JP7184453B2 - 搬送システム - Google Patents
搬送システム Download PDFInfo
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- JP7184453B2 JP7184453B2 JP2018095596A JP2018095596A JP7184453B2 JP 7184453 B2 JP7184453 B2 JP 7184453B2 JP 2018095596 A JP2018095596 A JP 2018095596A JP 2018095596 A JP2018095596 A JP 2018095596A JP 7184453 B2 JP7184453 B2 JP 7184453B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
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- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G35/00—Mechanical conveyors not otherwise provided for
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- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
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- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0297—Wafer cassette
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Description
図1は、本実施形態に係る搬送システム2の構成例を示す平面図であり、図2は、搬送システム2の接続関係の例を示す機能ブロック図である。図1に示すように、本実施形態に係る搬送システム2は、切削装置(加工装置)4によって加工される板状の被加工物11を搬送するための搬送通路6を含んでいる。
本実施形態では、被加工物11とともに切削ブレード82等を搬送の対象とする搬送システムについて説明する。なお、本実施形態に係る搬送システムの基本的な構成は、実施形態1に係る搬送システム2の基本的な構成と同じである。よって、実施形態1の搬送システム2と共通する構成要素には同じ符号を付して詳細な説明を省略する。
本実施形態では、切削装置に対してカセット28(被加工物11)を搬送するための搬送機構が搬送通路に取り付けられている例を説明する。なお、切削装置や搬送通路の基本的な構成は、実施形態1,2と同じである。よって、共通する構成要素には同じ符号を付して詳細な説明を省略する。
4,4a,4b,204,204a,204b,304 切削装置(加工装置)
6 搬送通路
6a,6b,6c 通路モジュール
8,208 ストックユニット
10,10a,10b,10c 無人被加工物搬送車
12 制御ユニット
14 筐体
14a 天井
14b 開口
16 第1カセット支持台
18 カセット(被加工物ストッカー)
20 プッシュプルアーム
22 ガイドレール
24 第2昇降機構
26 第2カセット支持台
28 カセット(搬送用カセット)
30 カセット搬送アーム(被加工物搬送部)
32 制御装置
34 受信機
36 送信機
38 シャシ(被加工物支持部)
38a 凹部
40 車輪(走行機構)
42 制御装置
44 受信機
46 送信機
48 基台
48a,48b 開口
48c 配管接続部
50 カセット支持台
80 切削ユニット
82 切削ブレード
92 カバー
92a 天井
92b 開口
92c 扉
96 制御装置
98 受信機
100 送信機
102 通路部
104 ガイド部
106 待機部
108 アングル(ブラケット)
110 連結具
112 ボルト
114 脚部材
114a 基部
114b 柱部
114c 吸着部
114d 開口
132 制御部(制御信号生成部)
134 受信機
136 送信機
206 無人ブレード搬送車
210 ブレードストッカー
212 ブレード搬送アーム(ブレード搬送部)
214 シャシ(ブレード支持部)
214a 凹部
216 ブレードケース
218 車輪(走行機構)
220 制御装置
222 受信機
224 送信機
11 被加工物
13 テープ(ダイシングテープ)
15 フレーム
21 配管
Claims (8)
- 複数の加工装置のそれぞれに対して被加工物を搬送する搬送システムであって、
複数の該加工装置に渡って該加工装置の真上の空間に設置される搬送通路と、
該被加工物を支持する被加工物支持部と、該被加工物支持部に設けられた走行機構と、制御信号を受信する受信機と、を備え、該搬送通路を走行する無人被加工物搬送車と、
該加工装置に供給される該被加工物を収容する被加工物ストッカーと該無人被加工物搬送車との間で該被加工物を搬送する被加工物搬送部と、制御信号を受信する受信機と、を備えるストックユニットと、
該加工装置、該無人被加工物搬送車、及び該ストックユニットに制御信号を送信する送信機と、該加工装置から送信される通知信号を受信する受信機と、該送信機から送信される制御信号を生成する制御信号生成部と、を備える制御ユニットと、を含み、
該搬送通路は、該加工装置に対して吸着する吸着部を有する脚部を備え、該吸着部によって該加工装置に固定されるとともに、2台の該無人被加工物搬送車が行き違うことのできるスペースを有しており、
該制御ユニットの該制御信号生成部は、該制御ユニットの該受信機が受信した通知信号に基づき該制御ユニットの該送信機から送信される制御信号を生成し、
該制御ユニットの該送信機は、該制御ユニットの該制御信号生成部で生成された制御信号を、該加工装置、該無人被加工物搬送車、及び該ストックユニットに送信し、
該ストックユニットの該被加工物搬送部は、該ストックユニットの該受信機で受信した制御信号に基づき該被加工物ストッカーに収容されている該被加工物を該無人被加工物搬送車の該被加工物支持部へと搬送し、
該無人被加工物搬送車の走行機構は、該無人被加工物搬送車の該受信機で受信した制御信号に基づき該無人被加工物搬送車を該搬送通路上で走行させ、該被加工物支持部で支持する該被加工物を該加工装置へと搬送することを特徴とする搬送システム。 - 複数の加工装置のそれぞれに対して被加工物を搬送する搬送システムであって、
複数の該加工装置に渡って該加工装置の真上の空間に設置される搬送通路と、
該被加工物を支持する被加工物支持部と、該被加工物支持部に設けられた走行機構と、制御信号を受信する受信機と、を備え、該搬送通路を走行する無人被加工物搬送車と、
該加工装置で該被加工物を加工する際に使用される切削ブレードを支持するブレード支持部と、該ブレード支持部に設けられた走行機構と、制御信号を受信する受信機と、を備え、該搬送通路を走行する無人ブレード搬送車と、
該加工装置に供給される該被加工物を収容する被加工物ストッカーと該無人被加工物搬送車との間で該被加工物を搬送する被加工物搬送部と、該加工装置に供給される該切削ブレードを収容するブレードストッカーと該無人ブレード搬送車との間で該切削ブレードを搬送するブレード搬送部と、制御信号を受信する受信機と、を備えるストックユニットと、
該加工装置、該無人被加工物搬送車、該無人ブレード搬送車、及び該ストックユニットに制御信号を送信する送信機と、該加工装置から送信される通知信号を受信する受信機と、該送信機から送信される制御信号を生成する制御信号生成部と、を備える制御ユニットと、を含み、
該搬送通路は、2台の該無人被加工物搬送車が行き違うことのできるスペースを有しており、
該制御ユニットの該制御信号生成部は、該制御ユニットの該受信機が受信した通知信号に基づき該制御ユニットの該送信機から送信される制御信号を生成し、
該制御ユニットの該送信機は、該制御ユニットの該制御信号生成部で生成された制御信号を、該加工装置、該無人被加工物搬送車、該無人ブレード搬送車、及び該ストックユニットに送信し、
該ストックユニットの該被加工物搬送部は、該ストックユニットの該受信機で受信した制御信号に基づき該被加工物ストッカーに収容されている該被加工物を該無人被加工物搬送車の該被加工物支持部へと搬送し、
該ストックユニットの該ブレード搬送部は、該ストックユニットの該受信機で受信した制御信号に基づき該ブレードストッカーに収容されている該切削ブレードを該無人ブレード搬送車の該ブレード支持部へと搬送し、
該無人被加工物搬送車の走行機構は、該無人被加工物搬送車の該受信機で受信した制御信号に基づき該無人被加工物搬送車を該搬送通路上で走行させ、該被加工物支持部で支持する該被加工物を該加工装置へと搬送し、
該無人ブレード搬送車の該走行機構は、該無人ブレード搬送車の該受信機で受信した制御信号に基づき該無人ブレード搬送車を該搬送通路上で走行させ、該ブレード支持部で支持する該切削ブレードを該加工装置へと搬送することを特徴とする搬送システム。 - 該搬送通路には、該無人被加工物搬送車の位置を確認する際に用いられる情報提供部が設けられており、
該無人被加工物搬送車には、該情報提供部の情報を読み取ることができる読み取り機が設けられていることを特徴とする請求項1又は請求項2に記載の搬送システム。 - 複数の加工装置のそれぞれに対して被加工物を搬送する搬送システムであって、
複数の該加工装置に渡って該加工装置の真上の空間に設置される搬送通路と、
該被加工物を支持する被加工物支持部と、該被加工物支持部に設けられた走行機構と、制御信号を受信する受信機と、を備え、該搬送通路を走行する無人被加工物搬送車と、
該加工装置に供給される該被加工物を収容する被加工物ストッカーと該無人被加工物搬送車との間で該被加工物を搬送する被加工物搬送部と、制御信号を受信する受信機と、を備えるストックユニットと、
該加工装置、該無人被加工物搬送車、及び該ストックユニットに制御信号を送信する送信機と、該加工装置から送信される通知信号を受信する受信機と、該送信機から送信される制御信号を生成する制御信号生成部と、を備える制御ユニットと、を含み、
該搬送通路は、該加工装置に対して吸着する吸着部を有する脚部を備え、該吸着部によって該加工装置に固定されるとともに、該搬送通路には、該無人被加工物搬送車の位置を確認する際に用いられる情報提供部が設けられており、
該無人被加工物搬送車には、該情報提供部の情報を読み取ることができる読み取り機が設けられており、
該制御ユニットの該制御信号生成部は、該制御ユニットの該受信機が受信した通知信号に基づき該制御ユニットの該送信機から送信される制御信号を生成し、
該制御ユニットの該送信機は、該制御ユニットの該制御信号生成部で生成された制御信号を、該加工装置、該無人被加工物搬送車、及び該ストックユニットに送信し、
該ストックユニットの該被加工物搬送部は、該ストックユニットの該受信機で受信した制御信号に基づき該被加工物ストッカーに収容されている該被加工物を該無人被加工物搬送車の該被加工物支持部へと搬送し、
該無人被加工物搬送車の走行機構は、該無人被加工物搬送車の該受信機で受信した制御信号に基づき該無人被加工物搬送車を該搬送通路上で走行させ、該被加工物支持部で支持する該被加工物を該加工装置へと搬送することを特徴とする搬送システム。 - 複数の加工装置のそれぞれに対して被加工物を搬送する搬送システムであって、
複数の該加工装置に渡って該加工装置の真上の空間に設置される搬送通路と、
該被加工物を支持する被加工物支持部と、該被加工物支持部に設けられた走行機構と、制御信号を受信する受信機と、を備え、該搬送通路を走行する無人被加工物搬送車と、
該加工装置で該被加工物を加工する際に使用される切削ブレードを支持するブレード支持部と、該ブレード支持部に設けられた走行機構と、制御信号を受信する受信機と、を備え、該搬送通路を走行する無人ブレード搬送車と、
該加工装置に供給される該被加工物を収容する被加工物ストッカーと該無人被加工物搬送車との間で該被加工物を搬送する被加工物搬送部と、該加工装置に供給される該切削ブレードを収容するブレードストッカーと該無人ブレード搬送車との間で該切削ブレードを搬送するブレード搬送部と、制御信号を受信する受信機と、を備えるストックユニットと、
該加工装置、該無人被加工物搬送車、該無人ブレード搬送車、及び該ストックユニットに制御信号を送信する送信機と、該加工装置から送信される通知信号を受信する受信機と、該送信機から送信される制御信号を生成する制御信号生成部と、を備える制御ユニットと、を含み、
該搬送通路には、該無人被加工物搬送車の位置を確認する際に用いられる情報提供部が設けられており、
該無人被加工物搬送車には、該情報提供部の情報を読み取ることができる読み取り機が設けられており、
該制御ユニットの該制御信号生成部は、該制御ユニットの該受信機が受信した通知信号に基づき該制御ユニットの該送信機から送信される制御信号を生成し、
該制御ユニットの該送信機は、該制御ユニットの該制御信号生成部で生成された制御信号を、該加工装置、該無人被加工物搬送車、該無人ブレード搬送車、及び該ストックユニットに送信し、
該ストックユニットの該被加工物搬送部は、該ストックユニットの該受信機で受信した制御信号に基づき該被加工物ストッカーに収容されている該被加工物を該無人被加工物搬送車の該被加工物支持部へと搬送し、
該ストックユニットの該ブレード搬送部は、該ストックユニットの該受信機で受信した制御信号に基づき該ブレードストッカーに収容されている該切削ブレードを該無人ブレード搬送車の該ブレード支持部へと搬送し、
該無人被加工物搬送車の走行機構は、該無人被加工物搬送車の該受信機で受信した制御信号に基づき該無人被加工物搬送車を該搬送通路上で走行させ、該被加工物支持部で支持する該被加工物を該加工装置へと搬送し、
該無人ブレード搬送車の該走行機構は、該無人ブレード搬送車の該受信機で受信した制御信号に基づき該無人ブレード搬送車を該搬送通路上で走行させ、該ブレード支持部で支持する該切削ブレードを該加工装置へと搬送することを特徴とする搬送システム。 - 該搬送通路は、該加工装置の上面に設置されることを特徴とする請求項1から請求項5のいずれかに記載の搬送システム。
- 該搬送通路は、複数の通路モジュールを連結して構成されることを特徴とする請求項1から請求項6のいずれかに記載の搬送システム。
- 該加工装置は、配管が接続される配管接続部又はメンテナンス用の扉を側面に備えることを特徴とする請求項1から請求項7のいずれかに記載の搬送システム。
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