WO2015146655A1 - Film réfléchissant de lumière - Google Patents
Film réfléchissant de lumière Download PDFInfo
- Publication number
- WO2015146655A1 WO2015146655A1 PCT/JP2015/057588 JP2015057588W WO2015146655A1 WO 2015146655 A1 WO2015146655 A1 WO 2015146655A1 JP 2015057588 W JP2015057588 W JP 2015057588W WO 2015146655 A1 WO2015146655 A1 WO 2015146655A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- resin
- film
- light reflecting
- light
- Prior art date
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/40—Solar thermal energy, e.g. solar towers
Definitions
- the present invention relates to a light reflecting film.
- Solar power generation is a power generation method that collects sunlight and uses it as a heat source. Compared with solar cells, solar power generation has the advantage of being able to generate electricity regardless of day and night by storing heat, and the cost of manufacturing and maintenance is low. It is considered that power generation efficiency is high.
- a condensing device that reflects sunlight by a reflector (mirror) and condenses it in one place is used. Since the reflector is exposed to ultraviolet rays, heat, wind and rain, sandstorms, and the like caused by sunlight, conventionally, a glass light reflector has been used from the viewpoint of durability. However, the glass light reflector has problems such as being heavy, large in volume, expensive in transportation, difficult to install, and easy to break.
- the conventional method has a problem that the manufacturing cost increases in order to improve the smoothness of the surface of the supporting substrate.
- the light reflecting film is light, flexible, and easy to handle. There was a problem that the advantages could not be fully utilized.
- an object of the present invention is to provide a light reflecting film capable of making the metal reflecting layer sufficiently smooth in the light reflector.
- the present inventor conducted intensive research to solve the above problems. As a result, the thickness of the resin support layer provided on the support base side of the metal reflective layer (the side opposite to the light incident side) and the thickness of the adhesive layer are set within predetermined ranges, respectively. The inventors have found that the smoothness of the metal reflective layer can be sufficiently secured without increasing the smoothness, and have completed the present invention.
- a resin support layer An adhesive layer provided on one surface side of the resin support layer; A metal reflective layer provided on the other surface side of the resin support layer; A light reflecting film comprising: The resin support layer has a thickness of 200 to 1000 ⁇ m; A light reflecting film, wherein the adhesive layer has a thickness of 30 to 200 ⁇ m. 2.
- the light reflective film according to 1 or 2 wherein the pressure-sensitive adhesive layer has a shear storage elastic modulus G ′ of 1 ⁇ 10 7 Pa or less. 4).
- 10 is a light reflection film
- 11 is a resin support layer
- 12 is an adhesion layer
- 13 is a metal reflection layer
- 14 is a corrosion preventing layer
- 15 is an ultraviolet absorbing layer
- 16 is an adhesive layer
- 17 is an acrylic layer
- 18 is a hard coat layer.
- X to Y indicating a range means “X or more and Y or less”.
- measurements such as operation and physical properties are performed under conditions of room temperature (20 to 25 ° C.) / Relative humidity 40 to 50% RH.
- a light reflecting film includes a resin support layer, an adhesive layer provided on one surface side of the resin support layer, and a metal reflection layer provided on the other surface side of the resin support layer.
- the thickness of the resin support layer is 200 to 1000 ⁇ m, and the thickness of the adhesive layer is 30 to 200 ⁇ m.
- the light reflecting film of the present embodiment has the above-described configuration, so that the smoothness of the metal reflecting layer can be made sufficient when the light reflecting film is attached to a support substrate to form a light reflector.
- the mechanism by which the light reflecting film of the present embodiment can exert such an effect is not clear, the present inventor presumes as follows.
- the present invention is not limited by the following mechanism.
- Conventional light-reflecting films have been designed so that the thickness of each layer is as thin as possible within the range in which the function of each layer can be fully exerted, mainly from a cost standpoint.
- the unevenness of the surface of the supporting substrate to which the film is bonded affects the smoothness of the metal reflecting layer, so that the smoothness of the surface of the supporting substrate can be increased or concentrated.
- an operation such as pasting a light reflecting film on a supporting substrate in advance was necessary prior to mounting in the apparatus.
- a resin base material layer and an adhesive layer are sequentially provided on the support base material side (the side opposite to the light incident side) of the metal reflective layer, and the thickness of these two layers is conventionally increased. Is also characterized by its thickening. Increasing the thickness of the resin base layer suppresses the impact on the smoothness of the metal reflective layer due to the unevenness of the surface of the support base, and increasing the thickness of the adhesive layer alleviates the unevenness of the surface of the support base, thereby reflecting light. It is considered that the smoothness of the metal reflection layer can be made sufficient in the body. Therefore, the light reflecting film of this embodiment is useful in that the smoothness of the metal reflecting layer can be made sufficiently even when the surface of the supporting substrate is not sufficiently smooth.
- the surface roughness Ra of the surface of the supporting substrate to which the light reflecting film of this embodiment is applied is preferably 0.2 ⁇ m or more, more preferably 0.3 ⁇ m or more, and further preferably 0.4 ⁇ m or more.
- the effects of the present invention are further exhibited.
- FIG. 1 is a schematic cross-sectional view showing a light reflecting film according to an embodiment of the present invention.
- 1 includes a resin support layer 11, an adhesive layer 12 provided on one surface side of the resin support layer 11, and a metal reflection layer 13 provided on the other surface side of the resin support layer 11. And have. That is, the metal reflective layer 13, the resin support layer 11, and the adhesive layer 12 are sequentially laminated from the light incident side.
- the light reflecting film 10 of FIG. 1 has a corrosion preventing layer 14 between the metal reflecting layer 13 and the resin support layer 11 in addition to the above layers. Furthermore, functional layers such as an ultraviolet absorbing layer 15, an adhesive layer 16, an acrylic layer 17, and a hard coat layer 18 are laminated in this order from the metal reflecting layer 13 side to the light incident side from the metal reflecting layer 13.
- the thickness of the entire light reflecting film is not particularly limited, but is preferably 250 to 2000 ⁇ m, more preferably 300 to 1500 ⁇ m, and further preferably 500 to 1000 ⁇ m. If the total thickness is 250 ⁇ m or more, the self-supporting property is high and the support can be used even if the rigidity is low. On the other hand, when the total thickness is 2000 ⁇ m or less, winding with a small-diameter core is possible during production, and production efficiency is increased.
- each component of the light reflection film of this form is demonstrated in detail.
- the resin support layer has a function as a base material when the layers are laminated in the production of the light reflecting film.
- the light reflecting film of this embodiment is characterized in that it essentially includes a resin support layer having a thickness of 200 to 1000 ⁇ m.
- the thickness of the resin support layer is preferably 250 to 600 ⁇ m, and more preferably 300 to 400 ⁇ m.
- the thickness of the resin support layer is less than 200 ⁇ m, the unevenness of the support base material in the light reflector affects the metal reflection layer, and the smoothness of the metal reflection layer may be reduced.
- the thickness of the resin support layer is more than 1000 ⁇ m, the flexibility of the light reflecting film is impaired, and roll-to-roll winding may be difficult.
- the resin material constituting the resin support layer is not particularly limited, and various conventionally known materials can be appropriately employed.
- resin materials include polycarbonate, polyarylate, polysulfone, polyethersulfone, polyethylene terephthalate, polyethylene naphthalate, polyester such as modified polyester, polyolefin such as polyethylene and polypropylene, cellulose, diacetylcellulose, triacetylcellulose, Cellulose esters such as cellulose acetate propionate and cellulose acetate butyrate, polyvinyl chloride (soft polyvinyl chloride, hard polyvinyl chloride), polyvinylidene chloride, polyvinyl alcohol, ethylene-vinyl alcohol copolymer, polystyrene, syndiotactic Polystyrene, styrene / acrylonitrile copolymer, polyacetal, epoxy resin, phenol resin, Examples include olefin polymers, polynorbornene, polymethylpentene, poly
- the Young's modulus of the resin support layer is preferably 3 GPa or more, and more preferably 3.5 GPa or more.
- the upper limit of the Young's modulus is not particularly limited, but is preferably 6 GPa or less, and more preferably 5.5 GPa or less from the viewpoint of maintaining the flexibility of the light reflecting film. In this specification, the value measured by the method described in the examples is adopted as the Young's modulus.
- the resin having such Young's modulus is not particularly limited, but is hard polyvinyl chloride, polystyrene, styrene / acrylonitrile copolymer, polyacetal, epoxy resin, phenol resin, methacrylic resin such as polymethyl methacrylate, polyethylene terephthalate, polyethylene Examples thereof include polyesters such as naphthalate and modified polyester. Of these, polyethylene terephthalate, epoxy resin, and phenol resin are more preferable.
- the resin support layer may be a film manufactured by melt casting film formation or a film manufactured by solution casting film formation.
- the resin substrate may be an unstretched film or a stretched film.
- An adhesion layer is a layer provided in order to stick a light reflection film on the support base material in a light reflector.
- the light reflecting film of this embodiment is characterized in that an adhesive layer having a thickness of 30 to 200 ⁇ m is essential on one surface side of the resin support layer.
- the thickness of the adhesive layer is preferably 100 to 200 ⁇ m, and more preferably 150 to 200 ⁇ m. If the thickness of the adhesive layer is less than 30 ⁇ m, the unevenness of the support material in the light reflector cannot be sufficiently relaxed, and the smoothness of the metal reflective layer may be reduced. On the other hand, if the thickness of the pressure-sensitive adhesive layer exceeds 200 ⁇ m, it becomes difficult to sufficiently dry the pressure-sensitive adhesive layer in the production process, which may reduce the production efficiency.
- the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer is not particularly limited, and for example, known pressure-sensitive adhesives such as a dry laminating agent, a wet laminating agent, a heat sealing agent, and a hot melt agent can be appropriately employed.
- a material for the pressure-sensitive adhesive for example, a polyester resin, a polyurethane resin, a polyvinyl acetate resin, an acrylic resin, a nitrile rubber, or a combination of these materials is used.
- the adhesive layer preferably has a shear storage elastic modulus G ′ at 23 ° C. of 1 ⁇ 10 7 Pa or less, and 1.2 ⁇ 10 6. More preferably, it is Pa or less.
- the lower limit value of the shear storage modulus G ′ is not particularly limited, but is preferably 1 ⁇ 10 4 Pa or more and more preferably 1 ⁇ 10 5 Pa or more from the viewpoint of tackiness.
- the value measured by the method as described in an Example shall be employ
- the shear storage modulus G ′ of the pressure-sensitive adhesive layer can be easily adjusted by those skilled in the art. Specifically, the shear storage modulus G ′ is desired by adjusting the glass transition point (Tg), molecular weight (weight average molecular weight, molecular weight distribution) of the resin constituting the pressure-sensitive adhesive, and the type and blending amount of the curing agent. It is possible to control to the value of.
- Tg glass transition point
- molecular weight weight average molecular weight, molecular weight distribution
- the adhesive layer is formed by laminating on the resin support layer.
- the laminating method is not particularly limited, and for example, it is preferable to carry out the roll method continuously from the viewpoint of economy and productivity.
- the metal reflection layer is a layer made of a metal having a function of reflecting sunlight.
- a metal reflective layer is provided on the other surface side of the resin support layer (the surface side opposite to the surface side on which the pressure-sensitive adhesive layer is provided).
- the surface reflectance of the metal reflective layer is preferably 80% or more, more preferably 90% or more.
- the metal reflective layer is made of aluminum (Al), silver (Ag), chromium (Cr), copper (Cu), nickel (Ni), titanium (Ti), magnesium (Mg), rhodium (Rh), platinum (Pt) and It is preferably formed of a material containing at least one element selected from the element group consisting of gold (Au).
- aluminum (Al) or silver (Ag) is a main component from viewpoints of a reflectance, corrosion resistance, etc., and it is more preferable to consist of silver (Ag).
- the main component means that the content of a certain atom exceeds 50 atomic% when the total amount of metal atoms contained in the metal reflective layer is 100 atomic%.
- the metal reflective layer may be composed of two or more layers of the above metal thin film. Further, a layer made of a metal oxide such as SiO 2 or TiO 2 may be provided in this order on the metal reflective layer to further improve the reflectance.
- a metal oxide such as SiO 2 or TiO 2
- the thickness of the metal reflective layer is preferably 10 to 200 nm, more preferably 30 to 150 nm from the viewpoint of reflectivity and the like.
- the formation method of the metal reflective layer is not particularly limited, and both a wet method and a dry method can be used.
- the wet method is a general term for a plating method, and is a method of forming a film by depositing a metal from a solution. Specific examples include silver mirror reaction.
- the dry method is a general term for a vacuum film forming method, and specifically includes a resistance heating vacuum deposition method, an electron beam heating vacuum deposition method, an ion plating method, an ion beam assisted vacuum deposition method, and a sputtering method. and so on. In the manufacturing method of the light reflection film of this form, it is preferable to form a metal reflection layer by a vapor deposition method.
- the light reflective film of the present embodiment includes, as necessary, a hard coat layer, an acrylic layer, an adhesive layer, an ultraviolet absorption layer, a corrosion prevention layer, a gas barrier layer, You may have other functional layers, such as an anchor layer and a peeling layer. Hereinafter, these layers will be described.
- the hard coat layer is preferably provided on the outermost layer on the light incident side.
- the “hard coat layer” means a layer having a pencil hardness of H or more according to JIS K 5600-5-4: 1999.
- the hard coat layer functions as a surface protective layer for enhancing the scratch resistance of the optical reflective film.
- the material for forming the hard coat layer is not particularly limited as long as transparency, weather resistance, hardness, mechanical strength, and the like can be obtained.
- a resin curable by electron beam or ultraviolet irradiation, a thermosetting resin, or the like can be used.
- a thermosetting silicone hard coat composed of a partially hydrolyzed oligomer of an alkoxysilane compound, a thermosetting polysiloxane resin.
- a hard coat made of, an ultraviolet curable acrylic hard coat made of an acrylic compound having an unsaturated group, and a thermosetting inorganic material are preferred.
- the hard coat layer preferably contains an antioxidant or an ultraviolet absorber.
- Specific materials that can be used for the hard coat layer include an aqueous colloidal silica-containing acrylic resin (Japanese Patent Laid-Open No. 2005-66824), a polyurethane resin composition (Japanese Patent Laid-Open No. 2005-110918), and an aqueous silicone compound.
- Resin film used as binder Japanese Patent Laid-Open No. 2004-142161
- photocatalytic oxide-containing silica film or alumina such as titanium oxide
- photocatalytic film such as titanium oxide or niobium oxide having a high aspect ratio
- the hard-coat layer of this form is comprised from an inorganic substance.
- thermosetting silicone hard coat a partially hydrolyzed oligomer of an alkoxysilane compound synthesized by a known method can be used.
- An example of the synthesis method is as follows. First, tetramethoxysilane or tetraethoxysilane is used as an alkoxysilane compound, and a predetermined amount of water is added in the presence of an acid catalyst such as hydrochloric acid or nitric acid to remove by-produced alcohol from room temperature to 80 ° C. React in range.
- an acid catalyst such as hydrochloric acid or nitric acid
- the alkoxysilane is hydrolyzed and further subjected to a condensation reaction to obtain a partially hydrolyzed oligomer of an alkoxysilane compound having two or more silanol groups or alkoxy groups in one molecule and an average polymerization degree of 4 to 8. It is done.
- a curing catalyst such as acetic acid or maleic acid is added to this and dissolved in an alcohol or glycol ether organic solvent to obtain a thermosetting silicone hard coat liquid.
- coating method for example, gravure coat method, reverse coat method, die coat method etc.
- a hard-coat layer is formed by heat-curing at the temperature of the range of 80-140 degreeC.
- an acrylic compound having an unsaturated group includes, for example, pentaerythritol di (meth) acrylate, diethylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethyloltetra (A polyfunctional (meth) acrylate mixture such as (meth) acrylate can be used, and a photopolymerization initiator such as benzoin, benzoin methyl ether, and benzophenone is blended and used. And this is apply
- the hard coat layer is made of an inorganic material formed by a dry method
- silicon oxide, aluminum oxide, silicon nitride, aluminum nitride, lanthanum oxide, lanthanum nitride, or the like can be formed by vacuum film formation.
- the vacuum film forming method include a resistance heating vacuum deposition method, an electron beam heating vacuum deposition method, an ion plating method, an ion beam assisted vacuum deposition method, and a sputtering method.
- the hard coat layer is made of an inorganic material formed by a wet method, it is preferably made of a film obtained by applying polysilazane to a film and then heat-curing it.
- the hard coat precursor contains polysilazane, for example, after applying a solution of polysilazane represented by the following general formula (1) and an organic solvent, if necessary, the solvent is evaporated.
- a polysilazane layer having a thickness of 0.05 to 3.0 ⁇ m is formed on the surface of the light reflecting film.
- a glass-like transparent hard coat film is formed on the surface of the light reflecting film.
- R 1 , R 2 , and R 3 each independently represent a hydrogen atom, a substituted or unsubstituted alkyl group, an aryl group, a vinyl group, or a (trialkoxysilyl) alkyl group.
- a group consisting of a hydrogen atom, methyl, ethyl, propyl, iso-propyl, butyl, iso-butyl, tert-butyl, phenyl, vinyl, 3- (triethoxysilyl) propyl, 3- (trimethoxysilyl) propyl Is preferably a group selected from:
- n is an integer, and n is determined so that the polysilazane has a number average molecular weight in the range of 150 to 150,000 g / mol.
- catalysts preferably basic catalysts, in particular N, N-diethylethanolamine, N, N-dimethylethanolamine, triethanolamine, triethylamine, 3-morpholinopropylamine, N-heterocyclic compounds are used.
- the catalyst concentration is usually 0.1 to 10 mol%, preferably 0.5 to 7 mol%, based on polysilazane.
- a solution containing perhydropolysilazane in which all of R 1 , R 2 and R 3 in the general formula (1) are hydrogen atoms is used.
- At least one polysilazane represented by the following general formula (2) is used.
- R 1 , R 2 , R 3 , R 4 , R 5 and R 6 are each independently a hydrogen atom, a substituted or unsubstituted alkyl group, an aryl group, a vinyl group, Represents a (trialkoxysilyl) alkyl group.
- n and p are integers, and in particular, n is determined so that polysilazane has a number average molecular weight in the range of 150 to 150,000 g / mol.
- R 1, R 3 and R 6 is a hydrogen atom and R 2, R 4 and R 5 are methyl; R 1, R 3 and R 6 is a hydrogen atom and R 2, R A compound in which 4 is methyl and R 5 is vinyl; a compound in which R 1 , R 3 , R 4 and R 6 are hydrogen atoms and R 2 and R 5 are methyl is preferable.
- At least one polysilazane represented by the following general formula (3) is used.
- R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 and R 9 are each independently a hydrogen atom, substituted or unsubstituted
- An alkyl group, an aryl group, a vinyl group, or a (trialkoxysilyl) alkyl group is represented.
- n, p and q are integers, and in particular, n is determined so that the polysilazane has a number average molecular weight in the range of 150 to 150,000 g / mol.
- R 1 , R 3 and R 6 are hydrogen atoms
- R 2 , R 4 , R 5 and R 8 are methyl
- R 9 is (triethoxysilyl) propyl
- R 7 is alkyl.
- the compound which is hydrogen is preferable.
- the concentration of polysilazane in the polysilazane solution is generally 1 to 80% by mass, preferably 5 to 50% by mass, and more preferably 10 to 40% by mass.
- an organic solvent which does not contain water or a reactive group (for example, a hydroxy group or an amine group) and is inert to the polysilazane is suitable.
- organic solvents include aliphatic or aromatic hydrocarbons, halogen hydrocarbons, esters (eg, ethyl acetate, butyl acetate), ketones (eg, acetone, methyl ethyl ketone), ethers (eg, tetrahydrofuran, dibutyl ether). , Mono- or polyalkylene glycol dialkyl ethers (diglymes), or a mixed solvent thereof.
- the polysilazane solution may contain a known binder.
- the binder include cellulose ether, cellulose ester (for example, ethyl cellulose, nitrocellulose, cellulose acetate, cellulose acetobutyrate), natural resin (for example, rubber, rosin resin), synthetic resin (for example, polymerization resin, condensation resin). ) And the like.
- the synthetic resin include aminoplasts (particularly urea resins and melamine formaldehyde resins), alkyd resins, acrylic resins, polyesters or modified polyesters, epoxides, polyisocyanates or blocked polyisocyanates, and polysiloxanes.
- the polysilazane solution includes additives for controlling the viscosity of the solution, wetting of the substrate, film-forming properties, lubricating action, and exhaust properties, or inorganic nanoparticles such as SiO 2 , TiO 2 , ZnO, ZrO 2 or Al 2 O 3 may be added.
- the thickness of the hard coat layer is preferably in the range of 10 nm to 3 ⁇ m.
- the polysilazane hard coat layer can also be used as an oxygen / water vapor barrier layer.
- the hard coat layer is preferably flexible and does not warp. On the surface of the hard coat layer, a dense cross-linked structure may be formed. At this time, the film may bend or bend easily and may be cracked, making handling difficult. In such a case, it is preferable to design the hard coat layer so as to obtain flexibility and flatness by adjusting the amount of the inorganic substance in the composition.
- an acrylic layer may be provided on the light incident surface side of the metal reflecting layer.
- the acrylic layer has a function of preventing deterioration or discoloration of the layer provided in the lower layer (that is, the lower layer of the acrylic layer viewed from the light incident side) or film peeling.
- it can function as a layer that protects the metal reflective layer from external factors such as water, chlorine, or sulfur in the air.
- the resin support layer etc. which are provided in the lower layer can be functioned as a layer which protects from an ultraviolet-ray by containing a ultraviolet absorber or using resin etc. which have an ultraviolet-absorbing group.
- the thickness of the acrylic layer is not particularly limited, but is preferably 20 to 100 ⁇ m, and more preferably 30 to 80 ⁇ m.
- the thickness of the acrylic layer is 20 ⁇ m or more, moisture permeation is suppressed, so that a sufficient amount of an ultraviolet absorber can be contained, and a desired ultraviolet absorption effect can be obtained.
- the absorption amount of the sunlight in an acrylic layer can be suppressed as the thickness of an acrylic layer is 100 micrometers or less, while being able to suppress that a reflectance falls, maintaining the softness
- the acrylic layer according to this embodiment mainly includes an acrylic resin as a base resin, and may further include additives such as an ultraviolet absorber and an antioxidant.
- an ultraviolet absorber A benzophenone type, a benzotriazole type, a phenyl salicylate type, a triazine type, a hindered amine type, a benzoate type etc. are mentioned as an organic type, Moreover, a titanium oxide, a zinc oxide is mentioned as an inorganic type. , Cerium oxide, iron oxide and the like. More specifically, compounds exemplified as ultraviolet absorbers contained in the ultraviolet absorbing layer described later can be mentioned. In order to reduce the problem of bleeding out when a large amount of the ultraviolet absorber is contained, it is preferable to use a high molecular weight ultraviolet absorber having a weight average molecular weight of 1000 or more. The weight average molecular weight is preferably 1000 or more and 3000 or less. In addition, in this specification, the value measured on condition of the following measurement using a gel permeation chromatography (GPC) is employ
- GPC gel permeation chromatography
- the content of the ultraviolet absorber is preferably 0.1 to 20% by mass, more preferably 1 to 10% by mass with respect to 100% by mass of the total amount of the acrylic resin contained in the acrylic layer. More preferably, it is ⁇ 8% by mass.
- an organic antioxidant such as a hindered amine antioxidant, a hindered phenol antioxidant, and a phosphoric acid antioxidant.
- the content of the antioxidant is preferably 0.1 to 20% by mass, more preferably 1 to 10% by mass, with respect to 100% by mass of the total amount of the acrylic resin contained in the acrylic layer. More preferably, it is ⁇ 6% by mass.
- the adhesive layer is not particularly limited as long as it has a function of improving the adhesion between the layers.
- the adhesive layer may consist of only one layer or may consist of a plurality of layers.
- the thickness of the adhesive layer is preferably 1 to 10 ⁇ m, and more preferably 3 to 8 ⁇ m, from the viewpoints of adhesion, smoothness, reflectance of the reflecting material, and the like.
- the material is not particularly limited, and a single material such as polyester resin, polyurethane resin, acrylic resin, melamine resin, epoxy resin, polyamide resin, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer resin, etc. Alternatively, these mixed resins can be used.
- a mixed resin of polyester resin and melamine resin or a mixed resin of polyester resin and urethane resin is preferable from the viewpoint of weather resistance, and if it is a thermosetting resin in which a curing agent such as isocyanate is mixed with an acrylic resin. More preferred.
- a method for forming the adhesive layer conventionally known coating methods such as a gravure coating method, a reverse coating method, and a die coating method can be used.
- the adhesive layer is made of a metal oxide
- a metal oxide for example, silicon oxide, aluminum oxide, silicon nitride, aluminum nitride, lanthanum oxide, lanthanum nitride, etc.
- the vacuum film forming method include a resistance heating vacuum deposition method, an electron beam heating vacuum deposition method, an ion plating method, an ion beam assisted vacuum deposition method, and a sputtering method.
- the ultraviolet absorbing layer is a layer containing an ultraviolet absorber for the purpose of preventing deterioration of the light reflecting film caused by sunlight or ultraviolet rays.
- the ultraviolet absorbing layer is preferably provided between the metal reflective layer and the hard coat layer.
- the thickness of the ultraviolet absorbing layer is preferably 20 ⁇ m or more, more preferably 20 to 100 ⁇ m, from the viewpoint of ultraviolet absorbing power.
- UV absorbers examples include benzophenone, benzotriazole, phenyl salicylate, hindered amine, triazine, and benzoate as organic materials, and inorganic materials such as titanium oxide, zinc oxide, cerium oxide, and iron oxide. Etc. Especially, it is preferable to use a triazine type ultraviolet absorber.
- benzophenone ultraviolet absorber examples include 2,4-dihydroxy-benzophenone, 2-hydroxy-4-methoxy-benzophenone, 2-hydroxy-4-n-octoxy-benzophenone, 2-hydroxy-4-dodecyloxy-benzophenone, 2- Hydroxy-4-octadecyloxy-benzophenone, 2,2'-dihydroxy-4-methoxy-benzophenone, 2,2'-dihydroxy-4,4'-dimethoxy-benzophenone, 2,2 ', 4,4'-tetra And hydroxy-benzophenone.
- benzotriazole ultraviolet absorber examples include 2- (2′-hydroxy-5-methylphenyl) benzotriazole, 2- (2′-hydroxy-3 ′, 5′-di-t-butylphenyl) benzotriazole, 2 -(2'-hydroxy-3'-t-butyl-5'-methylphenyl) benzotriazole, 2,2'-methylenebis [6- (2H-benzotriazol-2-yl) -4- (1,1, 3,3-tetramethylbutyl) phenol] (molecular weight 659; examples of commercial products are LA31 from ADEKA Corporation), 2- (2H-benzotriazol-2-yl) -4,6-bis (1-methyl- 1-Phenylethyl) phenol (molecular weight 447.6; examples of commercially available products include Tinuvin 234 from Ciba Specialty Chemicals) It is.
- phenyl salicylate ultraviolet absorber examples include phenyl saltylate, 2-4-di-t-butylphenyl-3,5-di-t-butyl-4-hydroxybenzoate, and the like.
- hindered amine ultraviolet absorbers examples include bis (2,2,6,6-tetramethylpiperidin-4-yl) sebacate.
- triazine ultraviolet absorber examples include 2,4-diphenyl-6- (2-hydroxy-4-methoxyphenyl) -1,3,5-triazine, 2,4-diphenyl-6- (2-hydroxy -4-ethoxyphenyl) -1,3,5-triazine, 2,4-diphenyl- (2-hydroxy-4-propoxyphenyl) -1,3,5-triazine, 2,4-diphenyl- (2-hydroxy -4-butoxyphenyl) -1,3,5-triazine, 2,4-diphenyl-6- (2-hydroxy-4-butoxyphenyl) -1,3,5-triazine, 2,4-diphenyl-6- (2-hydroxy-4-hexyloxyphenyl) -1,3,5-triazine, 2,4-diphenyl-6- (2-hydroxy-4-octyloxyphenyl) -1,3,5 Triazine, 2,4-diphenyl-6- (2-hydroxy-4-dodec
- benzoate UV absorbers examples include 2,4-di-tert-butylphenyl-3,5-di-tert-butyl-4-hydroxybenzoate (molecular weight 438.7; Sumisorb 400).
- a compound having a function of converting the energy held by ultraviolet light into vibrational energy in the molecule and releasing the vibrational energy as heat energy can be used as the ultraviolet absorber.
- those that exhibit an effect when used in combination with an antioxidant or a colorant, or light stabilizers that act as light energy conversion agents, such as quenchers, can be used in combination.
- said ultraviolet absorber may be used individually by 1 type, and may be used in combination of 2 or more type. Moreover, when using a normal ultraviolet absorber, it is effective to use a photopolymerization initiator that generates radicals with visible light.
- the content of the ultraviolet absorber in the ultraviolet absorbing layer is preferably from 0.1 to 20% by mass, more preferably from 1 to 15% by mass, and even more preferably from 3 to 10% by mass. By making the content within the above range, it is possible to prevent soiling of the roll and film and deterioration of adhesion due to bleeding out of the ultraviolet absorber while sufficiently exhibiting weather resistance.
- the light reflection film of this embodiment may have a corrosion prevention layer adjacent to the metal reflection layer for the purpose of preventing the metal reflection layer from corroding.
- the corrosion protection layer can include a corrosion inhibitor and a binder.
- the corrosion prevention layer may consist of only one layer or a plurality of layers.
- the thickness of the corrosion prevention layer is preferably 30 to 200 nm, more preferably 20 to 100 nm.
- binder for the corrosion prevention layer examples include cellulose ester, polycarbonate, polyarylate, polysulfone (including polyethersulfone), polyethylene terephthalate, polyester such as polyethylene naphthalate, polyethylene, polypropylene, cellophane, cellulose diacetate, cellulose triacetate, Cellulose acetate propionate, cellulose acetate butyrate, polyvinylidene chloride, polyvinyl alcohol, ethylene vinyl alcohol, syndiotactic polystyrene, polycarbonate, polynorbornene, polymethylpentene, polyether ketone, polyether ketone imide, polyamide, fluororesin, List nylon, polymethyl methacrylate, or acrylic resin Door can be. Of these, acrylic resins are preferred. Further, the corrosion prevention layer may include a curing agent such as 2,4-tolylene diisocyanate.
- corrosion inhibitor As a corrosion inhibitor, it is preferable to have an adsorptive group with respect to the metal which comprises a metal reflective layer.
- corrosion refers to a phenomenon in which a metal is chemically or electrochemically eroded or deteriorated in material by an environmental substance surrounding it (see JIS Z0103: 2004).
- the optimum content of the corrosion inhibitor varies depending on the compound used, but is generally preferably in the range of 0.1 to 1.0 g / m 2 .
- Examples of the corrosion inhibitor having an adsorptive group for metals include amines and derivatives thereof, compounds having a pyrrole ring, compounds having a triazole ring such as benzotriazole, compounds having a pyrazole ring, compounds having a thiazole ring, and imidazole rings. It is preferable to be selected from at least one of a compound having an indazole ring, a compound having an indazole ring, a copper chelate compound, a thiourea, a compound having a mercapto group, a naphthalene compound, or a mixture of two or more thereof.
- the ultraviolet absorber may also serve as a corrosion inhibitor. It is also possible to use a silicone-modified resin. More specifically, the corrosion inhibitors described in paragraphs “0063” to “0073” of JP2012-232538A can be used.
- the light reflecting film of this embodiment may have a gas barrier layer on the light incident side of the metal reflecting layer.
- the gas barrier layer is intended to prevent deterioration of the humidity, especially the deterioration of the resin base material and each component layer supported by the resin base material due to high humidity, but it has special functions and uses. As long as it has the function of preventing deterioration, a gas barrier layer of various modes can be provided.
- the moisture-proof barrier layer, 40 ° C., the water vapor permeability at 90% RH is preferably not more than 1g / m 2 ⁇ day, more preferably at most 0.5g / m 2 ⁇ day, 0 More preferably, it is 2 g / m 2 ⁇ day or less.
- the oxygen permeability of the gas barrier layer is preferably 0.6 ml / m 2 / day / atm or less under the conditions of a measurement temperature of 23 ° C. and 90% RH.
- Examples of the method for forming the gas barrier layer include a method of forming an inorganic oxide by a method such as vacuum deposition, sputtering, ion beam assist, chemical vapor deposition, and the like.
- An inorganic oxide precursor by a sol-gel method is used.
- a method of forming an inorganic oxide film by applying heat treatment and / or ultraviolet irradiation treatment to the coating film after coating is also preferably used.
- the inorganic oxide is formed by local heating from a sol using an organometallic compound as a raw material.
- an organometallic compound for example, silicon (Si), aluminum (Al), zirconium (Zr), titanium (Ti), tantalum (Ta), zinc (Zn), barium (Ba), indium (In) contained in the organometallic compound,
- An oxide of an element such as tin (Sn) or niobium (Nb), such as silicon oxide, aluminum oxide, or zirconium oxide. Of these, silicon oxide is preferred.
- the inorganic oxide As a method for forming the inorganic oxide, it is preferable to use a so-called sol-gel method or a polysilazane method.
- the sol-gel method is a method of forming an inorganic oxide from an organometallic compound that is a precursor of an inorganic oxide
- the polysilazane method is a method of forming an inorganic oxide from a polysilazane that is a precursor of an inorganic oxide.
- the compounds and methods described in paragraphs “0174” to “0191” of JP2012-232538A can be appropriately employed.
- the anchor layer is made of a resin, and is a layer provided for closely attaching the resin base material and the metal reflective layer, or the support base material (resin film) of the metal reflective layer and the metal reflective layer. Therefore, the anchor layer has an adhesion property that allows the resin base material (support base material) and the metal reflective layer to adhere to each other, heat resistance that can withstand heat when the metal reflective layer is formed by a vacuum deposition method, and the metal reflective layer. It is preferable to have smoothness to bring out the high reflection performance inherent in the.
- the resin used for the anchor layer is not particularly limited as long as it satisfies the above conditions of adhesion, heat resistance, and smoothness.
- polyester resin, polyurethane resin, acrylic resin, melamine resin, epoxy resin, Polyamide resin, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer resin, etc. can be used alone or in combination.
- a mixed resin of a polyester resin and a melamine resin or a mixed resin of a polyester resin and a urethane resin is preferable, and a thermosetting resin in which a curing agent such as isocyanate is further mixed is more preferable.
- the thickness of the anchor layer is preferably 0.01 to 3 ⁇ m, more preferably 0.1 to 2 ⁇ m. By satisfying this range, the unevenness on the surface of the resin substrate can be covered while maintaining the adhesion, the smoothness can be improved, and the anchor layer can be sufficiently cured, resulting in the reflection of the light reflecting film. The rate can be increased.
- the anchor layer can contain the corrosion inhibitor described in the above section (Corrosion prevention layer).
- a method for forming the anchor layer conventionally known coating methods such as a gravure coating method, a reverse coating method, and a die coating method can be used.
- the light reflecting film of this embodiment may have a release layer on the side opposite to the light incident side of the adhesive layer.
- a light reflecting film when a light reflecting film is shipped, it is shipped with the release layer attached to the adhesive layer, the light reflecting film having the adhesive layer is peeled from the release layer, and the light reflecting film is attached to a support substrate and light from a solar reflective device or the like. Used as a reflector.
- the release layer may be any layer that can impart protection to the metal reflective layer, such as an acrylic film or sheet, a polycarbonate film or sheet, a polyarylate film or sheet, a polyethylene naphthalate film or sheet, a polyethylene terephthalate film or sheet.
- Plastic film or sheet such as fluororesin film, resin film or sheet kneaded with titanium oxide, silica, aluminum powder, copper powder, etc., coating the resin kneaded with these, or metal deposition such as aluminum by metal vapor deposition, etc.
- a resin film or sheet that has been subjected to surface treatment is used.
- the thickness of the release layer is not particularly limited, but is usually preferably in the range of 12 to 250 ⁇ m.
- a light reflector in which the above-described light reflection film is attached to a support substrate.
- the light reflector has a structure in which a light reflecting film is bonded to a self-supporting base material (support base material) through an adhesive layer.
- self-supporting in the case of “self-supporting base material” means that, when cut to a size used as a base material for a light reflector, the opposite edge portions are supported. By this, it means that it has the rigidity of the grade which can carry
- the base material of the light reflector has self-supporting properties, it can be easily handled when installed in the solar light reflection device described later, and the holding member for holding the light reflector can have a simple configuration. Therefore, it is possible to reduce the weight of the solar reflective device. For example, when the solar reflective device is used as a solar reflective device for solar thermal power generation, power consumption during solar tracking can be suppressed.
- the substrate may be a single layer or a shape in which a plurality of layers are laminated. Moreover, a single structure may be sufficient and it may be divided
- the shape of the substrate is preferably a concave shape or can be a concave shape. Therefore, a base material that is variable from a flat shape to a concave shape may be used, or a base material that is fixed to a concave shape may be used.
- the base material that can be changed into the concave shape can adjust the curvature of the film mirror that is bonded by adjusting the curvature of the base material. It is preferable because a rate can be obtained.
- the base material having the concave shape fixed is preferable from the viewpoint of adjustment cost because it is not necessary to adjust the curvature.
- the base material includes steel plates, copper plates, aluminum plates, aluminum-plated steel plates, aluminum-based alloy-plated steel plates, copper-plated steel plates, tin-plated steel plates, chrome-plated steel plates, stainless steel plates, and veneer plates (preferably waterproofed) Wood board, fiber reinforced plastic (FRP) board, resin board, and the like.
- a metal plate from the viewpoint of high thermal conductivity. More preferably, it is a plated steel plate, stainless steel plate, aluminum plate or the like having not only high thermal conductivity but also good corrosion resistance. Most preferably, a steel plate combining a resin and a metal plate is used.
- the material for the resin film as the surface layer various conventionally known resin films can be used.
- a polycarbonate film, a polyester film such as polyethylene terephthalate, a norbornene resin film, a cellulose ester film, and an acrylic film are preferable, and a polyester film such as polyethylene terephthalate or an acrylic film is particularly preferable.
- the thickness of the resin film is preferably an appropriate thickness depending on the type and purpose of the resin. For example, it is generally 10 to 250 ⁇ m, preferably 20 to 200 ⁇ m.
- a sunlight reflecting device having a light reflector.
- the solar light reflection device of this embodiment is suitably used for condensing sunlight in solar thermal power generation.
- the solar light reflection device of this embodiment includes a light reflector and a holding member that holds the light reflector.
- a cylindrical member having a fluid inside is provided as a heat collecting part in the vicinity of the film mirror, and sunlight is reflected on the cylindrical member so as to reflect the inside.
- a form generally called a trough type that heats a fluid and converts the heat energy to generate electric power can be given.
- mold is also mentioned as another form.
- the tower-type configuration has at least one heat collecting part and at least one solar power solar reflection device for reflecting sunlight and irradiating the heat collecting part, and is collected in the heat collecting part. There is one that uses liquid heat to heat a liquid and turn a turbine to generate electricity.
- a plurality of solar power generation solar reflective devices are arranged around the heat collection unit.
- a plurality of solar reflective devices for solar thermal power generation are arranged concentrically or in a concentric fan shape.
- sunlight is reflected to the collector mirror by the sunlight reflecting mirrors installed around the support tower, and then reflected further by the collector mirror and sent to the heat collector and sent to the heat exchange facility. It is done.
- the solar light reflection device of this embodiment can be used for both trough type and tower type. Of course, it can be used for various other types of solar thermal power generation.
- the sunlight reflecting device has a holding member that holds the light reflector.
- the holding member is preferably held in a state in which the light reflector can track the sun.
- the holding member preferably has a configuration for holding the light reflector in a state where the sun can be tracked. However, when the sun is tracked, it may be driven manually, or a separate driving device may be provided to automatically track the sun. It is good also as composition to do.
- Example 1 A biaxially stretched polyethylene terephthalate (PET) film (thickness: 200 ⁇ m, Young's modulus: 3.8 GPa) was used as the resin support layer.
- PET polyethylene terephthalate
- a polyester resin (Polyester SP-181, manufactured by Nippon Synthetic Chemical Co., Ltd.) and 2,4-tolylene diisocyanate are mixed at a resin solid content ratio (mass ratio) of 10: 2, and methyl ethyl ketone (MEK) is used as a solvent.
- MEK methyl ethyl ketone
- an amount prepared to be 10% by mass of glycol dimercaptoacetate (manufactured by Wako Pure Chemical Industries, Ltd.) as a corrosion inhibitor was mixed to prepare a mixed solution.
- This mixed solution was coated on one surface of a PET film as a resin support layer by a gravure coating method to form a corrosion prevention layer having a thickness of 60 nm.
- a metal reflective layer made of silver was formed on the surface of the corrosion prevention layer so as to have a thickness of 80 nm by vacuum deposition.
- the surface of the metal reflective layer was coated with an ultraviolet absorbing polymer “New Coat UVA-204W” (manufactured by Shin-Nakamura Chemical) by the gravure coating method to form an ultraviolet absorbing layer having a thickness of 5 ⁇ m.
- the surface of the UV absorbing layer is coated with an adhesive TBS-730 (Dainippon Ink Co., Ltd.) by a gravure coating method to form a 5 ⁇ m thick adhesive layer, and the UV absorber (BASF Tinuvin 477 triazine type) is formed on the surface.
- An acrylic layer having a thickness of 30 ⁇ m containing 5% was formed.
- a 30 wt% coating solution was prepared by diluting Sircoat BP-16N (manufactured by Kinken Co., Ltd .: 45 wt% methanol solution) of acrylic silicone thermosetting resin with MEK.
- the MEK in the coating solution was 32% by mass.
- the coating liquid was applied to the surface of the acrylic layer, dried at 80 ° C. for 90 seconds, and then heated at 45 ° C. for 48 hours to form a hard coat layer having a dry film thickness of 3 ⁇ m.
- an acrylic pressure-sensitive adhesive SZ-7543, manufactured by Nippon Carbide Industry Co., Ltd.
- a curing agent Coronate HX, manufactured by Nippon Polyurethane Industry Co., Ltd.
- the addition amount was adjusted to 2 ⁇ 10 6 Pa, and an adhesive layer having a thickness of 30 ⁇ m was formed by applying with an applicator to complete a light reflecting film.
- the thickness of the resin support layer was determined by cutting the film with a laser cutter and measuring the thickness of the cross section using a transmission electron microscope (SEM).
- the Young's modulus of the resin support layer was determined as follows. The resin support layer was cut into a 1 cm ⁇ 5 cm strip. Using this sample, a tensile test was performed at a speed of 50 mm / min using a Tensilon universal material tester, RTF-2430, manufactured by A & D Co., Ltd., and the Young's modulus was obtained.
- the shear storage elastic modulus G ′ of the adhesive layer was determined as follows. An adhesive was applied on a polyethylene terephthalate film to form an adhesive layer, which was peeled off. About the peeled adhesive layer, using a dynamic viscoelasticity measuring device (“ARES” manufactured by Rheometric Co., Ltd.), shear storage elasticity at 23 ° C. in a temperature rising mode (temperature rising rate 5 ° C./min, frequency 10 Hz). The rate G ′ was measured.
- ROS dynamic viscoelasticity measuring device
- Example 2 A light reflecting film was produced in the same manner as in Example 1 except that the thickness of the resin support layer was 500 ⁇ m.
- Example 3 A light reflecting film was produced in the same manner as in Example 1 except that the thickness of the resin support layer was 1000 ⁇ m.
- Example 4 to 6 A light reflecting film was prepared in the same manner as in Examples 1 to 3 except that the thickness of the adhesive layer was 100 ⁇ m.
- Example 7 to 9 A light reflecting film was prepared in the same manner as in Examples 1 to 3, except that the thickness of the adhesive layer was 200 ⁇ m.
- Example 10 A light reflecting film was produced in the same manner as in Example 5 except that the ultraviolet absorbing layer was not provided.
- Example 11 By adding a curing agent (Coronate HX, manufactured by Nippon Polyurethane Industry Co., Ltd.) to an acrylic pressure-sensitive adhesive (SZ-7543, manufactured by Nippon Carbide Industry Co., Ltd.) on the other surface of the resin support layer, shear storage modulus G ′: 5 A light reflecting film was produced in the same manner as in Example 2 except that the pressure layer was adjusted to ⁇ 10 4 Pa and an adhesive layer having a thickness of 200 ⁇ m was formed.
- a curing agent Coronate HX, manufactured by Nippon Polyurethane Industry Co., Ltd.
- SZ-7543 acrylic pressure-sensitive adhesive
- Example 12 By adding a curing agent (Coronate HX, manufactured by Nippon Polyurethane Industry Co., Ltd.) to an acrylic pressure-sensitive adhesive (SZ-7543, manufactured by Nippon Carbide Industry Co., Ltd.) on the other surface of the resin support layer, shear storage modulus G ′: A light reflecting film was produced in the same manner as in Example 2, except that the pressure was adjusted to 1 ⁇ 10 5 Pa and an adhesive layer having a thickness of 30 ⁇ m was formed.
- a curing agent Coronate HX, manufactured by Nippon Polyurethane Industry Co., Ltd.
- SZ-7543 acrylic pressure-sensitive adhesive
- Example 13 By adding a curing agent (Coronate HX, manufactured by Nippon Polyurethane Industry Co., Ltd.) to an acrylic pressure-sensitive adhesive (SZ-7543, manufactured by Nippon Carbide Industry Co., Ltd.) on the other surface of the resin support layer, shear storage modulus G ′: A light reflecting film was produced in the same manner as in Example 2 except that the amount of the curing agent was adjusted to 1.2 ⁇ 10 7 Pa and a 30 ⁇ m thick adhesive layer was formed.
- a curing agent Coronate HX, manufactured by Nippon Polyurethane Industry Co., Ltd.
- SZ-7543 acrylic pressure-sensitive adhesive
- Example 14 A light reflecting film was produced in the same manner as in Example 1 except that a biaxially stretched soft vinyl chloride film (thickness: 500 ⁇ m, Young's modulus: 1.7 GPa) was used as the resin support layer.
- Example 15 A light reflecting film was produced in the same manner as in Example 1 except that a biaxially stretched epoxy resin film (thickness: 500 ⁇ m, Young's modulus: 5 GPa) was used as the resin support layer.
- Example 16 A light reflecting film was produced in the same manner as in Example 1 except that a biaxially stretched soft vinyl chloride film (thickness: 1000 ⁇ m, Young's modulus: 1.7 GPa) was used as the resin support layer.
- Example 17 A light reflecting film was produced in the same manner as in Example 1 except that a biaxially stretched phenol resin film (thickness: 1000 ⁇ m, Young's modulus: 5.2 GPa) was used as the resin support layer.
- a comparative light reflecting film was prepared in the same manner as in Examples 2 to 3 except that the thickness of the adhesive layer was 25 ⁇ m.
- Comparative Example 3 A comparative light reflecting film was produced in the same manner as in Example 7 except that the thickness of the resin support layer was 150 ⁇ m.
- Comparative Example 4 A comparative light reflecting film was produced in the same manner as in Example 7 except that the thickness of the resin support layer was 1100 ⁇ m.
- Comparative Example 5 A comparative light reflecting film was produced in the same manner as in Example 3 except that the thickness of the adhesive layer was 300 ⁇ m.
- each light reflecting film was made of a support substrate made of stainless steel (SUS) (surface roughness Ra: 0.5 ⁇ m in Examples 1A, 2A, 3 to 11, 12A, and 13 to 17, Example 1B, In 2B and 12B, the surface roughness Ra is 0.1 ⁇ m), and the surface roughness Ra of the metal reflective layer of the light reflecting film is measured using an ultra-precision non-contact three-dimensional measuring device (NH-3SP from Mitaka Kogyo). Measured.
- the measurement conditions were a measurement range of 2 mm, a measurement pitch of 2 ⁇ m, an objective lens of 100 times, and a cutoff value of 0.250 mm. Based on the obtained value, it evaluated in four steps as follows.
- the light resistance of the light reflecting films prepared in Examples 1 to 10 and Comparative Examples 1 to 7 was evaluated.
- the regular reflectance (5 ° regular reflectance) when the incident angle of incident light is 5 ° with respect to the normal of the reflective surface of the light reflecting film attached to the support substrate made of SUS is the wavelength range 250. Measurements were made at ⁇ 2500 nm to determine the initial average reflectance. For the measurement, a spectrophotometer U-4100 (manufactured by Shimadzu Corporation) was used.
- the light reflecting film is irradiated with a xenon lamp on the light incident surface side of the film (using a Suga test machine SX75, under a black panel temperature of 63 ° C. and a relative humidity of 50%, with a radiation intensity of 180 W / m 2 , 5000 hours) and a light resistance test was conducted. And 5 degree regular reflectance was measured by the method similar to the above after the light resistance test, and the average reflectance was calculated
- Degree of decrease is less than 10% ⁇ Degree of decrease is 10% or more.
- the light reflecting films produced in Examples 2 and 11 to 13 were evaluated for scratch resistance. Specifically, according to the scratch hardness (pencil method) test (JIS K5600-5-4: 1999), the outermost layer of the light reflecting film is scratched 5 times under the conditions of a pencil angle of 45 ° and a load of 500 g. The hardness of the pencils that were not scratched four times or more was evaluated in three stages as follows.
- the light reflective films produced in Examples 1 to 17 and Comparative Examples 1 to 7 were evaluated for manufacturing suitability. Specifically, in the case where a core having a diameter of about 30 cm is manufactured at 40 m / min by a roll-to-roll manufacturing method, the case where there is no problem in the manufacturing is ⁇ , manufacturing failure (winding failure or adhesive is not dried). When it became, it was set as x.
- the light reflecting films of Examples 1 to 17 in which the thicknesses of the resin support layer and the pressure-sensitive adhesive layer are within a predetermined range are applied to a support substrate having a surface roughness Ra of 0.5 ⁇ m. Even when affixed, the surface roughness Ra of the metal reflective layer was less than 0.1 ⁇ m, indicating that sufficient smoothness was exhibited.
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Abstract
La présente invention vise à fournir un film réfléchissant de lumière, qui permet à une couche de réflexion métallique d'être suffisamment lisse dans un corps de réflexion de lumière. À cet effet, un film réfléchissant de lumière selon la présente invention comprend : une couche de support en résine ; une couche adhésive qui est située sur un premier côté de surface de la couche de support en résine ; et une couche réfléchissante qui est disposée sur l'autre côté de surface de la couche de support en résine. Ce film réfléchissant de lumière est caractérisé par le fait que la couche de support en résine a une épaisseur de 200-1 000 μm et la couche adhésive a une épaisseur de 30-200 µm.
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CN105509349A (zh) * | 2015-12-18 | 2016-04-20 | 九格能源科技(天津)有限公司 | 一种真空高温太阳能集热管 |
WO2018116598A1 (fr) * | 2016-12-22 | 2018-06-28 | 富士フイルム株式会社 | Film optique et procédé de fabrication d'un film optique |
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JP7358041B2 (ja) * | 2018-10-12 | 2023-10-10 | 積水化学工業株式会社 | 防食用粘着剤、防食用粘着剤層及び防食用粘着テープ |
KR20230020959A (ko) * | 2020-06-12 | 2023-02-13 | 닛토덴코 가부시키가이샤 | 필름 미러 적층체 및 미러 부재 |
JPWO2023054282A1 (fr) * | 2021-09-28 | 2023-04-06 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010085858A (ja) * | 2008-10-01 | 2010-04-15 | Nippon Zeon Co Ltd | 光学部材及び液晶表示装置 |
JP2011128501A (ja) * | 2009-12-21 | 2011-06-30 | Konica Minolta Opto Inc | フィルムミラー、フィルムミラーの製造方法及び太陽光集光用ミラー |
WO2012176650A1 (fr) * | 2011-06-21 | 2012-12-27 | コニカミノルタアドバンストレイヤー株式会社 | Miroir collecteur de lumière solaire et système de génération de puissance thermique solaire ayant le miroir collecteur de lumière solaire |
-
2014
- 2014-03-26 JP JP2014064630A patent/JP2017096987A/ja active Pending
-
2015
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010085858A (ja) * | 2008-10-01 | 2010-04-15 | Nippon Zeon Co Ltd | 光学部材及び液晶表示装置 |
JP2011128501A (ja) * | 2009-12-21 | 2011-06-30 | Konica Minolta Opto Inc | フィルムミラー、フィルムミラーの製造方法及び太陽光集光用ミラー |
WO2012176650A1 (fr) * | 2011-06-21 | 2012-12-27 | コニカミノルタアドバンストレイヤー株式会社 | Miroir collecteur de lumière solaire et système de génération de puissance thermique solaire ayant le miroir collecteur de lumière solaire |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105509349A (zh) * | 2015-12-18 | 2016-04-20 | 九格能源科技(天津)有限公司 | 一种真空高温太阳能集热管 |
WO2018116598A1 (fr) * | 2016-12-22 | 2018-06-28 | 富士フイルム株式会社 | Film optique et procédé de fabrication d'un film optique |
KR20190087504A (ko) * | 2016-12-22 | 2019-07-24 | 후지필름 가부시키가이샤 | 광학 필름 및 광학 필름의 제조 방법 |
CN110100192A (zh) * | 2016-12-22 | 2019-08-06 | 富士胶片株式会社 | 光学膜及光学膜的制造方法 |
JPWO2018116598A1 (ja) * | 2016-12-22 | 2019-10-24 | 富士フイルム株式会社 | 光学フィルム及び光学フィルムの製造方法 |
CN110100192B (zh) * | 2016-12-22 | 2021-02-09 | 富士胶片株式会社 | 光学膜及光学膜的制造方法 |
KR102269381B1 (ko) * | 2016-12-22 | 2021-06-28 | 후지필름 가부시키가이샤 | 광학 필름 및 광학 필름의 제조 방법 |
KR20210080589A (ko) * | 2016-12-22 | 2021-06-30 | 후지필름 가부시키가이샤 | 광학 필름 및 광학 필름의 제조 방법 |
KR102342126B1 (ko) * | 2016-12-22 | 2021-12-22 | 후지필름 가부시키가이샤 | 광학 필름 및 광학 필름의 제조 방법 |
JP7027337B2 (ja) | 2016-12-22 | 2022-03-01 | 富士フイルム株式会社 | フレキシブルディスプレイ用光学フィルム及びフレキシブルディスプレイ用光学フィルムの製造方法 |
US11306188B2 (en) | 2016-12-22 | 2022-04-19 | Fujifilm Corporation | Optical film and method for manufacturing optical film |
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