WO2015093180A1 - Dispositif électroluminescent - Google Patents

Dispositif électroluminescent Download PDF

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Publication number
WO2015093180A1
WO2015093180A1 PCT/JP2014/079632 JP2014079632W WO2015093180A1 WO 2015093180 A1 WO2015093180 A1 WO 2015093180A1 JP 2014079632 W JP2014079632 W JP 2014079632W WO 2015093180 A1 WO2015093180 A1 WO 2015093180A1
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WIPO (PCT)
Prior art keywords
pattern
light emitting
cathode
parallel connection
anode
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Application number
PCT/JP2014/079632
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English (en)
Japanese (ja)
Inventor
広明 佐野
猪股　大介
Original Assignee
株式会社タムラ製作所
株式会社光波
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Application filed by 株式会社タムラ製作所, 株式会社光波 filed Critical 株式会社タムラ製作所
Publication of WO2015093180A1 publication Critical patent/WO2015093180A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present invention relates to a light emitting device using an LED chip, and more particularly to its line structure.
  • LED lamps using light emitting diodes have been dramatically expanded in various fields such as backlights for liquid crystal displays, mobile phones, information terminals, and indoor / outdoor advertisements. Furthermore, LED lamps have features such as long life and high reliability, and features such as power consumption, impact resistance, high-purity display, lightness, thinness, and so on. Application is also being attempted.
  • COB Chip on Board
  • a COB type light emitting device in which a plurality of LED chips are mounted on a mounting substrate
  • Patent Document 1 a COB type light emitting device in which a plurality of LED chips are mounted on a mounting substrate.
  • Some of these COB type light emitting devices use wires for serial connection of LED chips.
  • a plurality of LED chips formed on a sapphire substrate are mounted on a mounting substrate, and are continuously wired with a gold wire or the like from the positive and negative pads on the upper surface of each LED chip.
  • each LED chip is electrically connected, and these LED chips are sealed with a resin containing a phosphor.
  • FIG. 1 A circuit diagram of such a light emitting device is shown in FIG. That is, a plurality of LED chips are connected in series with a wire to form an LED chip array, and a plurality of LED chip arrays are connected in parallel.
  • the COB type light emitting device using the wire as described above has a limit in increasing the density because the wire becomes an obstacle. That is, since adjacent LED chips are connected to each other by a wire, when the wires come into contact with each other, a short circuit occurs or the wire loop cannot be formed due to being too close. In order to prevent this, since it is necessary to mount the LED chips apart from each other by a certain distance, there is a limit to increasing the density.
  • the conduction between the LED chips or the like relies on a wire. Since the LED chip and the wire are sealed with resin, the resin expands and contracts due to the heat generated by the LED chip. Due to the expansion / contraction of the resin, stress is applied to the wire, and the wire may be peeled off from the LED chip or the mounting substrate.
  • a flip chip mounting method is known in addition to a method of ensuring conduction using a wire.
  • this flip chip mounting an electrode is formed on the back surface of the LED chip, and conduction is ensured by connecting the electrode to a wiring pattern arranged on the mounting substrate. According to this mounting method, conduction can be ensured without using a wire, so that mounting can be performed at high density.
  • the flip chip mounting method for high-density mounting has a low error tolerance to prevent short-circuiting between LED chips. That is, when the short circuit occurs, the current concentrates in the place, which causes the LED chip to be unlit, and as a result, there is a fear that the light amount is significantly reduced as described above.
  • the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a light-emitting device capable of high-density mounting by flip-chip mounting and having high light quantity reliability.
  • the flip chip mounting type light emitting device of the present invention is characterized by having the following configurations (1) to (5).
  • (1) A mounting board having a wiring pattern on its surface.
  • (2) A plurality of light emitting elements arranged on the mounting substrate and electrically connected to the wiring pattern.
  • (3) The wiring pattern is an anode pattern and a cathode pattern arranged flat with a predetermined interval, and between the anode pattern and the cathode pattern, both patterns are for parallel connection arranged with a predetermined interval Having a pattern.
  • a plurality of light emitting elements are mounted such that the anode electrode of each light emitting element is connected to the pattern for parallel connection and the cathode electrode is connected to the cathode pattern.
  • Each light emitting element is connected in series and in parallel with other adjacent light emitting elements by a wiring pattern.
  • a plurality of parallel connection patterns are arranged between the anode pattern and the cathode pattern at a predetermined interval, and a plurality of light emitting elements are connected to the parallel connection patterns adjacent to each other. It is mounted so that the electrode is connected to one parallel connection pattern and the cathode electrode of each light emitting element is connected to the other parallel connection pattern.
  • the wiring pattern further includes a folding pattern, and the anode pattern and the cathode pattern are arranged on one side of the mounting substrate at a predetermined interval, and the folding pattern includes the positions of the anode pattern and the cathode pattern.
  • the parallel connection pattern is between the anode pattern and the folding pattern, and between the folding pattern and the cathode pattern, respectively.
  • the two parallel connection patterns that are arranged at a predetermined interval and are adjacent to the folding pattern have a plurality of light emitting elements, and the anode electrode of each light emitting element is connected to one of the parallel connection patterns.
  • a plurality of other light emitting elements mounted such that the cathode electrode of the element is connected to the folding pattern , Connected to the folded pattern has the anode electrode of the light emitting element, the cathode electrode is mounted so as to be connected to a parallel connection pattern of the other, that the series connection is configured by folding back.
  • the positioning means has a notch shape provided in the wiring pattern.
  • the mounting substrate is a ceramic substrate or a metal substrate.
  • the mounting substrate is an aluminum nitride substrate.
  • each of the plurality of light emitting elements is connected in series and in parallel with other adjacent light emitting elements by the wiring pattern, a parallel circuit is formed for each series. Therefore, even if a disconnection occurs such that any one light-emitting element is peeled off, it can be suppressed by the non-lighting of only one light-emitting element. Therefore, high-density mounting is possible by flip chip mounting, and a light emitting device with high light quantity reliability can be obtained.
  • a series circuit is configured in the light emitting element, it is not necessary to provide a pattern for the series circuit in the wiring pattern, and the structure of the wiring pattern can be extremely simplified. Therefore, a light emitting device capable of high-density mounting and having high light quantity reliability can be easily manufactured.
  • the wiring pattern is provided with positioning means for each light emitting element, it is possible to accurately position each light emitting element, so that high-density mounting is possible while preventing short-circuiting of the light emitting elements, and light quantity reliability Can be obtained.
  • FIG. 1 is a circuit diagram of a light emitting device according to a first embodiment. It is a figure which shows the light emitting element which concerns on 1st Embodiment, (a) is the perspective view, (b) is a bottom view. It is a top view of the mounting board of a 1st embodiment.
  • FIG. 2 is a cross-sectional view of the light emitting device according to the first embodiment taken along the line AA. It is a top view of the light-emitting device concerning a 2nd embodiment. It is a circuit diagram of the light-emitting device concerning a 2nd embodiment. It is a top view of the mounting board of a 2nd embodiment.
  • the light-emitting device is used for high-luminance and high-light-quantity applications such as exhibition lighting, projectors, stage spotlights, and the like.
  • a plan view of the light emitting device is shown in FIG.
  • the light emitting device includes a plurality of LED chips 10 and a mounting substrate 20, and the LED chip 10 is flip-chip mounted on the mounting substrate 20. That is, a plurality of LED chips 10 are arranged in an array on the wiring pattern 21 on the mounting substrate 20 and are electrically connected with solder such as gold tin.
  • the wiring pattern 21 on the mounting substrate 20 is configured to be electrically connectable to an external power supply device (not shown), and each LED chip 10 is supplied with electric power from the external power supply device via the wiring pattern 21. It is like that.
  • each LED chip 10 is connected in series and in parallel to the other adjacent LED chips by the wiring pattern 21.
  • FIG. 2 is a circuit diagram of the light emitting device according to the present embodiment. As shown in FIG. 2, a plurality of LED chips 10 are connected in series in the horizontal direction of FIG. 2 to form an LED chip array 9, and the LED chip arrays 9 are connected in parallel in the vertical direction of FIG. . In the present light emitting device, LED chip rows 9 configured in multiple series are connected in parallel to LED chips 10 of other LED chip rows 9 adjacent to each other in series. In FIG. 1, 11 ⁇ 11 LED chips 10 are arranged, but in FIG. 2, 6 ⁇ 11 LED chips 10 are arranged for simplicity.
  • the LED chip 10 is a light emitting diode and emits blue light having a dominant wavelength of 420 to 480 nm, for example.
  • the present invention is not particularly limited to this, and a green LED chip, a red LED chip, a near-ultraviolet LED chip, or the like can be used.
  • white light when obtaining white light as a light emitting device, for example, it may be obtained by the principle of color mixing in a multi-chip system using blue, green and red LED chips, or by a single chip system using a phosphor. You may do it.
  • the number of LED chips 10 can be changed as appropriate.
  • FIG. 3 (a) is a perspective view of the LED chip 10
  • FIG. 3 (b) is a view of the back surface of the LED chip 10.
  • FIG. The shape of the LED chip 10 is rectangular here, as shown in FIG. However, the present invention is not limited to this, and it may be a frustum shape or a circle.
  • the LED chip 10 has an anode electrode 11 and a cathode electrode 12 formed on the back surface thereof.
  • the anode electrode 11 and the cathode electrode 12 are conductive portions made of metal formed by plating, sputtering, vapor deposition, or the like, and are electrically connected to the wiring pattern 21 of the mounting substrate 20.
  • the anode electrode 11 is formed elongated and the cathode electrode 12 is formed wider than the anode electrode 11.
  • a gap 13 extending in one direction is formed between the anode electrode 11 and the cathode electrode 12.
  • the width of the gap 13 is, for example, the same as or approximately the same as the width of the anode electrode 11.
  • These electrodes 11 and 12 are insulated by a gap 13 with a predetermined distance therebetween.
  • the anode electrode 11 and the cathode electrode 12 are electrically connected to the wiring pattern 21 through conductive bumps that are protruding terminals, and a resin is provided between the LED chip 10 and the mounting substrate 20. You may make it enclose.
  • FIG. 4 is a plan view of the mounting substrate 20.
  • the mounting substrate 20 can be a ceramic substrate such as aluminum nitride, alumina, silicon carbide, silicon nitride, boron nitride.
  • the mounting substrate 20 is not limited to a ceramic substrate, and a substrate made of another material may be used.
  • a metal substrate such as aluminum or copper, a resin-based substrate such as glass epoxy or silicone, or an insulating single crystal substrate such as diamond, sapphire, gallium nitride, ZnO, or gallium oxide may be used.
  • a ceramic substrate or a metal substrate is preferable because it has high thermal conductivity and the heat dissipation performance of the LED chip 10 is high.
  • An aluminum nitride substrate is particularly preferable.
  • On the mounting substrate 20, a conductive wiring pattern 21, a plurality of gaps 22 extending in one direction and arranged in parallel, and a plurality of positioning marks 23 arranged at predetermined intervals are formed.
  • the wiring pattern 21 is a metal thin film and is formed by plating.
  • the wiring pattern 21 is formed on almost the entire surface of the mounting substrate 20 except for the gap 22 and the positioning mark 23. That is, by performing an etching process or the like, gaps 22 and positioning marks 23 that are gaps or notches are formed in the metal thin film. Note that the substrate material of the mounting substrate 20 is exposed from the gap 22 and the positioning mark 23.
  • the wiring pattern 21 includes a substantially concave anode pattern 21a and a cathode pattern 21b, and a plurality of substantially I-shaped parallel connection patterns 21c.
  • the anode pattern 21a and the cathode pattern 21b are arranged in parallel so that both end portions thereof face each other with a predetermined interval.
  • a plurality of parallel connection patterns 21c are arranged in parallel at predetermined intervals in a region surrounded by the anode pattern 21a and the cathode pattern 21b.
  • the gap 22 extends in one direction and is provided in parallel.
  • the I-shaped parallel connection pattern 21 c extends in the same direction (vertical direction in FIG. 4) and is orthogonal to this direction (lateral direction in FIG. 4). Further, between each parallel connection pattern 21c, between the concave anode pattern 21a and the I-shaped parallel connection pattern 21c, and between the I-shaped parallel connection pattern 21c and the concave cathode pattern 21b. In between, a plurality are provided in parallel at a predetermined interval. This interval can be appropriately changed according to the size of the LED chip 10.
  • the width of the gap 22 matches or substantially matches the width of the gap 13 on the back surface of the LED chip 10.
  • the shape of the gap 22 depends on the shape of the electrodes 11 and 12 of the LED chip 10.
  • the positioning mark 23 is provided in the wiring pattern 21 so as to be aligned with each LED chip 10 and functions as a guide for recognizing the mounting position when the LED chip 10 is mounted.
  • the positioning mark 23 is visually checked when, for example, a machine tool mounts the LED chip 10 with its arm, suction nozzle, or the like, when the machine recognizes it through a camera, or when an operator manually mounts the LED chip 10. This is used for recognition.
  • the positioning marks 23 are provided in an array so as to be aligned vertically and horizontally so as to be positioned at the four corners of the LED chip 10.
  • a region surrounded by four positioning marks 23 adjacent to each other is a mounting position, and the LED chip 10 is mounted at this mounting position.
  • the positioning mark 23 of the present embodiment includes a convex mark 23a formed on the cathode pattern 21b and a convex mark formed in the middle of the parallel connection pattern 21c. 23b, and a step-shaped mark 23c and a recessed mark 23d formed on the edge of the parallel connection pattern 21c.
  • the shapes of these marks 23a to 23d can be appropriately changed according to the shape of the LED chip 10. Since the LED chip 10 is rectangular, the LED chip 10 is mounted with the corners of the LED chip 10 aligned with the recesses of the marks 23a to 23c.
  • the marks 23a to 23c are used to align the four corners of the LED chip 10, whereas the mark 23d is located between the mounting positions of the LED chip 10 at the edge of the parallel connection pattern 21c. Therefore, the LED chip 10 is used to accurately position the LED chip 10 in the vertical direction of FIG. 4, and is also used to confirm that the mark 23 d can be visually recognized without being hidden by the LED 10 and is accurately positioned.
  • the plurality of LED chips 10 have gaps 22 in the lateral direction of FIGS. 1, 2, and 4, that is, the direction orthogonal to the direction in which the patterns 21a to 21c extend. They are arranged in series so as to straddle. That is, as shown in the cross-sectional view of the light emitting device according to this embodiment in FIG. 5, the plurality of LED chips 10 are arranged such that the anode electrode 11 overlaps the anode pattern 21 a or the parallel connection pattern 21 c, and the gap 22 is formed.
  • the cathode electrode 12 is arranged so as to overlap the parallel connection pattern 21c or the cathode pattern 21b.
  • the direction from right to left in FIGS. 1, 2, 4 and 5 is the series direction, and the current flows in this direction.
  • the LED chip 10 itself constitutes a series circuit.
  • the parallel circuit Since the patterns 21a to 21c are provided so as to extend straight in one direction, the LED chip 10 can be mounted along this direction.
  • the plurality of LED chips 10 are arranged so that the anode electrode 11 thereof overlaps with the anode pattern 21a or the parallel connection pattern 21c, and the cathode electrode 12 is arranged so as to overlap with the parallel connection pattern 21c or the cathode pattern 21b.
  • the LED chip 10 in the rightmost vertical column in FIG. 1 will be described.
  • the LED chip 10 is arranged so that the anode electrode 11 overlaps the anode pattern 21a, straddles the gap 22, and the cathode electrodes 12 are arranged in parallel. It arrange
  • a plurality of parallel connection patterns 21c are arranged between the anode pattern 21a and the cathode pattern 21b, and the anode electrodes 11 of the plurality of LED chips 10 are arranged on one of the adjacent patterns 21a to 21c. Since the cathode electrodes 12 of these LED chips 10 are mounted on the other of the adjacent patterns 21a to 21c, a parallel circuit can be formed for each series. According to this configuration, since the series circuit is configured by the LED chip 10 itself, the wiring pattern 21 does not need a pattern for the series circuit. Therefore, it is possible to easily manufacture a highly reliable light-emitting device that can be mounted at high density with a very simple wiring pattern structure without using a complicated wiring pattern shape. Further, since each pattern 21a to 21c forms a parallel circuit in one direction, the voltage to the LED chip 10 is the same potential in these patterns, and variations in current-voltage characteristics can be suppressed.
  • the mounting substrate 20 By making the mounting substrate 20 a ceramic substrate (particularly an aluminum nitride substrate) or a metal substrate, the heat dissipation of the LED chip 10 is enhanced, and the forward voltage VF is reduced due to the voltage characteristic variation of the LED chip 10. It can suppress that the low LED chip 10 becomes unlit. In other words, in a multi-series multi-parallel circuit, if there is a portion where the forward voltage VF becomes low due to variations in the voltage characteristics of the LED chip 10, current concentrates there. As a result, the LED chip 10 generates heat, and the forward voltage VF is lowered by the heat, so that a current flows and the lamp is not lit.
  • the wiring pattern 21 is provided with a positioning mark 23 for each of the LED chips 10.
  • the wiring pattern 21 of the mounting substrate 20 is provided with the positioning marks 23 that are positioned along the mounting positions with respect to the mounting positions of the LED chips 10, so that the positioning is directly performed. This is possible, and accurate positioning can be achieved even when severe positioning accuracy is required.
  • the positioning mark 23 has a notch shape provided in the wiring pattern 21, it is not necessary to separately provide a frame-like body for fitting and positioning the LED chip 10.
  • the provision of a separate frame-like body causes an increase in the manufacturing process, an increase in manufacturing cost, and labor, such as the frame-like body itself and a separate design for insulation between the frame-like body and the LED chip or wiring pattern.
  • the gap 22 when the gap 22 is provided in the wiring pattern 21, it can be formed together by an etching process or the like, the manufacturing process can be reduced, and a separate frame-like body is not required. Can also be reduced.
  • the positioning mark 23 since it is provided as a notch shape, it is possible to provide the positioning mark 23 closer to the LED chip 10 than in the case where it is provided on the outer shape of the mounting substrate or the wiring pattern. As a result, the positioning mark 23 can be provided along the mounting position of the LED chip 10.
  • FIG. 6 is a plan view of the light emitting device according to the second embodiment.
  • FIG. 7 is a circuit diagram of the light emitting device according to the second embodiment.
  • FIG. 8 is a plan view of the mounting board according to the second embodiment.
  • FIG. 7 is a simple schematic circuit diagram and does not match the number of LED chips 10 in FIG.
  • the series direction is one direction, but in this embodiment, as shown in FIG. That is, as shown in FIG. 8, the wiring pattern 21 on the mounting substrate 20 is also structured so that the series direction is folded halfway.
  • the wiring pattern 21 is arranged on the side opposite to the positions of the substantially L-shaped anode pattern 21d and the cathode pattern 21e arranged side by side on the one side of the mounting substrate 20 and the patterns 21d and 21e.
  • a substantially concave folding pattern 21f and a plurality of I-shaped parallel connection patterns 21g are provided.
  • the anode pattern 21d and the cathode pattern 21e are arranged so as to be opposed to each other with a predetermined interval, and to have a substantially concave shape (U-shape) by these patterns.
  • the folding pattern 21f is disposed such that both end portions of the concave shape are opposed to the end portions of the anode pattern 21d and the cathode pattern 21e with a predetermined distance therebetween. With these patterns 21d, 21e, and 21f, the outer shape of the wiring pattern 21 is substantially rectangular.
  • the plurality of parallel connection patterns 21g are arranged in parallel, and one set is provided on each of the lower side and the upper side in FIG. That is, the parallel connection pattern 21g is arranged in parallel with a predetermined spacing between the anode pattern 21d and the folding pattern 21f and between the folding pattern 21f and the cathode pattern 21e. .
  • the gaps 22 are also provided in a set of two sets arranged in parallel.
  • the serial connection of the LED chips 10 is folded by the folding pattern 21f. That is, the two parallel connection patterns 21g adjacent to the folding pattern 21f include a plurality of LED chips 10, and the anode electrode 11 of the LED chip 10 has one parallel connection pattern 21g (the lower pattern in FIG. 8). And the cathode electrode 12 is mounted so as to be connected to the folding pattern 21f. Further, in the other plurality of LED chips 10, the anode electrode 11 of the LED chip 10 is connected to the folding pattern 21f, and the cathode electrode 12 is connected to the other parallel connection pattern 21g (the upper one in FIG. 8).
  • the LED chip 10 is an 8 ⁇ 4 ⁇ 2 circuit.
  • the same effect as the first embodiment can be obtained. Furthermore, since the series direction is folded in the middle, the positive electrode and the negative electrode of the light emitting device can be collected on one side. Thereby, it is possible to easily cope with an external design change such as easy connection with a connector or an external power source. As another advantage, a series circuit longer than the length of the mounting substrate 20 can be formed, the current value can be reduced by increasing the number of series, which can be adjusted to the supply voltage without changing the density. And the like.
  • the wiring pattern 21 is formed by plating.
  • the metal foil may be bonded to the surface of the mounting substrate 20 with a conductive adhesive. The method is not particularly limited.
  • the anode pattern 21a, the cathode pattern 21b, and the parallel connection pattern 21c are arranged in parallel in one direction.
  • the anode pattern 21 ′ for example, the anode pattern is centered in a circular shape or an annular shape, and one or a plurality of strip-shaped ring-shaped parallel connection patterns are arranged concentrically at a predetermined interval, A cathode ring having a belt-like ring shape can be arranged on the outside with a predetermined interval. A plurality of gaps 22 ′ are provided in parallel between these patterns.
  • the configuration of the wiring pattern 21 ' is the reverse of the above, that is, the anode pattern is arranged on the outermost side, the cathode pattern is arranged at the center position, and the parallel connection pattern is arranged between them. good.
  • the LED chip 10 is connected in series across the gap 22 'and electrically connected to the wiring pattern 21' of the adjacent belt-shaped ring.
  • Parallel connection is realized by arranging a plurality of LED chips 10 along the circumferential direction on the wiring pattern 21 ′ of the belt-shaped ring.
  • the same effects as those of the first and second embodiments can be achieved.
  • the LED chips 10 can be arranged concentrically, since the symmetry is good, more uniform illumination light can be obtained.
  • the LED chips 10 are arranged vertically and horizontally so that the light emitting surface is square as a whole, but the light emitting surface may be arranged to be circular.
  • the wiring pattern in this case is not particularly illustrated, for example, the anode pattern and the cathode pattern are formed in a semicircular shape, and both ends thereof are opposed to each other with a predetermined interval, and are arranged so as to be a substantially circular shape as a whole. Then, an arc-shaped parallel connection wiring pattern is disposed inside.
  • folding pattern 21f only one folding pattern 21f is provided.
  • the present invention is not limited to this, and a plurality of folding patterns 21f may be provided.
  • the number of folding patterns 21f is odd as in the second embodiment, the number of times of folding is odd, and one-side wiring is possible as in the second embodiment, and when the number of folding patterns 21f is even, the number of times is even. It is possible to wire on both sides.
  • both of the patterns 21f are arranged so as to face each other, the anode pattern 21a is arranged so as to face one that does not face, and the other part that does not face
  • the cathode pattern 21b is disposed to face the cathode pattern 21b.
  • a pattern for parallel connection between the portions where the folding patterns 21f are opposed to each other, between one portion where both are not opposed to the anode pattern 21a, and between the other portion where both are not opposed to the cathode pattern 21b. 21c is arranged.
  • the wiring pattern 21 is provided with the notch as the positioning mark 23, but the present invention is not limited to this. That is, the positioning mark 23 only needs to be provided for each LED chip 10, and various modes are conceivable.
  • a frame-like body on which the LED chip 10 can be fitted may be provided on the wiring pattern 21 for each LED chip 10, or a shape such as a cross or a dot may be printed on the wiring pattern 21.
  • a separate member or a separate process is required.
  • a part of the wiring pattern 21 may be used.
  • a plurality of convex portions 23 ′ are formed on one edge of the wiring pattern 21.
  • the convex portion 23 ′ is formed in the same shape as the anode electrode 11 of the LED chip 10, and positioning in the vertical and horizontal directions can be realized by arranging the anode electrode 11 so as to coincide with the convex portion 23 ′.
  • a positioning pattern 23 ′′ may be provided between any two of the anode pattern, the cathode pattern, and the parallel connection pattern. Since any of the positioning marks shown in FIG. 10 can be formed together with the wiring pattern 21 by a process such as etching when forming the wiring pattern 21, work efficiency and manufacturing cost can be reduced.
  • the substrate base material of the mounting substrate 20 is exposed by providing a notch shape as the positioning mark 23.
  • the mounting substrate 20 itself may be penetrated.
  • the positioning means is the positioning mark 23 having a convex shape, a staircase shape, or a concave shape, but is not limited thereto.
  • a cross-shaped or L-shaped positioning mark may be used. As a result, the four corners of the LED chip 10 can be positioned more accurately by hitting the four corners of the cross shape and the L-shape.
  • LED chip array 10
  • LED chip 11 Anode electrode 12
  • Cathode electrode 13 Gap 20
  • Mounting substrate 21 Wiring pattern 21 'Wiring pattern 21a
  • Anode pattern 21b Cathode pattern 21c
  • Parallel connection pattern 21d Anode pattern 21e
  • Cathode pattern 21f Folding pattern 21g For parallel connection Pattern 22 Gap 22 'Gap 23 Positioning marks 23a to 23d Mark 23' Positioning mark 23 '' Positioning mark

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention porte sur un dispositif électroluminescent apte à un montage à densité élevée au moyen d'un montage de puce à protubérances, et qui possède une fiabilité élevée de quantité de lumière. Un motif de câblage possède : un motif de cathode et un motif d'anode déposés en maintenant un espace prédéterminé ; et un motif de connexion parallèle disposé entre le motif d'anode et le motif de cathode en maintenant un espace prédéterminé depuis les deux motifs. Dans le motif d'anode et le motif de connexion parallèle, une pluralité d'éléments électroluminescents sont montés de telle sorte que des électrodes d'anode sont connectées au motif d'anode et des électrodes de cathode sont connectées au motif de connexion parallèle, dans le motif de connexion parallèle et le motif de cathode, une pluralité d'éléments électroluminescents sont montés de telle sorte que des électrodes d'anode sont connectées au motif de connexion parallèle et des électrodes de cathode sont connectées au motif de cathode, et chacun des éléments électroluminescents sont connectés en série et en parallèle à un autre élément électroluminescent adjacent au moyen du motif de câblage.
PCT/JP2014/079632 2013-12-19 2014-11-07 Dispositif électroluminescent WO2015093180A1 (fr)

Applications Claiming Priority (2)

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JP2013-262681 2013-12-19
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WO2020244784A1 (fr) 2019-06-07 2020-12-10 Jenoptik Optical Systems Gmbh Appareil d'éclairage à del

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