JP7490304B2 - 切削装置及び搬送システム - Google Patents
切削装置及び搬送システム Download PDFInfo
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- JP7490304B2 JP7490304B2 JP2020069936A JP2020069936A JP7490304B2 JP 7490304 B2 JP7490304 B2 JP 7490304B2 JP 2020069936 A JP2020069936 A JP 2020069936A JP 2020069936 A JP2020069936 A JP 2020069936A JP 7490304 B2 JP7490304 B2 JP 7490304B2
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q5/00—Driving or feeding mechanisms; Control arrangements therefor
- B23Q5/22—Feeding members carrying tools or work
-
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- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
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- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
本実施形態では、上述した実施形態とは異なる態様の加工装置(切削装置)について説明する。図35は、本実施形態かかる加工装置(切削装置)402の内部の構造を示す斜視図である。なお、以下の説明では、上述した実施形態と共通する構成要素に同じ符号を付して、その詳細な説明を省略する。
4 :加工装置(切削装置)
4a :加工装置(切削装置)
4b :加工装置(切削装置)
6 :搬送路
6a :開口
8 :ローダー・アンローダー(搬送装置)
10 :搬送車
10a :搬送車
10b :搬送車
12 :制御ユニット
21 :配管
22 :筐体
22a :天井
22b :開口
24 :カセット収容機構
24a :第1カセット収容機構
24b :第2カセット収容機構
26 :支持台
26a :上面
26b :外側面
28 :カセット載置台
28a :下面
28b :上面
28c :貫通孔
30 :カセット
30a :第1カセット
30b :第2カセット
32 :搬入出口
34 :外扉(第2扉)
36 :回転連結部材
38a :外部搬入出領域(外部領域)
38b :内部収容領域(内部領域)
40 :内扉(第1扉)
42 :昇降機構
42a :シリンダーチューブ
42b :ピストンロッド
42c :連結部材
44 :第1センサー
44a :磁石
46 :制御装置
48 :第2センサー
48a :磁石
50 :ストッパー部材
50a :角棒
50b :ローラー
52 :軸機構
52a :回転軸
52b :軸受け
54 :ピン(押圧部)
54a :リング
54b :ボタン
56 :昇降機構
56a :支持柱
58 :昇降台
60 :仮置きユニット
62 :筐体
62a :上板
62b :下板
62c :側板
62c1 :第1側板
62c2 :第2側板
62d :開口
62e1 :第1開口
62e2 :第2開口
64 :搬送ユニット(搬送機構)
64a :第1搬送ユニット
64b :第2搬送ユニット
66 :載置台
68 :受信機
70 :送信機
72a :上段ガイドレール(第1仮置き部)
72b :下段ガイドレール(第2仮置き部)
72c :間隔
74a :第1エアアクチュエーター
74b :第2エアアクチュエーター
76a :第1ガイド機構
76b :第2ガイド機構
78 :間隔調整機構
82 :車両フレーム
84 :車軸
86 :車輪(前輪)
88 :車輪(後輪)
90 :駆動ユニット
92 :モーター(駆動源)
92a :回転軸(出力シャフト)
94 :プーリー
96 :バッテリー(二次電池)
98 :配線(充電配線)
100 :端子(受電端子)
102 :容器(カセット)
102a :収容部(収容空間)
102b :開口
102c :上壁
102d :底壁
104 :格納領域
106 :第1ガイドレール
106a :保持面
106b :側面
108 :第2ガイドレール
108a :保持面
110 :昇降ユニット(昇降機構)
112 :吊り下げ部材
114 :駆動機構
116 :接触部材
118 :弾性部材(伸縮部材)
120 :カバー
122 :第1センサー
124 :第2センサー
126 :第3センサー
128 :支持台
130 :制御部(制御ユニット)
130a :第1センサー制御部
130b :走行指示部
130c :第2センサー制御部
130d :旋回指示部
130e :進入制御部
130f :停車制御部
132 :受信機
134 :送信機
142 :モーター
142a :回転軸(出力シャフト)
144a :第1回転軸(第1シャフト)
144b :第2回転軸(第2シャフト)
146 :プーリー
148 :連結部材
150a :プーリー
150b :プーリー
152 :連結部材
154a :リール
154b :リール
156a :ローラー
156b :ローラー
162 :駆動機構
164 :モーター
164a :回転軸(出力シャフト)
166a :第1回転軸(第1シャフト)
166b :第2回転軸(第2シャフト)
166c :第3回転軸(第3シャフト)
168 :プーリー
170 :連結部材
172 :リール
172a :溝(凹部)
172b :突起(凸部)
174 :固定部材
176 :ガイド
182 :蓋部
182a :板状部材
182b :柔軟部材
184 :接触部
184a :固定部材
184b :ローラー
186 :固定ブロック
188 :連結ブロック(L字ブロック)
188a :連結部
188b :固定部
190 :連結軸
202 :基台
202a :凹部
202b :凹部
202c :配管接続部
204 :昇降台
206 :X軸移動機構(加工送りユニット)
206a :テーブルカバー
206b :防塵防滴カバー
208 :チャックテーブル
208a :保持面
218b :クランプ
210 :サブチャックテーブル
210a :保持面
210b :溝
212 :ガイドレール
214 :第1支持構造
216 :第1レール
218 :第1移動機構
220 :第1保持ユニット
220a :保持パッド(第1保持パッド)
220b :把持機構
222 :第2レール
224 :第2移動機構
226 :第2保持ユニット
228 :第2支持構造
230 :Y軸Z軸移動機構(割り出し送りユニット、切り込み送りユニット)
232 :加工ユニット(切削ユニット)
232a :スピンドル
232b :切削ブレード
234 :撮像ユニット(カメラ)
236 :ボード搬送ユニット
236a :アクチュエーター
236b :保持パッド(第2保持パッド)
238 :洗浄ユニット
240 :スピンナテーブル
242 :噴射ノズル
244 :カバー
244a :天井
244b :扉
246 :制御装置
248 :受信機
250 :送信機
262 :下段フレーム
264 :上段フレーム
266 :路面パネル
268 :ねじ
270 :下段フレームユニット
270a :下段フレームユニット
270b :下段フレームユニット
270c :下段フレームユニット
270d :下段フレームユニット
272 :上段フレームユニット
272a :上段フレームユニット
272b :上段フレームユニット
274a :橋渡しパネル
274b :橋渡しパネル
276 :ガード部
278 :走行領域
280 :停車領域
282 :開口
284 :待機領域
286 :マーク
286a :第1マーク
286b :第2マーク
286c :第3マーク
286d :第4マーク
288 :端子(給電端子)
290 :端子支持部
292 :配線(給電配線)
302 :制御部(信号生成部)
304 :受信機
306 :送信機
402 :加工装置(切削装置)
404 :昇降台
406 :カセット収容機構
406a :第1カセット収容機構
406b :第2カセット収容機構
11 :被加工物
13 :テープ(ダイシングテープ)
15 :フレーム
17 :被加工物ユニット
17a :被加工物ユニット
17b :被加工物ユニット
31 :ボード
33 :トレー
35 :本体部
37 :位置規定部材
39a :第1ボード配置領域 39b :第2ボード配置領域
A :載置領域
A1a :第1載置領域
A1b :第1載置領域
A2 :第2載置領域
B1a :第1搬送領域
B1b :第1搬送領域
B2 :第2搬送領域
C1 :矢印
C2 :矢印
C3 :矢印
D1 :矢印
D2 :矢印
D3 :矢印
E1 :矢印
E2 :矢印
F1 :矢印
F2 :矢印
G :矢印
Claims (3)
- 切削ブレードが装着されるスピンドルを備える切削ユニットと、
板状の被加工物がテープを介して環状のフレームに支持された被加工物ユニット又は該フレームに対応した形状のトレーを保持する保持面を備えるチャックテーブルと、
駆動源を備え、該チャックテーブルを加工送り方向に沿って移動させる加工送りユニットと、
駆動源を備え、該切削ユニットを該加工送り方向に垂直な割り出し送り方向に沿って移動させる割り出し送りユニットと、
該被加工物ユニット又は該トレーを収容する容器が載置される載置領域と、
該被加工物ユニット又は該トレーを保持する第1保持パッドを備え、該載置領域と該チャックテーブルとの間で該被加工物ユニット又は該トレーを搬送する搬送ユニットと、
該チャックテーブルの側方に設けられ、該チャックテーブルの該保持面よりも下方に位置し該切削ユニットの調整に使用されるボードを保持する保持面を備えたサブチャックテーブルと、
該チャックテーブルに保持された該トレーと該サブチャックテーブルとの間で該ボードを搬送するボード搬送ユニットと、を含み、
該ボード搬送ユニットは、
該ボードを保持する第2保持パッドと、
該切削ユニットとともに該割り出し送りユニットに支持され、該サブチャックテーブルに保持された該ボードに該第2保持パッドが接触する位置と、該チャックテーブルの該保持面及び該サブチャックテーブルの該保持面よりも上方の位置と、の間で該加工送り方向と該割り出し送り方向とに垂直な方向に沿って該第2保持パッドを移動させるエア駆動型のアクチュエーターと、を備える切削装置。 - 該載置領域の下方の領域に配置され該トレーを収容できるトレー収容領域と、を更に含み、
該搬送ユニットは、該トレー収容領域と該チャックテーブルとの間で該トレーを搬送することを特徴とする請求項1に記載の切削装置。 - 請求項1又は請求項2に記載の切削装置を含む複数の装置と、
該装置の上方に設置される搬送路と、
走行用の車輪が装着される車両フレームと、該車輪を駆動する駆動源と、該被加工物ユニット又は該トレーを収容する容器と、該車両フレームに設けられ、該容器を吊り下げて昇降させる昇降ユニットと、該駆動源と該昇降ユニットとを制御する制御部と、制御信号を受信する受信機と、を備え、該搬送路を走行する搬送車と、
該被加工物ユニット又は該トレーを収容するカセットが載置される第1載置領域と、該搬送車から降下した該容器が載置される第2載置領域と、制御信号を受信する受信機と、を備え、該第1載置領域に載置された該カセットと該第2載置領域に載置された該容器との間で該被加工物ユニット又は該トレーを搬送するローダー・アンローダーと、
該装置、該搬送車、及び該ローダー・アンローダーに制御信号を送信する送信機と、該送信機から送信される制御信号を生成する信号生成部と、を備える制御ユニットと、を含み、
該制御ユニットからの信号に基づき、該搬送車が該ローダー・アンローダーから受け渡された該被加工物ユニット又は該トレーを該装置に搬送する搬送システム。
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