WO2016017670A1 - 絶縁シート - Google Patents
絶縁シート Download PDFInfo
- Publication number
- WO2016017670A1 WO2016017670A1 PCT/JP2015/071461 JP2015071461W WO2016017670A1 WO 2016017670 A1 WO2016017670 A1 WO 2016017670A1 JP 2015071461 W JP2015071461 W JP 2015071461W WO 2016017670 A1 WO2016017670 A1 WO 2016017670A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- surface layer
- layer
- resin
- insulating sheet
- intermediate layer
- Prior art date
Links
- 238000009413 insulation Methods 0.000 title abstract description 7
- 239000010410 layer Substances 0.000 claims abstract description 102
- 239000002344 surface layer Substances 0.000 claims abstract description 93
- 239000003822 epoxy resin Substances 0.000 claims description 40
- 229920000647 polyepoxide Polymers 0.000 claims description 40
- 239000011256 inorganic filler Substances 0.000 claims description 24
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 24
- 239000000919 ceramic Substances 0.000 claims description 9
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 229920005989 resin Polymers 0.000 description 56
- 239000011347 resin Substances 0.000 description 56
- 239000011342 resin composition Substances 0.000 description 24
- 238000000034 method Methods 0.000 description 18
- 238000001723 curing Methods 0.000 description 9
- 238000007731 hot pressing Methods 0.000 description 9
- 239000002904 solvent Substances 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/03—3 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/44—Number of layers variable across the laminate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/107—Ceramic
- B32B2264/108—Carbon, e.g. graphite particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/304—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/04—Insulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to an insulating sheet.
- an insulating sheet is an adhesive sheet that is used by being bonded to an adherend (for example, an insulating sheet that is interposed between an electronic component and a heat radiating member that releases heat generated by the electronic component to the outside) Etc.) contains an epoxy resin and an inorganic filler.
- Patent Document 1 describes an insulating sheet in which a resin sheet formed of a resin composition containing an epoxy resin and an inorganic filler and a metal layer formed of a metal foil are laminated.
- an object of the present invention is to provide an insulating sheet that is excellent in insulation, adhesiveness, and thermal conductivity.
- the present invention is an insulating sheet having a layer structure of three or more layers, Used by adhering to the adherend, A first surface layer adhered to the adherend; A second surface layer that is a surface opposite to the first surface layer; An intermediate layer in contact with the first surface layer from the inside, The first surface layer contains an epoxy resin and an inorganic filler, The intermediate layer has a higher volume content of inorganic components than the first surface layer, and a higher thermal conductivity than the first surface layer, The first surface layer is an insulating sheet having a thickness smaller than that of the intermediate layer and having a difference in thermal resistance with the intermediate layer in the thickness direction within ⁇ 5 ° C./W.
- the intermediate layer contains an epoxy resin and an inorganic filler.
- the intermediate layer is made of a ceramic plate.
- the ceramic plate is an alumina plate, an aluminum nitride plate, or a silicon nitride plate.
- the schematic sectional drawing of the insulating sheet which concerns on one Embodiment.
- the schematic sectional drawing which shows a coating apparatus.
- the insulating sheet according to the present embodiment is an insulating sheet having a layer structure of three or more layers. Further, the insulating sheet according to the present embodiment is used by being adhered to an adherend. Furthermore, the insulating sheet according to the present embodiment includes a first surface layer that is bonded to the adherend, a second surface layer that is a surface opposite to the first surface layer, and the first surface layer. And an intermediate layer in contact with the inside.
- the first surface layer contains an epoxy resin and an inorganic filler.
- the intermediate layer has a higher volume content of inorganic components than the first surface layer, and a higher thermal conductivity than the first surface layer.
- the first surface layer has a smaller thickness than the intermediate layer, and a difference in thermal resistance with the intermediate layer in the thickness direction is within ⁇ 5 ° C./W.
- the insulating sheet according to the present embodiment will be described using an insulating sheet having a three-layer structure as an example.
- the insulating sheet according to the present embodiment is an insulating sheet that is used by being interposed between an electronic component and a heat radiating member that releases heat generated by the electronic component to the outside.
- the insulating sheet 1 includes a first surface layer 2 on one side, a second surface layer 3 on the other side, the first surface layer 2 and the second surface layer. 3 and an intermediate layer 4 in contact with the first surface layer 2 and the second surface layer 3.
- the first surface layer 2, the second surface layer 3, and the intermediate layer 4 each contain an epoxy resin and an inorganic filler.
- the first surface layer 2 and the second surface layer 3 are layers each having a smaller volume content of an inorganic filler that is an inorganic component than the intermediate layer 4. Since the first surface layer 2 and the second surface layer 3 each have a smaller volume content of the inorganic filler than the intermediate layer 4, the volume of the epoxy resin in the first surface layer 2 and the second surface layer 3. The content can be made larger than the volume content of the epoxy resin in the intermediate layer 4. Moreover, the epoxy resin has excellent adhesiveness unlike the inorganic filler which is an inorganic component. Therefore, the said 1st surface layer 2 and the said 2nd surface layer 3 become the thing excellent in adhesiveness, As a result, the insulating sheet 1 which concerns on this embodiment becomes the thing excellent in adhesiveness.
- the intermediate layer 4 has a volume content of the inorganic filler of preferably 50% by volume or more, and more preferably 50 to 70% by volume.
- Each of the first surface layer 2 and the second surface layer 3 has a volume content of inorganic filler of preferably 60% by volume or less, more preferably 30 to 60% by volume. The volume means the volume at 20 ° C.
- the intermediate layer 4 has higher thermal conductivity than the first surface layer and the second surface layer.
- the intermediate layer 4 has a thermal conductivity of preferably 10 to 50 W / (m ⁇ K), more preferably 10 to 30 W / (m ⁇ K).
- the first surface layer has a thermal conductivity of preferably 10 to 50 W / (m ⁇ K), more preferably 10 to 30 W / (m ⁇ K).
- the second surface layer has a thermal conductivity of preferably 10 to 50 W / (m ⁇ K), more preferably 10 to 30 W / (m ⁇ K).
- the thermal conductivity can be measured by the method defined in JIS A1412-1: 1999.
- the first surface layer 2 and the second surface layer 3 each have a smaller thickness than the intermediate layer 4.
- the insulation sheet 1 which concerns on this embodiment becomes the thing excellent in heat conductivity by such structure.
- the intermediate layer 4 has a thickness of preferably 100 to 300 ⁇ m, more preferably 100 to 200 ⁇ m.
- the first surface layer 2 has a thickness of preferably 30 to 100 ⁇ m, more preferably 30 to 80 ⁇ m.
- the second surface layer 3 has a thickness of preferably 30 to 100 ⁇ m, more preferably 30 to 80 ⁇ m. The thickness can be measured with a micrometer.
- the difference in thermal resistance between the first surface layer 2 and the intermediate layer 4 in the thickness direction is within ⁇ 5 ° C./W.
- the insulating sheet 1 according to the present embodiment such a configuration makes it difficult for heat accumulation to occur.
- the insulating sheet 1 according to the present embodiment is excellent in thermal conductivity.
- the second surface layer 3 preferably has a difference in thermal resistance within ⁇ 5 ° C./W with respect to the intermediate layer 4 in the thickness direction.
- the first surface layer 2 has a thermal resistance of preferably 75 ° C./W or less, more preferably 6 to 20 ° C./W.
- Each of the second surface layers 3 has a thermal resistance of preferably 75 ° C./W or less, more preferably 6 to 20 ° C./W.
- the intermediate layer 4 has a thermal resistance of preferably 75 ° C./W or less, more preferably 6 to 20 ° C./W.
- the first surface layer 2 preferably has a difference in thermal resistance with the intermediate layer 4 in the thickness direction within ⁇ 3 ° C./W.
- the second surface layer 3 preferably has a difference in thermal resistance with the intermediate layer 4 in the thickness direction within ⁇ 3 ° C./W.
- the ratio of the resistance in the thickness direction of the intermediate layer 4 to the thermal resistance in the thickness direction of the first surface layer 2 is preferably 8/10 to 10/8, more preferably 9/10 to 10 /.
- the ratio of the resistance in the thickness direction of the intermediate layer 4 to the thermal resistance in the thickness direction of the second surface layer 3 is preferably 8/10 to 10/8, more preferably 9/10 to 10 /.
- the thermal resistance can be measured by the method defined in JIS A1412-1: 1999.
- the properties (thermal resistance, thickness, thermal conductivity, etc.) of each layer can be measured by polishing the insulating sheet and exposing the layer to be measured.
- the dielectric breakdown voltage (BDV) of the insulating sheet according to the present embodiment is preferably 2 kV or more, and more preferably 3 kV or more. BDV can be measured based on JIS K6911: 1995.
- the insulating sheet according to the present embodiment is used by being interposed between an electronic component such as a power transistor and a heat radiation member such as a heat radiation fin.
- the insulating sheet according to the present embodiment is configured as described above. Next, a manufacturing method for manufacturing the insulating sheet according to the present embodiment will be described.
- a hot pressing step is performed in which the first resin sheet to be the first surface layer 2, the third resin sheet to be the intermediate layer 4, and the second resin sheet to be the second surface layer 3 are hot pressed.
- the insulating sheet according to the present embodiment can be obtained.
- the resin sheet manufacturing method is a resin composition preparation step of preparing a resin composition by mixing an inorganic filler, an epoxy resin, and if necessary, a volatile solvent and other components by a general method, A resin sheet forming step of forming the resin composition by forming the resin composition into a sheet shape.
- a method for preparing the resin composition in the resin composition preparation step for example, a method in which an epoxy resin is dissolved in a volatile solvent and an inorganic filler or other component is added and mixed can be employed. Further, for example, a method of mixing the inorganic filler, the heated and melted epoxy resin and other components with a mixer or the like while heating and melting the epoxy resin can be employed.
- epoxy resin examples include bisphenol A type epoxy resin, modified bisphenol A type epoxy resin, bisphenol F type epoxy resin, modified bisphenol F type epoxy resin, triphenylmethane type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, Various epoxy resins such as dicyclopentadiene type epoxy resin, phenol novolac type epoxy resin, and phenoxy resin can be used alone or in combination of two or more.
- the inorganic filler is not particularly limited as long as it has a thermal conductivity higher than that of the epoxy resin.
- the inorganic filler preferably has an average particle size of 10 to 50 ⁇ m.
- the resin composition can be provided with a thermosetting property by containing a curing agent and a curing accelerator.
- the curing agent is not particularly limited, and examples thereof include amine curing agents such as diaminodiphenyl sulfone, dicyandiamide, diaminodiphenylmethane, and triethylenetetramine, phenol novolac resins, aralkyl-type phenol resins, and dicyclopentadiene-modified phenols.
- Resin, phenolic curing agents such as naphthalene type phenolic resin and bisphenolic phenolic resin, acid anhydrides and the like can be used.
- phenol novolac resin and diaminodiphenyl sulfone are preferable in that it is easy to ensure reliability in electrical characteristics.
- the curing accelerator is not particularly limited, but amine-based curing accelerators such as imidazoles, triphenyl phosphate (TPP), and boron trifluoride monoethylamine are preferable in terms of storage stability.
- the other components are generally used as plastic compounding chemicals such as dispersants, tackifiers, anti-aging agents, antioxidants, processing aids, stabilizers, antifoaming agents, flame retardants, thickeners, pigments, etc.
- plastic compounding chemicals such as dispersants, tackifiers, anti-aging agents, antioxidants, processing aids, stabilizers, antifoaming agents, flame retardants, thickeners, pigments, etc.
- Other components that can be added can be appropriately added as long as the effects of the present invention are not impaired.
- the volatile solvent is used to uniformly disperse components contained in the resin composition. Although it does not specifically limit as said volatile solvent, A boiling point of 120 degrees C or less is preferable at the point that volatilization removal is easy at the time of a resin sheet formation process. Moreover, it is preferable to use methyl ethyl ketone, acetone, toluene, etc. at the point that there is no reactivity with a resin composition.
- the resin sheet forming step for example, when a volatile solvent is used and a resin composition that is liquid at room temperature is used, the resin sheet is formed by a general coating apparatus as shown in FIG. A resin sheet can be formed on the support layer 6 by coating the resin composition 5 to be formed on one side of the support layer 6 and then drying the resin composition 5.
- the method for applying the resin composition 5 is not particularly limited, and a doctor blade method, a coater method, an extrusion molding method, a screen printing method, a metal mask printing method, and the like can be employed.
- a method for drying the resin composition 5 in addition to a drying method by heating at normal pressure, a method of volatilizing and removing a volatile solvent in the resin composition 5 under a vacuum condition may be employed.
- a volatile solvent is contained in the resin composition 5, the resin composition 5 is usually dried and solidified by this drying.
- the temperature at which the resin composition 5 is dried is not particularly limited, but is preferably a temperature not lower than the boiling point of the volatile solvent blended in the resin composition 5 and not higher than the complete curing temperature of the epoxy resin. 130 ° C is suitable.
- the support layer 6 may be, for example, a sheet-like sheet that has been subjected to surface roughening treatment and surface release treatment in addition to surface untreatment. Things can be used.
- the material of the support layer 6 is not particularly limited, and examples thereof include plastics such as polyester, polyolefin, and polyimide, metals such as copper, aluminum, and nickel. Among these, polyethylene terephthalate (PET) is preferable in terms of good peelability, good external formability, and low cost.
- PET polyethylene terephthalate
- the thickness of the support layer 6 is usually 25 to 188 ⁇ m.
- the support layer 6 is fed out on one side and wound up on the other side, and the liquid resin composition 5 is continuously applied and dried between the feeding and winding.
- a so-called “roll-to-roll” method with excellent productivity can also be adopted.
- the resin sheet has a void. Since the voids of the resin sheet can be reduced by hot pressing the resin sheet, the thickness of the resin layer formed after the hot pressing is smaller than that of the resin sheet. Therefore, in consideration of such a change in thickness, for example, by appropriately setting the thickness when the resin composition is applied to the support layer, the thickness of the desired resin layer can be obtained.
- the mass of the resin layer per unit area of the surface where the resin layer is laminated is w
- the thickness of the resin layer is m
- the density of the resin layer is ⁇
- the density ⁇ of the resin layer can be calculated from the sum of the density of each component of the resin layer multiplied by the volume ratio of each component in the resin layer in the resin sheet.
- a resin layer may be separately formed and the mass and volume may be measured to calculate the density ⁇ of the resin layer.
- the mass of the resin layer can be calculated by subtracting the mass of the component that volatilizes during hot pressing from the mass of the resin composition used to form the resin layer. Therefore, by forming the resin sheet so that the mass per unit area after drying is w, the thickness of the resin layer after the hot pressing step in the subsequent stage can be set to the target thickness m.
- the hot pressing step first, the first resin sheet with the support layer and the third resin with the support layer are first brought into contact with the first resin sheet that becomes the first surface layer and the third resin sheet that becomes the intermediate layer.
- a resin sheet is laminated and hot-pressed to join the first resin sheet and the third resin sheet, thereby producing a joined body having support layers on both sides. And the support layer by the side of the 3rd resin sheet is peeled from this joined body.
- the second resin sheet with the support layer and the joined body with the support layer are laminated so that the second resin sheet to be the second surface layer and the third resin sheet to be the intermediate layer are in contact with each other.
- the insulating sheet which has a support layer on both surfaces is produced by pressing and joining a 2nd resin sheet and a 3rd resin sheet. And an insulating sheet can be obtained by peeling a support layer from both surfaces of an insulating sheet.
- the pressure in the hot press is preferably 1 to 20 MPa, more preferably 2 to 15 MPa.
- the conditions of the hot press other than the pressure are not particularly limited, and examples include a temperature of 40 to 160 ° C. and 2 seconds to 10 hours. It is preferably 40 ° C. or higher in terms of further promoting thermal curing, and 160 ° C. or lower in terms of preventing the epoxy resin curing reaction from proceeding excessively so that the electricity cannot be bonded between the media to be insulated. It is preferable that Further, it is more preferable to perform hot pressing under reduced pressure in that voids can be efficiently removed.
- the epoxy resin is preferably in an uncured state, more specifically, a semi-cured state that is not completely cured.
- the semi-cured state is that the calorific value of the epoxy resin which is not cured at all in DSC measurement is 100%, and the calorific value of the epoxy resin after performing the hot pressing step is in the range of 20 to 85%. Is preferred.
- the hot pressing step can be performed by, for example, a press machine equipped with a decompression device, a press machine equipped with a cooling device, and other multistage press machines.
- a specific method for carrying out the heat press there are a method of heating and natural cooling, a method of consistently heating and cooling by heat exchange, a method of separating the heating press and the cooling press and performing a cooling press after the heating press, etc. Illustrated.
- the third resin sheet since the third resin sheet has a high volume content of the inorganic filler, cracking is likely to occur. However, in the manufacturing method, since the third resin sheet is covered with the first resin sheet and the second resin sheet and hot-pressed, the cracked portion of the epoxy resin of the first resin sheet and the second resin sheet is hot-pressed. Can be filled. As a result, an insulating sheet with few cracks can be obtained.
- the insulating sheet of the present embodiment is configured as described above, it has the following advantages.
- the insulating sheet 1 of this embodiment is an insulating sheet having a layer structure of three or more layers. Further, the insulating sheet according to the present embodiment is used by being adhered to an adherend. Furthermore, the insulating sheet according to the present embodiment includes a first surface layer 2 that is bonded to the adherend, a second surface layer 3 that is a surface opposite to the first surface layer 2, and the first surface layer 2. And an intermediate layer 4 in contact with the surface layer 2 from the inside.
- the first surface layer 2 contains an epoxy resin and an inorganic filler.
- the intermediate layer 4 has a higher volume content of inorganic components than the first surface layer 2 and a higher thermal conductivity than the first surface layer 2.
- the first surface layer 2 has a thickness smaller than that of the intermediate layer 4, and a difference in thermal resistance with the intermediate layer 4 in the thickness direction is within ⁇ 5 ° C./W.
- the volume content of the epoxy resin in the first surface layer 2 is set in the intermediate layer 4. It can be made larger than the volume content of the epoxy resin.
- an epoxy resin has the outstanding adhesiveness unlike an inorganic component. Therefore, the first surface layer 2 is excellent in adhesiveness, and as a result, the insulating sheet 1 is excellent in adhesiveness.
- the first surface layer 2 is less prone to cracks due to the smaller volume content of the inorganic component than the intermediate layer 4.
- the first surface layer 2 has excellent insulating properties, and as a result, the insulating sheet 1 has excellent insulating properties.
- the intermediate layer 4 has a volume content of the inorganic filler larger than that of the first surface layer 2.
- an inorganic component is more excellent in heat conductivity than an epoxy resin. Therefore, the intermediate layer 4 is excellent in thermal conductivity.
- the insulating sheet 1 is excellent in thermal conductivity.
- the first surface layer 2 is smaller in thickness than the intermediate layer 4, so that the insulating sheet 1 is excellent in thermal conductivity.
- the first surface layer 2 has a difference in thermal resistance with the intermediate layer 4 in the thickness direction within ⁇ 5 ° C./W. Therefore, in such an insulating sheet 1, it is difficult for heat accumulation to occur. As a result, the insulating sheet 1 is excellent in thermal conductivity. As described above, according to this embodiment, it is possible to provide an insulating sheet that is further excellent in insulation, adhesiveness, and thermal conductivity.
- the intermediate layer 4 contains an epoxy resin and an inorganic filler.
- the insulating sheet according to the present invention is not limited to the above embodiment.
- the insulating sheet according to the present invention is not limited to the above-described effects.
- the insulating sheet according to the present invention can be variously modified without departing from the gist of the present invention.
- the intermediate layer 4 contains an epoxy resin and an inorganic filler, but in the insulating sheet according to the present invention, the intermediate layer may be formed of a ceramic plate.
- the ceramic plate itself has a low mechanical strength
- the insulating sheet according to the present invention has an advantage that the mechanical strength is increased because the ceramic plate is covered with two surface layers.
- the intermediate layer 4 has a thickness of preferably 100 to 300 ⁇ m, more preferably 100 to 200 ⁇ m.
- the first surface layer 2 has a thickness of preferably 30 to 200 ⁇ m, more preferably 50 to 150 ⁇ m.
- the second surface layer 3 has a thickness of preferably 30 to 200 ⁇ m, more preferably 50 to 150 ⁇ m.
- the ceramic plate is preferably an alumina plate, an aluminum nitride plate, or a silicon nitride plate, and an aluminum nitride plate is particularly preferable from the viewpoint of excellent heat dissipation and low cost.
- 1 insulating sheet
- 2 first surface layer
- 3 second surface layer
- 4 intermediate layer
- 5 resin composition
- 6 support layer
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Abstract
Description
被着体に接着されて用いられ、
前記被着体に接着される第1表面層と、
前記第1表面層とは反対側の面となる第2表面層と、
前記第1表面層に内側から接する中間層とを備えており、
前記第1表面層が、エポキシ樹脂と無機フィラーとを含有し、
前記中間層は、前記第1表面層よりも無機成分の体積含有率が高く、前記第1表面層よりも熱伝導率が高く、
前記第1表面層は、前記中間層よりも厚みが小さく、厚み方向での前記中間層との熱抵抗の差が±5℃/W以内である、絶縁シートにある。
前記第1表面層2および前記第2表面層3は、それぞれ前記中間層4よりも無機フィラーの体積含有率が小さいので、前記第1表面層2および前記第2表面層3におけるエポキシ樹脂の体積含有率を前記中間層4におけるエポキシ樹脂の体積含有率よりも大きくすることができる。また、エポキシ樹脂は、無機成分たる無機フィラーと異なり優れた接着性を有する。よって、前記第1表面層2および前記第2表面層3は、接着性に優れたものとなり、その結果、本実施形態に係る絶縁シート1は、接着性に優れたものとなる。
また、前記第1表面層および前記第2表面層は、それぞれ前記中間層よりも無機成分たる無機フィラーの体積含有率が小さいことにより、クラックが生じ難い。よって、前記第1表面層2および前記第2表面層3は、絶縁性に優れたものとなり、その結果、本実施形態に係る絶縁シート1は、絶縁性に優れたものとなる。
前記中間層4は、無機フィラーの体積含有率が、好ましくは50体積%以上であり、より好ましくは50~70体積%である。
前記第1表面層2および前記第2表面層3の各層は、無機フィラーの体積含有率が、好ましくは60体積%以下であり、より好ましくは30~60体積%である。
なお、体積は20℃における体積を意味する。
前記中間層4は、熱伝導率が、好ましくは10~50W/(m・K)であり、より好ましくは10~30W/(m・K)である。
前記第1表面層は、熱伝導率が、好ましくは10~50W/(m・K)であり、より好ましくは10~30W/(m・K)である。また、前記第2表面層は、熱伝導率が、好ましくは10~50W/(m・K)であり、より好ましくは10~30W/(m・K)である。
なお、熱伝導率は、JIS A1412-1:1999に規定されている方法により測定することができる。
前記中間層4は、厚みが、好ましくは100~300μmであり、より好ましくは100~200μmである。
前記第1表面層2は、厚みが、好ましくは30~100μmであり、より好ましくは30~80μmである。また、前記第2表面層3は、厚みが、好ましくは30~100μmであり、より好ましくは30~80μmである。
なお、厚みは、マイクロメーターにより測定することができる。
前記第2表面層3は、厚み方向での前記中間層4との熱抵抗の差が±5℃/W以内であることが好ましい。
前記第1表面層2は、熱抵抗が、好ましくは75℃/W以下であり、より好ましくは6~20℃/Wである。前記第2表面層3は、それぞれ熱抵抗が、好ましくは75℃/W以下であり、より好ましくは6~20℃/Wである。前記中間層4は、熱抵抗が、好ましくは75℃/W以下であり、より好ましくは6~20℃/Wである。
前記第1表面層2は、厚み方向での前記中間層4との熱抵抗の差が±3℃/W以内であることが好ましい。前記第2表面層3は、厚み方向での前記中間層4との熱抵抗の差が±3℃/W以内であることが好ましい。
前記第1表面層2の厚み方向での熱抵抗に対する、前記中間層4の厚み方向での抵抗の比が、好ましくは8/10~10/8であり、より好ましくは9/10~10/9である。前記第2表面層3の厚み方向での熱抵抗に対する、前記中間層4の厚み方向での抵抗の比が、好ましくは8/10~10/8であり、より好ましくは9/10~10/9である。
なお、熱抵抗は、JIS A1412-1:1999に規定されている方法により測定することができる。
各層の性質(熱抵抗、厚み、熱伝導率等)は、絶縁シートを研磨して測定対象の層を露出させることで測定することができる。
BDVは、JIS K6911:1995に基づいて測定することができる。
樹脂シートの製造方法は、無機フィラーと、エポキシ樹脂と、必要に応じて揮発性溶媒とその他の成分とを一般的な方法で混合して、樹脂組成物を調製する樹脂組成物調製工程と、該樹脂組成物をシート状に成形して樹脂シートを形成する樹脂シート形成工程とを備えている。
前記無機フィラーは、平均粒子径が10~50μmであることが好ましい。
前記硬化剤としては、特に限定されるものではないが、例えば、ジアミノジフェニルスルホン、ジシアンジアミド、ジアミノジフェニルメタン、トリエチレンテトラミンなどのアミン系硬化剤、フェノールノボラック樹脂、アラルキル型フェノール樹脂、ジシクロペンタジエン変性フェノール樹脂、ナフタレン型フェノール樹脂、ビスフェノール系フェノール樹脂などのフェノール系硬化剤、酸無水物などを用いることができる。
中でも、電気特性における信頼性を確保し易い点において、フェノールノボラック樹脂、ジアミノジフェニルスルホンが好適である。
前記硬化促進剤としては、特に限定されるものではないが、イミダゾール類や、トリフェニルフォスフェイト(TPP)、三フッ化ホウ素モノエチルアミンなどのアミン系硬化促進剤が保存性などにおいて好適である。
前記揮発性溶媒としては、特に限定されないが、樹脂シート形成工程時において揮発除去が容易であるという点で、沸点が120℃以下のものが好ましい。また、樹脂組成物との反応性がないという点で、メチルエチルケトン、アセトン、トルエン等を用いることが好ましい。
w=m×ρ (1)
また、樹脂層の密度ρは、樹脂シートにおいて、樹脂層の各成分の密度に、樹脂層における各成分の体積割合を乗じたものの和から算出することができる。若しくは、別途樹脂層を1層形成し、斯かる質量と体積を測定して、樹脂層の密度ρを算出しても良い。
更に、樹脂層の質量は、該樹脂層の形成に使用された樹脂組成物の質量から、熱プレス時に揮発する成分の質量分を引いて算出することができる。
従って、乾燥後の単位面積当たりの質量がwとなるように樹脂シートを形成させることにより、後段における熱プレス工程後の樹脂層の厚さを目的とする厚さmとすることができる。
そして、この接合体から第3樹脂シート側の支持層を剥離させる。
次に、第2表面層となる第2樹脂シートと、中間層となる第3樹脂シートとが接するように、支持層付きの第2樹脂シートと、支持層付きの接合体とを積層し熱プレスして、第2樹脂シートと第3樹脂シートとを接合することにより、両面に支持層を有する絶縁シートを作製する。
そして、絶縁シートの両面から支持層を剥離することにより、絶縁シートを得ることができる。
また、ボイドを効率良く取り除き得るという点で、減圧下にて熱プレスを行うことがより好ましい。
また、前記熱プレスを実施する具体的方法としては、加熱プレスして自然冷却する方法、熱交換による加熱冷却一貫プレス方法、加熱プレスと冷却プレスとを分け加熱プレス後冷却プレスを行う方法等が例示される。
斯かる絶縁シート1において、前記第1表面層2は、前記中間層4よりも無機成分の体積含有率が小さいので、前記第1表面層2におけるエポキシ樹脂の体積含有率を前記中間層4におけるエポキシ樹脂の体積含有率よりも大きくすることができる。また、エポキシ樹脂は、無機成分と異なり優れた接着性を有する。よって、前記第1表面層2は、接着性に優れたものとなり、その結果、斯かる絶縁シート1は、接着性に優れたものとなる。
また、前記第1表面層2は、前記中間層4よりも無機成分の体積含有率が小さいことにより、クラックが生じ難い。よって、前記第1表面層2は絶縁性に優れたものとなり、その結果、斯かる絶縁シート1は、絶縁性に優れたものとなる。
また、斯かる絶縁シート1において、前記中間層4は、前記第1表面層2よりも無機フィラーの体積含有率が大きい。また、無機成分はエポキシ樹脂よりも熱伝導性に優れる。よって、前記中間層4は、熱伝導性に優れたものとなる。その結果、斯かる絶縁シート1は、熱伝導性に優れたものとなる。
さらに、斯かる絶縁シート1において、前記第1表面層2は、前記中間層4よりも厚みが小さいので、斯かる絶縁シート1は、熱伝導性に優れたものとなる。
さらに、斯かる絶縁シート1において、前記第1表面層2は、厚み方向での前記中間層4との熱抵抗の差が±5℃/W以内である。そのため、斯かる絶縁シート1では、熱溜まりが生じ難くなる。その結果、斯かる絶縁シート1は、熱伝導性に優れたものとなる。
以上のように、本実施形態によれば、絶縁性、接着性、及び、熱伝導性がより一層優れた絶縁シートを提供し得る。
この場合、前記中間層4は、厚みが、好ましくは100~300μmであり、より好ましくは100~200μmである。前記第1表面層2は、厚みが、好ましくは30~200μmであり、より好ましくは50~150μmである。また、前記第2表面層3は、厚みが、好ましくは30~200μmであり、より好ましくは50~150μmである。
Claims (4)
- 3層以上の層構造となっている絶縁シートであって、
被着体に接着されて用いられ、
前記被着体に接着される第1表面層と、
前記第1表面層とは反対側の面となる第2表面層と、
前記第1表面層に内側から接する中間層とを備えており、
前記第1表面層が、エポキシ樹脂と無機フィラーとを含有し、
前記中間層は、前記第1表面層よりも無機成分の体積含有率が高く、前記第1表面層よりも熱伝導率が高く、
前記第1表面層は、前記中間層よりも厚みが小さく、厚み方向での前記中間層との熱抵抗の差が±5℃/W以内である、絶縁シート。 - 前記中間層が、エポキシ樹脂と無機フィラーとを含有する、請求項1に記載の絶縁シート。
- 前記中間層が、セラミックプレートで構成されている、請求項1に記載の絶縁シート。
- 前記セラミックプレートが、アルミナプレート、窒化アルミニウムプレート、又は、窒化ケイ素プレートである、請求項3に記載の絶縁シート。
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JP2018148125A (ja) * | 2017-03-08 | 2018-09-20 | Tdk株式会社 | 電子機器及び電子機器の製造方法 |
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