WO2015129699A1 - 貫通孔を有する絶縁基板 - Google Patents
貫通孔を有する絶縁基板 Download PDFInfo
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- WO2015129699A1 WO2015129699A1 PCT/JP2015/055258 JP2015055258W WO2015129699A1 WO 2015129699 A1 WO2015129699 A1 WO 2015129699A1 JP 2015055258 W JP2015055258 W JP 2015055258W WO 2015129699 A1 WO2015129699 A1 WO 2015129699A1
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- insulating substrate
- hole
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- sintered body
- alumina
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Definitions
- the present invention relates to a ceramic substrate having a large number of through holes for forming via conductors and through-hole conductors.
- a conductive wiring When mounting an electronic component such as an IC device, it is necessary to form a conductive wiring via a semiconductor holding substrate.
- a method of forming conductive wiring on such a holding substrate a large number of through holes are formed in the holding substrate, and a metal electrode is formed on the side wall of the through hole.
- the diameter of such a through hole is required to be reduced to, for example, 100 ⁇ m or less, and a large number of through holes are required to be formed at a high density.
- the material of the holding substrate is required to have a high resistance in order to suppress a leakage current between the wirings.
- these boards need to be thin to meet the need for low-profile electronic components, so they must be strong, but after electronic components are mounted, they must be separated into pieces by dicing. Therefore, characteristics such as good machinability are also required.
- the through hole is formed by a combination of photolithography and DRIE.
- a sapphire substrate When a higher withstand voltage is required for the insulating substrate, a sapphire substrate is used, and in this case, a laser processing technique is generally used. However, in this case, the sapphire substrate itself may break due to the influence of heat during laser processing or due to a decrease in substrate strength when a large number of holes are formed. In particular, it is considered that the yield decreases as the density of the through holes increases.
- Patent Documents 1 and 2 describe that a through electrode is formed on a wafer made of ceramics such as alumina. Further, it is described that a through hole is formed in the wafer by laser processing.
- Patent Document 3 a through hole is formed in a ceramic substrate, and the through hole is formed by a pin in a green sheet of the ceramic substrate.
- Patent Document 4 also describes forming a through electrode on a ceramic substrate.
- Patent Document 5 describes that a through-hole having a diameter of 100 ⁇ m or less is formed by irradiating a laser on a green sheet of a ceramic substrate such as alumina.
- An insulating substrate made of an alumina sintered body has high toughness and can generally ensure a sufficiently high substrate strength.
- an abnormality in the shape of the through-hole occurs, there is a risk of causing damage or cracking when the high temperature is applied in the subsequent electrode formation process or semiconductor processing process, and may cause a conduction failure.
- the ceramic substrate becomes thinner, the influence of the shape abnormality of the through hole becomes larger.
- chipping, cracks, etc. are likely to occur during dicing.
- An object of the present invention is to obtain a substrate that can be thinned and has good dicing properties while preventing a shape abnormality of the through hole when forming the through hole in the ceramic insulating substrate.
- the present invention is an insulating substrate in which through holes for conductors are arranged,
- the thickness of the insulating substrate is 25 to 300 ⁇ m
- the diameter of the through hole is 20 ⁇ m or more
- the insulating substrate is made of an alumina sintered body
- the relative density of the alumina sintered body is 99.5% or more
- the average grain size The diameter is 2 to 50 ⁇ m.
- the present inventor examined the cause of abnormal shape of the through hole when a large number of through holes were formed in the alumina substrate. For example, as shown in FIG. 1B, such a through hole 2 swells toward one side, and a swelled portion 3 is formed.
- voids due to coarse pores remaining in the dense alumina sintered body are connected to the relatively fine through-hole 2 and integrated. It was considered a thing. Such voids are caused by coarse pores having a diameter of 10 ⁇ m or more.
- the glass portion contained in the substrate is soft, so the glass is gradually scraped to a grindstone and becomes a fine abrasive powder, while the alumina portion is scraped to peel off from the grain boundary, It was found that the peeled alumina particles were directly used as polishing powder. From this, it was considered that the generation of fine cutting powder can be suppressed by reducing the glass component contained in the substrate and increasing the particle size of the alumina particles.
- the inventor further examined the material of the dense alumina sintered body based on such knowledge. Since a large number of through electrodes are formed on this substrate, it is desirable to employ a high-purity alumina sintered body in order to achieve high resistance. However, at the same time, by controlling so that the average particle diameter is 2 to 50 ⁇ m and the relative density is 99.5% or more, coarse pores having a diameter of 10 ⁇ m or more can be suppressed, and abnormal shape of the through holes can be prevented. Furthermore, the inventors have found that it is possible to prevent the generation of fine grinding powder and to suppress the occurrence of defects such as chipping and cracking during dicing due to clogging of the grindstone.
- (A) is a top view which shows typically the insulated substrate 1 in which the through-hole 2 was formed
- (b) is a schematic diagram which shows the shape abnormality of the through-hole 2
- (c) is a through-hole. It is sectional drawing which shows typically the insulating substrate 1 in which 2 was formed. It is a schematic diagram which shows the example of calculation of an average particle diameter.
- It is a flowchart which shows an example of the suitable manufacturing procedure of an insulated substrate.
- the insulating substrate 1 is provided with one main surface 1a and the other main surface 1b, and a through-hole penetrating between the main surfaces 1a and 1b. 2 is formed in large numbers.
- a predetermined conductor can be formed in the through hole.
- a conductor Ag, Au, Cu, Pd, or a mixture thereof, or a paste obtained by mixing a small amount of glass component with these, is filled into the hole inner surface, and then baked at 400 to 900 ° C. to be fixed.
- Examples of the conductors (via conductors), conductors printed only on the inner surfaces of the holes, and baked in the same manner (through-hole conductors) can be exemplified, but the form of the conductors is not particularly limited.
- predetermined wirings, pads, and the like are formed on the main surfaces 1a and 1b of the through holes.
- the insulating substrate is an integral relay substrate.
- the thickness of the insulating substrate is 25 to 300 ⁇ m. From the viewpoint of reducing the height, the thickness of the insulating substrate is set to 300 ⁇ m or less, preferably 250 ⁇ m or less, and more preferably 200 ⁇ m or less. Further, from the viewpoint of the strength necessary for handling the insulating substrate, the thickness of the insulating substrate is 25 ⁇ m or more, preferably 50 ⁇ m or more, and more preferably 100 ⁇ m or more.
- the diameter W of the through hole formed in the insulating substrate is 20 ⁇ m or more. This through hole diameter is more preferably 25 ⁇ m or more from the viewpoint of ease of molding. Further, in order to increase the density of the through holes, the through hole diameter W is set to 100 ⁇ m or less, more preferably 80 ⁇ m or less.
- the distance D between the adjacent through holes 2 is preferably 50 ⁇ m or more, and more preferably 100 ⁇ m or more, from the viewpoint of suppressing breakage and cracks. Further, the distance D between adjacent through holes 2 is preferably 1000 ⁇ m or less, and more preferably 500 ⁇ m or less, from the viewpoint of improving the density of the through holes.
- the relative density of the alumina sintered body constituting the insulating substrate is set to 99.5% or more, more preferably 99.6% or more. This upper limit is not particularly limited and may be 100%.
- the porosity is determined as follows. That is, the cross section (cross section perpendicular to the bonding surface) of the handle substrate is mirror-polished and thermally etched to highlight the crystal grain boundary, and then an optical micrograph (200 times) is taken. Then, a layered visual field of 0.1 mm is set in the thickness direction (direction perpendicular to the bonding surface) of the handle substrate and 1.0 mm in the direction horizontal to the bonding surface. Then, for each visual field, the total area of pores having a size of 0.5 ⁇ m or more is calculated, and the visual field area ratio is calculated from the obtained pore area to obtain the porosity.
- the average particle size of the alumina sintered body constituting the insulating substrate is set to 2 to 50 ⁇ m.
- the average particle diameter of the alumina sintered body constituting the above is preferably 20 ⁇ m or less, and more preferably 10 ⁇ m or less.
- the occurrence of chipping during dicing can be suppressed by setting the average particle size to 2 ⁇ m or more.
- the average particle diameter is preferably 3 ⁇ m or more, and more preferably 3.5 ⁇ m or more.
- FIG. 1 An example of calculating the average particle diameter is shown in FIG.
- the alumina purity of the alumina sintered body constituting the insulating substrate is 99.9%. This can prevent contamination of the circuit and the like.
- the alumina purity of the alumina sintered body is determined by dissolving a sample pulverized in a powder form by sulfuric acid decomposition with sulfuric acid, and analyzing the solution by ICP emission spectrometry.
- 200 to 800 ppm by mass of zirconia, 150 to 300 ppm by mass of magnesia and 10 to 30 ppm by mass of yttria are added as sintering aids to the alumina sintered body constituting the insulating substrate.
- the breakdown voltage of sapphire is 47 kV / mm, and the breakdown voltage of a normal alumina sintered body is 12 kV / mm. Furthermore, the dielectric loss tangent of this alumina sintered body is equivalent to that of sapphire, which is much lower than the dielectric loss tangent of a normal alumina sintered body, for example, about 1/10.
- the addition amount of zirconia in the alumina sintered body constituting the insulating substrate is more preferably 300 mass ppm or more, and further preferably 600 mass ppm or less.
- the amount of magnesia added to the alumina sintered body constituting the insulating substrate is more preferably 200 ppm by mass or more, and further preferably 280 ppm by mass or less.
- the amount of yttria added to the alumina sintered body constituting the insulating substrate is more preferably 12 mass ppm or more, and further preferably 20 mass ppm or less.
- the method for forming the through hole in the insulating substrate is not particularly limited.
- a through hole can be formed in a green sheet of an insulating substrate by pins or laser processing.
- a through-hole can also be formed in a blank board
- 3 and 4 are flow charts illustrating procedures suitable for manufacturing the insulating substrate of the present invention.
- a slurry for an alumina molded body is prepared.
- the sintering aid powder as described above is added to high-purity alumina powder having a purity of 99.9% or more (more preferably 99.95% or more).
- high-purity alumina powder examples include high-purity alumina powder manufactured by Daimei Chemical Co., Ltd.
- the method for forming the polycrystalline ceramic sintered body is not particularly limited, and may be any method such as a doctor blade method, an extrusion method, or a gel cast method. Especially preferably, it manufactures using a gel cast method as blank board
- a slurry containing alumina powder, powder of each sintering aid, a dispersion medium and a gelling agent is produced, and this slurry is cast and gelled to obtain a compact.
- a release agent is applied to the mold, the mold is assembled, and the slurry is cast.
- the gel is cured in the mold to obtain a molded body, and the molded body is released from the mold. The mold is then washed. A blank substrate is obtained by sintering this gel molded body.
- the gel molded body is dried, preferably calcined in the air, and then calcined in hydrogen.
- the sintering temperature during the main calcination is preferably 1700 to 1900 ° C., more preferably 1750 to 1850 ° C., from the viewpoint of densification of the sintered body.
- the substrate is placed on a flat plate made of a refractory metal such as molybdenum. At that time, it is possible to leave a gap of 5 to 10 mm above the substrate to discharge the sintering aid. This is preferable from the viewpoint of facilitating the grain growth and facilitating the grain growth. This is because pores can be discharged by the grain boundary movement accompanying the grain growth. On the other hand, excessive discharge of the sintering aid tends to cause abnormal grain growth and cause cracks.
- an additional annealing treatment can be performed to correct the warp.
- This annealing temperature is preferably within the maximum temperature ⁇ 100 ° C. during firing from the viewpoint of promoting the discharge of the sintering aid while preventing deformation and abnormal grain growth, and the maximum temperature is 1900 ° C. or less. More preferably it is.
- the annealing time is preferably 1 to 6 hours.
- polishing slurry used for this, a slurry in which abrasive grains having a particle size of 30 nm to 200 nm are dispersed in an alkali or neutral solution is used.
- the abrasive material include silica, alumina, diamond, zirconia, and ceria, which are used alone or in combination.
- a hard urethane pad, a nonwoven fabric pad, and a suede pad can be illustrated as a polishing pad.
- the annealing process can be performed after the rough polishing process before the final precision polishing process is performed.
- the atmospheric gas for the annealing treatment include air, hydrogen, nitrogen, argon, and vacuum.
- the annealing temperature is preferably 1200 to 1600 ° C., and the annealing time is preferably 2 to 12 hours.
- the through hole is not formed in the molded body, and after the sintered blank substrate is roughly polished, the through hole is formed in the blank substrate by laser processing.
- Laser processing is preferably performed as follows.
- a through-hole is formed by irradiating the substrate surface with a short pulse laser.
- the pulse width is generally less than milliseconds (1 / 1e-3 seconds).
- gas (CO2) or solid (YAG) is used as the laser source.
- Example 1 The insulating substrate of the present invention was produced according to the procedure described with reference to FIG. Specifically, in order to produce a blank substrate made of translucent alumina ceramic, a slurry in which the following components were mixed was prepared.
- (Raw material powder) - ⁇ -alumina powder (alumina purity 99.9%) having a specific surface area of 3.5 to 4.5 m2 / g and an average primary particle size of 0.35 to 0.45 ⁇ m 100 parts by mass ⁇ MgO (magnesia) 250 mass ppm ⁇ ZrO2 (zirconia) 400 mass ppm ⁇ Y2O3 (yttria) 15 mass ppm
- Dission medium ⁇ Dimethyl glutarate 27 parts by mass ⁇ Ethylene glycol 0.3 parts by mass (gelling agent) ⁇ 4 parts by mass of MDI resin (dispersant) ⁇ Polymer surfactant 3 parts by mass (catalyst) ⁇ N, N-dimethylaminohexanol
- the slurry was cast in an aluminum alloy mold at room temperature and then left at room temperature for 1 hour. Subsequently, it was left to stand at 40 ° C. for 30 minutes, and after solidification proceeded, it was released. Furthermore, it was left to stand at room temperature and then at 90 ° C. for 2 hours to obtain a plate-like powder compact. However, many through-holes were formed by providing a core in the mold.
- the obtained powder compact is calcined at 1100 ° C. in the air (preliminary firing), then fired at 1750 ° C. in an atmosphere of hydrogen 3: nitrogen 1 and then annealed under the same conditions to obtain a blank substrate. It was.
- High-precision polishing was performed on the created blank substrate. First, the shape was adjusted by double-sided lapping with green carbon, and then double-sided lapping with diamond slurry was performed. The particle size of diamond was 3 ⁇ m. Finally, CMP processing using SiO2 abrasive grains and diamond abrasive grains was performed, and cleaning was performed to obtain an insulating substrate 1.
- the characteristics of the obtained insulating substrate are as follows. Dielectric breakdown voltage: Measurement average 75 kV / mm Insulating substrate 1 thickness: 150 ⁇ m Diameter W of the through hole 2: 60 ⁇ m Alumina purity: 99.9% Relative density: 99.6% Average particle size: 5 ⁇ m Porosity: 0.4% Resistivity: 10E14 ⁇ ⁇ cm Through hole interval D: 500 ⁇ m Number of through holes: 3.2 / cm2 Density of pores with a diameter of 10 ⁇ m or more: 0.0%
- Example 2 An insulating substrate was produced in the same manner as in Example 1. However, unlike Example 1, no through hole was formed during molding. Instead, a through-hole was formed in the blank substrate by laser processing after rough polishing the blank substrate, and then precision polishing was performed.
- the laser processing conditions are as follows. CO2 laser (wavelength 10.6 ⁇ m) Pulse (1000Hz-On time 5 ⁇ s) Laser mask diameter 0.3mm
- the characteristics of the obtained insulating substrate are as follows. Dielectric breakdown voltage: Measurement average 78kV / mm Insulating substrate 1 thickness: 150 ⁇ m Diameter W of the through hole 2: 70 ⁇ m Alumina purity: 99.9% Relative density: 99.6% Average particle size: 5 ⁇ m Porosity: 0.4% Resistivity: 10E14 ⁇ ⁇ cm Through hole interval D: 500 ⁇ m Number of through-holes: 3.2 / cm2 Density of pores with a diameter of 10 ⁇ m or more: 0.0% The obtained insulating substrate was evaluated in the same manner as in Example 1.
- Examples 3 to 6 A substrate was produced in the same manner as in Example 2. However, the firing temperature was adjusted to produce substrates with different average particle sizes. About the obtained board
- the properties and physical properties of the alumina sintered body are as follows.
- the obtained insulating substrate was evaluated in the same manner as in Example 1, and the results are shown in Table 1.
- Example 6 A substrate was produced in the same manner as in Example 2. However, substrates with different alumina purity and average particle diameter were prepared by adjusting the alumina raw material to be used and the firing temperature. About the obtained board
- the abnormality of the through hole was small, and cracks and chipping after dicing were suppressed.
- Comparative Examples 1, 2, and 3 since the relative density of the alumina sintered body constituting the insulating substrate was low, there were many through-hole abnormalities, cracks after dicing, and chipping.
- Comparative Example 4 since the average particle diameter of the alumina sintered body constituting the insulating substrate was small, there were many abnormalities in the through holes, cracks after dicing, and chipping.
- Comparative Example 5 since the average particle diameter of the alumina sintered body constituting the insulating substrate was large, there were many cracks and chipping after dicing.
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Abstract
Description
また、こういった基板は電子部品の低背化ニーズに対応するため薄板化が求められることから、高強度であることが必要である反面、電子部品実装後はダイシングにより個片化されることから、切削性の良さといった特性も求められる。
絶縁基板の厚さが25~300μmであり、貫通孔の径が20μm以上であり、絶縁基板がアルミナ焼結体からなり、アルミナ焼結体の相対密度が99.5%以上であり、平均粒径が2~50μmであることを特徴とする。
図1(a)、(c)に示すように、絶縁基板1には一方の主面1aと他方の主面1bとが設けられており、主面1aと1bとの間を貫通する貫通孔2が多数形成されている。
相対密度 (%)= 100(%) -気孔率(%)
すなわち、ハンドル基板の断面(接合面に対して垂直な断面)を鏡面研磨、サーマルエッチングし、結晶粒界を際立たせた後、光学顕微鏡写真(200倍)を撮影する。そして、ハンドル基板の厚さ方向(接合面に垂直な方向)に0.1mm、接合面に水平な方向に1.0mmの層状の視野を設定する。そして、各視野について、大きさ0.5μm以上の気孔の総面積を算出し、得られた気孔面積から視野面積比を算出し、気孔率とする。
(1) 多結晶セラミック焼結体の断面を鏡面研磨、サーマルエッチングして粒界を際立たせた後、顕微鏡写真(100~200倍)を撮影し、単位長さの直線が横切る粒子の数を数える。これを異なる3箇所について実施する。なお、単位長さは500μm~1000μmの範囲とする。
(2) 実施した3箇所の粒子の個数の平均をとる。
(3) 下記の式により、平均粒径を算出する。
[算出式]
D=(4/π)×(L/n)
[D:平均粒径、L:直線の単位長さ、n:3箇所の粒子の個数の平均]
D=(4/π)×[500/{(22+23+19)/3}]=29.9μmとなる。
好ましくは純度99.9%以上(更に好ましくは99.95%以上)の高純度アルミナ粉末に対して前述のような焼結助剤の粉末を添加する。このような高純度アルミナ粉末としては、大明化学工業株式会社製の高純度アルミナ粉体を例示できる。
図3を参照しつつ説明した手順に従って、本発明の絶縁基板を作製した。
具体的には、透光性アルミナセラミック製のブランク基板を作製する為、以下の成分を混合したスラリーを調製した。
(原料粉末)
・比表面積3.5~4.5m2/g、平均一次粒子径0.35~0.45μmのα-アルミナ粉末(アルミナ純度99.9%)
100質量部
・MgO(マグネシア) 250質量ppm
・ZrO2(ジルコニア) 400質量ppm
・Y2O3(イットリア) 15質量ppm
(分散媒)
・グルタル酸ジメチル 27質量部
・エチレングリコール 0.3質量部
(ゲル化剤)
・MDI樹脂 4質量部
(分散剤)
・高分子界面活性剤 3質量部
(触媒)
・N,N-ジメチルアミノヘキサノール 0.1質量部
絶縁破壊電圧: 測定平均 75kV/mm
絶縁基板1の厚さ: 150μm
貫通孔2の径W: 60μm
アルミナ純度: 99.9%
相対密度: 99.6%
平均粒径: 5μm
気孔率: 0.4%
抵抗率: 10E14 Ω・cm
貫通孔の間隔D: 500μm
貫通孔の個数: 3.2個/cm2
径10μm以上の気孔の密度: 0.0%
(ダイシング条件)
砥石回転数=30000rpm
砥石の送り速度=80mm/sec
砥石粒度=SD325(レジンボンド)
砥石幅=0.15mm
実施例1と同様にして絶縁基板を作製した。ただし、実施例1と異なり、成形時に貫通孔を形成しなかった。その代わりに、ブランク基板を粗研磨加工した後にレーザー加工によってブランク基板に貫通孔を形成し、その後に精密研磨加工を行った。
CO2レーザー(波長 10.6μm)
パルス(1000Hz- On time 5μs)
レーザーマスク径0.3mm
絶縁破壊電圧: 測定平均78kV/mm
絶縁基板1の厚さ: 150μm
貫通孔2の径W: 70μm
アルミナ純度: 99.9%
相対密度: 99.6%
平均粒径: 5μm
気孔率: 0.4%
抵抗率: 10E14 Ω・cm
貫通孔の間隔D: 500μm
貫通孔の個数: 3.2 個/cm2
径10μm以上の気孔の密度: 0.0%
得られた絶縁基板について、実施例1と同様の評価を行った
実施例2と同様の方法で基板を作製した。ただし、焼成温度を調整し、異なる平均粒径の基板を作製した。得られた基板について、実施例1と同様の評価を行った。
図3を参照しつつ説明した手順に従って、絶縁基板を作製した。
(原料粉末)
・α-アルミナ粉末(アルミナ純度 99.6%) 100質量部
・MgO(マグネシア) 100質量ppm
・Fe2O3 200質量ppm
・SiO2 150質量ppm
・CuO 100質量ppm
(分散媒)
・グルタル酸ジメチル 27質量部
・エチレングリコール 0.3質量部
(ゲル化剤)
・MDI樹脂 4質量部
(分散剤)
・高分子界面活性剤 3質量部
(触媒)
・N,N-ジメチルアミノヘキサノール 0.1質量部
実施例1と同様にして絶縁基板を作製した。ただし、アルミナ焼結体の性状および物性等は以下のとおりである。
アルミナ純度: 99.6%
平均粒径: 1μm
相対密度: 98%
気孔率: 2%
抵抗率: 10E14 Ω・cm
絶縁基板1の厚さ: 150μm
貫通孔2の径W: 70μm
貫通孔の間隔D: 500μm
貫通孔の個数: 35個/cm2
径10μm以上の気孔の密度: 1%
実施例2と同様の方法で基板を作製した。、ただし、用いるアルミナ原料、焼成温度の調整により異なるアルミナ純度、平均粒径の基板を作製した。得られた基板について、実施例1と同様の評価を行った。結果を表2に示した。
これら比較例の条件では、砥石の目詰まりが見られた。
比較例5では、絶縁基板を構成するアルミナ焼結体の平均粒径が大きいため、ダイシング後のクラック、チッピングが多かった。
Claims (5)
- 導体用の貫通孔が配列されている絶縁基板であって、前記絶縁基板の厚さが25~300μmであり、前記貫通孔の径が20μm~100μmであり、前記絶縁基板がアルミナ焼結体からなり、前記アルミナ焼結体の相対密度が99.5%以上であり、平均粒径が2~50μmであることを特徴とする、貫通孔を有する絶縁基板。
- 前記アルミナ焼結体の絶縁破壊電圧が50kV/mm以上であることを特徴とする、請求項1記載の絶縁基板。
- 前記アルミナ焼結体のアルミナ純度が99.9%以上であり、前記アルミナ焼結体に焼結助剤としてジルコニアが200~800質量ppm、マグネシアが150~300質量ppmおよびイットリアが10~30質量ppm添加されていることを特徴とする、請求項1または2記載の絶縁基板。
- 前記貫通孔がレーザー加工によって形成されていることを特徴とする、請求項1~3のいずれか一つの請求項に記載の絶縁基板。
- 前記アルミナ焼結体の成形時に前記貫通孔が成形されていることを特徴とする、請求項1~3のいずれか一つの請求項記載の絶縁基板。
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EP15750613.0A EP3113585B1 (en) | 2014-02-26 | 2015-02-24 | Insulating substrate having through-holes |
CN201580000703.7A CN105191511B (zh) | 2014-02-26 | 2015-02-24 | 具有贯通孔的绝缘基板 |
JP2015536337A JP5877933B1 (ja) | 2014-02-26 | 2015-02-24 | 貫通孔を有する絶縁基板 |
KR1020157023831A KR102250468B1 (ko) | 2014-02-26 | 2015-02-24 | 관통 구멍을 갖는 절연 기판 |
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CN108886870B (zh) * | 2016-03-11 | 2021-03-09 | 日本碍子株式会社 | 连接基板 |
KR102315180B1 (ko) * | 2017-06-13 | 2021-10-20 | 엔지케이 인슐레이터 엘티디 | 반도체 제조 장치용 부재 |
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- 2015-02-20 CN CN201580000543.6A patent/CN105144851B/zh not_active Expired - Fee Related
- 2015-02-20 EP EP15754711.8A patent/EP3113586B1/en not_active Not-in-force
- 2015-02-20 KR KR1020157023832A patent/KR102250469B1/ko active IP Right Grant
- 2015-02-20 WO PCT/JP2015/054765 patent/WO2015129574A1/ja active Application Filing
- 2015-02-24 EP EP15750613.0A patent/EP3113585B1/en not_active Not-in-force
- 2015-02-24 CN CN201580000703.7A patent/CN105191511B/zh not_active Expired - Fee Related
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- 2015-02-24 KR KR1020157023831A patent/KR102250468B1/ko active IP Right Grant
- 2015-02-24 WO PCT/JP2015/055258 patent/WO2015129699A1/ja active Application Filing
- 2015-02-25 TW TW104105989A patent/TWI632836B/zh not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
---|---|
JP5877933B1 (ja) | 2016-03-08 |
EP3113586A4 (en) | 2017-10-25 |
US9538653B2 (en) | 2017-01-03 |
TWI632124B (zh) | 2018-08-11 |
EP3113586A1 (en) | 2017-01-04 |
CN105144851B (zh) | 2019-02-12 |
TW201546019A (zh) | 2015-12-16 |
CN105191511B (zh) | 2019-04-09 |
US20150353428A1 (en) | 2015-12-10 |
TWI632836B (zh) | 2018-08-11 |
EP3113586B1 (en) | 2018-11-28 |
EP3113585A1 (en) | 2017-01-04 |
KR102250468B1 (ko) | 2021-05-12 |
EP3113585B1 (en) | 2018-11-28 |
US9894763B2 (en) | 2018-02-13 |
JPWO2015129574A1 (ja) | 2017-03-30 |
KR102250469B1 (ko) | 2021-05-12 |
KR20160124649A (ko) | 2016-10-28 |
JP5877932B1 (ja) | 2016-03-08 |
EP3113585A4 (en) | 2017-10-25 |
CN105144851A (zh) | 2015-12-09 |
JPWO2015129699A1 (ja) | 2017-03-30 |
KR20160124650A (ko) | 2016-10-28 |
CN105191511A (zh) | 2015-12-23 |
TW201547334A (zh) | 2015-12-16 |
US20160007461A1 (en) | 2016-01-07 |
WO2015129574A1 (ja) | 2015-09-03 |
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