JP2015177180A - 可撓性実装モジュール体の製造方法 - Google Patents
可撓性実装モジュール体の製造方法 Download PDFInfo
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- JP2015177180A JP2015177180A JP2014055163A JP2014055163A JP2015177180A JP 2015177180 A JP2015177180 A JP 2015177180A JP 2014055163 A JP2014055163 A JP 2014055163A JP 2014055163 A JP2014055163 A JP 2014055163A JP 2015177180 A JP2015177180 A JP 2015177180A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K3/3494—Heating methods for reflowing of solder
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
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Abstract
Description
上記の補強板には、具体的に、文献1〜文献3のような熱硬化性タイプの補強板、すなわち熱硬化性シートや、文献4及び文献5のような粘着シートがある。
しかし、文献1〜文献3のような熱硬化性シートを補強板として使用する際、可撓性表示基板の画像表示領域に配置された表示素子(例えば、液晶素子、EL素子)への影響を低減するために、低温で且つ短時間での処理(100℃以下/数分)する必要があるが、上記の熱硬化性シートでは、反応速度が不十分で、必要な程度まで熱硬化しない課題がある。
一方、文献4及び5の粘着シートにおける粘着剤のガラス転移温度を、高めにシフトすることが考えられるが、単にガラス転移温度を高めるだけでは、異方性導電膜を加熱及び加圧により粘着シートの変形は避けられず、また、ガラス転移温度を高めにすると、総じて粘着シートの剥離強度が低下してしまう。
一方の表面である配置面(7)に電子部品(9)の実装領域(10)を有する可撓性基板(11)と、導電粒子(19)を含有する熱硬化性の異方性導電膜(12)と、バンプ(13)を有する電子部品(9)とを用意する工程と、
前記実装領域(10)へ前記異方性導電膜(12)を配置する工程と、
前記異方性導電膜(12)上に前記電子部品(9)を配置する工程と、
前記電子部品(9)を加熱及び押圧し、前記電子部品(9)の前記バンプ(13)と前記可撓性基板(11)の実装領域(10)とを電気的に接続する実装工程と、
を有する可撓性実装モジュール体(15)の製造方法において、
前記可撓性基板(11)の前記配置面(7)とは反対側の面である支持面(8)のうち、少なくとも前記実装領域(10)の裏面側の部分の位置に、粘着剤(26)を含有する粘着剤層(21)と基材フィルム(22)とが積層された粘着フィルム(20)を、前記電子部品(9)を前記実装領域(10)と電気的に接続する前に予め貼付しておき、
前記粘着剤層(21)は、前記電子部品(9)の加熱及び押圧の際に、160℃において0.15MPa以上のせん断貯蔵弾性率を有するように、一次粒子径100nm未満のシリカ微粒子(25)が含有されたことを特徴とする可撓性実装モジュール体(15)の製造方法である。
前記支持面(8)のうち、前記実装領域(10)の裏面側の部分に加え、前記画像表示領域(16)の裏面側に位置する部分に前記接着フィルム(20)を配置してもよい。
前記電子部品(9)を加熱及び押圧する際に、前記電子部品(9)の温度が150℃以上170℃以下の範囲に昇温させる可撓性実装モジュール体(15)の製造方法である。(請求項3)
粉体の状態の前記粘着剤(26)100重量部に対し、前記シリカ微粒子(25)を5重量部以上含有する前記粘着剤(26)の溶液を、前記基材フィルム(22)上に配置して、前記粘着剤層(21)を形成する可撓性実装モジュール体(15)の製造方法である。(請求項7)
また、粘着剤層の所定の材質を選択することで、可撓性基板に対する剥離強度を高めることができる。
表示装置(5)は、柔軟性を有しており、可撓性基板(11)と一緒に湾曲可能になっている。
支持面(8)のうち、実装領域(10)の真裏位置の部分に加え、画像表示領域(16)の真裏位置の部分にも接着フィルム(20)が貼付されている。
粘着剤層(21)は、非熱硬化性の樹脂から成る粘着剤(26)と、粘着剤(26)に分散された一次粒子径100nm未満のシリカ微粒子(25)とを有している。
このようなシリカ微粒子は、例えば、日本アエロジル社のアエロジルシリーズ、及びトクヤマ社のレオロシールシリーズなどの市販品が入手でき、且つ使用可能である。
具体的には、ニトリルゴム(NBR:アクリロニトリルと 1,3-ブタジエンとの共重合体)、ブチルゴム、エチレンプロピレンゴムなどのゴム系ポリマーや、通常の粘着剤に用いられるアクリルポリマーなど可撓性基板(11)の材質との関係で選択して使用することができる。
図1(a)の可撓性基板(11)は、画像表示領域(16)に表示装置(5)が設けられ、電子部品(9)が搭載されていない状態である。この状態の可撓性基板(11)では、配置面(7)の実装領域(10)内に、パターニングされた金属薄膜やITO、IZOなどから成る電極(6)の表面が露出されている。
この貼付の際、粘着剤層(21)の粘着剤は熱硬化性樹脂ではないので、第一の貼付温度は室温に近く、可撓性基板(11)が変形する温度よりも低温である。
そして、同図(d)に示すように、異方性導電膜(12)上に電子部品(9)を乗せる。
電子部品(9)には、半導体チップを内蔵する素子本体(14)の底面に、半導体チップと電気的に接続されたバンプ(13)が設けられており、バンプ(13)を可撓性基板(11)側に向けて実装領域(10)上に配置したときに、バンプ(13)と配置面(7)の間に電極(6)が位置するようにされている。
押圧部材(31)の内部には、発熱装置が設けられており、押圧部材(31)は発熱装置によって加熱され、所定温度に昇温されており、電子部品(9)は、押圧のために押圧部材(31)が接触され、熱伝導によって加熱され、昇温する。
異方性導電膜に用いられる導電粒子(19)の樹脂粒子は、エポキシ樹脂、フェノール樹脂、アクリル樹脂、アクリロニトリル・スチレン(AS)樹脂、ベンゾグアナミン樹脂、ジビニルベンゼン系樹脂、スチレン系樹脂等の材質が熱硬化性である接着剤特性に合わせて適宜選択される。
そのとき、電極(6)の、導電粒子(19)が押し付けられた部分の真下位置では、粘着剤層(21)が強く押圧され、その周囲の粘着剤層(21)よりも、粘着剤(26)が大きく変形してしまう。その結果、粘着剤層(21)と、その上の部分の電極(6)には、周囲よりも窪んだ凹みが発生して、導電粒子(19)が電極(6)の凹みの中に入ると、導電粒子(19)は強く押圧されなくなる。
しかし、本発明では、粘着剤層(21)は、シリカ微粒子(25)を含有しており、せん断貯蔵弾性率が、160℃において0.15MPa以上になるようにされている。
電子部品(9)が押圧されても、押圧された粘着剤(26)は、可撓性基板(11)と基材フィルム(22)との間から押し出されず、粘着剤層(21)と電極(6)には凹みが発生せず、導電粒子(19)は、バンプ(13)と電極(6)に挟まれて潰され、バンプ(13)と電極(6)との間が電気的に接続される。
なお、異方性導電膜(12)によって、電子部品(9)を電極(6)に電気的、機械的に接続するためには、通常、電子部品(9)は、150℃以上170℃以下の範囲に昇温され、粘着フィルム(20)も、それに近い温度に昇温される。
具体的には、上記の昇温範囲においては、粘着剤層中に、0.5〜20重量%の範囲で含有させることが好ましい。
なお、上記のアクリルニトリル量は、結合アクリルニトリル量平均値(JISK 6384)である。
なお、図2−2(e)のように、支持面(8)のうち、実装領域(10)の裏面側に粘着フィルム(20)を配置し、画像表示領域(16)の裏面側の表面を露出させて、画像表示領域(16)の裏面側の表面と、粘着フィルム(20)の基材フィルム(22)とを台(30)に接触させ、実装領域(10)上に配置された電子部品(9)を押圧部材(31)で押圧して、同図(f)に示すように、支持面(8)のうち、画像表示領域(16)の裏面側の部分を露出させ、実装領域(10)の裏面側の部分に粘着フィルム(20)が位置し、画像表示領域(16)の裏面側の部分には位置しない可撓性実装モジュール体15’を得ることもできる。
要するに、本発明は、少なくとも実装領域(10)の真裏位置に粘着フィルム(20)が配置されていればよい。
なお、図2−1(f)のように、画像表示領域(16)の真裏位置の部分にも接着フィルム(20)が貼付されていれば、画像表示領域(16)の裏面側と実装領域(10)の裏面側の両方に粘着フィルム(20)が位置するから、可撓性基板(11)を平坦面上に配置しても、段差等の変形は生じない。
次に、上記の分散液を塗布装置に投入し、基材フィルム(22)(ポリエチレンテレフタレートフィルム、75μm厚)に塗布し、乾燥炉にて上記MEKを揮発させて、厚み約17μm(基材フィルムと合わせて約92μm厚)の粘着剤層(21)が形成された実施例1の粘着フィルム(20)を得た。
各実施例の粘着フィルム(20)及び比較例の粘着フィルムを、常温にて、可撓性基板(11)(約10μm厚のポリイミドフィルム基板)に対し、常温で、圧力0.34MPa及び500mm/minの条件にてラミネートしたサンプル片を作成し、そのサンプル片の剥離強度(180℃ピール強度)を、剥離強度測定器(オリエンテック社、テンシロン)を使って測定しその結果を評価した。その際の評価基準は、下記の通りである。
評価基準
12N/2cm以上の場合は「◎」。
8〜12N/2cmの場合は「○」。
5〜8N/2cmの場合は「○〜△」。なお、「○〜△」と評価されても、通常の検査により良品及び不良品を判別することができるから、実質上に使用可能である。
5N/2cm未満の場合は、「×」。
また、可撓性基板(11)(ここでは、約10μm厚みポリイミドフィルムに接続用電極を設けたサンプル基板)の電極(6)の裏面側に各実施例及び比較例の粘着フィルムを上記のサンプル片を作成した条件で貼付し、次いで、その電極(6)上に異方性導電膜(12)(DP3342MS、デクセリアルズ社)を配置し、抵抗値測定用の電子部品(9)を加熱及び圧着(160℃−1MPa−6sec)し、電子部品(9)のバンプ(13)と電極(6)との間の導通抵抗値測定と断面による圧着状態の確認(導電粒子の変形又は潰れ度合い)を、金属顕微鏡により行った。
なお、上記の異方性導電膜(12)に含有されている導電粒子(19)は、樹脂粒子にニッケル/金メッキを施され、その平均粒子径が4μmである。
圧縮状態の評価基準
導電粒子が30%以上圧縮変形又は潰れているものを「○」。
導電粒子が30%の変形に至らないものを「×」。
実施例及び比較例の粘着フィルムに対し、粘弾性測定装置(HAAKE社製、品番RS−150)を用いて、160℃におけるせん断貯蔵弾性率G’を得た。
そして、実施例及び比較例の粘着フィルムの粘着剤層の成分を改めて表1に記載すると共に、上記の方法により得られた測定及び観察結果も合わせて表1に記載した。
その一方で、シリカ微粒子が含有され、そのせん断貯蔵弾性率が0.15MPaを超えた粘着剤層をもつ各実施例では、電気的接続及び剥離強度が共に良好なことがわかる。
なお、アクリルニトリル量を18〜40.5%の範囲で使用すると、可撓性基板(11)に対する剥離強度を調整することができ、特に下限側の18%とした場合には被着体がポリイミド基板である場合、高い剥離強度を得られることがわかる。
8‥‥支持面
9‥‥電子部品
10‥‥実装領域
11‥‥可撓性基板
12‥‥異方性導電膜
13‥‥バンプ
20‥‥粘着フィルム
21‥‥粘着剤層
22‥‥基材フィルム
25‥‥シリカ微粒子
26‥‥粘着剤
Claims (7)
- 一方の表面である配置面(7)に電子部品(9)の実装領域(10)を有する可撓性基板(11)と、導電粒子(19)を含有する熱硬化性の異方性導電膜(12)と、バンプ(13)を有する電子部品(9)とを用意する工程と、
前記実装領域(10)へ前記異方性導電膜(12)を配置する工程と、
前記異方性導電膜(12)上に前記電子部品(9)を配置する工程と、
前記電子部品(9)を加熱及び押圧し、前記電子部品(9)の前記バンプ(13)と前記可撓性基板(11)の実装領域(10)とを電気的に接続する実装工程と、
を有する可撓性実装モジュール体(15)の製造方法において、
前記可撓性基板(11)の前記配置面(7)とは反対側の面である支持面(8)のうち、少なくとも前記実装領域(10)の裏面側に位置する部分に、粘着剤(26)を含有する粘着剤層(21)と基材フィルム(22)とが積層された粘着フィルム(20)を、前記電子部品(9)を前記実装領域(10)と電気的に接続する前に予め貼付しておき、
前記粘着剤層(21)は、前記電子部品(9)の加熱及び押圧の際に、160℃において0.15MPa以上のせん断貯蔵弾性率を有するように、一次粒子径100nm未満のシリカ微粒子(25)が含有されたことを特徴とする可撓性実装モジュール体(15)の製造方法。 - 前記支持面(8)のうち、画像表示領域(16)の裏面側に位置する部分に前記接着フィルム(20)を配置することを特徴とする請求項1記載の可撓性実装モジュール体(15)の製造方法。
- 前記電子部品(9)を加熱及び押圧する際に、前記電子部品(9)の温度が150℃以上170℃以下の範囲に昇温させる請求項1又は請求項2のいずれか1項記載の可撓性実装モジュール体(15)の製造方法。
- 前記粘着剤層(21)の前記粘着剤(26)のガラス転移温度が、−60℃〜20℃の範囲である請求項1乃至請求項3のいずれか1項記載の可撓性実装モジュール体(15)の製造方法。
- 前記粘着剤層(21)の前記粘着剤(26)がニトリルゴムである請求項1乃至請求項4のいずれか1項記載の可撓性実装モジュール体(15)の製造方法。
- 前記粘着剤層(21)中のニトリルゴムのアクリルニトリル量が、18〜40.5%である請求項1乃至請求項5のいずれか1項記載の可撓性実装モジュール体(15)の製造方法。
- 粉体の状態の前記粘着剤(26)100重量部に対し、前記シリカ微粒子(25)を5重量部以上含有する前記粘着剤(26)の溶液を、前記基材フィルム(22)上に配置して、前記粘着剤層(21)を形成する請求項1乃至請求項6のいずれか1項記載の可撓性実装モジュール体(15)の製造方法。
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KR102282848B1 (ko) | 2021-07-29 |
US10306772B2 (en) | 2019-05-28 |
CN106105404A (zh) | 2016-11-09 |
US20170006712A1 (en) | 2017-01-05 |
WO2015141345A1 (ja) | 2015-09-24 |
KR20160136347A (ko) | 2016-11-29 |
JP6243764B2 (ja) | 2017-12-06 |
CN106105404B (zh) | 2018-11-30 |
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