automatically remelted including the immersion of the crystal. Therefore, the semiconductor single crystal can be efficiently remelted.
- Example 1 The semiconductor single crystal 5 was remelted using the semiconductor single crystal pulling apparatus 1 of the present invention as shown in FIG. At that time, the change in the weight of the semiconductor single crystal 5 was measured by the weight measuring device 10 (load cell), and the weight of the semiconductor single crystal 5 being remelted was observed. The measurement results at this time are shown in FIG.
- the crystal was wound up with the wire 6 and the molten state of the semiconductor single crystal 5 was confirmed.
- the lower end portion of the semiconductor single crystal 5 immersed in the melt 2 was in a state where it could be determined that the melting was almost completed.
- Example 2 Using the semiconductor single crystal pulling apparatus 1 of the present invention as shown in FIG. 1, re-melting of the semiconductor single crystal 5 was started in the process as shown in FIG. 3 (SP1). In addition, the control apparatus 13 was programmed and the remelting was performed automatically so that the process shown below might be performed automatically.
- the semiconductor single crystal 5 to be remelted was one having a straight body portion of about 20 cm.
- the weight of the semiconductor single crystal 5 at this time is measured at any time by the weight measuring device 10 (load cell), and the result is transferred to the control device 13. At this time, when the change in the weight of the semiconductor single crystal 5 is within a predetermined range (for example, within 200 g per minute), the remelting detection device indicates that the melting of the lower end portion of the semiconductor single crystal 5 is completed. 7 is set in advance so as to be detected by SP (SP3).
- SP SP
- the length of the lower end portion of the semiconductor single crystal 5 immersed in the melt is 40 mm, which is less than the depth of the melt 2 in the crucible 3. .
- the remelting of the semiconductor single crystal was performed using a remelting detection device such as the semiconductor single crystal pulling device of the present invention and a single crystal pulling device not equipped with the lowest end detection device. And the operator confirmed visually whether the lower end part of the semiconductor single crystal was remelted.
- the semiconductor single crystal to be remelted was the same as in Example 2 and had a straight body portion of 20 cm. The relationship between the length of the semiconductor single crystal and the time at this time is shown by a broken line in FIG.
- the present invention is not limited to the above embodiment.
- the above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.
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Abstract
Description
前記単結晶引上げ装置は、前記ワイヤーで前記半導体単結晶の下端部を前記融液中に浸漬させて再溶融させた際に、前記半導体単結晶の重量の変化から、前記半導体単結晶の下端部の再溶融が完了したことを検出する再溶融検出装置と、
前記ルツボと前記ワイヤーとの間に電圧を印可することで、前記半導体単結晶と前記融液との間に電圧を印加しながら前記ワイヤーで前記半導体単結晶を巻上げた際に、前記半導体単結晶と前記融液との間に電流が流れなくなった位置から、前記半導体単結晶の最下端を検出する最下端検出装置とを具備するものであることを特徴とする半導体単結晶引上げ装置を提供する。
前記単結晶引上げ装置の前記ワイヤーを巻き下げて、前記半導体単結晶の下端部を前記融液中に浸漬させ、該下端部を再溶融させる結晶浸漬工程と、
前記再溶融検出装置を用いて、前記半導体単結晶の重量の変化から、前記融液中に浸漬させた前記半導体単結晶の下端部の溶融が完了したことを検出する再溶融検出工程と、
前記半導体単結晶と前記融液との間に電圧を印加しながら前記ワイヤーで前記半導体単結晶を巻上げ、前記最下端検出装置を用いて、前記半導体単結晶と前記融液との間に電流が流れなくなった位置から、前記半導体単結晶の最下端を検出する最下端検出工程と、
最下端検出工程の終了後に、再び結晶浸漬工程を開始するか、または、再溶融を終了するかを決定する判別工程とを有することを特徴とする半導体単結晶の再溶融方法を提供する。
前記半導体単結晶の重量の変化が、予め設定した所定の値以内になったら、前記浸漬した半導体単結晶の下端部の再溶融が完了したと検出することができる。
このように、半導体単結晶の重量の変化が、予め設定した所定の値以内になったら、浸漬した半導体単結晶の下端部の再溶融が完了したと検出すれば、半導体単結晶の下端部の再溶融が完了したことをより正確に検出することができる。
このように、半導体単結晶の重量が、予め設定した所定の重量以下となった場合に、再溶融の終了を決定することができる。
その後の、前記結晶浸漬工程において、前記融液中に浸漬させる前記半導体単結晶の下端部の長さを、前記検出した前記半導体単結晶の最下端から前記ルツボ内の前記融液の深さ未満とすることが好ましい。
このようにすることで、半導体単結晶の下端部で溶け残りがある場合においても、融液に浸漬させる半導体単結晶の下端部の長さを、ルツボ内の前記融液の深さ未満とするので、半導体単結晶がルツボ底部に接触することを防止することができる。
このように、本発明では半導体単結晶の再溶融を自動で行うことができるので、効率的に再溶融を行うことができる。
またこのような本発明の半導体単結晶引上げ装置を用いた半導体単結晶の再溶融方法であれば、浸漬させた半導体単結晶の下端部の再溶融の完了を目視によって確認する必要がないため、再溶融を効率よく行うことができる。
図1に示すように、本発明の半導体単結晶引上げ装置1は、融液2を収容するルツボ3を加熱保温するヒーター4と、融液2から半導体単結晶5を引き上げながら育成するワイヤー6と、再溶融検出装置7と、最下端検出装置8とを具備する。
まず、上記に示したような本発明の半導体単結晶引上げ装置1のワイヤー6を巻き下げて、半導体単結晶5の下端部を融液2中に浸漬させて再溶融させる。
そして、再溶融検出装置7を用いて、半導体単結晶5の重量の変化から、融液2中に浸漬させた半導体単結晶5の下端部の溶融が完了したことを検出する。
このように、半導体単結晶5の重量の変化が、予め設定した所定の重量以下となった場合に、再溶融の終了を決定することができる。すなわち、単結晶の溶融が進むと、単結晶の重量が徐々に減少するが、この変化がほとんどなくなった時、再溶融が完了したと判断できる。
半導体単結晶5と融液2との間に電圧を印可しながら、ワイヤー6で半導体単結晶5を巻上げる。そして、最下端検出装置8を用いて半導体単結晶5と融液2との間に電流が流れなくなった位置、つまり半導体単結晶5の最下端が融液から離れた位置を割り出し、これによって半導体単結晶5の最下端を検出する。
最下端検出工程の終了後に、再び結晶浸漬工程を開始するか、または、再溶融を終了するかを決定する。
このように、融液2中に浸漬させる半導体単結晶5の下端部の長さを、検出した半導体単結晶5の最下端からルツボ3内の融液2の深さ未満とすることで、半導体単結晶5の下端部がルツボ3の底に接触して、ルツボ3を破損することを確実に防止することができる。
このように、半導体単結晶の再溶融の完了を結晶の重量の変化から検出するため、結晶の浸漬を含め、半導体単結晶の再溶融を自動で行うことができる。そのため、半導体単結晶の再溶融を効率的に行うことができる。
図1に示すような、本発明の半導体単結晶引上げ装置1を用いて、半導体単結晶5の再溶融を行った。その際に、半導体単結晶5の重量の変化を重量測定器10(ロードセル)により測定して、再溶融中の半導体単結晶5の重量を観察した。このときの測定結果を、図2に示した。
(実施例2)
図1に示すような、本発明の半導体単結晶引上げ装置1を用いて、図3に示すような工程で、半導体単結晶5の再溶融を開始した(SP1)。なお、以下に示す工程を自動で行うように、制御装置13をプログラミングし、自動で再溶融を実施した。なお、再溶融する半導体単結晶5は直胴部が約20cmのものを用いて行った。
まず、ワイヤー6を巻き下げて、半導体単結晶5の下端部を融液2に40mm浸漬させた(SP2)。
このときの半導体単結晶5の重量は、重量測定器10(ロードセル)により随時測定され、その結果は制御装置13へ転送される。この際に、半導体単結晶5の重量の変化が所定の範囲内(例えば、1分間当たり200g以内)であった場合に、半導体単結晶5の下端部の溶融が完了したと、再溶融検出装置7によって検出されるように、予め設定しておいた(SP3)。
半導体単結晶5の下端部の溶融が完了したと検出されると、半導体単結晶5と融液2の間に電圧を印可しながら、ワイヤー6で半導体単結晶5を巻上げた(SP4)。そして、最下端検出装置8により、半導体単結晶5と融液2との間に電流が流れなくなった位置から、半導体単結晶5の最下端を検出した(SP5)。
そして、このときの半導体単結晶5の重量が所定の重量(例えば、1kg)より重い場合は、SP2に戻り、再び結晶浸漬工程を行った。一方、半導体単結晶5の重量が所定の重量(例えば、1kg)以内であった場合には再溶融を終了するように判別を行った(SP6)。
このときの半導体単結晶の長さと時間の関係を図4に実線で示した。また、図4には、後述する比較例の結果を破線で記載した。
(比較例)
一方、実施例2の結果では、自動で再溶融が行われているため、そのバラツキが小さく、ほぼ同じ時間で浸漬を繰り返しており、無駄な時間放置されること無く正確に再溶融を行うことができた。
Claims (6)
- 融液を収容するルツボを加熱保温するヒーターと、前記融液から半導体単結晶を引き上げながら育成するワイヤーとを具備する単結晶引上げ装置であって、
前記単結晶引上げ装置は、前記ワイヤーで前記半導体単結晶の下端部を前記融液中に浸漬させて再溶融させた際に、前記半導体単結晶の重量の変化から、前記半導体単結晶の下端部の再溶融が完了したことを検出する再溶融検出装置と、
前記ルツボと前記ワイヤーとの間に電圧を印可することで、前記半導体単結晶と前記融液との間に電圧を印加しながら前記ワイヤーで前記半導体単結晶を巻上げた際に、前記半導体単結晶と前記融液との間に電流が流れなくなった位置から、前記半導体単結晶の最下端を検出する最下端検出装置とを具備するものであることを特徴とする半導体単結晶引上げ装置。 - 請求項1に記載の単結晶引上げ装置を用いて、半導体単結晶の下端部を融液中に浸漬させて再溶融させる方法であって、
前記単結晶引上げ装置の前記ワイヤーを巻き下げて、前記半導体単結晶の下端部を前記融液中に浸漬させ、該下端部を再溶融させる結晶浸漬工程と、
前記再溶融検出装置を用いて、前記半導体単結晶の重量の変化から、前記融液中に浸漬させた前記半導体単結晶の下端部の溶融が完了したことを検出する再溶融検出工程と、
前記半導体単結晶と前記融液との間に電圧を印加しながら前記ワイヤーで前記半導体単結晶を巻上げ、前記最下端検出装置を用いて、前記半導体単結晶と前記融液との間に電流が流れなくなった位置から、前記半導体単結晶の最下端を検出する最下端検出工程と、
最下端検出工程の終了後に、再び結晶浸漬工程を開始するか、または、再溶融を終了するかを決定する判別工程とを有することを特徴とする半導体単結晶の再溶融方法。 - 前記再溶融検出工程において、
前記半導体単結晶の重量の変化が、予め設定した所定の値以内になったら、前記浸漬した半導体単結晶の下端部の再溶融が完了したと検出することを特徴とする請求項2に記載の半導体単結晶の再溶融方法。 - 前記判別工程において、
前記半導体単結晶の重量が、予め設定した所定の重量以下となった場合に、再溶融を終了すると決定することを特徴とする請求項2または請求項3に記載の半導体単結晶の再溶融方法。 - 前記判別工程において、再び結晶浸漬工程を開始すると決定した場合に、
その後の、前記結晶浸漬工程において、前記融液中に浸漬させる前記半導体単結晶の下端部の長さを、前記検出した前記半導体単結晶の最下端から前記ルツボ内の前記融液の深さ未満とすることを特徴とする請求項2または請求項3に記載の半導体単結晶の再溶融方法。 - 前記結晶浸漬工程と、前記再溶融検出工程と、前記最下端検出工程と、前記判別工程とを自動で行うことによって、前記半導体単結晶の再溶融を自動で行うことを特徴とする請求項2から請求項5のいずれか一項に記載の半導体単結晶の再溶融方法。
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02188487A (ja) * | 1989-01-17 | 1990-07-24 | Osaka Titanium Co Ltd | 棒状多結晶シリコンの自動供給方法 |
JPH06234592A (ja) * | 1985-01-14 | 1994-08-23 | Komatsu Electron Metals Co Ltd | 半導体シリコン単結晶の製造方法 |
JPH08301687A (ja) * | 1995-05-02 | 1996-11-19 | Komatsu Electron Metals Co Ltd | 棒状多結晶シリコンの溶解方法及びその装置 |
JP2000264780A (ja) * | 1999-03-19 | 2000-09-26 | Toshiba Ceramics Co Ltd | 半導体単結晶引き上げ装置における溶融検知方法および装置 |
JP2009132552A (ja) * | 2007-11-29 | 2009-06-18 | Covalent Materials Corp | シリコン単結晶の製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59184795A (ja) | 1983-04-04 | 1984-10-20 | Agency Of Ind Science & Technol | 3−5族化合物半導体単結晶の製造方法 |
JPH05124890A (ja) | 1991-11-01 | 1993-05-21 | Komatsu Electron Metals Co Ltd | 半導体単結晶成長装置 |
JP3482979B2 (ja) * | 1996-04-09 | 2004-01-06 | 三菱住友シリコン株式会社 | 単結晶引上装置におけるヒーター電極溶損防止装置 |
TW444071B (en) | 1998-06-19 | 2001-07-01 | Komatsu Denshi Kinzoku Kk | Manufacture apparatus and method for silicon crystal |
JP3512074B2 (ja) * | 2000-03-06 | 2004-03-29 | 日本電気株式会社 | 半導体単結晶育成装置および半導体単結晶育成方法 |
CN1265031C (zh) * | 2003-09-28 | 2006-07-19 | 北京有色金属研究总院 | 一种生长直拉硅单晶的重掺杂方法及掺杂装置 |
CN100436656C (zh) * | 2006-12-28 | 2008-11-26 | 西安理工大学 | 单晶炉中籽晶与熔融硅液面接触的检测方法 |
TW201006429A (en) | 2008-06-20 | 2010-02-16 | Gojo Ind Inc | Two-stroke foam pump |
US8691008B2 (en) * | 2009-03-31 | 2014-04-08 | Memc Electronic Materials, Inc. | Systems for weighing a pulled object |
JP5047227B2 (ja) * | 2009-05-27 | 2012-10-10 | ジャパンスーパークォーツ株式会社 | シリコン単結晶の製造方法及びシリコン単結晶引き上げ装置 |
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06234592A (ja) * | 1985-01-14 | 1994-08-23 | Komatsu Electron Metals Co Ltd | 半導体シリコン単結晶の製造方法 |
JPH02188487A (ja) * | 1989-01-17 | 1990-07-24 | Osaka Titanium Co Ltd | 棒状多結晶シリコンの自動供給方法 |
JPH08301687A (ja) * | 1995-05-02 | 1996-11-19 | Komatsu Electron Metals Co Ltd | 棒状多結晶シリコンの溶解方法及びその装置 |
JP2000264780A (ja) * | 1999-03-19 | 2000-09-26 | Toshiba Ceramics Co Ltd | 半導体単結晶引き上げ装置における溶融検知方法および装置 |
JP2009132552A (ja) * | 2007-11-29 | 2009-06-18 | Covalent Materials Corp | シリコン単結晶の製造方法 |
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