WO2015118782A1 - パージ装置及びパージ方法 - Google Patents
パージ装置及びパージ方法 Download PDFInfo
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- WO2015118782A1 WO2015118782A1 PCT/JP2014/083436 JP2014083436W WO2015118782A1 WO 2015118782 A1 WO2015118782 A1 WO 2015118782A1 JP 2014083436 W JP2014083436 W JP 2014083436W WO 2015118782 A1 WO2015118782 A1 WO 2015118782A1
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- flow rate
- purge
- storage container
- purge gas
- exhaust
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
- H01L2021/60022—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process using bump connectors, e.g. for flip chip mounting
- H01L2021/60097—Applying energy, e.g. for the soldering or alloying process
- H01L2021/60172—Applying energy, e.g. for the soldering or alloying process using static pressure
- H01L2021/60187—Isostatic pressure, e.g. degassing using vacuum or pressurised liquid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
Definitions
- the present invention relates to a purge apparatus and a purge method for purging the inside of a storage container in which a storage object is stored with a purge gas such as an inert gas or clean dry air.
- a purge gas such as an inert gas or clean dry air.
- a purge apparatus that maintains cleanliness by introducing purge gas into a storage container in which a storage object such as a semiconductor wafer or a glass substrate is stored (so-called purge process).
- purge process the flow rate of the purge gas supplied to the storage container may be controlled.
- a purge circuit having a desired flow rate is not actually supplied into the storage container and the purge process is not performed well due to a failure of a control circuit in the purge apparatus or a failure of the purge gas supply flow path. There is a fear. Therefore, there is a demand for determining whether or not a purge gas having a desired flow rate is supplied into the storage container (whether or not a good purge process is performed).
- Patent Document 1 Japanese Patent No. 4670808 discloses a technique for measuring the flow rate of purge gas supplied to the inside of a containment vessel. In the measurement container described in Patent Document 1, it is possible to measure the flow rate of the purge gas supplied from the purge device by mounting a dedicated flow rate measurement unit on the purge device. Can be determined. However, there are cases where it is desired to determine whether or not good purge processing is being performed during the process of supplying purge gas to the storage container that is actually subject to purge processing.
- an object of the present invention is to provide a purge apparatus and a purge method that can determine whether or not a good purge is being performed in the process of supplying purge gas to a storage container that is actually subjected to a purge process. It is to provide.
- a purge apparatus is a purge apparatus that purges the inside of a storage container in which a storage object is stored with a purge gas, and is connected to a discharge port of the storage container so that the purge gas inside the storage container is purged.
- a discharge pipe that discharges gas
- a measurement section that measures an exhaust flow rate that is a flow rate of purge gas that flows through the discharge pipe when performing the purge process, and a determination of whether the purge process is good or not based on the exhaust flow rate measured by the measurement section And a determination unit.
- a measurement unit for measuring the flow rate of the purge gas flowing through the discharge pipe is provided on the purge apparatus side, not on the measurement unit side mounted on the purge apparatus. For this reason, the exhaust flow rate when the purge gas is supplied to the storage container while the storage container that is actually the target of the purge process is placed on the purge device is measured, and the quality of the purge process is determined based on the measured exhaust flow rate. Can be determined. This makes it possible to determine whether or not a good purge process is being performed during the process of actually supplying the purge gas to the storage container.
- the present inventors have found that the airtightness of the containment vessel greatly affects the exhaust efficiency. That is, when the flow rate of the purge gas supplied to the storage container is higher than the predetermined flow rate (when the internal pressure of the storage container becomes higher than the predetermined pressure), the parts other than the discharge port of the storage container (for example, the lid part of the storage container and the main body It was found that the purge gas leaked out from the air and the exhaust flow rate discharged from the exhaust pipe became saturated. In other words, it has been found that an exhaust flow rate approximately proportional to the supply flow rate can be obtained up to the predetermined flow rate at which the purge gas leaks from a portion other than the discharge port of the containment vessel.
- the first mode in which the purge process is performed by supplying the purge gas to the storage container at the first flow rate and the second mode in which the purge process is performed by supplying the purge gas to the storage container at the second flow rate. It is good also as a structure further provided with the flow volume control part which switches a mode.
- the measurement unit may measure the exhaust flow rate in the first mode, and the determination unit may determine the quality of the purge process based on the exhaust flow rate measured in the first mode.
- the flow rate up to the predetermined flow rate is defined as the first flow rate in the containment vessel in which the purge gas leaks from a portion other than the discharge port of the containment vessel.
- the larger flow rate is set as the second flow rate.
- the purge process is satisfactorily performed based on the supply flow rate of the first flow rate in which the exhaust flow rate is proportional to the supply flow rate and the exhaust flow rate when the purge process is performed at the first flow rate. It can be determined whether or not. For this reason, it is possible to determine whether or not the purge process is performed satisfactorily based on the supply flow rate and the exhaust flow rate that are proportional to each other.
- the flow control unit switches to the first mode after starting the purge process in the second mode, the measurement unit measures the exhaust flow rate in the first mode, and the determination unit performs the first mode. Whether the purge process is good or bad may be determined based on the exhaust gas flow rate measured in step.
- a relatively large flow rate of purge gas can be first supplied to the containment vessel, so that the inside of the containment vessel can be cleaned quickly. Thereby, possibility that a to-be-contained object will be contaminated can be reduced.
- a purging method is a purging method for purging an inside of a storage container in which an object to be stored is stored with a purge gas, and is capable of discharging the purge gas inside the storage container to a discharge port of the storage container.
- a pipe is connected and an exhaust flow rate, which is a flow rate of purge gas flowing through the exhaust pipe when the purge process is performed, is measured, and the quality of the purge process is determined based on the measured exhaust flow rate.
- this purge method it is possible to determine whether or not a good purge process is being performed in the process of actually supplying the purge gas to the storage container.
- the purge gas is supplied to the storage container at the first flow rate to measure the exhaust gas flow rate, which is the flow rate of the purge gas flowing through the exhaust pipe when performing the purge process, and based on the measured exhaust gas flow rate. You may determine the quality of a purge process.
- the flow rate at which the purge gas is supplied to the containment vessel exceeds the predetermined flow rate
- the flow rate up to the predetermined flow rate is defined as the first flow rate in the containment vessel in which the purge gas leaks from a portion other than the discharge port of the containment vessel.
- the larger flow rate is set as the second flow rate.
- the present invention it is possible to determine whether or not a good purge process is being performed in the process of actually supplying the purge gas to the storage container.
- FIG. 1 is a front view showing a purge stocker including a purge device according to an embodiment.
- 2 is a cross-sectional view of the purge stocker of FIG. 1 as viewed from the line II-II.
- FIG. 3 is a cross-sectional view and a perspective view showing the configuration of the storage container purged by the purge device of FIG.
- FIG. 4 is a schematic configuration diagram showing the configuration of the purge apparatus of FIG.
- FIG. 5 is a timing chart showing mode switching in the flow rate control unit of FIG.
- FIG. 6 is a graph showing the relationship between the supply flow rate and the exhaust flow rate when the discharge pipe is connected to the discharge port of the containment vessel.
- FIG. 7 is a timing chart showing mode switching in the flow rate control unit according to the modification.
- the purge device 30 is a device that purges the interior of a storage container 50 such as a FOUP (Front Opening Unified Unified Pod) in which an object to be stored such as a semiconductor wafer or a glass substrate is stored with a purge gas.
- a purge gas examples include, for example, an inert gas and clean dry air.
- the purge device 30 is arranged in the purge stocker 1 for storing the storage container 50 in which the objects to be stored are stored. As shown in FIGS. 1 and 2, the purge stocker 1 is provided, for example, in a clean room 100.
- the purge stocker 1 provided in such a clean room 100 includes a partition 3, an FFU (Fan Filter Unit) 5, a rack 7, a crane 9, an exhaust port 15A, an OHT (Overhead Hoist Transfer) port 21, and a manual port 23. Yes.
- the partition 3 is a part that partitions (defines) an area above the floor surface 100A, and a storage area 1A is formed inside thereof.
- a plurality of FFUs 5 are provided along a predetermined direction above the ceiling of the space partitioned by the partition 3, that is, above the storage area 1A.
- the FFU 5 draws clean air from the outside of the storage area 1A into the storage area 1A, and blows the clean air downward toward the storage area 1A.
- the exhaust port 15A is provided in the vicinity of the bottom of the storage area 1A, and is a part for discharging a gas containing purge gas from the storage area 1A to the outside of the storage area 1A.
- the gas containing the purge gas is discharged from the storage area 1A by the exhaust fan 15.
- the rack 7 is a part for storing the storage container 50, and a plurality of rows (here, two rows) are provided in the storage area 1A. Each rack 7 extends in a predetermined direction X, and the two rows of racks 7 and 7 are arranged to face each other in the depth direction Y. Each rack 7 is formed with a plurality of storage shelves 7A for placing and storing the storage containers 50 along a predetermined direction X and a vertical direction Z.
- the crane 9 is a part for putting the storage container 50 in and out of the storage shelf 7A, and is arranged in a region sandwiched between the racks 7 and 7 facing each other.
- the crane 9 can move along the extending direction X of the rack 7 by traveling on a traveling rail (not shown) arranged on the floor along the extending direction X of the rack 7.
- the loading platform 9A of the crane 9 is provided so as to be movable up and down along the guide rail 9B, and the storage container 50 can be taken in and out of the plurality of storage shelves 7A provided in the vertical direction.
- the storage container 50 is taken into and out of the purge stocker 1 from the OHT port 21 and the manual port 23.
- the OHT port 21 is a part that delivers the storage container 50 between the overhead traveling vehicle (OHT) 27 that travels on the traveling rail 25 laid on the ceiling 100B and the purge stocker 1, and is a conveyor 21A that conveys the storage container 50.
- the manual port 23 is a part that delivers the storage container 50 between the operator and the purge stocker 1, and includes a conveyor 23 ⁇ / b> A that conveys the storage container 50.
- a purge device 30 for purging the inside of the storage container 50 to be placed with a purge gas for example, nitrogen gas
- the purge device 30 is a device for supplying and discharging purge gas into the storage container 50 mounted on the storage shelf 7A.
- the storage container 50 includes a main body 51 and a lid 53 that serve as a casing.
- a sealed space 54 is formed by the main body 51 and the lid 53.
- a plurality of semiconductor wafers (not shown) are accommodated in the sealed space 54.
- discharge ports 56 are provided in the vicinity of the left and right ends of the front end portion, and the left and right ends of the rear end portion are provided.
- a supply port 55 is provided.
- the supply port 55 is formed from the connection part 52A and the communication part 52C.
- the discharge port 56 is formed from the connection part 52B and the communication part 52D.
- the connecting portion 52A is configured to be connectable to the supply pipe 31 of the purge device 30 described in detail later. Further, the connecting portion 52B is configured to be connectable to the discharge pipe 33 of the purge device 30.
- connection parts 52A and 52B communication parts 52C and 52D having diameters equivalent to the inner diameters of the supply pipe 31 and the discharge pipe 33 are formed, respectively.
- the communication parts 52 ⁇ / b> C and 52 ⁇ / b> D are holes that communicate the sealed space 54 with the outside of the storage container 50.
- the lid 53 is disposed on one surface which is the side surface of the main body 51.
- the lid 53 is provided with a latch mechanism 58.
- the latch mechanism 58 has a latch portion 58A and a cam portion 58B.
- the key (not shown) is inserted into the insertion port 58C provided in the cam portion 58B and the key 58 is rotated, the latch portion 58A is opposite to the side where the cam portion 58B is located.
- the side end is configured to enter and exit.
- the lid portion 53 is fixed to the main body portion 51 by fitting the end portion of the latch portion 58A into the fitting groove 51A provided on the main body portion 51 on the surface facing the latch portion 58A. It is like that.
- FIG. 4 is a schematic configuration diagram showing the configuration of the purge device 30.
- the purge device 30 includes a supply pipe 31, an MFC (Mass Flow Controller) 35, a purge gas source 37, a discharge pipe 33, a flow meter (measurement unit) 39, and a control unit 40.
- MFC Mass Flow Controller
- the tip of the supply pipe 31 is a nozzle, and purge gas is supplied to the storage container 50 by being connected to the supply port 55 of the storage container.
- the supply pipe 31 is connected to the communication part 52C by being in close contact with the connection part 52A.
- the MFC 35 is a device that measures the mass flow rate of the purge gas flowing through the supply pipe 31 and controls the flow rate.
- the purge gas source (not shown) is a tank that stores the purge gas.
- the tip of the discharge pipe 33 is a nozzle, and is connected to the discharge port 56 of the storage container 50 to suck the purge gas inside the storage container 50 and discharge the purge gas inside the storage container 50.
- the discharge pipe 33 is connected to the communication part 52D by being in close contact with the connection part 52B.
- the flow meter 39 is a device that measures the flow rate of the purge gas flowing through the discharge pipe 33.
- the control unit 40 is a part that controls various purge processes in the purge device 30, and is an electronic control unit including, for example, a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like. As shown in FIG. 4, the control unit 40 includes a flow rate control unit 41 and a determination unit 43 as conceptual parts for executing various control processes of the purge device 30. The functions executed by such a conceptual part are executed under the control of a CPU or the like.
- a CPU Central Processing Unit
- ROM Read Only Memory
- RAM Random Access Memory
- the flow rate control unit 41 performs a purge process by supplying a purge gas to the storage container 50 at a first flow rate, and performs a purge process by supplying a purge gas to the storage container 50 at a second flow rate.
- first flow rate refers to a portion other than the discharge port of the storage container 50 (for example, FIG. 3A and FIG. 3B) when the flow rate of supplying the purge gas to the storage container 50 is greater than a predetermined flow rate. ), The flow rate up to the above-described predetermined flow rate in the storage container 50 where the purge gas leaks from the portion between the main body portion 51 and the lid portion 53).
- the “second flow rate” refers to a flow rate higher than the first flow rate.
- the determination unit 43 is a part that determines the quality of the purge process based on the exhaust flow rate measured by the flow meter 39. Specifically, the determination unit 43 detects the supply flow rate Fs by the MFC 35 when the flow rate control unit 41 controls the first flow rate (first mode), and the exhaust gas measured by the flow meter 39 disposed in the discharge pipe 33. Based on the flow rate Fe, whether the purge process is good or bad is determined. For example, when the exhaust flow rate Fe is less than the supply flow rate Fs by a predetermined amount or more, it can be determined that the purge process is not performed well.
- the determination unit 43 performs a purge process in consideration of a flow rate ratio in a nozzle (not shown) that ejects purge gas from the tip of the supply pipe 31 to the storage container 50 and a nozzle (not shown) that jets purge gas from the storage container 50 to the discharge pipe 33. You may determine the quality of.
- the exhaust flow rate Fe is When the supply flow rate Fs is less than a value obtained by multiplying the supply flow rate Fs by A and B (Fs ⁇ A ⁇ B) by a predetermined amount or more, it may be determined that the purge process is not performed well.
- the flow rate transmission ratios A and B can be set as appropriate according to the characteristics of the nozzle. In the case of a metal nozzle, a value of 0.70 to 0.95 is set as the flow rate transmission ratio A and B, and in the case of an elastic nozzle, a value of 0.90 to 1.00 is set as the flow rate transmission ratio A and B. B can be set.
- the flow control unit 41 detects the placement of the storage container 50 on the purge device 30 (or when a purge processing instruction is input by the user), the flow control unit 41 starts supplying purge gas to the storage container 50 (purge processing). .
- the flow rate control unit 41 starts a mode (second mode) in which purge gas is supplied at a flow rate f2 that is the second flow rate, and continues the second mode until time t1.
- the flow rate control unit 41 switches to the mode (first mode) in which purge gas is supplied at the flow rate f1, which is the first flow rate, in order to determine the quality of the purge process, and continues the first mode by time t2.
- the determination unit 43 determines whether or not the purge process is good by the method described above.
- the flow rate control unit 41 switches to the mode (second mode) in which purge gas is supplied again at the flow rate f2 that is the second flow rate, and continues for a predetermined time or until the storage container 50 is moved from the storage shelf 7A.
- the quality result of the purge process determined by the determination unit 43 is displayed, for example, on a display unit (not shown) of the purge device 30 (not shown), a warning sound is generated, or information indicating that is sent to other terminals. May be provided to notify the operator, such as
- the flow meter 39 for measuring the flow rate of the purge gas flowing through the discharge pipe 33 is provided on the purge device 30 side, not on the measurement unit side mounted on the purge device 30. . Therefore, the exhaust flow rate when the purge gas is supplied to the storage container 50 in a state where the storage container 50 to be purged is actually placed on the purge device 30 is measured, and the purge is performed based on the measured exhaust flow rate. The quality of the process can be determined. Thereby, it is possible to determine whether or not a good purge process is being performed in the process of actually supplying the purge gas to the storage container 50.
- the inventors of the present application have found that the airtightness of the containment vessel 50 greatly affects the exhaust efficiency. That is, as shown in FIG. 6, when the flow rate of the purge gas supplied to the storage container 50 is higher than the predetermined flow rate F1 (when the internal pressure of the storage container 50 becomes higher than the predetermined pressure P1), the lid portion 53 of the storage container 50 is formed. It was found that the purge gas leaks from between the main body 51 and the main body 51, and the exhaust flow rate discharged from the discharge pipe 33 becomes saturated. In other words, it has been found that an exhaust flow rate approximately proportional to the supply flow rate can be obtained up to the predetermined flow rate F1 (0 to F1) at which the purge gas leaks from between the lid portion 53 and the main body portion 51 of the storage container 50.
- the purge device 30 configured as described above, when the flow rate for supplying the purge gas to the storage container 50 is greater than the predetermined flow rate F1 as shown in FIG.
- the supply flow rate up to the predetermined flow rate F1 is the first flow rate f1 and the flow rate higher than the first flow rate is the second flow rate f2
- the purge gas is supplied to the storage vessel 50 at the first flow rate f1.
- the purge device 30 measures the exhaust gas flow rate in the first mode, and determines whether the purge process is good or not based on the exhaust gas flow rate measured in the first mode.
- the purge device 30 whether or not the purge process is good is determined based on the supply flow rate of the first flow rate f1 whose exhaust flow rate is substantially proportional to the supply flow rate and the exhaust flow rate when the purge process is performed at the first flow rate f1. Judgment. For this reason, since the quality of the purge process can be determined based on the supply flow rate and the exhaust flow rate that are approximately proportional to each other, accurate quality determination can be performed.
- the purge mode is switched to the first mode, the exhaust flow rate is measured in the first mode, and the exhaust flow rate measured in the first mode is measured.
- the quality of the purge process is determined. For this reason, since a relatively large flow rate of purge gas can be supplied to the storage container 50 first, the inside of the storage container 50 can be cleaned at an early stage. Thereby, possibility that a to-be-contained object will be contaminated can be reduced.
- the purge device 30 starts the purge process in the first mode, determines the quality of the purge process based on the exhaust flow rate measured in the first mode, and then The purge process may be continued by switching to the two mode. In this case, it is possible to determine whether the purge process is good or bad at an early stage of the purge process.
- the purge device 30 starts the purge process in the second mode, switches to the first mode at the final stage of ending the purge process, and the exhaust gas measured in the first mode.
- the purge process may be judged based on the flow rate, and the purge process may be finished as it is.
- this control is effective when it is desired to confirm whether or not the purge process is successfully performed at some timing.
- the purge device 30 disposed in the purge stocker 1 has been described as an example, but the present invention is not limited to this.
- the above-described embodiment includes a relay point between overhead traveling vehicles, a delivery point (load port) from the conveyor to the overhead traveling vehicle, a ceiling buffer, and the like.
- the purge apparatus of a modification can also be applied.
Abstract
Description
上記実施形態のパージストッカ1では、図5に示すようなタイミングで、第1モード及び第2モードを切り替える例を挙げて説明したが、本発明はこれに限定されない。例えば、図7(A)に示すように、パージ装置30は、第1モードでパージ処理を開始し、第1モードにおいて測定された排気流量に基づいてパージ処理の良否を判定し、その後、第2モードに切り換えてパージ処理を継続してもよい。この場合には、パージ処理における初期の段階でパージ処理の良否を判定することができるので、不具合が発生した場合には早期に対応することができる。
また、図7(B)に示すように、パージ装置30は、第2モードでパージ処理を開始し、パージ処理を終了する最後の段階で第1モードに切り換え、第1モードにおいて測定された排気流量に基づいてパージ処理の良否を判定し、そのままパージ処理を終えるようにしてもよい。この場合には、最初に相対的に大きな流量のパージガスを格納容器50に供給できるので、格納容器50の内部を早期に清浄化することができる。また、何かのタイミングでパージ処理が良好に行われた否かを確認したくなった場合に有効な制御である。
上記実施形態では、パージストッカ1に配置されたパージ装置30を例に挙げて説明したが、本発明はこれに限定されない。パーティション3などにより画成された空間に配置されるパージ装置だけでなく、例えば、天井走行車同士の中継ポイント、コンベヤから天井走行車への受け渡しポイント(ロードポート)、天井バッファなどに上記実施形態及び変形例のパージ装置も適用することが可能である。
Claims (5)
- 被格納物が格納される格納容器の内部をパージガスによってパージ処理するパージ装置であって、
前記格納容器の排出口に接続されることにより前記格納容器内部のパージガスを排出する排出管と、
前記パージ処理を実施する際に前記排出管を流れる前記パージガスの流量である排気流量を測定する測定部と、
前記測定部によって測定された前記排気流量に基づいて前記パージ処理の良否を判定する判定部と、を備えている、パージ装置。 - 前記格納容器に前記パージガスを供給する流量が所定流量よりも多くなると、前記格納容器の前記排出口以外の部分から前記パージガスが漏れ出す前記格納容器において、前記所定流量までの流量を第1流量とし、前記第1流量よりも多い流量を第2流量としたとき、
前記第1流量で前記格納容器に前記パージガスを供給することにより前記パージ処理を実施させる第1モードと、前記第2流量で前記格納容器に前記パージガスを供給することにより前記パージ処理を実施させる第2モードとを切り替える流量制御部を更に備え、
前記測定部は、前記第1モードにおいて前記排気流量を測定し、
前記判定部は、前記第1モードにおいて測定された前記排気流量に基づいて前記パージ処理の良否を判定する、請求項1に記載のパージ装置。 - 前記流量制御部は、前記第2モードで前記パージ処理を開始させ、その後、前記パージ処理の良否を判定するために前記第1モードに切り換えて前記パージ処理を実施し、その後再び前記第2モードで前記パージ処理を実施する、請求項2に記載のパージ装置。
- 被格納物が格納された格納容器の内部をパージガスによってパージ処理するパージ方法であって、
前記格納容器の排出口に前記格納容器内部のパージガスを排出可能な排出管を接続し、前記パージ処理を実施する際に前記排出管を流れる前記パージガスの流量である排気流量を測定し、測定された前記排気流量に基づいて前記パージ処理の良否を判定する、パージ方法。 - 前記格納容器に前記パージガスを供給する流量が所定流量よりも多くなると、前記格納容器の前記排出口以外の部分からパージガスが漏れ出す前記格納容器において、前記所定流量までの流量を第1流量、前記第1流量よりも多い流量を第2流量としたとき、
前記第1流量で前記格納容器に前記パージガスを供給することにより前記パージ処理を実施する際に前記排出管を流れる前記パージガスの流量である排気流量を測定し、測定された前記排気流量に基づいて前記パージ処理の良否を判定する、請求項4に記載のパージ方法。
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