WO2015141345A1 - 可撓性実装モジュール体の製造方法 - Google Patents

可撓性実装モジュール体の製造方法 Download PDF

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Publication number
WO2015141345A1
WO2015141345A1 PCT/JP2015/053999 JP2015053999W WO2015141345A1 WO 2015141345 A1 WO2015141345 A1 WO 2015141345A1 JP 2015053999 W JP2015053999 W JP 2015053999W WO 2015141345 A1 WO2015141345 A1 WO 2015141345A1
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Prior art keywords
film
pressure
electronic component
sensitive adhesive
adhesive layer
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PCT/JP2015/053999
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English (en)
French (fr)
Inventor
隆行 松島
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デクセリアルズ株式会社
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Publication date
Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Priority to CN201580014359.7A priority Critical patent/CN106105404B/zh
Priority to KR1020167028457A priority patent/KR102282848B1/ko
Publication of WO2015141345A1 publication Critical patent/WO2015141345A1/ja
Priority to US15/269,354 priority patent/US10306772B2/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
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    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/201—Temperature ranges
    • H01L2924/20105—Temperature range 150 C=<T<200 C, 423.15 K =< T < 473.15K
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]

Definitions

  • the present invention relates to a technique for manufacturing a flexible substrate on which electronic components are mounted.
  • a display device in which the image display unit has flexibility (flexibility), such as a film liquid crystal display and a flexible organic EL display, has attracted attention.
  • Such a display device uses a flexible display substrate as its main component.
  • This flexible display substrate is a flexible and highly transparent plastic film such as a plastic film, an image display region for displaying an image, and an electronic component for processing a video signal of the image display device (for example, , A driver IC).
  • a thermosetting anisotropic conductive film is disposed in the mounting region, the electronic component is disposed on the anisotropic conductive film, and then heated and pressed to be fixed. It is common.
  • the plastic film that becomes the substrate is made thin or its rigidity is reduced, the substrate is deformed or distorted during the above heating and pressing. However, based on this, the display image tends to deteriorate.
  • the field is different from that of the flexible display board described above, in the field of the wiring board that is common in the use of the flexible board, that is, in the technical field of the flexible printed wiring board,
  • a reinforcing plate backing plate
  • the reinforcing plate include thermosetting type reinforcing plates such as Documents 1 to 3, that is, thermosetting sheets, and adhesive sheets such as Documents 4 and 5.
  • thermosetting sheet such as Documents 1 to 3
  • the influence on the display elements for example, liquid crystal elements and EL elements
  • the reaction rate is insufficient and the problem of not thermosetting to the required level There is.
  • the adhesive sheet as in References 4 and 5 is used as a reinforcing plate, the above-mentioned problem is not present, but an anisotropic conductive film is disposed in the mounting region to heat electronic components such as IC (170 ° C./5 sec ) And pressure, the pressure-sensitive adhesive sheet is deformed by the heat, and there is a problem that the mounting state is not reliable.
  • the conductive particles of the anisotropic conductive film on the lower surface of the electrode or bump formed on the IC or the like are not sufficiently deformed, and the pressure-sensitive adhesive sheet is deformed during pressurization. It can be inferred that sufficient pressure is not applied.
  • thermosetting sheets of Documents 1 to 3 it is conceivable to increase the curing agent in order to increase the reaction rate so that low temperature connection is possible, but then the storage stability of the thermosetting sheet is improved. It will decline.
  • the present invention contains conductive particles (19) in the mounting region (10) provided on the arrangement surface (7) which is one surface of the flexible substrate (11).
  • the manufacturing method of the flexible mounting module body (15) having: Of the support surface (8) of the flexible substrate (11), which is the surface opposite to the arrangement surface (7), at least a portion located directly behind the mounting region (10) is provided with an adhesive (26 ) Containing a pressure-sensitive adhesive layer (21) and a pressure-sensitive adhesive film (20) in which a base film (22)
  • the present invention is the method for producing a flexible mounting module body (15), wherein the pressure-sensitive adhesive (26) has a glass transition temperature in the range of ⁇ 60 ° C. or higher and 20 ° C. or lower.
  • the present invention provides a flexible mounting module in which the mounting step heats the electronic component (9) to a temperature range of 150 ° C. or higher and 170 ° C. or lower when pressing is performed while heating the electronic component (9). It is a manufacturing method of a body (15).
  • the present invention is characterized in that, in the adhesive film attaching step, the portion of the support surface (8) to which the adhesive film (20) is attached includes a portion located directly behind the image display region (16).
  • This is a manufacturing method of the flexible mounting module body (15).
  • This invention is a manufacturing method of the flexible mounting module body (15) whose said adhesive (26) is a nitrile rubber.
  • This invention is a manufacturing method of the flexible mounting module body (15) in which the nitrile rubber in the said adhesive layer (21) contains acrylonitrile in the ratio of 18 weight% or more and 40.5 weight% or less. is there.
  • the present invention relates to a solution of the pressure-sensitive adhesive (26) containing 5 parts by weight or more of the silica fine particles (25) with respect to 100 parts by weight of the pressure-sensitive adhesive (26) in a powder state. It is a manufacturing method of the flexible mounting module body (15) which has an adhesive layer formation process arrange
  • the present invention as described above includes a reinforcing plate on the back side of a flexible display substrate used as a film liquid crystal display, a flexible organic EL display, or the like, or a “flexible substrate” serving as a base material such as a flexible printed wiring board.
  • a flexible display substrate used as a film liquid crystal display, a flexible organic EL display, or the like
  • a “flexible substrate” serving as a base material such as a flexible printed wiring board.
  • a flexible mounting module of the present invention when an electronic component is heated and pressed with an anisotropic conductive film, an adhesive film with a small deformation of the adhesive layer is used as the reinforcing plate. Pressure can be applied reliably to such an extent that the conductive particles present in the isotropic conductive film are deformed or crushed, and the electrical connection of the module is ensured.
  • Reference numeral 15 in FIG. 2 (f) denotes a flexible mounting module body obtained by the present invention, which includes a flexible substrate (11) made of a polyimide film or a polycarbonate film, a polyethersulfone film, a polyester film, and the like. It has an electronic component (9) which is an integrated circuit, a flexible display device (5), and an adhesive film (20) as a reinforcing plate.
  • An image display area (16) and a mounting area (10) are provided on one side of the arrangement surface (7) of the flexible substrate (11) made of polyimide or polyester film, and the display device (5) is an image.
  • the electronic component (9) is arranged in the mounting area (10), and the electronic component (9) and the display device (5) are electrically connected by a patterned wiring film (not shown).
  • a patterned wiring film not shown.
  • the display device (5) has flexibility and can be bent together with the flexible substrate (11).
  • the adhesive film (20) includes a base film (22) having flexibility such as a polyester film, an OPP film, a PE film, a PVA film, and a PVC film, and a flexibility disposed on the base film (22). And a pressure-sensitive adhesive layer (21).
  • Reference numeral 8 denotes a support surface which is the surface opposite to the arrangement surface (7) of the flexible substrate (11). Of the support surface (8), The pressure-sensitive adhesive layer (21) is in contact with the pressure-sensitive adhesive film (20). Of the support surface (8), the adhesive film (20) is also attached to the portion of the image display region (16) at the back side in addition to the portion at the back side of the mounting region (10).
  • the pressure-sensitive adhesive layer (21) has a pressure-sensitive adhesive (26) made of a non-thermosetting resin and silica fine particles (25) having a primary particle diameter of less than 100 nm dispersed in the pressure-sensitive adhesive (26).
  • the shape of the silica fine particles (25) having a diameter of less than 100 nm is not particularly limited, and various shapes such as a spherical shape, an irregular shape, and a flake shape can be used.
  • silica fine particles for example, commercially available products such as a series of registered trademark Aerosil sold by Nippon Aerosil Co., Ltd. and a series of registered trademark Leolosil of Tokuyama Co., Ltd. can be obtained and used.
  • the non-thermosetting resin has sufficient peel strength as an adhesive, and is relatively deformed even at high temperatures (about 160 ° C.) reached when the anisotropic conductive film is heated and pressed.
  • the resin can be selected from resins having a glass transition temperature in the range of ⁇ 60 ° C. or higher and 20 ° C. or lower so that there are few.
  • flexible substrates such as rubber polymers such as nitrile rubber (NBR: copolymer of acrylonitrile and 1,3-butadiene), butyl rubber, ethylene propylene rubber, and acrylic polymers used for ordinary adhesives It can be selected and used in relation to the material of (11).
  • the flexible substrate (11) in FIG. 1 (a) is in a state where the display device (5) is provided in the image display area (16) and the electronic component (9) is not mounted.
  • the surface of the electrode (6) made of a patterned metal thin film, ITO, IZO or the like is exposed in the mounting region (10) of the arrangement surface (7).
  • the supporting surface (8) of the flexible substrate (11) at least the supporting surface (8) at the back side of the mounting region (10) is brought into contact with the adhesive layer (21), and the adhesive film (20) can be used.
  • the pressure-sensitive adhesive film (20) is heated with the flexible substrate (11) pressed against each other, and the pressure-sensitive adhesive film (20) is brought to the first application temperature, as shown in FIG. ) Is attached to the flexible substrate (11).
  • the pressure sensitive adhesive of the pressure sensitive adhesive layer (21) is not a thermosetting resin, so the first sticking temperature is close to room temperature and lower than the temperature at which the flexible substrate (11) is deformed.
  • an anisotropic conductive film (19) in which conductive particles (19) are dispersed in a thermosetting resin composition such as an epoxy resin or an acrylic resin on the electrode (6). 12) is placed in contact with the surface of the electrode (6).
  • the electronic component (9) is placed on the anisotropic conductive film (12).
  • the electronic component (9) is provided with a bump (13) electrically connected to the semiconductor chip on the bottom surface of the element body (14) containing the semiconductor chip, and the bump (13) is provided on the flexible substrate.
  • the electrode (6) is positioned between the bump (13) and the arrangement surface (7).
  • the flexible substrate (11) to which the adhesive film (20) is attached is placed on the base (30) so that the base film (22) of the adhesive film (20) is in contact with the surface of the base (30).
  • the electronic component (9) is placed on the anisotropic conductive film (12) so that the bump (13) is positioned on the electrode (6).
  • the pressing member (31) is brought into contact with the bump (13) of the electronic component (9) in contact with the anisotropic conductive film (12).
  • the electronic component (9) is pressed by 31).
  • a heat generating device is provided inside the pressing member (31).
  • the pressing member (31) is heated by the heat generating device and heated to a predetermined temperature, and the electronic component (9) is used for pressing.
  • the pressing member (31) is contacted, heated by heat conduction, and raised in temperature.
  • the anisotropic conductive film (12) is in contact with the bump (13), and when the electronic component (9) is pressed, the anisotropic conductive film (12) is pressed by the bump (13).
  • the anisotropic conductive film (12), the electrode (6), the flexible substrate (11), and the adhesive film (20) are in contact with the bump (13) and the anisotropic conductive film (12).
  • the base (30) are arranged in a straight line, and the base (30) is stationary and the electronic component (9) is pressed, so that the bump (13) and the base (30) are pressed against each other. Then, the electrode (6), the flexible substrate (11), and the adhesive film (20) are also pressed.
  • the anisotropic conductive film (12), the electrode (6), the flexible substrate (11), and the like are caused by heat conduction from the electronic component (9).
  • the pressure-sensitive adhesive film (20) is heated by heat conduction and the temperature rises.
  • Resin particles of the conductive particles (19) used for the anisotropic conductive film are made of materials such as epoxy resin, phenol resin, acrylic resin, acrylonitrile / styrene (AS) resin, benzoguanamine resin, divinylbenzene resin, styrene resin, and the like. It is appropriately selected according to the adhesive properties that are thermosetting.
  • the bump (13) comes into contact with the conductive particles (19) to press the conductive particles (19), and the conductive particles (19) become the electrodes (6). Press.
  • the pressure-sensitive adhesive layer (21) is strongly pressed at a position directly below the portion of the electrode (6) where the conductive particles (19) are pressed, and the pressure-sensitive adhesive (21) is more than the pressure-sensitive adhesive layer (21) around it. 26) is greatly deformed.
  • a depression recessed from the surroundings is generated in the pressure-sensitive adhesive layer (21) and the electrode (6) in the upper part thereof, and the conductive particles (19) enter the depression of the electrode (6). Then, the conductive particles (19) are not strongly pressed.
  • the pressure-sensitive adhesive layer (21) contains silica fine particles (25), and the shear storage elastic modulus is set to 0.15 MPa or more at 160 ° C. Even if the electronic component (9) is pressed, the pressed adhesive (26) is not extruded from between the flexible substrate (11) and the base film (22), but the adhesive layer (21) and the electrode. No dent is generated in (6), and the conductive particles (19) are crushed by being sandwiched between the bump (13) and the electrode (6), and the gap between the bump (13) and the electrode (6) is electrically connected. Connected.
  • the pressing force of the pressing member (31) causes a gap between the bump (13) and the electrode (6).
  • the conductive particles (19) located in the region are crushed to obtain a flexible mounting module body (15) in which electrical connection between the bump (13) and the electrode (6) is ensured (FIG. 2 (f)).
  • the electronic component (9) is usually 150 ° C. or higher and 170 ° C. or lower.
  • the pressure-sensitive adhesive film (20) is also heated to a temperature close to that.
  • the pressure-sensitive adhesive layer (21) used in the present invention has a shear storage elastic modulus of 0. 0 when the temperature is raised to a temperature close to that of the electronic component (9) by adjusting the content of the silica fine particles (25). It is desirable that the pressure be 15 MPa or more. Specifically, in the above temperature rising range, the pressure-sensitive adhesive layer preferably contains 0.5 wt% or more and 20 wt% or less.
  • the pressure-sensitive adhesive (26) preferably has a glass transition temperature in the range of ⁇ 60 ° C. or higher and 20 ° C. or lower in order to obtain a strong pressure-sensitive adhesive force.
  • the shear storage elastic modulus of the pressure-sensitive adhesive layer (21) is set to 0.15 MPa or more by containing silica fine particles (25) of less than 100 nm.
  • the adhesive (26) is a nitrile. It is desirable that it is rubber, and the amount of acrylonitrile in the nitrile rubber is desirably contained in a proportion of 18% by weight or more and 40.5% by weight or less. In addition, said amount of acrylonitrile is a bonded acrylonitrile amount average value (JISK 6384). As shown in FIG. 3E, the adhesive film (20) is disposed on the back surface side of the mounting region (10) in the support surface (8), and the surface on the back surface side of the image display region (16) is exposed.
  • the electronic component placed on the mounting area (10) by bringing the back surface of the image display area (16) and the base film (22) of the adhesive film (20) into contact with the base (30) (9) is pressed by the pressing member (31), and as shown in FIG. 5F, the portion of the support surface (8) on the back side of the image display area (16) is exposed, and the mounting area ( It is also possible to obtain a flexible mounting module body 15 ′ in which the adhesive film (20) is located in the back side portion of 10) and is not located in the back side portion of the image display region (16). In short, in the present invention, it is only necessary that the adhesive film (20) is disposed at least at a position directly behind the mounting region (10). As shown in FIG.
  • the adhesive film (20) is also attached to the portion at the back of the image display area (16), the back side of the image display area (16) and the mounting area (10 ), The adhesive film (20) is located on both of the back surfaces. Therefore, even if the flexible substrate (11) is arranged on a flat surface, deformation such as a step does not occur.
  • the dispersion liquid is put into a coating apparatus, applied to a base film (22) (polyethylene terephthalate film, 75 ⁇ m thickness), and the MEK is volatilized in a drying furnace to have a thickness of about 17 ⁇ m (base film).
  • a base film (22) polyethylene terephthalate film, 75 ⁇ m thickness
  • MEK is volatilized in a drying furnace to have a thickness of about 17 ⁇ m (base film).
  • Example 2 the adhesive films (20) of Example 2 and Example 3 were obtained in the same manner as in Example 1 except that the addition amount of the silica fine particles was changed to 10 parts by mass and 15 parts by mass. .
  • adhesive films (20) of Example 4 and Example 5 were obtained in the same manner as in Example 1 except that the acrylic content in the acrylonitrile rubber was changed as shown in Table 2.
  • an adhesive film as a comparative example was obtained in the same manner as in Example 1 except that silica fine particles were not added.
  • the adhesive film of each Example and Comparative Example was applied to the back side of the electrode (6) of the flexible substrate (11) (here, a sample substrate provided with a connecting electrode on a polyimide film having a thickness of about 10 ⁇ m).
  • the piece was attached under the conditions used to create the piece, and then an anisotropic conductive film (12) (DP3342MS, Dexerials) was placed on the electrode (6), and the electronic component (9) for resistance measurement was heated and pressed.
  • the conductive particles (19) contained in the anisotropic conductive film (12) have resin particles subjected to nickel / gold plating and an average particle diameter of 4 ⁇ m. Evaluation criteria of compression state It evaluated as "(circle)” which shows that the electroconductive particle was excellent in what was compressively deformed or crushed 30% or more. It evaluated as "x” which showed that the thing which does not lead to a deformation
  • a shear storage modulus G ′ at 160 ° C. was obtained using a viscoelasticity measuring device (manufactured by HAAKE, product number RS-150). And while listing the component of the adhesive layer of the adhesive film of an Example and a comparative example again in Table 1, it also described in Table 1 together with the measurement and observation result obtained by said method.
  • the peel strength with respect to the flexible substrate (11) can be adjusted, especially when the lower limit side is 18%. It can be seen that when the adherend is a polyimide substrate, high peel strength can be obtained.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

　異方性導電膜（１２）を用いた電子部品（９）と電極（６）との間の電気的接続を確実にする。　可撓性基板（１１）の実装領域（１０）の裏面側に、粘着フィルム（２０）を貼付しておき、表面側に電子部品（９）を搭載する。粘着フィルム（２０）は、基材フィルム（２２）上に、粘着剤層（２１）が形成されており、粘着剤層（２１）の粘着剤（２６）中には、一次粒子径１００ｎｍ未満のシリカ微粒子（２５）が含有され、１６０℃におけるせん断貯蔵弾性率が０．１５ＭＰａ以上にされている。実装領域（１０）上に異方性導電膜（１２）を配置してその上に電子部品（９）を加熱及び押圧して搭載する際に、粘着剤層（２１）中の粘着剤（２６）は大きく押し出されることがなく、バンプ（１３）と電極（６）との間に挟まれた導電粒子（１９）は、押圧されて潰されるので、電気的接続が確実になる。

Description

可撓性実装モジュール体の製造方法
　本発明は、電子部品を実装した可撓性を有する基板を製造する技術に関する。
　利便性や携帯性の観点から、フィルム液晶ディスプレイやフレキシブル有機ＥＬディスプレイのように、画像表示部が可撓性（フレキシブル性）を有する表示装置が注目されている。
　このような表示装置は、その本体部品として、可撓性表示基板が使用される。この可撓性表示基板は、可撓性があり透明性の高いプラスチックフィルムのような可撓性基板に、画像を表示する画像表示領域と、画像表示装置の映像信号を処理する電子部品（例えば、ドライバーＩＣ）を実装する実装領域とを有している。そして、電子部品を実装する際には、熱硬化性の異方性導電膜を実装領域に配置して、異方性導電膜上に電子部品を配置し、その後に加熱及び押圧し、固定するのが一般的である。なお、可撓性表示基板の可撓性を更に高めるために、基板となるプラスチックフィルムを薄くしたり、又はその剛性を小さくすると、上記の加熱及び押圧の際に、基板の変形や歪みが発生し、それに基づき、表示画像が劣化する傾向にある。
　他方、上記の可撓性表示基板とはその分野を異にするが、可撓性基板を使用する点では共通する配線板の分野、すなわちフレキシブルプリント配線板の技術分野では、その配線板の端部に形成される外部端子領域の裏面に補強板（裏打ち板）を貼付することで、その端部に掛かる熱や応力を裏面の補強板で支持させて、他の部品への差込や、配線板上に電子部品を実装するときに生じる歪みや変形を回避する技術がある。
　上記の補強板には、具体的に、文献１～文献３のような熱硬化性タイプの補強板、すなわち熱硬化性シートや、文献４及び文献５のような粘着シートがある。
特開２０１２－２１９１５４号公報 特開２０１２－１１６８７０号公報 特開２０１１－７９９５９号公報 特開２００６－３３２１８７号公報 特開２００６－１７３５３５号公報
　そうすると、上記の可撓性表示基板の実装領域においても、その裏面側に文献１～５のような補強板により裏打ちし、その後に電子部品を実装することが考えられる。
　しかし、文献１～文献３のような熱硬化性シートを補強板として使用する際、可撓性表示基板の画像表示領域に配置された表示素子（例えば、液晶素子、ＥＬ素子）への影響を低減するために、低温で且つ短時間での処理（１００℃以下／数分）する必要があるが、上記の熱硬化性シートでは、反応速度が不十分で、必要な程度まで熱硬化しない課題がある。
　一方、文献４及び５のような粘着シートを補強板とする場合には上述の問題はないものの、異方性導電膜を実装領域に配置してＩＣ等の電子部品を加熱（１７０℃／５ｓｅｃ）及び加圧すると、粘着シートがその熱で変形を生じ、実装状態が信頼性に欠ける課題がある。特に、ＩＣ等に形成された電極又はバンプ下面の異方性導電膜の導電粒子が十分に変形しておらず、加圧の際に、粘着シートが変形して、その結果、該導電粒子に十分な圧力が掛からないものと推察できる。
　そうすると、文献１～文献３の熱硬化性シートに代えて、低温接続可能なように反応速度を高めるために、硬化剤を増加させることが考えられるが、それでは熱硬化性シートの保存安定性が低下してしまう。
　一方、文献４及び５の粘着シートにおける粘着剤のガラス転移温度を、高めにシフトすることが考えられるが、単にガラス転移温度を高めるだけでは、異方性導電膜を加熱及び加圧により粘着シートの変形は避けられず、また、ガラス転移温度を高めにすると、総じて粘着シートの剥離強度が低下してしまう。
　上記のような課題を解決するため、本発明は、可撓性基板（１１）の一方の表面である配置面（７）に設けられた実装領域（１０）に、導電粒子（１９）を含有する熱硬化性の異方性導電膜（１２）を配置する異方性導電膜配置工程と、前記実装領域（１０）に配置された前記異方性導電膜（１２）上に電子部品（９）を配置する電子部品配置工程と、前記電子部品のバンプ（１３）と前記異方性導電膜（１２）とを接触させた状態で、前記電子部品（９）を加熱しながら押圧し、前記バンプ（１３）と、前記実装領域（１０）に設けられた電極（６）とを導電粒子（１９）を介して電気的に接続する実装工程と、
を有する可撓性実装モジュール体（１５）の製造方法において、
　前記配置面（７）とは反対側の面である前記可撓性基板（１１）の支持面（８）のうち、少なくとも前記実装領域（１０）の真裏に位置する部分に、粘着剤（２６）を含有する粘着剤層（２１）と基材フィルム（２２）とが積層された粘着フィルム（２０）を貼付する粘着フィルム貼付工程を有し、
　前記粘着剤層（２１）には一次粒子径１００ｎｍ未満のシリカ微粒子（２５）が含有され、前記粘着剤層（２１）が１６０℃で０．１５ＭＰａ以上のせん断貯蔵弾性率を有するようされており、前記粘着フィルム貼付工程を、前記実装工程よりも前に行うことを特徴とする可撓性実装モジュール体（１５）の製造方法である。
　また、本発明は、前記粘着剤（２６）は、ガラス転移温度が、－６０℃以上２０℃以下の範囲である可撓性実装モジュール体（１５）の製造方法である。
　本発明は、前記実装工程は、前記電子部品（９）を加熱しながら押圧を行うときに、前記電子部品（９）を、１５０℃以上１７０℃以下の温度範囲に加熱する可撓性実装モジュール体（１５）の製造方法である。
　本発明は、前記粘着フィルム貼付工程は、前記粘着フィルム（２０）を貼付する前記支持面（８）の部分に、前記画像表示領域（１６）の真裏に位置する部分を含ませることを特徴とする可撓性実装モジュール体（１５）の製造方法である。
　本発明は、前記粘着剤（２６）はニトリルゴムである可撓性実装モジュール体（１５）の製造方法である。
　本発明は、前記粘着剤層（２１）中のニトリルゴムには、アクリルニトリルが１８重量％以上４０．５重量％以下の割合で含有される可撓性実装モジュール体（１５）の製造方法である。
　本発明は、粉体の状態の前記粘着剤（２６）１００重量部に対し、前記シリカ微粒子（２５）を５重量部以上含有する前記粘着剤（２６）の溶液を、前記基材フィルム（２２）上に配置して、前記粘着剤層（２１）を形成する粘着剤層形成工程を有する可撓性実装モジュール体（１５）の製造方法である。
　上記のような本発明は、フィルム液晶ディスプレイやフレキシブル有機ＥＬディスプレイなどに使用される可撓性表示基板や、フレキシブルプリント配線板などのベース材となる「可撓性基板」の裏側に補強板となる粘着フィルムを貼付し、異方性導電膜を使ってＩＣ等の電子部品を実装する際、当該粘着フィルムの粘着剤層が、所定のせん断貯蔵弾性率を示すように調整されているので、加熱及び押圧の際、ＩＣ等の電極によっては粘着剤層の変形が少ない。
　また、粘着剤層の所定の材質を選択することで、可撓性基板に対する剥離強度を高めることができる。
　したがって、本発明の可撓性実装モジュールの製造方法によれば、異方性導電膜により電子部品を加熱押圧する際、補強板として、粘着剤層の変形が少ない粘着フィルムを使用するので、異方性導電膜に存在する導電粒子を変形又は潰れる程度に確実に圧力を加えることができ、モジュールの電気的接続が確実になる。
（ａ）～（ｄ）：本発明の工程を説明するための図（１） （ｅ）、（ｆ）：本発明の工程を説明するための図（２） （ｅ）、（ｆ）：支持面のうち、画像表示領域の裏面位置に粘着フィルムを配置しない場合の工程を説明するための図
　図２（ｆ）の符号１５は、本発明によって得られる可撓性実装モジュール体であり、ポリイミドフィルムまたはポリカーボネートフィルム、ポリエーテルサルフォンフィルム、ポリエステルフィルムなどから成る可撓性基板（１１）と、集積回路である電子部品（９）と、柔軟性を有する表示装置（５）と、補強板としての粘着フィルム（２０）とを有している。
　ポリイミド又はポリエステルフィルムからなる可撓性基板（１１）の片面の配置面（７）には、画像表示領域（１６）と実装領域（１０）とが設けられており、表示装置（５）は画像表示領域（１６）に配置され、電子部品（９）は実装領域（１０）に配置されており、電子部品（９）と表示装置（５）とはパターニングされた配線膜（不図示）によって電気的に接続され、電子部品（９）を含む電気回路が表示装置（５）に出力する電気信号によって、表示装置（５）に文字や映像等が表示されるようになっている。
　表示装置（５）は、柔軟性を有しており、可撓性基板（１１）と一緒に湾曲可能になっている。
　粘着フィルム（２０）は、ポリエステルフィルム、ＯＰＰフィルム、ＰＥフィルム、ＰＶＡフィルム、ＰＶＣフィルムなどのような柔軟性を有する基材フィルム（２２）と、基材フィルム（２２）上に配置された柔軟性を有する粘着剤層（２１）とを有している。符号８は、可撓性基板（１１）の配置面（７）とは反対側の面である支持面であり、支持面（８）のうち、実装領域（１０）の真裏位置の部分には、粘着剤層（２１）が接触して粘着フィルム（２０）が貼付されている。
　支持面（８）のうち、実装領域（１０）の真裏位置の部分に加え、画像表示領域（１６）の真裏位置の部分にも接着フィルム（２０）が貼付されている。
　粘着剤層（２１）は、非熱硬化性の樹脂から成る粘着剤（２６）と、粘着剤（２６）に分散された一次粒子径１００ｎｍ未満のシリカ微粒子（２５）とを有している。
　直径１００ｎｍ未満のシリカ微粒子（２５）の形状は、特に限定がなく、球状、不定形、燐片状など各種の形状が使用できる。このようなシリカ微粒子は、例えば、日本アエロジル株式会社が販売する登録商標アエロジルのシリーズや、株式会社トクヤマの登録商標レオロシールのシリーズなどの市販品が入手でき、且つ使用可能である。
　また、非熱硬化性の樹脂には、粘着剤として十分な剥離強度が得られ、異方性導電膜の加熱及び押圧する際に到達する高温時（１６０℃程度）においても、比較的変形が少ないように、ガラス転移温度が－６０℃以上２０℃以下の範囲を有する樹脂から選択することができる。
　具体的には、ニトリルゴム（ＮＢＲ：アクリロニトリルと　１，３-ブタジエンとの共重合体）、ブチルゴム、エチレンプロピレンゴムなどのゴム系ポリマーや、通常の粘着剤に用いられるアクリルポリマーなど可撓性基板（１１）の材質との関係で選択して使用することができる。
　電子部品（９）を可撓性基板（１１）に搭載する手順について説明する。
　図１（ａ）の可撓性基板（１１）は、画像表示領域（１６）に表示装置（５）が設けられ、電子部品（９）が搭載されていない状態である。この状態の可撓性基板（１１）では、配置面（７）の実装領域（１０）内に、パターニングされた金属薄膜やＩＴＯ、ＩＺＯなどから成る電極（６）の表面が露出されている。
　この可撓性基板（１１）の支持面（８）のうち、少なくとも実装領域（１０）の真裏位置の支持面（８）を粘着剤層（２１）に接触させ、粘着フィルム（２０）と可撓性基板（１１）とを、互いに押圧しながら粘着フィルム（２０）を加熱し、粘着フィルム（２０）を第一の貼付温度にして、同図（ｂ）に示すように、粘着フィルム（２０）を可撓性基板（１１）に貼付する。
　この貼付の際、粘着剤層（２１）の粘着剤は熱硬化性樹脂ではないので、第一の貼付温度は室温に近く、可撓性基板（１１）が変形する温度よりも低温である。
　次いで、同図（ｃ）に示すように、電極（６）上に、エポキシ樹脂やアクリル樹脂等の熱硬化性樹脂組成物中に、導電粒子（１９）が分散された異方性導電膜（１２）を、電極（６）の表面に接触して配置する。
　そして、同図（ｄ）に示すように、異方性導電膜（１２）上に電子部品（９）を乗せる。
　電子部品（９）には、半導体チップを内蔵する素子本体（１４）の底面に、半導体チップと電気的に接続されたバンプ（１３）が設けられており、バンプ（１３）を可撓性基板（１１）側に向けて実装領域（１０）上に配置したときに、バンプ（１３）と配置面（７）の間に電極（６）が位置するようにされている。
　粘着フィルム（２０）の基材フィルム（２２）が台（３０）の表面に接触するように、粘着フィルム（２０）が貼付された可撓性基板（１１）を台（３０）上に配置し、電極（６）上にバンプ（１３）が位置するように、電子部品（９）を異方性導電膜（１２）上に配置し、電子部品（９）の素子本体（１４）の表面上に、図２（ｅ）に示すように、押圧部材（３１）を接触させると共に電子部品（９）のバンプ（１３）を異方性導電膜（１２）に接触させた状態で、押圧部材（３１）によって電子部品（９）を押圧する。
　押圧部材（３１）の内部には、発熱装置が設けられており、押圧部材（３１）は発熱装置によって加熱され、所定温度に昇温されており、電子部品（９）は、押圧のために押圧部材（３１）が接触され、熱伝導によって加熱され、昇温する。
　異方性導電膜（１２）はバンプ（１３）に接触しており、電子部品（９）が押圧されると、異方性導電膜（１２）は、バンプ（１３）によって押圧される。この異方性導電膜（１２）と、電極（６）と、可撓性基板（１１）と、粘着フィルム（２０）とは、バンプ（１３）と異方性導電膜（１２）とが接触する部分と台（３０）との間で一直線に並んでおり、台（３０）が静止して電子部品（９）が押圧されることで、バンプ（１３）と台（３０）とが互いに押圧されると、電極（６）と、可撓性基板（１１）と、粘着フィルム（２０）とも押圧される。また、加熱された電子部品（９）が昇温すると、電子部品（９）からの熱伝導によって、異方性導電膜（１２）と、電極（６）と、可撓性基板（１１）と、粘着フィルム（２０）とも熱伝導によって加熱され、昇温する。
　押圧された粘着フィルム（２０）の粘着剤層（２１）では、押圧力によって、粘着剤層（２１）中の粘着剤（２６）も昇温し軟化して、粘着剤が変形しやすくなる。
　異方性導電膜に用いられる導電粒子（１９）の樹脂粒子は、エポキシ樹脂、フェノール樹脂、アクリル樹脂、アクリロニトリル・スチレン（ＡＳ）樹脂、ベンゾグアナミン樹脂、ジビニルベンゼン系樹脂、スチレン系樹脂等の材質が熱硬化性である接着剤特性に合わせて適宜選択される。
　電子部品（９）が台（３０）に押圧されると、バンプ（１３）は導電粒子（１９）と接触して導電粒子（１９）を押圧し、導電粒子（１９）を電極（６）に押し付ける。
　そのとき、電極（６）の、導電粒子（１９）が押し付けられた部分の真下位置では、粘着剤層（２１）が強く押圧され、その周囲の粘着剤層（２１）よりも、粘着剤（２６）が大きく変形してしまう。その結果、粘着剤層（２１）と、その上の部分の電極（６）には、周囲よりも窪んだ凹みが発生して、導電粒子（１９）が電極（６）の凹みの中に入ると、導電粒子（１９）は強く押圧されなくなる。
　しかし、本発明では、粘着剤層（２１）は、シリカ微粒子（２５）を含有しており、せん断貯蔵弾性率が、１６０℃において０．１５ＭＰａ以上になるようにされている。
　電子部品（９）が押圧されても、押圧された粘着剤（２６）は、可撓性基板（１１）と基材フィルム（２２）との間から押し出されず、粘着剤層（２１）と電極（６）には凹みが発生せず、導電粒子（１９）は、バンプ（１３）と電極（６）に挟まれて潰され、バンプ（１３）と電極（６）との間が電気的に接続される。
　要するに、電子部品（９）が、電子部品（９）上の押圧部材（３１）によって加熱及び押圧されると、押圧部材（３１）の押圧力によって、バンプ（１３）と電極（６）の間に位置する導電粒子（１９）が潰されて、バンプ（１３）と電極（６）との間の電気的接続が確実な可撓性実装モジュール体（１５）が得られる（図２（ｆ））。
　なお、異方性導電膜（１２）によって、電子部品（９）を電極（６）に電気的、機械的に接続するためには、通常、電子部品（９）は、１５０℃以上１７０℃以下の範囲に昇温され、粘着フィルム（２０）も、それに近い温度に昇温される。
　従って、本発明に用いる粘着剤層（２１）は、シリカ微粒子（２５）の含有量を調整することで、電子部品（９）に近い温度に昇温したときのせん断貯蔵弾性率が、０．１５ＭＰａ以上になるようにすることが望ましい。
　具体的には、上記の昇温範囲においては、粘着剤層中に、０．５重量％以上２０重量％以下の範囲で含有させることが好ましい。
　他方、粘着剤（２６）については、強い粘着力を得るために、ガラス転移温度が、－６０℃以上２０℃以下の範囲であることが望ましく、本発明では、流動性が大きい粘着剤（２６）であっても、１００ｎｍ未満のシリカ微粒子（２５）を含有させることで、粘着剤層（２１）のせん断貯蔵弾性率を０．１５ＭＰａ以上にしている。
　また、本発明では、可撓性基板（１１）の裏面にポリイミドフィルムが露出していて、そのポリイミドフィルムに粘着剤層（２１）が粘着される場合には、粘着剤（２６）は、ニトリルゴムであることが望ましく、また、ニトリルゴム中のアクリルニトリル量は、１８重量％以上４０．５％重量以下の割合で含有されていることが望ましい。
　なお、上記のアクリルニトリル量は、結合アクリルニトリル量平均値（ＪＩＳＫ　６３８４）である。
　なお、図３（ｅ）のように、支持面（８）のうち、実装領域（１０）の裏面側に粘着フィルム（２０）を配置し、画像表示領域（１６）の裏面側の表面を露出させて、画像表示領域（１６）の裏面側の表面と、粘着フィルム（２０）の基材フィルム（２２）とを台（３０）に接触させ、実装領域（１０）上に配置された電子部品（９）を押圧部材（３１）で押圧して、同図（ｆ）に示すように、支持面（８）のうち、画像表示領域（１６）の裏面側の部分を露出させ、実装領域（１０）の裏面側の部分に粘着フィルム（２０）が位置し、画像表示領域（１６）の裏面側の部分には位置しない可撓性実装モジュール体１５’を得ることもできる。
　要するに、本発明は、少なくとも実装領域（１０）の真裏位置に粘着フィルム（２０）が配置されていればよい。
　なお、図２（ｆ）のように、画像表示領域（１６）の真裏位置の部分にも接着フィルム（２０）が貼付されていれば、画像表示領域（１６）の裏面側と実装領域（１０）の裏面側の両方に粘着フィルム（２０）が位置するから、可撓性基板（１１）を平坦面上に配置しても、段差等の変形は生じない。
　以下に実施例を用いて、更に具体的に説明する。
　まず、溶剤であるＭＥＫ（メチルエチルケトン）中に、アクリロニトリルゴム（ＮＢＲ－１、結合アクリルニトリル量の中心値が１８％）１００質量部を溶解させた樹脂溶液を攪拌しながら、一次粒子径１２ｎｍのシリカ微粒子（２５）（日本アエロジル社、アエロジルＲ－９７４）を５質量部ほど添加した後、更に分散処理を行なって、アクリルニトリル樹脂溶液にシリカ微粒子が分散した分散液を得た。
　次に、上記の分散液を塗布装置に投入し、基材フィルム（２２）（ポリエチレンテレフタレートフィルム、７５μｍ厚）に塗布し、乾燥炉にて上記ＭＥＫを揮発させて、厚み約１７μｍ（基材フィルムと合わせて約９２μｍ厚）の粘着剤層（２１）が形成された実施例１の粘着フィルム（２０）を得た。
　次に、上記のシリカ微粒子の添加量を、１０質量部、１５質量部に変えた以外は、実施例１と同様の方法で、実施例２及び実施例３の粘着フィルム（２０）を得た。
　次に、アクリルニトリルゴムにおけるアクリル含有量を、表２のように変えた以外は、実施例１と同様の方法で、実施例４及び実施例５の粘着フィルム（２０）を得た。
　他方、シリカ微粒子を添加しない以外は、実施例１と同様の方法で、比較例としての粘着フィルムを得た。
（剥離強度測定）
　各実施例の粘着フィルム（２０）及び比較例の粘着フィルムを、常温にて、可撓性基板（１１）（約１０μｍ厚のポリイミドフィルム基板）に対し、常温で、圧力０．３４ＭＰａ及び５００ｍｍ／ｍｉｎの条件にてラミネートしたサンプル片を作成し、そのサンプル片の剥離強度（１８０℃ピール強度）を、剥離強度測定器（オリエンテック社、テンシロン）を使って測定しその結果を評価した。その際の評価基準は、下記の通りである。
　評価基準
　１２Ｎ／２ｃｍ以上の場合は大変優れた特性であることを示す「◎」と評価される。
　８Ｎ／２ｃｍ以上１２Ｎ／２ｃｍ未満の場合は優れた特性であることを示す「○」と評価される。
　５Ｎ／２ｃｍ以上８Ｎ／２ｃｍ未満の場合は通常の特性であることを示す「△」と評価される。なお、「△」と評価されても、通常の検査により良品及び不良品を判別することができるから、実質上に使用可能である。
　５Ｎ／２ｃｍ未満の場合は、劣った特性であることを示す「×」と評価される。
（導通抵抗及び圧着状態）
　また、可撓性基板（１１）（ここでは、約１０μｍ厚みポリイミドフィルムに接続用電極を設けたサンプル基板）の電極（６）の裏面側に各実施例及び比較例の粘着フィルムを上記のサンプル片を作成した条件で貼付し、次いで、その電極（６）上に異方性導電膜（１２）（ＤＰ３３４２ＭＳ、デクセリアルズ社）を配置し、抵抗値測定用の電子部品（９）を加熱及び圧着（１６０℃－１ＭＰａ－６ｓｅｃ）し、電子部品（９）のバンプ（１３）と電極（６）との間の導通抵抗値測定と断面による圧着状態の確認（導電粒子の変形又は潰れ度合い）を、金属顕微鏡により行った。
　なお、上記の異方性導電膜（１２）に含有されている導電粒子（１９）は、樹脂粒子にニッケル／金メッキを施され、その平均粒子径が４μｍである。
　圧縮状態の評価基準
　導電粒子が３０％以上圧縮変形又は潰れているものを優れたとことを示す「○」と評価した。
　導電粒子が３０％の変形に至らないものを劣ったことを示す「×」と評価した。
（せん断貯蔵弾性率の測定）
　実施例及び比較例の粘着フィルムに対し、粘弾性測定装置（ＨＡＡＫＥ社製、品番ＲＳ－１５０）を用いて、１６０℃におけるせん断貯蔵弾性率Ｇ’を得た。
　そして、実施例及び比較例の粘着フィルムの粘着剤層の成分を改めて表１に記載すると共に、上記の方法により得られた測定及び観察結果も合わせて表１に記載した。
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000002
　表１の通り、シリカ微粒子を含有しない比較例では、ピール強度は◎と良好であるが、シリカ微粒子が含有されておらず、そのためにせん断貯蔵弾性率が低い。その結果、異方性導電膜による導電粒子の変形が不十分になり、バンプと電極との間の電気的接続が十分でないことがわかる。
　その一方で、シリカ微粒子が含有され、そのせん断貯蔵弾性率が０．１５ＭＰａを超えた粘着剤層をもつ各実施例では、電気的接続及び剥離強度が共に良好なことがわかる。
　なお、アクリルニトリル量を１８重量％以上４０．５重量％以下の範囲で使用すると、可撓性基板（１１）に対する剥離強度を調整することができ、特に下限側の１８％とした場合には被着体がポリイミド基板である場合、高い剥離強度を得られることがわかる。
　７‥‥配置面
　８‥‥支持面
　９‥‥電子部品
１０‥‥実装領域
１１‥‥可撓性基板
１２‥‥異方性導電膜
１３‥‥バンプ
２０‥‥粘着フィルム
２１‥‥粘着剤層
２２‥‥基材フィルム
２５‥‥シリカ微粒子
２６‥‥粘着剤 

Claims (7)

  1. 　可撓性基板（１１）の一方の表面である配置面（７）に設けられた実装領域（１０）に、導電粒子（１９）を含有する熱硬化性の異方性導電膜（１２）を配置する異方性導電膜配置工程と、
    　前記実装領域（１０）に配置された前記異方性導電膜（１２）上に電子部品（９）を配置する電子部品配置工程と、
    　前記電子部品のバンプ（１３）と前記異方性導電膜（１２）とを接触させた状態で、前記電子部品（９）を加熱しながら押圧し、前記バンプ（１３）と、前記実装領域（１０）に設けられた電極（６）とを導電粒子（１９）を介して電気的に接続する実装工程と、
    を有する可撓性実装モジュール体（１５）の製造方法において、
    　前記配置面（７）とは反対側の面である前記可撓性基板（１１）の支持面（８）のうち、少なくとも前記実装領域（１０）の真裏に位置する部分に、粘着剤（２６）を含有する粘着剤層（２１）と基材フィルム（２２）とが積層された粘着フィルム（２０）を貼付する粘着フィルム貼付工程を有し、
    　前記粘着剤層（２１）には一次粒子径１００ｎｍ未満のシリカ微粒子（２５）が含有され、前記粘着剤層（２１）が１６０℃で０．１５ＭＰａ以上のせん断貯蔵弾性率を有するようされており、
    　前記粘着フィルム貼付工程を、前記実装工程よりも前に行うことを特徴とする可撓性実装モジュール体（１５）の製造方法。
  2. 　前記粘着剤（２６）は、ガラス転移温度が、－６０℃以上２０℃以下の範囲である請求項１記載の可撓性実装モジュール体（１５）の製造方法。
  3. 　前記実装工程は、前記電子部品（９）を加熱しながら押圧を行うときに、前記電子部品（９）を、１５０℃以上１７０℃以下の温度範囲に加熱する請求項１又は請求項２のいずれか１項記載の可撓性実装モジュール体（１５）の製造方法。
  4. 　前記粘着フィルム貼付工程は、前記粘着フィルム（２０）を貼付する前記支持面（８）の部分に、前記画像表示領域（１６）の真裏に位置する部分を含ませることを特徴とする請求項１又は請求項２のいずれか１項記載の可撓性実装モジュール体（１５）の製造方法。
  5. 　前記粘着剤（２６）はニトリルゴムである請求項１又は請求項２のいずれか１項記載の可撓性実装モジュール体（１５）の製造方法。
  6. 　前記粘着剤層（２１）中のニトリルゴムには、アクリルニトリルが１８重量％以上４０．５重量％以下の割合で含有される請求項４記載の可撓性実装モジュール体（１５）の製造方法。
  7. 　粉体の状態の前記粘着剤（２６）１００重量部に対し、前記シリカ微粒子（２５）を５重量部以上含有する前記粘着剤（２６）の溶液を、前記基材フィルム（２２）上に配置して、前記粘着剤層（２１）を形成する粘着剤層形成工程を有する請求項１又は請求項２のいずれか１項記載の可撓性実装モジュール体（１５）の製造方法。
     
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